CN117559150A - Phased array antenna - Google Patents
Phased array antenna Download PDFInfo
- Publication number
- CN117559150A CN117559150A CN202311378629.5A CN202311378629A CN117559150A CN 117559150 A CN117559150 A CN 117559150A CN 202311378629 A CN202311378629 A CN 202311378629A CN 117559150 A CN117559150 A CN 117559150A
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- Prior art keywords
- antenna
- antenna array
- array surface
- plate
- phased array
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 230000005855 radiation Effects 0.000 claims abstract description 10
- 230000005540 biological transmission Effects 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000006855 networking Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000003631 expected effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention provides a phased array antenna, and relates to the technical field of phased array antennas. The phased array antenna comprises a heat radiation component and a plurality of antenna array surface units; the antenna array surface units are circumferentially arranged on one side of the heat dissipation assembly, and are matched to form an annular structure, and the antenna array surface units are used for installing the antenna units and receiving and transmitting signals; one side of the heat radiation component is abutted with the antenna array surface unit, and the antenna array surface unit radiates the radiation heat to the heat radiation component through the abutting surface when working. The phased array antenna can effectively improve the beam scanning range of a phased array by arranging a plurality of antenna array surface units and arranging a plurality of antenna array surface units on one side of the radiating assembly in a circumferential direction, namely, arranging a plurality of antenna array surface units on one side of the radiating assembly in a mode of encircling the radiating assembly, thereby meeting the requirement of omnidirectional/hemispherical space wave velocity coverage.
Description
Technical Field
The present disclosure relates to phased array antenna technology, and in particular, to a phased array antenna.
Background
Phased array antennas are an important component of modern weaponry, and as operational scenarios become complex, their functional requirements become more and more complex. At present, various countries around the world are researching fight modes such as missile cooperation, airplane cooperation, unmanned aerial vehicle cluster and the like, and become one of novel fight modes in the future, and communication networking and data transmission between fight platforms are indispensable, so that the fight mode is one of key technologies and difficulties for realizing cooperative fight functions. And the communication system has the characteristics of omnidirectional/hemispherical space beam coverage, narrow beam anti-interference, long distance, high speed and the like. The requirement of the characteristics leads to the fact that an antenna system is required to adopt a phased array mode, but the current single-array-plane phased array antenna is limited in beam scanning range, and cannot meet the requirement of omnidirectional/hemispherical space beam coverage. Based on the foregoing, it is particularly important to provide a phased array antenna that meets the above-mentioned needs.
Disclosure of Invention
An object of the present disclosure is to provide a phased array antenna that can solve the problem that the beam coverage of the existing phased array antenna cannot meet the above requirements.
The embodiments of the present specification are implemented as follows:
a phased array antenna mainly comprises a heat dissipation component and a plurality of antenna array surface units;
the antenna array surface units are circumferentially arranged on one side of the heat dissipation assembly, and are matched to form an annular structure, and the antenna array surface units are used for installing the antenna units and receiving and transmitting signals;
one side of the heat radiation component is abutted with the antenna array surface unit, and the antenna array surface unit radiates the radiation heat to the heat radiation component through the abutting surface when working.
Embodiments of the present description have at least the following advantages or benefits:
compared with the prior art, the phased array antenna has the advantages that the plurality of antenna array surface units are arranged, and the plurality of antenna array surface units are circumferentially arranged on one side of the radiating assembly, namely, the plurality of antenna array surface units are arranged on one side of the radiating assembly in a mode of encircling the radiating assembly, so that the beam scanning range of the phased array can be effectively improved, and the requirement of omnidirectional/hemispherical space wave velocity coverage is met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present description, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present description and should therefore not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a phased array antenna provided in the present specification;
FIG. 2 is a schematic structural view of the array panel assembly provided in the present specification;
fig. 3 is a schematic structural diagram of a temperature equalization plate provided in the present specification;
fig. 4 is a schematic structural diagram of a transceiver provided in the present specification.
Icon: 1. a heat dissipation assembly; 11. a heat sink; 12. a heat dissipation channel; 13. a lightening hole; 2. a temperature equalizing plate; 21. a first plate; 22. a second plate; 3. a transceiver; 4. an antenna array assembly; 41. antenna array surface printed board; 411. an antenna unit; 412. a connection hole; 413. a transmission hole; 42. an antenna array panel.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present specification more clear, the technical solutions of the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is apparent that the described embodiments are some embodiments of the present specification, but not all embodiments. In general, the components of the embodiments of the present description described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present specification, as presented in the figures, is not intended to limit the scope of the specification, as claimed, but is merely representative of selected embodiments of the specification. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present disclosure.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, it need not be defined and explained next in the following figures.
In the description of the embodiments of the present specification, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which a product of the specification is conventionally put in use, it is merely for convenience of description of the present specification and simplification of description, and it is not indicated or implied that the referred device or element must have a specific azimuth, constructed and operated in a specific azimuth, and thus it should not be construed as limiting the present specification. Furthermore, the terms "first," "second," third and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
Furthermore, the terms "horizontal," "vertical," "overhang" and the like, if any, do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present specification, it should also be noted that, unless explicitly specified and defined otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in this specification will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1 to fig. 4, a phased array antenna according to an embodiment of the present disclosure mainly includes a heat dissipation assembly 1 and a plurality of antenna array units;
the plurality of antenna array surface units are circumferentially arranged on one side of the heat dissipation assembly 1, and are matched to form an annular structure, and the antenna array surface units are used for installing the antenna units 411 and receiving and transmitting signals;
one side of the heat dissipation assembly 1 is abutted with the antenna array surface unit, and the antenna array surface unit dissipates heat to the heat dissipation assembly 1 through an abutting surface when working.
In this embodiment, one side of the heat dissipation assembly 1 is abutted with the antenna array surface unit, at this time, the antenna array surface unit can emit heat to the heat dissipation assembly 1 through the abutting surface, and then the heat generated during operation is emitted through the heat dissipation assembly 1, so that the heat dissipation performance of the phased array antenna can be greatly improved, and the requirement of a plurality of antenna array surface units on heat dissipation during simultaneous operation can be met.
In the present embodiment, the antenna array plane unit has a function of transmitting and receiving signals, and the antenna unit 411 can be mounted.
In this embodiment, the beam scanning range of the phased array can be increased by arranging a plurality of antenna array surface units in the circumferential direction of the heat dissipating component 1.
It should be noted that, a plurality of antenna array units may be symmetrically disposed on opposite sides of the heat dissipation assembly 1, and in the example of the up and down directions in fig. 1, the antenna array units may be symmetrically disposed on the up and down sides of the heat dissipation assembly 1, so as to further improve the beam scanning range of the phased array.
In this embodiment, the number of antenna array units will be described in detail by taking 3 as an example:
as shown in fig. 1, the 3 antenna array units are disposed below the heat dissipation assembly 1 (the lower side shown in fig. 1 is merely an exemplary arrangement mode, and is not a basis for limiting the technical solution in the present specification), and the included angle between the adjacent antenna array units is 60 °. The off-axis angle of the heat sink 1 is 90 ° (the plane in which the side wall of the heat sink 1 is located and the jig in the vertical direction).
In this embodiment, the antenna array unit includes a temperature equalizing plate 2, a transceiver 3, and an antenna array assembly 4;
the temperature equalizing plate 2 comprises a first plate 21 and a second plate 22 which are connected with each other, a plane where the side wall of the first plate 21 is located intersects with a plane where the side wall of the second plate 22 is located, and the first plate 21 is abutted against the heat dissipating component 1;
one side of the transceiver 3 is connected to a side wall of the second board 22, and the other side of the transceiver 3 is connected to one side of the antenna array panel assembly 4.
