CN117454723A - Simulation method and device for millimeter wave package antenna based on glass through hole technology - Google Patents
Simulation method and device for millimeter wave package antenna based on glass through hole technology Download PDFInfo
- Publication number
- CN117454723A CN117454723A CN202311783662.6A CN202311783662A CN117454723A CN 117454723 A CN117454723 A CN 117454723A CN 202311783662 A CN202311783662 A CN 202311783662A CN 117454723 A CN117454723 A CN 117454723A
- Authority
- CN
- China
- Prior art keywords
- simulation
- glass
- millimeter wave
- roughness
- transmission characteristic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004088 simulation Methods 0.000 title claims abstract description 173
- 239000011521 glass Substances 0.000 title claims abstract description 121
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000005516 engineering process Methods 0.000 title claims abstract description 21
- 230000005540 biological transmission Effects 0.000 claims abstract description 146
- 238000005315 distribution function Methods 0.000 claims abstract description 71
- 238000009826 distribution Methods 0.000 claims abstract description 17
- 230000005672 electromagnetic field Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000012937 correction Methods 0.000 claims description 48
- 238000004590 computer program Methods 0.000 claims description 20
- 230000008054 signal transmission Effects 0.000 claims description 16
- 230000006870 function Effects 0.000 claims description 8
- 238000013528 artificial neural network Methods 0.000 claims description 6
- 238000012706 support-vector machine Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 5
- 238000007781 pre-processing Methods 0.000 claims description 3
- 208000014903 transposition of the great arteries Diseases 0.000 description 39
- 230000008569 process Effects 0.000 description 10
- 239000004020 conductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 238000013213 extrapolation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000005293 physical law Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012887 quadratic function Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/27—Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/69—Microscopic objects, e.g. biological cells or cellular parts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/08—Probabilistic or stochastic CAD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Medical Informatics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Surface Treatment Of Glass (AREA)
- Details Of Aerials (AREA)
Abstract
The embodiment of the disclosure provides a simulation method and device of a millimeter wave package antenna based on a glass through hole technology. The simulation method comprises the following steps: extracting roughness characteristics of the side wall surface of the glass through hole according to the scanning electron microscope picture of the glass through hole; generating an initial distribution function of the sidewall surface from the extracted roughness features; constructing a first simulation model of the millimeter wave package antenna according to the initial distribution function and the material parameters of the millimeter wave package antenna by means of finite element simulation software; solving electromagnetic field distribution and transmission characteristic scattering parameters of a first simulation model of the millimeter wave package antenna through finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the first simulation model; and iteratively correcting the first simulation model of the millimeter wave package antenna according to the error between the simulated transmission characteristic scattering parameter of the simulated glass through hole and the actually measured transmission characteristic scattering parameter of the glass through hole.
Description
Technical Field
The embodiment of the disclosure relates to the technical field of simulation, in particular to a simulation method and a simulation device of a millimeter wave package antenna based on a glass through hole technology.
Background
With the vigorous development of smart phone technology, high-performance computing, artificial intelligence and other emerging fields, millimeter wave communication has very important value in military, civil and industrial fields due to the advantages of high speed, high capacity, high precision and abundant spectrum resources. Because of the limitations of the process level, material properties and physical laws, in order to solve the problems of significant transmission loss and integration level in millimeter wave chip packaging, it has become a great trend to replace the existing ceramics, organic materials and silicon with packaging materials having lower dielectric loss. Glass is becoming a current research hotspot due to the advantages of natural insulation, ultra-thin, high rigidity, high stability, adjustable thermal expansion coefficient and the like.
Despite the significant application prospects of glass packaging, there are still significant technical challenges. Similar to Through-Silicon-via (TSV) in a Silicon-based package, a glass via (TGV) in glass is a key structure that directly affects transmission loss, limiting power consumption and gain performance of a millimeter wave chip package. According to recent researches, the packaging technology based on TGV has the advantages that the practical transmission loss and the electromagnetic simulation result have distortion phenomena in the millimeter wave frequency band. The main reason is that when the communication frequency is raised to the millimeter wave band, at high frequencies, the current tends to be distributed on the surface of the conductor, a phenomenon called skin effect. Skin depth is frequency dependent. The higher the frequency, the smaller the skin depth, and the current will be concentrated mainly at the surface of the conductor. Therefore, in the high-frequency band, when the surface roughness of the conductor is small, the skin depth can penetrate into the conductor, so that the current can be more uniformly distributed, and the transmission loss is reduced. However, glass vias are typically fabricated by sand blasting, plasma etching, focused discharge, laser ablation, etc., which may damage the glass, resulting in irregular TGV sidewalls with higher roughness, resulting in TGV conductors with higher surface roughness after metal filling. When the surface roughness of the conductor is large, the skin depth becomes small, and more current will be concentrated on the surface of the conductor, resulting in a longer signal transmission path, thereby increasing transmission loss. In other words, in the high frequency band, the transmission loss of the millimeter wave package structure based on TGV mainly comes from the transmission loss caused by the rough surface of TGV. As interconnect density and communication frequency increase, smaller TGV sizes are required, so microscopic-scale losses will be further emphasized by skin effect.
If a millimeter wave package antenna based on TGV technology can be modeled and simulated more accurately, the research on the transmission loss of such millimeter wave package antenna is helpful to provide assistance and guide the process improvement.
Disclosure of Invention
Embodiments described herein provide a simulation method, a simulation apparatus, and a computer-readable storage medium storing a computer program for a millimeter wave package antenna based on a glass via technology.
