CN116774990B - Product program management system and management method for semiconductor machine - Google Patents
Product program management system and management method for semiconductor machine Download PDFInfo
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- CN116774990B CN116774990B CN202311075542.0A CN202311075542A CN116774990B CN 116774990 B CN116774990 B CN 116774990B CN 202311075542 A CN202311075542 A CN 202311075542A CN 116774990 B CN116774990 B CN 116774990B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 238000007726 management method Methods 0.000 title abstract description 6
- 238000012360 testing method Methods 0.000 claims abstract description 117
- 238000012546 transfer Methods 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims description 70
- 239000000523 sample Substances 0.000 claims description 33
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- 238000004088 simulation Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 77
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Abstract
The invention provides a product program management system and a management method of a semiconductor machine, comprising the following steps: a product program editing server for editing different product programs according to the wafer cassettes; a product program calling server for acquiring the corresponding product program from the product program editing server according to the wafer transfer box in the semiconductor machine and transferring the corresponding product program to the semiconductor machine; and a product program uploading server for obtaining the product program and the test result in the semiconductor machine and uploading the product program and the test result. The product program management system and the product program management method of the semiconductor machine disclosed by the invention can improve the test efficiency of wafer electrical test.
Description
Technical Field
The present invention relates to the field of semiconductor technology, and more particularly, to a product program management system and method for a semiconductor machine.
Background
In the semiconductor manufacturing industry, when wafers are produced by a semiconductor machine, corresponding product programs are generated. As wafer throughput increases, the number of semiconductor devices increases, resulting in an increasing number of product programs. When the wafer in the semiconductor machine is tested, the worker needs to acquire the product program in the semiconductor machine, analyze the product program and then compare the product program one by one to determine whether the corresponding product program has a problem. Automatic test cannot be realized, and the test efficiency is lower.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a product program management system and method for a semiconductor device, which can improve the testing efficiency of electrical testing of a wafer.
To achieve the above and other objects, the present invention provides a product program management system for a semiconductor device, comprising:
a product program editing server for editing different product programs according to the wafer cassettes;
a product program calling server for acquiring the corresponding product program from the product program editing server according to the wafer transfer box in the semiconductor machine and transferring the corresponding product program to the semiconductor machine; and
and the product program uploading server is used for acquiring the product program and the test result in the semiconductor machine and uploading the product program and the test result.
In one embodiment of the present invention, the product program call server generates call log information when the product program call server transmits the corresponding product program to the semiconductor device.
In an embodiment of the present invention, after the semiconductor machine station receives the product program, a test instruction is sent to the probe station to complete the test, and call log information is parsed to generate the test result.
In an embodiment of the present invention, the management system further includes a production system, where the production system determines the wafer transfer box, and issues a correct instruction when there is no problem with the product information corresponding to the wafer transfer box, and issues an error instruction when there is a problem with the product information corresponding to the wafer transfer box; the semiconductor machine is used for responding to the correct instruction and sending out a calling instruction so that the product program calling server can call the corresponding product program from the product program editing server according to the calling instruction.
In an embodiment of the present invention, the production system is further configured to determine whether the wafer transfer box is qualified according to a test result, if the test result is qualified, transport the wafer transfer box to a next process, and if the test result is not qualified, reserve the wafer transfer box.
The invention also provides a product program management method of the semiconductor machine, which comprises the following steps:
acquiring corresponding product programs from a product program editing server according to a wafer transfer box in a semiconductor machine and transferring the corresponding product programs to the semiconductor machine, wherein the product program editing server comprises a plurality of product programs;
acquiring the product program and the test result in the semiconductor machine, and uploading the product program and the test result.
In one embodiment of the present invention, before the step of obtaining the corresponding product program from the product program editing server according to the wafer cassette in the semiconductor machine and transferring the corresponding product program to the semiconductor machine, the method further comprises:
responding to a starting instruction of a production system, and acquiring identity information corresponding to the wafer transfer box by a probe station;
and the production system judges the wafer transfer box according to the product information corresponding to the identity information and sends out a corresponding correct instruction.
