CN116184091A - Movable heat sink device, thermal vacuum test equipment and test method - Google Patents

Movable heat sink device, thermal vacuum test equipment and test method Download PDF

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Publication number
CN116184091A
CN116184091A CN202310223381.9A CN202310223381A CN116184091A CN 116184091 A CN116184091 A CN 116184091A CN 202310223381 A CN202310223381 A CN 202310223381A CN 116184091 A CN116184091 A CN 116184091A
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heat sink
thermal vacuum
temperature
vacuum test
movable heat
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程皓月
严波
朱永强
邓茂
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Chongqing University
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003—Environmental or reliability tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Environmental & Geological Engineering (AREA)
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
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  • General Health & Medical Sciences (AREA)
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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a movable heat sink device, thermal vacuum test equipment and a test method, wherein a cooling working medium flow passage is arranged in a movable heat sink of the movable heat sink device, two connecting pipes are arranged on a passing flange side by side, a movable heat sink flow passage opening is communicated with an inner opening of the connecting pipe of the passing flange through a box inner fluid pipeline, and an outer opening of the connecting pipe of the passing flange is communicated with an external temperature-adjustable cold source through a box outer fluid pipeline. The thermal vacuum test equipment is formed by combining a movable heat sink device with a thermal vacuum test box. The test method is to configure a movable heat sink device according to each temperature requirement, and attach the movable heat sink to the corresponding heat sink surface of the electronic product. The invention can freely attach the multi-heat-sink surfaces of various shapes of aerospace electronic products, solves the difficult problem of the thermal vacuum test of the electronic products with the existing multi-heat-sink surfaces, and efficiently and quickly implements the thermal vacuum test.

Description

Movable heat sink device, thermal vacuum test equipment and test method
Technical Field
The invention belongs to the technical field of environmental tests of aerospace electronic products, and particularly relates to a movable heat sink device for a thermal vacuum test of a complex aerospace electronic product with multiple heat sink surfaces, thermal vacuum test equipment assembled by the movable heat sink device and a thermal vacuum test method of the electronic product.
Background
As the functions of satellites become more and more complex, the functions of the electronic products on the satellites become more and more complex, and further the power consumption and the heat consumption of the electronic products on the satellites are obviously increased. Because the heat consumption of the electronic product is obviously increased, the electronic product is provided with a plurality of structural forms of external heat sink surfaces, so that the requirement of the electronic product with high heat consumption can be met. Because the thermal vacuum test chamber has only one heat sink surface, electronic products with multiple heat sink surfaces can be more difficult to perform in thermal vacuum tests.
A thermal vacuum test is a common environmental test type for aerospace electronic products, and aims to simulate the space vacuum environment through a thermal vacuum test box and check whether the working state of electronic equipment in the vacuum environment is consistent with the design. For the structural design and the checking direction of the product, the temperature of the electronic product during working is mainly checked to be consistent with the design value. The heat sink surface is a heat dissipation outlet of the electronic product when the thermal vacuum test is carried out, namely, waste heat of the electronic product is transferred to the outside of the thermal vacuum test box through the heat sink surface.
The typical spaceborne high heat consumption electronic product mainly comprises a phased array antenna and an electronic single machine, the appearance of the phased array antenna F with the multiple heat sink surfaces is shown in figure 1, and the external heat sink surfaces of the phased array antenna F are respectively arranged at the two sides F1 and F2 at the top of the phased array antenna and the bottom F3 of the phased array antenna. The appearance of the multi-heat-sink-surface electronic single machine G is shown in fig. 2, and the external heat-sink surfaces G1 and G2 of the single machine are respectively positioned on the top surface and the bottom surface of the single machine.
As shown in fig. 3, when the electronic product performs the thermal vacuum test, since the thermal vacuum test chamber O only provides one temperature-controllable supporting base plate heat sink surface H, the phased array antenna with multiple heat sink surfaces and the single heat sink surface cannot be closely attached to the heat sink surface H of the thermal vacuum test chamber at the same time. Further, when the heat sink temperatures (F1 to F3 heat sink surfaces, G1 to G2 heat sink surfaces) required by the multiple heat sink surfaces are inconsistent, the heat sink surface H of the thermal vacuum test chamber cannot provide multiple heat sink test temperatures. Electronic products with multiple heat sink surfaces cannot be tested in a thermal vacuum test, and the test is difficult.
Disclosure of Invention
The invention aims to solve the problems of the prior art, and provides a mobile heat sink device which can be freely attached to multiple heat sink surfaces of various shapes of aerospace electronic products, solves the difficult problem of the thermal vacuum test of the electronic products with the existing multiple heat sink surfaces, and can efficiently and quickly implement the thermal vacuum test. The invention also provides thermal vacuum test equipment and a thermal vacuum test method for the electronic product.
In order to solve the technical problems, the technical scheme of the invention is as follows:
in a first aspect, the invention provides a mobile heat sink device, which comprises a mobile heat sink, a through-bin flange, an in-box fluid pipeline, an out-box fluid pipeline and an external temperature-adjustable cold source; the movable heat sink is internally provided with a cooling working medium runner, two connecting pipes are arranged on the passing flange side by side, the movable heat sink runner port is communicated with the connecting pipe inner port of the passing flange through an in-box fluid pipeline, and the passing flange connecting pipe outer port is communicated with an external temperature-adjustable cold source through an out-box fluid pipeline.
In a second aspect, the invention provides a thermal vacuum test device, which comprises a thermal vacuum test box and the movable heat sink device, wherein a through-bin flange is arranged at a through-bin flange hole of the vacuum test box, the movable heat sink and a fluid pipeline in the box are arranged in the thermal vacuum test box, and an external fluid pipeline and an external temperature-adjustable cold source are arranged outside the thermal vacuum test box.
In a third aspect, the present invention provides a thermal vacuum test method for an electronic product, including the steps of:
1. placing test piece
Placing a test piece on a supporting bottom plate of a thermal vacuum test box, determining the temperature of each heat sink surface of an electronic product, configuring a movable heat sink device according to each temperature requirement, and attaching the movable heat sink to the corresponding heat sink surface of the electronic product;
2. presetting a heat sink surface cooling temperature
The cooling temperature of each external adjustable temperature cold source is preset, and temperature measuring points are arranged on the surface of the movable heat sink; the electronic single machine is internally provided with a temperature measuring point P
3. Thermal vacuum test
Starting an external temperature-adjustable cold source, and circularly flowing a cooling working medium to dissipate heat; and starting the thermal vacuum test box according to a normal thermal vacuum test flow, providing a vacuum environment and a background radiation temperature environment by the thermal vacuum test box, electrifying the electronic product to work to a preset state, and reading and recording the data of each temperature measuring point.
Preferably, the electronic product is placed horizontally, a set of movable heat sink devices is added, the added movable heat sink is attached to the bottom heat sink surface of the electronic product, and the temperature of the bottom heat sink surface is preset.
The invention has the technical effects that:
according to the movable heat sink device, the temperature-controllable heat sink can be arranged at any position in the thermal vacuum test equipment so as to meet the thermal vacuum test requirement of the multi-heat sink electronic product, the difficulty of the thermal vacuum test of the multi-heat sink surface is greatly reduced, and the thermal vacuum test can be efficiently and rapidly implemented. By using the thermal vacuum test method, the placing mode of the sample is adjusted, the electronic product is horizontally placed, the influence of a gravitational field on the performance of the sample is reduced, and the thermal vacuum test method is close to the real state in an aerospace weightlessness environment.
Drawings
The drawings of the present invention are described as follows:
fig. 1 is a diagram of the profile of a typical multi-heatsink-plane phased array antenna F;
FIG. 2 is a schematic diagram of a typical multi-heat sink electronic stand-alone G;
FIG. 3 is a diagram showing the placement of a multi-heat sink electronic product in a thermal vacuum test chamber;
FIG. 4 is a schematic diagram of a mobile heat sink device according to the present invention;
FIG. 5 is a schematic view of a first thermal vacuum testing apparatus according to the present invention;
FIG. 6 is a schematic diagram of a second thermal vacuum testing apparatus according to the present invention;
FIG. 7 is a diagram of the structure of an electronic stand-alone for a test example;
FIG. 8 is a thermal vacuum test chart of test mode 1 of the test example;
FIG. 9 is a thermal vacuum test chart of test mode 2 of the test example;
FIG. 10 is a thermal vacuum test chart of test mode 3 of the test example;
FIG. 11 is a thermal vacuum test chart of test mode 4 of the test example.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings:
as shown in fig. 4, the mobile heat sink device of the present invention comprises a mobile heat sink 101, a through-bin flange 102, a tank inner fluid pipeline 103, an out-tank fluid pipeline 104 and an external temperature-adjustable cold source 105; the movable heat sink 101 is internally provided with a cooling working medium flow passage, the passing cabin flange 102 is provided with two connecting pipes side by side, the flow passage opening of the movable heat sink 101 is communicated with the inner opening of the connecting pipe of the passing cabin flange 102 through a tank fluid pipeline 103, and the outer opening of the connecting pipe of the passing cabin flange 102 is communicated with an external temperature-adjustable cold source 105 through a tank fluid pipeline 104.
The inside of the movable heat sink 101 is cooled by a cooling working medium (refrigerant) into liquid, gas-liquid two-phase fluid or gas, and a liquid flow channel or a gas flow channel is correspondingly formed. The liquid and gas-liquid two-phase refrigerant corresponds to the liquid cold source, and the gas refrigerant corresponds to the gas cold source. The refrigerant can flow in the movable heat sink 101 for heat exchange.
The in-tank fluid pipeline 103 and the out-tank fluid pipeline 104 both comprise a liquid supply pipe and a liquid return pipe, the cooling working medium circularly flows between the external temperature-adjustable cold source 105 and the movable heat sink 101, the external temperature-adjustable cold source 105 sets the temperature of the cooling working medium, and takes away waste heat absorbed by the movable heat sink 101 and discharges the waste heat to the outside of the thermal vacuum test box so as to ensure that the movable heat sink 101 maintains the constant temperature preset. The corresponding relationship between the movable heat sink 101 and the external temperature-adjustable cold source 105 can be one-to-one, one-to-many, or many-to-one.
In particular, the in-tank fluid conduit 103 is a flexible conduit, preferably a stainless steel bellows, to ensure that the movable heat sink 101 is moved and positioned in any direction and at any angle within the thermal vacuum test tank.
The movable heat sink device and the thermal vacuum test chamber O are combined together to form the thermal vacuum test equipment. As shown in fig. 5 and 6, the thermal vacuum test equipment provided by the invention comprises a thermal vacuum test chamber O and a movable heat sink device, wherein a through-bin flange 102 is arranged at a through-bin flange hole of the vacuum test chamber, a movable heat sink 101 and a fluid pipeline 103 in the chamber are arranged in the thermal vacuum test chamber, and an external fluid pipeline 104 and an external temperature-adjustable cold source 105 are arranged outside the thermal vacuum test chamber. The through-bin flange belongs to a standard component of a thermal vacuum test box.
Because the hot vacuum test chamber O belongs to high-value test equipment, in order to ensure the safety in the hot vacuum test chamber and avoid the leakage of cooling medium in the chamber, the movable heat sink 101, the through-warehouse flange 102 and the in-chamber fluid pipeline 103 can be made into a whole. The in-box fluid pipeline 103, the movable heat sink 101 and the joint pipe of the penetrating flange 102 are welded into a whole, so that the reliability of the internal structure of the thermal vacuum test equipment is improved.
The invention provides a thermal vacuum test method for an electronic product, which comprises the following steps:
1. placing test piece
The test piece is placed on a supporting bottom plate of a thermal vacuum test box, the temperature of each heat sink surface of the electronic product is determined, the movable heat sink device is configured according to each temperature requirement, and the movable heat sink is tightly attached to the corresponding heat sink surface of the electronic product by using screws or C-shaped pliers.
2. Presetting a heat sink surface cooling temperature
The cooling temperature of each external adjustable temperature cold source is preset, and temperature measuring points are arranged on the surface of the movable heat sink; the temperature measuring point P is arranged in the electronic single machine, and the temperature of each point is monitored by a thermocouple or a thermistor.
3. Thermal vacuum test
Starting an external temperature-adjustable cold source, and circularly flowing a cooling working medium to dissipate heat; and starting the thermal vacuum test box according to a normal thermal vacuum test flow, providing a vacuum environment and a background radiation temperature environment by the thermal vacuum test box, electrifying the electronic product to work to a preset state (namely a product design state), and reading and recording the data of each temperature measuring point.
As shown in fig. 5, a typical multi-heat-sink-surface phased array antenna F is taken as a test object, and the configuration of the test method of the present invention is describedAnd (5) solving. According to the thermal vacuum requirement of the phased array antenna, the heat sinking surfaces F1, F2 and F3 require the temperature of the heat sinking surfaces to be T respectively when the thermal vacuum test is carried out F1 、T F2 、T F3 。
The mobile heat sink device of the present invention was configured with 2 sets (A, B) of thermal vacuum tests. During the thermal vacuum test, the phased array antenna F is placed on the heat sink surface H of the supporting bottom plate with controllable temperature in the thermal vacuum test box O, and the temperature is set as T F3 . The movable heat sink 101A is arranged at the heat sink surface F1, and the temperature of the refrigerant of the external temperature-adjustable cold source 105A is set to be T F1 To ensure the heat sink temperature at F1 is T F1 . Similarly, the movable heat sink 101B is placed at the heat sink surface F2, and the temperature of the refrigerant of the external temperature-adjustable cold source 105B is set as T F2 . And starting the thermal vacuum test box according to a normal thermal vacuum test, so that the thermal vacuum test of the multi-heat-sink-surface electronic product can be performed.
Because the electronic product with multiple heat sink surfaces has a complex internal structure, a heat pipe or a soaking plate is required to conduct heat efficiently. Because the heat transfer performance of the heat pipe or the soaking plate is affected by gravity, the placement direction of the electronic product needs to be adjusted during the thermal vacuum test, so as to reduce the influence of gravity on the heat transfer performance of the heat pipe or the soaking plate. As shown in fig. 6, because the heat transfer direction of the heat pipe inside the phased array antenna is affected by gravity, the phased array antenna F is placed horizontally, a set of the mobile heat sink device of the invention is added, a third mobile heat sink 101C is attached to the bottom F3 heat sink surface of the phased array antenna, and the temperature is set to be T F3 。
Comparison of four test modes
As shown in fig. 7, the electronic single machine G has 2 heat sink surfaces G1 and G2 respectively located at the top and bottom of the electronic single machine, and a two-phase vapor chamber is used as a heat conduction enhancement structure in the electronic single machine, and the flow direction of two-phase working medium in the vapor chamber is in the direction of thick arrow; the temperature measuring point P is arranged in the electronic single machine, and the temperature of the electronic single machine can be monitored in a thermal vacuum test. According to the working environment on the satellite, the temperature of the G1 heat sink surface is required to be 55 ℃ and the temperature of the G2 heat sink surface is required to be 45 ℃ when a thermal vacuum test is carried out. When the single machine G works on the satellite, the top surface G1 of the single machine G is attached with a platform heat pipe as a heat sink to dissipate heat. Because the satellite platform heat pipe has larger length and turning radius, and the thermal vacuum test box has limited volume, the test cannot be carried out by adopting a heat dissipation mode consistent with the satellite platform heat pipe when the thermal vacuum test is carried out. The thermal vacuum test of the electronic stand-alone is performed in the following 4 ways:
test mode 1: as shown in fig. 8, the electronic stand-alone G is normally placed on the heat sink surface H of the temperature-controllable support base plate of the thermal vacuum test chamber. A copper door-shaped auxiliary heat dissipation clamp is used and is attached to the heat sink surface G2 and the heat sink surface H of the bottom plate. A temperature measuring point P is arranged at the top of the door-shaped clamp A1 ～P A5 Monitoring the temperature of the heat sink surface G2, and arranging temperature measuring points P along the height direction by the door-shaped clamp A6 ～P A8 The clamp is monitored for changes in temperature along the height. After the arrangement is completed, a thermal vacuum test is carried out, and the temperature of the bottom heat sink surface H is set to be 45 ℃. After the temperature is stabilized, P is measured A1 ～P A8 The temperature at each point was 58 ℃, 60 ℃, 63 ℃, 57 ℃, 53 ℃, 50 ℃ and 45 ℃. The temperature at the temperature measuring point P in the electronic single machine G is 78 ℃.
Test mode 2: as shown in fig. 9, the electronic stand-alone G is horizontally placed on the heat sink surface H of the temperature-controllable support base plate of the thermal vacuum test chamber. An L-shaped auxiliary heat dissipation clamp made of copper is used and is attached to heat sink surfaces G1 and G2 and a bottom plate heat sink surface H. Temperature measuring points P are respectively arranged along the height direction of the L-shaped clamp B1 ～P B4 And P B5 ～P B8 . After the arrangement is completed, a thermal vacuum test is carried out, and the temperature of the heat sink surface H is set to be 45 ℃. After the temperature is stabilized, P is measured B1 ～P B8 The temperature at each point was 45 ℃, 48 ℃, 50 ℃, 52 ℃, 45 ℃, 49 ℃, 52 ℃ and 55 ℃. The temperature at the temperature measuring point P inside the electronic unit G is 73 ℃.
Test mode 3: as shown in fig. 10, the electronic stand-alone G is normally placed on the temperature-controllable support base plate heat sink surface H of the thermal vacuum test chamber. The movable heat sink 101A is mounted at the heat sink face G1 using a set of the movable heat sink apparatus of the present invention. The movable heat sink surface is provided with a temperature measuring point P C1 ～P C4 . After the arrangement is completed, a thermal vacuum test is carried out, and a heat sink is arrangedThe temperature of the surface H is 45 ℃, and the temperature of the refrigerant of the external temperature-adjustable cold source 105A is 55 ℃. After the temperature is stabilized, P is measured C1 ～P C4 The temperature at each point was 55℃and 55 ℃. The temperature at the temperature measuring point P inside the electronic unit G is 72 ℃.
Test mode 4: as shown in fig. 11, the electronic stand-alone G is placed horizontally on the heat sink surface H of the temperature-controllable support base plate of the thermal vacuum test chamber. With the two sets of the mobile heat sink devices of the present invention, the mobile heat sink 101A is mounted at the heat sink surface G1, and the mobile heat sink 101B is mounted at the heat sink surface G2. The movable heat sink surface is provided with a temperature measuring point P D1 ～P D4 And P D5 ～P D8 . After the arrangement is completed, a thermal vacuum test is carried out, the heat sink surface H is set to be not working, the temperature of the refrigerant of the external temperature-adjustable cold source 105A is 55 ℃, and the temperature of the refrigerant of the external temperature-adjustable cold source 105B is 45 ℃. After the temperature is stabilized, P is measured D1 ～P D8 The temperature of each point was 55℃and 45℃and 45℃respectively. The temperature at the temperature measuring point P in the electronic single machine G is 70 ℃.
Test results for test modes 1-4 are shown in Table 1:
table 1 test 1 to 4 test result summary table
Figure BDA0004117628910000061
Figure BDA0004117628910000071
As is evident from table 1: the 1 st and 2 nd test modes of the mobile heat sink device are not used, and the multi-heat sink surface electronic single machine G is difficult to test and examine completely according to the test requirement. In the 3 rd and 4 th test modes of the invention, environmental test and examination can be carried out according to test requirements. On the basis of using the invention, the arrangement direction of the electronic single machine G is properly adjusted, so that the influence of gravity on the electronic single machine test can be eliminated, and the test result is further close to the real state in the space navigation weightlessness environment.

Claims (6)

1. A mobile heat sink apparatus, characterized by: the heat pump comprises a movable heat sink (101), a through-bin flange (102), a tank inner fluid pipeline (103), a tank outer fluid pipeline (104) and an external adjustable temperature cold source (105); the movable heat sink (101) is internally provided with a cooling working medium flow passage, two connecting pipes are arranged on the passing bin flange (102) side by side, the flow passage opening of the movable heat sink (101) is communicated with the inner opening of the connecting pipe of the passing bin flange (102) through an in-box fluid pipeline (103), and the outer opening of the connecting pipe of the passing bin flange (102) is communicated with an external temperature-adjustable cold source (105) through an out-box fluid pipeline (104).
2. The mobile heat sink apparatus of claim 1, wherein: the in-tank fluid conduit (103) is a flexible conduit.
3. The utility model provides a thermal vacuum test equipment, includes thermal vacuum test chamber, characterized by: the movable heat sink device of claim 1 or 2, wherein the through-bin flange (102) is arranged at the through-bin flange hole of the vacuum test box, the movable heat sink (101) and the in-box fluid pipeline (103) are arranged in the thermal vacuum test box, and the out-box fluid pipeline (104) and the external adjustable temperature cold source (105) are arranged outside the thermal vacuum test box.
4. A thermal vacuum testing apparatus according to claim 3, wherein: the inner fluid pipeline (103) of the box is welded with the joint pipe of the movable heat sink (101) and the penetrating bin flange (102) into a whole.
5. The thermal vacuum test method for the electronic product is characterized by comprising the following steps of:
1. placing test piece
Placing a test piece on a supporting bottom plate of a thermal vacuum test box, determining the temperature of each heat sink surface of the electronic product, configuring a movable heat sink device according to each temperature requirement, and attaching the movable heat sink to the corresponding heat sink surface of the electronic product;
2. presetting a heat sink surface cooling temperature
The cooling temperature of each external adjustable temperature cold source is preset, and temperature measuring points are arranged on the surface of the movable heat sink; the electronic single machine is internally provided with a temperature measuring point P
3. Thermal vacuum test
Starting an external temperature-adjustable cold source, and circularly flowing a cooling working medium to dissipate heat; and starting the thermal vacuum test box according to a normal thermal vacuum test flow, providing a vacuum environment and a background radiation temperature environment by the thermal vacuum test box, electrifying the electronic product to work to a preset state, and reading and recording the data of each temperature measuring point.
6. The method for thermal vacuum testing of electronic products according to claim 5, wherein the method comprises the steps of: and horizontally placing the electronic product, adding a set of movable heat sink device, attaching the added movable heat sink to the bottom heat sink surface of the electronic product, and presetting the temperature of the bottom heat sink surface.
CN202310223381.9A 2023-03-09 2023-03-09 Movable heat sink device, thermal vacuum test equipment and test method Pending CN116184091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310223381.9A CN116184091A (en) 2023-03-09 2023-03-09 Movable heat sink device, thermal vacuum test equipment and test method

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Application Number Priority Date Filing Date Title
CN202310223381.9A CN116184091A (en) 2023-03-09 2023-03-09 Movable heat sink device, thermal vacuum test equipment and test method

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