According to a first aspect of the present disclosure, a simulation method of a millimeter wave package antenna based on a glass via technology is provided. The simulation method comprises the following steps: extracting roughness characteristics of the side wall surface of the glass through hole according to the scanning electron microscope picture of the glass through hole; generating an initial distribution function of the sidewall surface from the extracted roughness features; constructing a first simulation model of the millimeter wave package antenna according to the initial distribution function and the material parameters of the millimeter wave package antenna by means of finite element simulation software; solving electromagnetic field distribution and transmission characteristic scattering parameters of a first simulation model of the millimeter wave package antenna through finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the first simulation model; and iteratively correcting the first simulation model of the millimeter wave package antenna according to the error between the simulated transmission characteristic scattering parameter of the simulated glass through hole and the actually measured transmission characteristic scattering parameter of the glass through hole.
In some embodiments of the present disclosure, generating an initial distribution function of the sidewall surface from the extracted roughness features includes: generating candidate distribution functions of the side wall surfaces in a random fitting mode; adjusting parameters of the candidate distribution function based on the extracted roughness features such that random sidewall surfaces characterized by the candidate distribution function have the extracted roughness features; and taking the adjusted candidate distribution function as an initial distribution function.
In some embodiments of the present disclosure, generating candidate distribution functions for the sidewall surfaces by way of random fitting includes generating candidate distribution functions by:
where f (x, y) denotes a candidate distribution function, x and y denote spatial coordinates, M denotes spatial frequency on the x-axis, N denotes spatial frequency on the y-axis, M denotes maximum spatial frequency on the x-axis, N denotes maximum spatial frequency on the y-axis, a (M, N) denotes amplitude, Φ (M, N) denotes phase angle, the amplitude and phase angle being generated by a random number.
In some embodiments of the present disclosure, the roughness features include one or more of the following: peak number per unit area, roughness root mean square, maximum height difference, main peak length.
In some embodiments of the present disclosure, iteratively correcting the first simulation model of the millimeter wave package antenna based on an error between the simulated transmission characteristic scattering parameter of the simulated glass via and the measured transmission characteristic scattering parameter of the glass via includes, in each iteration, performing the following operations until the error converges: adjusting parameters of the initial distribution function according to errors by means of a support vector machine or a neural network to adjust roughness characteristics of the simulated glass through holes in the first simulation model; updating the first simulation model by means of finite element simulation software according to the adjusted parameters of the initial distribution function; solving the electromagnetic field distribution and transmission characteristic scattering parameters of the updated first simulation model through finite element simulation software to obtain updated simulation transmission characteristic scattering parameters of the simulation glass through hole; and calculating an error between the updated simulated transmission characteristic scattering parameter and the measured transmission characteristic scattering parameter.
In some embodiments of the present disclosure, extracting roughness features of sidewall surfaces of a glass via from a scanning electron microscope picture of the glass via includes: obtaining a scanning electron microscope picture taken of a cross section of the glass through hole by a scanning electron microscope; preprocessing the scanning electron microscope picture to improve the definition and the analyzability of the scanning electron microscope picture; and extracting roughness characteristics of the side wall surface of the glass through hole from the preprocessed scanning electron microscope picture.
In some embodiments of the present disclosure, the simulation method further comprises: constructing a second simulation model of the millimeter wave package antenna according to material parameters of the millimeter wave package antenna by means of finite element simulation software, wherein glass through holes in the second simulation model are constructed to have smooth side wall surfaces; solving electromagnetic field distribution and transmission characteristic scattering parameters of a second simulation model of the millimeter wave package antenna through finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the second simulation model; the simulated transmission characteristic scattering parameter is multiplied by the transmission loss as a new simulated transmission characteristic scattering parameter.
Wherein the transmission loss is calculated according to the following equation:
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, K1 (0) represents a first correction factor when the roughness root mean square is 0, K2 (0) represents a second correction factor when the roughness root mean square is 0, and K3 (0) represents a third correction factor when the roughness root mean square is 0.
In some embodiments of the present disclosure, K1 (0), K2 (0), and K3 (0) are obtained by: obtaining actual measurement transmission loss of a plurality of millimeter wave package antennas, wherein glass through holes of each millimeter wave package antenna in the plurality of millimeter wave package antennas have different roughness root mean square; performing curve fitting on the transmission loss according to the obtained actually measured transmission loss and the roughness root mean square of the corresponding glass through hole to obtain functions of the transmission loss and the first correction factor, the second correction factor and the third correction factor under different roughness root mean square on signal transmission frequency; and presuming K1 (0), K2 (0) and K3 (0) according to the fitted curve.
Wherein the fitted curve is expressed as:
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, r represents roughness root mean square, K1 (r) represents a first correction factor when the roughness root mean square is r, K2 (r) represents a second correction factor when the roughness root mean square is r, and K3 (r) represents a third correction factor when the roughness root mean square is r.
According to a second aspect of the present disclosure, a simulation apparatus of a millimeter wave package antenna based on a glass via technology is provided. The simulation device includes at least one processor; and at least one memory storing a computer program. The computer program, when executed by at least one processor, causes the simulation apparatus to: extracting roughness characteristics of the side wall surface of the glass through hole according to the scanning electron microscope picture of the glass through hole; generating an initial distribution function of the sidewall surface from the extracted roughness features; constructing a first simulation model of the millimeter wave package antenna according to the initial distribution function and the material parameters of the millimeter wave package antenna by means of finite element simulation software; solving electromagnetic field distribution and transmission characteristic scattering parameters of a first simulation model of the millimeter wave package antenna through finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the first simulation model; and iteratively correcting the first simulation model of the millimeter wave package antenna according to the error between the simulated transmission characteristic scattering parameter of the simulated glass through hole and the actually measured transmission characteristic scattering parameter of the glass through hole.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to generate an initial distribution function of the sidewall surface from the extracted roughness features by: generating candidate distribution functions of the side wall surfaces in a random fitting mode; adjusting parameters of the candidate distribution function based on the extracted roughness features such that random sidewall surfaces characterized by the candidate distribution function have the extracted roughness features; and taking the adjusted candidate distribution function as an initial distribution function.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to generate candidate distribution functions of the sidewall surface by way of random fitting by: the candidate distribution function is generated by the following equation,
where f (x, y) denotes a candidate distribution function, x and y denote spatial coordinates, M denotes spatial frequency on the x-axis, N denotes spatial frequency on the y-axis, M denotes maximum spatial frequency on the x-axis, N denotes maximum spatial frequency on the y-axis, a (M, N) denotes amplitude, Φ (M, N) denotes phase angle, the amplitude and phase angle being generated by a random number.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to iteratively correct the first simulation model of the millimeter wave package antenna according to an error between a simulated transmission characteristic scattering parameter of the simulated glass via and a measured transmission characteristic scattering parameter of the glass via by: the following operations are performed during each iteration until the error converges: adjusting parameters of the initial distribution function according to errors by means of a support vector machine or a neural network to adjust roughness characteristics of the simulated glass through holes in the first simulation model; updating the first simulation model by means of finite element simulation software according to the adjusted parameters of the initial distribution function; solving the electromagnetic field distribution and transmission characteristic scattering parameters of the updated first simulation model through finite element simulation software to obtain updated simulation transmission characteristic scattering parameters of the simulation glass through hole; and calculating an error between the updated simulated transmission characteristic scattering parameter and the measured transmission characteristic scattering parameter.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to extract roughness characteristics of the sidewall surface of the glass via from the scanning electron microscope picture of the glass via by: obtaining a scanning electron microscope picture taken of a cross section of the glass through hole by a scanning electron microscope; preprocessing the scanning electron microscope picture to improve the definition and the analyzability of the scanning electron microscope picture; and extracting roughness characteristics of the side wall surface of the glass through hole from the preprocessed scanning electron microscope picture.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to further: constructing a second simulation model of the millimeter wave package antenna according to material parameters of the millimeter wave package antenna by means of finite element simulation software, wherein glass through holes in the second simulation model are constructed to have smooth side wall surfaces; solving electromagnetic field distribution and transmission characteristic scattering parameters of a second simulation model of the millimeter wave package antenna through finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the second simulation model; the simulated transmission characteristic scattering parameter is multiplied by the transmission loss as a new simulated transmission characteristic scattering parameter.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to calculate the transmission loss by:
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, K1 (0) represents a first correction factor when the roughness root mean square is 0, and K2 (0) representsThe second correction factor when the roughness root mean square is 0 is shown, and K3 (0) represents the third correction factor when the roughness root mean square is 0.
In some embodiments of the present disclosure, the computer program, when executed by the at least one processor, causes the simulation apparatus to obtain K1 (0), K2 (0), and K3 (0) by: obtaining actual measurement transmission loss of a plurality of millimeter wave package antennas, wherein glass through holes of each millimeter wave package antenna in the plurality of millimeter wave package antennas have different roughness root mean square; performing curve fitting on the transmission loss according to the obtained actually measured transmission loss and the roughness root mean square of the corresponding glass through hole to obtain functions of the transmission loss and the first correction factor, the second correction factor and the third correction factor under different roughness root mean square on signal transmission frequency; and presuming K1 (0), K2 (0) and K3 (0) according to the fitted curve.
Wherein the fitted curve is expressed as:
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, r represents roughness root mean square, K1 (r) represents a first correction factor when the roughness root mean square is r, K2 (r) represents a second correction factor when the roughness root mean square is r, and K3 (r) represents a third correction factor when the roughness root mean square is r.
According to a third aspect of the present disclosure, there is provided a computer readable storage medium storing a computer program, wherein the computer program when executed by a processor implements the steps of the simulation method according to the first aspect of the present disclosure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following brief description of the drawings of the embodiments will be given, it being understood that the drawings described below relate only to some embodiments of the present disclosure, not to limitations of the present disclosure, in which:
fig. 1 is an exemplary flowchart of a simulation method of a millimeter wave package antenna based on glass via technology in accordance with an embodiment of the present disclosure;
fig. 2 is an exemplary flowchart of further steps of a method of simulating a millimeter wave package antenna based on glass via technology in accordance with an embodiment of the present disclosure;
fig. 3 is a schematic block diagram of a simulation apparatus of a millimeter wave package antenna based on glass via technology in accordance with an embodiment of the present disclosure.
It is noted that the elements in the drawings are schematic and are not drawn to scale.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by those skilled in the art based on the described embodiments of the present disclosure without the need for creative efforts, are also within the scope of the protection of the present disclosure.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the presently disclosed subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. In addition, terms such as "first" and "second" are used merely to distinguish one component (or portion of a component) from another component (or another portion of a component).
Fig. 1 illustrates an exemplary flowchart of a simulation method of a millimeter wave package antenna based on glass via technology in accordance with an embodiment of the present disclosure.
At block S102 of fig. 1, roughness characteristics of sidewall surfaces of a glass through hole (TGV) are extracted from a scanning electron microscope picture of the glass through hole. It should be noted that the sidewall of the TGV herein refers to the inner sidewall of the TGV. The roughness characteristics may include one or more of the following: peak number per unit area, roughness root mean square, maximum height difference, main peak length.
In some embodiments of the present disclosure, SEM pictures taken of cross-sections of glass vias by a scanning electron microscope (scanning electron microscope, SEM) may be obtained. When photographing the cross section of the glass through hole, the glass through hole is already filled with metal. Thus, the SEM pictures herein can also be considered as pictures taken of the metal surface in the glass via. SEM pictures can provide higher magnification and more detailed surface information. Alternatively, other optical or electron microscopes may be used to obtain a cross-sectional picture of the glass through-hole, as embodiments of the present disclosure are not limited in this regard. The SEM pictures may then be pre-processed (e.g., denoising, contrast enhancement, etc.) to improve the sharpness and analyzability of the SEM pictures. Then, roughness characteristics of the sidewall surface of the glass via can be extracted from the pretreated SEM pictures by image recognition technology.