In this embodiment, the temperature equalization plate 2 in the single antenna array unit can rapidly conduct the heat generated by the transceiver 3 to the heat dissipation assembly 1. The reason why the temperature equalizing plate 2 can quickly transfer heat to the heat dissipating component 1 is that the first plate 21 and the second plate 22 are structurally arranged, that is, the contact area between the second plate 22 and the transceiver 3 is larger (in this embodiment, the second plate 22 and the transceiver 3 are overlapped), so that the transceiver 3 and the second plate 22 can quickly exchange heat, and the second plate 22 can quickly transfer heat to the heat dissipating component 1 through the first plate 21 due to the larger contact area between the first plate 21 and the heat dissipating component 1, and at this time, the heat dissipating component 1 can radiate heat to the outside of the phased array antenna, thereby ensuring that the internal temperature of the phased array antenna is suitable for operation.
In this embodiment, the surfaces of the side walls of the first plate 21 and the second plate 22 are in an intersecting state, so that the setting direction of the antenna array surface assembly 4 can meet the expected effect, thereby improving the beam scanning range of the phased array antenna.
In this embodiment, the transceiver 3 is mainly used for distributing and amplifying the fed rf signal, and changing the amplitude and phase of the rf signal, so that it generates heat when in an operating state.
It should be noted that, the transmission process of the phased array antenna to the radio frequency signal provided in this embodiment specifically includes: after the radio frequency excitation signal enters the transceiver 3, the radio frequency excitation signal is distributed and amplified by the transceiver 3 and then output to the antenna array surface assembly 4, and the radio frequency excitation signal is radiated into space by the antenna array surface assembly 4.
In this embodiment, the antenna array assembly 4 includes an antenna array surface printed board 41 and an antenna array surface bottom board 42 that are connected to each other, and a side of the antenna array surface bottom board 42 away from the antenna array surface printed board 41 is connected to a side of the transceiver 3, where the antenna array surface printed board 41 is used for mounting an antenna unit 411.
In this embodiment, the antenna array surface printed board 41 is used to transmit the radio frequency signal distributed and amplified by the transceiver 3 to the antenna unit 411, and then radiate the radio frequency signal into space through the antenna unit 411.
In this embodiment, the antenna array surface printed board 41 and the antenna array surface bottom board 42 may be square. The shape of the transceiver 3 may be square.
In other embodiments, the shapes of the antenna array surface printed board 41, the antenna array surface bottom board 42 and the transceiver 3 may be adjusted according to actual use requirements or assembly requirements.
In this embodiment, the antenna array surface printed board 41 has a plurality of mounting holes and connecting holes 412, the mounting holes are used for mounting the antenna units 411, and the antenna array surface printed board 41 is connected with the antenna array surface bottom board 42 through the matching of the connecting holes 412 and screws.
In this embodiment, the mounting holes can facilitate mounting of the antenna unit 411, and the connection holes 412 can improve the fixing effect between the antenna array surface printed board 41 and the antenna array surface bottom board 42.
It should be noted that the antenna array assembly 4, the transceiver 3 and the temperature equalization plate 2 are all connected by screws, and the heat dissipation assembly 1 and the temperature equalization plate 2 are also fixedly connected by the cooperation between the screws and the holes.
In this embodiment, the included angle between the plane of the antenna array surface printed board 41 far from the wall surface of the temperature equalizing board 2 and the horizontal plane is 60 ° -80 °.
In this embodiment, the antenna array surface printed board 41 is set by means of an inclination angle, so that the beam scanning range can be further improved. When the beam scanning coverage in hemispherical space can be realized when the beam scanning coverage is preferably set to 70 degrees, and the service performance is better. At this time, the beam scanning range of the antenna array plane itself is ±70°.
In other embodiments, the included angle between the plane of the wall surface of the antenna array surface printed board 41 and the horizontal plane may be set to 60 °, and the beam scanning range of the antenna array surface itself is +60°.
In other embodiments, the included angle between the plane of the wall surface of the antenna array surface printed board 41 and the horizontal plane may be set to 80 °, and the beam scanning range of the antenna array surface itself may be ±80°.
