CN117311518A - Control method for setting keyboard structure of notebook computer - Google Patents
Control method for setting keyboard structure of notebook computer Download PDFInfo
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- CN117311518A CN117311518A CN202311216670.2A CN202311216670A CN117311518A CN 117311518 A CN117311518 A CN 117311518A CN 202311216670 A CN202311216670 A CN 202311216670A CN 117311518 A CN117311518 A CN 117311518A
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 80
- 239000010935 stainless steel Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000002955 isolation Methods 0.000 claims abstract description 21
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 38
- 239000011888 foil Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 7
- 230000001960 triggered effect Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 31
- 239000010410 layer Substances 0.000 description 195
- 239000010408 film Substances 0.000 description 39
- 230000008901 benefit Effects 0.000 description 11
- 239000010409 thin film Substances 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
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- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229920006259 thermoplastic polyimide Polymers 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
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- 239000002356 single layer Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 229920001971 elastomer Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
- G06F3/0202—Constructional details or processes of manufacture of the input device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/705—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Push-Button Switches (AREA)
Abstract
A control method for setting a keyboard structure of a notebook computer comprises the following steps: bonding the substrate isolation insulating layer and the stainless steel substrate supporting layer into a sheet structure; performing roll-to-roll lamination operation on the sheet structure and the conductive circuit layer to enable the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer to be sequentially mutually connected to form an integrated sheet structure; conducting circuit processing operation is carried out on the conducting circuit layer in the integrated sheet structure; cutting the integrated sheet structure which completes the processing operation of the conductive circuit according to the preset printed circuit board graphic data of the notebook computer keyboard to obtain the printed circuit board of the single-chip notebook computer keyboard. The invention solves the problems of complex circuit layer structure, low energy efficiency ratio of the light source, troublesome assembly procedure, thicker total thickness of finished products, high material manufacturing cost, high processing cost and low quality consistency of the finished products in the scheme of the backlight keyboard of the notebook computer.
Description
Technical Field
The application relates to the field of notebook computer keyboards, in particular to a control method for setting a notebook computer keyboard structure.
Background
A keyboard is a type of instruction and data input device for operating the operation of the apparatus, and also refers to a set of function keys arranged through the system to operate a machine or apparatus. The keyboard is the most commonly used and main input device, and english letters, numbers, punctuation marks and the like can be input into a computer through the keyboard, so that commands, input data and the like can be sent to the computer. In the prior art, in order to improve portability and flexibility, tablet computers and notebook computers widely use independent keyboards as input devices.
The backlight keyboard of the notebook computer on the market at present comprises a keyboard functional structure part and a keyboard backlight part; wherein the thin film keyboard trigger circuit in the keyboard functional structure part is of a three-layer structure, which is respectively an upper thin film keyboard trigger matrix circuit, a middle thin film structure diaphragm and a lower thin film keyboard trigger matrix circuit; the backlight module in the keyboard backlight part is usually formed by taking the outermost edge as a light source, guiding the light path to the lower part of each key of the keyboard through the light guide film, and the light path distance is longer, so that the light source must use a high-brightness product to correspond to a low energy efficiency ratio.
Therefore, a new technical scheme for setting control of a notebook computer keyboard structure is needed currently, and the problems that the existing scheme of the notebook computer backlight keyboard is complex in circuit layer structure, low in light source energy efficiency ratio, troublesome in assembly process, thicker in total thickness of finished products, high in manufacturing material cost and processing cost, and low in quality consistency of the finished products are solved.
Disclosure of Invention
The application provides a control method for setting a notebook computer keyboard structure, which solves the problems of complex circuit layer structure, low energy efficiency ratio of a light source, troublesome assembly procedure, thicker total thickness of finished products, high manufacturing material cost, high processing cost and low quality consistency of the finished products in the scheme of the notebook computer backlight keyboard.
In order to solve the above problems, the present application provides a control method for setting a keyboard structure of a notebook computer, including: a sheet stainless steel metal is arranged as a stainless steel substrate supporting layer, and a sheet composite material with a melting point of more than 230 ℃ and a low dielectric constant is arranged as a substrate isolating insulating layer; setting a metal foil of a conductive material as a conductive circuit layer, wherein the thickness of the stainless steel substrate supporting layer is less than or equal to 50 mu m, the thickness of the substrate isolating insulating layer is 5 mu m to 50 mu m, and the thickness of the conductive circuit layer is 3 mu m to 10 mu m;
after the composite operation is carried out on the substrate isolation insulating layer and the stainless steel substrate supporting layer, the material curing operation is carried out on the substrate isolation insulating layer, so that the substrate isolation insulating layer and the stainless steel substrate supporting layer are combined into a sheet-shaped structure; performing roll-to-roll lamination operation on the sheet structure and the conductive circuit layer to enable the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer to be sequentially mutually connected to form an integrated sheet structure;
conducting circuit processing operation is carried out on the conducting circuit layer in the integrated sheet structure according to preset conducting circuit pattern data, and setting of a MiniLED control circuit and a key conducting circuit on the conducting circuit layer is completed;
cutting the integrated sheet structure which completes the processing operation of the conductive circuit according to the preset printed circuit board graphic data of the notebook computer keyboard to obtain the printed circuit board of the single-chip notebook computer keyboard.
Further, the method may further include: after the step of arranging the MiniLED control circuit and the key conduction circuit on the conductive circuit layer is completed, the method further comprises the following steps: according to the graphic data of the preset key cap key core structure installation hole site, the first key cap key core structure installation hole site is arranged on the integrated sheet structure through stamping operation.
Further, the method may further include: and (3) respectively arranging a plurality of MiniLED light emitting devices at preset positions on the MiniLED control circuit of the conductive circuit layer in an attaching and welding operation mode.
Further, the method may further include: after the step of obtaining the printed circuit board of the single-chip notebook computer keyboard, the method further comprises the following steps:
and covering a keyboard key conducting film circuit layer on the printed circuit board of the single-chip notebook computer keyboard, and covering the backlight keyboard appearance layer on the key conducting film circuit layer.
Further, the method may further include: setting two layers of substrate isolation insulating layers in the integrated sheet structure, and correspondingly setting two layers of conductive circuit layers; namely, a backlight keyboard appearance layer, a keyboard key conducting film circuit layer, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a plurality of MiniLED light emitting devices, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
Further, the method may further include: setting two layers of substrate isolation insulating layers in the integrated sheet structure, and correspondingly setting two layers of conductive circuit layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers in a separated mode; namely, a backlight keyboard appearance layer, a keyboard key conducting film circuit layer, a plurality of first MiniLED light emitting devices, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a plurality of second MiniLED light emitting devices, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
Further, the method may further include: a second key cap key core structure mounting hole site and a key conducting contact are arranged on the key conducting film circuit layer of the keyboard, wherein the key conducting contact is arranged outside the position of the key cap key core structure mounting hole site on the key conducting film circuit layer of the keyboard; the keyboard key conduction film circuit layer is connected with the conductive circuit layer in the integrated sheet structure, the conductive circuit layer is provided with a corresponding position of a first key cap key core structure installation hole site, a corresponding second key cap key core structure installation hole site is arranged on the keyboard key conduction film circuit layer, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
Further, the method may further include: the key conducting contacts are uniformly arranged around the position of the second key cap key core structure mounting hole on the key conducting film circuit layer of the keyboard.
Further, the method may further include: a third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, the backlight keyboard appearance layer covers the keyboard key conducting film circuit layer, a corresponding position of a second key cap key core structure installation hole site is arranged on the keyboard key conducting film circuit layer, the corresponding third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the second key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the shape of the key cap of the keyboard is matched with the shape of the installation hole site of the key core structure of the third key cap, and when the key cap of the keyboard is pressed, the key conduction contact on the key conduction film circuit layer of the keyboard key is triggered.
Further, the method may further include: the sheet-shaped insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant comprises: TPI, TPU or PA, wherein the metal foil of the conductive material comprises: copper foil, aluminum foil, tin foil or silver foil.
Through above-mentioned scheme, the application has following advantage:
structural integrity: the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer are sequentially mutually jointed to form the printed circuit board with an integrated structure, so that the printed circuit board can replace the supporting layer in a traditional notebook computer backlight keyboard, and the MiniLED circuit and part or all of the key conducting circuits are arranged on the same side or the front and back sides of the printed circuit board based on the stainless steel substrate in a mode of mixed single-layer circuit or multi-layer circuit.
Ease of processing: the assembly process of the backlight keyboard of the notebook computer is greatly reduced by arranging the printed circuit board with the stainless steel base material, and the alignment, the lamination and the assembly process between each functional layer and the structural layer of the original backlight keyboard of the notebook computer are omitted. And the MiniLED light-emitting device can be easily arranged on the circuit board of the stainless steel base material through the general attaching and welding procedure by virtue of the characteristic of extremely low temperature expansion and shrinkage of the stainless steel base material, so that the production difficulty is reduced, the product yield is improved, and the production cost is reduced.
Product stability: the existing notebook computer backlight keyboard is formed by combining a keyboard functional structure part and a keyboard backlight part in a glue film or glue mode, and a large number of semi-automatic or manual glue film or glue bonding procedures between original laminated structures are omitted through a printed circuit board with a stainless steel base material, so that the stability of the notebook computer backlight keyboard is greatly improved.
In summary, the application has the advantages of simplifying and efficient circuit design of the printed circuit board with structural integrity, avoiding processing simplicity of adaptation adjustment, reducing material types in the processing process of the printed circuit board, and the like, and the circuit board with the stainless steel substrate omits a large number of semi-automatic or manual adhesive film or glue bonding procedures between original laminated structures, so that the stability of the backlight keyboard of the notebook computer is greatly improved, meanwhile, the application scheme of a MiniLED light source is arranged under each key, the brightness requirement of a single MiniLED light source is reduced, on one hand, a common or even secondary LED can be used, and due to the fact that the backlight source is close to a target, the consumption of energy is greatly reduced by reducing the brightness, the purposes of reducing the product cost, improving the production efficiency and increasing the market competitiveness of the product are achieved, and the application has wide application prospect and economic benefit.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is a flow chart of a control method for setting a keyboard structure of a notebook computer according to the present application;
FIG. 2 is an exploded view of a keyboard of a notebook computer according to the control method of the present application;
FIG. 3 is an exploded view of one embodiment of a keyboard of a notebook computer according to the control method of the present application;
fig. 4 is a schematic exploded view of another embodiment of a keyboard of a notebook computer according to the control method of the present application.
Detailed Description
For the purposes, technical solutions and advantages of the present application, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
The main design thought of this application lies in: the printed circuit board using the stainless steel substrate as the circuit supporting layer has the following advantages: high temperature resistance: the printed circuit board with the stainless steel substrate as the circuit supporting layer has excellent high-temperature performance. When the circuit board operates in a high temperature environment, the support layer generally has a large thermal deformation, thereby affecting the performance and life of the circuit board. The deformation of the circuit board taking the stainless steel base material as the circuit supporting layer is extremely small due to high temperature, so that the circuit board can stably run for a long time in a high temperature environment; high strength: the printed circuit board with the stainless steel substrate as the circuit supporting layer has higher strength. When the circuit board is struck or vibrated in a mechanical environment, the ageing and fracture problems are easy to occur to part of the supporting layer, and the stainless steel base material is used as the circuit supporting layer, so that the circuit board can be effectively protected; long service life: because the stainless steel substrate is used as the printed circuit board of the circuit supporting layer, the service life of the circuit board is effectively prolonged. Meanwhile, the printed circuit board with the stainless steel substrate as the circuit supporting layer has corrosion resistance, so that the circuit board can be effectively prevented from being chemically corroded, and the service life of the circuit board is further prolonged; better heat dissipation performance: the stainless steel supporting layer has higher heat conductivity, so that heat can be better discharged from the circuit board, and the heat dissipation performance of the circuit board is improved. In conclusion, the printed circuit board with the stainless steel substrate as the circuit supporting layer has the advantages of high temperature resistance, high strength, long service life, good heat dissipation performance and the like. Under high temperature, mechanical and chemical environment, the stainless steel substrate is used as a circuit supporting layer to better protect the circuit board, so that the reliability and the service life of the circuit board are improved.
The stainless steel substrate material is used for compounding the stainless steel substrate supporting layer, the MiniLED control circuit and the key conducting circuit into a whole, the MiniLED control circuit and the key conducting circuit are integrated through the stainless steel substrate material, the partial or complete key conducting circuit can be arranged on a printed circuit board based on the stainless steel substrate, and the key function can be triggered by only setting a conductive material below a key cap structure after the key conducting circuit is integrated greatly. The thickness and the structure of the notebook computer backlight keyboard can be effectively adjusted, the production cost is reduced, the production efficiency is improved, and the market competitiveness of products is improved through the advantages of being simple and efficient in circuit design, avoiding adaptation adjustment, reducing the material types in the processing process of the printed circuit board and the like. In addition, the steps of adapting and adjusting are reduced, the production flow is simplified, the complexity of inventory management can be reduced by reducing the types of materials, the cost of material purchase and management is reduced, and the production efficiency is improved.
According to the application scheme, the application scheme of the MiniLED light source is ensured through each key, so that the brightness requirement of the single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and the backlight source is close to a target, so that the use of energy consumption can be greatly reduced by reducing the brightness. The MiniLED light-emitting device can be arranged on the same surface of the key conducting circuit to emit light from the front surface, or on the back surface of the key conducting circuit, and the light source is uniformly reflected to the front surface of the thin film keyboard triggering circuit by arranging the diffusion film and the reflection film.
The application is easy to implement by virtue of the extremely low temperature creep deformation characteristic of the stainless steel base material, so that the application of the MiniLED requiring high mounting precision is easy to implement, the production difficulty is reduced, and the production efficiency is improved.
In summary, the application has the advantages of simple and efficient circuit design of the printed circuit board with structural integrity, processing simplicity of avoiding adaptation adjustment, material variety reduction in the processing process of the printed circuit board, and the like, and the printed circuit board with the stainless steel substrate omits a large number of semi-automatic or manual adhesive film or glue bonding procedures between original laminated structures, so that the stability of the backlight keyboard of the notebook computer is greatly improved, meanwhile, an application scheme of a MiniLED light source is ensured through each key, the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary LED can be used, and due to the fact that the backlight source is close to a target, the consumption of energy can be greatly reduced by reducing the brightness, the purposes of reducing the product cost, improving the production efficiency and increasing the market competitiveness of the product are achieved, and the application has wide application prospect and economic benefit.
As shown in fig. 1, the control method for setting a keyboard structure of a notebook computer according to the present application includes:
step 100, setting a sheet stainless steel metal as a stainless steel substrate supporting layer, and setting a sheet composite material with a melting point of more than 230 ℃ and a low dielectric constant as a substrate isolating insulating layer; setting a metal foil of a conductive material as a conductive circuit layer, wherein the thickness of the stainless steel substrate supporting layer is less than or equal to 50 mu m, the thickness of the substrate isolating insulating layer is 5 mu m to 50 mu m, and the thickness of the conductive circuit layer is 3 mu m to 10 mu m;
step 110, after the substrate isolation insulating layer and the stainless steel substrate supporting layer are subjected to the composite operation, the substrate isolation insulating layer is subjected to the material curing operation, so that the substrate isolation insulating layer and the stainless steel substrate supporting layer are bonded into a sheet structure; performing roll-to-roll lamination operation on the sheet structure and the conductive circuit layer to enable the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer to be sequentially mutually connected to form an integrated sheet structure;
the step omits the semi-automatic or manual glue film or glue bonding procedure between a large number of original laminated structures by arranging the printed circuit board with the stainless steel base material, so that the stability of the backlight keyboard of the notebook computer is greatly improved
The step is realized through flexible production (roll-to-roll pressing operation), the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer are sequentially mutually jointed to form an integrated sheet structure, so that the total thickness of a finished product is reduced, and the method is beneficial to mass production and manufacture.
Step 120, conducting circuit processing operation is carried out on the conducting circuit layer in the integrated sheet structure according to preset conducting circuit pattern data, and setting of a MiniLED control circuit and a key conduction circuit on the conducting circuit layer is completed;
the stainless steel substrate material is used for compounding the stainless steel substrate supporting layer, the MiniLED control circuit and the key conducting circuit into a whole, and the stainless steel substrate material is used for integrating the MiniLED control circuit and the key conducting circuit, so that a part or the whole key conducting circuit can be arranged on a printed circuit board based on the stainless steel substrate, and the key function can be triggered and realized only by arranging a conductive material below a key cap structure after the key conducting circuit is integrated greatly. The thickness and the structure of the notebook computer backlight keyboard can be effectively adjusted, the production cost is reduced, the production efficiency is improved, and the market competitiveness of products is improved through the advantages of being simple and efficient in circuit design, avoiding adaptation adjustment, reducing the material types in the processing process of the printed circuit board and the like. In addition, the steps of adapting and adjusting are reduced, the production flow is simplified, the complexity of inventory management can be reduced by reducing the types of materials, the cost of material purchase and management is reduced, and the production efficiency is improved.
After the step of arranging the MiniLED control circuit and the key conduction circuit on the conductive circuit layer is completed, the method further comprises the following steps: according to the graphic data of the preset key cap key core structure installation hole site, the first key cap key core structure installation hole site is arranged on the integrated sheet structure through stamping operation.
According to the graphic data of the preset key cap key core structure installation hole site, the setting of the first key cap key core structure installation hole site on the integrated sheet structure is completed through stamping operation on the integrated sheet structure, so that the keyboard key cap is conveniently installed on the printed circuit board of the notebook computer keyboard.
And 130, cutting the integrated sheet structure with the conducting circuit processing operation according to the preset printed circuit board graphic data of the notebook computer keyboard to obtain the printed circuit board of the single-chip notebook computer keyboard.
The step can continuously produce a plurality of printed circuit boards of the notebook computer keyboard on a large scale, thereby improving the production efficiency and reducing the production cost.
After the step of obtaining the printed circuit board of the single-chip notebook computer keyboard, the method further comprises the following steps:
and (3) respectively arranging a plurality of MiniLED light emitting devices at preset positions on the MiniLED control circuit of the conductive circuit layer in an attaching and welding operation mode. Because the stainless steel base material has extremely low temperature expansion and contraction, the MiniLED light-emitting device can be easily arranged on the circuit board of the stainless steel base material through a general attaching and welding procedure, the production difficulty is reduced, the product yield is improved, and the production cost is reduced.
After the step of obtaining the printed circuit board of the single-chip notebook computer keyboard, the method further comprises the following steps:
and covering a keyboard key conducting film circuit layer on the printed circuit board of the single-chip notebook computer keyboard, and covering the backlight keyboard appearance layer on the key conducting film circuit layer.
As shown in fig. 2, a notebook computer keyboard according to a control method of the present application includes: the backlight keyboard appearance layer 10 and the printed circuit board 30, wherein the backlight keyboard appearance layer 10 is covered on the printed circuit board 30 through the keyboard key conducting film circuit layer 20 (i.e. the backlight keyboard appearance layer 20 is covered on the keyboard key conducting film circuit layer 30), the printed circuit board 30 is a printed circuit board with a multi-layer structure and is combined into a whole, and the backlight keyboard appearance layer comprises: the stainless steel substrate supporting layer 301, wherein the stainless steel substrate supporting layer 301, the substrate isolating insulating layer 302 and the conductive circuit layer 303 are sequentially mutually combined to form an integrated structure, a MiniLED control circuit and a key conducting circuit are arranged on the conductive circuit layer, and a plurality of MiniLED light emitting devices 40 are respectively arranged at preset positions on the MiniLED control circuit of the conductive circuit layer. A plurality of keyboard key caps 50 are disposed on the backlit keyboard appearance layer 10.
The stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer are sequentially mutually jointed to form an integrated structure, so that the integrated structure can replace the supporting layer in a traditional notebook computer backlight keyboard, and a MiniLED circuit and part or all of key conducting circuits are arranged on the same side or the front and back sides of a printed circuit board based on the stainless steel substrate in a mode of mixed single-layer circuits or multi-layer circuits; the semi-automatic or manual glue film setting or glue bonding process between a large number of original laminated structures is omitted, so that the stability of the backlight keyboard of the notebook computer is greatly improved; meanwhile, the thickness and the structure of the backlight keyboard of the notebook computer can be effectively adjusted, and the total thickness of a finished product is reduced.
The stainless steel substrate supporting layer can be a ferrite stainless steel foil with a heat dissipation coefficient higher than 16W or an austenite stainless steel foil with a heat dissipation coefficient higher than 16W. The ferrite stainless steel foil with the heat dissipation coefficient higher than 16W or the austenitic stainless steel foil with the heat dissipation coefficient higher than 16W is adopted, so that the printed circuit board based on the stainless steel metal has the characteristics of high heat dissipation and high heat load.
Wherein the thickness of the stainless steel substrate supporting layer may be set to be less than 50 μm; the thickness of the stainless steel substrate supporting layer is smaller than 50 mu m, so that the thickness of the printed circuit board can be reduced, and the trend of lightening and thinning requirements of a backlight keyboard of a notebook computer can be met.
In one embodiment of the application, the substrate isolation insulating layer in the integrated sheet structure is arranged as two layers, and correspondingly, the conductive circuit layer is also arranged as two layers; as shown in fig. 3, a thin film circuit layer 20, a first conductive circuit layer 303 and a first substrate isolation insulating layer 302 are disposed on the stainless steel substrate supporting layer 301 from far to near, and a plurality of MiniLED light emitting devices 40, a second conductive circuit layer 303 and a second substrate isolation insulating layer 302 are disposed on the stainless steel substrate supporting layer 301 from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit. According to the embodiment, the MiniLED control circuit and the key conducting circuit are separated on different conducting circuit layers through the two conducting circuit layers, the MiniLED light emitting device is arranged on the second conducting circuit layer (namely, the back surface of the key conducting circuit), the light source is uniformly reflected to the front surface of the thin film keyboard triggering circuit through the diffusion film and the reflection film, each key is ensured to have an application scheme of a MiniLED light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, a common or even secondary light emitting diode can be used, and the use of energy consumption can be greatly reduced by reducing the brightness due to the fact that the backlight source is close to a target; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
In another embodiment of the present application, the substrate isolating insulating layer in the integrated sheet structure is provided as two layers, and correspondingly, the conductive circuit layer is also provided as two layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers in a separated mode; as shown in fig. 4, a thin film circuit layer 20, a plurality of first MiniLED light emitting devices 40, a first conductive circuit layer 303 and a first substrate isolation insulating layer 302 are conducted from far to near on the stainless steel substrate supporting layer 301, and a plurality of second MiniLED light emitting devices 40, a second conductive circuit layer 303 and a second substrate isolation insulating layer 302 are conducted from far to near on the stainless steel substrate supporting layer 301; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device. In the embodiment, through the two conductive circuit layers, part of the MiniLED control circuit and the key conducting circuit are arranged on the first conductive circuit layer (namely, the MiniLED light-emitting device can be arranged on the same surface of the key conducting circuit to emit light on the front surface), and part of the MiniLED light-emitting device is arranged on the second conductive circuit layer (namely, the back surface of the key conducting circuit) to uniformly reflect the light source to the front surface of the thin film keyboard triggering circuit through the diffusion film and the reflection film; the arrangement can meet the requirement of users with high brightness of the notebook keyboard, each key ensures an application scheme of MiniLED light and reflection enhancement light source, so that the brightness requirement of a single MiniLED light source can be reduced, on one hand, common or even secondary LEDs can be used, and because the backlight source is close to a target, the energy consumption can be greatly reduced by reducing the brightness; meanwhile, the structure of the embodiment can realize the purpose of effectively adjusting the thickness and the structure of the backlight keyboard of the notebook computer.
Further comprises: a second key cap key core structure mounting hole site and a key conducting contact are arranged on the key conducting film circuit layer of the keyboard, wherein the key conducting contact is arranged outside the position of the key cap key core structure mounting hole site on the key conducting film circuit layer of the keyboard; the keyboard key conduction film circuit layer is connected with the conductive circuit layer in the integrated sheet structure, the conductive circuit layer is provided with a corresponding position of a first key cap key core structure installation hole site, a corresponding second key cap key core structure installation hole site is arranged on the keyboard key conduction film circuit layer, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer. The arrangement is convenient for installing the keyboard key cap on the printed circuit board of the notebook computer keyboard.
The key conducting contacts are uniformly arranged around the position of the second key cap key core structure mounting hole on the key conducting film circuit layer of the keyboard. The plurality of key conduction contacts are arranged, so that the key conduction contacts on the key conduction film circuit layer of the keyboard are triggered by the operation of pressing the key cap of the keyboard, and the operation is more convenient and sensitive.
The mode of correspondingly selecting the key-press conducting film circuit layer of the keyboard can be a contact conducting mode or an upper-layer and lower-layer film circuit superposition mode according to the design mode of the key-press conducting circuit to realize triggering. The setting can be more flexible, the method is suitable for various application scenes, and the use satisfaction of the user is improved.
Further comprises: a third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, the backlight keyboard appearance layer covers the keyboard key conducting film circuit layer, a corresponding position of a second key cap key core structure installation hole site is arranged on the keyboard key conducting film circuit layer, the corresponding third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the second key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the shape of the key cap of the keyboard is matched with the shape of the installation hole site of the key core structure of the third key cap, and when the key cap of the keyboard is pressed, the key conduction contact on the key conduction film circuit layer of the keyboard key is triggered to realize the key function. The key cap is convenient to install on the printed circuit board of the notebook computer keyboard, and key conduction contacts on the key conduction film circuit layer of the keyboard are triggered by pressing the key cap of the keyboard to realize key functions.
Further comprises: the substrate isolation insulating layer is a sheet-shaped insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant, and the sheet-shaped insulating composite material comprises: thermoplastic Polyimide (TPI), thermoplastic polyurethane rubber (TPU), polyamide (PA), the thickness of the substrate isolating insulation layer is 5 μm to 50 μm; the insulating composite material includes: TPI, TPU or PA are mature products, the cost is low, the insulating property is good, the temperature control of mass production is suitable, and the mass production and manufacturing are facilitated. Meanwhile, the thickness of the substrate isolation insulating layer can be effectively adjusted, the thickness and the structure of the backlight keyboard of the notebook computer can be adapted to flexible production, the total thickness of a finished product is reduced, and the large-scale production and manufacturing are facilitated.
The materials of the conductive circuit layer comprise: the thickness of the conductive circuit layer is 3-10 μm, which is a conductive metal material of copper foil, aluminum foil, tin foil or silver foil. The conductive metal material of copper foil, aluminum foil, tin foil or silver foil is mature product, and the cost is lower, and the thickness of the conductive circuit layer of this application sets up thickness and structure that can effectively adjust notebook computer keyboard in a poor light simultaneously, can be adapted to flexible production of reelable, has reduced the total thickness of finished product, does benefit to the mass production again and makes.
In this application, the preferred embodiments are only described with emphasis on being different from other preferred embodiments, and the preferred embodiments may be arbitrarily combined as long as they do not conflict, and the embodiments formed by the combination are also within the scope of the disclosure of the present specification, and in view of the brevity of the text, the embodiments formed by the combination will not be separately described herein.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
In this context, the preferred embodiments are only described with emphasis on being different from other preferred embodiments, and the embodiments formed by the combination may be arbitrarily combined as long as they do not collide, and the embodiments formed by the combination are also within the scope of the disclosure of the present specification, and in view of brevity, the embodiments formed by the combination will not be described separately.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.
Claims (10)
1. The control method for setting the keyboard structure of the notebook computer is characterized by comprising the following steps:
a sheet stainless steel metal is arranged as a stainless steel substrate supporting layer, and a sheet composite material with a melting point of more than 230 ℃ and a low dielectric constant is arranged as a substrate isolating insulating layer; setting a metal foil of a conductive material as a conductive circuit layer, wherein the thickness of the stainless steel substrate supporting layer is less than or equal to 50 mu m, the thickness of the substrate isolating insulating layer is 5 mu m to 50 mu m, and the thickness of the conductive circuit layer is 3 mu m to 10 mu m;
after the composite operation is carried out on the substrate isolation insulating layer and the stainless steel substrate supporting layer, the material curing operation is carried out on the substrate isolation insulating layer, so that the substrate isolation insulating layer and the stainless steel substrate supporting layer are combined into a sheet-shaped structure; performing roll-to-roll lamination operation on the sheet structure and the conductive circuit layer to enable the stainless steel substrate supporting layer, the substrate isolating insulating layer and the conductive circuit layer to be sequentially mutually connected to form an integrated sheet structure;
conducting circuit processing operation is carried out on the conducting circuit layer in the integrated sheet structure according to preset conducting circuit pattern data, and setting of a MiniLED control circuit and a key conducting circuit on the conducting circuit layer is completed;
cutting the integrated sheet structure which completes the processing operation of the conductive circuit according to the preset printed circuit board graphic data of the notebook computer keyboard to obtain the printed circuit board of the single-chip notebook computer keyboard.
2. The control method according to claim 1, wherein,
after the step of arranging the MiniLED control circuit and the key conduction circuit on the conductive circuit layer is completed, the method further comprises the following steps: according to the graphic data of the preset key cap key core structure installation hole site, the first key cap key core structure installation hole site is arranged on the integrated sheet structure through stamping operation.
3. The control method according to claim 2, wherein,
after the step of obtaining the printed circuit board of the single-chip notebook computer keyboard, the method further comprises the following steps:
and (3) respectively arranging a plurality of MiniLED light emitting devices at preset positions on the MiniLED control circuit of the conductive circuit layer in an attaching and welding operation mode.
4. The control method according to claim 3, wherein,
after the step of obtaining the printed circuit board of the single-chip notebook computer keyboard, the method further comprises the following steps:
and covering a keyboard key conducting film circuit layer on the printed circuit board of the single-chip notebook computer keyboard, and covering the backlight keyboard appearance layer on the key conducting film circuit layer.
5. The control method according to claim 4, wherein,
further comprises: setting two layers of substrate isolation insulating layers in the integrated sheet structure, and correspondingly setting two layers of conductive circuit layers; namely, a backlight keyboard appearance layer, a keyboard key conducting film circuit layer, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a plurality of MiniLED light emitting devices, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key conducting circuit, and the second conductive circuit layer is provided with a MiniLED control circuit.
6. The control method according to claim 4, wherein,
further comprises: setting two layers of substrate isolation insulating layers in the integrated sheet structure, and correspondingly setting two layers of conductive circuit layers; the MiniLED light-emitting devices are arranged on different conductive circuit layers in a separated mode; namely, a backlight keyboard appearance layer, a keyboard key conducting film circuit layer, a plurality of first MiniLED light emitting devices, a first conductive circuit layer and a first substrate isolating insulating layer are arranged above the stainless steel substrate supporting layer from far to near, and a plurality of second MiniLED light emitting devices, a second conductive circuit layer and a second substrate isolating insulating layer are arranged below the stainless steel substrate supporting layer from far to near; the first conductive circuit layer is provided with a key-on circuit and a MiniLED control circuit for controlling the first MiniLED light-emitting device, and the second conductive circuit layer is provided with a MiniLED control circuit for controlling the second MiniLED light-emitting device.
7. The control method according to claim 5 or 6, characterized in that,
further comprises: a second key cap key core structure mounting hole site and a key conducting contact are arranged on the key conducting film circuit layer of the keyboard, wherein the key conducting contact is arranged outside the position of the key cap key core structure mounting hole site on the key conducting film circuit layer of the keyboard; the keyboard key conduction film circuit layer is connected with the conductive circuit layer in the integrated sheet structure, the conductive circuit layer is provided with a corresponding position of a first key cap key core structure installation hole site, a corresponding second key cap key core structure installation hole site is arranged on the keyboard key conduction film circuit layer, and a straight line formed by connecting the center of the second key cap key core structure installation hole site and the center of the first key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer.
8. The control method according to claim 7, wherein,
further comprises: the key conducting contacts are uniformly arranged around the position of the second key cap key core structure mounting hole on the key conducting film circuit layer of the keyboard.
9. The control method according to claim 8, wherein,
further comprises: a third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, the backlight keyboard appearance layer covers the keyboard key conducting film circuit layer, a corresponding position of a second key cap key core structure installation hole site is arranged on the keyboard key conducting film circuit layer, the corresponding third key cap key core structure installation hole site is arranged on the backlight keyboard appearance layer, and a straight line formed by connecting the center of the third key cap key core structure installation hole site and the center of the second key cap key core structure installation hole site is perpendicular to the stainless steel substrate supporting layer; the shape of the key cap of the keyboard is matched with the shape of the installation hole site of the key core structure of the third key cap, and when the key cap of the keyboard is pressed, the key conduction contact on the key conduction film circuit layer of the keyboard key is triggered.
10. The control method according to claim 9, wherein,
further comprises: the sheet-shaped insulating composite material with the temperature resistance of more than 230 ℃ and low dielectric constant comprises: TPI, TPU or PA, wherein the metal foil of the conductive material comprises: copper foil, aluminum foil, tin foil or silver foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311216670.2A CN117311518A (en) | 2023-09-19 | 2023-09-19 | Control method for setting keyboard structure of notebook computer |
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| CN202311216670.2A CN117311518A (en) | 2023-09-19 | 2023-09-19 | Control method for setting keyboard structure of notebook computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524769A (en) * | 2024-01-03 | 2024-02-06 | 苏州天立达精密科技股份有限公司 | Support module for double-sided circuit board luminous keyboard |
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2023
- 2023-09-19 CN CN202311216670.2A patent/CN117311518A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524769A (en) * | 2024-01-03 | 2024-02-06 | 苏州天立达精密科技股份有限公司 | Support module for double-sided circuit board luminous keyboard |
| CN117524769B (en) * | 2024-01-03 | 2024-04-05 | 苏州天立达精密科技股份有限公司 | Support module for double-sided circuit board luminous keyboard |
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