CN116734929B - Distributed multi-parameter test system suitable for aircraft - Google Patents
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Abstract
The invention relates to a distributed multi-parameter testing system, in particular to a distributed multi-parameter testing system suitable for an aircraft, which comprises a flexible film acquisition device, a testing device and a display processing device, wherein the flexible film acquisition device integrates a sensor in an array mode and is in reliable connection with the testing device; the display processing device is used for high-speed transmission of data and uploading and downloading of commands and visual display of data facing users. The invention can realize the distributed multi-measuring point multi-parameter data acquisition of the aircraft environment and realize the analysis, the processing and the display of high-speed and high-precision data.
Description
Technical Field
The invention relates to a distributed multi-parameter testing system, in particular to a distributed multi-parameter testing system suitable for an aircraft.
Background
In space model flight experiments, measured environmental parameters are important references for ensuring the reliability research of the environment and the aircraft. In the testing process, a high-speed, high-precision and multi-parameter measuring device is needed to ensure that the result of the environmental test is efficient and reliable. Therefore, the measuring device needs to measure a large number of distributed measuring points simultaneously to improve the consistency of a measuring result and an actual environment, can measure multi-parameter environment parameters, is provided with a high-speed data acquisition and processing system, can obtain a testing result at high speed and high precision, and stores testing data. And the acquired data can be transmitted to a display processing device to realize man-machine interaction. In addition, the reliability and stability of equipment in a severe and complex flight test environment can be ensured; the invention designs a distributed multi-parameter testing system aiming at the problems.
Disclosure of Invention
The invention provides a distributed multi-parameter testing system suitable for an aircraft, which aims to solve the problem that the existing aircraft environment parameter testing system cannot meet the requirements of high-speed, high-precision and multi-parameter measurement.
The invention is realized by adopting the following technical scheme: a distributed multi-parameter test system for an aircraft, the overall system architecture comprising: the flexible film acquisition device integrates a sensor in an array mode and is in reliable connection with the testing device, the flexible film acquisition device is used for acquiring environmental parameters in the flight test process, the testing device is used for carrying out analog-to-digital conversion on analog signals acquired by the flexible film acquisition device to digital signals and carrying out mixed framing on the digital signals and then storing the digital signals, and on the other hand, the flexible film acquisition device is used for carrying out data interaction with the display processing device through a network transmission protocol; the display processing device is used for high-speed transmission of data and uploading and downloading of commands and visual display of data facing users. The flexible film collecting device and the testing device are arranged on the aircraft, and the display processing device can be arranged on the aircraft or not arranged on the aircraft for use on the ground.
The flexible film acquisition device comprises an array type temperature sensor flexible film, an array type strain sensor flexible film, an array type heat flow sensor flexible film, an array type heat film flow rate sensor flexible film and a wiring terminal row; the array type temperature sensor flexible film adopts a mode that an excitation source and a sensor array are independently designed, and thermal resistance type sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the surface temperature of the aircraft; the array type strain sensor flexible film adopts a mode that an excitation source and a sensor array are independently designed, and strain gauge type sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the pressure intensity of the surface of the aircraft; the array type heat flow sensor flexible film adopts a mode of independently designing an excitation source and a sensor array, and thermopile type heat flow sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the surface flow velocity of the aircraft; the flexible film of the array type hot film flow rate sensor adopts a mode that an excitation source and a sensor array are independently designed, and the hot film air flow rate sensor is arranged on the flexible film in a rectangular arrangement mode to measure the air flow rate on the surface of the aircraft; the wiring terminal block is used for fixing and arranging signal wires of the connected array type sensor and providing wiring terminals for the testing device.
