CN116013886A - Radiator - Google Patents

Radiator Download PDF

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Publication number
CN116013886A
CN116013886A CN202310014941.XA CN202310014941A CN116013886A CN 116013886 A CN116013886 A CN 116013886A CN 202310014941 A CN202310014941 A CN 202310014941A CN 116013886 A CN116013886 A CN 116013886A
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CN
China
Prior art keywords
channels
jet
channel
backflow
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310014941.XA
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Chinese (zh)
Inventor
石先玉
孙瑜
万里兮
吴昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Wanying Microelectronics Co ltd
Original Assignee
Chengdu Wanying Microelectronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Wanying Microelectronics Co ltd filed Critical Chengdu Wanying Microelectronics Co ltd
Priority to CN202310014941.XA priority Critical patent/CN116013886A/en
Priority to DE202023100905.0U priority patent/DE202023100905U1/en
Publication of CN116013886A publication Critical patent/CN116013886A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the technical field of semiconductors, in particular to a radiator, which comprises: a structural body comprising: a first face and a second face opposite the first face; the first surface is provided with a heat dissipation window, N jet channels and M backflow channels are arranged in the heat dissipation window, the N jet channels and the M backflow channels are arranged according to a preset rule, and jet outlets of the jet channels and backflow inlets of the backflow channels are both connected with the heat dissipation window; the device also comprises a jet cavity and a reflux cavity, wherein the jet inlet of each jet channel is connected with the jet cavity, and the reflux outlet of each reflux channel is connected with the reflux cavity; the cooling working medium is injected into the jet cavity from the second surface, reaches the heat source surface through the N jet channels, flows out of the backflow channels around each jet channel through reflection of the heat source surface, and reaches the backflow cavity to radiate heat on the heat source surface.