At block S104, an initial distribution function of the sidewall surface of the TGV is generated from the extracted roughness features. The inventors of the present disclosure found that the roughness of the sidewall surface of the TGV is close to random distribution, thus suggesting that candidate distribution functions of the sidewall surface of the TGV are generated by means of random fitting. The candidate distribution function may be a gaussian distribution function.
In some embodiments of the present disclosure, the candidate distribution function of the sidewall surface of the TGV may be considered to be composed of a plurality of fundamental waves, and the candidate distribution function may be generated by the following formula (1):
（1）
where f (x, y) denotes a candidate distribution function, x and y denote spatial coordinates, M denotes spatial frequency on the x-axis, N denotes spatial frequency on the y-axis, M denotes maximum spatial frequency on the x-axis, N denotes maximum spatial frequency on the y-axis, a (M, N) denotes amplitude, Φ (M, N) denotes phase angle, the amplitude and phase angle being generated by a random number.
Then, parameters of the candidate distribution function are adjusted based on the roughness features extracted at block S102. The parameters may include: phase, amplitude, periodicity, etc. By changing the parameters of the candidate distribution function, the average roughness of the sidewall surface of the TGV can be adjusted, so that the TGV with any irregular roughness can be accurately simulated by adjusting the parameters of the candidate distribution function. The parameters of the candidate distribution function are adjusted such that the random sidewall surface characterized by the candidate distribution function has roughness characteristics, such as the number of peaks per unit area, roughness root mean square, maximum height difference, main peak length, etc., extracted at block S102. The adjusted candidate distribution function may then be used as the initial distribution function.
At block S106, a first simulation model of the millimeter wave package antenna is constructed from the initial distribution function and the material parameters of the millimeter wave package antenna by means of finite element simulation software. Finite element simulation software may include COMSOL and the like. The material parameters of the millimeter wave package antenna may include the dielectric constant, loss tangent, electrical conductivity of the pore-filling metal, etc. of the glass substrate used. The initial distribution function and the material parameters of the millimeter wave package antenna may be input together into the finite element simulation software, and then a three-dimensional model (i.e., a first simulation model) of the millimeter wave package antenna may be constructed by the finite element simulation software. In the first simulation model, the actual geometry of the TGV may be defined by the initial distribution function generated at block S104. Finite element simulation software may perform finite element simulation on a TGV-based "ground-signal-ground (GSG)" structure.
At block S108, the electromagnetic field distribution and the transmission characteristic scattering parameter of the first simulation model of the millimeter wave package antenna are solved by finite element simulation software to obtain a simulated transmission characteristic scattering parameter of a simulated glass through hole in the first simulation model. The transmission characteristic scattering parameter may also be referred to as a transmission characteristic S parameter, which may be used to measure transmission loss.
At block S110, a first simulation model of the millimeter wave package antenna is iteratively corrected according to an error between a simulated transmission characteristic scattering parameter of the simulated glass via and an measured transmission characteristic scattering parameter of the glass via. The actually measured transmission characteristic scattering parameter of the glass through hole is obtained by actually measuring the transmission loss of the millimeter wave package antenna. In some embodiments of the present disclosure, the following operations may be performed during each round of iteration until the error converges as described above: adjusting parameters of an initial distribution function according to the errors by means of a support vector machine or a neural network to adjust roughness characteristics of the simulated glass through holes in the first simulation model, wherein the support vector machine or the neural network can provide a basis for the next iteration direction; updating the first simulation model by means of finite element simulation software according to the adjusted parameters of the initial distribution function; solving the electromagnetic field distribution and transmission characteristic scattering parameters of the updated first simulation model through finite element simulation software to obtain updated simulation transmission characteristic scattering parameters of the simulation glass through hole; and calculating an error between the updated simulated transmission characteristic scattering parameter and the measured transmission characteristic scattering parameter.
The first simulation model of the millimeter wave package antenna obtained through the above-described process can be used to more truly infer the transmission characteristic scattering parameters of the millimeter wave package antenna. Thus, in subsequent work, one skilled in the art can utilize the first simulation model to adjust the process parameters of the TGV to quickly determine at which process parameters the transmission loss is smaller and to guide the process improvement.
In millimeter wave package antennas based on TGV technology, the number of TGVs may be very large due to performance requirements. When TGV is used as a three-dimensional package or interconnect for a package antenna, it is usually present in the form of a "ground-signal-ground" three-port or in the form of a TGV "signal-shielding array", which has a great high frequency advantage over a single TGV structure, so that in practice a large number of TGVs are designed in millimeter wave package antennas.
When the number of TGVs is large, in the full-wave electromagnetic simulation software such as HFSS, the through holes such as TGVs are usually simplified to be smooth cylinders for processing. The electromagnetic loss model can not effectively estimate the influence of special microcosmic morphology introduced by the TGV technology on the transmission loss, so that the electromagnetic simulation result is difficult to accurately reflect the transmission loss caused by the actual technological scheme. This not only affects the accuracy of the TGV package design in practical applications, but the fabrication process is also difficult to adjust based on the measured results. At the same time, the increased number of TGVs further increases the computational overhead.
Therefore, for applications with a large number of TGVs, a simplified modeling method needs to be established. Embodiments of the present disclosure propose that a smooth TGV may be used in place of a TGV having an irregular microstructure in a simulation model, and then the transmission loss resulting from the smooth TGV simulation is multiplied by a correction factor to determine the transmission loss resulting from the TGV simulation having an irregular microstructure, so that not only a large amount of computational resources can be saved but also simulation accuracy can be improved in TGV array modeling simulation.
FIG. 2 shows an exemplary flow chart for implementing a simplified modeling method based on FIG. 1.
