CN116722342B - Millimeter wave filtering super-surface antenna module and communication equipment - Google Patents
Millimeter wave filtering super-surface antenna module and communication equipment Download PDFInfo
- Publication number
- CN116722342B CN116722342B CN202310994325.5A CN202310994325A CN116722342B CN 116722342 B CN116722342 B CN 116722342B CN 202310994325 A CN202310994325 A CN 202310994325A CN 116722342 B CN116722342 B CN 116722342B
- Authority
- CN
- China
- Prior art keywords
- metal
- super
- dielectric substrate
- millimeter wave
- antenna module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001914 filtration Methods 0.000 title claims abstract description 27
- 238000004891 communication Methods 0.000 title claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 155
- 239000002184 metal Substances 0.000 claims abstract description 155
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- 230000008878 coupling Effects 0.000 claims description 29
- 238000010168 coupling process Methods 0.000 claims description 29
- 238000005859 coupling reaction Methods 0.000 claims description 29
- 238000006880 cross-coupling reaction Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000010354 integration Effects 0.000 abstract description 18
- 238000013461 design Methods 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The application is applicable to the technical field of communication, and provides a millimeter wave filtering super-surface antenna module and communication equipment, wherein the millimeter wave filtering super-surface antenna module comprises a first dielectric substrate, a second dielectric substrate, a third dielectric substrate and a fourth dielectric substrate which are sequentially stacked based on an LTCC (low temperature co-fired ceramic) process; metal grounding plates are arranged on the first surface and the second surface of the first dielectric substrate; the filter is arranged on the first dielectric substrate, an output port of the filter is connected with a metal connector, and the metal connector is arranged on the side walls of the first dielectric substrate and the second dielectric substrate; the super-surface antenna comprises a super-surface unit array and a microstrip line feed structure, and the super-surface unit array is arranged on the fourth dielectric substrate. Compared with a single device, the millimeter wave filtering super-surface antenna module is independently built in a system, reduces additional components and circuits, and has the advantages of high integration level and small volume.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to a millimeter wave filtering super-surface antenna module and communication equipment.
Background
With the development of the fifth generation mobile communication technology, millimeter waves play an increasingly important role in short-distance communication due to the advantages of extremely wide bandwidth, short wavelength, easy miniaturization and the like, so that more and more attention is paid to 5G communication, and the millimeter waves have a wide application prospect and are key technologies for 5G key deployment. Compared with the middle-low frequency band, the millimeter wave frequency spectrum resource is more abundant, the broadband working frequency band is easier to provide and divide, and the possibility is provided for meeting the requirements of terminal users with high transmission rate.
Antennas are key components for radiating and receiving energy in modern wireless communication systems, and the performance of the antennas often determines the success or failure of the whole communication system, and with the rapid development of wireless communication technology, the requirements on the size and the electrical performance of the antennas are higher and higher. The super surface is used as a two-dimensional plane structure of the metamaterial, and has the advantages of low profile, simple design, low loss and the like. The super-surface antenna is widely focused in the industry as a novel antenna structure with the characteristics of wider impedance bandwidth, high gain and the like.
The substrate integrated waveguide structure is a novel waveguide structure which is applied more in recent years and is mainly applied to circuits of microwave and millimeter wave frequency bands. The characteristics of low radiation loss and high quality factor of the microstrip line are similar to those of the traditional rectangular waveguide, and the microstrip line has the advantages of easiness in processing, easiness in integration, small volume and the like, so that the microstrip line is widely applied to the microwave and millimeter wave field.
Both filters and antennas are critical components of the rf front-end, they are typically of independent design, are used in systems that require cascading via additional transmission lines, and require additional capacitive-inductive components for device-to-device matching. This approach can take up a large space of the overall system; therefore, how to reduce the volume of the whole system on the premise of ensuring the electrical performance of the device becomes an urgent problem to be solved.
Disclosure of Invention
The embodiment of the application aims to provide a millimeter wave filtering super-surface antenna module which works in a 5G millimeter wave n257 frequency band; the method aims to improve the problem that the radio frequency device (when ensuring the performance of the system) is large in size and difficult to integrate when being integrated in the system.
The embodiment of the application is realized in such a way that a millimeter wave filtering super-surface antenna module comprises:
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the fourth dielectric substrate are sequentially stacked on the basis of an LTCC (low temperature co-fired ceramic) process; metal grounding plates are arranged on the first surface and the second surface of the first dielectric substrate;
the filter is arranged on the first dielectric substrate, an output port of the filter is connected with a metal connector, and the metal connector is arranged on the side walls of the first dielectric substrate and the second dielectric substrate;
the super-surface antenna comprises a super-surface unit array and a microstrip line feed structure, and the super-surface unit array is arranged on the fourth dielectric substrate;
the metal connector is L-shaped, and the width of the metal connector is adjustable so as to realize impedance matching between the filter and the input/output port of the super-surface antenna.
