CN117526074A - Distributed feedback type passive mode locking stable laser and manufacturing method thereof - Google Patents
Distributed feedback type passive mode locking stable laser and manufacturing method thereof Download PDFInfo
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- CN117526074A CN117526074A CN202410014086.7A CN202410014086A CN117526074A CN 117526074 A CN117526074 A CN 117526074A CN 202410014086 A CN202410014086 A CN 202410014086A CN 117526074 A CN117526074 A CN 117526074A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 230000010287 polarization Effects 0.000 claims abstract description 18
- 239000013307 optical fiber Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000835 fiber Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000012360 testing method Methods 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 230000032683 aging Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000007769 metal material Substances 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
- H01S3/1106—Mode locking
- H01S3/1112—Passive mode locking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to a distributed feedback type passive mode locking stable laser and a manufacturing method thereof, comprising a shell, THS heat sink, COS chip, SAC-slow axis collimating lens, VBG assembly, reflecting mirror, connecting bridge, polarization beam combiner, FAC 02-second fast axis collimating lens, FAC 01-first fast axis collimating lens, focusing lens and other structures.
Description
Technical Field
The invention relates to a distributed feedback type passive mode locking stable laser and a manufacturing method thereof, belonging to the technical field of semiconductor lasers.
Background
In recent years, the market development of high-power fiber lasers is rapid, and the fiber lasers have extremely broad application prospects and huge application values in the fields of material processing, intelligent manufacturing, national defense and the like. The application range is also gradually expanding. Meanwhile, with the progress of semiconductor laser technology, the semiconductor laser product structure is diversified, wherein the narrow-linewidth optical fiber coupling semiconductor laser has the advantages of good beam quality, higher conversion efficiency, strong stability, small volume and the like, and has wide application prospect in many aspects.
The optical fiber coupling semiconductor laser module with the wavelength locking commonly used at present adopts a built-in grating structure or an external cavity wavelength locking structure, thereby realizing the wavelength locking. The external cavity wavelength locking structure is used for placing a volume grating VBG in the pump source and locking the central wavelength of the laser spectrum through the volume grating VBG. However, the locking effect of the bulk grating, namely the center wavelength of the spectrum after locking, also changes along with the working current of the laser and the temperature change of the laser (the half-width of the spectrum of the currently commonly used module is about 0.3-0.5nm, and the wavelength shift change amount is about 0.05nm/°c). In some fields requiring stable output center wavelengths, such as certain gas lasers or information detection applications, conventional locked wavelength fiber optic modules may not meet the operational requirements due to the narrow absorption peak (approximately 0.2 nm). There is a need for more accurate control of the spectrum of the laser. However, the control difficulty of the central wavelength of the optical fiber coupling module increases with the increase of the number of the pump source chips, especially in a high-power optical fiber laser after the beam combination of a plurality of laser modules, the control difficulty of the central wavelength is higher, and the practical use requirement is difficult to meet. Therefore, the distributed feedback passive mode locking stabilization technology is designed, so that the laser after mode locking is simpler in structure, more convenient to use and more stable in mode locking effect.
Disclosure of Invention
Aiming at the defects of the existing mode locking technology, the invention provides a distributed feedback type passive mode locking stable laser and a manufacturing method thereof, so that the mode locking laser has the advantages of simple structure, convenient operation and stable mode locking effect.