It should be noted here that the inclination of the second plate 22, the transceiver 3 and the antenna array surface bottom plate 42 is the same as the inclination of the antenna array surface printed board 41, that is, all set to 70 °.
In this embodiment, the transceiver 3 has an outer shell portion and an inner core portion, the outer shell portion is made of an aluminum alloy, and the inner core portion is made of a semiconductor material.
In this embodiment, the outer shell portion and the inner core portion of the transceiver 3 can further improve the signal transmission efficiency and the structural rigidity of the transceiver 3 by adopting the above materials, and meanwhile, the quality of the signal itself can not be affected.
It should be noted that, in this embodiment, the antenna array surface printed board 41 is made of polytetrafluoroethylene and copper, specifically, a polytetrafluoroethylene board is printed with copper pieces, the copper pieces can enable the antenna unit 411 and the transceiver 4 to transmit signals, the antenna array surface bottom board 42 is made of aluminum alloy, the heat dissipation component 1 is made of aluminum alloy, and the temperature equalizing board 2 is made of aluminum alloy.
The reason for selecting the aluminum alloy is that the heat dissipation assembly 1 made of the aluminum alloy and the heat dissipation performance of the temperature equalization plate 2 are better, so that the heat dissipation performance of the phased array antenna can be further improved, and meanwhile, the phased array antenna is lighter in weight and meets the requirement of light weight.
In this embodiment, the transceiver 3 is provided with a plurality of transmission holes 413, a plurality of transmission holes 413 are arrayed on the transceiver 3, and a plurality of transmission holes 413 are used for transmitting signals. The transmission hole 413 may further improve the efficiency of transmitting signals by the transceiver 3.
In this embodiment, a surface of the first plate 21 away from the side wall of the heat dissipating assembly 1 is perpendicular to a surface of the second plate 22 away from the side wall of the transceiver 3, and the first plate 21 is parallel to two opposite side walls of the heat dissipating assembly 1. The structure of the first plate 21 and the second plate 22 is arranged in the mode, so that the assembly effect of the heat radiating assembly 1 and the temperature equalizing plate 2 is better, and the assembly effect of the temperature equalizing plate 2 and the antenna array surface assembly 4 is better, namely, the fixing effect and the assembly precision are higher.
In this embodiment, the heat dissipation assembly 1 includes a heat dissipation member 11 and a plurality of heat dissipation channels 12, one side of the heat dissipation member 11 is abutted to the antenna array unit, the other side of the heat dissipation member 11 is circumferentially provided with a plurality of heat dissipation channels 12, and the heat dissipation member 11 has a cavity, and the cavity is communicated with the heat dissipation channels 12.
The heat sink assembly 1 may conduct heat through the chamber to the heat sink channel 12 and through the heat sink channel 12 to the exterior of the phased array antenna.
In this embodiment, the heat dissipation element 11 is provided with a plurality of lightening holes 13, as shown in fig. 1. The above manner can further enable the quality of the phased array antenna to meet the requirement of light weight.
In this embodiment, the antenna array module 4 has dimensions of 120mm×108mm×6.7mm (length×width×height), the transceiver 3 has dimensions of 120mm×108mm×7mm (length×width×height), the temperature equalizing plate 2 has dimensions of 120mm×108mm×8mm (length×width×height), and the heat sink 11 has a thickness of 17mm.
In this embodiment, the phased array antenna (3 antenna array surface units) is tested in a microwave darkroom, and the test results are as follows:
the antenna can work in the C wave band to complete the receiving and transmitting of electromagnetic signals, and can realize the beam scanning coverage range of 0-360 degrees of rotation angle and 90-90 degrees of off-axis angle without scanning blind areas.
In summary, the present disclosure provides a phased array antenna, which can effectively improve the beam scanning range of a phased array by setting a plurality of antenna array surface units, and by circumferentially setting a plurality of antenna array surface units on one side of a heat dissipation assembly 1, that is, setting a plurality of antenna array surface units on one side of the heat dissipation assembly 1 in a manner of encircling the heat dissipation assembly 1, thereby meeting the requirement of omnidirectional/hemispherical space wave velocity coverage. Therefore, the phased array antenna can be applied to the scenes such as a communication networking system, an inter-bomb cooperative networking system, an inter-aircraft networking system, an unmanned aerial vehicle cluster networking system and the like under a plurality of cooperative combat scenes.
The above description is only of preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification should be included in the protection scope of the present specification.
Claims (10)
1. The phased array antenna is characterized by comprising a heat dissipation assembly and a plurality of antenna array surface units;
the antenna array surface units are circumferentially arranged on one side of the heat dissipation assembly, and are matched to form an annular structure, and the antenna array surface units are used for installing the antenna units and receiving and transmitting signals;
one side of the heat radiation component is abutted with the antenna array surface unit, and the antenna array surface unit radiates the radiation heat to the heat radiation component through the abutting surface when working.
2. A phased array antenna as claimed in claim 1, wherein the antenna array element comprises a temperature equalizing plate, a transceiver and an antenna array assembly;
the temperature equalization plate comprises a first plate and a second plate which are connected with each other, a plane where the side wall of the first plate is located is intersected with a plane where the side wall of the second plate is located, and the first plate is abutted with the heat dissipation assembly;
one side of the receiving and transmitting piece is connected with the side wall of the second plate, and the other side of the receiving and transmitting piece is connected with one side of the antenna array surface component.
3. A phased array antenna as claimed in claim 2, wherein the antenna array assembly comprises an antenna array surface printed board and an antenna array surface base board which are connected to each other, and wherein a side of the antenna array surface base board remote from the antenna array surface printed board is connected to a side of the transceiver, the antenna array surface printed board being adapted to mount an antenna element.
4. A phased array antenna as claimed in claim 3, wherein the antenna array surface printed board has a plurality of mounting holes for mounting antenna elements and connection holes through which the antenna array surface printed board is connected to the antenna array surface base plate by screw engagement.
5. A phased array antenna as claimed in claim 3, wherein the antenna array face printed board is located at an angle of 60 ° -80 ° to the horizontal plane away from the plane of the wall of the temperature equalization board.
6. A phased array antenna as claimed in claim 2, wherein the transceiver has an outer portion and an inner portion, the outer portion being of an aluminium alloy and the inner portion being of a semiconductor material.
7. A phased array antenna as claimed in claim 6, wherein the transceiver is provided with a plurality of transmission apertures, the plurality of transmission apertures being arranged in an array on the transceiver, the plurality of transmission apertures being for transmitting signals.
8. A phased array antenna as claimed in claim 2, wherein the side wall of the first plate remote from the radiating element is perpendicular to the side wall of the second plate remote from the transceiver, the first plate being parallel to opposite side walls of the radiating element.
9. The phased array antenna of claim 1, wherein the heat dissipating assembly comprises a heat dissipating member and a plurality of heat dissipating channels, one side of the heat dissipating member is in contact with the antenna array surface unit, the plurality of heat dissipating channels are circumferentially arranged on the other side of the heat dissipating member, and the heat dissipating member has a cavity, and the cavity is communicated with the heat dissipating channels.
10. A phased array antenna as claimed in claim 9, wherein the heat sink is provided with lightening apertures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311378629.5A CN117559150A (en) | 2023-10-23 | 2023-10-23 | Phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311378629.5A CN117559150A (en) | 2023-10-23 | 2023-10-23 | Phased array antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117559150A true CN117559150A (en) | 2024-02-13 |
Family
ID=89821194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311378629.5A Pending CN117559150A (en) | 2023-10-23 | 2023-10-23 | Phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117559150A (en) |
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2023
- 2023-10-23 CN CN202311378629.5A patent/CN117559150A/en active Pending
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