It is another object of an embodiment of the present application to provide a communication device including the millimeter wave filtered super surface antenna module as described above.
According to the millimeter wave filtering super-surface antenna module provided by the embodiment of the application, a super-surface antenna is placed above a filter, two devices share a metal grounding plate at the upper layer of a first dielectric substrate, an output port of the L-shaped metal connector side cascading filter and a feed port (or an input port) of the super-surface antenna are used, and the width of the L-shaped metal connector is adjusted to realize impedance matching among the devices; compared with a single device, the application is independently built in the system, reduces the addition of additional components and additional circuit assistance, and has the advantages of high integration level and small volume.
Drawings
Fig. 1 is a schematic structural diagram of a millimeter wave filtering super-surface antenna module according to an embodiment of the present application;
fig. 2 is a front view of a millimeter wave filtering super-surface antenna module according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a three-dimensional structure of a filter in one embodiment;
FIG. 4 is a top view of a filter in one embodiment;
FIG. 5 is a schematic diagram of a second metal grounding plate according to an embodiment;
FIG. 6 is a schematic diagram of a three-dimensional structure of a subsurface antenna in one embodiment;
FIG. 7 is a side view of a subsurface antenna in one embodiment;
FIG. 8 is a schematic three-dimensional structure of a microstrip line feed structure in one embodiment;
FIG. 9 is a top view of a microstrip feed structure in one embodiment;
fig. 10 is an S-parameter graph of a millimeter wave filtered subsurface antenna module in an embodiment of the application;
FIG. 11 is a graph of Gain (Gain) of a millimeter wave filtered subsurface antenna module in accordance with an embodiment of the present application;
FIG. 12 is an E-plane pattern of a millimeter wave filtered super-surface antenna module in accordance with an embodiment of the present application;
fig. 13 is an H-plane (H-plane) pattern of a millimeter wave filtered super-surface antenna module in accordance with an embodiment of the present application.
In the accompanying drawings: 1-a first dielectric substrate; 2-a second dielectric substrate; 3-a third dielectric substrate; 4-a fourth dielectric substrate; 5-a first metal ground plate; 6-a second metal ground plate; 7-metallizing the through holes; an array of 8-subsurface units; a 9-metal connector; an input port of a 101-filter; 102-an output port of the filter; 103-a first metal cavity; 104-a second metal cavity; 105-a third metal cavity; 106-a fourth metal cavity; 107-cross-coupling structure; 301-microstrip feed lines; 302-metal connection posts; 303-microstrip patch antenna; 304-metal pads.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms unless otherwise specified. These terms are only used to distinguish one element from another element. For example, a first xx element may be referred to as a second xx element, and similarly, a second xx element may be referred to as a first xx element, without departing from the scope of this disclosure.
Specific implementations of the application are described in detail below in connection with specific embodiments.
As shown in fig. 1, a block diagram of a millimeter wave filtering super-surface antenna module according to an embodiment of the present application includes:
the first dielectric substrate 1, the second dielectric substrate 2, the third dielectric substrate 3 and the fourth dielectric substrate 4 are sequentially stacked on the basis of an LTCC (low temperature co-fired ceramic) process; metal grounding plates are arranged on the first surface and the second surface of the first dielectric substrate 1;
the filter is arranged on the first dielectric substrate 1, an output port 102 of the filter is connected with a metal connector 9, and the metal connector 9 is arranged on the side walls of the first dielectric substrate 1 and the second dielectric substrate 2;
the super-surface antenna comprises a super-surface unit array 8 and a microstrip line feed structure, and the super-surface unit array 8 is arranged on the fourth dielectric substrate 4;
the metal connector 9 is far away from one end of the first dielectric substrate 1 and is electrically connected with the microstrip line feed structure, the microstrip line feed structure is coupled and connected with the super-surface unit array 8, the metal connector 9 is in an L shape, the length of the metal connector 9 is one half wavelength, and the width of the metal connector 9 is adjustable so as to realize impedance matching between the filter and an input/output port of the super-surface antenna.
In this embodiment, the frequency band of the millimeter wave filtering super-surface antenna module includes the entire n257 frequency bands, and the frequency band is wide and the gain is better; placing the super-surface antenna above the filter, wherein two devices share a metal grounding plate on the upper layer of the first dielectric substrate 1, and adjusting the width of the L-shaped metal connector 9 to realize impedance matching among the devices by using an output port of the L-shaped metal connector 9 and a feed port (or an input port) of the super-surface antenna; compared with a single device which is independently built in a system, the method reduces the addition of extra components and extra circuit assistance, and has the advantages of high integration level and small volume.
The millimeter wave filtering super-surface antenna module can be applied to a millimeter wave radio frequency antenna with smaller volume and higher gain, adopts a laminated design by using an LTCC technology, so that the volume of the radio frequency module is reduced, and the millimeter wave filtering super-surface antenna module has the advantage of high integration level, wherein the filter adopts a SIW structure, has the advantages of low radiation loss, high quality factor, small volume, easy integration and the like, and the arranged antenna adopts the super-surface structure, has wide impedance bandwidth and high gain, reduces the electric size of the antenna, is easy to process and integrate, and is consistent with the trend of miniaturization and high integration level of future systems; the problems that an existing single device is integrated with an additional component in a radio frequency device, the size is overlarge and the like can be effectively solved. The working frequency range of the module comprises the whole n257 frequency ranges, so that the requirements of modern 5G communication are met; specific performance can be seen in fig. 10-13: s11 < -10dB in the whole n257 frequency band 26.5GHz-29.5GHz is shown in fig. 10, and the maximum gain point of the whole module is 7.8dB as shown in fig. 11. Fig. 12 and 13 show E-plane and H-plane patterns of the module, and it can be seen that the module has excellent electrical performance and meets the design requirements.
In one example of the present embodiment, the first surface and the second surface are the upper surface and the lower surface of the first dielectric substrate 1, and the two metal grounding plates are the first metal grounding plate 5 and the second metal grounding plate 6 respectively; furthermore, the filter shares a metal ground plate, i.e. the second metal ground plate 6, with the super surface antenna.
In an example of this embodiment, the millimeter wave filtering super-surface antenna module has a size of 8.42mm×8.32mm×1.45mm, and can be widely applied to various communication devices such as 5G base stations, and adapts to the trend of miniaturization of radio frequency devices, so that the problems of adding additional components and overlarge volume in a single device in an integrated manner can be effectively solved.
In one example of the present embodiment, the height h1 of the first dielectric substrate 1 is 0.288mm, the height h2 of the second dielectric substrate 2 is 0.48mm, the height h3 of the third dielectric substrate 3 is 0.192mm, and the height h4 of the fourth dielectric substrate 4 is 0.48mm. Because the materials of the medium substrates are the same and the LTCC technology is used, different medium thicknesses can be flexibly set according to design requirements; meanwhile, the LTCC technology can be used for plating silver on the outer side of the whole dielectric substrate, so that isolation between the module and the outside interference is realized. The module adopts the L-shaped metal connector 9 added on the side of the dielectric substrate to connect the filter and the super-surface antenna, thereby further promoting the miniaturization design of the module; the super surface is a two-dimensional planar structure of the metamaterial, has the advantages of low profile, simple design, low loss and the like, and can be mutually promoted with the side coupling design of the metal connector 9.
As shown in fig. 1 to fig. 4, in one example of the present embodiment, the filter is a SIW filter, and the SIW filter includes a first metal cavity 103, a second metal cavity 104, a third metal cavity 105, and a fourth metal cavity 106; the metallized through holes 7 are arranged in the first metal grounding plate 5 and the second metal grounding plate 6 according to a certain rule to form four metal cavities or middle cavity structures, coupling windows are arranged between the metal cavities or middle cavity structures, the size of the coupling windows of the metal cavities is flexibly set according to the coupling strength of the metal cavities, and the example is not limited to the above.
In one example of the present embodiment, the dielectric constants of the first dielectric substrate 1, the second dielectric substrate 2, the third dielectric substrate 3, and the fourth dielectric substrate 4 are all 5.9, and the loss tangent is 0.0009;
for example: for each dielectric substrate, ferro-A6M material having a dielectric constant of 5.9 and a loss tangent of 0.0009; the Ferro-A6M material has the advantage that the LTCC process can be used, the stacked design can be adopted, and the volume of the module is reduced.
As shown in fig. 1 and 3, in one example of the present embodiment, the filter includes four cavity structures formed by a plurality of metallized through holes 7 arranged in the first dielectric substrate 1, and coupling windows are disposed between adjacent cavity structures.