The technical scheme of the invention is as follows:
a distributed feedback type passive mode locking stable laser comprises a shell, THS heat sinks, COS chips, SAC-slow axis collimating lenses, VBG assemblies, reflectors, connecting bridges, polarization beam combiners, FAC 02-second fast axis collimating lenses, focusing lens carriers, optical fibers, electrodes, FAC 01-first fast axis collimating lenses, focusing lenses, reflector gaskets, VBG heat sinks, heat conducting fins I, VBG-body Bragg gratings, positioning grooves, heat conducting fins II, heat radiating strips I, heat radiating strips II, heat radiating grids and other structures, M THS heat sinks are arranged in the shell, M is larger than or equal to 2, N COS chips are distributed on each THS heat sink, N is larger than or equal to 1, FAC 01-first fast axis collimating lenses are respectively arranged at the front ends of the chips, FAC 01-first fast axis collimating lenses are used for carrying out fast axis direction light spot collimating focusing on laser emitted by the COS chips, VBG assemblies are respectively arranged at the front ends of the FAC 01-first fast axis collimating lenses, the VBG assemblies comprise VBG assemblies, the VBG heat sinks and the VBG heat conducting fins and the heat conducting fins are arranged on the VBG heat conducting fins are arranged at the two sides, and the two sides of the VBG heat conducting fins are arranged at the positioning grooves; the other side of the VBG assembly is provided with an SAC-slow axis collimating lens which is used for focusing and collimating the light spots in the slow axis direction of the laser emitted by the COS chip; one side of the THS heat sink is provided with a connecting bridge, the connecting bridge is used for connecting different cos chips in series through wires, the other side of the connecting bridge is provided with a polarization beam combiner, the polarization beam combiner is used for combining lasers in different paths into one beam of laser, one side of the polarization beam combiner is provided with a FAC 02-second fast axis collimating lens, the FAC 02-second fast axis collimating lens carries out secondary focusing compression on the combined laser in the fast axis direction, one side of the FAC 02-second fast axis collimating lens is provided with a focusing lens carrier, the middle of one side of the focusing lens carrier is provided with a focusing lens, and the other side of the focusing lens carrier is provided with an optical fiber. The secondary focusing compressed laser beam passing through the FAC 02-second fast axis collimating lens is further focused by the focusing lens, so that the laser is coupled into the optical fiber, and the laser is transmitted through the optical fiber.
The number of components depends on the power of the module and can be determined according to the power.
According to the invention, preferably, the shell is of a convex structure, one side of the shell is provided with the electrode, the shell is made of light metal material with good heat conduction performance, the electrode material is made of metal material with good electric conduction performance, the electrode and the shell are welded together through the insulating material, and the electrode and the COS chip are connected together through a certain number of gold wires or aluminum wires with good wire performance.
According to the invention, the THS heat sink and the shell are sintered together through metal solder, and the THS heat sink is made of metal with good heat conduction performance.
According to the invention, preferably, the VBG adopts a reflective Bragg grating (R-VBG) structure, and after laser emitted by the COS chip is compressed in a fast axis direction and a slow axis direction, light waves emitted by COS units in an outer cavity of the laser array are fed back to adjacent units through selection of angles and wavelengths of the VBG, so that phase locking of the outer cavity of the laser array is realized, and the spectrum width of the laser is compressed.
According to the invention, preferably, a positioning groove is arranged in the middle of the VBG heat sink, the size of the positioning groove is larger than that of the VBG, the VBG heat sink is made of metal or ceramic materials with good heat conduction performance, the VBG heat sink is used for radiating the VBG, the heat conducting sheets I and II are made of metal materials with good viscosity and heat conduction performance, the heat conducting sheets I are adhered to the bottom of the VBG, the heat conducting sheets II are adhered to the two sides of the VBG, and the VBG heat sink are adhered together through the heat conducting sheets I and II.
According to the invention, preferably, the VBG assembly is provided with the radiating strips I and the radiating strips II which have the same structure along the front and rear sides of the light path direction, each radiating strip is provided with L radiating grids which are uniformly arranged, the radiating area of the heat conducting fin is increased through the radiating grids, the radiating strips I and the radiating strips II are mainly used for radiating the VBG assembly, the radiating strips I and the radiating strips II are adhered to the shell and the VBG heat sink through glue with good heat conducting performance, when the laser device is used, when a laser beam passes through the VBG, the VBG heat gathering temperature is increased, the VBG heat is rapidly transferred to the VBG heat sink through the heat conducting fin I and the heat conducting fin II, and the VBG heat sink rapidly releases the VBG heat through the radiating strips I and the heat conducting strip II, so that the heat generated by the VBG and the VBG heat radiated by the VBG keep dynamic balance, and the VBG temperature is ensured to be stably kept within a certain range.
