CN116243437A - Multi-rate multi-channel receiving and transmitting integrated packaging optical device - Google Patents

Abstract

The invention discloses a multi-rate multi-channel transceiver integrated packaging optical device, which relates to the field of optical module packaging. The invention provides a multi-rate multi-channel receiving and transmitting integrated packaging optical device, which is characterized in that an optical module is integrally designed by using a BOX, and all optical, electric chips, optical elements, control elements, structural elements and the like are packaged into an airtight BOX shell, so that good integral air tightness is realized; dust-proof, water-proof and oil-proof adhesion, and ensures miniaturization of products and unrestricted functionality of products.

Description

Multi-rate multi-channel receiving and transmitting integrated packaging optical device

Technical Field

The present invention relates to the field of optical communication devices. More particularly, the present invention relates to a multi-rate, multi-channel, transceiver-integrated packaged optical device.

Background

The multi-rate multi-channel receiving and transmitting integrated optical device solution is to support development of big data, cloud service and the like, realizes smooth evolution of GPON to 10G GPON, gigabit acceleration, can be downward compatible with an ONU end of GPON, XGPON, XGSPON only by upgrading and reforming OLT end equipment, has almost zero change of other configurations of an OLT machine room, and is a main stream solution for realizing gigabit network access;

based on the characteristics, the multi-rate multi-channel transceiving integrated optical device is a main stream scheme for realizing the gigabit access network, and the multi-rate multi-channel transceiving integrated optical device of the main stream is mainly coaxially packaged, and the main defects are that:

the existing multichannel transceiver is mostly in TO coaxial packaging, and due TO the fact that transceiver ends TO with multiple rates are integrated, the coaxial scheme is transversely and longitudinally irregular in device, large in size, high in difficulty in small-sized optical module packaging, meanwhile, the optical path part is in non-airtight packaging, lipid substances can be volatilized under high-temperature working conditions like heat-dissipating glue or other auxiliary materials in the module level use process, the optical path membrane lens surface is easy TO infiltrate after long-term working, dust and water vapor are not prevented, miniaturization of equipment is affected, and product performance is restricted.

Disclosure of Invention

It is an object of the present invention to address at least the above problems and/or disadvantages and to provide at least the advantages described below.

To achieve these objects and other advantages and in accordance with the purpose of the invention, a multi-rate multi-channel transceiver integrated package optical device is provided, in which a case BOX for hermetically packaging an entire of an optical chip, an optical element, and a control element is provided to hermetically package the optical chip and an optical path portion at the same level.

Preferably, the BOX profile is configured as a regular structure and the internal cavity of the BOX is configured as a near equipotential.

Preferably, the transmitting end cavity I, the receiving end cavity II and the transmitting end cavity II are formed in the BOX inner cavity through the support.

Preferably, the optoelectronic chip is configured to include:

the laser chips are respectively arranged in the transmitting end cavity I and the transmitting end cavity II;

TIA electric chips respectively arranged in the receiving end cavity I and the receiving end cavity II;

the laser chip and the TIA electric chip are respectively communicated with external pins of the transmitting end and the receiving end through gold wire bonding points of pin arrangement at two sides in the BOX internal cavity.

Preferably, the optical element is configured to include:

spatially matched with each laser chip and each TIA electric chip to construct a filter assembly, a collimating lens assembly, an isolator and a functional lens of a transmitting light path and a receiving light path;

wherein, the bracket is provided with a mounting groove matched with the mounting position of each optical element.

Preferably, the workflow of the emission light path is configured to:

the control element respectively controls the corresponding laser chips to be in a working state so as to generate corresponding optical signals I and II;

the optical signals I and II are respectively collimated by the corresponding collimating lens group I and II in the collimating lens assembly, reflected by the corresponding filter plate I and II in the filter plate assembly, transmitted or reflected by the filter plate III in the filter plate assembly, and then enter the isolator;

the optical signals I and II transmitted by the isolator are transmitted to the functional lens for converging and outputting after being transmitted by the filter IV and the filter V in the filter assembly, and the optical signals are transmitted;

the workflow of the receive optical path is configured to:

after the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted to the corresponding PD through the corresponding collimating lens group III in the collimating lens assembly after being transmitted and reflected by the filter sheet V, the filter sheet IV and the filter sheet VI, and the optical signal is converted into an electric signal to enter the TIA electric chip to complete photoelectric conversion;

after the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted to the corresponding PD through the corresponding collimating lens group IV in the collimating lens assembly after corresponding reflection and transmission treatment through the filter sheet V, the filter sheet VII, the filter sheet VIII and the filter sheet IX, and converted into an electric signal to enter the TIA electric chip to complete photoelectric conversion.

Preferably, the control element is configured to include a control motherboard that cooperates with each laser chip;

wherein, each transmitting end cavity is internally provided with a temperature control chip TEC matched with each control main board.

Preferably, the single-layer optical module circuit board PCBA is arranged in the BOX inner cavity and matched with the photoelectric chip.

The invention at least comprises the following beneficial effects: the invention uses the whole design of the BOX in the optical module to package all optical, electric chips, optical elements, control elements, structural elements and the like into the airtight BOX shell, thereby realizing good whole air tightness; dust-proof, water-proof and oil-proof adhesion, and ensures miniaturization of products and unrestricted functionality of products.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of a transceiver-integrated packaged optical device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the structure of a BOX according to the present invention;

FIG. 3 is a schematic diagram of another lead layout of a transceiver integrated packaged optical device according to the present invention;

FIG. 4 is a schematic view of the structure of the bracket and BOX of the present invention;

FIG. 5 is a schematic view of the structure of the bracket and filter assembly and collimator of the present invention;

FIG. 6 is a schematic view of a portion of the enlarged structure of FIG. 1;

FIG. 7 is a schematic diagram of the configuration of the transceiver-integrated package optical device of the present invention mated with a PCBA;

the device comprises a BOX-1, a bracket-2, a transmitting end cavity I-3, a receiving end cavity I-4, a receiving end cavity II-5, a transmitting end cavity II-6, a laser chip-7, a TIA electric chip-8, a gold wire bonding point-9, an external pin-10, a filter piece component-11, a collimating lens-12, an isolator 13, a functional lens-14, a mounting groove-15, a control main board 16, a TEC-17, a PCBA-18, a ceramic cushion block-19, a collimating lens group I-120, a collimating lens group II-121, a collimating lens group III-122, a collimating lens group IV-123, a filter piece I-110, a filter piece II-111, a filter piece III-112, a filter piece IV-113, a filter piece V-114, a filter piece VI-115, a filter piece VII-116, a filter piece VIII-117 and a filter piece IX-118.

Detailed Description

The present invention is described in further detail below with reference to the drawings to enable those skilled in the art to practice the invention by referring to the description.

It will be understood that terms, such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.

It should be noted that, in the description of the present invention, the orientation or positional relationship indicated by the term is based on the orientation or positional relationship shown in the drawings, which are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "engaged/connected," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, may be a detachable connection, or may be an integral connection, may be a mechanical connection, may be an electrical connection, may be a direct connection, may be an indirect connection via an intermediary, may be a communication between two elements, and for one of ordinary skill in the art, the specific meaning of the terms in this disclosure may be understood in a specific case.

Fig. 1 shows an implementation form of a multi-rate multi-channel integrated transceiver packaging optical device according to the present invention, in which a housing BOX for integrally hermetically packaging an optical chip, an optical element, and a control element is provided in an optical module to hermetically package the optical chip and an optical path portion at the same level, in which, by adopting the overall design of the BOX, all the optical, the optical chip, the optical element, the control element, and the structural element in the optical module are packaged in the airtight BOX housing, so as to achieve good overall air tightness, effectively prevent dust, water, and oil contamination, make the optical device have higher integration level, facilitate miniaturization of equipment, and ensure functionality of the optical device;

further, the airtight package at the same level can be in various package forms such as parallel sealing and welding, glue packaging and the like, and the purpose of the airtight package is to realize the airtight package of components inside the BOX; the inside can be filled with nitrogen or any inert gas, and the purpose is to remove oxygen in the BOX and avoid oxidation and aging of the internal chip at high temperature.

In another example, as shown in fig. 2, the BOX profile is configured as a regular structure and the internal cavity of the BOX is configured as a near equipotential. The technical scheme aims TO solve the problems that the existing TO coaxial packaging scheme is large in overall size, different in transverse and longitudinal dimensions, irregular in overall shape, limited in module miniaturization packaging size, difficult in module internal layout and limited in development of equipment miniaturization, and the BOX is small in overall size due TO the fact that the BOX is configured into a regular structure (such as a cuboid) so as TO enable the BOX TO be convenient for module miniaturization packaging; the design of PCBA board distribution, heat dissipation and the like in the module is facilitated, and meanwhile, the internal cavity of the BOX is configured to be a nearly equipotential body, so that when the internal cavity is subjected to directional movement with almost no charge, a relative static balance state is achieved;

further, in practical implementation, the BOX may be any shape, but the purpose of the BOX is to reduce the occupied space in the module.

As shown in fig. 4, in another example, a transmitting end cavity i 3, a receiving end cavity i 4, a receiving end cavity ii 5 and a transmitting end cavity ii 6 are constructed in a BOX internal cavity through a bracket 2, in this scheme, the BOX internal cavity bracket constructs a plurality of independent metal shielding cavities, so as to realize independent operation of a plurality of internal channels, effectively eliminate crosstalk of light and electric signals between channels, and ensure the effectiveness and stability of receiving and transmitting of an optical module;

further, the present solution indicates an embodiment of forming independent cavities by using a support, in practical application, the number of the cavities in the present solution may be one or more, the number of the cavities may be increased and expanded according to different needs to use different needs, and the internal component support may be one or more components.

1-2, in another example, the optoelectronic chip is configured to include:

the laser chips 7 are respectively arranged in the transmitting end cavity I and the transmitting end cavity II;

the TIA electric chip 8 is respectively arranged in the receiving end cavity I and the receiving end cavity II, the TIA electric chip and the laser chip are respectively arranged in the receiving end cavity through matched ceramic cushion blocks 19, the ceramic cushion blocks are five, two transmitting ends and two receiving ends are respectively provided with a small cushion block (or called a heat sink), and a large ceramic cushion block is arranged below the four channels and almost fully covers the bottom of the whole box, in the structure, the TIA electric chip and the ceramic cushion block are in direct contact for heat dissipation through the direct contact of the ceramic cushion block and the shell, and the TIA electric chip and the ceramic cushion block are in direct contact, so that the heat dissipation efficiency is better;

the laser chip and the TIA electric chip are respectively communicated with the transmitting end and the receiving end through gold wire bonding points 9 of pin arrangement at two sides in the internal cavity of the BOX, in the scheme, the gold wire bonding points of butterfly-shaped packaging at two sides in the internal cavity of the BOX are connected with the transmitting end and the receiving end, so that the stability of receiving and transmitting is ensured, the lead layout is reasonable, the complexity of wiring in the BOX is reduced, the multichannel receiving and transmitting chip is packaged into the same BOX packaging through an integrated design, a receiving and transmitting integrated device is formed, external wavelength division multiplexing equipment is reduced, optical fiber resources are saved, and the problems that in the prior art, the BOX packaging multichannel optical devices are single transmitting devices or single receiving devices and the integration degree is insufficient are effectively solved;

further, as shown in fig. 4, the electrical signal extraction in the scheme is not limited to the butterfly package such as pin array on both sides, for example, the external connection mode of the pad in other directions can be also adopted, and of course, the positions of the cavities of each transmitting end and each receiving end can be adaptively adjusted according to different wiring modes so as to simplify the complexity of wiring.

As shown in fig. 1, in another example, the optical element is configured to include:

the device is matched with each laser chip and each TIA electric chip in space to construct a filter assembly 11, a collimating lens assembly 12, an isolator 13 and a functional lens 14 of a transmitting light path and a receiving light path, and in practical application, the disposable packaging of the light path elements of the optical chips can be realized due to the high internal integration level of the BOX package, the full-process automatic intelligent manufacturing is easy to realize, and the functional lens can be one component or the combination of two components, and has the function of converging light during transmitting; and the functional lens plays a role in collimating light during receiving;

the mounting groove 15 matched with the mounting position of each optical element is formed in the support, the support is integrally opened, the mounting groove matched with the mounting position of each optical element is formed in the support, in practical application, the optical elements such as the wavelength division multiplexing related light-splitting diaphragms (filter slice assemblies, collimating lenses, functional lenses) and isolators are mounted on the mounting groove TO form an integrated structure with the support, and then the integrated structure is integrally mounted in the BOX, so that the assembly is simple, the precision is controllable, meanwhile, due TO the integral mold opening design, the integrated optical elements can be uniformly mounted through automatic equipment, the production efficiency is improved, the mounting accuracy is guaranteed, the problems that in the prior art, a plurality of procedures are needed for coaxially packaging TO packaging and device packaging, and the upstream and downstream industrial chains are matched, and the automation degree of the procedures is not high, and the whole automation is difficult TO realize are effectively solved;

further, the position and sequence of the optical splitting films in the scheme can be adjusted and designed according to the requirement, or other types of optical elements are used, so that the purpose of the optical splitting multiplexing of the multi-rate multi-channel integrated optical device is realized, and the multiplexing wavelength is the multiplexing design of the combo of the GPON and the 10G PON or the combo of the future 10GPON/50G PON or any other special wavelength. Multiple and multiple receipts, multiple and single receipts, and the like;

furthermore, the components of the present embodiment are not limited to be mounted on the support with the isolated cavity, but may be mounted on the inner substrate.

As shown in fig. 1 and 5, the workflow of the transmit light path is configured to:

the control element respectively controls the corresponding laser chips to be in a working state so as to generate corresponding optical signals I and II;

the optical signals I and II are respectively collimated by the corresponding collimating lens group I120 and II 121 in the collimating lens assembly, reflected by the corresponding filtering sheet I110 and II 111 in the filtering sheet assembly, transmitted or reflected by the filtering sheet III 112 in the filtering sheet assembly, and enter the isolator, wherein each collimating lens group comprises a collimating lens and/or a focusing lens, and in practical application, the functional lens and the collimating lens group are spatially mutually collimating and focusing lenses, and a series of matched filtering sheet assemblies are inserted between the functional lens and the collimating lens group to further construct a corresponding receiving or transmitting light path;

the optical signals I and II transmitted by the isolator are transmitted to the functional lens for converging and outputting after being transmitted by the filter IV 113 and the filter V114 in the filter assembly, and the optical signal transmission is completed;

the workflow of the received light path is configured to:

after the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted and reflected by the filter sheet V, the filter sheet IV and the filter sheet VI 115, and then converted into an electric signal by the PD corresponding to the collimating lens group III 122 in the collimating lens assembly, and then enters the TIA electric chip to complete photoelectric conversion;

after the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted to the corresponding PD through the corresponding collimating lens group IV 123 in the collimating lens assembly after corresponding reflection and transmission treatment through the filter V, the filter VII 116, the filter VIII 117 and the filter IX 118, and converted into an electric signal to enter the TIA electric chip, so that photoelectric conversion is completed.

As in fig. 1, in another example, the control element is configured to include a control motherboard 16 that cooperates with each laser chip;

the temperature control chip TEC17 matched with each control main board is arranged in each transmitting end cavity, in the scheme, the TEC is matched with each control main board, so that the temperature of equipment parts can be controlled, in the BOX, due TO the integral design, the optical chips and optical components in the BOX package are highly integrated, different functional areas can be increased or reduced according TO the needs, in practical application, the free arrangement of optical paths can be realized as shown in fig. 6, the free design, for example, the internal TEC can be used for selecting a model with larger working area (namely, the TEC size can be amplified) according TO a wider working range, thereby increasing the power for refrigerating and heating, realizing better temperature control, expanding the working temperature range of an optical device, and effectively solving the problems that in the prior art, due TO the fact that the internal space of a TO is limited, the TEC needs TO be selected with smaller size and the power is limited, and the working temperature range of the whole device is limited.

In another example, as shown in fig. 7, the PCBA18 of the single-layer optical module circuit board is further included in the BOX internal cavity and is matched with the optical-electrical chip, in this case, because the BOX integrated package is adopted, by optimizing the arrangement and the optical path of the internal optical-electrical chip, the overall length of the device is shortened by about 11mm compared with that of the coaxial packaged multi-rate multi-channel transceiving integrated optical device, the range of the PCBA of the optical module is increased, the design difficulty of the PCBA is reduced, the design difficulty is reduced from a double-layer board or even a multi-layer board to a single-layer board, the design and manufacturing circuit is reduced, the design signal optimizing circuit with more graceful space of the cloth board is increased, the overall performance of the optical module is improved, and the manufacturing cost of the PCBA is also reduced.

The corresponding scheme of the invention has the following effects in practical application:

firstly, the BOX packaging adopted by the invention seals the photoelectric chip and the optical element in the BOX in an airtight manner, so that the airtight packaging of the same level of the optical path part and the photoelectric chip can be realized, and the trouble that the vapor, dust and volatile substances are difficult to adhere to due to the non-airtight packaging of the coaxial packaging optical path part is solved.

Secondly, the BOX packaging adopted by the invention ensures that the whole multi-speed multi-channel transceiving integrated optical device is packaged in a regular BOX BOX by optimizing the internal optical path and the mounting position of the photoelectric chip, thereby facilitating the arrangement and the mounting of the SFP+ module, shortening the longitudinal dimension by about 10mm compared with the coaxial packaging, enlarging the arrangement space in the module and facilitating the PCB layout and the packaging of the module;

thirdly, the BOX package adopted by the invention has the advantages that the internal TEC and the ceramic cushion block are in direct contact with the shell for heat dissipation, the photoelectric chip is in direct contact with the ceramic cushion block, the heat dissipation efficiency is better than that of the coaxial package, and the expansion of the high-temperature working temperature range of the device is facilitated;

fourth, the BOX packaging adopted by the invention, the optical chip and the optical element can finish one-stop packaging by means of automatic high-precision surface mount equipment, thereby reducing the support to upstream and downstream industrial chains and being easy to realize automatic production;

fifthly, the BOX packaging adopted by the invention has the advantages that the optical path part element can realize automatic mounting through the integral design, the optical diaphragm, the optical isolator and the like, and the integral optical path part element realizes good air tightness inside the BOX, so that the device can adapt to more severe working conditions;

sixthly, the support is arranged on the BOX package, so that independent work of multiple cavities can be realized, and optical and electric crosstalk is isolated.

The above is merely illustrative of a preferred embodiment, but is not limited thereto. In practicing the present invention, appropriate substitutions and/or modifications may be made according to the needs of the user.

The number of equipment and the scale of processing described herein are intended to simplify the description of the present invention. Applications, modifications and variations of the present invention will be readily apparent to those skilled in the art.

Although embodiments of the invention have been disclosed above, they are not limited to the use listed in the specification and embodiments. It can be applied to various fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art. Therefore, the invention is not to be limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.

Claims (8)

1. A multi-rate multi-channel receiving and transmitting integrated packaging optical device is characterized in that a shell BOX for hermetically packaging an optoelectronic chip, an optical element and a control element in an integral way is arranged in an optical module so as to hermetically package the optoelectronic chip and an optical path part at the same level.

2. The multi-rate, multi-channel transceiver integrated packaged optical device of claim 1, wherein the BOX profile is configured as a regular structure and the internal cavity of the BOX is configured as a near equipotential.

3. The multi-rate, multi-channel, transceiver-integrated packaged optical device of claim 1, wherein the transmitting end cavity i, the receiving end cavity ii, and the transmitting end cavity ii are constructed in the BOX internal cavity by a bracket.

4. The multi-rate, multi-channel, transceiver-integrated packaged optical device of claim 3, wherein the optoelectronic chip is configured to include:

the laser chips are respectively arranged in the transmitting end cavity I and the transmitting end cavity II;

TIA electric chips respectively arranged in the receiving end cavity I and the receiving end cavity II;

the laser chip and the TIA electric chip are respectively communicated with external pins of the transmitting end and the receiving end through gold wire bonding points of pin arrangement at two sides in the BOX internal cavity.

5. The multi-rate, multi-channel transceiver integrated packaged optical device of claim 3, wherein said optical element is configured to include:

spatially matched with each laser chip and each TIA electric chip to construct a filter assembly, a collimating lens assembly, an isolator and a functional lens of a transmitting light path and a receiving light path;

wherein, the bracket is provided with a mounting groove matched with the mounting position of each optical element.

6. The multi-rate, multi-channel transceiver integrated packaged optical device of claim 5, wherein the workflow of the transmit optical path is configured to:

the control element respectively controls the corresponding laser chips to be in a working state so as to generate corresponding optical signals I and II;

the optical signals I and II are respectively collimated by the corresponding collimating lens group I and II in the collimating lens assembly, reflected by the corresponding filter plate I and II in the filter plate assembly, transmitted or reflected by the filter plate III in the filter plate assembly, and then enter the isolator;

the optical signals I and II transmitted by the isolator are transmitted to the functional lens for converging and outputting after being transmitted by the filter IV and the filter V in the filter assembly, and the optical signals are transmitted;

the workflow of the receive optical path is configured to:

after the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted to the corresponding collimating lens group III in the collimating lens component after being transmitted and reflected by the filter V, the filter IV and the filter VI

After the optical signal III is collimated and input by the functional lens, the optical signal III can be transmitted to the corresponding PD through the corresponding collimating lens group IV in the collimating lens assembly after corresponding reflection and transmission treatment through the filter sheet V, the filter sheet VII, the filter sheet VIII and the filter sheet IX, and converted into an electric signal to enter the TIA electric chip to complete photoelectric conversion.

7. The multi-rate, multi-channel, transceiver-integrated packaged optical device of claim 1, wherein the control element is configured to include a control motherboard that mates with each laser chip;

wherein, each transmitting end cavity is internally provided with a temperature control chip TEC matched with each control main board.

8. The multi-rate, multi-channel, transceiver-integrated packaged optical device of claim 1, further comprising a single layer optical module circuit board PCBA coupled to the entire optical device by a flex board or hard link.

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