CN116045717B

CN116045717B - Heat mass transfer device, heat exchange coefficient calculation method, device, equipment and medium

Info

Publication number: CN116045717B
Application number: CN202310102681.1A
Authority: CN
Inventors: 黄彦平; 谢峰; 徐建军; 唐瑜; 周慧辉; 谢添舟; 昝元峰; 刘亮; 王艳林
Original assignee: Nuclear Power Institute of China
Current assignee: Nuclear Power Institute of China
Priority date: 2023-02-13
Filing date: 2023-02-13
Publication date: 2023-07-04
Anticipated expiration: 2043-02-13
Also published as: CN116045717A

Abstract

The embodiment of the application provides a heat and mass transfer device, a method, a device, equipment and a medium for calculating a heat exchange coefficient, wherein the heat and mass transfer device comprises a heating component, a heat conduction component and a temperature measuring component; the heat conduction assembly is provided with a plurality of working medium channels extending along a first direction and a plurality of temperature measuring channels extending along the first direction, the working medium channels and the temperature measuring channels are arranged at intervals, the heat conduction assembly further comprises heat exchange sections which are sequentially arranged along the first direction, and the heat conduction assembly is connected with the heating assembly so as to conduct heat emitted by the heating assembly to the working medium channels; the temperature measuring assembly comprises a plurality of temperature sensing pieces, the temperature sensing pieces are respectively arranged in the temperature measuring channels, the temperature sensing pieces are respectively located in different heat exchange sections relative to the working medium channels, and the temperature sensing pieces are used for measuring wall surface temperatures of the different heat exchange sections. According to the heat and mass transfer device, the heat exchange coefficient calculation method, the heat exchange coefficient calculation device, the heat exchange coefficient calculation equipment and the heat exchange coefficient medium, accuracy of a measurement result and measurement efficiency can be improved.

Description

Heat mass transfer device, heat exchange coefficient calculation method, device, equipment and medium

Technical Field

The present disclosure relates to the field of nuclear reactor fuel assemblies, and more particularly, to a heat and mass transfer device, and a method, apparatus, device, and medium for calculating a heat transfer coefficient.

Background

The heat and mass transfer device with the multi-channel thin-wall annular narrow-slit heating structure is an advanced nuclear reactor core assembly, and the structure has the characteristics of compact structure, high heat transfer rate and high stability. Therefore, the heat and mass transfer device with the multi-channel thin-wall annular narrow-slit heating structure can be used in a nuclear reactor core assembly, is a heat exchange structure which is widely used in the industry at present, and is increasingly applied to heat exchange systems with small volume and high heat exchange efficiency, such as a fusion reactor system, a plate heat exchanger, an electronic device cooling system and the like.

The heat and mass transfer performance and the flow stability of the heat and mass transfer device of the multi-channel thin-wall annular slit heating structure are important technical indexes of the heat and mass performance of the nuclear reactor core assembly, however, if the heat and mass transfer characteristics and the stable operation boundary of the annular slit heating channel of the heat and mass transfer device of the multi-channel thin-wall annular slit heating structure are required to be obtained, due to the complexity and the specificity of the heat and mass transfer device of the multi-channel thin-wall annular slit heating structure, an experimenter can influence the flow field and the temperature field inside the annular slit heating channel when obtaining the data, and the accuracy of a measurement result is influenced.

Disclosure of Invention

According to the heat and mass transfer device, the heat exchange coefficient calculating method, the heat and mass transfer device, the heat exchange coefficient calculating device, the heat and mass transfer device and the heat exchange coefficient calculating medium, accuracy of measurement results and measurement efficiency can be improved.

In a first aspect, the present application provides a heat and mass transfer device comprising a heating assembly, a thermally conductive assembly, and a temperature sensing assembly; the heat conduction assembly is provided with a plurality of working medium channels extending along a first direction and a plurality of temperature measuring channels extending along the first direction, the working medium channels and the temperature measuring channels are arranged at intervals, the heat conduction assembly further comprises heat exchange sections which are sequentially arranged along the first direction, and the heat conduction assembly is connected with the heating assembly so as to conduct heat emitted by the heating assembly to the working medium channels; the temperature measuring assembly comprises a plurality of temperature sensing pieces, the temperature sensing pieces are respectively arranged in the temperature measuring channels, the temperature sensing pieces are respectively positioned at different heat exchange sections relative to the working medium channels, and the temperature sensing pieces are used for measuring the wall surface temperatures of the different heat exchange sections; the heat conduction assembly comprises a plurality of sub heat conduction assemblies arranged at intervals, each sub heat conduction assembly comprises a heat absorption piece and a heat release piece which are connected, the heat absorption piece is used for receiving heat energy sent by the heating assembly, the heat release piece is used for transferring the heat energy of the heat absorption piece to working media flowing in the working media channel, and the heat conduction quantity of the heat absorption piece is smaller than that of the heat release piece.

According to any of the foregoing embodiments of the first aspect of the present application, the heat absorbing member further includes a plurality of flow holes extending along the second direction, the plurality of temperature measurement channels are disposed around the circumferential direction of the working medium channels at intervals, the flow holes are communicated with two adjacent working medium channels, and the second direction intersects with the first direction.

According to any of the foregoing embodiments of the first aspect of the present application, the temperature measuring assembly further includes a temperature measuring collar and an insertion portion connected to the temperature sensing member, the temperature measuring collar is sleeved on the temperature sensing member, and the temperature measuring collar is abutted to an inner wall of the temperature measuring channel.

According to any of the foregoing embodiments of the first aspect of the present application, the temperature measuring assembly further includes a positioning member disposed at an end of the heat absorbing member away from the temperature measuring collar, the positioning member having a plurality of through holes, and the plurality of insertion portions respectively passing through the different through holes.

According to any of the foregoing embodiments of the first aspect of the present application, the temperature measuring assembly further includes an insulating member disposed in the temperature measuring channel and covering the insert portion.

In a second aspect, the present application provides a method for calculating a heat exchange coefficient, where the method includes:

acquiring a first temperature measured by a temperature sensing piece, and calculating to obtain the temperature of a working medium in a working medium channel according to the first temperature and preset characteristic parameters of the working medium channel;

Calculating to obtain a second temperature according to preset characteristic parameters of the working medium channel, the first temperature and a one-dimensional steady-state heat conduction equation;

calculating a temperature difference value between the second temperature and the temperature of the working medium;

the method comprises the steps of obtaining preset characteristic parameters of a heat conduction assembly, calculating to obtain the heat flow density of working medium channels according to the preset characteristic parameters of the heat conduction assembly, and calculating the quotient of the temperature difference and the heat flow density to obtain the monomer heat exchange coefficient of each working medium channel.