At block S202 of fig. 2, a second simulation model of the millimeter wave package antenna is constructed from material parameters of the millimeter wave package antenna by means of finite element simulation software, wherein glass vias in the second simulation model are constructed with smooth sidewall surfaces. In some embodiments of the present disclosure, the number of glass vias in the second simulation model may be substantially greater than the number of glass vias in the first simulation model.
At block S204, electromagnetic field distribution and transmission characteristic scattering parameters of a second simulation model of the millimeter wave package antenna are solved by finite element simulation software to obtain simulated transmission characteristic scattering parameters of simulated glass through holes in the second simulation model. Since the glass through-hole is constructed to have a smooth sidewall surface, the simulation calculation amount of this operation is greatly reduced compared to the operation at block S108.
At block S206, the simulated transmission characteristic scattering parameter is multiplied by the transmission loss as a new simulated transmission characteristic scattering parameter.
In some embodiments of the present disclosure, the transmission loss may be calculated according to the following equation (2):
（2）
wherein the method comprises the steps of，α T (ω) represents transmission loss, ω represents signal transmission frequency, K1 (0) represents a first correction factor when the roughness root mean square is 0, K2 (0) represents a second correction factor when the roughness root mean square is 0, and K3 (0) represents a third correction factor when the roughness root mean square is 0.
Since an absolutely smooth (roughness root mean square of 0) glass through-hole cannot be obtained in practical applications, embodiments of the present disclosure propose to calculate K1 (0), K2 (0) and K3 (0) by way of curve extrapolation. In some embodiments of the present disclosure, K1 (0), K2 (0), and K3 (0) are obtained by: obtaining measured transmission loss of a plurality of millimeter wave package antennas, wherein the glass through hole of each millimeter wave package antenna in the plurality of millimeter wave package antennas has different roughness root mean square; performing curve fitting on the transmission loss according to the obtained actually measured transmission loss and the roughness root mean square of the corresponding glass through hole to obtain functions of the transmission loss and the first correction factor, the second correction factor and the third correction factor under different roughness root mean square on signal transmission frequency; and presuming K1 (0), K2 (0) and K3 (0) according to the fitted curve.
Wherein the fitted curve is expressed as:
（3）
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, r represents roughness root mean square, K1 (r) represents a first correction factor when the roughness root mean square is r, K2 (r) represents a second correction factor when the roughness root mean square is r, and K3 (r) represents a third correction factor when the roughness root mean square is r.
In one example, the operations of curve fitting and curve extrapolation may be performed by means of MATLAB. Let a be when r=r1 T (ω)= α T1 The method comprises the steps of carrying out a first treatment on the surface of the When r=r2, α T (ω)= α T2 The method comprises the steps of carrying out a first treatment on the surface of the When r=r3, α T (ω)= α T3 The method comprises the steps of carrying out a first treatment on the surface of the And so on; when r=rn, α T (ω)= α TN . Wherein N is a positive integer greater than 3. The data is then imported into MATLAB.MATLAB may be instructed to fit a quadratic function of ω according to the discrete values described above.
Thus, the following data sets are available:
[R1, K1(R1), K2(R1),K3(R1)]，
[R2, K1(R2), K2(R2),K3(R2)]，
[R3, K1(R3), K2(R3),K3(R3)]，
……
[RN, K1(N), K2(N),K3(N)]。
the data set is then imported into MATLAB, which is then automatically fitted to a surface, including three independent variables K1, K2, K3 and one dependent variable r. When the fitting results in the formula (3), r=0 is brought into the formula (3), and the first correction factor K1 (0), the second correction factor K2 (0), and the third correction factor K3 (0) when the side wall is smooth can be obtained.
If the glass via is designed to have an ideal smooth sidewall surface in the simulation model of the millimeter wave package antenna, the transmission loss of the millimeter wave package antenna is frequency-invariant, but in actual measurement, the transmission loss of the millimeter wave package antenna is frequency-variant, which is entirely caused by the roughness of the sidewall surface of the glass via. The second simulation model according to the embodiment of the present disclosure, although employing a glass via having a smooth sidewall surface for simulation calculation, multiplies the simulated transmission characteristic scattering parameter by the transmission loss as a new simulated transmission characteristic scattering parameter when calculating the transmission loss, and the transmission loss is related to roughness, so the second simulation model according to the embodiment of the present disclosure can estimate a more accurate simulated transmission characteristic scattering parameter.
Fig. 3 shows a schematic block diagram of a simulation apparatus 300 of a millimeter wave package antenna based on glass via technology in accordance with an embodiment of the present disclosure. As shown in FIG. 3, the emulation device 300 may include a processor 310 and a memory 320 storing a computer program. The computer programs, when executed by the processor 310, enable the emulation device 300 to perform the steps of the methods as shown in fig. 1 or fig. 2. In one example, the emulation apparatus 300 may be a computer device or a cloud computing node. The simulation apparatus 300 may extract roughness characteristics of the sidewall surface of the glass via according to a scanning electron microscope picture of the glass via. The simulation apparatus 300 may generate an initial distribution function of the sidewall surface based on the extracted roughness features. The simulation apparatus 300 may construct a first simulation model of the millimeter wave package antenna according to the initial distribution function and the material parameters of the millimeter wave package antenna by means of finite element simulation software. The simulation device 300 may solve the electromagnetic field distribution and the transmission characteristic scattering parameter of the first simulation model of the millimeter wave package antenna through finite element simulation software to obtain a simulated transmission characteristic scattering parameter of the simulated glass through hole in the first simulation model. The simulation device 300 may iteratively correct the first simulation model of the millimeter wave package antenna according to an error between the simulated transmission characteristic scattering parameter of the simulated glass via and the measured transmission characteristic scattering parameter of the glass via.
In some embodiments of the present disclosure, the simulation apparatus 300 may generate candidate distribution functions for the sidewall surfaces by way of random fitting. The simulation apparatus 300 may adjust parameters of the candidate distribution function based on the extracted roughness features such that the random sidewall surfaces characterized by the candidate distribution function have the extracted roughness features. The simulation apparatus 300 may use the adjusted candidate distribution function as the initial distribution function.
In some embodiments of the present disclosure, the simulation apparatus 300 may generate the candidate distribution function by:
where f (x, y) denotes a candidate distribution function, x and y denote spatial coordinates, M denotes spatial frequency on the x-axis, N denotes spatial frequency on the y-axis, M denotes maximum spatial frequency on the x-axis, N denotes maximum spatial frequency on the y-axis, a (M, N) denotes amplitude, Φ (M, N) denotes phase angle, the amplitude and phase angle being generated by a random number.
In some embodiments of the present disclosure, the simulation apparatus 300 may perform the following operations during each round of iteration until the error converges: adjusting parameters of the initial distribution function according to errors by means of a support vector machine or a neural network to adjust roughness characteristics of the simulated glass through holes in the first simulation model; updating the first simulation model by means of finite element simulation software according to the adjusted parameters of the initial distribution function; solving the electromagnetic field distribution and transmission characteristic scattering parameters of the updated first simulation model through finite element simulation software to obtain updated simulation transmission characteristic scattering parameters of the simulation glass through hole; and calculating an error between the updated simulated transmission characteristic scattering parameter and the measured transmission characteristic scattering parameter.
In some embodiments of the present disclosure, the simulation apparatus 300 may obtain a scanning electron microscope picture taken of a cross section of a glass via by a scanning electron microscope. The simulation device 300 may preprocess the sem pictures to improve the sharpness and analyzability of the sem pictures. The simulation apparatus 300 may extract roughness characteristics of the sidewall surface of the glass via from the preprocessed sem image.
In some embodiments of the present disclosure, emulation device 300 may construct a second emulation model of the millimeter wave package antenna from the material parameters of the millimeter wave package antenna by means of finite element emulation software. Wherein the glass through-hole in the second simulation model is constructed to have a smooth sidewall surface. The simulation device 300 may solve the electromagnetic field distribution and the transmission characteristic scattering parameter of the second simulation model of the millimeter wave package antenna through finite element simulation software to obtain a simulated transmission characteristic scattering parameter of the simulated glass through hole in the second simulation model. The simulation apparatus 300 may multiply the simulated transmission characteristic scattering parameter by the transmission loss as a new simulated transmission characteristic scattering parameter.
Wherein the transmission loss is calculated according to the following equation:
Wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, K1 (0) represents a first correction factor when the roughness root mean square is 0, and K2 (0) represents when the roughness root mean square is 0K3 (0) represents a third correction factor when the root mean square of the roughness is 0.
In some embodiments of the present disclosure, emulation device 300 may obtain measured transmission losses for a plurality of millimeter wave package antennas. The glass via of each millimeter wave package antenna of the plurality of millimeter wave package antennas has a different root mean square roughness. The simulation device 300 may perform curve fitting on the transmission loss according to the obtained actually measured transmission loss and the roughness root mean square of the corresponding glass through hole to obtain a function of the transmission loss and the first correction factor, the second correction factor and the third correction factor under different roughness root squares with respect to the signal transmission frequency. The simulation device 300 may infer K1 (0), K2 (0), and K3 (0) from the fitted curves.
Wherein the fitted curve is expressed as:
wherein alpha is T (ω) represents transmission loss, ω represents signal transmission frequency, r represents roughness root mean square, K1 (r) represents a first correction factor when the roughness root mean square is r, K2 (r) represents a second correction factor when the roughness root mean square is r, and K3 (r) represents a third correction factor when the roughness root mean square is r.
In embodiments of the present disclosure, processor 310 may be, for example, a Central Processing Unit (CPU), a microprocessor, a Digital Signal Processor (DSP), a processor of a multi-core based processor architecture, or the like. Memory 320 may be any type of memory implemented using data storage technology including, but not limited to, random access memory, read only memory, semiconductor-based memory, flash memory, disk storage, and the like.
Furthermore, in an embodiment of the present disclosure, the simulation apparatus 300 may also include an input device 330, such as a keyboard, a mouse, etc., for inputting SEM pictures of glass through holes, material parameters of millimeter wave package antennas, etc. In addition, the simulation apparatus 300 may further comprise an output device 340, such as a display or the like, for outputting the simulated transmission characteristic scattering parameters.
In other embodiments of the present disclosure, there is also provided a computer readable storage medium storing a computer program, wherein the computer program is capable of implementing the steps of the method as shown in fig. 1 to 2 when being executed by a processor.
In summary, the simulation method of the millimeter wave package antenna based on the glass through hole technology according to the embodiment of the disclosure can realize accurate modeling of the glass through hole. The first simulation model of the millimeter wave package antenna obtained by the simulation method according to the embodiment of the present disclosure can be used to more truly infer the transmission characteristic scattering parameter of the millimeter wave package antenna. Thus, in subsequent work, one skilled in the art can utilize the first simulation model to adjust the process parameters of the TGV to quickly determine at which process parameters the transmission loss is smaller and to guide the process improvement.
Further, the simulation method according to the embodiment of the present disclosure can also be applied to a millimeter wave package antenna based on high-density TGV. The second simulation model according to the embodiment of the present disclosure uses the glass through hole having the smooth sidewall surface to perform the simulation calculation, and the simulation calculation amount can be significantly reduced. Although the second simulation model uses the glass via having the smooth sidewall surface for simulation calculation, the simulated transmission characteristic scattering parameter is multiplied by the transmission loss as a new simulated transmission characteristic scattering parameter when calculating the transmission loss, and the transmission loss is related to the sidewall surface roughness of the glass via, so the second simulation model according to the embodiment of the present disclosure can estimate a more accurate simulated transmission characteristic scattering parameter.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus and methods according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
As used herein and in the appended claims, the singular forms of words include the plural and vice versa, unless the context clearly dictates otherwise. Thus, when referring to the singular, the plural of the corresponding term is generally included. Similarly, the terms "comprising" and "including" are to be construed as being inclusive rather than exclusive. Likewise, the terms "comprising" and "or" should be interpreted as inclusive, unless such an interpretation is expressly prohibited herein. Where the term "example" is used herein, particularly when it follows a set of terms, the "example" is merely exemplary and illustrative and should not be considered exclusive or broad.
Further aspects and scope of applicability will become apparent from the description provided herein. It should be understood that various aspects of the present application may be implemented alone or in combination with one or more other aspects. It should also be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
While several embodiments of the present disclosure have been described in detail, it will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present disclosure without departing from the spirit and scope of the disclosure. The scope of the present disclosure is defined by the appended claims.
Claims (10)
1. The simulation method of the millimeter wave package antenna based on the glass through hole technology is characterized by comprising the following steps of:
extracting roughness characteristics of the side wall surface of the glass through hole according to a scanning electron microscope picture of the glass through hole;
generating an initial distribution function of the sidewall surface from the extracted roughness features;
constructing a first simulation model of the millimeter wave package antenna according to the initial distribution function and material parameters of the millimeter wave package antenna by means of finite element simulation software;
solving electromagnetic field distribution and transmission characteristic scattering parameters of the first simulation model of the millimeter wave package antenna through the finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the first simulation model; and
and iteratively correcting the first simulation model of the millimeter wave package antenna according to the error between the simulated transmission characteristic scattering parameter of the simulated glass through hole and the actually measured transmission characteristic scattering parameter of the glass through hole.
2. The simulation method of claim 1, wherein generating an initial distribution function of the sidewall surface from the extracted roughness features comprises:
Generating candidate distribution functions of the side wall surfaces in a random fitting mode;
adjusting parameters of the candidate distribution function based on the extracted roughness features such that random sidewall surfaces characterized by the candidate distribution function have the extracted roughness features; and
and taking the adjusted candidate distribution function as the initial distribution function.
3. The simulation method of claim 2 wherein generating candidate distribution functions for the sidewall surface by means of random fitting comprises generating candidate distribution functions by:
，
wherein f (x, y) represents the candidate distribution function, x and y represent spatial coordinates, M represents spatial frequencies on the x-axis, N represents spatial frequencies on the y-axis, M represents maximum spatial frequencies on the x-axis, N represents maximum spatial frequencies on the y-axis, a (M, N) represents amplitude, Φ (M, N) represents phase angle, the amplitude and the phase angle being generated by a random number.
4. A simulation method according to any of claims 1 to 3, wherein the roughness features comprise one or more of the following: peak number per unit area, roughness root mean square, maximum height difference, main peak length.
5. A simulation method according to any one of claims 1 to 3, wherein iteratively correcting the first simulation model of the millimeter wave package antenna in accordance with an error between the simulated transmission characteristic scattering parameter of the simulated glass via and the measured transmission characteristic scattering parameter of the glass via comprises, in each iteration, performing the following operations until the error converges:
adjusting parameters of the initial distribution function according to the errors by means of a support vector machine or a neural network to adjust roughness characteristics of the simulated glass through holes in the first simulation model;
updating the first simulation model by means of the finite element simulation software according to the adjusted parameters of the initial distribution function;
solving the electromagnetic field distribution and transmission characteristic scattering parameters of the updated first simulation model through the finite element simulation software to obtain updated simulation transmission characteristic scattering parameters of the simulation glass through hole; and
and calculating an error between the updated simulated transmission characteristic scattering parameter and the measured transmission characteristic scattering parameter.
6. A simulation method according to any one of claims 1 to 3, wherein extracting roughness features of sidewall surfaces of a glass via from a scanning electron microscope picture of the glass via comprises:
Obtaining a scanning electron microscope picture taken of a cross section of the glass through hole by a scanning electron microscope;
preprocessing the scanning electron microscope picture to improve the definition and the analyzability of the scanning electron microscope picture; and
and extracting the roughness characteristics of the side wall surface of the glass through hole from the pretreated scanning electron microscope picture.
7. A simulation method according to any one of claims 1 to 3, further comprising:
constructing a second simulation model of the millimeter wave package antenna according to the material parameters of the millimeter wave package antenna by means of the finite element simulation software, wherein glass through holes in the second simulation model are constructed to have smooth side wall surfaces;
solving electromagnetic field distribution and transmission characteristic scattering parameters of the second simulation model of the millimeter wave package antenna through the finite element simulation software to obtain simulation transmission characteristic scattering parameters of a simulation glass through hole in the second simulation model;
multiplying the simulated transmission characteristic scattering parameter by transmission loss as a new simulated transmission characteristic scattering parameter;
Wherein the transmission loss is calculated according to the following equation:
，
wherein alpha is T (ω) represents the transmission loss, ω represents the signal transmission frequency, K1 (0) represents a first correction factor when the roughness root mean square is 0, K2 (0) represents a second correction factor when the roughness root mean square is 0, and K3 (0) represents a third correction factor when the roughness root mean square is 0.
8. The simulation method according to claim 7, wherein K1 (0), K2 (0) and K3 (0) are obtained by:
obtaining the actually measured transmission loss of a plurality of millimeter wave package antennas, wherein the glass through holes of each millimeter wave package antenna in the plurality of millimeter wave package antennas have different roughness root mean square;
performing curve fitting on the transmission loss according to the obtained actually measured transmission loss and the roughness root mean square of the corresponding glass through hole to obtain functions of the transmission loss and the first correction factor, the second correction factor and the third correction factor under different roughness root mean square on signal transmission frequency; and
estimating K1 (0), K2 (0) and K3 (0) from the fitted curve;
wherein the fitted curve is expressed as:
，
wherein alpha is T (ω) represents the transmission loss, ω represents a signal transmission frequency, r represents the roughness root mean square, K1 (r) represents a first correction factor when the roughness root mean square is r, K2 (r) represents a second correction factor when the roughness root mean square is r, and K3 (r) represents a third correction factor when the roughness root mean square is r.
9. A simulation device of a millimeter wave package antenna based on a glass through hole technology, which is characterized by comprising:
at least one processor; and
at least one memory storing a computer program;
wherein the computer program, when executed by the at least one processor, causes the simulation apparatus to perform the steps of the simulation method according to any of claims 1 to 8.
10. A computer-readable storage medium storing a computer program, characterized in that the computer program, when executed by a processor, implements the steps of the simulation method according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311783662.6A CN117454723B (en) | 2023-12-22 | 2023-12-22 | Simulation method and device for millimeter wave package antenna based on glass through hole technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311783662.6A CN117454723B (en) | 2023-12-22 | 2023-12-22 | Simulation method and device for millimeter wave package antenna based on glass through hole technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117454723A true CN117454723A (en) | 2024-01-26 |
| CN117454723B CN117454723B (en) | 2024-04-09 |
Family
ID=89589540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311783662.6A Active CN117454723B (en) | 2023-12-22 | 2023-12-22 | Simulation method and device for millimeter wave package antenna based on glass through hole technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117454723B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080255812A1 (en) * | 2007-04-13 | 2008-10-16 | Christophe Hery | Texturing a Translucent Surface |
| US20140074440A1 (en) * | 2012-09-10 | 2014-03-13 | Fujitsu Limited | Antenna design method and apparatus |
| US20160148714A1 (en) * | 2013-07-12 | 2016-05-26 | The University Of Florida Research Foundation, Inc. | Low ohmic loss radial superlattice conductors |
| CN111541006A (en) * | 2020-05-21 | 2020-08-14 | 中国电子科技集团公司第十四研究所 | Glass-based patch antenna unit |
| CN113990412A (en) * | 2021-10-26 | 2022-01-28 | 西安交通大学 | Method, system and device for calibrating material deformation behavior and simulation platform |
-
2023
- 2023-12-22 CN CN202311783662.6A patent/CN117454723B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080255812A1 (en) * | 2007-04-13 | 2008-10-16 | Christophe Hery | Texturing a Translucent Surface |
| US20140074440A1 (en) * | 2012-09-10 | 2014-03-13 | Fujitsu Limited | Antenna design method and apparatus |
| US20160148714A1 (en) * | 2013-07-12 | 2016-05-26 | The University Of Florida Research Foundation, Inc. | Low ohmic loss radial superlattice conductors |
| CN111541006A (en) * | 2020-05-21 | 2020-08-14 | 中国电子科技集团公司第十四研究所 | Glass-based patch antenna unit |
| CN113990412A (en) * | 2021-10-26 | 2022-01-28 | 西安交通大学 | Method, system and device for calibrating material deformation behavior and simulation platform |
Non-Patent Citations (1)
| Title |
|---|
| 孟凡: "应用于毫米波相控阵天线一体化封装互连技术研究", 中国优秀硕士学位论文全文数据库 信息科技辑, no. 01, 15 January 2022 (2022-01-15), pages 136 - 110 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117454723B (en) | 2024-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chen et al. | A new efficient algorithm for the unconditionally stable 2-D WLP-FDTD method | |
| Wang et al. | Optimization of subgridding schemes for FDTD | |
| CN115577603B (en) | Simulation method and system for reducing unit matrix dimension and related equipment | |
| Ryu et al. | Multi-objective optimization of magnetic actuator design using adaptive weight determination scheme | |
| JP2020031366A (en) | Calculation method of radio wave shielding loss, calculation device, and program | |
| CN117454723B (en) | Simulation method and device for millimeter wave package antenna based on glass through hole technology | |
| Baumann et al. | Finite‐volume time‐domain (FVTD) modelling of a broadband double‐ridged horn antenna | |
| Warecka et al. | Propagation in the open cylindrical guide of arbitrary cross section with the use of field matching method | |
| CN115563840B (en) | Simulation method and system for reducing cascade error of unit matrix and related equipment | |
| CN109614732B (en) | Electromagnetic compatibility modeling method and device for object | |
| CN116151073A (en) | Integrated circuit simulation method and device based on mixed finite element method | |
| Kim et al. | Method of moments solution of volume integral equations using higher-order hierarchical Legendre basis functions | |
| CN108399274B (en) | Electromechanical comprehensive analysis method for conformal bearing antenna | |
| CN116306163A (en) | Finite element electromagnetic numerical method for port section transmission matching of waveguide design | |
| Li et al. | Isogeometric analysis with trimming technique for quadruple arch‐cut ridged circle waveguide | |
| Borries et al. | Improved multilevel fast multipole method for higher-order discretizations | |
| Torabi et al. | An efficient closed-form derivation of spatial Green's function for finite dielectric structures using characteristic Green's function-rational function fitting method | |
| CN109117537A (en) | A kind of optimization method and device of high-voltage commutation transformer end square ring arrangement | |
| CN105977119B (en) | A kind of grided electron gun virtual anode method for determining position | |
| Shao et al. | Efficient compact 2-D time-domain method with weighted Laguerre polynomials | |
| Dahl et al. | Efficient simulation of substrate-integrated waveguide antennas using a hybrid boundary element method | |
| CN106650094A (en) | Method for calculating tolerance of microwave device design parameters | |
| Kaufmann | The meshless radial point interpolation method for electromagnetics | |
| CN106294898B (en) | Complex point source solving method for accelerating analysis of electromagnetic scattering characteristics of medium target | |
| CN114580249B (en) | Multi-loop FDTD electromagnetic field simulation analysis method, system, equipment and medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |