CN117240327B

CN117240327B - Non-contact connector

Info

Publication number: CN117240327B
Application number: CN202311498199.0A
Authority: CN
Inventors: 袁毅
Original assignee: Shanghai Archiwave Electronic Technology Co ltd
Current assignee: Shanghai Archiwave Electronic Technology Co ltd
Priority date: 2023-11-13
Filing date: 2023-11-13
Publication date: 2024-01-30
Anticipated expiration: 2043-11-13
Also published as: CN117240327A

Abstract

The invention relates to a contactless connector comprising: the antenna comprises a transmitting circuit, a receiving circuit and a double circularly polarized double-frequency antenna; the transmitting circuit is connected with the double circular polarization double-frequency antenna and is used for transmitting the radio frequency signals through the double circular polarization double-frequency antenna; the receiving circuit is connected with the double circular polarization double-frequency antenna and is used for receiving radio frequency signals received through the double circular polarization double-frequency antenna; the dual circularly polarized dual frequency antenna comprises an inner block antenna and an outer Zhou Tianxian; the inner block antenna is used for receiving and transmitting a first radio frequency signal, the outer peripheral antenna is used for receiving and transmitting a second radio frequency signal, the frequencies of the first radio frequency signal and the second radio frequency signal are different, and the frequency is greater than or equal to 45GHz; the inner block antenna is provided with a cross-shaped slot and is connected with a first feeder line forming an angle of 45 degrees or 135 degrees with one edge of the cross-shaped slot; the peripheral antenna is connected with a second feeder line and a third feeder line which are designed in a crisscross manner.

Description

Non-contact connector

Technical Field

The invention relates to the technical field of wireless communication, in particular to a non-contact connector.

Background

Connectors are known as connectors, plugs and sockets. Common connectors include charging connectors and data connectors, typically with metal contacts as a medium to transmit power or signals. Such as a new energy automobile charging connector, a vehicle-mounted Ethernet connector, USB data of a notebook computer and a mobile phone, a charging two-in-one connector and the like. With the development of electromagnetic fields and wireless technology, wireless charging connectors and wireless data connectors have emerged. The wireless charging connector does not need to be connected with the device by force during charging, so that the safety, the waterproofness and the dust resistance of the device connector can be improved, the device connector also has the global standard specification, and the device connector can be conveniently provided for the convenience of use of all electric equipment, and the device connector is accelerated in popularization in all fields. The wireless data connector also has such advantages in terms of security, waterproofing, dust-proofing, and convenience. However, the current wireless data connector cannot meet the following requirements: 1) ISM (unlicensed band) of 57GHz-64GHz is used as carrier, 2) short spacing is provided between connectors, 3) 360 DEG rotation of connectors does not affect reliable connection, 4) single chip implementation of low cost connectors.

Disclosure of Invention

The invention aims to provide a non-contact connector, which solves the technical problem of improving the isolation degree of transmitting and receiving electromagnetic waves between the non-contact connectors.

Embodiments of the present invention disclose a contactless connector comprising: the antenna comprises a transmitting circuit, a receiving circuit and a double circularly polarized double-frequency antenna;

the transmitting circuit is connected with the double-circular polarization double-frequency antenna and is used for transmitting radio frequency signals through the double-circular polarization double-frequency antenna;

the receiving circuit is connected with the double-circular polarization double-frequency antenna and is used for receiving radio frequency signals received through the double-circular polarization double-frequency antenna;

the dual circularly polarized dual frequency antenna comprises an inner block antenna and an outer Zhou Tianxian; the inner block antenna is used for receiving and transmitting a first radio frequency signal, the outer peripheral antenna is used for receiving and transmitting a second radio frequency signal, the frequencies of the first radio frequency signal and the second radio frequency signal are different, and the frequency is greater than or equal to 45GHz;

the inner block antenna is provided with a cross-shaped slot and is connected with a first feeder line forming an angle of 45 degrees or 135 degrees with one edge of the cross-shaped slot;

and the peripheral antenna is connected with a second feeder line and a third feeder line which are designed in a crisscross manner.

The non-contact connector of the embodiment of the invention has the frequency of 57GHz-64GHz of the first radio frequency signal and the second radio frequency signal.

According to the non-contact connector of the embodiment of the invention, the first radio frequency signal is high frequency of a 60GHz frequency band, and the second radio frequency signal is low frequency of the 60GHz frequency band.

According to the non-contact connector disclosed by the embodiment of the invention, the high frequency of the 60GHz frequency band is 62.5GHz, and the low frequency of the 60GHz frequency band is 59.5GHz.

The non-contact connector of the embodiment of the invention, the inner block antenna comprises an inner block antenna driving layer and an inner block antenna parasitic layer, and the outer peripheral antenna comprises an outer peripheral antenna driving layer and an outer peripheral antenna parasitic layer; the inner block antenna parasitic layer, the outer peripheral antenna parasitic layer, the inner block antenna driving layer and the outer peripheral antenna driving layer are stacked from top to bottom in sequence.

The contactless connector according to an embodiment of the present invention, the transmitting circuit and the receiving circuit each include: a filter having a Q value of 100 or less.

The contactless connector of the embodiment of the invention is a multi-order filter formed by combining a plurality of dielectric filters.

In the non-contact connector according to the embodiment of the invention, the inner block antenna adopts back feed, and the outer peripheral antenna adopts orthogonal side feed.

The package of the dual circularly polarized dual-frequency antenna comprises a first metal layer, a second metal layer, a third metal layer, a first dielectric layer between the first metal layer and the second metal layer, and a second dielectric layer between the second metal layer and the third metal layer; the inner block antenna and the outer peripheral antenna are located in the first metal layer, the first power feed line, the second power feed line, and the third power feed line are located in one of the second metal layer and the third metal layer, and a ground line is located in the other of the second metal layer and the third metal layer.

The contactless connector of the embodiment of the present invention, the transmitting circuit includes: the device comprises an input port, a carrier feed source, a single-pole single-throw switch, a power amplifier and a transmitting filter;

one end of the single-pole single-throw switch is connected with the carrier feed source and the input port, the other end of the single-pole single-throw switch is connected with one end of the power amplifier, the other end of the power amplifier is connected with one end of the transmitting filter, and the other end of the transmitting filter is connected with one of the inner block antenna and the outer peripheral antenna.

The contactless connector of the embodiment of the present invention, the receiving circuit includes: the device comprises a receiving filter, a low noise amplifier, a demodulator, a single-ended-differential converter, a baseband limiting amplifier and an output port;

one end of the receiving filter is connected with the other one of the inner block antenna and the outer peripheral antenna, the other end of the receiving filter is connected with one end of the low noise amplifier, the other end of the low noise amplifier is connected with one end of the demodulator, the other end of the demodulator is connected with one end of the single-ended differential converter, the other end of the single-ended differential converter is connected with one end of the baseband limiting amplifier, and the baseband limiting amplifier biases signal feedback to the single-ended differential converter, and the other end of the baseband limiting amplifier is connected with the output port.

The non-contact connector of the embodiment of the invention has a connection distance of 0.5 cm-5 cm.

Compared with the prior art, the embodiment of the invention has the main differences and effects that:

in the present invention, a dual circularly polarized dual frequency antenna receives or transmits a circularly polarized electromagnetic wave (radio frequency signal), the transmitted circularly polarized electromagnetic wave being orthogonal to the received circularly polarized electromagnetic wave. The actual isolation between the receiving and transmitting channels is improved (to 20-30 dB).

In the present invention, the dual circularly polarized dual frequency antenna includes an inner block antenna and an outer Zhou Tianxian; the inner block antenna is used for receiving and transmitting a first radio frequency signal, the outer peripheral antenna is used for receiving and transmitting a second radio frequency signal, the frequencies of the first radio frequency signal and the second radio frequency signal are different, and the frequency is greater than or equal to 45GHz. The antenna supports double frequencies in a high frequency band, so that different frequencies can be used by the receiving and transmitting channels, and the isolation of the receiving and transmitting channels is improved.

In the invention, the inner block antenna is provided with a cross-shaped slot, and is connected with a first feeder line which forms an angle of 45 degrees or 135 degrees with one edge of the cross-shaped slot; the peripheral antenna is connected with a second feeder line and a third feeder line which are designed in a crisscross manner. The antenna can transmit and receive circularly polarized electromagnetic waves (radio frequency signals), so that the polarization orthogonality of the transmitted and received electromagnetic waves is realized, and the transmitted and received electromagnetic waves are isolated from each other; and because circular polarization is realized by a feed mode, the physical structure (feed structure) between the antennas used in pairs is geometrically symmetrical, and the 360-degree rotation connection point does not influence the air interface connection performance and polarization relation of the system.

In the invention, the inner block antenna comprises an inner block antenna driving layer and an inner block antenna parasitic layer, and the outer peripheral antenna comprises an outer peripheral antenna driving layer and an outer peripheral antenna parasitic layer; the inner block antenna parasitic layer, the outer peripheral antenna parasitic layer, the inner block antenna driving layer and the outer peripheral antenna driving layer are stacked from top to bottom in sequence. The performance and bandwidth of the antenna are improved.

In the invention, the first radio frequency signal is high frequency of a 60GHz frequency band, and the second radio frequency signal is low frequency of the 60GHz frequency band. The high frequency of the 60GHz band is 62.5GHz, and the low frequency of the 60GHz band is 59.5GHz. Different frequencies can be used for the receiving and transmitting channels, and the isolation degree of the receiving and transmitting channels is improved (20 dB improvement).

In the present invention, the transmitting circuit and the receiving circuit respectively include: a filter having a Q value of 100 or less. The antenna supports circular polarization and double frequency, has realized the isolation of higher receiving and transmitting channel, adopts the filter of lower Q value in the receiving and transmitting circuit to realize the high isolation of receiving and transmitting channel. In the invention, the filter is a multi-order filter formed by combining a plurality of dielectric filters, and the chip packaging volume can be saved by adopting the filter with lower Q value. And the filter improves the isolation of the transmit-receive channel (15 dB improvement).