Preferably, the THS heat sinks are oppositely arranged, the light paths are opposite, a reflector gasket is respectively arranged between the two opposite THS heat sinks in the shell, the upper end of the reflector gasket is provided with a reflector, each COS chip is provided with a reflector on the light path passing through the SAC-slow axis collimating lens, the reflectors are used for deflecting the locked laser by 90 degrees, the opposite arrangement can fully save the space in the shell, and the laser light paths above the opposite THS heat sinks are originally opposite and form mutually parallel light beams after being turned by 90 degrees through the reflectors.
Further preferably, the mirror spacer is made of a ceramic material.
According to the invention, preferably, the connecting bridge is connected with the COS chips through metal gold wires or aluminum wires with good electric conductivity, and the COS chips on two sides of the laser are connected in series through the connecting bridge.
A manufacturing method of a distributed feedback type passive mode locking stable laser comprises the following steps:
1) Firstly, the COS chip is reflowed to the THS heat sink through vacuum high-temperature sintering by using good metal solder with heat conducting property;
2) Setting FAC 01-first fast axis collimating lens on THS heat sink along COS chip light path to perform fast axis direction collimation and slow axis collimating lens to perform slow axis direction collimation;
3) Paving a layer of metal solder on the lower end of the collimated THS heat sink, placing the metal solder into the shell, and carrying out vacuum high-temperature sintering on the shell for reflow to sinter the THS heat sink and the shell together;
4) Connecting the sintered shell with the electrode, the COS chip and the connecting bridge through wires by using a wire bonding machine, so that all the COS chips are connected in series;
5) Respectively sticking a heat conducting fin II and a heat conducting fin I on two sides and the bottom of the VBG, and then assembling the VBG on a VBG heat sink positioning groove to adhere the VBG and the VBG heat sink together to form a VBG assembly;
6) Placing the VBG assembly at the front end of the THS heat sink, performing VBG wave locking on the COS chip on the THS heat sink through a VBG automatic wave locking device, and solidifying the VBG assembly after the wave locking on the shell;
7) Respectively coating glue with good heat conduction performance on the bottoms and the side surfaces of the radiating strip I and the radiating strip II, bonding the side surfaces of the radiating strip I and the radiating strip II with the VBG heat sink together at the front and the back, and bonding the bottom of the VBG heat sink with the shell;
8) Respectively assembling the polarization beam combiner, the FAC 02-second fast axis collimating lens and the focusing lens carrier to corresponding positions of the shell through an assembling clamp;
9) Assembling the reflector gasket to the middle position of the shell and positioned between opposite THS heat sinks, and assembling the reflector through automatic coupling equipment to enable laser to be transmitted to an optical fiber through the reflector through the polarization beam combiner, the FAC 02-second fast axis collimating lens and the focusing lens, so as to complete the internal assembly of the laser;
10 And (3) performing aging test screening and parameter testing on the laser after performing vacuum sealing on the laser through vacuum sealing equipment, so as to finish the manufacturing of the distributed feedback type passive mode-locking fiber laser.
The VBG grating position in the light path is further optimized on the basis of the existing structure, and a heat sink or a heat dissipation structure is added to the bottom of the VBG. The radiating structures are also subjected to certain simulation calculation and optimization, specific radiating requirements are met, and further improvement of the wavelength stability of the laser can be realized through the innovations. While the wavelength of the laser of the existing structure can be initially locked and reduced by half width, the center wavelength is actually slowly lengthened with the increase of time. By improving the method, the wavelength lengthening process can be controlled or even unchanged, and plays an important role in the field of high-precision detection application.
The invention has the beneficial effects that:
1. the mode-locked fiber laser manufactured by the distributed feedback type passive mode-locked stabilization technology has simpler structure, does not need to add additional VBG or other active heat dissipation devices, reduces the use cost, can be directly used, does not need to carry out additional VBG cooling operation, and ensures that the operation is more convenient and the preparation time before the operation is shortened by tens of times.
2. The VBG and the VBG heat sink are bonded into an integrated structure through the heat conducting fin, and the heat radiating strips are arranged, so that the VBG heat radiating performance is improved, and meanwhile, the VBG wave locking is performed by adopting the single-path COS, the wave locking is performed first, and then the beam combination is performed.
