CN116417478A - Flat panel detector panel and manufacturing method thereof - Google Patents
Flat panel detector panel and manufacturing method thereof Download PDFInfo
- Publication number
- CN116417478A CN116417478A CN202111656212.1A CN202111656212A CN116417478A CN 116417478 A CN116417478 A CN 116417478A CN 202111656212 A CN202111656212 A CN 202111656212A CN 116417478 A CN116417478 A CN 116417478A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting
- layer
- substrate
- flat panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000000835 fiber Substances 0.000 claims abstract description 82
- 238000006243 chemical reaction Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000009940 knitting Methods 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 98
- 238000000034 method Methods 0.000 claims description 28
- 239000011241 protective layer Substances 0.000 claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 230000000844 anti-bacterial effect Effects 0.000 claims description 7
- 238000009941 weaving Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- -1 Polyethylene terephthalat Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention provides a flat panel detector panel and a manufacturing method thereof, the flat panel detector panel comprises a light-emitting substrate and a chip, wherein the light-emitting substrate comprises a bearing substrate and a light-emitting layer, the light-emitting layer is fixed on the outer surface of the bearing substrate and comprises a plurality of light-emitting units, the light-emitting layer is formed by warp-weft knitting of first conductive fibers and second conductive fibers, at least one of the first conductive fibers and the second conductive fibers comprises a light-emitting material, and the chip is electrically connected with the light-emitting layer. The invention utilizes the conductive fiber and the second conductive fiber to weave into a net shape to obtain the luminous layer, and fixes the luminous layer on the outer surface of the bearing substrate, so that the free conversion of the image presented by the luminous substrate can be realized through program control based on the chip to meet different customer demands.
Description
Technical Field
The invention belongs to the field of X-ray detector imaging, and relates to a panel of a flat panel detector and a manufacturing method thereof.
Background
At present, the X-ray flat panel detector adopts a common carbon fiber carbon plate on the appearance surface, and is fixed on a structural member by using screws for locking. And then pasting a film made of PET (Polyethylene terephthalat) material on the carbon plate to adapt to different pattern requirements of different customers. The film pasting mode can solve the problem of complex patterns, but the film pasting is relatively not environment-friendly, reworking is inconvenient, the surface of the carbon plate is easy to adhere the waste back glue of the film, and once the back glue needs to be replaced, the back glue is relatively troublesome, and the film pasting waste has the possibility of polluting the environment; the problem that the carbon plate is pasted by the pad pasting is also solved by the pigment of the pad pasting, once patterns are arranged in an operable Area (AA Area for short) of the pad pasting, the patterns are affected by different densities of the printing ink, and artifacts are formed when the detector images, so that the imaging of the detector is affected. Some detectors are directly screen printed on a carbon plate, but screen printing patterns are difficult, and can only be applied to simple patterns, so that the requirements of various custom customers cannot be met, and the patterns are exposed to the outside and have the risk of being worn and erased after a long time.
Therefore, there is an urgent need to find a flat panel detector panel that is environmentally friendly, meets various customer needs, does not affect detector imaging, and is convenient to rework.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention is directed to a flat panel detector panel and a method for manufacturing the same, which are used for solving the problems of inconvenient reworking of a common detector panel film, environmental protection, influence on detector imaging and inapplicability to various customer demands in the prior art.
To achieve the above and other related objects, the present invention provides a method for manufacturing a flat panel detector panel, comprising the steps of:
providing a first conductive fiber and a second conductive fiber, and weaving the first conductive fiber and the second conductive fiber into a net in a warp-weft mode to form a luminous layer with a plurality of luminous units, wherein at least one of the first conductive fiber and the second conductive fiber comprises luminous materials;
providing a bearing substrate, and fixing the light-emitting layer on the outer surface of the bearing substrate to obtain a light-emitting substrate;
providing a chip, and electrically connecting the chip with the light-emitting layer.
Optionally, the chip includes a processor and a memory, and the memory stores a program, and the program is executed by the processor to implement light emitting pattern conversion and/or light emitting color conversion of the light emitting layer.
Optionally, the mesh lattice points of the mesh woven by the conductive yarn and the luminous yarn form the luminous unit.
Optionally, the staggered points of the first conductive fibers and the second conductive fibers form the light emitting unit.
Optionally, the carrier substrate comprises a carbon plate.
Optionally, the method of fixing the light emitting layer to the carrier substrate includes a lamination method.
Optionally, the method further includes a step of forming a protective layer on a surface of the light-emitting substrate having the light-emitting layer, where the protective layer includes at least one of a water layer and an antibacterial layer.
Optionally, the method further comprises the step of providing a detector housing, and mounting the light-emitting substrate on the detector housing.
Optionally, the method further comprises the step of placing the chip on the bottom of the carrier substrate or embedding the chip in the carrier substrate.
The invention also provides a flat panel detector panel comprising:
the light-emitting substrate comprises a bearing substrate and a light-emitting layer, wherein the light-emitting layer is fixed on the outer surface of the bearing substrate and comprises a plurality of light-emitting units, the light-emitting layer is formed by warp-weft knitting of first conductive fibers and second conductive fibers, and at least one of the first conductive fibers and the second conductive fibers comprises a light-emitting material;
and the chip is electrically connected with the light-emitting layer.
Optionally, the staggered points of the first conductive fibers and the second conductive fibers form the light emitting unit.
Optionally, the chip is disposed at the bottom of the carrier substrate or embedded in the carrier substrate.
Optionally, the chip includes a processor and a memory, and the memory stores a program, and the program is executed by the processor to implement light emitting pattern conversion and/or light emitting color conversion of the light emitting layer.
Optionally, a protective layer is disposed on a surface of the light-emitting substrate having the light-emitting layer, and the protective layer includes at least one of a waterproof layer and an antibacterial layer.
Optionally, the flat panel detector panel further includes a detector housing, and the light emitting substrate is mounted on the detector housing.
As described above, the flat panel detector panel and the manufacturing method thereof of the present invention adopt the mesh woven by the first conductive fibers and the second conductive fibers as the light-emitting layer having a plurality of light-emitting units, and press the light-emitting layer on the outer surface of the carrier substrate to form the light-emitting substrate, so that the light-emitting substrate is convenient to detach and simple to rework, the light-emitting layer is electrically connected with the chip to control the light emission of each light-emitting unit so as to realize the panel to display an image, and a program for controlling the light emission of the light-emitting unit is written according to the requirement and stored in the memory in the chip, thereby realizing the free conversion and switching of the display pattern by the control program, meeting the requirements of various clients, and having low power consumption and uniform density, and avoiding the influence of the generation of artifacts on the detector imaging. The invention is also beneficial to reworking of the detector, does not generate redundant film sticking waste, reduces the cost and is environment-friendly. In addition, the protective layer is formed on the outer surfaces of the light-emitting layer and the bearing substrate, so that the safety of the circuit is protected, and the light-emitting device has high industrial utilization value.
Drawings
FIG. 1 is a flow chart of a method for fabricating a flat panel detector panel according to the present invention.
Fig. 2 is a schematic structural diagram of a flat panel detector panel according to the present invention after forming a mesh-shaped light emitting layer.
Fig. 3 is a schematic cross-sectional structure of a flat panel detector panel according to the present invention after fixing a light-emitting layer to an outer surface of a carrier substrate.
Fig. 4 is a schematic cross-sectional structure of a flat panel detector panel according to the present invention after forming a protective layer.
Fig. 5 is a top view of a flat panel detector panel according to the present invention after chips are embedded in a carrier substrate.
Fig. 6 is a schematic structural diagram of a flat panel detector panel according to the present invention after a chip is embedded in a carrier substrate.
Fig. 7 is a schematic cross-sectional structure of a flat panel detector panel according to the present invention after a light-emitting substrate is mounted on a detector housing.
Fig. 8 is a front view of a flat panel detector panel of the present invention showing silk screen and trademark images.
Fig. 9 is a schematic diagram showing a flat panel detector panel of the present invention displaying silk screen and trademark images.
Description of element reference numerals
1a first conductive fiber
1b second conductive fibers
11. Light-emitting unit
12. Light-emitting layer
2. Bearing substrate
3. Protective layer
4. Chip
5. Light-emitting substrate
51. Silk screen printing
52. Trade mark
6. Detector shell
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
Please refer to fig. 1 to 9. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Example 1
The embodiment provides a flat panel detector panel and a method for manufacturing the same, as shown in fig. 1, in order to form a flow chart of the method for manufacturing the flat panel detector panel, the method comprises the following steps:
s1: providing a first conductive fiber and a second conductive fiber, and weaving the first conductive fiber and the second conductive fiber into a net in a warp-weft mode to form a luminous layer with a plurality of luminous units, wherein at least one of the first conductive fiber and the second conductive fiber comprises luminous materials;
s2: providing a bearing substrate, and fixing the light-emitting layer on the outer surface of the bearing substrate to obtain a light-emitting substrate;
s3: providing a chip, and electrically connecting the chip with the light-emitting layer.
Referring to fig. 2, the step S1 is performed: providing first conductive fibers 1a and second conductive fibers 1b, and knitting the first conductive fibers 1a and the second conductive fibers 1b into a net by weft knitting to form a light-emitting layer 12 with a plurality of light-emitting units 11, wherein at least one of the first conductive fibers 1a and the second conductive fibers 1b comprises a light-emitting material.
Specifically, the light-emitting layer 12 includes at least one first conductive fiber 1a and at least one second conductive fiber 1b.
As an example, as shown in fig. 2, a schematic structure of the mesh-shaped light emitting layer 12 is shown, and the staggered points of the first conductive fibers 1a and the second conductive fibers 1b form the light emitting unit 11.
Specifically, the light emitting color of the light emitting unit 11 is related to the material of the light emitting material, and the light emitting color of the light emitting unit 11 may be selected to be suitable for the first conductive fiber 1a and/or the second conductive fiber 1b according to actual needs.
Specifically, the thicknesses of the first conductive fibers 1a and the second conductive fibers 1b may be selected according to the needs. In this embodiment, the diameters of the sections of the first conductive fibers 1a and the second conductive fibers 1b are larger than 1 μm.
Specifically, the light emission of the light emitting unit 11 is controlled by controlling the electric field between the crossing points of the first conductive fibers 1a and the second conductive fibers 1b.
Specifically, the shape and size of the light emitting layer 12 formed by weaving the first conductive fibers 1a and the second conductive fibers 1b are determined according to actual needs, and are not limited herein, and the shape of the mesh in the light emitting layer 12 includes a trilateral shape, a quadrilateral shape, or other suitable shapes. In this embodiment, the grid in the light-emitting layer 12 is quadrilateral.
Referring to fig. 3 to 4, the step S2 is performed: a carrier substrate 2 is provided, and the light-emitting layer 12 is fixed on the outer surface of the carrier substrate 2 to obtain a light-emitting substrate 5.
By way of example, the carrier substrate 2 comprises a carbon plate or other suitable material. In this embodiment, a carbon plate is used as the carrier substrate 2.
Specifically, the shape, size and thickness of the carrier substrate 2 may be selected according to practical needs, which are not limited herein.
As an example, as shown in fig. 3, in order to schematically illustrate a cross-sectional structure of the light-emitting layer 12 after being fixed to the carrier substrate 2, a method of fixing the light-emitting layer 12 to the carrier substrate 2 includes a lamination method or other suitable method. In this embodiment, the light-emitting layer 12 is pressed onto the outer surface of the carrier substrate 2 by using a pressing technique, and after the pressing technique is used, the light-emitting layer 12 and the common flat panel detector 2 are pressed together, so that the light-emitting layer 12 and the carrier substrate 2 form a whole to obtain the light-emitting substrate 5.
Specifically, in order to strengthen the structural strength of the first conductive fibers 1a and the second conductive fibers 1b, to prevent the electrical paths in the light-emitting layer 12 from being damaged during lamination, carbon fibers are further doped in the light-emitting layer 12 to increase the strength of the light-emitting layer 12, so that the light-emitting layer 12 can be better laminated to the outer surface of the carrier substrate 2 and is pressed together with the carrier substrate 2.
As an example, the method further includes a step of forming a protective layer 3 on the surface of the light-emitting substrate 5 having the light-emitting layer 12, and the protective layer 3 may include at least one of a waterproof layer and an antibacterial layer, or may be another suitable material. In this embodiment, a polymer waterproof coating with waterproof property, crack resistance and good temperature adaptability is used as the protective layer 3, so that the light-emitting layer 12 is protected, and a waterproof function can be realized at the same time, so as to prevent the problem of short circuit between the light-emitting layer 12 and the chip 4 and the external power supply caused by a humid environment.
Specifically, as shown in fig. 4, to schematically illustrate the cross-sectional structure of the protective layer 3 after forming the protective layer 3, a method for forming the protective layer 3 includes spin coating or other suitable methods.
Specifically, the protective layer 3 includes a single-layer film or a multi-layer film, and the protective layer 3 is made of a transparent material.
In particular, when the protective layer 3 includes an antibacterial coating, it is possible to satisfy the requirement of biocompatibility, that is, to satisfy that a material causes an appropriate reaction at a specific portion of the body.
Referring to fig. 5 to 7, the step S3 is performed: a chip 4 is provided, which chip 4 is electrically connected to the light-emitting layer 12.
As an example, the chip 4 comprises a processor and a memory.
Specifically, the chip 4 includes electronic circuitry and related devices for controlling the light-emitting layer 12.
Specifically, the chip 4 may control the working state of any one or more of the light emitting units 11 in the light emitting layer 12, that is, simultaneously control the light emission and extinction of one light emitting unit 11 or a plurality of light emitting units 11.
As an example, as shown in fig. 5 and 6, the chip 4 may be placed on the bottom of the carrier substrate 2 or embedded in the carrier substrate 2, or may be placed at other suitable positions, respectively, in a top view after the chip 4 is embedded in the back surface of the carrier substrate 2 and in a schematic view after the chip 4 is embedded in the back surface of the carrier substrate 2. In this embodiment, the chip 4 is placed on the back surface of the carrier substrate 2 and is embedded in the back surface to fix the chip 4.
Specifically, the light-emitting substrate 5 is further provided with a circuit port (not shown) electrically connected to the chip and used for connecting an external circuit.
As an example, the method further comprises the step of providing a detector housing 6, and mounting the light emitting substrate 5 on the detector housing 6.
Specifically, as shown in fig. 7, in order to schematically illustrate the cross-sectional structure of the light-emitting substrate 5 after being mounted on the detector housing 6, the method of mounting the panel 5 on the detector housing 6 includes screwing, riveting, attaching, or other suitable methods. In this embodiment, the panel 5 is fixed to the detector housing 6 by means of screw locking.
Specifically, after the light-emitting substrate 5 is mounted on the detector housing 6, the circuit formed by the light-emitting layer 12 and the chip 4 needs to be programmed as required, and the programmed program is stored in the memory in the chip 4.
As an example, the program in the memory is executed by the processor to realize the light emission pattern conversion and/or the light emission color conversion of the light emission layer 12.
According to the manufacturing method of the flat panel detector panel of the embodiment, the first conductive fibers 1a and the second conductive fibers 1b are woven into the mesh-shaped luminescent layer 12, the luminescent layer 12 is fixed on the outer surface of the bearing substrate 2 to obtain the luminescent substrate 5, the protective layer 3 covering the luminescent layer 12 and the outer surface of the bearing substrate 2 is formed, the luminescent layer 12 is protected, the luminescent layer 12 is electrically connected with the chip 4, and the processor in the chip 4 executes the program to control the luminescence of the luminescent unit 11 in the luminescent layer 12, so that the image display of the luminescent substrate 5 is realized.
Example two
The present embodiment provides a flat panel detector, as shown in fig. 7, which is a schematic cross-sectional structure of the flat panel detector panel, and includes a light-emitting substrate 5 and a chip 4, wherein the light-emitting substrate 5 includes a carrier substrate 2 and a light-emitting layer 12, the light-emitting layer 12 is fixed on an outer surface of the carrier substrate 2 and includes a plurality of light-emitting units 11, the light-emitting layer 12 is formed by knitting first conductive fibers 1a and second conductive fibers 1b by warp and weft, and at least one of the first conductive fibers 1a and the second conductive fibers 1b includes a light-emitting material; the chip 4 is electrically connected to the light-emitting layer 12.
As an example, the staggered points of the first conductive fibers 1a and the second conductive fibers 1b constitute the light emitting unit 11.
Specifically, the first conductive fiber 1a and the second conductive fiber 1b are electrified, and due to the change of the electric field at the crossing point between the first conductive fiber 1a and the second conductive fiber 1b, the luminescent material is affected by the electric field to generate electroluminescence, that is, the luminescent unit 11 is formed, and the luminescent principle is similar to that of a flexible light emitting diode and the power consumption is low.
As an example, the chip 4 is placed at the bottom of the carrier substrate 2 or embedded inside the carrier substrate 2.
As an example, the chip 4 includes a processor and a memory in which a program is stored, which is executed by the processor to realize the light emission pattern conversion and/or the light emission color conversion of the light emission layer 12.
As an example, a protective layer 3 is provided on a surface of the light-emitting substrate 5 having the light-emitting layer 12, and the protective layer 3 includes at least one of a waterproof layer and an antibacterial layer.
Specifically, the luminescent layer 12 may display an image or a font composed of silk screen 51, trademark 52, or other available dots.
Specifically, as shown in fig. 8, the chip 4 controls the light emission of the light emitting unit 11 to control the display of the light emitting substrate 5, which is a schematic diagram of the screen printing 51 and the LOGO 52 (LOGO) displayed on the light emitting substrate 5.
Specifically, as shown in fig. 9, in the front view of the silk screen 51 and the trademark 52 displayed on the light-emitting substrate 5, only the silk screen 51 is displayed when the light-emitting substrate 5 displays an image, no artifact occurs, and the influence of the artifact on the imaging quality of the detector is avoided.
Specifically, the size, shape, color and position information of the trademark 52 displayed on the light-emitting substrate 5 can be controlled by the program.
Specifically, the width, position and information of the operable area of the screen printing 51 displayed on the light-emitting substrate 5 may be set according to the condition of the machine, and remain unchanged after the setting is completed.
Specifically, the light-emitting substrate 5 is provided with a circuit port connected with an external circuit, the pins of the chip 4 are electrically connected with an external power supply circuit through the circuit port, the chip 4 executes the program to control part of the light-emitting units 11 in the light-emitting layer 12 to emit light, thereby forming a visual light-emitting pattern in the light-emitting layer 12, and further realizing free switching of the display image of the light-emitting layer 12 in the light-emitting substrate 5.
Specifically, a main switch for controlling the light emission of the light emitting layer 12 is further disposed in the light emitting substrate 5, and when a light source is not needed, the switch is controlled to turn off the power supply to the light emitting layer 12, so that the light emitting layer 12 does not work.
As an example, the flat panel detector panel further comprises a detector housing 6, and the light emitting substrate 5 is mounted on the detector housing 6.
The flat panel detector panel of this embodiment fixes the luminescent layer 12 woven by the first conductive fibers 1a and the second conductive fibers 1b on the carrier substrate 2 to form the luminescent substrate 5, so that the panel 5 is convenient to detach, simple to rework, free from redundant film pasting waste, low in cost and environment-friendly, the luminescent layer 12 emits bright light by using the electroluminescent principle, low in power consumption, uniform in density, only displays luminescent screen printing, and avoids generating artifacts, and the image detector images. In addition, the chip 4 is used for controlling the work of the light emitting unit 11 in the light emitting layer 12, a program is written for a circuit formed by the chip 4 and the light emitting layer 12 and is stored in a memory in the chip 4, and the simple and free conversion of the display pattern in the light emitting substrate 5 is realized through the program, so that different requirements of customers are met.
In summary, the flat panel detector panel and the manufacturing method thereof of the invention utilize the first conductive fiber and the second conductive wire fiber to weave into the reticular luminescent layer, and fix the luminescent layer to the bearing substrate to form the luminescent substrate, so that the panel is convenient to disassemble and simple to rework, the protective layer is utilized to protect the circuit between the luminescent layer and the chip in the luminescent substrate, the circuit is prevented from short circuit or short circuit, and the chip is utilized to control each luminescent unit in the luminescent layer, so that the luminescent substrate can display images, and the free conversion of the display pattern of the luminescent substrate is realized to meet various requirements of customers. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (14)
1. A method for manufacturing a flat panel detector panel, comprising the steps of:
providing a first conductive fiber and a second conductive fiber, and weaving the first conductive fiber and the second conductive fiber into a net in a warp-weft mode to form a luminous layer with a plurality of luminous units, wherein at least one of the first conductive fiber and the second conductive fiber comprises luminous materials;
providing a bearing substrate, and fixing the light-emitting layer on the outer surface of the bearing substrate to obtain a light-emitting substrate;
providing a chip, and electrically connecting the chip with the light-emitting layer.
2. The method for manufacturing a flat panel detector panel according to claim 1, wherein: the chip comprises a processor and a memory, wherein a program is stored in the memory, and the program is executed by the processor to realize the luminous pattern conversion and/or luminous color conversion of the luminous layer.
3. The method for manufacturing a flat panel detector panel according to claim 1, wherein: the staggered points of the first conductive fibers and the second conductive fibers form the light-emitting unit.
4. The method for manufacturing a flat panel detector panel according to claim 1, wherein: the carrier substrate includes a carbon plate.
5. The method for manufacturing a flat panel detector panel according to claim 1, wherein: the method for fixing the light-emitting layer on the bearing substrate comprises a pressing method.
6. The method of fabricating a flat panel detector panel according to claim 1, further comprising the steps of: forming a protective layer on one surface of the light-emitting substrate with the light-emitting layer, wherein the protective layer comprises at least one of a waterproof layer and an antibacterial layer.
7. The method of fabricating a flat panel detector panel according to claim 1, further comprising the steps of: providing a detector shell, and installing the luminous substrate on the detector shell.
8. The method of fabricating a flat panel detector panel according to claim 1, further comprising the steps of: and placing the chip at the bottom of the bearing substrate or embedding the chip into the bearing substrate.
9. A flat panel detector panel, comprising:
the light-emitting substrate comprises a bearing substrate and a light-emitting layer, wherein the light-emitting layer is fixed on the outer surface of the bearing substrate and comprises a plurality of light-emitting units, the light-emitting layer is formed by warp-weft knitting of first conductive fibers and second conductive fibers, and at least one of the first conductive fibers and the second conductive fibers comprises a light-emitting material;
and the chip is electrically connected with the light-emitting layer.
10. The flat panel detector panel of claim 9, wherein: the staggered points of the first conductive fibers and the second conductive fibers form the light-emitting unit.
11. The flat panel detector panel of claim 9, wherein: the chip is arranged at the bottom of the bearing substrate or embedded in the bearing substrate.
12. The flat panel detector panel of claim 9, wherein: the chip comprises a processor and a memory, wherein a program is stored in the memory, and the program is executed by the processor to realize the luminous pattern conversion and/or luminous color conversion of the luminous layer.
13. The flat panel detector panel of claim 9, wherein: the light-emitting substrate is provided with a protective layer on one surface with the light-emitting layer, and the protective layer comprises at least one of a waterproof layer and an antibacterial layer.
14. The flat panel detector panel of claim 9, wherein: the flat panel detector panel also comprises a detector shell, and the light-emitting substrate is arranged on the detector shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111656212.1A CN116417478A (en) | 2021-12-30 | 2021-12-30 | Flat panel detector panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111656212.1A CN116417478A (en) | 2021-12-30 | 2021-12-30 | Flat panel detector panel and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116417478A true CN116417478A (en) | 2023-07-11 |
Family
ID=87053310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111656212.1A Pending CN116417478A (en) | 2021-12-30 | 2021-12-30 | Flat panel detector panel and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116417478A (en) |
-
2021
- 2021-12-30 CN CN202111656212.1A patent/CN116417478A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9936561B2 (en) | Flexible LED screen | |
| US20060207139A1 (en) | Flexible display | |
| US20030211797A1 (en) | Plural layer woven electronic textile, article and method | |
| US20160245491A1 (en) | Transparent light emitting apparatus | |
| EP1503665A1 (en) | Woven electronic textile, yarn and article | |
| CN103152893B (en) | Flexible double-side displayer formed by combining light emitting wires | |
| US20130027963A1 (en) | Textile product having a lighting function and method for the production thereof | |
| CN111837237A (en) | Electrode substrate for transparent light emitting diode display device and transparent light emitting diode display device including the same | |
| CN110796956A (en) | Flexible transparent display screen and manufacturing method thereof | |
| CN116417478A (en) | Flat panel detector panel and manufacturing method thereof | |
| CN216871970U (en) | Panel of flat panel detector | |
| US10907782B2 (en) | Luminescent fiber, luminescent fabric, and method for producing a luminescent fiber | |
| CN205900547U (en) | Illumination panel and lighting device | |
| TW201101268A (en) | Translucent LED display panel | |
| WO2008152574A1 (en) | Fabric display with diffuser | |
| CN204795682U (en) | Electrode network board and electroluminescence line luminescent system | |
| KR20050063292A (en) | Flexible front electrode films and electro-luminescence devices using the same | |
| KR102428820B1 (en) | LED light-emitting board using transparent substrate, manufacturing method thereof | |
| WO2015174135A1 (en) | Led-mounting tape and clothing furnished with same | |
| JP2020038778A (en) | Decorating device, method for using light emitting device, and vehicle | |
| JP4594926B2 (en) | Textile surface structure comprising a plurality of conductive fibers or an array of conductive fibers and method for producing the same | |
| Parkova et al. | Light-emitting textile display with floats for electronics covering | |
| JP2006519319A6 (en) | Textile surface structure comprising a plurality of conductive fibers or an array of conductive fibers and method for producing the same | |
| CN218645389U (en) | LED starry sky top film lamp piece | |
| JP2012060093A (en) | Led lighting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |