CN116454076A - LED lamp bead with composite plate type integrated bracket and preparation method thereof - Google Patents
LED lamp bead with composite plate type integrated bracket and preparation method thereof Download PDFInfo
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- CN116454076A CN116454076A CN202310467058.6A CN202310467058A CN116454076A CN 116454076 A CN116454076 A CN 116454076A CN 202310467058 A CN202310467058 A CN 202310467058A CN 116454076 A CN116454076 A CN 116454076A
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- led lamp
- mounting cavity
- emitting chip
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- 239000011324 bead Substances 0.000 title claims abstract description 139
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 29
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- 238000004806 packaging method and process Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses an LED lamp bead with a composite plate type integrated bracket and a preparation method thereof, wherein at least two layers of composite plates are fixedly connected and combined through a composite technology to form the lamp bead bracket with an integrated structure, the middle part of an upper layer of substrate forms a mounting cavity by a hollowed-out groove, the upper surface of a lower layer of substrate is provided with an etching circuit, a light-emitting element and a driving chip are fixedly communicated to the etching circuit in the mounting cavity, and a bonding pad is arranged on the bottom surface of the lower layer of substrate; the production process is simplified, and the conductivity is stable and reliable; the glue injection layer in the mounting cavity is not easy to delaminate even if thermally expanded under the high temperature condition, and gold wires and ball-planting welding points connected with the light-emitting chip and the driving chip and the circuit board are not disconnected; the thickness can reach 0.5mm, and the cost investment of raw materials and production equipment is low; the lamp bead circuit design scheme is convenient to change. The advantages of the Chip type lamp beads and the Top type lamp beads are combined, and meanwhile the defects of the Chip type lamp beads and the Top type lamp beads are avoided.
Description
Technical Field
The invention belongs to the technical field of manufacturing of LED display screens, and particularly relates to an LED lamp bead with a composite plate type integrated bracket and a preparation method thereof.
Background
In the prior art, a Chip type LED lamp bead or a Top type LED lamp bead is generally adopted in an LED display screen, and the Top type LED lamp bead is generally adopted in the LED display screen
The structure of the Chip type LED lamp beads is characterized in that a plurality of bonding pads are arranged on the bottom surface of a bottom PCB substrate, a light-emitting Chip and a control Chip are fixedly arranged on the top surface of the PCB substrate, the LED lamp beads are formed by packaging an upper laminated plastic film, a plurality of groups of light-emitting chips and control chips are fixed at a plurality of lamp bead positions on a large-area PCB substrate in the mass production process, a transparent adhesive film is compression molded on the surface of the PCB substrate, and then the LED lamp beads are cut into a plurality of LED lamp beads; the PCB substrate has simple process and low price, the positions and the shapes of the light-emitting chip, the control chip and the bonding pad can be set arbitrarily, the modification operation is convenient, and the cost is low; and has the advantages of good weldability, high temperature resistance, capability of being welded by ferrochrome, small thickness and the like, and the minimum thickness can be 0.5mm. However, the light emitting Chip and the control Chip of each Chip type LED lamp bead are required to be connected to the bonding pad through a plurality of metal fixing ribs and pin wires; the lamp pearl work in-process can generate heat, and the glued membrane can expand after being heated, causes that last glued membrane and lower floor's base plate can produce layering, break away from and misplacement, and metal solid muscle, pin walk line and plant ball solder joint fine very thin, easily break through because of glued membrane layering, break away from and misplacement, cause lamp pearl to lack normal work such as look, and stable reliability performance is not good.