In one example of the present embodiment, the four middle cavity structures are a first metal cavity 103, a second metal cavity 104, a third metal cavity 105, and a fourth metal cavity 106, respectively; simultaneously, gaps are arranged at two ends of the first metal grounding plate 5 to form an input port 101 of the filter and an output port 102 of the filter;
as shown in fig. 4, in this embodiment, the width of the coupling window between the second metal cavity and the third metal cavity is the same as the width of the coupling window between the fourth metal cavity and the first metal cavity, the width of the coupling window between the first metal cavity and the second metal cavity is greater than the width of the coupling window between the third metal cavity and the fourth metal cavity, and the width of the coupling window between the third metal cavity and the fourth metal cavity is greater than the width of the coupling window between the second metal cavity and the third metal cavity. Different coupling window widths are set, different coupling coefficients can be limited, so that the overall loss and gain of the module meet the design requirements, and the module has the advantages of low radiation loss, high quality factor, small volume, easiness in integration and the like.
In one example of the present embodiment, it is preferable that the width L12 of the coupling window between the first metal cavity 103 and the second metal cavity 104 is 1.5mm, the width L23 of the coupling window between the second metal cavity 104 and the third metal cavity 105 is 1.419mm, the width L34 of the coupling window between the third metal cavity 105 and the fourth metal cavity 106 is 1.48mm, and the width L41 of the coupling window between the first metal cavity 103 and the fourth metal cavity 106 is 1.419mm.
The length L1 of the coupling cavity is 3.005mm, the widths of the first metal cavity 103 and the second metal cavity 104 are 2.96mm, and the widths of the third metal cavity 105 and the fourth metal cavity 106 are 2.85mm.
In general, the thickness of a unit laminated layer of the LTCC process can be set to be 0.01mm, and the width, the height and the like of a coupling window can be flexibly limited during processing; the thickness of the metal connector 9 of the cascade filter and the super surface antenna is 0.01mm, but is not limited thereto.
As shown in fig. 3, in one embodiment, a cross-coupling structure 107 is disposed at a coupling window between the first metal cavity 103 and the second metal cavity 104, where the cross-coupling structure 107 is used to increase a transmission zero to improve the out-of-band rejection performance of the filter.
In one embodiment, as shown in fig. 5, the cross-coupling structure 107 is an S-shaped slot etched on the metal ground plate of the first surface of the first dielectric substrate 1, and the slot line width ds of the S-shaped slot is 0.1mm.
In this embodiment, the zero point position can be adjusted by adjusting the width ws and the length Ls of the S-shaped groove, so as to meet more various design requirements.
As shown in fig. 1, in one embodiment, the super surface unit array 8 includes a plurality of metal patches arranged in an array;
for example: a6 x 6 metal patch, a6 x 8 metal patch, a 7 x 7 metal patch, an 8 x 8 metal patch, or the like, the present example can find the maximum value of the antenna gain by adjusting the distance between the super surface and the feed antenna (i.e., the coupling pitch of the super surface element array 8 and the microstrip line feed structure). The position and impedance bandwidth of the resonance point can be changed by adjusting the length of the metal patches and the distance between the metal patches, so that the frequency spectrum resources applied to the millimeter wave antenna are more abundant.
As shown in fig. 5, in one embodiment, the input port 101 and the output port of the filter adopt a coplanar waveguide structure to realize impedance matching.
In the embodiment, a coplanar waveguide structure is adopted for feeding, so that impedance matching of ports is realized, the width of the ports can be adjusted, the impedance of the ports can be adjusted, the width wp of the input/output ports of the filter is 1.2mm, and the length lp can be flexibly set according to the impedance matching; for example, it is possible to: the input port 101 and the output port (or called the input port 101 of the filter and the output port 102 of the filter) of the filter are formed by printing microstrip lines based on an LTCC process, and the shapes of the microstrip lines include but are not limited to rectangle, bar, ladder-shaped strip and the like; the S-shaped cross coupling structure 107 is etched on the metal grounding plate matched with the center positions of the input microstrip line and the output microstrip line, and is used for increasing transmission zero points to improve the out-of-band rejection performance of the filter, and the position of the zero points can be adjusted by adjusting the specification of the S-shaped grooves.
As shown in fig. 6-9, in one embodiment, the microstrip line feed structure includes a microstrip patch antenna 303, a microstrip feed 301;
the microstrip patch antenna 303 is disposed on the third dielectric substrate 3 and opposite to the super surface unit array 8, one end of the microstrip feeder 301 is connected to the metal connector 9, and the other end of the microstrip feeder 301 extends to and is connected with the microstrip patch antenna 303.
In one example of this embodiment, a connection portion is disposed at an end of the microstrip feed line 301 extending to the microstrip patch antenna 303, and the connection portion is connected to a metal connection post 302, where the metal connection post 302 penetrates through the third dielectric substrate 3 and is electrically connected to a specified position of the microstrip patch antenna 303.
In this example, the connection portion may be a metal pad 304 welded to an end portion of the microstrip feed line 301, and a metal connection post 302 connected to the metal pad 304, where the metal connection post 302 penetrates through the third dielectric substrate 3 and is electrically connected to a specified position of the microstrip patch antenna 303.
The metal pads 304 may be in a circular structure, a square structure, or a circular ring structure, and when a circular ring structure is preferred, the corresponding metal connecting posts 302 may also be in a tubular structure, similar to the metallized through holes 7.
As shown in fig. 9, in an example of an embodiment, the width Lp1 of the microstrip patch antenna 303, the radius R of the metal connection post 302, and the length Lk1 and the width Wk1 of the microstrip feeder 301 may be defined as required, so as to satisfy impedance matching of the input/output ports of the ultra-surface antenna and the filter.
In one embodiment, the dielectric constants of the first dielectric substrate 1, the second dielectric substrate 2, the third dielectric substrate 3 and the fourth dielectric substrate 4 are 5.9, the loss tangent is 0.0009, and the material used is Ferro-A6M; the metallic ground plate, the metallized through holes 7, the half wavelength metallic connector 9, the microstrip patch antenna 303, and the metallic patch of the 6 x 6 super surface structure (i.e., the super surface unit array 8) are silver.
In an example of an embodiment, the designated location of the microstrip patch antenna 303 is configured to: the microstrip patch antenna 303 may be a rectangular patch disposed on the third dielectric substrate 3, the microstrip patch antenna 303 is fed by using a microstrip feeder 301, a metal pad 304 is added at the end of the microstrip feeder 301, and the rectangular patch is fed by loading a metal connecting post 302 to connect with a 50 Ω position of the rectangular patch load, so as to better realize impedance matching.
In this embodiment, the width of the microstrip feeder 301 is adjusted to adjust the impedance matching of the antenna, but an impedance transformer is often added to achieve the impedance matching of the antenna, the microstrip patch antenna 303 is fed by using the metal connecting post 302, a place with the impedance of 50Ω is found on the microstrip patch antenna 303, and then the microstrip patch antenna is connected to the microstrip feeder 301 through the metal connecting post 302, so that the design of the impedance transformer can be omitted, and the size of the antenna is reduced.
As shown in fig. 3 and 4, in an example of an embodiment, a notch is provided at a position where the metal ground plate is opposite to the metal connector 9, and the notch can isolate the metal ground plate from the metal connector 9.
Specifically, a notch is disposed at a side edge of the second metal grounding plate 6, one end of the metal connector 9 is connected to the output port of the filter on the first metal grounding plate 5, and the other end of the metal connector is connected to the microstrip feeder 301 beyond the notch.
In this embodiment, the dielectric substrate material uses LTCC (low temperature co-fired ceramic) technology, silver can be plated on the outer side of the entire dielectric substrate, and the module connects the filter and the ultra-surface antenna by adding an L-shaped metal connector 9 on the side of the dielectric substrate. A notch or a rectangular groove is arranged on one side, close to the metal connector 9, of the upper metal grounding plate of the filter and is used for isolating the upper metal grounding plate from the metal connector 9 on the side;
in another embodiment, a communication device is provided that includes a millimeter wave filtered subsurface antenna module as described above.
The filtering super-surface antenna module includes:
the first dielectric substrate 1, the second dielectric substrate 2, the third dielectric substrate 3 and the fourth dielectric substrate 4 are sequentially stacked on the basis of an LTCC (low temperature co-fired ceramic) process; metal grounding plates are arranged on the first surface and the second surface of the first dielectric substrate 1;
the filter is arranged on the first dielectric substrate 1, an output port 102 of the filter is connected with a metal connector 9, and the metal connector 9 is arranged on the side walls of the first dielectric substrate 1 and the second dielectric substrate 2;
the super-surface antenna comprises a super-surface unit array 8 and a microstrip line feed structure, and the super-surface unit array 8 is arranged on the fourth dielectric substrate 4;
the metal connector 9 is far away from one end of the first dielectric substrate 1 and is electrically connected with the microstrip line feed structure, the microstrip line feed structure is coupled and connected with the super-surface unit array 8, the metal connector 9 is in an L shape, the length of the metal connector 9 is one half wavelength, and the width of the metal connector 9 is adjustable so as to realize impedance matching between the filter and an input/output port of the super-surface antenna.
In the communication device of this embodiment, the millimeter wave filtering super-surface antenna module uses LTCC technology, and adopts a stacked design, so that the volume of the radio frequency module is reduced, and the communication device has the advantage of high integration level, and the filter adopts a SIW structure, and has the advantages of low radiation loss, high quality factor, small volume, easy integration, and the like. The working frequency range of the module comprises the whole n257 frequency ranges, so that the requirements of modern 5G communication are met; therefore, the communication equipment has excellent performance and can be applied to 5G communication, in particular to a communication band contained in an n257 frequency band.
In this embodiment, the millimeter wave filtering super-surface antenna module is not necessarily provided with four layers of dielectric substrates, and may also be provided with a multi-layer circuit board (PCB board), where the multi-layer circuit board may apply LTCC technology, and adopts a laminated design, so as to facilitate implementation of multi-layer three-dimensional antenna layout, so that the millimeter wave filtering super-surface antenna module has a small volume, and has the advantages of high integration level, low insertion loss, and high performance, and may be widely applied to various communication devices such as 5G base stations, especially n257 frequency bands, and adapts to the trend of miniaturization of electronic devices of the communication devices.
In one example of this embodiment, taking the size of the whole module (length l×width w×height as shown in fig. 9) as an example of 8.42mm×8.32mm×1.45mm, the module includes a filter of SIW structure, a microstrip patch antenna 303, a super surface antenna of 6×6 metal patch, and a metal connector 9; the module operates in the n257 band, as shown in fig. 10, with S11 < -10dB throughout the n257 band at 26.5GHz-29.5GHz, and the maximum gain point for the whole module is 7.8dB, as shown in fig. 11. Fig. 12 and 13 show E-plane and H-plane patterns of the module.
Above-mentioned, millimeter wave filtering super surface antenna module, compare in original single device and carry out the integration in the system, cascade the module that constitutes whole with super surface antenna and wave filter through the range upon range of, wherein the wave filter adopts the SIW wave filter, in 5G frequency channel, SIW wave filter structure in-band interpolation damage, ripple and out-of-band suppression are good, and easy integration with other devices, antenna part adopts super surface structure, impedance bandwidth is wide, the gain is high, reduce the electric size of antenna, easy processing, easy integration, it is identical with the trend of future system miniaturization and high integration level. The module is used for integration in the system, so that the addition of extra components and extra circuit assistance are reduced, and the volume of the system is reduced; meanwhile, the millimeter wave filtering super-surface antenna module in the embodiment of the application has the advantages that the matching of single devices is finished, and when the millimeter wave filtering super-surface antenna module is integrated in a system, the additional adjustment matching is not needed, so that the workload is greatly reduced. The method can be widely applied to various communication equipment such as a 5G base station, is suitable for the trend of miniaturization of radio frequency devices, and can effectively solve the problems of overlarge integrated volume of a traditional single device in a system, need to readjust matching among devices and the like. Providing further support for the large-scale layout 5G; besides being applicable to 5G base station equipment, the embodiment of the application is also applicable to multiple new generation information technology peer equipment.
The embodiment of the application provides a millimeter wave filtering super-surface antenna module, and provides communication equipment based on the millimeter wave filtering super-surface antenna module, wherein the millimeter wave filtering super-surface antenna module adopts an LTCC (low temperature co-fired ceramic) process design, so that the whole structure is small in size and has the advantages of high integration level, low insertion loss and high gain, a SIW (silicon-based) filter is adopted as a filter, the SIW filter is well suppressed in band insertion loss, ripple and out-of-band in a 5G frequency band, the SIW filter is easy to integrate with other devices, the antenna part adopts a super-surface structure, the impedance bandwidth is wide, the gain is high, the electric size of the antenna is reduced, the antenna is easy to process and integrate, and the antenna module is consistent with the trend of miniaturization and high integration level of future systems.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (10)
1. A millimeter wave filtered super-surface antenna module, the millimeter wave filtered super-surface antenna module comprising:
the first dielectric substrate, the second dielectric substrate, the third dielectric substrate and the fourth dielectric substrate are sequentially stacked on the basis of an LTCC (low temperature co-fired ceramic) process; metal grounding plates are arranged on the first surface and the second surface of the first dielectric substrate;
the filter is arranged on the first dielectric substrate, an output port of the filter is connected with a metal connector, and the metal connector is arranged on the side walls of the first dielectric substrate and the second dielectric substrate;
the super-surface antenna comprises a super-surface unit array and a microstrip line feed structure, and the super-surface unit array is arranged on the fourth dielectric substrate;
the metal connector is L-shaped, and the width of the metal connector is adjustable so as to realize impedance matching between the filter and the input/output port of the super-surface antenna.
2. The millimeter wave filtered super-surface antenna module of claim 1, wherein the filter comprises four cavity structures formed by a plurality of metallized through holes arranged in the first dielectric substrate, and coupling windows are arranged between adjacent cavity structures.
3. The millimeter wave filtered super-surface antenna module of claim 2, wherein the four middle cavity structures are a first metal cavity, a second metal cavity, a third metal cavity, a fourth metal cavity, respectively;
the width of the coupling window between the second metal cavity and the third metal cavity is the same as the width of the coupling window between the fourth metal cavity and the first metal cavity, the width of the coupling window between the first metal cavity and the second metal cavity is larger than the width of the coupling window between the third metal cavity and the fourth metal cavity, and the width of the coupling window between the third metal cavity and the fourth metal cavity is larger than the width of the coupling window between the second metal cavity and the third metal cavity.
4. A millimeter wave filtered super-surface antenna module according to claim 3, characterised in that a cross-coupling structure is provided at the coupling window between the first and second metal cavities for increasing the transmission zero to improve the out-of-band rejection performance of the filter.
5. The millimeter wave filtered super-surface antenna module of claim 4, wherein said cross-coupling structure is an S-shaped slot etched in a metallic ground plane of a first surface of said first dielectric substrate.
6. The millimeter wave filtered subsurface antenna module as recited in claim 1, wherein the dielectric constants of the first, second, third and fourth dielectric substrates are all 5.9 and the loss tangent is 0.0009;
the super-surface unit array comprises a plurality of metal patches arranged in an array;
the input port and the output port of the filter adopt coplanar waveguide structures so as to realize impedance matching.
7. The millimeter wave filtered super-surface antenna module of claim 1, wherein said microstrip line feed structure comprises a microstrip patch antenna, a microstrip feed line;
the microstrip patch antenna is arranged on the third dielectric substrate and is opposite to the super-surface unit array, one end of the microstrip feeder is connected with the metal connector, and the other end of the microstrip feeder extends to the microstrip patch antenna and is connected with the microstrip patch antenna.
8. The millimeter wave filtering super-surface antenna module according to claim 7, wherein a connecting portion is provided at an end of the microstrip feed line extending to the microstrip patch antenna, the connecting portion is connected with a metal connecting post, and the metal connecting post penetrates through the third dielectric substrate and is electrically connected with a designated position of the microstrip patch antenna.
9. The millimeter wave filtered super surface antenna module according to claim 1, wherein a position of said metal ground plate opposite to said metal connector is provided with a notch capable of isolating said metal ground plate from said metal connector.
10. A communication device comprising a millimeter wave filtered super surface antenna module as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310994325.5A CN116722342B (en) | 2023-08-09 | 2023-08-09 | Millimeter wave filtering super-surface antenna module and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310994325.5A CN116722342B (en) | 2023-08-09 | 2023-08-09 | Millimeter wave filtering super-surface antenna module and communication equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116722342A CN116722342A (en) | 2023-09-08 |
| CN116722342B true CN116722342B (en) | 2023-10-10 |
Family
ID=87868250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310994325.5A Active CN116722342B (en) | 2023-08-09 | 2023-08-09 | Millimeter wave filtering super-surface antenna module and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116722342B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127977A (en) * | 1996-11-08 | 2000-10-03 | Cohen; Nathan | Microstrip patch antenna with fractal structure |
| CN202121063U (en) * | 2011-04-26 | 2012-01-18 | 肖丙刚 | Ultra wide band microstrip antenna based on complementary split ring resonator for realizing suppressing harmonic wave |
| EP3179634A1 (en) * | 2015-12-11 | 2017-06-14 | Alcatel- Lucent Shanghai Bell Co., Ltd | A radiating/receiving element for a compact multiband antenna |
| KR20180006811A (en) * | 2016-07-11 | 2018-01-19 | (주)탑중앙연구소 | Microstrip stacked patch antenna |
| CN110233342A (en) * | 2019-06-24 | 2019-09-13 | 西安空间无线电技术研究所 | A kind of complex impedance matching circular polarisation filter antenna |
| CN110444878A (en) * | 2019-08-23 | 2019-11-12 | 华南理工大学 | A kind of filtering paster antenna with CT coupled structure |