In a third aspect, embodiments of the present application provide a computing device, the device comprising:

the first acquisition module is used for acquiring a first temperature measured by the temperature sensing piece and calculating to obtain the temperature of the working medium in the working medium channel according to the first temperature and preset characteristic parameters of the working medium channel;

the first calculation module is used for calculating a second temperature according to preset characteristic parameters of the working medium channel, the first temperature and the one-dimensional steady-state heat conduction equation;

the second calculation module is used for calculating a temperature difference value between the second temperature and the temperature of the working medium;

the second acquisition module is used for acquiring preset characteristic parameters of the heat conduction assembly, calculating the heat flux density of the working medium channels according to the preset characteristic parameters of the heat conduction assembly, and calculating the quotient of the temperature difference and the heat flux density to obtain the monomer heat exchange coefficient of each working medium channel.

In a fourth aspect, the present application provides a computing device comprising: a processor and a memory storing computer program instructions; the processor executes the computer program instructions to implement the method for calculating the heat exchange coefficient.

In a fifth aspect, the present application provides a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement a method of calculating a heat exchange coefficient as described above.

The heat and mass transfer device comprises a heating component, a heat conduction component and a temperature measurement component, wherein temperature measurement channels extend along a first direction and are arranged on the heat conduction component, temperature sensing pieces are arranged in each temperature measurement channel and are arranged on different heat exchange sections of a working medium channel, so that wall temperatures at the different heat exchange sections can be measured through the temperature sensing pieces, and heat and mass transfer characteristics of the heat conduction component in the heat and mass transfer device can be obtained based on the measured wall temperatures; and through setting up heating element, heat conduction subassembly can simulate the flow of actual heat mass transfer device, operation characteristics such as heat transfer to realize the accurate measurement of heat mass transfer device multiple thermal engineering parameter, improve the accuracy that heat mass transfer device measured.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like or similar reference characters designate like or similar features.

FIG. 1 is a schematic illustration of a configuration of a heat and mass transfer device provided in one embodiment of the present application;

FIG. 2 is a schematic structural view of a heat conduction assembly according to one embodiment of the present application;

FIG. 3 is a schematic structural view of another heat conducting component provided in one embodiment of the present application;

FIG. 4 is a schematic view of a heat conduction assembly according to another embodiment of the present disclosure;

FIG. 5 is a schematic structural view of a sub-heat conducting assembly provided in one embodiment of the present application;

FIG. 6 is a schematic structural view of a temperature sensing element according to one embodiment of the present application;

FIG. 7 is a flow chart of a method for calculating a heat exchange coefficient according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of an experimental result provided in one embodiment of the present application;

FIG. 9 is a schematic diagram of an experimental result provided in one embodiment of the present application;

FIG. 10 is a schematic diagram of a computing device provided in an embodiment of the present application;

fig. 11 is a schematic structural diagram of a computing device according to an embodiment of the present application.

Reference numerals illustrate:

100. a heat and mass transfer device; x, a first direction; y, second direction;

10. a heating assembly; 20. a heat conducting component; 21. a working medium channel; 211. an annular plug plate; 22. a temperature measuring channel; 23. a heat exchange section; 24. a first header flange; 25. a second coupling flange; 27. a flow hole; 28. installing a bolt; 29. a sub-heat conducting assembly; 291. a heat absorbing member; 292. a heat release member; 30. a temperature measuring component, 31 and a temperature sensing piece; 311. an insertion section; 32. a temperature measuring lantern ring; 33. a positioning piece; 34. an insulating member; 1001. a first acquisition module; 1002. a first computing module; 1003. a second computing module; 1004. a second acquisition module; 1101. a processor; 1102. a memory; 1103. a communication interface; 1110. a bus.

Detailed Description

Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative of the application and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

In the related art, a working medium channel of the heat and mass transfer device is generally formed by a plurality of annular working medium channels, the working medium channel is a long channel with a flat annular cross section, and in order to achieve the purpose of enhancing heat transfer, narrow slit gaps, heating wall surfaces and heat exchange wall surfaces of the annular working medium channel are generally millimeter-sized (1-4 mm), and the narrow slit gaps, the heating wall surfaces and the heat exchange wall surfaces of the annular working medium channel belong to the category of thin-wall narrow channels. If the heat and mass transfer characteristics and the stable operation boundary of the annular thin-wall narrow-slit working medium channel are to be obtained, the simulation of the heat conducting structure in the heat and mass transfer device is needed to be realized, so that the wall temperature of the working medium channel, namely the multi-channel annular narrow-slit heating channel, can be accurately measured, and whether the multi-channel thin-wall annular narrow-slit heating structure generates unstable flow and critical boiling can be judged according to the wall temperature.

However, in the prior art, due to the complexity and the specificity of the multi-channel thin-wall annular slit heating structure, the geometric dimension is small, and the problems of multi-component and multi-channel measurement interference exist, so that an experimenter can influence the flow field and the temperature field inside the multi-channel annular slit heating channel when acquiring the data, and the wall surface temperature of the multi-channel annular slit heating channel cannot be accurately obtained, thereby influencing the accuracy of the measurement result.

Therefore, the invention provides a heat and mass transfer device, a calculation method, a device, equipment and a medium of a heat exchange coefficient, which can overcome the simulation and measurement technology of heat transfer of the heat and mass transfer device, can measure key parameters under the condition of not interfering with the flow field and the temperature field in a working medium channel so as to acquire the heat and mass transfer characteristic and the stable operation boundary of the heat and mass transfer device, is used for developing the heat and mass transfer characteristic of the working medium channel and the thermal hydraulic experiment research, acquires the heat transfer coefficient and the temperature field distribution of the working medium channel, and the stable operation boundary parameters such as the flow instability, the boiling critical and the like, and improves the measurement accuracy and the measurement efficiency of the heat and mass transfer device.

The heat and mass transfer device provided by the embodiment of the application can be used for simulating the heat and mass transfer device with the multichannel thin-wall annular narrow slit heating structure, so that the wall surface temperature of the multichannel annular narrow slit working medium channel can be accurately measured, and the heat and mass transfer device can be subjected to thermal hydraulic analysis based on the measured wall surface temperature.

For a better understanding of the present application, the heat and mass transfer device provided in the embodiments of the present application will be described in detail below with reference to the accompanying drawings, by way of specific embodiments and application scenarios thereof.

Referring to fig. 1-3, fig. 1 is a schematic illustration of a thermal mass transfer device according to one embodiment of the present application; FIG. 2 is a schematic structural view of a heat conduction assembly according to one embodiment of the present application; fig. 3 is a schematic structural view of another heat conduction assembly according to an embodiment of the present application.

As shown in fig. 1-3, a first aspect of the present application provides a heat and mass transfer device 100, the heat and mass transfer device 100 comprising a heating assembly 10, a thermally conductive assembly 20, and a temperature sensing assembly 30; the heat conduction assembly 20 is provided with a plurality of working medium channels 21 extending along a first direction X and a plurality of temperature measurement channels 22 extending along the first direction X, the working medium channels 21 and the temperature measurement channels 22 are arranged at intervals, the heat conduction assembly 20 further comprises heat exchange sections 23 which are sequentially arranged along the first direction X, and the heat conduction assembly 20 is connected with the heating assembly 10 so as to conduct heat emitted by the heating assembly 10 to the working medium channels 21; the temperature measuring assembly 30 comprises a plurality of temperature sensing pieces 31, wherein the temperature sensing pieces 31 are respectively arranged in the temperature measuring channels 22, the temperature sensing pieces 31 are respectively positioned on different heat exchange sections 23 relative to the working medium channels 21, and the temperature sensing pieces 31 are used for measuring the wall surface temperatures of the different heat exchange sections 23.