3. By adopting the technology of the invention to carry out laser mode locking, half-width parameters of the laser after mode locking are optimized and improved, the spectrum width is compressed to be below 0.2nm, the wavelength stabilizing time is above 60S, and the light beam output quality and stability are greatly improved.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of the optical path structure of the present invention.
Fig. 3 is a schematic view of the THS heat sink structure of the present invention.
FIG. 4 is a schematic diagram of the VBG assembly structure of the present invention.
Fig. 5 is a schematic view of a heat dissipating strip according to the present invention.
The light source comprises a shell, 2, THS heat sink, 3, COS chip, 4, SAC-slow axis collimating lens, 5, VBG assembly, 6, reflector, 7, connecting bridge, 8, polarization beam combiner, 9, FAC 02-second fast axis collimating lens, 10, focusing lens carrier, 11, optical fiber, 12, electrode, 13, FAC 01-first fast axis collimating lens, 14, focusing lens, 15, reflector gasket, 16, VBG heat sink, 17, heat conducting sheet I, 18, VBG-body Bragg grating, 19, positioning groove, 20, heat conducting sheet II, 21, heat radiating strip I, 22, heat radiating strip II, 23 and heat radiating grid.
Detailed Description
The invention will now be further illustrated by way of example, but not by way of limitation, with reference to the accompanying drawings.
Example 1:
as shown in FIG. 1, the distributed feedback type passive mode-locked stable laser has the structure of a shell 1, a THS heat sink 2, a COS chip 3, a SAC-slow axis collimating lens 4, a VBG assembly 5, a reflecting mirror 6, a connecting bridge 7, a polarization beam combiner 8, a FAC 02-second fast axis collimating lens 9, a focusing lens carrier 10, an optical fiber 11, an electrode 12, a FAC 01-first fast axis collimating lens 13, a focusing lens 14, a reflecting mirror gasket 15, a VBG heat sink 16, a heat conducting sheet I19, a VBG-body Bragg grating 18, a positioning groove 19, a heat conducting sheet II 20, a heat radiating strip I21, a heat radiating strip II 22, a heat radiating grid 23 and the like.
The shell 1 is of a convex structure, two electrodes 12 are arranged on one side of the shell 1, M THS heat sinks 2 are arranged in the shell 1, M is 10, N COS chips 3 are distributed on each THS heat sink 2, N is 3, the front end of each COS chip 3 is respectively provided with a FAC 01-first fast axis collimating lens 13, the front end of each FAC 01-first fast axis collimating lens 13 is respectively provided with a VBG assembly 5, the VBG assembly 5 comprises a VBG heat sink 16, a heat conducting fin I19, a heat conducting fin II 20 and a VBG18, a positioning groove 19 is arranged in the middle of the VBG heat sink 16, the upper end of the positioning groove 19 is provided with a VBG18, the bottom of the VBG18 is provided with a heat conducting fin I17, two sides of the VBG18 are provided with a heat conducting fin II 20, the front surface and the rear surface of the VBG assembly 5 are respectively provided with a heat radiating strip I21 and a heat radiating strip II 22 with the same structure, each heat radiating strip is provided with L heat radiating grids 23 which are uniformly arranged, the other side of the radiating strip II 22 is provided with a SAC-slow axis collimating lens 4, the SAC-slow axis collimating lens 4 is used for focusing and collimating the laser emitted by the COS chip 3 in the slow axis direction, every two THS heat sinks are arranged in opposite directions, a reflector gasket 15 is respectively arranged between each row of two THS heat sinks 2 in the shell 1, the upper end of the reflector gasket 15 is provided with a reflector 6, the connecting bridge 7 is positioned at one side of the THS heat sink 2, the other side of the connecting bridge 7 is provided with a polarization beam combiner 8, two laser beams at the left side and the right side of the laser are combined into one beam of laser through the polarization beam combiner 8, one side of the polarization beam combiner 8 is provided with a FAC 02-second fast axis collimating lens 9, the FAC 02-second fast axis collimating lens 9 carries out secondary focusing and collimating on the combined laser in the fast axis direction, one side of the FAC 02-second fast axis collimating lens 9 is provided with a focusing lens carrier 10, the middle of one side of the focusing lens carrier 10 is provided with a focusing lens 14, the other side of the focusing lens carrier 10 is provided with an optical fiber 11.
The shell 1 is of a convex structure, one side of the shell 1 is provided with an electrode 12, the shell 1 is made of a light metal material with good heat conduction performance, the electrode 12 is made of a metal material with good electric conduction performance, the electrode 12 and the shell 1 are welded together through an insulating material to cause, and the electrode 12 and the COS chip 3 are connected together through a certain number of gold wires or aluminum wires with good wire performance.
The THS heat sink 2 and the shell 1 are sintered together through metal solder, and the THS heat sink 2 is made of metal materials with good heat conduction performance.
The VBG18 adopts a reflective type volume Bragg grating (R-VBG) structure, and after laser emitted by the COS chip 3 is compressed in the fast axis direction through the FAC 01-first fast axis collimating lens 13, light waves emitted by COS chip 3 units in the laser array outer cavity are fed back to adjacent units through angle and wavelength selection of the VBG18, so that phase locking of the laser array outer cavity is realized, and the spectral width of the laser is compressed.
The VBG heat sink 16 is provided with a positioning groove 19 in the middle, the size of the positioning groove 19 is larger than that of the VBG18, the upper end of the positioning groove 19 is provided with the VBG18, the bottom of the VBG18 is provided with a heat conducting sheet I17, two sides of the VBG18 are provided with heat conducting sheets II 29, the VBG heat sink 16 is made of metal or ceramic materials with good heat conducting performance, the VBG heat sink 16 is used for radiating the VBG18, the two sides of the heat conducting sheet I17 and the heat conducting sheet II 20 are made of metal materials with good viscous heat conducting performance, the heat conducting sheet I17 is stuck to the bottom of the VBG18, the heat conducting sheet II 20 is stuck to the two sides of the VBG18, and the VBG18 and the VBG heat sink 16 are stuck together through the heat conducting sheet I17 and the heat conducting sheet II 20.
The VBG assembly 5 is provided with radiating strips I21 and radiating strips II 22 with the same structure along the front and rear sides of the light path direction, each radiating strip is provided with L radiating grids 23 which are uniformly arranged, the radiating area of the radiating strips is increased through the radiating grids 23, the radiating strips I21 and II 22 are mainly used for radiating the VBG assembly 5, the radiating strips I21 and II 22 are adhered to the shell 1 and the VBG heat sink 16 through glue with good heat conduction performance, when the laser is used, laser beams penetrate through the VBG18 to enable the VBG18 heat collection temperature to rise, the VBG18 heat is rapidly transferred to the VBG heat sink 16 through the heat conducting strips I17 and II 20, and the VBG heat sink 16 rapidly releases the VBG heat 16 through the radiating strips I21 and II 22, so that the heat generated by the VBG18 and the VBG18 are kept in dynamic balance, and the VBG18 temperature is ensured to be stably kept within a certain range.
A reflector gasket 15 is arranged between two opposite THS heat sinks 2 in the shell 1, a reflector 6 is arranged at the upper end of the reflector gasket 15, each COS chip is provided with a reflector on an optical path passing through the SAC-slow axis collimating lens, the reflector 6 is used for deflecting the locked laser by 90 degrees, the reflector gasket 15 is arranged at the lower end of the reflector 6, and the reflector gasket 15 is made of ceramic materials.
The connecting bridge 7 is positioned on one side of the THS heat sink 2, the connecting bridge 7 is connected with the COS chip 3 through a metal gold wire or an aluminum wire with good electric conductivity, and the COS chips 3 on two sides of the laser are connected in series through the connecting bridge 7.
The FAC 02-second fast axis collimating lens 9 is provided with a focusing lens carrier 10 on one side, a focusing lens 14 is arranged in the middle of one side of the focusing lens carrier 10, an optical fiber 11 is arranged on the other side of the focusing lens carrier 10, the laser beam which is subjected to secondary focusing collimation through the FAC 02-second fast axis collimating lens 9 is further focused through the focusing lens 14, so that the laser is coupled into the optical fiber 11, and the laser is transmitted through the optical fiber.
Example 2
A manufacturing method of a distributed feedback type passive mode locking stable laser comprises the following steps:
1) Firstly, the COS chip 3 is reflowed to the THS heat sink 2 through vacuum high-temperature sintering by using good metal solder with heat conduction property;
2) FAC 01-a first fast axis collimating lens 13 is arranged on the THS heat sink 2 along the light path of the COS chip 3 to perform fast axis direction collimation and a slow axis collimating lens 4 is arranged on the THS heat sink 2 to perform slow axis direction collimation;
3) Paving a layer of metal solder at the lower end of the collimated THS heat sink 2, placing the metal solder into the shell 1, and sintering the shell 1 at a vacuum high temperature to sinter the THS heat sink 2 and the shell 1 together;
4) Connecting the sintered shell 1, the electrode 12, the COS chips 3 and the connecting bridge 7 together through gold wires by using a wire bonding machine, so that all the COS chips 3 form a series circuit;
5) Respectively sticking a heat conducting fin II 20 and a heat conducting fin I17 on two sides and the bottom of the VBG18, and then assembling the VBG18 on a positioning groove 19 of the VBG heat sink 16, so that the VBG18 and the VBG heat sink 16 are stuck together to form a VBG assembly 5;
6) Placing the VBG assembly 5 on the THS heat sink 2, performing VBG wave locking on the COS chip 3 on the THS heat sink 2 through VBG18 automatic wave locking equipment, and solidifying the VBG assembly 5 after the wave locking on the shell;
7) Glue with good heat conduction performance is respectively coated on the bottoms and the side surfaces of the radiating strips I21 and II 22, the side surfaces of the radiating strips I21 and II 22 are bonded with the VBG heat sink 16, the bottoms are bonded with the shell 1;
8) Respectively assembling the polarization beam combiner 8, the FAC 02-second fast axis collimating lens 9 and the focusing lens carrier 10 to corresponding positions of the shell 1 through an assembling clamp;
9) The reflector gasket 15 is assembled in the middle of the shell 1 and positioned in the middle of opposite THS heat sinks, the reflector 6 is coupled and assembled through automatic coupling equipment, so that laser light passes through the reflector 6 and is transmitted to the optical fiber 11 through the polarization beam combiner 8, the FAC 02-second fast axis collimating lens 9 and the focusing lens 14, and the internal laser assembly is completed;
10 And (3) performing aging test screening and parameter testing on the laser after performing vacuum sealing on the laser through vacuum sealing equipment, so as to finish the manufacturing of the distributed feedback type passive mode-locking fiber laser.
Claims (10)
1. The distributed feedback type passive mode locking stable laser is characterized by comprising a shell, M THS heat sinks are arranged in the shell, M is larger than or equal to 2, N COS chips are distributed on each THS heat sink, N is larger than or equal to 1, FAC 01-first fast axis collimating lenses are respectively arranged at the front ends of the COS chips, a VBG assembly is respectively arranged at the front ends of the FAC 01-first fast axis collimating lenses, the VBG assembly comprises a VBG heat sink, a heat conducting sheet I, a heat conducting sheet II and a VBG, a positioning groove is formed in the VBG heat sink, the VBG is arranged at the upper end of the positioning groove, the heat conducting sheet I is arranged at the bottom of the VBG, and the heat conducting sheet II is arranged at two sides of the VBG; the other side of the VBG assembly is provided with an SAC-slow axis collimating lens; one side of the THS heat sink is provided with a connecting bridge, the other side of the connecting bridge is provided with a polarization beam combiner, one side of the polarization beam combiner is provided with a FAC 02-second fast axis collimating lens, one side of the FAC 02-second fast axis collimating lens is provided with a focusing lens carrier, a focusing lens is arranged in the middle of one side of the focusing lens carrier, and the other side of the focusing lens carrier is provided with an optical fiber.
2. The distributed feedback type passive mode locking stable laser according to claim 1, wherein the shell is of a convex structure, an electrode is arranged on one side of the shell, the electrode and the shell are welded together through an insulating material, and the electrode and the COS chip are connected together through gold wires or aluminum wires.
3. The distributed feedback passive mode-locked stable laser of claim 1 wherein the THS heat sink and the housing are sintered together by metallic solder.
4. The distributed feedback passive mode-locked stable laser of claim 1, wherein the VBG employs a reflective bulk bragg grating structure.
5. The distributed feedback type passive mode-locked stable laser device according to claim 1, wherein a positioning groove is arranged in the middle of the VBG heat sink, the size of the positioning groove is larger than that of the VBG, the heat conducting fin I is stuck to the bottom of the VBG, the heat conducting fin II is stuck to two sides of the VBG, and the VBG heat sink are stuck together through the heat conducting fin I and the heat conducting fin II.
6. The distributed feedback type passive mode-locked stable laser device according to claim 2, wherein the front and rear sides of the VBG assembly along the light path direction are respectively provided with a heat dissipation strip I and a heat dissipation strip II which have the same structure, each heat dissipation strip is provided with L heat dissipation grids which are uniformly arranged, and the heat dissipation strips I and II are adhered with the shell and the VBG heat sink through glue.
7. The distributed feedback type passive mode-locked stable laser according to claim 6, wherein the THS heat sinks are arranged in opposite directions, a reflector gasket is arranged between the two opposite THS heat sinks, a reflector is arranged at the upper end of the reflector gasket, and a reflector is arranged on an optical path of each COS chip passing through the SAC-slow axis collimating lens and used for deflecting the locked laser at 90 degrees.
8. The distributed feedback passive mode-locked stable laser of claim 7 wherein the mirror spacer is a ceramic material.
9. The distributed feedback passive mode-locked stable laser of claim 1, wherein the connecting bridge is connected to the COS chip by gold or aluminum wires.
10. A method of making a distributed feedback passive mode-locked stable laser as defined in claim 7, comprising the steps of:
1) Firstly, enabling the COS chip to flow back to the THS heat sink through metal solder and vacuum high-temperature sintering;
2) Setting FAC 01-first fast axis collimating lens on THS heat sink along COS chip light path to perform fast axis direction collimation and slow axis collimating lens to perform slow axis direction collimation;
3) Paving a layer of metal solder on the lower end of the collimated THS heat sink, placing the metal solder into the shell, and carrying out vacuum high-temperature sintering on the shell for reflow to sinter the THS heat sink and the shell together;
4) Connecting the sintered shell with the electrode, the COS chip and the connecting bridge through wires by using a wire bonding machine, so that all the COS chips are connected in series;
5) Respectively sticking a heat conducting fin II and a heat conducting fin I on two sides and the bottom of the VBG, and then assembling the VBG on a VBG heat sink positioning groove to adhere the VBG and the VBG heat sink together to form a VBG assembly;
6) Placing the VBG assembly at the front end of the THS heat sink, performing VBG wave locking on the COS chip on the THS heat sink through a VBG automatic wave locking device, and solidifying the VBG assembly after the wave locking on the shell;
7) Glue is respectively coated on the bottoms and the side surfaces of the radiating strip I and the radiating strip II, the side surfaces of the radiating strip I and the radiating strip II are bonded with the VBG heat sink, and the bottoms of the VBG heat sinks are bonded with the shell;
8) Respectively assembling the polarization beam combiner, the FAC 02-second fast axis collimating lens and the focusing lens carrier to corresponding positions of the shell through an assembling clamp;
9) Assembling the reflector gasket to the middle position of the shell and positioned between opposite THS heat sinks, and assembling the reflector through automatic coupling equipment to enable laser to be transmitted to an optical fiber through the reflector through the polarization beam combiner, the FAC 02-second fast axis collimating lens and the focusing lens, so as to complete the internal assembly of the laser;
10 And (3) performing aging test screening and parameter testing on the laser after performing vacuum sealing on the laser through vacuum sealing equipment, so as to finish the manufacturing of the distributed feedback type passive mode-locking fiber laser.
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