Description

Radiator
Technical Field
The invention relates to the technical field of semiconductors, in particular to a radiator.
Background
With the improvement of the packaging integration density of the semiconductor chip, the heat per unit area is rapidly increased, and the conventional heat dissipation mode is adoptedThe heat flux density of the part is more than 100W/cm 2 The application scene of the device is shown to be the front of a garment and the elbow, the heat is concentrated or the use reliability of the device is seriously affected, and under the condition of higher integration density of the device, the conventional heat dissipation structure occupies larger space, so that the improvement of the integration density is not facilitated.
Therefore, how to improve the heat dissipation performance while ensuring the integration level of the device is a technical problem to be solved at present.
Disclosure of Invention
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a heat sink which overcomes or at least partially solves the above problems.
In a first aspect, the present invention provides a heat sink comprising:
a structural body comprising a first face and a second face opposite the first face;
the first surface is provided with a heat dissipation window which is used for being in contact with a heat source surface to be dissipated, N jet flow channels and M backflow channels are arranged in the heat dissipation window, the N jet flow channels and the M backflow channels are arranged according to a preset rule, the lengths of the jet flow channels are different from those of the backflow channels, a jet flow outlet of each jet flow channel and a backflow inlet of each backflow channel are connected with the heat dissipation window, and N and M are positive integers;
the structural body further comprises: the jet inlet of each jet channel is connected with the jet cavity, the reflux outlet of each reflux channel is connected with the reflux cavity, and the jet cavity and the reflux cavity are parallel to the second surface;
the cooling working medium flows into the jet cavity from the second surface, reaches the heat source surface opposite to the first surface through the N jet channels, flows out of the backflow channels around each jet channel after being reflected by the heat source surface, and reaches the backflow cavity to dissipate heat of the heat source surface.
Preferably, the N fluidic channels and the M backflow channels are arranged in a staggered manner, or the fluidic channels and the backflow channels are arranged in a matched manner.
Preferably, when the N fluidic channels and the M backflow channels are arranged in a staggered manner, 3, 4 or 5 backflow channels are arranged around each fluidic channel.
Preferably, the first channel sections of the N jet channels and the second channel sections of the M return channels are each any one of the following shapes:
round, square, oval, and triangular.
Preferably, when the jet flow channels are arranged in a matching way with the backflow channels, the section of each backflow channel in the M backflow channels is annular, and each annular backflow channel is arranged around a corresponding jet flow channel in a surrounding way.
Preferably, the method further comprises: and the cooling working medium inlet channel is positioned on the second surface and connected with the jet flow cavity, and the cooling working medium outlet channel is connected with the reflux cavity.
Preferably, the heat source surface is a chip, a metal layer or a supporting structure.
Preferably, the structural body is specifically made of an organic resin material, a ceramic material or a metal material.
In a second aspect, the present invention also discloses a radiator, including:
two structural bodies according to any one of the first aspect, and the two structural bodies are symmetrically arranged with the second face.
Preferably, the method further comprises: and the cooling working medium inlet channel is positioned between the two second surfaces and connected with the two jet flow cavities, and the cooling working medium outlet channel is connected with the two reflux cavities.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the invention provides a radiator, comprising: a structural body comprising: a first face and a second face opposite the first face; the first surface is provided with a heat dissipation window which is used for being in contact with a heat source surface to be subjected to heat dissipation, N jet flow channels and M backflow channels are arranged in the heat dissipation window, the N jet flow channels and the M backflow channels are arranged according to a preset rule, the lengths of the jet flow channels are different from those of the backflow channels, a jet flow outlet of each jet flow channel and a backflow inlet of each backflow channel are both connected with the heat dissipation window, and N and M are both positive integers; the structure body further comprises a jet cavity and a backflow cavity, the jet inlet of each jet channel is connected with the jet cavity, the backflow outlet of each backflow channel is connected with the backflow cavity, and the jet cavity and the backflow cavity are parallel to the second surface; the cooling working medium is injected into the jet cavity from the second surface, reaches the heat source surface opposite to the first surface through the N jet channels, flows out of the backflow channels around each jet channel after being reflected by the heat source surface, and reaches the backflow cavity to radiate heat on the heat source surface.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also throughout the drawings, like reference numerals are used to designate like parts. In the drawings:
FIG. 1 is a schematic diagram of a heat sink according to an embodiment of the present invention;
FIG. 2 shows a schematic diagram of a structure in which jet channels and return channels are staggered in an embodiment of the present invention;
FIG. 3 is a schematic diagram showing the configuration of the jet channel and the return channel in the embodiment of the invention;
fig. 4 is a schematic perspective view of a radiator according to an embodiment of the invention;
FIG. 5 is a schematic diagram of another heat sink according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of another radiator according to an embodiment of the invention.
Reference numerals in the drawings: 11-heat source surface, 12-jet flow channel, 13-return flow channel, 14-cooling working medium outlet channel, 15-cooling working medium inlet channel, 16-structure body, 161-first surface, 162-second surface, 163-heat dissipation window, 164-jet flow cavity and 165-return flow cavity.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Example 1
An embodiment of the present invention provides a heat sink, as shown in fig. 1, including: a structural body 16, the structural body 16 comprising a first face 161 and a second face 162 opposite the first face;
the first surface 161 is provided with a heat dissipation window 163, the heat dissipation window 163 is used for being in contact with a heat source surface 11 to be subjected to heat dissipation, N jet flow channels 12 and M backflow channels 13 are arranged in the heat dissipation window 163, the N jet flow channels 12 and the M backflow channels 13 are arranged according to a preset rule, the lengths of the jet flow channels 12 are different from those of the backflow channels 13, each jet flow channel 12, each jet flow outlet and each backflow inlet of the backflow channels 13 are connected with the heat dissipation window 163, and N and M are positive integers;
the structural body 16 further comprises a jet cavity 164 and a backflow cavity 165, the jet inlet of each jet channel 12 is connected with the jet cavity, the backflow outlet of each backflow channel 13 is connected with the backflow cavity 165, and the jet cavity 164 and the backflow cavity 165 are parallel to the second face 162;
the cooling medium is jetted from the second surface 162 to the jet cavity 164, reaches the heat source surface 11 opposite to the first surface 161 through the N jet channels 12, flows out of the return channels 13 around each jet channel 12 after being reflected by the heat source surface 11, and reaches the return cavity 165 to dissipate heat from the heat source surface 11.
In a specific embodiment, when the N jet channels 12 and the M return channels 13 on the structural body 16 are arranged according to a preset rule, there are the following various ways.
Wherein, the values of N and M may be the same or different. Thus, the N fluidic channels 12 are arranged in a staggered manner with the M return channels 13, or the fluidic channels 12 and the return channels 13 are provided in a matched manner.
In one embodiment, when the N fluidic channels 12 and the M return channels 13 are arranged in a staggered manner, 3, 4 or 5 return channels are provided around each fluidic channel.
As shown in fig. 2, a schematic view of 4 return channels is provided around each jet channel. By arranging the plurality of return channels in the jet channel, the cooling working medium emitted by the jet channel 12 is reflected to the periphery into the return channels 13 arranged around after being bounced by the heat source surface 11, so that the cooling working medium with heat can be sent into the return channels 13 through heat exchange of the heat source surface, the return channels 13 are mutually isolated from the jet channel 12, the cooling function of the subsequent cooling working medium is not influenced, and the heat dissipation performance is improved.
Of course, 3, 5 or a greater number of return channels 13 may be provided around each jet channel, which will not be described in detail herein.
The first cross section of the N jet channels 12 and the second cross section of the M return channels 13 are each any of the following shapes:
round, square, oval, and triangular. Of course, any other shape that facilitates the passage of the cooling medium is not limited herein. As shown in fig. 2, is circular in cross-section.
In another embodiment, when the jet flow channels 12 are arranged in cooperation with the backflow channels 13, the section of each backflow channel 13 in the M backflow channels is annular, and each annular backflow channel is enclosed around a corresponding one of the jet flow channels 12.
As shown in fig. 3, the first cross-section of the jet channel 12 may be circular, square, elliptical or triangular, which is not limited herein, and the corresponding return channel 13 is an annular return channel 13 surrounding the jet channel 12.
By adopting the arrangement mode, after the cooling working medium is emitted from the jet flow channel 12 to reach the heat source surface for reflection, the cooling working medium flows out from the annular backflow channel 13, so that the cooling working medium with heat can be sent into the annular backflow channel 13 through heat exchange of the heat source surface 11, the backflow channel 13 is mutually isolated from the jet flow channel 12, the cooling function of the subsequent cooling working medium is not affected, and the heat dissipation performance is improved.
In an alternative embodiment, the heat sink further comprises: cooling medium inlet passage 15 on second face 162 and connected to jet chamber 164, and cooling medium outlet passage 14 connected to return chamber 165. The cooling medium inlet channel 15 is parallel to the second surface, as shown in fig. 1 and fig. 4, where fig. 4 is a schematic diagram of the whole structure. The overall structure shows that the direction of the cooling medium inlet channel 15 is bidirectional, and the direction of the cooling medium outlet channel 14 also comprises two directions, and a bidirectional mode is adopted, so that the cooling medium reaches the heat source surface 11 as soon as possible to dissipate heat, the cooled cooling medium is enabled to be dissipated by the cooling medium outlet channel 14 as soon as possible, and the heat dissipation performance is improved.
The heat source surface 11 is specifically a chip, a metal layer, or a support structure. And is not limited thereto.
The structural body 16 is specifically made of an organic resin material, a ceramic material, or a metal material, and is not limited thereto. The radiator shown in fig. 4 can be formed by 3D printing, cutting, welding and high-temperature sintering lamp.
The radiator is integrated in the high-power-consumption electronic package body, so that the radiating performance is improved.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the invention provides a radiator, comprising: a structural body comprising: a first face and a second face opposite the first face; the first surface is provided with a heat dissipation window which is used for being in contact with a heat source surface to be subjected to heat dissipation, N jet flow channels and M backflow channels are arranged in the heat dissipation window, the N jet flow channels and the M backflow channels are arranged according to a preset rule, the lengths of the jet flow channels are different from those of the backflow channels, a jet flow outlet of each jet flow channel and a backflow inlet of each backflow channel are both connected with the heat dissipation window, and N and M are both positive integers; the structure body further comprises a jet cavity and a backflow cavity, the jet inlet of each jet channel is connected with the jet cavity, the backflow outlet of each backflow channel is connected with the backflow cavity, and the jet cavity and the backflow cavity are parallel to the second surface; the cooling working medium is injected into the jet cavity from the second surface, reaches the heat source surface opposite to the first surface through the N jet channels, flows out of the backflow channels around each jet channel after being reflected by the heat source surface, and reaches the backflow cavity to radiate heat on the heat source surface.
Example two
Based on the same inventive concept, the present invention also provides a heat sink, as shown in fig. 5 and 6, including: two of the structural bodies 16 as described in example one are provided, and the two structural bodies 16 are symmetrically disposed with the second face 162.
In an alternative embodiment, the heat sink further comprises: a cooling medium inlet channel 15 between the two second faces 162 and connecting the two jet chambers 164, and a cooling medium outlet channel 14 connecting the two return chambers 165.
Compared with the radiator in the first embodiment, the radiator adopting the double-sided mounting structure has doubled radiating capacity and can radiate heat for the packaging structure of the chip with larger power consumption.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (10)

1. A heat sink, comprising:
a structural body comprising a first face and a second face opposite the first face;
the first surface is provided with a heat dissipation window which is used for being in contact with a heat source surface to be dissipated, N jet flow channels and M backflow channels are arranged in the heat dissipation window, the N jet flow channels and the M backflow channels are arranged according to a preset rule, the lengths of the jet flow channels are different from those of the backflow channels, a jet flow outlet of each jet flow channel and a backflow inlet of each backflow channel are connected with the heat dissipation window, and N and M are positive integers;
the structural body further comprises: the jet inlet of each jet channel is connected with the jet cavity, the reflux outlet of each reflux channel is connected with the reflux cavity, and the jet cavity and the reflux cavity are parallel to the second surface;
the cooling working medium flows into the jet cavity from the second surface, reaches the heat source surface opposite to the first surface through the N jet channels, flows out of the backflow channels around each jet channel after being reflected by the heat source surface, and reaches the backflow cavity to dissipate heat of the heat source surface.
2. The heat sink of claim 1, wherein the N fluidic channels and the M return channels are arranged in a staggered manner or the fluidic channels are configured to mate with the return channels.
3. The heat sink of claim 2, wherein when the N fluidic channels and the M return channels are arranged in a staggered manner, 3, 4, or 5 return channels are disposed around each fluidic channel.
4. The heat sink of claim 3, wherein the first channel sections of the N fluidic channels and the second channel sections of the M return channels are each any of the following shapes:
circular, square, oval, triangular or other polygonal shape.
5. The heat sink of claim 2, wherein each of the M return channels is annular in cross-section when the jet channel is configured with the return channels, and each annular return channel surrounds a corresponding one of the jet channels.
6. The heat sink as recited in claim 1, comprising: and the cooling working medium inlet channel is positioned on the second surface and connected with the jet flow cavity, and the cooling working medium outlet channel is connected with the reflux cavity.
7. The heat sink of claim 1, wherein the heat source surface is embodied as a chip, a metal layer, or a support structure.
8. The heat sink of claim 1, wherein the structural body is specifically made of an organic resin material, a ceramic material, or a metal material.
9. A heat sink, comprising:
two structural bodies according to any one of claims 1-8, wherein the two structural bodies are symmetrically arranged on the second surface.
10. The heat sink as recited in claim 9, further comprising: and the cooling working medium inlet channel is positioned between the two second surfaces and connected with the two jet flow cavities, and the cooling working medium outlet channel is connected with the two reflux cavities.
CN202310014941.XA 2023-01-06 2023-01-06 Radiator Pending CN116013886A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202310014941.XA CN116013886A (en) 2023-01-06 2023-01-06 Radiator
DE202023100905.0U DE202023100905U1 (en) 2023-01-06 2023-02-24 heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310014941.XA CN116013886A (en) 2023-01-06 2023-01-06 Radiator

Publications (1)

Publication Number Publication Date
CN116013886A true CN116013886A (en) 2023-04-25

Family

ID=85773006

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310014941.XA Pending CN116013886A (en) 2023-01-06 2023-01-06 Radiator

Country Status (2)

Country Link
CN (1) CN116013886A (en)
DE (1) DE202023100905U1 (en)

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Publication number Publication date
DE202023100905U1 (en) 2023-03-09

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