In an embodiment of the present invention, the step of the production system judging the wafer cassette according to the product information corresponding to the identity information and issuing a corresponding correct instruction includes:
the probe station acquires the identity information and sends the identity information to a semiconductor machine station;
the semiconductor machine station acquires corresponding product information according to the identity information and sends the product information to the production system;
the production system judges whether the product information has a problem or not;
if the product information has no problem, a corresponding correct instruction is sent;
if the product information has problems, a corresponding error instruction is sent out.
In one embodiment of the present invention, the step of obtaining a corresponding product program from a product program editing server according to a wafer cassette in a semiconductor device and transferring the corresponding product program to the semiconductor device includes:
responding to a correct instruction of the production system, and sending a calling instruction by the semiconductor machine;
responding to the calling instruction of the semiconductor machine, and acquiring a product program corresponding to the wafer transfer box from a product program editing server by a product program calling server;
the product program call server transmits the product program to the semiconductor device while generating call log information.
In one embodiment of the present invention, the step of obtaining the product program and the test result in the semiconductor device and uploading the product program and the test result includes:
after the semiconductor machine station receives the product program, a test instruction is sent to the probe station to complete the test, and the product program is deleted;
acquiring call log information, analyzing the call log information to find whether a problem exists in the call process, and generating a test result;
the semiconductor machine station uploads the test result and the product program to a product program uploading server;
the semiconductor machine station sends out a test ending instruction to a production system, and the product program uploading server stores the test result and the product program into a database.
As described above, the present invention provides a system and method for managing a product program of a semiconductor device, which is capable of directly calling a corresponding product program from a product program editing server through a product program calling server when performing a verification test on a wafer cassette having an abnormality, so as to directly determine whether the wafer cassette having an abnormality is caused by the modification of the product program, thereby effectively improving the test efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram showing a system for product program management of a semiconductor device according to the present invention;
FIG. 2 is a logic diagram of a method for product program management of a semiconductor device according to the present invention;
FIG. 3 is a flow chart of a method for product program management of a semiconductor device according to the present invention;
FIG. 4 is a flowchart showing step S10 in FIG. 3;
FIG. 5 is a flowchart showing step S20 in FIG. 3;
FIG. 6 is a flowchart showing step S30 in FIG. 3;
FIG. 7 is a flowchart showing step S40 in FIG. 3;
fig. 8 is a flowchart of step S50 in fig. 3.
Description of element numbers:
100. a production system; 200. a probe station; 300. a semiconductor machine; 400. the product program calls the server; 500. a product program editing server; 600. a product program uploading server; 700. and (5) a database.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a product program management system of a semiconductor device, which can be applied to electrical testing of a wafer. When a problem occurs in the test result of a wafer in a certain wafer cassette, it can be retested to determine whether there is a problem in the product program in the semiconductor device 300. The product program management system may include a production system 100, a probe station 200, a semiconductor machine 300, a product program invocation server 400, a product program editing server 500, a product program upload server 600, and a database 700.
Referring to FIG. 1, in one embodiment of the invention, a production system 100 may be a manufacturing execution system (Manufacturing Execution Systems, MES). The production system 100 may be configured to send a start-up instruction to the semiconductor tool 300. The semiconductor device 300 may send a start command to the probe station 200 to control the probe station 200 to operate. When a test is required for a certain cassette in the production system 100, the production system 100 may send a start command to the probe station 200 through the semiconductor machine station 300. After the probe station 200 receives the start instruction, the probe station 200 can scan relevant information such as a two-dimensional code on the corresponding wafer transfer box, so as to obtain identity information corresponding to the wafer transfer box. Wherein the start-up information may be production information, personnel may make a shipment within the production system 100, at which time the production system 100 may generate a start-up information and transfer the corresponding wafer cassette phase to the probe station 200.
Referring to fig. 1, in an embodiment of the present invention, the production system 100 may be further configured to receive product information from the pods sent from the semiconductor device 300 and determine whether there is a problem with the product information. If the product information has no problem, a corresponding correct instruction is sent out. If the product information has problems, a corresponding error instruction is sent out. Specifically, after the production system 100 obtains the product information, it needs to be determined to determine whether there is a problem with the corresponding wafer cassette. The product information may include the number of wafers in the wafer cassette, the reticle version, etc. The production system 100 can determine whether there is a problem with the product information by determining whether the number of wafers is correct, whether the mask version is correct, etc. For example, when there is no problem in the wafer number and the mask version, it indicates that there is no problem in the product information, and the production system 100 can issue a corresponding correct instruction. When any one of the wafer number and the mask version has a problem, it indicates that the product information has a problem, and the production system 100 may issue a corresponding error command. The error information may indicate that the wafer cassette has a deviation, so as to feed back to a worker.
Referring to fig. 1, in an embodiment of the present invention, the production system 100 may further determine whether the corresponding pods are acceptable according to the test result. If the test results are acceptable, this indicates that the cassette is acceptable, at which point the production system 100 may transport the cassette to the next process. If the test results are not acceptable, this indicates that the cassette is not acceptable, at which point the production system 100 may reserve the cassette for subsequent processing by personnel.
Referring to fig. 1, in an embodiment of the present invention, the probe station 200 may be configured to receive a start command from the production system 100 through the semiconductor machine 300, and scan a two-dimensional code on the wafer cassette, so as to obtain identity information corresponding to the wafer cassette, and send the identity information to the semiconductor machine 300. The probe station 200 may also be used to receive test instructions from the semiconductor tool 300 to test individual wafers in the wafer cassette.
Referring to fig. 1, in one embodiment of the present invention, a semiconductor tool 300 may be used to obtain corresponding product information based on cassette identity information and send the product information to the production system 100. Specifically, the semiconductor machine 300 may obtain corresponding product information according to the identity information. The product information may be stored in the database 700 in advance or may be stored in the production system 100 in advance. The semiconductor tool 300 may send corresponding product information to the production system 100. The semiconductor machine 300 may also obtain the call log information and parse it to find out whether there is a problem in the call process and generate a test result.
Referring to FIG. 1, in one embodiment of the present invention, semiconductor tool 300 may also be used to issue call instructions in response to the correct instructions of production system 100. The calling instruction may include a list of product programs required for product testing, and the list of product programs required for product testing may be transmitted to the product program calling server 400, so that the product program calling server 400 may obtain the corresponding product programs from the product program editing server 500. The semiconductor device 300 may also be used to receive product programs and issue test instructions to the probe station 200 to complete the test while deleting the product programs. The semiconductor device 300 may also be used to upload product programs and test results to the product program upload server 600. The semiconductor tool 300 may also issue a test end instruction to the production system 100.
Referring to fig. 1, in one embodiment of the present invention, the product program calling server 400 may obtain a corresponding product program from the product program editing server 500 according to a calling instruction of the semiconductor device 300, and transmit the corresponding product program to the semiconductor device 300, and generate calling log information. Corresponding test information and product program information can be recorded in the call log information so as to facilitate the analysis of the call log information by staff.
Referring to fig. 1, in one embodiment of the present invention, the product program editing server 500 may edit programs required for wafer testing, and may generate different product programs for different wafers. The product program upload server 600 can communicate with the semiconductor device 300 to obtain the corresponding product program and test result. The product program uploading server 600 may be connected to the database 700, and further the product program and the test result may be uploaded to the database 700 for storage by the product program uploading server 600.
Therefore, in the above scheme, when the verification test is performed on the abnormal wafer cassette, the unexpected effect is that the corresponding product program can be directly called from the product program editing server through the product program calling server, and whether the abnormal wafer cassette is caused by the modification of the product program can be directly judged, so that the test efficiency is effectively improved.
Referring to fig. 2, the present invention also provides a method for managing product programs of a semiconductor device, which can be applied to the above-mentioned management system. The logic of the product program management method of the semiconductor device can include steps S100-S600. Step S100 may be expressed as the occurrence of a product program change requirement for the wafer. Step S200 may be expressed as that the product program editing server 500 may edit the corresponding product program according to the wafer. Step S300 may be expressed as that when the editing of the product program is completed, a simulation test (Electrical Wafer Sort, EWS) may be performed on the product program so that the product program passing the simulation test can be inputted into the semiconductor device 300. Step S400 may be expressed as that the semiconductor device 300 may perform a test according to a wafer corresponding to a product program, and determine whether the test is successful. If the test is successful, step S600 is performed, i.e. the product program change of the wafer is ended. If the test fails, step S500 is executed to determine whether the product program change in the product program call server 400 is problematic. When there is no problem with the product program change in the product program call server 400, step S600 is executed, i.e. the product program change of the wafer is ended. When a problem occurs in the product program change in the product program calling server 400, the process returns to step S200.
Referring to fig. 3, in one embodiment of the present invention, the management method may specifically include the following steps:
step S10, responding to a starting instruction of a production system, and acquiring identity information corresponding to a wafer transfer box by a probe station;
step S20, the production system judges the wafer transfer box according to the product information corresponding to the identity information and sends out a corresponding correct instruction;
step S30, according to the wafer transfer box in the semiconductor machine, obtaining the corresponding product program from the product program editing server and transferring the corresponding product program to the semiconductor machine, wherein the product program editing server comprises a plurality of product programs;
step S40, obtaining the product program and the test result in the semiconductor machine, and uploading the product program and the test result;
step S50, the production system is used for classifying and storing the wafer transfer boxes based on the test result.
Referring to fig. 4, in one embodiment of the present invention, when step S10 is performed, specifically, step S10 may include the following steps:
s11, the production system sends a starting instruction to the probe station through the semiconductor machine station;
step S12, the probe station acquires the wafer transfer box according to the starting instruction, scans and reads the identity information of the wafer transfer box.
In one embodiment of the present invention, when step S11 and step S12 are performed, specifically, when a test is required for a certain cassette in the production system 100, the production system 100 may send a start command to the probe station 200 through the semiconductor machine station 300. After the probe station 200 receives the start instruction, the probe station 200 can scan relevant information such as a two-dimensional code on the corresponding wafer transfer box, so as to obtain identity information corresponding to the wafer transfer box. Wherein the start-up information may be production information, personnel may make a shipment within the production system 100, and the production system 100 may generate a start-up information and transfer the corresponding pods to the probe station 200.
Referring to fig. 5, in one embodiment of the present invention, when step S20 is performed, specifically, step S20 may include the following steps:
s21, the probe station acquires the identity information of the wafer transfer box and sends the identity information to the semiconductor machine station;
s22, the semiconductor machine station acquires corresponding product information according to the identity information and sends the product information to a production system;
step S23, the production system judges whether the product information has problems, wherein the product information comprises the number of wafers and the photomask version;
step S24, if the product information has no problem, a corresponding correct instruction is sent;
step S25, if the product information has a problem, a corresponding error instruction is sent.
In one embodiment of the present invention, when step S21 and step S22 are performed, specifically, after the two-dimensional code on the wafer cassette is scanned by the probe station 200, corresponding identity information may be generated. The probe station 200 may then send the identity information to the semiconductor station 300, and the semiconductor station 300 may obtain corresponding product information according to the identity information, which may be stored in the database 700 in advance. The semiconductor tool 300 may send corresponding product information to the production system 100.
In one embodiment of the present invention, when executing steps S23, S24 and S25, specifically, after the production system 100 obtains the product information, it needs to determine whether there is a problem with the corresponding wafer cassette. The product information may include the number of wafers in the wafer cassette, the reticle version, etc. The production system 100 can determine whether there is a problem with the product information by determining whether the number of wafers is correct, whether the mask version is correct, etc. For example, when there is no problem in the wafer number and the mask version, it indicates that there is no problem in the product information, and the production system 100 can issue a corresponding correct instruction. When any one of the wafer number and the mask version has a problem, it indicates that the product information has a problem, and the production system 100 may issue a corresponding error command. The error information may indicate that the wafer cassette has a deviation, so as to feed back to a worker.
Referring to fig. 6, in one embodiment of the present invention, when step S30 is performed, specifically, step S30 may include the following steps:
step S31, responding to a correct instruction of the production system, and sending a calling instruction by the semiconductor machine;
step S32, responding to the calling instruction of the semiconductor machine, and obtaining a product program corresponding to the wafer transfer box from a product program editing server by a product program calling server;
step S33, the product program calling server sends the product program to the semiconductor machine, and generates calling log information.
In one embodiment of the present invention, when executing steps S31, S32 and S33, specifically, after the production system 100 issues the correct instruction, the semiconductor device 300 may receive the correct instruction and issue the call instruction to the product program call server 400. The calling instruction may indicate that the machine 300 needs to call the product program required for the wafer cassette test from the product program editing server 500. The product program editing server 500 can edit the product program required by the wafer test, and further can generate different product programs for different wafers. When the product program calling server 400 selects a desired product program from the product program editing server 500, the corresponding product program can be sent to the semiconductor machine 300, and calling log information is generated, in which corresponding test information and program document information can be recorded, so that the staff can analyze the product program.
Referring to fig. 7, in one embodiment of the present invention, when step S40 is performed, specifically, step S40 may include the following steps:
step S41, after receiving the product program, the semiconductor machine station sends a test instruction to the probe station to complete the test, and meanwhile, the product program is deleted;
step S42, acquiring call log information, analyzing the call log information to find whether a problem exists in the call process, and generating a test result;
step S43, the semiconductor machine station uploads the test result and the product program to the product program uploading server;
step S44, the semiconductor machine station sends out the test ending instruction to the production system, and the product program uploading server saves the test result and the product program into the database.
In one embodiment of the present invention, when executing steps S41 and S42, specifically, after the semiconductor machine 300 receives the product program, a test command may be issued to the probe station 200, so that the probe station 200 tests each wafer in the wafer cassette according to the product program. After all the wafers are tested, the semiconductor device 300 may delete the corresponding product program. When a problem occurs in the test process, a worker can acquire corresponding call log information by using file transfer protocol software (File Transfer Protocol software, FTP software) and analyze the call log information to find out whether the problem exists in the call process and generate a test result. Moreover, the operator can also view the operation condition of each semiconductor machine 300 in real time through the virtual network console software (Virtual Network Console software, VNC software). The staff can solve any problem in real time in the test through remote connection in real time.
In one embodiment of the present invention, when performing step S43 and step S44, specifically, after generating the test result, the semiconductor device 300 may upload the test result and the product program to the product program upload server 600. Meanwhile, the semiconductor machine 300 may feed back a test end command to the production system 100, and the production system 100 may transport the wafer cassette according to the test end command. The product program uploading server 600 may communicate with the database 700, and further the test result and the product program may be uploaded to the database 700 for storage by the product program uploading server 600.
Referring to fig. 8, in one embodiment of the present invention, when step S50 is performed, specifically, step S50 may include the following steps:
step S51, the production system judges whether the corresponding wafer transfer box is qualified according to the test result;
step S52, if the test result is qualified, transporting the wafer transfer box to the next process;
and step S53, if the test result is not qualified, reserving the wafer transfer box.
In one embodiment of the present invention, when executing step S51, step S52 and step S53, specifically, the production system 100 may determine whether the corresponding wafer cassette is qualified according to the test result. If the test results are acceptable, this indicates that the cassette is acceptable, at which point the production system 100 may transport the cassette to the next process. If the test results are not acceptable, this indicates that the cassette is not acceptable, at which point the production system 100 may reserve the cassette for subsequent processing by personnel.
In the description of the present specification, the descriptions of the terms "present embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The embodiments of the invention disclosed above are intended only to help illustrate the invention. The examples are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (5)
1. A product program management system for a semiconductor tool, comprising:
a product program editing server for editing different product programs according to the wafer cassettes;
a product program calling server for acquiring the corresponding product program from the product program editing server according to the wafer transfer box in the semiconductor machine and transferring the corresponding product program to the semiconductor machine;
a product program uploading server for obtaining the product program and the test result in the semiconductor machine and uploading the product program and the test result; and
the production system judges the wafer conveying box, and when the product information corresponding to the wafer conveying box has no problem, the production system sends out a correct instruction, and when the product information corresponding to the wafer conveying box has the problem, the production system sends out an error instruction;
the semiconductor machine is used for responding to the correct instruction and sending a calling instruction so that the product program calling server can call the corresponding product program from the product program editing server according to the calling instruction, and after the semiconductor machine receives the product program, a test instruction is sent to the probe station to complete the test, and call log information is analyzed to generate the test result;
when the product program of the wafer is required to be changed, the product program editing server edits a corresponding product program according to the wafer, after the product program is edited, the product program is subjected to simulation test, so that the product program passing the simulation test is input into the semiconductor machine, the semiconductor machine tests the corresponding wafer according to the product program and judges whether the test is successful, if the test is successful, the product program of the wafer is changed, if the test is failed, whether the product program in the product program calling server is changed, if the change is not problematic, the product program of the wafer is changed, and if the change is problematic, the product program editing server repeatedly edits the corresponding product program according to the wafer until the change is not problematic.
2. The system of claim 1, wherein after the semiconductor device receives the product program, a test command is sent to the probe station to complete the test, and the call log information is parsed to generate the test result.
3. The system of claim 1, wherein the production system is further configured to determine whether the wafer cassette is acceptable according to a test result, and if the test result is acceptable, then transport the wafer cassette to a next process, and if the test result is unacceptable, then keep the wafer cassette.
4. A method for product program management of a semiconductor device, comprising:
responding to a starting instruction of the production system, and acquiring identity information corresponding to the wafer transfer box by the probe station;
the probe station acquires the identity information and sends the identity information to a semiconductor machine station;
the semiconductor machine station acquires corresponding product information according to the identity information and sends the product information to the production system;
the production system judges whether the product information has a problem or not;
if the product information has no problem, a corresponding correct instruction is sent;
if the product information has problems, a corresponding error instruction is sent;
responding to a correct instruction of the production system, and sending a calling instruction by the semiconductor machine;
responding to the calling instruction of the semiconductor machine, and obtaining a product program corresponding to the wafer cassette from a product program editing server by a product program calling server, wherein the product program editing server comprises a plurality of product programs;
the product program calling server sends the product program to the semiconductor machine and generates calling log information;
acquiring the product program and the test result in the semiconductor machine, and uploading the product program and the test result;
when the product program of the wafer is required to be changed, the product program editing server edits a corresponding product program according to the wafer, after the product program is edited, the product program is subjected to simulation test, so that the product program passing the simulation test is input into the semiconductor machine, the semiconductor machine tests the corresponding wafer according to the product program and judges whether the test is successful, if the test is successful, the product program of the wafer is changed, if the test is failed, whether the product program in the product program calling server is changed, if the change is not problematic, the product program of the wafer is changed, and if the change is problematic, the product program editing server repeatedly edits the corresponding product program according to the wafer until the change is not problematic.
5. The method of claim 4, wherein the steps of obtaining the product program and the test result in the semiconductor device and uploading the product program and the test result comprise:
after the semiconductor machine station receives the product program, a test instruction is sent to the probe station to complete the test, and the product program is deleted;
acquiring call log information, analyzing the call log information to find whether a problem exists in the call process, and generating a test result;
the semiconductor machine station uploads the test result and the product program to a product program uploading server;
the semiconductor machine station sends out a test ending instruction to a production system, and the product program uploading server stores the test result and the product program into a database.
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