The structure of the Top type LED lamp beads is that a plurality of lamp bead metal circuits are formed after materials are removed by punching and shearing on a large-area sheet, a plastic shell is integrally injection-molded and packaged at each lamp bead position, a concave cup body is formed at each lamp bead position, a light-emitting chip and a control chip are welded and connected on the metal circuits through metal fixing ribs and pin wires in the cup body, the cup body is packaged through dispensing, and finally after punching and cutting, pins are bent and molded to the lower part of the plastic shell, so that a plurality of lamp beads are formed. However, the pins are subjected to multiple procedures such as punching shear, molding, injection molding, bending and the like in the production process, so that the process is complex and the operation is complex; the cost of one stamping die is hundreds of thousands, the die price is high, and the cost of the prior equipment is high; after the die is opened and shaped, in the process of product research and development and die design and manufacturing, a small error or small structure adjustment can lead to the fact that the die cannot be improved and can only be scrapped, the die must be opened again, the requirement on primary design and shaping of the prior design is very high, the line design scheme cannot be changed after shaping, the requirement on the precision of production equipment is high, and the investment of production equipment and production cost is quite large; the nylon material on the surface of the injection molding and the injection molding is not good in heat resistance, the temperature resistance is not more than 300 ℃, the nylon material can be melted when the temperature reaches more than 200 ℃, the heat gun is easy to blow and damage during replacement and maintenance, or the ferrochrome Gao Wenye easy-to-bake nylon material shell is not welded, and the operability is not good; and the Top type LED lamp beads are limited by structural characteristics, the thickness of the Top type LED lamp beads is usually more than 1mm, and the occupied space is large.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide an LED lamp bead with a composite plate type integrated bracket and a preparation method thereof, which can have the advantages of both Chip type LED lamp beads and Top type LED lamp beads and simultaneously discard the defects of the Chip type LED lamp beads and the Top type LED lamp beads.
The technical scheme adopted by the invention is as follows:
the LED lamp bead comprises a lamp bead support, a welding disc and a light-emitting element, wherein the lamp bead support is an integrated composite plate structure formed by fixedly connecting and combining at least two layers of substrates through a composite process, an upper substrate is provided with a mounting cavity formed by a hollowed-out groove, an etching circuit is arranged on the upper surface of a lower substrate at a position corresponding to the mounting cavity, and the light-emitting element is arranged in the mounting cavity and is electrically connected to the etching circuit; the bonding pads are arranged on the top surface, the bottom surface and/or the side surfaces of the lamp bead bracket, connecting through holes are formed in the upper substrate and the lower substrate except for the mounting cavity in a penetrating manner, and pins of the etched circuit are connected to the bonding pads through the connecting through holes; and the mounting cavity is internally packaged and filled with an glue injection layer.
Further, the upper substrate is a hollow fiber board or an etched circuit board, the lower substrate is an etched circuit board, and the upper substrate and the lower substrate are pressed together through a high-temperature pressing process to form a lamp bead bracket with an integral structure; and a driving chip is also arranged in the mounting cavity and is also electrically connected to the etching circuit.
Further, the cross sections of the upper substrate, the lower substrate and the mounting cavity are all in regular geometric shapes, and the cross section area of the mounting cavity is smaller than 3/4 of the rectangular area of the upper substrate.
Further, the upper substrate and the lower substrate are both rectangular structures, and at least three bonding pads are arranged at four corners of the bottom surface of the lower substrate; the mounting cavity is arranged in the middle of the upper substrate, the mounting cavity is round, and four connecting through holes are formed in the four corners of the upper substrate and the lower substrate; the light-emitting element and the driving chip are fixedly connected to the etching circuit through gold wires and ball-planting welding points, and the light-emitting element comprises at least one light-emitting chip.
Further, the light-emitting element comprises a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the driving chip are uniformly distributed in the mounting cavity along the circumferential direction.
Still further, the first light emitting chip is a red light emitting chip, the second light emitting chip is a green light emitting chip, and the third light emitting chip is a blue light emitting chip.
Still further, the lateral wall of installation cavity is the conical surface.
Still further, the taper of the mounting cavity side wall is-20 degrees to 20 degrees.
Still further, the lamp pearl support is the PCB circuit board that has more than two-layer structure, according to the order from top to bottom, the installation cavity is by punching shear cutting technology or milling process remove the partial material of the top plate of PCB circuit board and constitute.
Finally, the invention also relates to a preparation method for the LED lamp bead with the composite plate type integrated bracket, which comprises the following steps:
s01, designing a lamp bead circuit according to the use requirement, typesetting and arranging a plurality of lamp bead positions, lamp bead circuits, connecting through holes, mounting cavities and bonding pads in a region range corresponding to the original board area of the whole PCB circuit board;
s02, manufacturing a plurality of lamp bead circuits, connecting through holes and bonding pads on an upper layer plate and/or a lower layer plate of a PCB (printed circuit board) according to a lamp bead circuit design scheme and a typesetting layout scheme, and manufacturing hollowed-out grooves on the upper layer plate to form a mounting cavity;
s03, carrying out composite crimping on the upper layer plate and the lower layer plate through a high-temperature lamination process to form a PCB circuit board with an integral structure;
s04, copper deposition and tin plating are carried out, so that each bonding pad forms a three-dimensional bonding pad through a connecting via hole;
s05, welding the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the driving chip on the lamp bead circuit in the mounting cavity according to a design typesetting layout scheme;
s06, injecting glue into the mounting cavity for packaging;
s07, dividing the PCB circuit board by a punching and cutting milling process according to a design typesetting layout scheme; forming a plurality of LED lamp beads;
s08, light splitting test; through the LED test equipment, electrical performance test is carried out on each LED lamp bead, and qualified LED lamp beads are screened out;
s09, braiding, namely braiding the LED lamp beads which are qualified in test into a material belt according to a uniform direction, and rolling the material belt into a disc to form an LED lamp bead finished product with the composite plate type integrated bracket.
The beneficial effects of the invention are as follows:
the utility model provides a LED lamp pearl with integrative support of compound board formula and preparation method thereof, constitute the lamp pearl support of an organic whole structure by two-layer composite sheet through compound technology fixed connection combination, the middle part of upper substrate constitutes the installation cavity by the fretwork groove, the upper surface of lower floor's base plate sets up etching circuit corresponding to the position of installation cavity, light-emitting component and driver chip are fixed to be linked to etching circuit in the installation cavity, set up the pad in the bottom surface of lower floor's base plate, etching circuit is connected to the pad through the connection via hole. In the specific operation, a hollow fiber board is adopted as an upper substrate, an etched circuit board is adopted as a lower substrate, and the hollow fiber board and the etched circuit board are compounded into a lamp bead bracket with an integral structure through a high-temperature lamination process; the PCB circuit board can be directly used as a lamp bead bracket, an upper layer plate or two upper layer plates of the PCB circuit board are milled and hollowed to form a concave groove type mounting cavity, and a printed circuit of the PCB circuit board is exposed in the mounting cavity so as to be connected and conducted with the light-emitting element and the driving chip through gold wire and ball-planting welding spot; and encapsulating and filling the glue injection layer in the mounting cavity.
According to the LED lamp bead with the composite plate type integrated bracket and the preparation method thereof, the lamp bead circuit adopts the PCB etching circuit, so that the production process is simplified, the requirement of the combination of the light-emitting element and the control element on the variability can be supported, the electrode position can be flexibly set, and the requirement of the die bonding position of various light-emitting chips can be met; the multi-layer composite plate is combined with the connecting through holes penetrating up and down to be communicated with the bottom plane bonding pad, and the multi-layer composite plate can also be used as a three-dimensional bonding pad, so that the electrode is more firmly welded and contacted, is not easy to fall off, and has stable and reliable conductive performance; the mounting cavity is internally packaged and filled with an adhesive injection layer, the adhesive injection layer is not easy to delaminate even if thermally expanded under high temperature conditions, and gold wires and ball-planting welding spots connected with the light-emitting chip and the driving chip and the circuit board are not disconnected, so that the normal working stability of the lamp beads is ensured; the thickness can reach 0.5mm, and the cost investment of raw materials and production equipment is low; the lamp bead circuit design scheme is convenient to change. Meanwhile, the directivity of the light of the lamp beads can be controlled by setting the angle of the side wall of the mounting cavity.
The LED lamp bead with the composite plate type integrated bracket and the preparation method thereof combine the advantages of the Chip type lamp bead and the Top type lamp bead, avoid the defects of the Chip type lamp bead and the Top type lamp bead, and can meet the use requirements of various industries to the greatest extent.
Drawings
Fig. 1 is a schematic perspective view of an LED lamp bead with a composite plate type integral bracket according to a first embodiment of the present invention;
fig. 2 is a schematic view of another perspective view of an LED lamp bead with a composite plate-type integral bracket according to the first embodiment of the present invention;
fig. 3 is an enlarged schematic view of a planar structure of an LED lamp bead with a composite plate-type integral bracket according to the first embodiment of the present invention;
FIG. 4 is a schematic view of the bottom structure of FIG. 3;
FIG. 5 is an enlarged schematic view of the rear view structure of FIG. 3;
fig. 6 is an enlarged schematic diagram of a cross-sectional structure of an LED lamp bead with a composite plate-type integral bracket according to the first embodiment of the present invention;
fig. 7 is an enlarged schematic diagram of a cross-sectional structure of an LED lamp bead with a composite plate-type integral bracket according to a second embodiment of the present invention;
fig. 8 is an enlarged schematic diagram of a cross-sectional structure of an LED lamp bead with a composite plate-type integral bracket according to a third embodiment of the present invention.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
As shown in fig. 1 to 7, in order to solve the common problems in the prior art, the invention provides an LED lamp bead with a composite plate type integral bracket and a preparation method thereof, and the integral planning scheme is as follows: firstly, according to the necessary components of the conventional structure of the LED lamp bead, a lamp bead bracket, a bonding pad 9, a light-emitting element 10 and a driving chip 4 are used as the main structure of the LED lamp bead with a composite plate type integrated bracket; the lamp bead bracket adopts an integrated structure formed by fixedly connecting and combining at least two layers of composite boards through a composite technology, wherein an upper substrate 5 is arranged to form a mounting cavity through a hollow groove, an etching circuit is arranged on the upper surface of a lower substrate 6 corresponding to the position of the mounting cavity, and a light-emitting element and a driving chip are arranged in the mounting cavity and fixedly connected to the etching circuit through gold wires and ball-planting welding points in a conductive manner, so that the electrical connection and control connection of the light-emitting element and the driving chip are realized. The bonding pad 9 is arranged on the bottom surface of the lamp bead bracket and is close to the edge, one or more connecting through holes 7 are arranged at any position except the mounting cavity on the upper substrate 5 and the lower substrate 6 in a penetrating way, and pins of the etched circuit are connected to the bonding pad 9 through the connecting through holes 7, so that a three-dimensional bonding pad structure can be formed; after the light-emitting element and the driving chip are fixedly installed and connected in the installation cavity, the installation cavity is internally packaged and filled with the glue injection layer 8, and the protection function is provided through the glue injection layer.
The bonding pad 9 can be arranged on the top surface, the bottom surface or the side surface of the lamp bead support of the integrated structure at will, and can be arranged on the top surface, the bottom surface and the side surface of the lamp bead support of the integrated structure at the same time according to the actual use requirement, so that the bonding pad position combination has strong adaptability.
Further, as one of the preferred schemes, the upper substrate 5 may be a hollow fiber board or an etched circuit board structure, and the lower substrate 6 may be an etched circuit board structure, and the hollow fiber board and the etched circuit board are pressed together to form the lamp bead bracket with an integral structure through a high-temperature pressing process.
Furthermore, the lamp bead bracket can also directly adopt a PCB circuit board structure with more than two layers of structures, and the production and manufacturing process of the PCB circuit board is a mature technology, so that the cost investment of the production process and the production equipment can be saved. The first layer board of the PCB circuit board with a two-layer structure is an upper layer board, namely an upper layer substrate 5, and the second layer board of the PCB circuit board is a lower layer board, namely a lower layer substrate 6; if the PCB circuit board is more than two layers, the upper insulating board of the PCB circuit board is an upper layer board, namely an upper substrate 5, and the multi-layer board with the conductive circuits jointly forms a lower substrate 6.
And removing part of materials of the upper layer plate of the PCB circuit board to form the mounting cavity through a punching and cutting process or a milling process according to the sequence from top to bottom.
Further, the cross sections of the upper substrate 5, the lower substrate 6, the bonding pads 9 and the mounting cavity are all regular geometric shapes, and specifically, the same or different geometric shapes such as rectangular, circular and the like can be respectively set according to the use requirements.
And the sectional area of the mounting cavity is set to be smaller than 3/4 of the rectangular area of the upper substrate so as to ensure the mechanical support strength and stability of the lamp bead bracket.
Further, according to the conventional structural characteristics in the industry, the upper substrate 5 and the lower substrate 6 are both arranged into rectangular structures, and four rectangular bonding pads 9 are arranged at four corners of the bottom surface of the lower substrate 6; the mounting cavity is arranged in the middle of the upper substrate 5, and is of a circular structure; four connecting through holes 7 are arranged at four corners of the upper substrate 5 and the lower substrate 6, and the etched circuit is connected to four bonding pads 9 on the bottom surface through the four connecting through holes 7; the light emitting element 10 and the driving chip 4 are fixedly connected to the etched circuit by gold wires and ball-implant bonding points.
The light-emitting element 10 is formed by combining the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3, wherein the first light-emitting chip 1, the second light-emitting chip 2, the third light-emitting chip 3 and the driving chip 4 are uniformly distributed in the mounting cavity along the circumferential direction, namely, the three light-emitting chips of the first light-emitting chip 1, the second light-emitting chip 2 and the third light-emitting chip 3 are distributed in a delta shape, the driving chip is distributed at the lower middle position of the three light-emitting chips, the layout space is reasonable, and the operation is convenient.
Still further, the first light emitting chip 1 adopts a red light emitting chip, the second light emitting chip 2 adopts a green light emitting chip, the third light emitting chip 3 adopts a blue light emitting chip, the requirement of setting optical three primary colors is met, the working state, the working sequence, the working time parameters and other technological parameters of the three light emitting chips are controlled and driven by the driving chip 4, and various lighting effects can be realized.
The lateral wall in installation chamber can set up to vertical direction, also can set up to interior conical surface to can control the luminous designability of LED lamp pearl according to different user demands.
When the side wall of the installation cavity is an inner conical surface, the specific conical degree range of the inner conical surface of the side wall of the installation cavity is preferably set to be-20 degrees to 20 degrees, and the conical surface with any angle can be adopted according to actual use requirements.
The LED lamp bead with the composite plate type integrated bracket and the preparation method thereof have the advantages that the lamp bead circuit adopts the PCB etching circuit, the manufacturing process of the PCB circuit board belongs to the mature process in the prior art, the production process is simplified, the early production cost and the equipment cost investment are low, the requirement of the combination of the variability of the light-emitting element and the control element can be supported, the electrode position can be flexibly set, and the requirement of the die bonding position of various light-emitting chips can be met; the multi-layer composite plate is combined with the connecting through holes penetrating up and down to be communicated with the bottom plane bonding pad, and the multi-layer composite plate can also be used as a three-dimensional bonding pad, so that the electrode is more firmly welded and contacted, is not easy to fall off, and has stable and reliable conductive performance; the mounting cavity is internally packaged and filled with an adhesive injection layer, the adhesive injection layer is not easy to delaminate even if thermally expanded under high temperature conditions, and gold wires and ball-planting welding spots connected with the light-emitting chip and the driving chip and the circuit board are not disconnected, so that the normal working stability of the lamp beads is ensured; the thickness can reach 0.5mm, and the cost investment of raw materials and production equipment is low; the lamp bead circuit design scheme is convenient to change. Meanwhile, the directivity of the light of the lamp beads can be controlled by setting the angle of the side wall of the mounting cavity.
The LED lamp bead with the composite plate type integrated bracket and the preparation method thereof combine the advantages of the Chip type lamp bead and the Top type lamp bead, avoid the defects of the Chip type lamp bead and the Top type lamp bead, and can meet the use requirements of various industries to the greatest extent.
Embodiment one:
the side wall of the mounting cavity is an inner cylindrical surface, and the straight up and down punching shear cutting production and processing technology is convenient to operate.
Embodiment two:
the side wall of the installation cavity is an inner conical surface, the specific conical degree of the inner conical surface of the side wall of the installation cavity is 20 degrees, and the light condensing effect can be ensured while the light emitting irradiation range of the LED lamp beads is ensured.
Embodiment III:
the side wall of the installation cavity is an inner conical surface, the specific taper of the inner conical surface of the side wall of the installation cavity is-20 degrees, and the luminous specificity can be increased.
Embodiment four:
the preparation method for the LED lamp bead with the composite plate type integrated bracket is provided, and specifically comprises the following steps of:
s01, designing a lamp bead circuit according to the use requirement, typesetting and arranging a plurality of lamp bead positions, lamp bead circuits, connecting through holes, mounting cavities and bonding pads in a region range corresponding to the original board area of the whole PCB circuit board;
s02, manufacturing a plurality of lamp bead circuits, connecting through holes and bonding pads on an upper layer plate and/or a lower layer plate of a PCB circuit board through conventional PCB circuit board production processes such as printing, etching, stamping, routing and drilling according to a lamp bead circuit design scheme and a typesetting layout scheme, and manufacturing hollowed-out grooves serving as mounting cavities on the upper layer plate;
s03, carrying out composite crimping on the upper layer plate and the lower layer plate through a high-temperature lamination process to form a PCB circuit board with an integral structure;
s04, copper deposition and tin plating are carried out, so that each bonding pad forms a three-dimensional bonding pad through a connecting via hole;
s05, welding the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the driving chip on the lamp bead circuit in the mounting cavity according to a design typesetting layout scheme;
s06, injecting glue into the mounting cavity for packaging;
s07, dividing the PCB circuit board by a punching and cutting milling process according to a design typesetting layout scheme; forming a plurality of LED lamp beads;
s08, light splitting test; through the LED test equipment, electrical performance test is carried out on each LED lamp bead, and qualified LED lamp beads are screened out;
s09, braiding, namely braiding the LED lamp beads which are qualified in test into a material belt according to a uniform direction, and rolling the material belt into a disc to form an LED lamp bead finished product with the composite plate type integrated bracket.
The invention relates to an LED lamp bead with a composite plate type integrated bracket and a preparation method thereof, wherein at least two layers of composite plates are fixedly connected and combined through a composite technology to form the lamp bead bracket with an integrated structure, the middle part of an upper layer of substrate forms a mounting cavity through a hollowed-out groove, an etching circuit is arranged on the upper surface of a lower layer of substrate at a position corresponding to the mounting cavity, a light-emitting element and a driving chip are fixedly communicated to the etching circuit in the mounting cavity, a bonding pad is arranged on the bottom surface of the lower layer of substrate, and the etching circuit is connected and conducted to the bonding pad through a connecting via hole. In the specific operation, a hollow fiber board is adopted as an upper substrate, an etched circuit board is adopted as a lower substrate, and the hollow fiber board and the etched circuit board are compounded into a lamp bead bracket with an integral structure through a high-temperature lamination process; the PCB circuit board can be directly used as a lamp bead bracket, an upper layer plate or two upper layer plates of the PCB circuit board are milled and hollowed to form a concave groove type mounting cavity, and a printed circuit of the PCB circuit board is exposed in the mounting cavity so as to be connected and conducted with the light-emitting element and the driving chip through gold wire and ball-planting welding spot; and encapsulating and filling the glue injection layer in the mounting cavity.
According to the LED lamp bead with the composite plate type integrated bracket and the preparation method thereof, the lamp bead circuit adopts the etched circuit or the PCB printed circuit, so that the production process is simplified, the requirement of the combination of the light-emitting element and the control element on the variability can be supported, the electrode position can be flexibly set, and the die bonding position requirement of various light-emitting chips can be met; the multi-layer composite plate is combined with the connecting through holes penetrating up and down to be communicated with the bottom plane bonding pad, and the multi-layer composite plate can also be used as a three-dimensional bonding pad, so that the electrode is more firmly welded and contacted, is not easy to fall off, and has stable and reliable conductive performance; the mounting cavity is internally packaged and filled with an adhesive injection layer, the adhesive injection layer is not easy to delaminate even if thermally expanded under high temperature conditions, and gold wires and ball-planting welding spots connected with the light-emitting chip and the driving chip and the circuit board are not disconnected, so that the normal working stability of the lamp beads is ensured; the thickness can reach 0.5mm, and the cost investment of raw materials and production equipment is low; the lamp bead circuit design scheme is convenient to change. Meanwhile, the directivity of the light of the lamp beads can be controlled by setting the angle of the side wall of the mounting cavity.
The LED lamp bead with the composite plate type integrated bracket and the preparation method thereof combine the advantages of the Chip type lamp bead and the Top type lamp bead, avoid the defects of the Chip type lamp bead and the Top type lamp bead, and can meet the use requirements of various industries to the greatest extent.
The invention is not limited to the above-described alternative embodiments, and any person who may derive other various forms of products in the light of the present invention, however, any changes in shape or structure thereof, all falling within the technical solutions defined in the scope of the claims of the present invention, fall within the scope of protection of the present invention.
Claims (10)
1. LED lamp pearl with integrative support of compound board-like, its characterized in that: the LED lamp comprises a lamp bead support, a welding disc and a light-emitting element, wherein the lamp bead support is an integrated composite plate structure formed by fixedly connecting and combining at least two layers of substrates through a composite process, an installation cavity formed by a hollowed-out groove is formed in an upper layer of substrate, an etching circuit is arranged on the upper surface of a lower layer of substrate at a position corresponding to the installation cavity, and the light-emitting element is arranged in the installation cavity and is electrically and fixedly connected to the etching circuit; the bonding pads are arranged on the top surface, the bottom surface and/or the side surfaces of the lamp bead bracket; connecting through holes are formed in the upper substrate and the lower substrate in a penetrating mode except for the mounting cavity, and pins of the etched circuit are connected to the bonding pads through the connecting through holes; and the mounting cavity is internally packaged and filled with an glue injection layer.
2. The LED lamp bead with composite panel-type integral support according to claim 1, wherein: the upper substrate is a hollowed-out fiber board or an etched circuit board, the lower substrate is an etched circuit board, and the upper substrate and the lower substrate are pressed together through a high-temperature pressing process to form a lamp bead bracket with an integral structure; and a driving chip is also arranged in the mounting cavity and is also electrically connected to the etching circuit.
3. The LED lamp bead with composite panel-type integral support according to claim 1, wherein: the cross sections of the upper substrate, the lower substrate and the mounting cavity are all in regular geometric shapes, and the cross section area of the mounting cavity is smaller than 3/4 of the rectangular area of the upper substrate.
4. The LED lamp bead with composite plate-type integral bracket according to claim 2, wherein: the upper substrate and the lower substrate are both rectangular structures, and at least three bonding pads are arranged at four corners of the bottom surface of the lower substrate; the mounting cavity is arranged in the middle of the upper substrate, the mounting cavity is round, and four connecting through holes are formed in the four corners of the upper substrate and the lower substrate; the light-emitting element and the driving chip are fixedly connected to the etching circuit through gold wires and ball-planting welding points, and the light-emitting element comprises at least one light-emitting chip.
5. The LED lamp bead with composite panel-type integral bracket of claim 4, wherein: the light-emitting element comprises a first light-emitting chip, a second light-emitting chip and a third light-emitting chip, and the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the driving chip are uniformly distributed in the mounting cavity along the circumferential direction.
6. The LED lamp bead with composite panel-type integral bracket of claim 5, wherein: the first light-emitting chip is a red light-emitting chip, the second light-emitting chip is a green light-emitting chip, and the third light-emitting chip is a blue light-emitting chip.
7. The LED lamp bead with composite panel-type integral bracket of claim 4, wherein: the side wall of the installation cavity is a conical surface.
8. The LED lamp bead with composite panel-type integral bracket of claim 7, wherein: the taper of the side wall of the mounting cavity is-20 degrees to 20 degrees.
9. The LED lamp bead with composite panel-type integral bracket of claim 8, wherein: the lamp bead support is a PCB circuit board with more than two layers of structures, and the mounting cavity is formed by removing part of materials of an upper layer plate of the PCB circuit board through a punching and cutting process or a milling process according to the sequence from top to bottom.
10. A method for preparing the LED lamp bead with the composite plate type integrated bracket according to one of claims 1 to 9, which is characterized in that: the method comprises the following steps:
s01, designing a lamp bead circuit according to the use requirement, typesetting and arranging a plurality of lamp bead positions, lamp bead circuits, connecting through holes, mounting cavities and bonding pads in a region range corresponding to the original board area of the whole PCB circuit board;
s02, manufacturing a plurality of lamp bead circuits, connecting through holes and bonding pads on an upper layer plate and/or a lower layer plate of a PCB (printed circuit board) according to a lamp bead circuit design scheme and a typesetting layout scheme, and manufacturing hollowed-out grooves on the upper layer plate to form a mounting cavity;
s03, carrying out composite crimping on the upper layer plate and the lower layer plate through a high-temperature lamination process to form a PCB circuit board with an integral structure;
s04, copper deposition and tin plating are carried out, so that each bonding pad forms a three-dimensional bonding pad through a connecting via hole;
s05, welding the first light-emitting chip, the second light-emitting chip, the third light-emitting chip and the driving chip on the lamp bead circuit in the mounting cavity according to a design typesetting layout scheme;
s06, injecting glue into the mounting cavity for packaging;
s07, dividing the PCB circuit board by a punching and cutting milling process according to a design typesetting layout scheme; forming a plurality of LED lamp beads;
s08, light splitting test; through the LED test equipment, electrical performance test is carried out on each LED lamp bead, and qualified LED lamp beads are screened out;
s09, braiding, namely braiding the LED lamp beads which are qualified in test into a material belt according to a uniform direction, and rolling the material belt into a disc to form an LED lamp bead finished product with the composite plate type integrated bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310467058.6A CN116454076A (en) | 2023-04-24 | 2023-04-24 | LED lamp bead with composite plate type integrated bracket and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310467058.6A CN116454076A (en) | 2023-04-24 | 2023-04-24 | LED lamp bead with composite plate type integrated bracket and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116454076A true CN116454076A (en) | 2023-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310467058.6A Pending CN116454076A (en) | 2023-04-24 | 2023-04-24 | LED lamp bead with composite plate type integrated bracket and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116454076A (en) |
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2023
- 2023-04-24 CN CN202310467058.6A patent/CN116454076A/en active Pending
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