Alternatively, the heating assembly 10 may be disposed in various manners, for example, the heating assembly 10 may be disposed in the form of an electrically conductive flange disposed at both ends of the heat conductive assembly 20 along the first direction X and connected to the heat conductive assembly 20. Correspondingly, the heat and mass transfer device 100 may further include a copper heating belt connected to the conductive flange, where the copper heating belt is connected to an external power device and is electrified by the external power device, so that after the conductive flange is electrified and heated by the copper heating belt, heat can be continuously emitted to the heat conduction assembly 20 to provide a stable heat source, so that heat energy emitted by the heat conduction assembly 10 is transferred to the working medium flowing in the working medium channel 21, thereby heating the working medium in the working medium channel 21. It will be readily appreciated that the heating assembly 10 may also be a steam heater, a microwave heater, or the like, and the particular arrangement of the heating assembly 10 is not limited so long as heat is provided to the heat and mass transfer device 100.

Optionally, in this embodiment of the present application, the heating assembly 10 may further include a first header flange 24 and a second header flange 25, where the first header flange 24 and the second header flange 25 are respectively disposed at two ends of the heat conducting assembly 20 along the first direction X and are connected to the working medium channel 21, and the first header flange 24 and the second header flange 25 may be respectively fixed to the heating assembly 10 by silver brazing, so that the heating assembly 10 can be ensured to have good electrical conductivity, after being connected to an external power supply, heat can be continuously conducted to the heat conducting assembly 20, so that the heating effect of the first header flange 24 and the second header flange 25 on the working medium channel 21 is improved, and the heating of the working medium in the working medium channel 21 is achieved; of course, the connection mode of the first header flange 24 and the second header flange 25 with the heating assembly 10 can be a detachable connection mode such as a bolt connection mode, so that the subsequent disassembly, assembly, maintenance and replacement are convenient. The above-described changes and modifications to the manner in which the first and

second header flanges

24 and 25, respectively, are coupled to the heating assembly 10 do not depart from the principles and scope of the present application and are intended to be limited thereto.

In these alternative embodiments, the first and

second header flanges

24, 25 may further include channels for the flow of the working fluid, so that the working fluid flowing through the working fluid channel 21 can flow from the first header flange 24 into the working fluid channel 21 and then out of the working fluid channel 21 through the second header flange 25, thereby completing the heating of the working fluid.

Optionally, the heat exchange section 23 is a working medium heat conducting element capable of conducting heat energy emitted by the heating component 10 to flow in the working medium channel 21, so that the heat exchange section 23 can select a corresponding metal material, for example, a metal material with reasonable heat conducting function such as austenitic stainless steel, according to the heating value of the actual heating component 10, and in the embodiment of the application, in order to simulate the flowing and heating condition of the heat mass transfer device actually provided with the multi-channel thin-wall annular narrow-slit heating structure, the heating section 23 can be set to have the same annular structure and the same structural dimension as the actual structure, so that the heat mass transfer performance and the operation stability of the heat mass transfer device actually provided with the multi-channel thin-wall annular narrow-slit heating structure can be studied. Improving the accuracy of the measurement of the heat and mass transfer device 100.

Referring to fig. 4 in combination, fig. 4 is a schematic structural diagram of a heat conduction assembly according to another embodiment of the present application.

In this embodiment of the present application, the working medium channel 21 is provided in multiple manners, for example, a plurality of annular plugs 211 may be disposed in the working medium channel 21, and the annular plugs 211 divide the working medium channel 21 into a plurality of mutually independent sub-channels, so that the flow and heating conditions of the working medium in the heat and mass transfer device actually having the multi-channel thin-wall annular narrow-slit heating structure can be more accurately simulated, and the measurement accuracy of the heat and mass transfer device 100 is improved.

Optionally, the temperature measuring channel 22 is disposed on the heat conducting component 20 along the first direction X, and the temperature measuring channel 22 and the working medium channel 21 are disposed at intervals, so that the situation that the temperature measuring channel 22 affects the flow direction of the working medium in the working medium channel 21, and therefore the working medium in the working medium channel 21 cannot be effectively heated can be avoided or reduced. In view of the fact that in the heat and mass transfer device with the multi-channel thin-wall annular slot heating structure, wall temperatures of different positions of the heat conducting component need to be accurately obtained by measuring wall temperatures of the working medium channels, in the embodiment of the application, the plurality of temperature measuring channels 22 can be processed to different depths along the first direction X, so that wall temperatures of different positions of the heat exchanging section 23 of the heat conducting component 20 can be obtained, and sufficient experimental data is provided for subsequent thermal hydraulic analysis of the heat and mass transfer device 100.

Alternatively, the temperature sensing member 31 is a temperature sensor, such as a thermistor, a thermocouple, etc., and the present application is not limited to the specific type of the temperature sensing member 31, as long as the temperature in the temperature measuring channel 22 can be accurately measured in real time. It is easy to understand that the setting position and interval of the temperature measuring channel 22 and the depth of the temperature sensing element 31 inserted into the temperature measuring channel 22 are not limited, and a person skilled in the art can adjust according to the test requirement, and the temperature of the wall surface of the heat conducting component 20 at multiple points can be measured by changing the inserting position and inserting depth of the temperature sensing element 31.

The heat and mass transfer device 100 of the embodiment of the present application includes a heating assembly 10, a heat conduction assembly 20 and a temperature measurement assembly 30, wherein temperature measurement channels 22 extend along a first direction X and are disposed on the heat conduction assembly 20, a temperature sensing element 31 is disposed in each temperature measurement channel 22, and the temperature sensing elements 31 are disposed on different heat exchange sections 23 of a working medium channel 21, so that the present application can measure wall temperatures at the different heat exchange sections 23 through the temperature sensing elements 31, and thus can obtain heat and mass transfer characteristics of the heat conduction assembly 20 of the heat and mass transfer device 100 based on the measured wall temperatures; and through setting up heating assembly 10, heat conduction subassembly 20 can simulate the operation characteristics such as actual heat mass transfer device 100's flow, heat transfer to realize the accurate measurement of heat mass transfer device 100 multiple thermal engineering parameter, improve the accuracy of heat mass transfer device 100 measurement.

Referring to fig. 5 in combination, fig. 5 is a schematic structural diagram of a sub-heat conducting assembly according to an embodiment of the present application.

In some alternative embodiments, the heat conducting assembly 20 includes a plurality of sub heat conducting assemblies 29 disposed at intervals, each sub heat conducting assembly 29 includes a heat absorbing member 291 and a heat releasing member 292 connected to each other, the heat absorbing member 291 is configured to receive heat energy emitted by the heat generating assembly 10, the heat releasing member 292 is configured to transfer the heat energy of the heat absorbing member 291 to the working medium flowing in the working medium channel 21, and the heat conducting amount of the heat absorbing member 291 is smaller than that of the heat releasing member 292.

Optionally, each sub heat-conducting component 29 adopts a segmented structure, each sub heat-conducting component 29 is composed of a heat absorbing member 291 and a heat releasing member 292, the heat absorbing member 291 is arranged at two ends of the heat-conducting component 20 along the first direction X and is connected with the heat generating component 10, the heat absorbing member 291 is used for receiving heat energy emitted by the heat generating component 10, and the heat releasing member 292 is arranged between the two heat absorbing members 291 and is used for transferring the heat energy of the heat absorbing member 291 to the working medium flowing in the working medium channel 21 so as to heat the working medium.

In the embodiment of the present application, the heat absorbing member 291 may be made of a metal material such as copper or nickel with a smaller electrical resistance, and the heat releasing member 292 may be made of a corresponding metal material, such as austenitic stainless steel, according to the heat productivity of the heating element 10.

In these alternative embodiments, the heat conducting component 20 is designed into the sectional structure of the heat release member 292 and the heat absorption member 291, so that the heat generation amount of the heat conducting component 20 is mainly concentrated in the heat release member 292 area, and the heat conducting effect of the heat conducting component 20 is improved.

In some alternative embodiments, the heat absorbing member 291 further includes a plurality of flow holes 27 extending along the second direction Y, and the plurality of temperature measuring channels 22 are arranged at intervals around the circumference of the working fluid channels 21, the flow holes 27 communicating with two adjacent working fluid channels 21, and the first direction X and the second direction Y intersect.

In this embodiment of the present application, an included angle between the first direction X and the second direction Y is not limited, as long as two directions are not parallel to each other, and the first direction X is taken as a vertical direction, and the second direction Y is perpendicular to the first direction X as an example.

Alternatively, the flow holes 27 may be through holes, penetrate through the heat absorbing member 291, and are communicated with two adjacent working medium channels 21, and the flow holes 27 can uniformly mix working mediums flowing in the working medium channels 21, so as to ensure uniformity of the flow field of the heat and mass transfer device 100, thereby avoiding or reducing interference to the flow field and the temperature field of fluid in the working medium channels 21, and improving measurement accuracy of the heat and mass transfer device 100.

Referring to fig. 6 in combination, fig. 6 is a schematic structural diagram of a temperature sensing element according to an embodiment of the present application.

In some alternative embodiments, the temperature measuring assembly 30 further includes a temperature measuring collar 32 and an insertion portion 311 connected to the temperature sensing member 31, the temperature measuring collar 32 is sleeved on the temperature sensing member 31, and the temperature measuring collar 32 abuts against the inner wall of the temperature measuring channel 22.

Alternatively, the insertion portion 311 is a portion of the temperature sensing member 31 inserted into the temperature measuring channel 22.

Alternatively, the temperature measuring collar 32 may be made of a metal material with good heat conductivity, such as copper, aluminum, etc., so that the temperature measuring collar 32 has good heat conductivity; in the embodiment of the application, the clearance tolerance between the outer diameter of the temperature measuring collar 32 and the inside of the temperature measuring channel 22 can be controlled within the range of +0.02-0.03mm, so that the temperature measuring collar 32 can smoothly enter the temperature measuring channel 22, and the temperature sensing piece 31 can be ensured to be in good contact with the inner wall of the temperature measuring channel 22, thereby improving the temperature measuring precision and the response speed of the temperature sensing piece 31 and further improving the measuring accuracy of the temperature measuring component 30.

Optionally, the ratio of the length of the temperature measuring collar 32 to the diameter of the temperature sensing piece 31 may be greater than or equal to 5, and the connection mode of the temperature sensing piece 31 and the temperature measuring collar 32 may be a fixed connection mode through silver soldering connection, so as to ensure the stability and good heat conducting performance of the connection structure between the temperature measuring collar 32 and the temperature sensing piece 31.

In some alternative embodiments, the temperature measuring assembly 30 further includes a positioning member 33, where the positioning member 33 is disposed at an end of the heat absorbing member 291 away from the temperature measuring collar 32, and the positioning member 33 has a plurality of through holes, and the plurality of insertion portions 311 respectively pass through the different through holes.

In these alternative embodiments, the positioning member 33 can ensure accurate positioning of the temperature sensing member 31, so as to avoid or reduce the situation that the insertion portion 311 is separated from the temperature measurement channel 22, and thus the normal temperature measurement cannot be performed. Wherein the positioning member 33 may be formed by processing an insulating material such as a polyimide laminate, so that it is possible to prevent or reduce the temperature sensing member 31 from affecting the accuracy of temperature measurement of the temperature sensing member 31 due to additional electric potential generated by electrification.

In some alternative implementations, the temperature sensing assembly 30 further includes an insulator 34, the insulator 34 being disposed within the temperature sensing channel 22 and surrounding the insert 311.

In these alternative embodiments, since the heating element 10 is often required to be energized to generate heat, the housing of the temperature sensing element 31 is generally made of stainless steel, and if the housing of the temperature sensing element 31 is conductive, the accuracy of the temperature measurement of the temperature sensing element 31 cannot be ensured. Therefore, the insulating member 34 needs to be coated on the outside of the insertion portion 311, specifically, the material of the insulating member 34 may be, for example, an insulating material such as polytetrafluoroethylene, asbestos rubber, etc., so as to keep the insertion portion 311 insulated along the path, so that the temperature sensing member 31 can be prevented or reduced from influencing the measurement accuracy of the temperature in the experiment due to the additional electric potential generated by the electrification, and the measurement accuracy of the temperature measuring assembly 30 can be further improved.

The method for calculating the heat exchange coefficient provided in the embodiment of the second aspect of the present application is described below.

Fig. 7 is a schematic flow chart of a method for calculating a heat exchange coefficient according to an embodiment of the second aspect of the present application. As shown in fig. 7, the method for calculating the heat exchange coefficient may include the following steps:

step 101, acquiring a first temperature measured by a temperature sensing piece, and calculating to obtain the temperature of a working medium in a working medium channel according to the first temperature and preset characteristic parameters of the working medium channel;

102, calculating to obtain a second temperature according to preset characteristic parameters of a working medium channel, a first temperature and a one-dimensional steady-state heat conduction equation;

step 103, calculating a temperature difference value between the second temperature and the temperature of the working medium;

step 104, obtaining preset characteristic parameters of the heat conduction assembly, calculating to obtain the heat flux density of the working medium channels according to the preset characteristic parameters of the heat conduction assembly, and calculating the quotient of the temperature difference and the heat flux density to obtain the single heat exchange coefficient of each working medium channel.

In some alternative embodiments, the preset characteristic parameter of the working fluid channel may be a channel mass flow rate of the working fluid channel, a channel cross-sectional area of the working fluid channel, a length of the working fluid channel, a wall thickness of the working fluid channel, and the like. The working medium temperature can calculate the enthalpy value established by temperature induction according to the preset characteristic parameters of the working medium channel, and then the working medium temperature is obtained by physical property calculation by combining the pressure of the heat conduction system of the whole heat and mass transfer device

。

In this embodiment, the heating element of the heat and mass transfer device is connected to the dc power supply through the electrode, so that effective heat is generated to directly heat the fluid in the working medium channel, and therefore the heat conducting element can be regarded as a heating element with an internal heat source. The applicant finds through a great deal of experimental research that, since the length and width dimensions of the heat conduction component are far greater than the thickness, the heat conduction of the heat conduction component in the thickness direction is mainly considered, and therefore, the one-dimensional steady-state heat conduction equation of the corresponding heat conduction component can be written as:

（1）

wherein in formula (1)

The thermal conductivity of the heat conducting component is assumed to be a linear function of temperature and can be expressed as +.>

Wherein a is ₀ 、a ₁ Calculating coefficient for heat conduction coefficient of the heat conduction component, wherein T is first temperature measured by the temperature sensing element, < ->

Is the volume heat generation rate (W/m) ³ ) Y is the wall thickness (m) of the working medium channel at the position of the temperature sensing part. Wherein->

The calculation method comprises the following steps:

（2）

n in formula (2) _d The electrical power P (kW) energizing the heating assembly,

，V _h is the volume of the heat conducting component.

Solving equation (1) according to the obtained first temperature and the wall thickness of the working medium channel at the position of the temperature sensing part and introducing boundary conditions to obtain the outer wall temperature of the heat conduction assembly, namely the second temperature

Wherein the boundary conditions are conventional conditions in existing thermal hydraulic analysis and are not described in detail herein.

The difference between the first temperature and the second temperature is then calculated,

，/>

at the temperature of the second temperature of the first temperature,

is the temperature of working medium.

In step 104, the preset characteristic parameters of the heat conduction assembly may include a diameter of the heat conduction assembly, a length of the heat conduction assembly. Specifically, the heat flux density q can be obtained from the diameter of the heat conductive member, the length of the heat conductive member, and the energization power of the heating member.

Therefore, after the calculation by the steps, the local heat exchange coefficient of one working medium channel, namely the monomer heat exchange coefficient, can be calculated by the heat flow density, namely

（3）

Wherein: q is the heat flux density (kW/m) ² ）；T _wo Is a second temperature (°c);

is the temperature (DEG C) of the working medium in the working medium channel. Wherein the temperature difference is Two->

The local heat exchange coefficient of one working medium channel, namely the monomer heat exchange coefficient, can be obtained through the formula (3).

In the calculation method of the heat exchange coefficient, only the wall thickness of the working medium channel where the temperature sensing piece is located and the first temperature of the measuring point are obtained, the temperature of the inner wall of the heat conduction component, namely the second temperature, can be obtained by substituting the temperature of the inner wall of the heat conduction component into a one-dimensional steady state equation, the monomer heat exchange coefficient of each working medium channel can be obtained according to the second temperature and the temperature of the working medium in the working medium channel, the heat mass transfer device is not required to be cut in a destructive mode, the temperature of the inner wall and the outer wall of each working medium channel is measured, the damage to the heat mass transfer device is avoided or reduced, the situation that the heat mass transfer device cannot be used is avoided, the heat exchange coefficient can be obtained by measuring the first temperature through the temperature sensing piece, the calculation efficiency is remarkably improved, and the follow-up thermal mass transfer device is convenient to carry out thermal hydraulic analysis.

In one embodiment, the step 101 may specifically be performed as follows:

step 201, calculating to obtain a first coefficient according to a preset characteristic parameter of the working medium channel.

In this embodiment of the application, the preset characteristic parameters of the heat conduction assembly include the distance between the measuring point of the temperature sensing piece and the inlet of the temperature measurement channel, and the heating length of the heat conduction assembly, and the preset characteristic parameters of the working medium channel include the channel sectional area of the working medium channel and the channel mass flow rate of the working medium channel.

Specifically, the calculation formula of the first coefficient may be

X is a first coefficient, L _x For the distance between the measuring point of the temperature sensing piece and the inlet of the temperature measuring channel, L is the heating length of the heat conducting component, G is the channel mass flow rate (kg/m) of the working medium ² * s), A is the channel cross section area (m) ² ）。

Step 202, obtaining the energizing parameter of the heating assembly, and calculating the product of the energizing parameter and the first coefficient to obtain the second coefficient.

In this embodiment of the present application, the energizing parameter may be an energizing electric power of the heating assembly, so the second coefficient is:

。

and 203, calculating the sum of the second coefficient and the preset first enthalpy value to obtain a second enthalpy value.

Specifically, the specific calculation formula of the second enthalpy value may be:

(5) Wherein h is _x A second enthalpy value of h _in For presetting the first enthalpy value, it is easy to understand that the preset first enthalpy value can be selected according to different preset characteristic parameters of the working medium channel.

And 204, acquiring a force parameter of the heat and mass transfer device, and calculating the working medium temperature according to the second enthalpy value and the force parameter.

Optionally, in an embodiment of the present application, the temperature of the fluid corresponding to the temperature measuring point of the temperature sensing member

The working medium temperature is mainly calculated by the heat balance calculation formula (5), namely, the enthalpy value at the temperature measuring point is calculated by the heat balance calculation formula (5), and the working medium temperature is calculated by physical properties by combining the force parameter of the heat and mass transfer device, namely, the system pressure. The specific physical property calculation process is a thermodynamic calculation formula in the prior art, and is not described herein.

It should be noted that, assuming that the second enthalpy value calculated by the above calculation method is greater than or equal to the saturation enthalpy value, the working medium temperature is the saturation temperature under the pressure, that is, when hx is greater than or equal to hfs (saturation enthalpy), the working medium temperature is the saturation temperature corresponding to the saturation enthalpy.

In an embodiment, the preset characteristic parameters of the heat conducting component include a diameter of the heat conducting component and a length of the heat conducting component, and step 104 may specifically be performed as follows:

Step 301, calculating to obtain the total heating volume of the heat conduction assembly according to the diameter of the heat conduction assembly and the length of the heat conduction assembly;

step 302, calculating quotient of total heating body and energizing parameters of heating assembly to obtain heat flux density.

In embodiments of the present application, a specific calculation of the heat flux density of the heat and mass transfer device may be represented by equation (6) as follows:

(6)

wherein n is the number of heating elements in the heat conducting component; d is the diameter (m) of the heat conduction component, and specifically the diameter of a heat release member in the heat conduction component; l is the heating length (m) of the heating element of the heat conducting component. Multiplying the diameter of a heating element, the length of the heating element and the circumference ratio to obtain the heating volume of the monomer

I.e. the heat conducting volume of each heating element; and then adding the single heating volumes of each heating piece to obtain the total heating volume of the heat and mass transfer device, dividing the total heating volume by the energizing power of the heating components of the heat and mass transfer device to obtain the heat flow density q, and finally substituting the calculated heat flow density into a formula (3):

the monomer heat exchange coefficient of each working medium channel can be obtained.

In one embodiment, the following steps may be specifically performed after step 104:

step 401, calculating the sum of heat exchange coefficients of a plurality of monomers to obtain the total heat exchange coefficient of the heat conduction assembly;

Step 402, calculating the quotient of the total heat exchange coefficient and the quantity of the heat conduction components to obtain an average heat exchange coefficient;

step 403, obtaining a dimensionless function of the heat and mass transfer device based on the average heat transfer coefficient and the knoop-schel number.

Optionally, in this embodiment of the present application, the average heat exchange coefficient of the heat and mass transfer device may be obtained by adding the monomer heat exchange coefficients of each working medium channel obtained in the foregoing steps, and then averaging the monomer heat exchange coefficients, where a specific calculation method is as follows:

（7）

wherein n is the number of heating elements in the heat conducting assembly.

And finally, the average heat exchange coefficient calculation relation is arranged through the method of No. Xie Ershu, so that a dimensionless number of times function relation can be obtained, and the specific function relation can be in the following form:

（8）

the Nu is a flow reynolds number Xie Ershu, re is a flow reynolds number, and Pr is a prandtl number, where the flow reynolds number and the prandtl number may be calculated according to a calculation formula of the flow reynolds number and the prandtl number in the prior art, which is not described herein.

In these alternative embodiments, by calculating a dimensionless function, a basis formula can be provided for subsequent thermal hydraulic analysis of the heat and mass transfer device, improving the efficiency and accuracy of the thermal hydraulic analysis of the heat and mass transfer device.

In one embodiment, the following steps may be specifically performed after step 105:

step 501, under the condition that the heat and mass transfer device is in disturbance, acquiring a first temperature change curve of the heat conduction assembly in a first time range, and obtaining a first maximum temperature value and a first minimum temperature value of the heat conduction assembly according to the first temperature change curve;

step 502, under the condition that the heat and mass transfer device is in disturbance, obtaining a second temperature change curve of the heat conduction assembly in a second time range, and obtaining a second maximum temperature value and a second minimum temperature value of the heat conduction assembly according to the second temperature change curve;

in step 503, when the first maximum temperature value is smaller than the second maximum temperature value and the first minimum temperature value is greater than the second minimum temperature value, unstable information of the working medium channel is generated.

Alternatively, the perturbation of the heat and mass transfer device may be an action that increases current power, decreases current power, or the like, which is capable of perturbing the heat and mass transfer device for one cycle of pulsation. The first maximum temperature value, the first minimum temperature value, the second maximum temperature value and the second minimum temperature value are all wall surface temperatures of the working medium channel.

In the embodiment of the application, the first time range and the second time range dT are each 1 second to 2 seconds. According to the applicant's extensive experimental study, it was found that the first time range and the second time range should not be too long. Because of the need for sufficient convergence time, the first time frame and the second time frame must not be too short, both for at least 1 second; if the calculation result diverges, too long a first time range and a second time range may result in a distorted result.

Specifically, the first time range and the second time range dt are 2 to 3 times the time for the working medium to flow through the working medium channel. The first time range and the second time range are set to be 2 to 3 times of the time for the working medium to flow through the working medium channel, so that at least one complete flowing unstable pulsation period can be ensured in the first time range and the second time range, the accuracy of the maximum value and the minimum value of the wall temperature is ensured, and the accuracy of identifying flowing instability is improved.

Alternatively, in the embodiment of the present application, the first time range and the second time range are selected from two consecutive durations dt. If the time interval is not two continuous time lengths, the time interval is not easy to accurately determine, so that the accuracy of the detected flow instability can be improved by selecting two continuous time steps.

In step 503, for all working fluid channels, if the first maximum temperature value in the first time range is smaller than the second maximum temperature value in the second time range and the first minimum temperature value in the first time range is greater than the second minimum temperature value in the second time range, it is determined that the working fluid channels are unstable. And identifying the unstable flow pulsation based on the relationship between the maximum value and the minimum value of the wall temperature of each channel in two continuous time steps, wherein the wall temperature data of each channel is divergent wall temperature pulsation, namely judging whether the wall temperature data diverges in continuous time to identify the unstable flow.

As shown in fig. 8 and 9, a maximum wall temperature value and a minimum wall temperature value of each working medium channel in two continuous first time ranges and a second time range dt are obtained, wherein the first maximum temperature value in the first time range is Max1, the first minimum temperature value is Min1, the second maximum temperature value in the second time range is Max2, and the second minimum temperature value is Min2. In fig. 8, max1> Max2 and Min1< Min2, so that flow instability does not occur, and in fig. 9, max1< Max2 and Min1> Min2, so that flow instability occurs.

In these alternative embodiments, the method realizes the automatic identification of the flow instability of the working medium channels of the heat and mass transfer device, can be used as a shortcut for a technician to analyze whether the flow instability occurs among the parallel working medium channels under different working conditions, and based on the wall temperature change data of the density wave pulsation of the parallel working medium channels obtained by measurement or calculation, the program can automatically identify whether the flow instability occurs by judging whether the flow instability diverges or not through the steps in a continuous time, so that the technician can save a large amount of data analysis time, and the efficiency of analyzing whether the flow instability occurs is improved.

step 601, obtaining temperature change information and a temperature value of a temperature sensing piece, wherein the temperature change information comprises a temperature rising rate;

step 602, generating boiling critical information of a working medium channel under the condition that the temperature rising rate is greater than 3 ℃/s or the temperature value is greater than 700 ℃.

In step 602, it is determined whether the working fluid channel is boiling critical as follows:

a) The wall temperature measured by the temperature sensing piece rises in a temperature fly way, and the temperature rising rate is more than 3 ℃/s, so that the boiling criticality is considered to occur in the working medium channel;

b) The wall temperature measured by the temperature sensing piece continuously rises and exceeds 700 ℃, and the boiling critical point is considered to occur in the working medium channel.

When this occurs, the power supply needs to be turned off immediately and the heating is stopped to ensure the safety of the heat and mass transfer device.

It should be noted that, in the method for calculating the heat exchange coefficient provided in the embodiment of the present application, the execution body may be a calculating device. In the embodiment of the present application, a calculation method for executing a heat exchange coefficient by a calculation device is taken as an example, and the calculation device provided in the embodiment of the present application is described.

FIG. 10 is a schematic diagram of a computing device according to another embodiment of the present application, which may include:

The first obtaining module 1001 is configured to obtain a first temperature measured by the temperature sensing element, and calculate to obtain a working medium temperature in the working medium channel according to the first temperature and a preset characteristic parameter of the working medium channel;

the first calculating module 1002 is configured to calculate a second temperature according to a preset feature parameter of the working medium channel, the first temperature, and a one-dimensional steady-state heat conduction equation;

a second calculation module 1003, configured to calculate a temperature difference between the second temperature and the working medium temperature;

the second obtaining module 1004 is configured to obtain preset feature parameters of the heat conducting component, calculate a heat flux density of the working medium channels according to the preset feature parameters of the heat conducting component, and calculate a quotient of the temperature difference and the heat flux density to obtain a single heat exchange coefficient of each working medium channel.

Optionally, the measuring device may further include:

the third calculation module is used for calculating a first coefficient according to the preset characteristic parameters of the working medium channel;

the third acquisition module is used for acquiring the energizing parameter of the heating assembly, calculating the product of the energizing parameter and the first coefficient, and obtaining a second coefficient;

the fourth calculation module is used for calculating the sum of the second coefficient and a preset first enthalpy value to obtain a second enthalpy value;

and the fourth acquisition module is used for acquiring the force parameter of the heat and mass transfer device and calculating the working medium temperature according to the second enthalpy value and the force parameter.

Optionally, the computing device may further include:

a fifth calculation module, configured to calculate a total heating volume of the heat conduction assembly according to a diameter of the heat conduction assembly and a length of the heat conduction assembly;

and a sixth calculation module, configured to calculate a quotient of the total heating volume and an energizing parameter of the heating assembly, and obtain the heat flux density.

Optionally, the computing device may further include:

a seventh calculation module, configured to calculate a sum of heat exchange coefficients of a plurality of monomers to obtain a total heat exchange coefficient of the heat conduction assembly;

the eighth calculation module is used for calculating the quotient of the total heat exchange coefficient and the quantity of the heat conduction components to obtain an average heat exchange coefficient;

a first determination module is configured to obtain a dimensionless function of the heat and mass transfer device based on the average heat transfer coefficient and the knoop-schel number.

Optionally, the computing device may further include:

a fifth obtaining module, configured to obtain a first temperature change curve of the heat conducting component in a first time range when the thermal mass transfer device is in a disturbance state, and obtain a first maximum temperature value and a first minimum temperature value of the heat conducting component according to the first temperature change curve;

the sixth acquisition module is used for acquiring a second temperature change curve of the heat conduction assembly in a second time range under the condition that the heat and mass transfer device is in disturbance, and acquiring a second maximum temperature value and a second minimum temperature value of the heat conduction assembly according to the second temperature change curve;

The first generation module is used for generating unstable information of the working medium channel under the condition that the first maximum temperature value is smaller than the second maximum temperature value and the first minimum temperature value is larger than the second minimum temperature value.

Optionally, the computing device may further include:

the seventh acquisition module is used for acquiring temperature change information and temperature values of the temperature sensing piece, wherein the temperature change information comprises a temperature rising rate;

the second generation module is used for generating boiling critical information of the working medium channel under the condition that the temperature rising rate is more than 3 ℃/s or the temperature value is more than 700 ℃.

It should be noted that, the computing device is a device corresponding to the computing method of the heat exchange coefficient, and all implementation manners in the above method embodiments are applicable to the embodiment of the device, so that the same technical effects can be achieved.

It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.

Fig. 11 shows a schematic hardware structure of a computing device according to an embodiment of the present application.

The device may include a processor 1101 and a memory 1102 storing program instructions.

The steps of any of the various method embodiments described above are implemented when a program is executed by the processor 1101.

For example, the program may be partitioned into one or more modules/units, which are stored in the memory 1102 and executed by the processor 1101 to complete the present application. One or more of the modules/units may be a series of program instruction segments capable of performing specific functions to describe the execution of the program in the device.

In particular, the processor 1101 may comprise a Central Processing Unit (CPU), or an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), or may be configured to implement one or more integrated circuits of embodiments of the present application.

Memory 1102 may include mass storage for data or instructions. By way of example, and not limitation, memory 1102 may comprise a Hard Disk Drive (HDD), floppy Disk Drive, flash memory, optical Disk, magneto-optical Disk, magnetic tape, or universal serial bus (Universal Serial Bus, USB) Drive, or a combination of two or more of the foregoing. Memory 1102 may include removable or non-removable (or fixed) media where appropriate. Memory 1102 may be internal or external to the integrated gateway disaster recovery device, where appropriate. In a particular embodiment, the memory 1102 is a non-volatile solid state memory.

The memory may include Read Only Memory (ROM), random Access Memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical/tangible memory storage devices. Thus, in general, the memory includes one or more tangible (non-transitory) readable storage media (e.g., memory devices) encoded with software comprising computer-executable instructions and when the software is executed (e.g., by one or more processors) it is operable to perform the operations described with reference to methods in accordance with aspects of the present disclosure.

The processor 1101 implements any of the methods of the above embodiments by reading and executing program instructions stored in the memory 1102.

In one example, the electronic device may also include a communication interface 1103 and a bus 1110. The processor 1101, the memory 1102, and the communication interface 1103 are connected to each other through a bus 1110 and perform communication with each other.

The communication interface 1103 is mainly used for implementing communication between each module, device, unit and/or apparatus in the embodiments of the present application.

Bus 1110 includes hardware, software, or both, that couple the components of the online data flow billing device to each other. By way of example, and not limitation, the buses may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an infiniband interconnect, a Low Pin Count (LPC) bus, a memory bus, a micro channel architecture (MCa) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a video electronics standards association local (VLB) bus, or other suitable bus, or a combination of two or more of the above. Bus 1110 can include one or more buses, where appropriate. Although embodiments of the present application describe and illustrate a particular bus, the present application contemplates any suitable bus or interconnect.

In addition, in combination with the method in the above embodiment, the embodiment of the application may be implemented by providing a storage medium. The storage medium has program instructions stored thereon; the program instructions, when executed by a processor, implement any of the methods of the embodiments described above.

The embodiment of the application further provides a chip, the chip includes a processor and a communication interface, the communication interface is coupled with the processor, and the processor is used for running a program or an instruction, implementing each process of the above method embodiment, and achieving the same technical effect, so as to avoid repetition, and not repeated here.

It should be understood that the chips referred to in the embodiments of the present application may also be referred to as system-on-chip chips, chip systems, or system-on-chip chips, etc.

The embodiments of the present application provide a computer program product, which is stored in a storage medium, and the program product is executed by at least one processor to implement the respective processes of the above method embodiments, and achieve the same technical effects, and are not repeated herein.

It should be clear that the present application is not limited to the particular arrangements and processes described above and illustrated in the drawings. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present application are not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps, after appreciating the spirit of the present application.

The functional blocks shown in the above-described structural block diagrams may be implemented in hardware, software, firmware, or a combination thereof. When implemented in hardware, it may be, for example, an electronic circuit, an Application Specific Integrated Circuit (ASIC), suitable firmware, a plug-in, a function card, or the like. When implemented in software, the elements of the present application are the programs or code segments used to perform the required tasks. The program or code segments may be stored in a machine readable medium or transmitted over transmission media or communication links by a data signal carried in a carrier wave. A "machine-readable medium" may include any medium that can store or transfer information. Examples of machine-readable media include electronic circuitry, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio Frequency (RF) links, and the like. The code segments may be downloaded via computer grids such as the internet, intranets, etc.

It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be different from the order in the embodiments, or several steps may be performed simultaneously.

Aspects of the present disclosure are described above with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions/acts specified in the flowchart and/or block diagram block or blocks. Such a processor may be, but is not limited to being, a general purpose processor, a special purpose processor, an application specific processor, or a field programmable logic circuit. It will also be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware which performs the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, which are intended to be included in the scope of the present application.

Claims

1. A heat and mass transfer device, the heat and mass transfer device comprising:

a heating assembly;

the heat conduction assembly is provided with a plurality of working medium channels extending along a first direction and a plurality of temperature measurement channels extending along the first direction, the working medium channels and the temperature measurement channels are arranged at intervals, the heat conduction assembly further comprises heat exchange sections which are sequentially arranged along the first direction, and the heat conduction assembly is connected with the heating assembly so as to conduct heat emitted by the heating assembly to the working medium channels;

the temperature measuring assembly comprises a plurality of temperature sensing pieces, the temperature sensing pieces are respectively arranged in the temperature measuring channels, the temperature sensing pieces are respectively positioned at different heat exchange sections relative to the working medium channels, and the temperature sensing pieces are used for measuring the wall surface temperatures of the different heat exchange sections;

the heat conduction assembly comprises a plurality of sub heat conduction assemblies arranged at intervals, each sub heat conduction assembly comprises a heat absorption piece and a heat release piece which are connected, the heat absorption piece is used for receiving heat energy emitted by the heating assembly, the heat release piece is used for transmitting the heat energy of the heat absorption piece to working media flowing in the working medium channel, and the heat conduction quantity of the heat absorption piece is smaller than that of the heat release piece.

2. The heat and mass transfer device of claim 1, wherein the heat sink further comprises a plurality of flow apertures extending in a second direction, the plurality of temperature sensing channels being spaced circumferentially about the working fluid channel, the flow apertures communicating between adjacent two of the working fluid channels, the second direction intersecting the first direction.

3. The heat and mass transfer device of claim 1, wherein the temperature sensing assembly further comprises a temperature sensing collar and an insert coupled to the temperature sensing member, the temperature sensing collar being sleeved on the temperature sensing member, the temperature sensing collar abutting an inner wall of the temperature sensing channel.

4. The heat and mass transfer device of claim 3, wherein the temperature sensing assembly further comprises a spacer disposed at an end of the heat sink remote from the temperature sensing collar, the spacer having a plurality of through holes through which the plurality of inserts pass, respectively.

5. The heat and mass transfer device of claim 3, wherein the temperature sensing assembly further comprises an insulator disposed within the temperature sensing channel and surrounding the insert.

6. The method of calculating a heat transfer coefficient for use with the heat and mass transfer device of any one of claims 1-5, comprising:

acquiring a first temperature measured by the temperature sensing piece, and calculating to obtain the temperature of the working medium in the working medium channel according to the first temperature and preset characteristic parameters of the working medium channel;

calculating to obtain a second temperature according to the preset characteristic parameters of the working medium channel, the first temperature and a one-dimensional steady-state heat conduction equation;

calculating a temperature difference value between the second temperature and the working medium temperature;

and obtaining preset characteristic parameters of the heat conduction assembly, calculating the heat flux density of the working medium channels according to the preset characteristic parameters of the heat conduction assembly, and calculating the quotient of the temperature difference and the heat flux density to obtain the monomer heat exchange coefficient of each working medium channel.

7. The method of claim 6, wherein calculating the working medium temperature in the working medium channel according to the first temperature and the preset characteristic parameter of the working medium channel comprises:

according to the preset characteristic parameters of the working medium channel, calculating to obtain a first coefficient;

Acquiring an energization parameter of the heating assembly, and calculating a product of the energization parameter and the first coefficient to obtain a second coefficient;

calculating the sum of the second coefficient and a preset first enthalpy value to obtain a second enthalpy value;

and acquiring a force parameter of the heat and mass transfer device, and calculating the working medium temperature according to the second enthalpy value and the force parameter.

8. The method of claim 7, wherein the preset characteristic parameters of the heat conducting component include a diameter of the heat conducting component and a length of the heat conducting component, and the obtaining the preset characteristic parameters of the heat conducting component and calculating the heat flux density of the working medium channel according to the preset characteristic parameters of the heat conducting component includes:

calculating to obtain the total heating volume of the heat conduction assembly according to the diameter of the heat conduction assembly and the length of the heat conduction assembly;

and calculating the quotient of the total heating body and the energizing parameters of the heating assembly to obtain the heat flow density.

9. The method of claim 6, wherein said calculating the quotient of said temperature difference and said heat flux density to obtain a single heat exchange coefficient for each of said working fluid channels further comprises:

Calculating the sum of the heat exchange coefficients of the monomers to obtain the total heat exchange coefficient of the heat conduction assembly;

calculating the quotient of the total heat exchange coefficient and the quantity of the heat conducting components to obtain an average heat exchange coefficient;

a dimensionless function of the heat and mass transfer device is obtained from the average heat exchange coefficient and the knoop-schel number.

10. The method of claim 6 wherein said working fluid passages of said heat and mass transfer device are connected in parallel, said method further comprising:

acquiring a first temperature change curve of the heat conduction assembly in a first time range under the condition that the heat and mass transfer device is in disturbance, and acquiring a first maximum temperature value and a first minimum temperature value of the heat conduction assembly according to the first temperature change curve;

acquiring a second temperature change curve of the heat conduction assembly in a second time range under the condition that the heat and mass transfer device is in disturbance, and acquiring a second maximum temperature value and a second minimum temperature value of the heat conduction assembly according to the second temperature change curve;

and generating unstable information of the working medium channel under the condition that the first maximum temperature value is smaller than the second maximum temperature value and the first minimum temperature value is larger than the second minimum temperature value.

11. The method of claim 6 wherein said working fluid passages of said heat and mass transfer device are connected in parallel, said method further comprising:

acquiring temperature change information and a temperature value of the temperature sensing piece, wherein the temperature change information comprises a temperature rising rate;

and generating boiling critical information of the working medium channel under the condition that the heating rate is more than 3 ℃/s or the temperature value is more than 700 ℃.

12. A computing device, characterized in that it is applied to a method for computing a heat exchange coefficient according to any one of claims 6 to 11, the device comprising:

the first calculation module is used for calculating a second temperature according to the preset characteristic parameters of the working medium channel, the first temperature and the one-dimensional steady-state heat conduction equation;

the second calculation module is used for calculating a temperature difference value between the second temperature and the working medium temperature;

13. A computing device, the computing device comprising: a processor and a memory storing computer program instructions;

the processor, when executing the computer program instructions, implements a method for calculating a heat exchange coefficient according to any one of claims 6-11.

14. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon computer program instructions, which when executed by a processor, implement a method of calculating a heat exchange coefficient according to any of claims 6-11.