In the present invention, the contactless connector can take ISM (unlicensed band) of 57GHz-64GHz as a carrier, a short space (e.g., 0.5 cm-5 cm) between connectors, 360 ° rotation of connectors does not affect reliable connection, and is implemented in a low-cost single chip.

Drawings

Fig. 1 shows a contactless connector according to an embodiment of the present application.

Fig. 2 shows a dual circularly polarized dual frequency antenna according to an embodiment of the present application.

Fig. 3A shows one way of feeding an inner block antenna according to an embodiment of the present application.

Fig. 3B illustrates another feeding pattern of an inner block antenna according to an embodiment of the present application.

Fig. 4A shows one feeding pattern of the peripheral antenna according to an embodiment of the present application.

Fig. 4B shows another feeding pattern of the peripheral antenna according to an embodiment of the present application.

Fig. 5 illustrates a side view of a contactless connector implemented in a single packaged chip manner according to an embodiment of the present application.

Fig. 6 is a side view of an antenna package according to an embodiment of the present application.

Fig. 7 shows a top view of a chip according to an embodiment of the present application.

Fig. 8 illustrates a stacked arrangement of dual circularly polarized dual frequency antennas according to an embodiment of the present application.

Fig. 9 shows a side view of a contactless connector implemented in a single packaged chip manner according to an embodiment of the present application.

Fig. 10 illustrates a contactless connector used in pairs according to an embodiment of the present application.

Fig. 11 shows a top view of a chip used in pairs according to an embodiment of the present application.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

If the wireless connector is to achieve simultaneous full duplex and the SNR (signal to noise ratio) of the demodulated signal needs to meet certain requirements (e.g., 12 dB), then there is also a requirement for transmit-receive isolation (e.g., path loss is 41.98 dB, then the total isolation requirement is 41.98 dB +12 dB =53.98 dB). Existing wireless connector simultaneous full duplex implementations typically include: a simultaneous full duplex implementation of spatial isolation, a simultaneous full duplex implementation of a circulator, a simultaneous full duplex implementation of a frequency selective combiner.

If a spatial isolation approach is used, the transmit-receive isolation of 53.98dB is achieved, the spacing of the spatial isolation needs to be greater than the spacing of the antennas minus the gain difference in the antenna radiation direction (antenna vertical and horizontal direction angular gain), and in the case of using, for example, a horn antenna, the spacing of the spatial isolation will be greater. This approach results in high cost, four antennas and four chips, high power consumption, and "tie points" that cannot be rotated 360 °.

If the circulator mode is adopted, the simultaneous full duplex can be realized by a single chip, namely, the coupler or the circulator is used for realizing the isolation of the receiving and transmitting ports, and the antenna function is not influenced. However, since a magnetic material (ferrite microwave circulators) is required, it is considered that if an ISM of 57GHz to 64GHz (frequency band requiring no license) is desired as a carrier, the existing magnetic material is expensive and bulky in the 60GHz frequency band, and thus cannot be integrated in a chip. If implemented using an active circulator, signal bandwidth is limited and there is no practical use at 60 GHz.

If the frequency selective combiner is adopted, full duplex can be realized by a single chip, and the receiving and transmitting port isolation can also be realized by the frequency selective combiner. But frequency selective combiners require isolation greater than 54dB, the Q of the device needs to be greater than 150. And the filter structure is a multi-order filtering combination, resulting in a large filter. The Q value provided by the chip in the 60GHz frequency band is about 10, and the packaging area of the chip also limits the mode of the multi-order filter.

In view of this problem, an embodiment of the present application provides a contactless connector, as shown in fig. 1, a contactless connector 100 including: a transmitting circuit 101, a receiving circuit 102 and a dual circularly polarized dual-band antenna 103. The transmitting circuit 101 is connected with the dual circularly polarized dual-frequency antenna 103 and is used for transmitting radio frequency signals through the dual circularly polarized dual-frequency antenna 103; the receiving circuit 102 is connected to the dual circularly polarized dual frequency antenna 103, and is configured to receive the radio frequency signal received by the dual circularly polarized dual frequency antenna 103.

According to some embodiments of the present application, the transmitting circuit 101 (transmitter) includes: SPST (Single Pole Single Throw), single pole single throw switch) 104, carrier feed 105, input port 106, PA (Power Amplifier) 107, transmit filter 108; one end of the SPST 104 is connected with the carrier feed 105 and the input port, the other end of the SPST 104 is connected with one end of the power amplifier PA 107, the other end of the PA 107 is connected with one end of the transmitting filter 108, and the other end of the transmitting filter 108 is connected with the double circular polarization double-frequency antenna 103.

As an example, in the transmitting circuit 101, the carrier feed 105 and the input port 106 are connected to the PA 107 through the SPST 104, the PA 107 outputs a signal to the transmitting filter 108, and the transmitting filter 108 outputs a signal to the dual circularly polarized dual frequency antenna 103.

