CN116210354A

CN116210354A - Electronic device and vehicle

Info

Publication number: CN116210354A
Application number: CN202180046269.1A
Authority: CN
Inventors: 万军平; 崔培华
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2023-06-02
Also published as: WO2023050363A1

Abstract

The application provides an electronic device, it is including circuit board (30) that are equipped with chip (31), and circuit board (30) are accomodate in first cavity (1), still fill in first cavity (1) simultaneously and have first heat conduction liquid (3), and circuit board (30) immerse first heat conduction liquid (3), and its heat is taken away by first heat conduction liquid (3) easily. Therefore, compared with a mode of sticking the solid heat dissipation material on the circuit board to dissipate heat, the alignment operation of the solid heat dissipation material and the chip and other positions is not required, so that the assembly process is simple, the requirement on the assembly precision is low, the dislocation of the solid heat dissipation material caused by the vibration of a vehicle is avoided, and the heat dissipation effect is ensured.

Description

Electronic device and vehicle

Technical Field

The application relates to the field of vehicles, in particular to an electronic device and a vehicle.

Background

The computing device generates heat when performing computation and processing, and heat dissipation is required to the computing device in order to prevent a reduction in the operation speed due to an excessively high temperature of the computing device.

At present, a cooling plate is installed on a circuit board of a computing device, a solid heat dissipation material is arranged at a position of the cooling plate corresponding to a part of the circuit board, which needs heat dissipation, and the solid heat dissipation material is attached to the heat dissipation part. The cooling plate is filled with cooling water, so that heat of the circuit board is transferred to the cooling water in the cooling plate through the solid heat dissipation material, and heat dissipation of the circuit board is achieved.

Because the types of circuit boards of different types of computing devices are different, and the parts requiring heat dissipation are also different, the heat dissipation mode has high requirements on assembly precision, and is difficult to be compatible with the different types of computing devices.

Disclosure of Invention

In view of the above, embodiments of the present application provide an electronic device and a vehicle that have low requirements for assembly accuracy and are compatible with multiple types of high-density components to be cooled.

In a first aspect of the present application, there is provided an electronic device, comprising: a circuit board; the circuit board cooling device comprises a first chamber, a heat dissipation device and a heat dissipation device, wherein the first chamber is used for accommodating the circuit board and is filled with first heat conduction liquid, and the heat dissipation device is used for dissipating heat of the circuit board through the first heat conduction liquid.

Through the arrangement, the first heat conduction liquid is filled in the first cavity, so that heat on the circuit board can be transferred into the first heat conduction liquid, and the circuit board can be compatible with various circuit boards of different types;

the alignment operation of the solid heat dissipation material and the heat dissipation element of the circuit board is avoided, the assembly process is simple, and the requirement on the assembly precision is not high;

the situation that the solid heat dissipation material is misplaced and the solid heat dissipation material is not well attached to the circuit board due to vibration of the vehicle is avoided;

the heat dissipation device is utilized to dissipate heat of the circuit board through the first heat conduction liquid, so that the heat dissipation efficiency is improved, and the circuit board is suitable for a high-power circuit board.

In one possible implementation, the heat dissipating device includes: the second shell is internally provided with a second cavity, second heat conduction liquid is filled in the second cavity, and the second shell is in contact with the first cavity.

Through the arrangement, the first heat-conducting liquid can be radiated through the second heat-conducting liquid in the second shell, so that the radiating effect is improved.

In one possible implementation, the first chamber is located in the first housing, and the heat dissipating device may further include an air cooling unit including: the fan is positioned on the first shell and used for radiating heat for the first shell, and a driving source connected with the fan.

Through the arrangement, the first heat conduction liquid can be cooled through the air cooling mode, so that the heat dissipation effect on the circuit board is improved.

In one possible implementation, the first chamber is located in the first housing, and a sealing ring is disposed between the first housing and the second housing to seal the first chamber.

Through the arrangement, the sealing between the first shell and the second shell is realized, and the overflow of heat conduction fluid is avoided.

In one possible implementation, the first housing and the second housing are detachably connected, so that the maintenance and updating of the circuit board can be facilitated, and the vehicle-mounted control device is adapted.

In one possible implementation, the second housing includes a plurality of second housings that form the first chamber.

Through the arrangement, the heat dissipation efficiency is improved, and the structure that a plurality of second shells form the first cavity is simpler.

In one possible implementation, the sealing ring comprises a first sealing ring and a second sealing ring, and the cross section of the first sealing ring is O-shaped; the section of the second sealing ring is zigzag.

Through above-mentioned setting, the O shape cross-section of first sealing washer is convenient for process, and the zigzag cross-section of second sealing washer can effectively prevent that first heat conduction liquid from spilling over, and can bear bigger pressure, promotes sealed effect, adapts to vibrations under the on-vehicle scene.

In one possible implementation, the second seal ring is closer to the first chamber than the first seal ring.

Through above-mentioned setting, the zigzag cross-section of second sealing washer can prevent effectively that first heat conduction liquid from spilling over to between first sealing washer and the second sealing washer, and then avoids the heat conduction liquid that spills over to pollute first sealing washer, avoids reducing sealed effect.

In one possible implementation, the first seal ring and the second seal ring may also have other cross-sectional shapes, the first seal ring being closer to the first chamber than the second seal ring, the cross-sections of the first seal ring and the second seal ring may both be O-shaped or both zigzag-shaped.

In one possible implementation, the surface of the second housing facing the first chamber is provided with heat exchange fins.

Through above-mentioned setting, can increase the area of contact of the first heat conduction liquid of second casing with first cavity, promote the radiating effect.

In one possible implementation, the second housing is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are communicated with the second chamber.

Through the arrangement, the second heat conduction liquid can flow in the second cavity, so that the heat dissipation effect is improved.

In one possible implementation, the method further includes: the liquid injection port is communicated with the first cavity and used for injecting first heat conduction liquid into the first cavity.

Through above-mentioned setting, can make things convenient for the injection and the pouring of first heat conduction liquid, make things convenient for upgrading or the maintenance of circuit board.

In one possible implementation, the liquid filling port is disposed on the second housing.

In one possible embodiment, the filling opening protrudes relative to a side of the second housing facing away from the first chamber.

Through the arrangement, the liquid level of the first heat conduction liquid can be conveniently controlled, and when the liquid level of the first heat conduction liquid is positioned at the protruding part of the liquid injection port, the circuit board can be completely immersed in the first heat conduction liquid.

In one possible implementation, the first thermally conductive liquid is a fluorinated liquid or mineral oil and the second thermally conductive liquid is water.

Through the arrangement, uniform heat dissipation of the circuit board can be realized, and the heat dissipation effect is improved.

In one possible implementation, the electronic device is for a control unit of a vehicle.

In one possible implementation, a plurality of chips are provided on the circuit board.

In one possible implementation, a buckle plate is further arranged on the circuit board, and the buckle plate is used for installing the CPU.

Through the arrangement, various circuit board structures can be realized.

In one possible implementation, the method further includes: the heat conducting solid is arranged on the surface of the first chamber. The heat conducting solid is attached to the chip, so that heat dissipation of the chip is achieved.

Through the arrangement, various heat dissipation modes can be realized, and the heat dissipation requirements of different chips are met.

In a second aspect of the present application, a vehicle is provided, including an electronic device provided by the first aspect of the present application and any possible implementation manner thereof.

The electronic device provided by the application can be suitable for a vehicle-mounted scene, and the heat dissipation effect of the vehicle-mounted electronic device (controller) under the vibration condition is ensured; the requirement on the assembly precision is not high, workers are not required to align the solid heat dissipation materials according to the positions, the sizes and the heights of the chips, and the assembly efficiency is improved; the situation that the solid heat dissipation material is misplaced and the solid heat dissipation material is not well attached to the circuit board due to vehicle vibration can be avoided, the heat dissipation effect is improved, and inconvenience caused by maintenance is reduced; in addition, the heat dissipation efficiency can be improved by radiating the circuit board through the first heat conduction liquid in the modes of air cooling or water cooling and the like, and the circuit board is suitable for more types of circuit boards.

Drawings

The various features of the invention and the connections between the various features are further described below with reference to the figures. The figures are exemplary, some features are not shown in actual scale, and some features that are conventional in the art to which this application pertains and are not essential to the application may be omitted from some figures, or features that are not essential to the application may be additionally shown, and combinations of the various features shown in the figures are not meant to limit the application. In addition, throughout the specification, the same reference numerals refer to the same. The specific drawings are as follows:

fig. 1 is a schematic diagram of an application scenario of an electronic device provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of an exploded structure of an electronic device according to one embodiment of the present application;

FIG. 4A is a cross-sectional view of an electronic device provided in one embodiment of the present application;

FIG. 4B is a cross-sectional view of an electronic device provided in another embodiment of the present application;

FIG. 5 is a cross-sectional view of an electronic device provided in another embodiment of the present application;

FIG. 6 is a cross-sectional view of an electronic device provided in another embodiment of the present application;

FIG. 7 is a cross-sectional view of an electronic device provided in another embodiment of the present application;

FIG. 8 is a cross-sectional view of an electronic device provided in another embodiment of the present application;

fig. 9 is a cross-sectional view of a second housing of an electronic device provided in one embodiment of the present application.

Detailed Description

Fig. 1 is a schematic view of an application scenario of an electronic device according to an embodiment of the present application. As shown in fig. 1, the electronic device provided in the embodiment of the present application may be applied to various controllers of a vehicle 100, for example, may be applied to a vehicle computing platform 101, and may also be referred to as a mobile data center (Mobile Data Center, MDC), a cabin domain controller 103 (Cabin domain controller, CDC), and a vehicle controller 102 (Vehicle control unit, VCU) and other controllers. These controllers can be mounted at positions such as a front passenger seat of the vehicle and a trunk of the vehicle, for example. The electronic device provided by the embodiment of the application can also be applied to controllers of vehicles such as trains, planes and the like. The electronic device provided by the application can be compatible with various types of circuit boards, can be used in jolt and shake environments, is simple in assembly process, and has low requirements on assembly precision.

Fig. 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present application, and as shown in fig. 2, the electronic device provided in an embodiment of the present application includes: the circuit board 30, the first chamber 1, and the heat sink 200. The first chamber 1 houses the circuit board 30 and is filled with a first heat conductive liquid 3. The heat dissipation device 200 is used for dissipating heat of the circuit board 30 through the first heat conductive liquid 3.

In some embodiments, the circuit board 30 may be a printed circuit board (Printed Circuit Board, PCB), a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a printed circuit board, an aluminum substrate, a high frequency board, a thick copper plate, or the like. As shown in fig. 3-8, one or both sides of the circuit board 30 may be provided with one or

more chips

31, 32, 33, and the

chips

31, 32, 33 may be one or a combination of a central processing unit (central processing unit, CPU), a graphics processor (graphic processing unit, GPU), a neural network processor (neural network processing unit, NPU), a digital signal processing unit (Digital Signal Process, DSP), a Field-programmable gate array (Field-Programmable Gate Array, FPGA), and the like. The

chips

31, 32, 33 may have different sizes and heights, and be distributed at different positions on the circuit board 30, and the chips 33 may also be mounted on the circuit board 30 by the clip 70, so as to facilitate replacement due to later-stage chip 33 upgrading.

In some embodiments, as shown in fig. 3-5 and 7, the first chamber 1 may be formed by a first housing 10 and a second housing 20 together; as shown in fig. 5, the first chamber 1 may be constituted by a plurality of (two schematically drawn in fig. 5) second housings 20; as shown in fig. 8, the first chamber 1 may also be constituted by a third housing 81 and a fourth housing 82; of course, the first chamber may also be formed by an integrally formed hermetic shell (not shown).

In some embodiments, as shown in fig. 3-7 and 9, the heat sink 200 may be configured as a second housing 20 filled with a second thermally conductive liquid 4; as shown in fig. 8, the heat sink 200 may also be configured as a third housing 81 and an air cooling unit 90 provided on the third housing 81. The second heat conducting liquid may be water, and the first heat conducting liquid may be a fluorinated liquid or mineral oil.

In some embodiments, a sealing ring is provided between the first housing 10 and the second housing 20 to seal the first chamber 1. The number of the sealing rings can be one or a plurality of. In the example shown in fig. 3-8, the sealing rings include a first sealing ring 51 and a second sealing ring 52. The first seal ring 51 is located in the first groove 11 of the first housing 10, and the second seal ring 52 is located in the second groove 12 of the first housing 10. Alternatively, as shown in fig. 4A, the first seal ring 51 may be an O-ring having an O-shape in cross section, and the second seal ring 52 may be a tooth seal ring. It should be noted that the first groove 11 and the second groove 12 may be provided on the second housing 20, or grooves may be provided on both the first housing 10 and the second housing 20.

Fig. 3 is an exploded view of an electronic device according to an embodiment of the present application. As shown in fig. 3, an electronic device provided in one embodiment of the present application includes: a first housing 10, a second housing 20, and a circuit board 30. The first casing 10 and the second casing 20 together constitute a first chamber 1, and the first chamber 1 accommodates therein a circuit board 30 and a first heat conductive liquid 3 (see fig. 4A). The first heat conducting liquid 3 may be a non-aqueous working medium that is not electrically conductive, for example, the first heat conducting liquid 3 may be a fluorinated liquid or mineral oil or the like. The first chamber 1 is filled with the first heat conductive liquid 3, so that the circuit board 30 is immersed in the first heat conductive liquid 3, and heat on the circuit board 30 can be transferred to the first heat conductive liquid 3, thereby lowering the temperature of the circuit board 30. In this way, the circuit board 30 can be cooled well without providing a solid heat sink material between the circuit board 30 and the first and

second cases

10 and 20, and thus the assembly complexity caused by mounting and adjusting the solid heat sink material can be suppressed, and the assembly process is simplified. In addition, the same set of first and

second housings

10, 20 can be used to mount a plurality of different types of circuit boards 30, wherein a plurality of circuit boards 30 can also be placed in the first chamber 1, thereby enabling a reduction in manufacturing cost.

As shown in fig. 3, one or both sides of the circuit board 30 may be provided with one or

more chips

31, 32, and as previously described, the

chips

31, 32 may be one or a combination of CPU, GPU, NPU, DSP, FPGA, etc., respectively. These

chips

31, 32 may have different sizes and heights, distributed in different locations of the circuit board, wherein in the example shown in fig. 3-6, the chip 31 is mounted directly on the circuit board 30. In the example shown in fig. 7, the chip 33 is mounted on the circuit board 30 by a clip 70 to facilitate replacement by later upgrades of the chip 33.

As shown in fig. 3, the first housing 10 may have a first opening 13, a groove, and a first mounting portion 14. In the example shown in fig. 3, the first housing 10 has a rectangular parallelepiped box shape having a first opening 13 at one side. The second housing 20 is mounted on the first housing 10 to close the first opening 13, thereby constituting the first chamber 1 together with the first housing 10. The first chamber 1 is used for mounting a circuit board 30. The side of the circuit board 30 on which the

chips

31, 32 are mounted may be the same as the direction in which the first opening 13 opens, i.e., face toward the second housing 20. A groove is formed at the edge of the first opening 13 in a ring shape surrounding the first opening 13 for accommodating a sealing ring, so that the first chamber 1 is a closed chamber, preventing the first heat conducting liquid 3 from flowing out of the first chamber 1.

Alternatively, the groove may include: the first groove 11 and the second groove 12 are formed at the edge of the first opening 13, and the first groove 11 and the second groove 12 are formed to surround the first opening 13 in a ring shape and are respectively used for installing sealing rings 51 and 52, so that the first chamber 1 is a closed chamber, and the first heat conduction liquid 3 is prevented from flowing out of the first chamber 1.

Alternatively, the second recess 12 is closer to the first chamber 1 than the first recess 11, that is to say the first recess 11 is located at the periphery of the second recess 12. The first groove 11 can accommodate a first seal 51, and the second groove 12 can accommodate a second seal 52. Alternatively, as shown in fig. 4A, the first seal ring 51 may be an O-ring having an O-shape in cross section, and the second seal ring 52 may be a tooth seal ring, and in this embodiment, a portion thereof contacting the second housing 20 is zigzag or triangular in cross section. It should be noted that the first groove 11 and the second groove 12 may be provided on the second housing 20, or grooves may be provided on both the first housing 10 and the second housing 20. The setting of sealing washer has realized the seal between first casing 10 and the second casing 20, avoids first heat conduction liquid 3 to spill over, and the O shape cross-section of first sealing washer is convenient for process, and the zigzag cross-section of second sealing washer 52 can effectively prevent that first heat conduction liquid 3 from spilling over, and can bear bigger pressure, promotes sealed effect, adapts to vibrations under the on-vehicle scene.

As shown in fig. 3, the first mounting portion 14 may be located outside the first opening 13 and protrude outward with respect to the first housing 10 for fixing the second housing 20. In the example shown in fig. 3, the first mounting portions 14 are provided on both sides of the first housing 10, but the present application is not limited thereto, and the first mounting portions 14 may be provided on four sides of the first housing 10. The first and

second housings

10 and 20 may be fixedly coupled together using fasteners, and the first mounting portion 14 may have fastener through holes, for example, the fastener through holes may be screw holes, for fixing the first and

second housings

10 and 20 using screws. This fixation between the first housing 10 and the second housing 20 can facilitate replacement, repair and upgrading of the chip on the circuit board 30, and is particularly suitable for iterative updating of controllers in the fields of automatic driving and intelligent driving.

As shown in fig. 3 and 9, the second housing 20 may have a second chamber 2. In the example shown in fig. 3, the second housing 20 has a rectangular parallelepiped box shape having a cavity (i.e., the second chamber 2, see fig. 4A and 9). As shown in fig. 9, the second chamber 2 is located in the second housing 20, and a plurality of liquid guiding walls 26 may be provided in the second chamber 2, so that the second heat conductive liquid 4 flows in the second chamber 2 along a path formed by the liquid guiding walls 26 to improve cooling efficiency. The second chamber 2 may be filled with a second heat conducting liquid 4 (see fig. 4A). The second thermally conductive liquid may be water. Optionally, the second housing 20 may further include: a liquid inlet 23 and a liquid outlet 22. The liquid inlet 23 and the liquid outlet 22 are communicated with the second chamber 2 and are used for respectively leading in and leading out the second heat conduction liquid. In the example shown in fig. 3, the liquid inlet 23 and the liquid outlet 22 are disposed on one surface of the rectangular parallelepiped, but the present application is not limited thereto, and the liquid inlet 23 and the liquid outlet 22 may be disposed at any position. The liquid inlet 23 and the liquid outlet 22 may be respectively in communication with a heat conducting liquid driving source (e.g., a water pump) so as to circulate the second heat conducting liquid in the second chamber 2. The second heat-conducting liquid flowing out from the second chamber 2 radiates heat in a radiator, not shown, and then flows back to the second chamber 2.

Alternatively, the second housing 20 may further include second mounting portions 24, and in the example shown in fig. 3, the second mounting portions 24 are provided on both sides of the second housing 20, corresponding to the first mounting portions 14. Of course, the present application is not limited thereto, and the second mounting portions 24 may be provided around the second housing 20, for example, on four sides, respectively. When the second housing 20 is mounted to the first housing 10, the second housing 20 covers the first opening 13, the second mounting portion 24 of the second housing 20 may be fixed to the first mounting portion 14, and the second mounting portion 24 may have fastener holes, for example, the fastener holes may be threaded holes, so that the first mounting portion 14 and the second mounting portion 24 may be fixed to each other by screws.

Optionally, the second housing 20 may further comprise a first heat conducting liquid filling port 21. The first heat-conducting liquid injection port 21 is communicated with the first chamber 1 and is used for injecting the first heat-conducting liquid 3 into the first chamber 1. As shown in fig. 4A, the first heat conductive liquid injection port 21 may penetrate the second housing 20 in the Y direction or be inclined at an angle in the Y direction and protrude in the Y direction with respect to the second housing. As shown in fig. 4B, the first heat-conductive liquid injection port 21 may also be arranged on the side wall of the first housing 10, that is, the side wall of the first housing protrudes outward (X direction) and extends toward the second housing (Y direction), thereby forming the first heat-conductive liquid injection port 21. The first heat-conducting liquid filling port 21 may be flush with the outer surface of the second housing or may be higher than the outer surface of the second housing as shown in fig. 4B. Of course, the first heat-conducting liquid inlet 21 may be formed by the first casing 10 and the second casing 20. In a state where the second housing 20 and the first housing 10 are fixed together, the first heat-conductive liquid 3 is injected into the first chamber 1 through the first heat-conductive liquid injection port 21 until the first heat-conductive liquid 3 has a first liquid surface 35 (see a thick dotted line in fig. 4B) in contact with the second housing and a second liquid surface 34 (see a solid line in fig. 4B) lower than the opening of the first heat-conductive liquid injection port 21. In the present embodiment, the length direction of the plane in which the first housing 10 is located is taken as the X direction, the width direction of the plane in which the first housing 10 is located is taken as the Z direction, the height direction of the plane in which the first housing 10 is located is taken as the Y direction, and the direction perpendicular to the plane in which the first housing 10 is located is also taken as the Y direction, and at the same time, the Y direction is also taken as the direction perpendicular to the board surface of the circuit board 30.

In some embodiments, as shown in fig. 4A, a heat exchanging fin 60 may be further disposed on a surface of the second housing 20 facing the first chamber 1, and the heat exchanging fin 60 may be a sheet metal piece protruding outwards with respect to the second housing 20, for increasing a contact area of the second housing 20 with the first heat conductive liquid 1, thereby improving heat dissipation efficiency.

Fig. 5 is a cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, as shown in fig. 5, the first housing 10 may also have a second opening 15, which is suitable for the case of having a plurality of second housings 20. The second opening 15 is opposite to the first opening 13. The edge of the second opening 15 is provided with a groove for receiving the sealing ring around it. In the example shown in fig. 5, the grooves optionally include a third groove 16 and a fourth groove 17. The third groove 16 and the fourth groove 17 are similar to the first groove 11 and the second groove 12 and are used for accommodating a sealing ring, the third groove can be used for accommodating an O-ring with an O-shaped cross section, the fourth groove 17 can be used for accommodating a zigzag sealing ring with a zigzag cross section, and the structures of the O-ring and the zigzag sealing ring are the same as those of the foregoing embodiments, so that the details are not repeated here for brevity.

As shown in fig. 5, two second housings 20 cover the first opening 13 and the second opening 15, respectively, and are fixed to the first housing 10 so as to constitute the first chamber 1 with the first housing 10. The plurality of second housings 20 are fixed to the first housing 10 in the same manner as in the previous embodiment, and the second mounting portions and the first mounting portions may be fixed together by screws, which will not be described herein for the sake of brevity. When chips are mounted on both sides of the circuit board 30, the chips on both sides of the circuit board 30 can radiate heat through the second housing 20. In the embodiment shown in fig. 5, the heat exchanging fins 60 may be provided on the surface of one or both of the second cases 20 facing the first chamber 1, or the heat exchanging fins 60 may not be provided, as the case may be.

Fig. 7 is a cross-sectional view of an electronic device according to another embodiment of the present application. In this embodiment, the electronic device may further include a pinch plate 70, as shown in fig. 7. The clip 70 is used to mount the chip 33 to facilitate replacement of the chip 33 by later upgrades of the chip 33. The clip 70 includes a first support portion 71, a second support portion 72, and a mounting portion 73, the first support portion 71 and the second support portion 72 being located on the circuit board 30, the mounting portion 73 being supported by the first support portion 71 and the second support portion 72, and the chip 33 being mounted on the mounting portion 73.

In some embodiments, as shown in fig. 3 and 6, the electronic device may further include a solid thermally conductive portion 40, also referred to herein as a thermally conductive solid. The solid heat conducting portion 40 is located on the surface of the second housing 20 facing the first chamber 1 and corresponds to the position of the chip 31 of the circuit board 30, and the solid heat conducting portion 40 is attached to the chip 31 for dissipating heat from the chip 31. Wherein the solid thermally conductive portion 40 may be a thermally conductive interface material (Thermal Interface Materials, TIM), which may include, for example, one or more of the following: silicone grease, silica gel, a heat dissipation gasket, a phase change material and a phase change metal sheet heat conduction adhesive. In the above-described embodiment, the circuit board 30 is entirely accommodated in the first chamber 1, however, as other embodiments, a part of the circuit board 30 may be immersed in the first heat conductive liquid 3, and the electronic components provided on the other parts not immersed in the heat conductive liquid may be brought into contact with the second housing 20 through the same heat conductive material as the solid heat conductive part 40 to achieve heat dissipation.

In another embodiment, as shown in fig. 6, an electronic device may include: a circuit board 30 and a plurality of second housings 20. The difference from the above-described embodiment is that the first chamber 1 is formed by two second housings 20. The second housing may be in the shape of a rectangular parallelepiped having a third opening, the edge of which is annularly provided with grooves and sealing rings similar to those of the above-described embodiments, and when the two second housings 20 are fixed together, the third openings of the two rectangular cubes are combined relatively to constitute the first chamber 1, and the first chamber is sealed by the sealing rings. The second chamber of the second housing may be located in the side walls of the cuboid, for example, as shown in fig. 6, in all the side walls. The second chamber may also be located only in a side wall parallel to the circuit board.

In another embodiment, as shown in fig. 8, an electronic device provided in an embodiment of the present application may include: the circuit board 30, the third housing 81, the fourth housing 82, and the air cooling unit 90. The fourth housing 82 has the same structure as the first housing 10 of the above embodiment, and the fourth housing 82 may be a rectangular parallelepiped having a cavity (i.e., the first chamber 1) with one side thereof not closed (i.e., the first opening 13). The first opening 13 communicates with the first chamber 1 for mounting the circuit board 30 and the third housing 81. The side of the circuit board 30 on which the chip is mounted may be in the same direction as the opening direction of the first opening 13. Similar to the previous embodiments, the edge of the first opening 13 may be provided with grooves for receiving sealing rings, one or more of which, in the example shown in fig. 8, comprise a first groove and a second groove for mounting sealing rings, respectively, so that the first chamber 1 can be sealed by the third housing 81 by means of the sealing rings, preventing the first heat conducting liquid 3 from flowing out of the first chamber 1. For brevity, reference may be made to the above embodiments for descriptions of the sealing ring, and details are not repeated here.

The third housing 81 and the fourth housing 82 together form an inner first chamber 1 for containing the first heat conducting liquid 3 and the circuit board 30. As in the above embodiment, the third housing 81 is provided with the first heat conductive liquid inlet 25, and the first heat conductive liquid inlet 25 communicates with the first chamber 1 for injecting the first heat conductive liquid 3 into the first chamber 1. The air cooling unit 90 the air cooling unit may include a fan 91 and a driving source, and the fan 91 may be located at an outer surface of the third housing 81 for cooling the circuit board 30 by the first heat conductive liquid 3.

By the electronic device improved in the embodiment of the application, the heat dissipation effect of the vehicle-mounted electronic device (also called a controller) under the vibration condition can be ensured; the assembly precision requirement is low, the assembly mode is simple, convenient and quick, workers do not need to align the solid radiating block according to the position, the size and the height of the chip, and the assembly efficiency is improved; the situations that the solid heat dissipation material is misplaced and the solid heat dissipation material is not well attached to the circuit board due to vibration of the vehicle are reduced, the heat dissipation effect is ensured, and inconvenience caused by maintenance is reduced; in addition, the heat dissipation efficiency can be improved by radiating the circuit board through the first heat conduction liquid in the modes of air cooling or water cooling and the like, and the circuit board is suitable for more types of circuit boards.

The words "first, second, third, etc. like in the description and in the claims are used solely for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order of the objects, and it will be appreciated that the specific order or sequence may be interchanged if permitted to enable the embodiments of the application described herein to be practiced otherwise than as illustrated and described herein.

Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment, but may. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments as would be apparent to one of ordinary skill in the art from this disclosure.

Note that the above is only the preferred embodiments of the present application and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the present application has been described in connection with the above embodiments, the present invention is not limited to the above embodiments, but may include many other equivalent embodiments without departing from the spirit of the present invention, and the present invention is also within the scope of protection.

Claims

An electronic device, characterized in that: comprising the following steps:

a circuit board;

a first chamber housing the circuit board and filled with a first thermally conductive liquid, an

And the heat dissipation device is used for dissipating heat of the circuit board through the first heat conduction liquid.
The electronic device of claim 1, wherein the heat sink comprises: the second shell is internally provided with a second cavity, second heat conduction liquid is filled in the second cavity, and the second shell is in contact with the first cavity.
The electronic device of claim 2, wherein the first chamber is located in a first housing, and a sealing ring is disposed between the first housing and the second housing to seal the first chamber.
The electronic device of claim 2, wherein the second housing comprises a plurality of second housings that form the first chamber.
The electronic device of claim 3, wherein the seal ring comprises a first seal ring and a second seal ring,

the cross section of the first sealing ring is O-shaped;

the section of the second sealing ring is zigzag.
The electronic device of claim 5, wherein the second seal ring is closer to the first chamber than the first seal ring.
The electronic device according to any one of claims 3-6, wherein a surface of the second housing facing the first chamber is provided with heat exchanging fins.
The electronic device of any one of claims 2-7, wherein the second housing is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being in communication with the second chamber.
The electronic device of any one of claims 2-8, further comprising:

the liquid injection port is communicated with the first cavity and used for injecting the first heat conduction liquid into the first cavity.
The electronic device of claim 9, wherein the liquid injection port is disposed on the second housing.
The electronic device of any of claims 2-10, wherein the first thermally conductive liquid is a fluorinated liquid or mineral oil and the second thermally conductive liquid is water.
The electronic device according to any one of claims 1-11, characterized in that the electronic device is for a control unit of a vehicle.
The electronic device of any one of claims 1-12, wherein the circuit board is provided with a plurality of chips.
The electronic device of any one of claims 1-13, wherein a clip is further provided on the circuit board, the clip being for mounting a CPU.
The electronic device of any one of claims 1-14, further comprising: and the heat conducting solid is arranged on the surface of the first chamber.
A vehicle comprising an electronic device according to claim 1 to 15.