| CN112086754A (en) * | 2020-09-14 | 2020-12-15 | 电子科技大学 | Low-profile filtering antenna based on super-surface structure |
| CN112332087A (en) * | 2020-10-29 | 2021-02-05 | 杭州电子科技大学 | Differential feed circular polarization filtering antenna based on super surface structure |
| CN113809518A (en) * | 2021-08-09 | 2021-12-17 | 杭州电子科技大学 | Microwave and millimeter wave large-frequency ratio common-aperture antenna with high isolation |
| WO2023087984A1 (en) * | 2021-11-19 | 2023-05-25 | 南京邮电大学 | Novel metasurface unit-based h-plane siw horn antenna |
-
2023
- 2023-08-09 CN CN202310994325.5A patent/CN116722342B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6127977A (en) * | 1996-11-08 | 2000-10-03 | Cohen; Nathan | Microstrip patch antenna with fractal structure |
| CN202121063U (en) * | 2011-04-26 | 2012-01-18 | 肖丙刚 | Ultra wide band microstrip antenna based on complementary split ring resonator for realizing suppressing harmonic wave |
| EP3179634A1 (en) * | 2015-12-11 | 2017-06-14 | Alcatel- Lucent Shanghai Bell Co., Ltd | A radiating/receiving element for a compact multiband antenna |
| KR20180006811A (en) * | 2016-07-11 | 2018-01-19 | (주)탑중앙연구소 | Microstrip stacked patch antenna |
| CN110233342A (en) * | 2019-06-24 | 2019-09-13 | 西安空间无线电技术研究所 | A kind of complex impedance matching circular polarisation filter antenna |
| CN110444878A (en) * | 2019-08-23 | 2019-11-12 | 华南理工大学 | A kind of filtering paster antenna with CT coupled structure |
| CN112086754A (en) * | 2020-09-14 | 2020-12-15 | 电子科技大学 | Low-profile filtering antenna based on super-surface structure |
| CN112332087A (en) * | 2020-10-29 | 2021-02-05 | 杭州电子科技大学 | Differential feed circular polarization filtering antenna based on super surface structure |
| CN113809518A (en) * | 2021-08-09 | 2021-12-17 | 杭州电子科技大学 | Microwave and millimeter wave large-frequency ratio common-aperture antenna with high isolation |
| WO2023087984A1 (en) * | 2021-11-19 | 2023-05-25 | 南京邮电大学 | Novel metasurface unit-based h-plane siw horn antenna |
Non-Patent Citations (3)
| Title |
|---|
| Li, Wenxing.A High Selectivity, Miniaturized, Low Profile Dual-Band Bandpass FSS with a Controllable Transmission Zero.《INTERNATIONAL JOURNAL OF ANTENNAS AND PROPAGATION》.2017,全文. * |
| 代天瑶 ; .超宽带滤波天线研究与设计.电子科技.2018,(12),全文. * |
| 王璐.基于超表面的宽带滤波天线设计.《山西大学学报》.2023,全文. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116722342A (en) | 2023-09-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2979323B1 (en) | A siw antenna arrangement | |
| CN113054425B (en) | Millimeter wave dual-frequency dual-polarization filtering antenna | |
| CN109037923B (en) | Millimeter wave broadband filter antenna and MIMO antenna array formed by same | |
| CN109742525B (en) | Filtering antenna | |
| US20080284670A1 (en) | Wide-band slot antenna apparatus with stop band | |
| CN109273835B (en) | Large-frequency-ratio common-caliber antenna based on structural multiplexing | |
| CN109672019B (en) | Terminal MIMO antenna device and method for realizing antenna signal transmission | |
| CN107946752B (en) | Substrate integrated gap waveguide electromagnetic dipole antenna | |
| CN109462000B (en) | Multi-layer substrate integrated waveguide third-order filtering power divider | |
| US7642981B2 (en) | Wide-band slot antenna apparatus with constant beam width | |
| EP2403053B1 (en) | Coupling mechanism for a PCB mounted microwave re-entrant resonant cavity | |
| CN108428998B (en) | Millimeter wave dielectric resonator MIMO antenna applied to 5G mobile communication | |
| CN113675602B (en) | Antenna module, preparation method thereof and terminal | |
| CN116759779B (en) | 5G millimeter wave filtering power division module | |
| KR102521291B1 (en) | Radiation amplifiers, radiation systems and radio devices in radio devices | |
| CN112542703A (en) | 5G millimeter wave resonator antenna module | |
| CN116722342B (en) | Millimeter wave filtering super-surface antenna module and communication equipment | |
| CN109802225B (en) | Microstrip filter antenna | |
| CN107834137B (en) | Duplexer and transceiving shared millimeter wave array antenna | |
| CN110649380A (en) | Millimeter wave broadband filtering antenna | |
| CN110581354A (en) | Dual-polarization 5G millimeter wave antenna structure and mobile device | |
| CN113690621B (en) | Miniaturized high efficiency bluetooth antenna based on multilayer PCB board | |
| CN111697321B (en) | Filter antenna based on half-mode substrate integrated waveguide structure | |
| CN113851845A (en) | Integrated filtering duplex antenna for inhibiting in-band signal | |
| CN111564683A (en) | Substrate integrated waveguide filter combining one-eighth mode and one-fourth mode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |