CN116164781B - MEMS sensor based on optical fiber F-P cavity and packaging method thereof - Google Patents

MEMS sensor based on optical fiber F-P cavity and packaging method thereof Download PDF

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Publication number
CN116164781B
CN116164781B CN202310434277.4A CN202310434277A CN116164781B CN 116164781 B CN116164781 B CN 116164781B CN 202310434277 A CN202310434277 A CN 202310434277A CN 116164781 B CN116164781 B CN 116164781B
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collimator
threaded
packaging shell
packaging
thread
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CN116164781A (en
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马志波
李若飞
王嘉言
喜奇
苑伟政
任森
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Northwestern Polytechnical University
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Northwestern Polytechnical University
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/353—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre
    • G01D5/35306—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement
    • G01D5/35309—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement using multiple waves interferometer
    • G01D5/35312—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells influencing the transmission properties of an optical fibre using an interferometer arrangement using multiple waves interferometer using a Fabry Perot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/16—Elements for restraining, or preventing the movement of, parts, e.g. for zeroising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

The invention discloses an MEMS sensor based on an optical fiber F-P cavity and a packaging method thereof, belonging to the technical field of optical fiber sensors, wherein the MEMS sensor comprises a packaging shell for packaging a sensitive chip, one end of the packaging shell, which is far away from the sensitive chip, is in threaded connection with a threaded collimator, one end of the threaded collimator, which is positioned outside the packaging shell, is fixedly provided with an outer collimator limiting block, a threaded fixer is arranged between one end of the packaging shell, which is far away from the sensitive chip, and the outer collimator limiting block, and the threaded fixer is sleeved outside the threaded collimator; an inner limit block of the collimator is fixedly arranged on the inner side wall of the packaging shell, and an optical fiber penetrates through the center of the threaded collimator; the packaging shell, the thread fixer and the collimator outer limiting block are fixed through an outer fixing ring and high-temperature glue, and a plurality of thread adjusting bolts are further connected to the packaging shell through threads. The invention can improve the connection stability of the collimator, reduce the light path deviation and solve the problems of thermal expansion coefficient mismatch and thermal stress caused by the fact that the collimator is fixed by high Wen Jiaofeng.

Description

MEMS sensor based on optical fiber F-P cavity and packaging method thereof
Technical Field
The invention relates to the technical field of optical fiber sensors, in particular to an MEMS sensor based on an optical fiber F-P cavity and a packaging method thereof.
Background
The optical fiber collimator mainly comprises an optical fiber and a collimating lens, can convert divergent beams emitted from the end face of a common quartz optical fiber into parallel beams, and improves the working distance of the rear-end optical assembly, so that the rear-end optical assembly is isolated from a high-temperature area, and measurement in a high-temperature environment can be realized by combining a high-temperature resistant sensitive structure. The packaging of collimators for optical MEMS sensors is largely divided into two forms: optical fiber in-line and lens-isolated. Compared with the optical fiber direct-insertion type, the lens isolation type structure scheme has the characteristics of higher high-temperature stability, more stable transmitted light signals, small beam divergence angle, small volume, light weight and the like, and is more beneficial to continuous measurement work in extreme environments, so that the sensor packaging form is usually selected as a lens isolation type. Lens isolation mainly uses fiber collimators to isolate the back-end optics from the high temperature region to achieve high temperature sensor applications, and therefore, research on the way in which collimators are assembled with the sensor body is becoming increasingly important.
Currently, the lens-isolated F-P cavity MEMS sensor is usually connected to the collimator and the sensor post by means of adhesive bonding. The manner of the adhesive connection thus needs to be satisfied: 1. after bonding, ensuring that the distance from the collimator to the sensitive chip is the optimal working distance of the collimator; 2. the emergent light spot of the collimator should be positioned at the center of the inner hole of the ceramic tube as much as possible, so that the sensitive chip can be positioned at the center of the end face of the ceramic tube. In order to ensure that light can still be aligned with the sensitive chip after gluing, high-temperature glue needs to be smeared uniformly as much as possible, however, errors exist under manual operation to influence the glue smearing amount, so that collimated parallel light cannot be aligned with the sensitive chip. Meanwhile, because the thermal expansion coefficients of the high-temperature glue and the sensor pillar material are different, the mismatch of the thermal expansion coefficients is easy to generate at a higher temperature, so that the collimated light path is deviated, and the MEMS sensor fails. In addition, the stress concentration may also affect the reliability of the package structure due to residual stress caused by thermal expansion mismatch.
Disclosure of Invention
Aiming at the problems, the invention aims to provide an optical fiber F-P cavity-based MEMS sensor and a packaging method thereof, which can improve the connection stability of a collimator, reduce the light path offset and solve the problems of thermal expansion coefficient mismatch and thermal stress caused by using a high Wen Jiaofeng fixed collimator at present.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the MEMS sensor based on the optical fiber F-P cavity comprises a packaging shell for packaging a sensitive chip, and is characterized in that: the end, far away from the sensitive chip, of the packaging shell is movably connected with a threaded collimator, an outer collimator limiting block is fixedly arranged at the end, located outside the packaging shell, of the threaded collimator, a threaded fixer is arranged between the end, far away from the sensitive chip, of the packaging shell and the outer collimator limiting block, and the threaded fixer is sleeved outside the threaded collimator; a circle of collimator inner limiting block is fixedly arranged on the inner side wall of the packaging shell, and an optical fiber penetrates through the center of the threaded collimator.
Furthermore, the packaging shell, the threaded fixer and the collimator outer limiting block are also sleeved with the same outer fixing ring, the outer fixing ring is in threaded connection with the threaded fixer, and the outer fixing ring is fixed with the packaging shell and the collimator outer limiting block through high-temperature glue.
Further, three adjusting bolt positioning grooves are symmetrically formed in the packaging shell along the circumferential direction, each adjusting bolt positioning groove is internally provided with a threaded adjusting bolt in a threaded mode, an adjusting bolt fixing sleeve shell is arranged outside each threaded adjusting bolt, and each adjusting bolt fixing sleeve shell is fixed with the outer side wall of the packaging shell through high-temperature glue.
Further, three abdication grooves matched with the fixed casing of the adjusting bolt are formed in the inner side wall of the outer fixing ring.
Further, an external thread is arranged on the middle section of the outer side wall of the thread collimator, an internal thread is arranged on the inner side wall of one end of the packaging shell, which is far away from the sensitive chip, and the thread collimator is in threaded connection with the packaging shell.
Further, the threaded collimator is made of ceramic materials.
Further, the packaging method of the MEMS sensor based on the optical fiber F-P cavity is characterized by comprising the following steps of,
s1: the packaging shell and the thread collimator which are packaged with the sensitive chip are respectively fixed on a pair of horizontally placed work adjusting frames, and the light screen is placed on the same straight line with the two work adjusting frames;
s2: connecting a light source with the threaded collimator, and adjusting a working adjusting frame provided with the threaded collimator to enable light emitted by the threaded collimator to reach the central point of the light screen;
s3: connecting the threaded collimator with an optical power meter, detecting the light intensity of the returned light emitted by the light source through the optical power meter after passing through the sensitive chip, and then detecting the light intensity of the light reaching the optical power meter through the threaded collimator and the optical fiber, and accurately adjusting a working adjusting frame corresponding to the threaded collimator to determine the maximum position of the returned light intensity, namely the optimal working distance of the threaded collimator;
s4: and connecting and fixing the threaded collimator and the packaging shell.
Further, the specific operation of step S4 includes the steps of,
s401: the thread fixer is sleeved on the thread collimator, a work adjusting frame provided with the thread collimator is adjusted, and the thread collimator is screwed into the packaging shell;
s402: when the threaded collimator reaches the maximum limit position, the threaded fixer is tightly attached to the collimator outer limit block;
s403: the outer fixing ring is sleeved from one end of the packaging shell, which is far away from the threaded collimator, and is sleeved on the threaded fixer and the collimator outer limiting block, and is reinforced by high-temperature glue;
s404: and (3) observing the optical power meter again, if the performance requirement cannot be met, inserting a threaded adjusting bolt into the adjusting bolt positioning groove to align the optical path of the threaded collimator, sleeving an adjusting bolt fixing sleeve shell outside the threaded adjusting bolt after the maximum light intensity point is obtained, and fixing through high-temperature glue to finish packaging.
The beneficial effects of the invention are as follows: compared with the prior art, the invention has the advantages that,
1. the MEMS sensor based on the optical fiber F-P cavity is connected with the packaging shell by adopting the screw threads outside the collimator, so that the problem of thermal expansion coefficient mismatch caused by uneven coating of high-temperature glue in the prior art and the problem of residual stress caused by solidification of the high-temperature glue are avoided, the stability of the collimator in the cavity structure is improved, the light intensity received by a receiving end is increased, and the static and dynamic performances of the sensor are improved.
2. The thread collimator is made of ceramic materials and is in a thread matching structure with the packaging shell, so that stress between the thread collimator and the packaging support column is reduced, and the sensor can keep stable performance in an ultra-high temperature environment by adopting ceramic materials with low thermal expansion coefficients.
3. According to the invention, the threaded collimator and the packaging shell are in threaded connection, the adapted threads can be calculated in advance according to materials, the reliability is improved, the system error is reduced, and meanwhile, compared with the traditional packaging mode of high-temperature glue connection, complicated steps of waiting for curing of the high-temperature glue, tempering, eliminating residual stress and the like are required, the threaded connection can simplify the whole packaging process, and the packaging efficiency of the collimator and the packaging shell in a limited time is improved.
4. The MEMS sensor based on the optical fiber F-P cavity is further provided with the adjusting bolt positioning groove and the corresponding threaded adjusting bolt on the packaging shell, so that the position of the threaded collimator in the packaging process can be finely adjusted, the centering accuracy is improved, and the sensor accuracy is further improved.
Drawings
FIG. 1 is a front view of a MEMS sensor structure of the present invention.
Fig. 2 is an enlarged view of a portion a of fig. 1 according to the present invention.
FIG. 3 is a side view of a MEMS sensor structure of the present invention.
Fig. 4 is a cross-sectional view of the package housing of the present invention in a position corresponding to the threaded adjustment pin.
FIG. 5 is a schematic view of the structure of the outer fixing ring of the present invention.
FIG. 6 is a schematic diagram of the connection relationship of the MEMS sensor packaging process according to the present invention.
Wherein: the optical power meter comprises a 1-sensitive chip, a 2-packaging shell, a 3-collimator inner limiting block, a 4-thread collimator, a 5-thread fixer, a 6-outer fixing ring, a 601-abdication groove, a 7-collimator outer limiting block, an 8-optical fiber, a 9-adjusting bolt fixing sleeve, a 10-thread adjusting bolt, 11-high temperature glue, a 12-adjusting bolt positioning groove, 13-working adjusting frames, 14-light sources, 15-optical power meters and 16-light screens.
Detailed Description
In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is further described below with reference to the accompanying drawings and examples.
Example 1
Referring to the accompanying drawings 1-5, the MEMS sensor based on the optical fiber F-P cavity comprises a packaging shell 2 for packaging a sensitive chip 1, wherein the sensitive chip 1 is packaged at one end part of the packaging shell 2, one end of the packaging shell 2, which is far away from the sensitive chip 1, is in threaded connection with a threaded collimator 4, an external thread is arranged on the middle section of the outer side wall of the threaded collimator 4, an internal thread is arranged on the inner side wall of one end, which is far away from the sensitive chip 1, of the packaging shell 2, and the threaded collimator 4 is in threaded connection with the packaging shell 2.
The end, outside the packaging shell 2, of the threaded collimator 4 is fixedly provided with a collimator outer limiting block 7, the threaded collimator 4 and the outer limiting block 7 are of an integral structure, a threaded fixer 5 is arranged between one end, far away from the sensitive chip 1, of the packaging shell 2 and the collimator outer limiting block 7, an outer thread is arranged on the outer side wall of the threaded fixer 5, the inner side wall is of a smooth design, can be sleeved outside the threaded collimator 4, and can slide along the long axis direction of the threaded collimator 4; the outer diameters of the packaging shell 2 and the collimator outer limiting block 7 are the same; a circle of collimator inner limiting block 3 for limiting the front end position of the threaded collimator 4 is fixedly arranged on the inner side wall of the packaging shell 2, and the function of the collimator inner limiting block 3 is to prevent the threaded collimator 4 from being excessively and inwards propped against the sensitive chip 1; the center of the thread collimator 4 is provided with an optical fiber 8 in a penetrating way.
The packaging shell 2, the thread fixer 5 and the collimator outer limiting block 7 are also sleeved with the same outer fixing ring 6, the inner side wall of the outer fixing ring 6 is provided with an inner thread matched with the outer thread on the outer side wall of the thread fixer 5, so that the outer fixing ring 6 is in threaded connection with the thread fixer 5, and the outer fixing ring 6 is also fixed with the packaging shell 2 and the collimator outer limiting block 7 through high-temperature glue 11; in order to reduce the impact between the collimator outer limiting block 7 and the threaded fixer 5, a rubber gasket is arranged on one side of the collimator outer limiting block 7, which is close to the threaded collimator 4, and the rubber gasket can also serve as a substrate to play a sealing role.
The packaging shell 2 is provided with three adjusting bolt positioning grooves 12 symmetrically along the circumferential direction, the round surface where the three adjusting bolt positioning grooves 12 are located is located in front of an external thread part of the threaded collimator 4, each adjusting bolt positioning groove 12 is internally and uniformly connected with a threaded adjusting bolt 10, an adjusting bolt fixing sleeve shell 9 is arranged outside each threaded adjusting bolt 10, and each adjusting bolt fixing sleeve shell 9 is also fixed with the outer side wall of the packaging shell 2 through high-temperature glue 11.
In order to avoid blocking the outer fixing ring 6 by the fixing sleeve 9 of the adjusting bolt, three giving way grooves 601 matched with the fixing sleeve 9 of the adjusting bolt are formed in the inner side wall of the outer fixing ring 6, so that the outer fixing ring 6 is conveniently sleeved to the rear end of the screw collimator 4 from the front end of the screw collimator 4.
Preferably, the screw collimator 4 is made of ceramic material, the ceramic has small thermal expansion coefficient, and the screw collimator can be lubricated to increase the reliability and strength of the joint.
Example 2
Embodiment two provides a packaging method of the MEMS sensor based on the optical fiber F-P cavity in embodiment one, which specifically comprises the following steps,
s1: the packaging shell 2 and the screw collimator 4 which are packaged with the sensitive chip 1 are respectively fixed on a pair of horizontally placed working adjusting frames 13, the starting distance of the packaging shell 2 and the screw collimator 4 is based on the designed working distance, and the light is irradiated by adjusting the positions of the two working adjusting frames 13; placing the screener 16 in alignment with the two work adjusting frames 13 as illustrated in figure 6;
s2: connecting a light source 14 with the screw collimator 4, and adjusting a work adjusting frame 13 provided with the screw collimator 4 to enable light emitted by the screw collimator 4 to reach the central point of the light screen 16;
a source 14 of visible light is connected to the screw collimator 4 to determine the return light position of the sensitive chip 1, and when light is emitted, the law of reflection of the light is mainly utilized. Firstly, ensuring that the emergent light spot of the thread collimator 4 strikes the middle of the sensitive chip 1, at the moment, the sensitivity of the sensor is the highest, and then carrying out subsequent adjustment according to the returned light position of the sensitive chip 1.
Then, looking at the sensitive chip 1 from the screw collimator 4, when the light spot position is deviated to the left (right) of the light screen 16, which means that the incident light angle of the screw collimator 4 is deviated to the center on the XOY plane, the deviated light spot can be adjusted to the center by feeding the corresponding work adjusting frame 13 of the screw collimator 4 outward (inward) along the Z axis and adjusting the work adjusting frame 13 inward (outward) along the Y axis.
S3: the screw collimator 4 is connected with the optical power meter 15, the optical power meter 15 detects the light intensity of the returned light emitted by the light source 14 after passing through the sensitive chip 1 and reaching the optical power meter 15 through the screw collimator 4 and the optical fiber 8, and then accurately adjusts the corresponding work adjusting frame 13 of the screw collimator 4 to determine the maximum position of the returned light intensity, namely the optimal working distance of the screw collimator 4;
in step S2, after the relative positions of the screw collimator 4 and the package housing 2 are preliminarily determined by using visible light, the screw collimator 4 is connected with the optical power meter 15, the optical power meter 15 detects the light intensity of the returned light emitted by the light source 14 and passing through the sensitive chip 1, and then the returned light reaches the optical power meter 15 through the screw collimator 4 and the optical fiber 8, and when the returned light power is maximum, the signal is optimal.
After the adjustment is completed at a certain distance, the position of the working adjusting frame 13 is adjusted, the relative distance between the sensitive chip 1 and the threaded collimator 4 is changed, fine adjustment is continued, the return light power values of different distances are obtained, and the distance corresponding to the maximum value is the optimal working distance of the threaded collimator 4.
If the maximum is not reached or there is no change in the optical power, it is necessary to repeat the visible light exposure or to check whether the detection system is working effectively.
S4: the thread collimator 4 is fixedly connected with the packaging shell 2;
specifically, S401: the thread fixer 5 is sleeved on the thread collimator 4, a work adjusting frame 13 on which the thread collimator 4 is arranged is adjusted, and the thread collimator 4 is screwed into the packaging shell 2; it should be noted that, the work adjusting frame 13 is provided with a knob, and the positions of the screw collimator 4 on the X axis, the Y axis and the Z axis can be adjusted, and the work adjusting frame 13 is in the prior art, and the specific structure thereof is not described in the application.
When the screw collimator 4 is connected with the package housing 2, the screw collimator 4 receives red light for observing the light spot position. When the sensor is packaged, the red light is used for observing and adjusting the position of the light spot, the light spot is ensured to be positioned at the center of the sensitive chip 1 as much as possible, and the performance of the sensor is ensured. The relative position of the light source is adjusted to ensure that the thread collimator 4 and the inner hole of the packaging shell 2 are positioned on the same axis, namely, light passes through the thread collimator 4 and the packaging shell 2, clear and bright red light spots (light interference phenomenon occurs when the light passes through the packaging shell to reach the top of the sensitive chip) can be seen on the light screen 16, and the light spots can be emitted from the center of the inner hole of the packaging shell 2.
S402: when the threaded collimator 4 reaches the maximum limit position, the threaded fixer 5 is tightly attached to the collimator outer limit block 7;
s403: the outer fixing ring 6 is sleeved from one end of the packaging shell 2 far away from the threaded collimator 4, is sleeved on the threaded fixer 5 and the collimator outer limiting block 7, and is reinforced by high-temperature glue 11;
s404: observing the optical power meter 15 again, if the performance requirement cannot be met, inserting a threaded adjusting bolt 10 into the adjusting bolt positioning groove 12 to align the optical path of the threaded collimator 4, sleeving an adjusting bolt fixing sleeve 9 outside the threaded adjusting bolt 10 after obtaining the maximum light intensity point, and fixing through high-temperature glue 11 to finish packaging.
After the packaging is finished, the pressure performance and the temperature resistance of the sensor are required to be analyzed, and if the performance requirements cannot be met, the packaging process is required to be finished again, so that the sensor can work efficiently.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (2)

1. The packaging method of the MEMS sensor based on the optical fiber F-P cavity comprises a packaging shell (2) for packaging a sensitive chip (1), wherein one end of the packaging shell (2) away from the sensitive chip (1) is movably connected with a threaded collimator (4), one end of the threaded collimator (4) positioned outside the packaging shell (2) is fixedly provided with a collimator outer limiting block (7), a threaded fixer (5) is arranged between one end of the packaging shell (2) away from the sensitive chip (1) and the collimator outer limiting block (7), and the threaded fixer (5) is sleeved outside the threaded collimator (4); a circle of collimator inner limiting blocks (3) are fixedly arranged on the inner side wall of the packaging shell (2), and an optical fiber (8) is arranged in the center of the threaded collimator (4) in a penetrating manner;
the packaging shell (2), the thread fixer (5) and the collimator outer limiting block (7) are sleeved with the same outer fixing ring (6), the outer fixing ring (6) is in threaded connection with the thread fixer (5), and the outer fixing ring (6) is fixed with the packaging shell (2) and the collimator outer limiting block (7) through high-temperature glue (11);
three adjusting bolt positioning grooves (12) are symmetrically formed in the packaging shell (2) along the circumferential direction, each adjusting bolt positioning groove (12) is internally and respectively connected with a threaded adjusting bolt (10), an adjusting bolt fixing sleeve shell (9) is arranged outside each threaded adjusting bolt (10), and each adjusting bolt fixing sleeve shell (9) is also fixed with the outer side wall of the packaging shell (2) through high-temperature glue (11);
three abdication grooves (601) matched with the adjusting bolt fixing sleeve shell (9) are formed in the inner side wall of the outer fixing ring (6);
an external thread is arranged on the middle section of the outer side wall of the thread collimator (4), an internal thread is arranged on the inner side wall of one end, far away from the sensitive chip (1), of the packaging shell (2), and the thread collimator (4) is in threaded connection with the packaging shell (2);
characterized in that the packaging method comprises the following steps,
s1: the packaging shell (2) packaged with the sensitive chip (1) and the thread collimator (4) are respectively fixed on a pair of horizontally placed work adjusting frames (13), and a light screen (16) and the two work adjusting frames (13) are placed on the same straight line;
s2: connecting a light source (14) with the threaded collimator (4), and adjusting a working adjusting frame (13) provided with the threaded collimator (4) to enable light emitted by the threaded collimator (4) to reach the central point of the light screen (16);
s3: connecting the screw collimator (4) with the optical power meter (15), detecting the light intensity of the returned light emitted by the light source (14) through the optical power meter (15) after passing through the sensitive chip (1) and reaching the optical power meter (15) through the screw collimator (4) and the optical fiber (8), and accurately adjusting the working adjusting frame (13) corresponding to the screw collimator (4), thereby determining the maximum position of the returned light intensity, namely the optimal working distance of the screw collimator (4);
s4: the thread collimator (4) is connected and fixed with the packaging shell (2);
the specific operation of step S4 includes the following steps,
s401: the thread fixer (5) is sleeved on the thread collimator (4), a work adjusting frame (13) on which the thread collimator (4) is arranged is adjusted, and the thread collimator (4) is screwed into the packaging shell (2);
s402: when the threaded collimator (4) reaches the maximum limit position, the threaded fixer (5) is tightly attached to the collimator outer limit block (7);
s403: the outer fixing ring (6) is sleeved from one end of the packaging shell (2) far away from the threaded collimator (4), is sleeved on the threaded fixer (5) and the collimator outer limiting block (7), and is reinforced by high-temperature glue (11);
s404: observing the optical power meter (15) again, if the performance requirement cannot be met, inserting a threaded adjusting bolt (10) into the adjusting bolt positioning groove (12) to align the optical path of the threaded collimator (4), sleeving an adjusting bolt fixing sleeve (9) outside the threaded adjusting bolt (10) after obtaining the maximum light intensity point, and fixing through high-temperature glue (11) to finish packaging.
2. The method for packaging the MEMS sensor based on the optical fiber F-P cavity according to claim 1, wherein: the thread collimator (4) is made of ceramic materials.
CN202310434277.4A 2023-04-21 2023-04-21 MEMS sensor based on optical fiber F-P cavity and packaging method thereof Active CN116164781B (en)

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