The testing device comprises a distributed multi-parameter sensing connector, a signal conditioning circuit module, an analog-to-digital and digital-to-analog conversion module, a transmission module, a gigabit Ethernet interface connector, an RS422 interface connector, an FPGA main control module and a storage module; the distributed multi-parameter sensing connector comprises a connector interface of an array type temperature sensor, a connector interface of an array type strain sensor, a connector interface of an array type heat flow sensor and a connector interface of an array type heat film flow rate sensor; the interface of the distributed multi-parameter sensing connector can be spliced with the binding post of the binding post; the signal conditioning circuit module comprises a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit, a heat film flow rate signal conditioning circuit, a clamping protection circuit, a row selection analog switch and a column selection analog switch; the distributed multi-parameter sensing connector is connected with a row selection analog switch and a column selection analog switch, the row selection analog switch, the column selection analog switch and a clamping protection circuit, the clamping protection circuit is respectively connected with a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit and a heat film flow rate signal conditioning circuit, and the control ends of the row selection analog switch and the column selection analog switch are connected with an FPGA main control module; the analog-to-digital conversion module comprises an analog-to-digital conversion part and a digital-to-analog conversion part, wherein the temperature signal conditioning circuit, the strain signal conditioning circuit, the heat flow signal conditioning circuit and the heat film flow rate signal conditioning circuit are all connected with the analog-to-digital conversion part, the analog-to-digital conversion part is connected with the FPGA main control module and converts analog signals of the sensor into digital signals to be transmitted to the FPGA main control module, the digital-to-analog conversion part is connected with the FPGA main control module and the strain signal conditioning circuit, and control signals of the FPGA main control module are converted into adjustment signals through the digital-to-analog conversion part and are input to the strain signal conditioning circuit to adjust output direct current bias of the strain signal conditioning circuit; the transmission module comprises a gigabit Ethernet module and an RS422 module; the FPGA main control module is connected with the gigabit Ethernet interface connector through the gigabit Ethernet module, the FPGA main control module is connected with the RS422 interface connector through the RS422 module, and the storage module is connected with the FPGA main control module.
The distributed multi-parameter testing system suitable for the aircraft comprises a synchronous triggering module and a synchronous triggering interface connector, wherein the FPGA main control module is connected with the synchronous triggering interface connector through the synchronous triggering module. When the aircraft carries a plurality of test systems, the FPGA main control module of one test system sends out a synchronous signal and a trigger signal to ensure synchronous test of the plurality of test systems.
The display processing device comprises a configuration and task planning module, a data transmission module, a data management module, a data analysis module, a data output module and a data display module, wherein the data transmission module is connected with the data management module, the data management module is connected with the configuration and task planning module, the configuration is connected with the task planning module and the data display module, the data management module is connected with the data analysis module, and the data analysis module is connected with the data output module.
The distributed multi-parameter testing system suitable for the aircraft is characterized in that the interface connecting wires of the synchronous triggering interface connector, the gigabit Ethernet interface connector and the RS422 interface connector all adopt shielding wires with electromagnetic compatibility characteristics so as to reduce the influence of external electromagnetic fields on power supplies or communication lines and electromagnetic energy radiated outwards by the lines.
The storage module comprises an EEPROM storage unit and an EMMC storage unit.
By adopting the technical measures, the technical scheme of the invention can effectively solve the problems of distributed multi-parameter data acquisition, storage, transmission and man-machine interaction in the flight test of the prior aircraft. The test system is compatible with different types of sensors through a modularized layering grouping technology, so that the environment parameters in the flight test of the aircraft are acquired by the distributed multi-parameter test system, and the purpose of structural health monitoring of the aircraft is further realized.
Drawings
Fig. 1 is a schematic diagram of an overall system structure provided by the technical scheme of the present invention.
Fig. 2 is a schematic diagram of a system hardware structure provided by the technical scheme of the present invention.
Fig. 3 is a schematic diagram of a system software architecture provided by the technical scheme of the present invention.
In the figure: the system comprises a 10-flexible film acquisition device, a 11-testing device, a 12-display processing device, a 13-distributed multi-parameter sensing connector, a 14-signal conditioning circuit module, a 15-analog-digital and digital-analog conversion module, a 16-synchronous triggering module, a 17-transmission module, a 18-synchronous triggering interface connector, a 19-gigabit Ethernet interface connector, a 20-RS422 interface connector, a 21-FPGA main control module, a 22-storage module, a 23-configuration and task planning module, a 24-data display module, a 25-data management module, a 26-data output module, a 27-data analysis module and a 28-data transmission module.
Detailed Description
As shown in fig. 1, the present invention provides a distributed multi-parameter testing system suitable for an aircraft, where the overall architecture of the system includes: a flexible film collecting device 10, a testing device 11 and a display processing device 12. The distributed multi-parameter testing system adopts a modularized architecture, firstly, a plurality of sensors are integrated on a flexible film acquisition device 10 in an array mode, and reliable connection is realized with a testing device 11 through a J30J series miniature rectangular electric connector. Then, the test device 11 converts the collected signals of the multiple sensors into digital signals through a corresponding signal conditioning circuit and analog-to-digital conversion. Next, the processed digital signals are subjected to hybrid framing and stored in a storage unit. Finally, after the flight test is finished, the user outputs the test data to the processing display device 12 through a high-speed data transmission protocol, so that visual display analysis of the data is realized, and the aim of monitoring the structural health of the aircraft is finally realized.
The flexible film collecting apparatus 10 includes: the device comprises an array type temperature sensor flexible film, an array type strain sensor flexible film, an array type heat flow sensor flexible film, an array type heat film flow rate sensor flexible film and a wiring terminal row. The array type temperature sensor flexible film adopts a mode of independently designing an excitation source and a sensor array, and thermal resistance sensors are arranged on the flexible film in a rectangular arrangement mode of 8 x 16 to measure the change of the surface temperature of an aircraft; the flexible film of the array type strain sensor adopts a mode of independently designing an excitation source and a sensor array, and strain gauge type sensors are arranged on the flexible film in a rectangular arrangement mode of 8 x 16 to measure the change of the surface pressure of the aircraft; the flexible film of the array type heat flow sensor adopts a mode of independently designing an excitation source and a sensor array, and thermopile type heat flow sensors are arranged on the flexible film in a rectangular arrangement mode of 8 x 16 to measure the change of the surface flow velocity of the aircraft; the flexible film of the array type hot film flow rate sensor adopts a mode of independently designing an excitation source and a sensor array, and the hot film air flow rate sensor is arranged on the flexible film in a rectangular arrangement mode of 8 x 16 to measure the air flow rate on the surface of the aircraft; the terminal block is used for fixing and sorting the signal lines of the connected array sensor and provides terminals for the testing device 11.
The test device 11 includes: the system comprises a distributed multi-parameter sensing connector 13, a signal conditioning circuit module 14, an analog-to-digital and digital-to-analog conversion module 15, a synchronous trigger module 16, a transmission module 17, a synchronous trigger interface connector 18, a gigabit Ethernet interface connector 19, an RS422 interface connector 20, an FPGA main control module 21 and a storage module 22. The distributed multi-parameter sensing connector 13 comprises a connector interface of an array type temperature sensor, a connector interface of an array type strain sensor, a connector interface of an array type heat flow sensor and a connector interface of an array type heat film flow rate sensor. The distributed multi-parameter sensing connector 13 adopts a J30J series miniature rectangular electric connector with large contact piece density, small volume and light weight, and has the functions of looseness prevention and easy installation, and in addition, when wiring is carried out, the situation that data cannot be normally transmitted after single wire breakage is prevented by adopting double-wire connection is avoided, and an interface of the distributed multi-parameter sensing connector 13 can be spliced with a binding post of a wiring terminal; the interface connection wires of the synchronous triggering interface connector 18, the gigabit Ethernet interface connector 19 and the RS422 interface connector 20 all adopt shielding wires with electromagnetic compatibility characteristics to reduce the influence of external electromagnetic fields on power supplies or communication lines and electromagnetic energy radiated outwards by the lines. The signal conditioning circuit module 14 comprises a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit, a heat film flow rate signal conditioning circuit, a clamping protection circuit, a row selection analog switch and a column selection analog switch. The distributed multi-parameter sensing connector is connected with a row selection analog switch and a column selection analog switch, the row selection analog switch, the column selection analog switch and the clamping protection circuit are connected, and the clamping protection circuit is respectively connected with a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit and a heat film flow rate signal conditioning circuit, and the control ends of the row selection analog switch and the column selection analog switch are connected with the FPGA main control module. The row selection and column selection analog switches are used for gating sensor channels, solve the problems of high cost, complex layout and crosstalk between cables of connecting cables, solve the problems of switching time, power supply voltage and the like, and realize acquisition of signals of each channel by controlling switching of an address bus of the analog switch according to a frame structure by the FPGA main control module 21. The clamping protection circuit is used for fixing the data input by the sensor in the range of a selected level, clamping the voltage and preventing the damage of a rear device circuit caused by external transient electrostatic high voltage, so that the testing system is protected; the signal conditioning circuit for temperature, strain, heat flow and heat film flow rate is used for conditioning temperature signals, strain signals, heat flow signals and heat film flow rate signals with different amplitudes and phases after passing through the clamping protection circuit into an allowable input range of the analog-to-digital converter, and meanwhile, interference caused by amplification of operational amplifier internal noise following a sensor signal can be avoided, and internal noise generated in the operation of the operational amplifier can be restrained. The analog-to-digital conversion module 15 comprises an analog-to-digital conversion part and a digital-to-analog conversion part, wherein the temperature signal conditioning circuit, the strain signal conditioning circuit, the heat flow signal conditioning circuit and the heat film flow rate signal conditioning circuit are all connected with the analog-to-digital conversion part, the analog-to-digital conversion part is connected with the FPGA main control module and converts analog signals of the sensor into digital signals to be transmitted to the FPGA main control module, the digital-to-analog conversion part is connected with the FPGA main control module and the strain signal conditioning circuit, and control signals of the FPGA main control module are converted into adjusting signals through the digital-to-analog conversion part and are input to the strain signal conditioning circuit to adjust output direct current bias of the strain signal conditioning circuit. The synchronous trigger module 16 is connected with the FPGA main control module 21 and the synchronous trigger interface connector 18 and is used for synchronizing data, receiving synchronous signals and trigger signals from the FPGA main control module 21 in other test systems and guaranteeing test synchronization of a plurality of test systems; the FPGA main control module 21 is used for data framing fusion processing, is responsible for global logic control, has high processing speed, and can simultaneously run a plurality of instructions, namely, has the advantage of parallel execution. Meanwhile, the requirements of high speed, high bandwidth, high capacity and the like are met, the system is suitable for high-speed data communication, video image processing, high-speed data acquisition and the like, and the system can be reset through keys. The memory module 22 includes an EEPROM memory unit and an EMMC memory unit; the EEPROM can be programmed and erased to provide high reliability and high durability, is a nonvolatile memory, is a frequently used medium and small capacity memory, can be used for low-power and low-voltage operation, can be accessed through a two-wire double-row interface, and has the greatest characteristics of being capable of being programmed and erased for multiple times, high reliability and high durability, the number of times of erasing the EEPROM in the design can reach one million times, the stored data can be saved for 100 years, meanwhile, the EEPROM is used for preventing the condition that a system is not operated due to the loss of a system driving program after the system is powered down, the driving program is stored in the power-down nonvolatile memory, and the program is automatically started after the system is powered up; the EMMC storage unit is used for realizing large-capacity data storage, the transmission rate of 110MB/s is larger than the acquired data quantity of the sensor, the signal quality of a data bus can be ensured, the EMMC storage is used for data storage in a ring storage mode, and the data can be read out through the RS422 interface connector 20; the transmission module 17 comprises a gigabit ethernet module and an RS422 module; the gigabit Ethernet module is used for high-speed data transmission and accords with 10Base-T, 100Base-TX and 1000Base-T IEEE 802.3 standards, the chip supports 10/100/1000Mbps network transmission rate, and the chip performs data communication with the FPGA main control module 21 through an RGMII interface; the RS422 module is used as auxiliary transmission, so that a data protocol of multipoint communication and differential transmission can be completed, and meanwhile, an RS422 isolation circuit is designed to reduce signal interference and avoid interface damage caused by abnormal signals.
The display processing device 12 comprises a configuration and task planning module 23, a data transmission module 28, a data management module 25, a data analysis module 27, a data output module 26 and a data display module 24. The data transmission module 28 and the data management module 25 are connected, the data management module 25 and the configuration are connected with the task planning module 23, the configuration is connected with the task planning module 23 and the data display module 24, the data management module 25 and the data analysis module 27 are connected, the data analysis module 27 and the data output module 26 are connected, and the display processing device 12 is connected with the testing device 11 through the data transmission module 28. The data display module 24 is used for man-machine interaction between a user and the system, and can perform system configuration, task planning and data display; the configuration and task planning module 23 is used for planning a test task and managing unit information by a user; the data management module 25 is configured to send configuration data to the data transmission module 28, and receive test data uploaded by the data transmission module 28, extract the test data, and then transmit specified data to the data analysis module 27; the data transmission module 28 is configured to interact with the testing device 11 through gigabit ethernet, and perform communication transmission through RS422 protocol as an auxiliary function; the data analysis module 27 is used for performing time domain and frequency domain analysis on the feature values processed by the test data by the data management module, and then outputting the analysis result in a report form or a graph form; the data output module 26 outputs the conclusion after the data analysis by the data analysis module in a report or graph mode.
Claims (5)
1. A distributed multi-parameter test system for an aircraft, comprising: the device comprises a flexible film acquisition device (10), a testing device (11) and a display processing device (12), wherein the flexible film acquisition device (10) integrates sensors in an array mode and is connected with the testing device (11), the flexible film acquisition device (10) is used for acquiring environmental parameters in a flight test process, the testing device (11) is used for carrying out analog-to-digital conversion on analog signals acquired by the flexible film acquisition device (10) to digital signals and carrying out mixed framing on the digital signals for storage, and on the other hand, the flexible film acquisition device is used for carrying out data interaction with the display processing device (12) through a network transmission protocol; the display processing device (12) is used for high-speed transmission of data and uploading and downloading of commands and visual display of data for users; the flexible film collecting device (10) comprises an array type temperature sensor flexible film, an array type strain sensor flexible film, an array type heat flow sensor flexible film, an array type heat film flow rate sensor flexible film and a wiring terminal row; the array type temperature sensor flexible film adopts a mode that an excitation source and a sensor array are independently designed, and thermal resistance type sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the surface temperature of the aircraft; the array type strain sensor flexible film adopts a mode that an excitation source and a sensor array are independently designed, and strain gauge type sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the pressure intensity of the surface of the aircraft; the array type heat flow sensor flexible film adopts a mode of independently designing an excitation source and a sensor array, and thermopile type heat flow sensors are arranged on the flexible film in a rectangular arrangement mode to measure the change of the surface flow velocity of the aircraft; the flexible film of the array type hot film flow rate sensor adopts a mode that an excitation source and a sensor array are independently designed, and the hot film air flow rate sensor is arranged on the flexible film in a rectangular arrangement mode to measure the air flow rate on the surface of the aircraft; the wiring terminal block is used for fixing and arranging signal wires of the connected array sensor and providing wiring terminals for the testing device (11); the test device (11) comprises: the system comprises a distributed multi-parameter sensing connector (13), a signal conditioning circuit module (14), an analog-digital and digital-analog conversion module (15), a transmission module (17), a gigabit Ethernet interface connector (19), an RS422 interface connector (20), an FPGA main control module (21) and a storage module (22); the distributed multi-parameter sensing connector (13) comprises a connector interface of an array type temperature sensor, a connector interface of an array type strain sensor, a connector interface of an array type heat flow sensor and a connector interface of an array type heat film flow rate sensor; the signal conditioning circuit module (14) comprises a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit, a heat film flow rate signal conditioning circuit, a clamping protection circuit, a row selection analog switch and a column selection analog switch; the distributed multi-parameter sensing connector (13) is connected with a row selection analog switch and a column selection analog switch, the row selection analog switch, the column selection analog switch and a clamp protection circuit, the clamp protection circuit is respectively connected with a temperature signal conditioning circuit, a strain signal conditioning circuit, a heat flow signal conditioning circuit and a thermal film flow rate signal conditioning circuit, and the control ends of the row selection analog switch and the column selection analog switch are connected with an FPGA main control module (21); the analog-to-digital conversion module (15) comprises an analog-to-digital conversion part and a digital-to-analog conversion part, wherein the temperature signal conditioning circuit, the strain signal conditioning circuit, the heat flow signal conditioning circuit and the heat film flow rate signal conditioning circuit are all connected with the analog-to-digital conversion part, the analog-to-digital conversion part is connected with the FPGA main control module (21) and converts an analog signal of a sensor into a digital signal to be transmitted to the FPGA main control module (21), the digital-to-analog conversion part is connected with the FPGA main control module (21) and the strain signal conditioning circuit, and a control signal of the FPGA main control module (21) is converted into an adjusting signal through the digital-to-analog conversion part and is input into the strain signal conditioning circuit to adjust the output direct current bias of the strain signal conditioning circuit; the transmission module (17) comprises a gigabit Ethernet module and an RS422 module; the FPGA main control module (21) is connected with the gigabit Ethernet interface connector (19) through the gigabit Ethernet module, the FPGA main control module (21) is connected with the RS422 interface connector (20) through the RS422 module, and the storage module (22) is connected with the FPGA main control module (21).
2. A distributed multi-parameter test system for an aircraft according to claim 1, characterized in that the test device (11) further comprises a synchronous trigger module (16) and a synchronous trigger interface connector (18), and the FPGA master control module (21) is connected with the synchronous trigger interface connector (18) through the synchronous trigger module (16).
3. A distributed multi-parameter test system for an aircraft according to claim 1 or 2, characterized in that the display processing means (12) comprise a configuration and mission planning module (23), a data transmission module (28), a data management module (25), a data analysis module (27), a data output module (26) and a data display module (24), the data transmission module (28) and the data management module (25) being connected, the data management module (25) and the configuration being connected with the mission planning module (23), the configuration being connected with the mission planning module (23) and the data display module (24), the data management module (25) and the data analysis module (27) being connected with the data output module (26).
4. A distributed multi-parameter test system for aircraft according to claim 1 or 2, characterized in that the interface connection lines of the synchronous trigger interface connector (18), the gigabit ethernet interface connector (19) and the RS422 interface connector (20) are shielding lines with electromagnetic compatibility.
5. A distributed multi-parameter testing system for aircraft according to claim 1 or 2, characterized in that the memory module (22) comprises an EEPROM memory unit and an EMMC memory unit.
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