According to some embodiments of the present application, the receiving circuit 102 (receiver) includes: a reception filter 109, an LNA (Low Noise Amplifier ) 110, a demodulator 111, a SE-Diff (single end to differential end, single-ended-to-differential converter) 112, a BBA (Baseband Amplifier, baseband limiting amplifier) 113, an output port 114; one end of the reception filter 109 is connected to the dual circularly polarized dual frequency antenna 103, the other end of the reception filter 109 is connected to one end of the LNA 110, the other end of the LNA 110 is connected to one end of the demodulator 111, the other end of the demodulator 111 is connected to one end of the SE-Diff 112, the other end of the SE-Diff 112 is connected to one end of the BBA 113, and the BBA 113 biases signal feedback to the SE-Diff 112, and the other end of the BBA 113 is connected to the output port 114.

The reception circuit 102 receives a signal from the dual circularly polarized dual band antenna 103 through the reception filter 109 and outputs the filtered signal to the LNA 110, and the LNA 110 outputs the signal to the demodulator 111, SE-Diff 112, BBA 113 and sequentially processes the signal to the output port 114.

As shown in fig. 2, the dual circularly polarized dual frequency antenna 103 includes an inner block antenna 201 and an outer Zhou Tianxian 202; the inner block antenna 201 is used for receiving and transmitting a first radio frequency signal, and may be a patch (patch) block antenna, and the outer block antenna 202 is used for receiving and transmitting a second radio frequency signal, and may be a patch square loop antenna. The first radio frequency signal and the second radio frequency signal have different frequencies, and the frequency is more than or equal to 45GHz.

In the application, the receiving and transmitting radio frequency may take ISM of 57GHz-64GHz as a carrier, and according to some embodiments of the application, the first radio frequency signal is a high frequency of 60GHz band, for example, 62.5GHz, and when transmitting, the first radio frequency signal is fed into a carrier signal of 62.5GHz through a carrier feed source 105; the second radio frequency signal is a low frequency of 60GHz band, for example 59.5GHz, and when transmitted, is fed into a 59.5GHz carrier signal via carrier feed 105.

The layout supports dual frequency bands, the low frequency adopts a square ring patch structure, the high frequency adopts a block patch structure, and the isolation degree is increased. The dual circularly polarized dual band antenna 103 receives or transmits circularly polarized electromagnetic waves. The circular polarization has LHCP (Left Hand Circular Polarized Antenna) left-hand circular polarization and RHCP (Right Hand Circular Polarized Antenna) right-hand circular polarization. In the antenna theory, electromagnetic waves of LHCP and electromagnetic waves of RHCP have polarization orthogonality and are isolated from each other. If the transmitting end antenna transmits with LHCP between the paired circularly polarized antennas, the electromagnetic propagation direction is opposite for the receiving end antenna due to the mirror image relationship of the transmitting end antenna and the receiving end antenna, and RHCP is used for receiving. Similarly, if the transmitting end antenna transmits by RHCP, the receiving end antenna receives by LHCP. The antenna supports dual frequency bands, and the isolation of a receiving and transmitting channel is improved.

As shown in fig. 3A and 3B, the inner block antenna 201 has a cross-shaped slot 301. In order to achieve various purposes, a patch antenna may be provided with a slot, for example, a T-shaped slot or a Y-shaped slot for achieving dual frequencies, a U-shaped slot for expanding bandwidth, and the like. In this application, a cross slot 301 is formed in the inner antenna 201 to achieve circular polarization.

The x-axis and y-axis are identified in fig. 3A and 3B, and cross-shaped slit 301 includes a side 301a along the x-axis and a side 301B along the y-axis. In order to be able to transmit and receive circularly polarized electromagnetic waves, the inner block antenna 201 is connected to a feeder line 302 (first feeder line) at 45 degrees or 135 degrees to the side 301a as a feeder arm, and the feeder line 302 is connected to a feeder line 303 which is externally connected.

According to some embodiments of the present application, the inner mass antenna 201 employs a feed back of a cross slot. For example, as shown in fig. 3A, a feeder line 302 is connected to the cross-shaped slot 301, and the feeder line 302 makes an angle of 45 degrees with the side 301a of the cross-shaped slot 301 as a feeder arm. Alternatively, as shown in fig. 3B, the power feeding line 302 is connected to the cross-shaped slit 301, and the power feeding line 302 makes an angle of 135 degrees with the side 301a of the cross-shaped slit 301 as a power feeding arm. The angle of the feed arm will determine whether the antenna is LHCP or RHCP, for example, if the antenna is LHCP when the feed arm is at 45 degrees to side 301a (fig. 3A) and RHCP when the feed arm is at 135 degrees to side 301a (fig. 3B); accordingly, if the antenna is LHCP when the feed arm is at 135 degrees to side 301a (fig. 3B), then the antenna is RHCP when the feed arm is at 45 degrees to side 301a (fig. 3A).

As shown in fig. 4A and 4B, the outer peripheral antenna 202 is connected to a feeder line 401 (second feeder line) and a feeder line 402 (third feeder line) which are designed to cross. According to some embodiments of the present application, the outer Zhou Tianxian 202 employs an orthogonal, side-fed feed, as shown in fig. 4A and 4B, the outer peripheral antenna 202 having a feed line 401 and a feed line 402. The feed line 401 and the feed line 402 may be at a positive 90 ° angle from a clockwise direction, for example, as shown in fig. 4A. The feeder 401 and the feeder 402 may also be at minus 90 °, for example, as shown in fig. 4B. The angle between the two feed lines determines whether the antenna is LHCP or RHCP. For example, one possible case is: the antenna is LHCP when there is positive 90 ° (fig. 4A) between feeder 401 and feeder 402, and RHCP when there is negative 90 ° (fig. 4B) between feeder 401 and feeder 402. Another possible case is: the antenna is LHCP when there is negative 90 ° (fig. 4B) between feeder 401 and feeder 402, and RHCP when there is positive 90 ° (fig. 4A) between feeder 401 and feeder 402.

In particular implementations, the dual circularly polarized dual frequency antenna 103 may further employ a microstrip patch antenna design, and the low profile facilitates the integration of an AIP (Antenna in Package, package antenna) on a chip package. In practical applications, some packaging structures only allow for fewer metal layers, for example, in the case of only three metal layers, since other structures need to occupy a certain metal layer, for example, the ground occupies one metal layer, and the feed line occupies one metal layer, leaving only one metal layer for the antenna. The single-layer microstrip patch antenna design can be conveniently integrated into such a package. Fig. 5 shows a side view of a contactless connector implemented in the form of a single packaged chip. The x-axis and z-axis are identified in the figure, with the positive x-axis direction being the rightward direction and the positive z-axis direction being the upward direction. The contactless connector 100 is implemented in a single packaged chip 500. The height of the entire chip 500 may be 2.1mm. The chip 500 includes a substrate 501; the upper right side of the substrate 501 includes a ground 502 as a common ground for connection of various elements in the chip 500; the bottom of the substrate 501 is provided with one or more solder balls 503 for connection to other devices. A molding compound 504 is disposed on the substrate 501.

The molding compound 504 encapsulates a power source 505, a radio frequency IC (Integrated Circuit Chip ) 506, and two Band Pass Filters (BPFs) 507 disposed from left to right above the left side of the substrate 501. The power source 505 and the radio frequency IC 506 are connected by wire bonds 508, and the radio frequency IC 506 and the band pass filter 507 are connected by wire bonds 509. The radio frequency IC 506 includes a transmitting terminal TX (not shown in fig. 5) and a receiving terminal RX (not shown in fig. 5), and the band-pass filter 507 includes a transmitting filter (not shown in fig. 5, corresponding to the transmitting filter 108) and a receiving filter (not shown in fig. 5, corresponding to the receiving filter 109). The transmitting terminal TX of the radio frequency IC 506 and the transmitting filter in the band-pass filter 507 constitute the transmitting circuit 101, and the receiving terminal RX of the radio frequency IC 506 and the receiving terminal in the band-pass filter 507 constitute the receiving circuit 102.

The molding compound 504 also encapsulates the antenna package 510 located at the upper right of the bandpass filter 507. The antenna package 510 includes an antenna carrier 511 and three metal layers. The antenna carrier 510 may be made of glass, low temperature co-fired Ceramic (LTCC), or the like. As shown in fig. 5, a metal layer (third metal layer) is underlying in the antenna carrier 511, forming a ground 512; one metal layer (second metal layer) is in the middle layer in the antenna carrier 511, forming a plurality of power feeding lines 513 (microstrip lines); on top of the antenna carrier 511 is a metal layer (first metal layer) forming the antenna 103, wherein the inner block antenna 201 and the outer Zhou Tianxian 202 of the antenna 103 are located as patch antennas in the same metal layer. Ground 512 may be connected to ground 502 by a connection 514, but wherein a radiation field is formed between ground 512 and antenna 103 so that antenna 103 may radiate. The feeder 513 has one end connected to the lower band-pass filter 507 and the other end connected to the upper antenna 103.

Because the ground needs to be proximate to the antenna, in some cases the antenna package may have another configuration, the ground being disposed between the antenna and the feed line, such that the ground may have a through hole for the feed line to pass through to connect to the antenna.

In the invention, the non-contact connector is a chip; the chip comprises a power supply, a radio frequency IC, a band-pass filter and a double circularly polarized double-frequency antenna which are sequentially arranged in the plane direction. The arrangement of the elements in the plane direction of the chip saves the thickness of the chip, so that the chip can be formed in one wafer.

As fig. 6 shows another configuration of an antenna package, an antenna package 600 comprises an antenna carrier 601 and three metal layers. In the antenna package 600, a metal layer (first metal layer) on top of an antenna carrier 601 forms an antenna 602, the antenna 602 being a patch antenna including an inner block antenna and an outer peripheral antenna; unlike the antenna package 510, the metal layer (second metal layer) of the intermediate layer in the antenna carrier 601 forms the ground 603; the underlying metal layer (third metal layer) in the antenna carrier 601 forms a feed line 604, which feed line 604 may be a microstrip line; the ground 603 has a through hole for the feed line 604 to pass up and down to be connected to the antenna 602. Also shown in fig. 6 is a slot 605 of the antenna 602, which slot 605 may be a cross-shaped slot, the same or similar to the cross-shaped slot 301 shown in fig. 3A and 3B, to achieve circular polarization.

In the antenna package, the antenna carrier has dielectric layers between different metal layers, for example, as shown in fig. 6, a dielectric layer 606 (first dielectric layer) between the metal layer where the antenna 602 is located and the metal layer where the ground 603 is located, and a dielectric layer 607 (second dielectric layer) between the metal layer where the ground 603 is located and the metal layer where the feeder 604 is located. Dielectric layer 606 and dielectric layer 607 have dielectric constants.

A top view of a chip 500 implementing the contactless connector 100 in fig. 5 is shown in fig. 7: chip 500 includes a digital intermediate frequency 701, a power source 505, a radio frequency IC 506, an inner block antenna 201 and an outer Zhou Tianxian 202 as patch antennas, on an antenna carrier 511. The digital intermediate frequency 701 is not shown in the side view of fig. 5 due to being obscured by the power source 505. The inner block antenna 201 has a feed point 703 introduced by a feed line 702, the feed line 702 being connected to an HBPF (high band pass filter) 704. In the figure, the HBPF 704 is connected to the receiving terminal RX (in the receiving circuit 102) as an example, and the HBPF 704 functions as the receiving filter 109 in the receiving circuit 102. In other embodiments, HBPF 704 may also be connected to transmit side TX (in transmit circuit 101) to act as transmit filter 108. The peripheral antenna 202 has a feed point 706 introduced by a feed line 705 and a feed point 708 introduced by a feed line 707. The plurality of feeder lines 513 in the side view of fig. 5 includes the feeder line 702, the feeder line 705, and the feeder line 707 described above. Feeder 705 and feeder 707 are connected to LBPF (low band pass filter) 709. The LBPF 709 is shown as being connected to the transmitting terminal TX (in the transmitting circuit 101), where the LBPF 709 acts as a transmit filter 108 in the transmitting circuit 101. In other embodiments, LBPF 709 may also be connected to a receiving end RX (in receiving circuit 102) to function as a receiving filter 109. The two bandpass filters 507 in the side view of fig. 5 include the HBPF 704 and LBPF 709 described above, and what is visible in the side view of fig. 5 is LBPF 709, with HBPF 704 obscured from view by LBPF 709.

In practice, some packages have multiple metal layers and are high enough to be distributed to the antennas, and in this case, the dual circularly polarized dual band antenna 103 may be stacked to achieve higher performance and bandwidth.

For example, as shown in fig. 8, the inner block antenna 201 includes an inner block antenna driving layer (patch) 801 and an inner block antenna parasitic layer (patch) 802, and the outer peripheral antenna 202 includes an outer peripheral antenna driving layer (patch) 803 and an outer peripheral antenna parasitic layer (patch) 804; the inner block antenna parasitic layer 802, the outer peripheral antenna parasitic layer 804, the inner block antenna driving layer 801, and the outer peripheral antenna driving layer 803 are stacked in this order from top to bottom, and may be provided as patches in different metal layers of the package according to actual needs. Through the stacked structure, the parasitic patch is additionally introduced on the basis of the single-layer patch antenna (the driving patch), resonance points are increased by the parasitic patch, and the resonance points of the parasitic patch are positioned near the resonance frequency of the original single-layer patch antenna (the driving patch) in a similar staggered tuning mode, so that the working frequency band of the antenna is widened.

Fig. 9 shows a side view of a contactless connector implemented in the form of a single packaged chip, and fig. 9 shows that contactless connector 100 is implemented in the form of a single packaged chip 900. The chip 900 comprises a redistribution layer RDL 902 covered with a molding compound 901, a radio frequency IC 903 and a power source 904, wherein the radio frequency IC 903 and the power source 904 are sequentially arranged below the RDL 902 from left to right and are connected through the RDL 902. Chip 900 also includes a PCB 905 located above RDL 902. The height of the PCB 905 may be 2.1mm and various components therein may be encapsulated using a molding compound. An LBPF (low band pass filter) 906 and an HBPF (high band pass filter) 907 are sequentially disposed left to right in the middle of the bottom of the PCB 905. LBPF 906 and HBPF 907 are connected to RDL 902 via solder balls, respectively, and thus to radio frequency IC 903. The bottom right side of PCB 905 is also provided with ground 908, which is a common ground for connection of various components in chip 900, ground 908 being connected to RDL 902 through solder balls. A land 909 with a through hole is also provided above the LBPF 906 and HBPF 907 in the PCB 905. A radiation field may be formed between the ground 909 and the antenna 103. The top of the PCB 905 is provided with an antenna 103, the antenna 103 has a stacked structure as shown in fig. 8, in which an inner block antenna parasitic layer 802, an outer peripheral antenna parasitic layer 804, an inner block antenna driving layer 801, and an outer peripheral antenna driving layer 803 are stacked in order from top to bottom, and may be provided as patches in different metal layers of a package according to actual needs. LBPF 906 is connected to peripheral antenna driving layer 803 and peripheral antenna parasitic layer 804 by a plurality of feed lines 910 through vias of ground 909. The HBPF 907 is connected to the inner block antenna driving layer 801 and the inner block antenna parasitic layer 802 through two power supply lines 911 penetrating through the through holes of the ground 909. The horizontal wiring portions of the power feeding line 910 and the power feeding line 911 may be formed in a metal layer. Also included in PCB 905 are a plurality of metal layers 912 for forming various signal lines or interconnections, not limited herein.

According to some embodiments of the present application, the band-pass filter may be a filter having a Q value of 100 or less. For example, the band-pass filter 504 may be a filter having a Q value of 100 or less. The antenna supports circular polarization and double frequency, has realized the isolation of higher receiving and transmitting channel, adopts the filter of lower Q value in the receiving and transmitting circuit to realize the high isolation of receiving and transmitting channel. The filter can be a multi-order filter formed by combining a plurality of dielectric filters, and the filter structure is a multi-order filter combination, so that the chip packaging volume can be saved by adopting the filter with a lower Q value.

The contactless connector according to the embodiment of the present invention may be used in pairs, for example, fig. 10 shows a contactless connector 100 and a contactless connector 100'. The non-contact connector 100 'includes a dual circularly polarized dual-band antenna 103', and the rest of the structure is completely symmetrical to the non-contact connector 100, which is not described herein. The dual circularly polarized dual band antenna 103 of the contactless connector 100 performs contactless communication with the dual circularly polarized dual band antenna 103 'of the contactless connector 100'.

As an example, fig. 11 shows a top view of a chip 500 'implementing a contactless connector 100', with a symmetrical structure to the chip 500, comprising a digital intermediate frequency 701', a power source 505', a radio frequency IC 506', an inner block antenna 201' and an outer Zhou Tianxian 'as patch antennas, on an antenna carrier 511'. The radio IC 506' includes a transmitting end TX ' and a receiving end RX '. The inner patch antenna 201' has a feed point 703' introduced by a feed line 702', the feed line 702' being connected to the HBPF 704'. The HBPF 704 'is shown as being connected to the transmitting terminal TX' (in the transmitting circuit of the contactless connector 100 '), where the HBPF 704' acts as a transmitting filter in the transmitting circuit of the contactless connector 100', and the HBPF 704' and the transmitting terminal TX 'constitute the transmitting circuit of the contactless connector 100'. In other embodiments, HBPF 704 'may also be connected to a receiving terminal RX' (in the receiving circuit of contactless connector 100 ') to act as a receiving filter for contactless connector 100'. The peripheral antenna 202 has a feed point 706 'introduced by a feed line 705' and a feed point 708 'introduced by a feed line 707'. Feeder 705' and feeder 707' are connected to LBPF 709'. In the figure, the LBPF 709 'is connected to the receiving terminal RX' (in the transmitting circuit of the contactless connector 100 ') as an example, where the LBPF 709' is used as a receiving filter in the receiving circuit of the contactless connector 100', and the LBPF 709' and the transmitting terminal RX 'constitute the receiving circuit of the contactless connector 100'. In other embodiments, LBPF 709 'may also be connected to transmit terminal TX' (in the transmit circuitry of contactless connector 100 ') to act as a transmit filter for contactless connector 100'.

The dual circularly polarized dual-band antenna 103 is matched with the feeding direction of the dual circularly polarized dual-band antenna 103', for example, the angle between the feeding arm at the feeding point 703 of the inner block antenna 201 of the dual circularly polarized dual-band antenna 103 and the cross-shaped slot is 45 °, and the angle between the feeding arm at the feeding point 703' of the inner block antenna 201 'of the dual circularly polarized dual-band antenna 103' and the cross-shaped slot is 135 °; from a clockwise view, the feed point 708 and the feed point 706 of the outer peripheral antenna 202 of the dual-circularly polarized dual-frequency antenna 103 are at plus 90 degrees, and the feed point 708 'and the feed point 706' of the outer Zhou Tianxian 'of the dual-circularly polarized dual-frequency antenna 103' are at minus 90 degrees. So that the transmitted circularly polarized electromagnetic wave is orthogonal to the received circularly polarized electromagnetic wave. For example, the peripheral antenna 202 transmits a low frequency radio frequency signal (59.5 GHz) of LHCP, which is RHCP for the outer Zhou Tianxian 202', so the outer Zhou Tianxian 202' receives the low frequency radio frequency signal of RHCP; while the inner block antenna 201' transmits a high frequency radio frequency signal (62.5 GHz) of LHCP, which is RHCP for the inner block antenna 201, so that the inner block antenna 201 receives the high frequency radio frequency signal of RHCP.

In the application, polarization orthogonality of the receiving and transmitting radio frequency signals is realized, mutual isolation is realized, and because the polarization orthogonality is realized through a feeding mode, a physical structure (a feeding structure) between antennas is geometrically symmetrical, and the air interface connection performance and polarization relation of a system are not influenced by 360-degree rotation connection points. The actual isolation between the receiving and transmitting channels is improved (to 20-30 dB). And for a double circularly polarized double-frequency antenna, the receiving and transmitting frequencies are different, so that the isolation degree of a receiving and transmitting channel is improved, (20 dB is improved on the basis of 20-30 dB). The bandpass filter in the contactless connector chip also improves the isolation of the transmit-receive channel (by 15 dB). Finally, the isolation of the receiving and transmitting channels brought by the double circular polarization double frequency scheme and the isolation of the receiving and transmitting channels brought by the band-pass filter reach the isolation of the receiving and transmitting channels of at least 55dB, the 54dB isolation requirement of the 60GHz frequency band is met, and the receiving and transmitting duplex of the 60GHz non-contact connector is realized.

The non-contact connector can take an ISM (frequency band without license) of 57GHz-64GHz as a carrier, short spacing (for example, 0.5 cm-5 cm) is arranged between the connectors, and 360-degree rotation of the connectors does not affect reliable connection and is realized by a single chip with low cost.

It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. Furthermore, for ease of description, only some, but not all, of the structures or processes associated with the present application are shown in the drawings. It should be noted that in the present specification, like reference numerals and letters denote like items throughout the drawings.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present embodiment can be understood in a specific case by those of ordinary skill in the art.

Illustrative embodiments of the present application include, but are not limited to, contactless connectors.

Various aspects of the illustrative embodiments will be described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to those skilled in the art that some alternative embodiments may be practiced using the features described in part. For purposes of explanation, specific numbers and configurations are set forth in order to provide a more thorough understanding of the illustrative embodiments. However, it will be apparent to one skilled in the art that the alternative embodiments may be practiced without the specific details. In some other instances, well-known features are omitted or simplified in order not to obscure the illustrative embodiments of the present application.

References in the specification to "an embodiment," "an illustrative embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or property, but every embodiment may or may not necessarily include the particular feature, structure, or property. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature is described in connection with a particular embodiment, it is within the knowledge of one skilled in the art to affect such feature in connection with other embodiments, whether or not such embodiment is explicitly described.

The terms "comprising," "including," and "containing" are synonymous, unless the context dictates otherwise. The phrase "a and/or B" means "(a), (B) or (a and B)".

In the drawings, some structural features may be shown in a particular arrangement and/or order. However, it should be understood that such a particular arrangement and/or ordering is not required. Rather, in some embodiments, these features may be described in a different manner and/or order than shown in the illustrative figures. Additionally, the inclusion of structural features in a particular drawing does not imply that all embodiments need include such features, and in some embodiments may not include such features or may be combined with other features.

The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the application of the technical solution of the present application is not limited to the applications mentioned in the embodiments of the present application, and various structures and modifications can be easily implemented with reference to the technical solution of the present application, so as to achieve the various beneficial effects mentioned herein. Variations that do not depart from the gist of the invention are intended to be within the scope of the invention as claimed.

Claims

1. A contactless connector, comprising: the antenna comprises a transmitting circuit, a receiving circuit and a double circularly polarized double-frequency antenna;

2. The contactless connector of claim 1, wherein the first and second radio frequency signals have a frequency of 57GHz-64GHz.

3. The contactless connector of claim 2, wherein the first radio frequency signal is a high frequency in the 60GHz band and the second radio frequency signal is a low frequency in the 60GHz band.

4. A contactless connector according to claim 3, wherein the high frequency of the 60GHz band is 62.5GHz and the low frequency of the 60GHz band is 59.5GHz.

5. The contactless connector of claim 1, wherein the inner block antenna comprises an inner block antenna driving layer and an inner block antenna parasitic layer, and the outer peripheral antenna comprises an outer peripheral antenna driving layer and an outer peripheral antenna parasitic layer; the inner block antenna parasitic layer, the outer peripheral antenna parasitic layer, the inner block antenna driving layer and the outer peripheral antenna driving layer are stacked from top to bottom in sequence.

6. The contactless connector of claim 1, wherein the transmitting circuit and the receiving circuit each comprise: a filter having a Q value of 100 or less.

7. The contactless connector of claim 6, wherein the filter is a multi-order filter composed of a plurality of dielectric filters.

8. The contactless connector of claim 1, wherein the inner block antenna is fed back and the outer peripheral antenna is fed side-fed with orthogonal sources.

9. The contactless connector of claim 1, wherein the package of the dual circularly polarized dual frequency antenna comprises a first metal layer, a second metal layer, a third metal layer, and a first dielectric layer between the first metal layer and the second metal layer, a second dielectric layer between the second metal layer and the third metal layer; the inner block antenna and the outer peripheral antenna are located in the first metal layer, the first power feed line, the second power feed line, and the third power feed line are located in one of the second metal layer and the third metal layer, and a ground line is located in the other of the second metal layer and the third metal layer.

10. The contactless connector of claim 1, wherein the transmitting circuit comprises: the device comprises an input port, a carrier feed source, a single-pole single-throw switch, a power amplifier and a transmitting filter;

11. The contactless connector of claim 10, wherein the receiving circuit comprises: the device comprises a receiving filter, a low noise amplifier, a demodulator, a single-ended-differential converter, a baseband limiting amplifier and an output port;

12. The contactless connector according to claim 1, wherein the connection distance is 0.5 cm to 5 cm.