CN115647578A - Laser processing method - Google Patents
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- CN115647578A CN115647578A CN202211688064.6A CN202211688064A CN115647578A CN 115647578 A CN115647578 A CN 115647578A CN 202211688064 A CN202211688064 A CN 202211688064A CN 115647578 A CN115647578 A CN 115647578A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a laser processing method, which relates to the field of photoelectricity, wherein the laser processing method comprises the following steps: moving the laser emitting mechanism from the previous processing position to the next processing position according to a preset processing track; and controlling a shielding piece positioned at the upstream of the Bessel cutting head in the laser emission mechanism to rotate so as to shield the part of the laser beam, so that the crack of the through hole formed at the current processing position of the laser emission mechanism is superposed or tangent with the preset processing track and is connected with the crack of the previous through hole. According to the technical scheme, the defects of edge breakage and the like of the product can be avoided, and the processing quality of the product is guaranteed.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a laser processing method.
Background
In the related art of laser cutting, since the bessel beam itself has a diffraction-free performance, when cutting a brittle material, a laser device often cuts the brittle material using the bessel beam, for example, the laser device cuts the brittle material such as optical glass, ceramics, or sapphire using the bessel beam.
However, when cutting is performed by using the bessel beam, the crack progression of the brittle material is not easily controlled, so that chipping, cracking, and the like are likely to occur in the brittle material, and the yield after cutting the brittle material is reduced.
Disclosure of Invention
The invention mainly aims to provide a laser processing method, aiming at avoiding the defects of edge breakage and the like of a product and ensuring the processing quality of the product.
In order to achieve the above object, the laser processing method provided by the present invention comprises the following steps:
moving the laser emitting mechanism from the previous processing position to the next processing position according to a preset processing track;
and controlling a shielding piece positioned at the upstream of the Bessel cutting head in the laser emitting mechanism to rotate so as to shield a part of the laser beam, so that the crack of the through hole formed at the current processing position of the laser emitting mechanism is superposed or tangent with the preset processing track and is connected with the crack of the previous through hole.
In an optional embodiment, the step of controlling a blocking piece located upstream of the bezier cutting head in the laser emission mechanism to rotate so as to block a portion of the laser beam, so that a crack of the through hole formed by the laser emission mechanism at the current processing position coincides with or is tangent to the preset processing track, and is connected to a crack of a previous through hole includes:
acquiring a tangent included angle between the current processing position and the last processing position on the preset processing track;
according to the included angle of the tangent line, acquiring a deflection angle of a vertical moving position of the laser beam on the Bezier cutting head relative to the current position of the laser beam on the Bezier cutting head;
and controlling the shielding piece of the laser emitting mechanism to rotate according to the deflection angle.
In an optional embodiment, before the step of controlling the shutter of the laser emission mechanism to rotate, the method further includes:
judging whether the deflection angle meets a preset correction condition or not;
if yes, correcting the deflection direction and generating a correction angle;
and controlling the shielding piece of the laser emitting mechanism to rotate according to the new deflection direction according to the correction angle.
In an optional embodiment, the step of determining whether the deflection angle satisfies a preset correction condition includes:
judging whether the deflection angle exceeds 180 degrees;
if so, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
and if so, correcting the deflection direction and setting the difference between 360 degrees and the deflection angle as a correction angle.
In an optional embodiment, the step of determining whether the deflection angle satisfies a preset correction condition includes:
judging whether the deflection angle exceeds 90 degrees;
if yes, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
if yes, correcting the deflection direction and setting the difference between 180 degrees and the deflection angle as a correction angle.
In an optional embodiment, the step of moving the laser emission mechanism from the previous processing position to the next processing position according to the preset processing track includes:
controlling the laser emitting mechanism to process a plurality of test through holes;
and selecting the parameter of one test through hole, which is closest to the preset crack, of the actual cracks in the test through holes as a target parameter, and setting the target parameter.
In an alternative embodiment, the area of the laser beam that is blocked at the position of incidence of the blocking piece is not more than half the area of the spot of the laser beam.
In an optional embodiment, the step of moving the laser emission mechanism from the previous processing position to the next processing position according to the preset processing track includes:
keeping the laser emitting mechanism still;
and controlling the workpiece to be processed to move along a preset processing track, so that the laser emitting mechanism moves from the previous processing position to the next processing position.
In an optional embodiment, after the step of controlling a blocking piece located upstream of the bezier cutting head in the laser emission mechanism to rotate so as to block a portion of the laser beam, so that a crack of the through hole formed by the laser emission mechanism at the current processing position coincides with or is tangent to the preset processing track, and is connected to a crack of a previous through hole, the method further includes:
and separating the product and the residual material along the preset processing track.
In an optional embodiment, the step of separating the product and the remnant along the predetermined processing track includes:
applying external force to the product or the residual material to separate the product and the residual material along the preset processing track;
or heating the product or the residual material to separate the product and the residual material along the preset processing track.
According to the laser processing method provided by the technical scheme of the invention, when the laser emitting mechanism is used for processing and cutting a workpiece to be processed, a plurality of through holes can be processed along a preset processing track, and when the laser emitting mechanism moves from a previous processing position to a next processing position, the shielding piece positioned at the upstream of the Bezier cutting head can shield part of a laser beam, and the shielding piece is controlled to rotate, so that Bezier beams with light spots in different long axis directions are formed at different rotating positions of the shielding piece, the fracture direction of a crack generated at the next processing position can be matched with the advancing direction of the processing track at the through hole position, and the crack generated at each processing position can be tangent or superposed with the preset processing track.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a first embodiment of a laser processing method according to the present invention;
FIG. 2 is a schematic flow chart of a second embodiment of the laser processing method of the present invention;
FIG. 3 is a schematic flow chart of a laser processing method according to a third embodiment of the present invention;
FIG. 4 is a schematic flow chart of a fourth embodiment of the laser processing method according to the present invention;
FIG. 5 is a schematic flow chart of a fifth embodiment of the laser processing method according to the present invention;
FIG. 6 is a schematic flow chart of a laser processing method according to a sixth embodiment of the present invention;
FIG. 7 is a schematic flow chart of a laser processing method according to a seventh embodiment of the present invention;
FIG. 8 is a schematic flow chart of an eighth embodiment of the laser processing method according to the present invention;
FIG. 9 is a schematic flow chart of a ninth embodiment of the laser processing method of the present invention;
FIG. 10 is a schematic flow chart of a tenth embodiment of the laser processing method according to the present invention;
FIG. 11 is a schematic structural view of a laser emitting mechanism, a workpiece to be machined and a movable platform according to the present invention;
FIG. 12 is a schematic view of the shielding member and the laser beam;
FIG. 13 is another schematic view of the shielding member and the laser beam according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
70 | |
| 10 | |
90 | |
| 11 | |
200 | |
| 30 | Light |
300 | Workpiece to be machined |
| 50 | Reflecting mirror |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a laser processing method, wherein a shielding piece positioned at the upstream of a Bessel cutting head in a laser emitting mechanism is controlled to rotate, and light spots with different long axis directions are formed at different rotating positions of the shielding piece, so that cracks of a through hole formed at the current processing position of the laser emitting mechanism are matched with a preset processing track and can be connected with the cracks of the previous through hole, the technical problem that the crack trend of a brittle material is difficult to control can be effectively solved, and the yield of products is improved.
Referring to fig. 1, in an alternative embodiment of the present invention, a laser processing method includes the steps of:
step S10: moving the laser emitting mechanism 100 from the previous processing position to the next processing position according to a preset processing track;
step S20: and controlling the blocking piece 70 positioned at the upstream of the Bessel cutting head 90 in the laser emitting mechanism 100 to rotate so as to block the part of the laser beam 11, so that the crack of the through hole formed at the current processing position of the laser emitting mechanism 100 is coincident with or tangent to the preset processing track and is connected with the crack of the previous through hole.
In this embodiment, it can be understood that, referring to fig. 11, the workpiece 300 to be processed by the bessel cutting head 90 of the laser emitting mechanism 100 may be a brittle material such as optical glass, ceramic, or sapphire, and is not limited specifically herein; the laser emitting mechanism 100 comprises a laser 10, a beam shaping assembly 30, a reflector 50, a shielding piece 70 and a bessel cutting head 90, wherein the laser 10 is used for emitting a laser beam 11, and the beam shaping assembly 30, the reflector 50, the shielding piece 70 and the bessel cutting head 90 can be arranged in sequence on the light path of the laser beam 11; the beam shaping assembly 30 includes a beam expander (not shown in the figure) and a collimator (not shown in the figure), the beam expander expands the diameter of the laser beam 11, the collimator collimates the divergent laser beam 11 to obtain a parallel laser beam 11, and the reflector 50 is used for changing the propagation direction of the laser beam 11; specifically, where the shield 70 is located upstream of the bessel cutting head 90, in some exemplary embodiments the shield 70 may be specifically disposed between the beam shaping assembly 30 and the mirror 50 in the optical path of the laser beam 11, in other exemplary embodiments the shield 70 may be specifically disposed between the mirror 50 and the bessel cutting head 90 in the optical path of the laser beam 11; thus, partial shielding of the laser beam 11 can be realized by the shielding member 70, so that the remaining laser beam 11 which is not shielded can be converted into a bessel beam with an elliptical spot after being converted and focused by the bessel cutting head 90, and cracks can be formed at both ends of the major axis at the moment because the elliptical spot has stronger energy at both ends of the major axis; during laser processing, by controlling the relative movement between the laser emitting mechanism 100 and the workpiece 300 to be processed, the laser emitting mechanism 100 may sequentially process a plurality of through holes on the workpiece 300 to be processed along a processing track, and by controlling the rotation of the shielding member 70, light spots with different long axis directions are formed at different rotation positions of the shielding member 70, so that the extending direction of the cracks may be adjusted, the crack of each through hole may be tangent to or coincide with the processing track at the position of the through hole, so that the cracks formed by two adjacent through holes are connected, so as to avoid the occurrence of defects such as edge breakage and the like due to the fact that the crack extends out of the processing track and is not controlled when the product and the remnant are separated, and improve the processing yield of the product.
In the laser processing method provided by the present application, after a through hole is processed, the laser emitting mechanism 100 moves to a processing position above and below the preset processing track, where the processing position where a through hole is processed may be an initial processing position in the preset processing track, or may be the other processing positions in the preset processing track, and of course, the processing position where a through hole is processed is excluded is a final processing position in the preset processing track; it can be understood that, when the workpiece 300 to be machined is cut, it is required to ensure that the crack formed at each machining position by the generated bessel beam with the elliptical spot corresponds to the extension tangential direction of the preset machining track at the position, so that the multiple cracks can be maximally ensured to coincide with the preset machining track after being finally connected. If the track between the current machining position and the next machining position is not a straight track, the incident position of the laser beam 11 on the bessel cutting head 90 needs to be correspondingly adjusted to change the direction of the elliptical spot of the bessel beam, so that the crack of the through hole formed by the laser beam 11 at the next machining position is tangent to or overlapped with the preset machining track and is connected with the crack at the previous machining position.
According to the technical scheme, when the laser emitting mechanism 100 processes and cuts the workpiece 300 to be processed, a plurality of through holes can be processed along a preset processing track, when the laser emitting mechanism 100 moves from a previous processing position to a next processing position, the shielding piece 70 located at the upstream of the Bezier cutting head 90 can shield a part of the laser beam 11, and the shielding piece 70 is controlled to rotate, so that Bezier beams with different light spots in the major axis direction are formed at different rotating positions of the shielding piece 70, the fracture direction of a crack generated at the next processing position can be matched with the advancing direction of the processing track at the through hole position, the crack generated at each processing position can be tangent or overlapped with the preset processing track, and therefore, when the laser emitting mechanism 100 processes a plurality of through holes on the workpiece 300 to be processed according to the preset processing track, the cracks of two adjacent through holes can be connected to form a crack closed along the preset processing track, and the situations of edge breakage, cracks and the like in the processing process can be avoided, and the yield can be improved.
Referring to fig. 2, in an alternative embodiment, the step of controlling the rotation of the shielding member 70 located upstream of the bezier cutting head 90 in the laser emitting mechanism 100 to shield the portion of the laser beam 11, so that the crack of the through hole formed by the laser emitting mechanism 100 at the current processing position coincides with or is tangent to the preset processing track, and is connected to the crack of the previous through hole includes:
step S21: acquiring a tangent included angle between a current processing position and a last processing position on a preset processing track;
step S22: according to the included angle of the tangent lines, the deflection angle of the upper and lower moving positions of the laser beam 11 on the Bezier cutting head 90 relative to the current position of the laser beam 11 on the Bezier cutting head 90 is obtained;
step S23: the shutter 70 of the laser emission mechanism 100 is controlled to rotate according to the deflection angle.
In this embodiment, it can be understood that the laser processing method adopted in the present application mainly needs to control the blocking piece 70 to rotate correspondingly when the laser emitting mechanism 100 moves from the previous processing position to the next processing position according to the preset processing track, so as to generate the bezier beam with the elliptical light spot in the matching major axis direction. In step S21, a tangent between the current processing position and the previous processing position is obtained first, so that an included angle between the tangent at the current processing position and the tangent at the previous processing position can be obtained; in step S22, according to the obtained tangent included angle, a deflection angle of the laser beam 11 at the next position on the bessel cutting head 90 relative to the current position of the laser beam 11 on the bessel cutting head 90 can be correspondingly obtained; in step S23, the rotation of the mask 70 of the laser emission mechanism 100 is controlled according to the deflection angle. In some exemplary embodiments, if the obtained tangential included angle is 90 °, according to the tangential included angle, a deflection angle of 90 ° may be obtained, and according to the deflection angle, the shielding member 70 of the laser emitting mechanism 100 may be controlled to rotate by 90 ° to generate the bessel beam corresponding to the elliptical spot in the desired long axis direction.
Further, the rotation time of the shutter 70 is acquired according to the deflection angle and the preset angular velocity at which the shutter 70 rotates; acquiring the rotation angle of the shutter 70 based on the rotation time and the preset angular velocity; the shutter 70 of the laser emitting mechanism 100 is controlled to rotate according to the rotation angle.
Referring to fig. 3, in an alternative embodiment, before the step of controlling the shutter 70 of the laser emission mechanism 100 to rotate, the method further includes:
step S24: judging whether the deflection angle meets a preset correction condition or not;
step S25: if yes, correcting the deflection direction and generating a correction angle;
step S26: the shutter 70 of the laser emitting mechanism 100 is controlled to rotate in accordance with the new deflection direction based on the correction angle.
In this embodiment, in order to improve the efficiency of controlling the rotation of the shielding member 70 of the laser emitting mechanism 100, the following steps are provided, in step S24, first, the deflection angle is determined, and whether the deflection angle satisfies a preset correction condition, for example, the preset correction condition may be determining whether the deflection angle exceeds 90 ° or 180 °; if yes, correcting the deflection direction and generating a correction angle, that is, correcting the original deflection direction, for example, the original deflection direction is clockwise, and the original deflection direction is counterclockwise after correction, and generating a correction angle under counterclockwise deflection; in step S26, the rotation of the mask 70 of the laser emitting mechanism 100 is controlled in accordance with the new deflection direction based on the generated correction angle so that the mask 70 is rotated to a desired position, and a desired bessel beam having an elliptical spot in the major axis direction is formed.
Referring to fig. 4, in an alternative embodiment, the step of determining whether the deflection angle satisfies the preset correction condition includes:
step S241: judging whether the deflection angle exceeds 180 degrees;
if yes, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
step S251: if yes, correcting the deflection direction and setting the difference between 360 degrees and the deflection angle as a correction angle.
In this embodiment, when the shielding member 70 rotates 360 °, the elliptical spots generated by each rotation angle are different, so in this embodiment, in order to improve the efficiency of controlling the rotation of the shielding member 70 of the laser emitting mechanism 100, in step S241, it is determined whether the next vertical position of the laser beam 11 on the bessel cutting head 90 relative to the current deflection angle of the laser beam 11 on the bessel cutting head 90 exceeds 180 °, wherein in step S251, if the vertical position exceeds 180 °, the deflection direction is corrected, i.e., the direction is opposite to the original direction, and the difference between 360 ° and the deflection angle is set as the correction angle. In some exemplary embodiments, when the rotation direction is clockwise and the yaw angle is 225 °, when step S241 judges whether or not the yaw angle exceeds 180 °, step S251 judges that the yaw angle exceeds 180 °, the yaw direction is corrected, the rotation direction is corrected to the counterclockwise direction, and a difference 135 ° between 360 ° and the yaw angle 225 ° is set as a correction angle, and finally the shutter 70 is controlled to rotate 135 ° in the counterclockwise direction.
Referring to fig. 5, in an alternative embodiment, the step of determining whether the deflection angle satisfies the preset correction condition includes:
step S242: judging whether the deflection angle exceeds 90 degrees;
if yes, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
step S252: if yes, correcting the deflection direction and setting the difference between 180 degrees and the deflection angle as a correction angle.
In this embodiment, when the shielding element 70 rotates 360 °, the elliptical spots generated in the first quadrant and the third quadrant of the coordinate system are approximately the same, and the elliptical spots generated in the second quadrant and the fourth quadrant are approximately the same, for example, the elliptical spot of the (1, 1) coordinate value in the coordinate system is approximately the same as the elliptical spot of the (-1, -1) coordinate value, and the elliptical spot of the (-1, 1) coordinate value in the coordinate system is approximately the same as the elliptical spot of the (1, -1) coordinate value, so that for example, when the elliptical spot of the (1, 1) coordinate value needs to be selected, the elliptical spot of the (-1, -1) coordinate value can be selected to replace the elliptical spot of the (1, 1) coordinate value. Therefore, in the present embodiment, in order to improve the efficiency of controlling the rotation of the shutter 70 of the laser emitting mechanism 100, in step S242, it is determined whether the next position of the laser beam 11 on the bessel cutting head 90, relative to the current deflection angle of the laser beam 11 on the bessel cutting head 90, exceeds 90 °, wherein in step S252, if it exceeds 90 °, the deflection direction is corrected, i.e., the direction opposite to the original direction, and the difference between 180 ° and the deflection angle is set as the correction angle. In some exemplary embodiments, when the rotation direction is clockwise and the deflection angle is 135 °, in step S242, it is determined whether the deflection angle exceeds 90 °, in step S252, the deflection direction is corrected, the rotation direction is corrected to counterclockwise, and a difference of 45 ° between 180 ° and the deflection angle 135 ° is set as a correction angle, and finally the shutter 70 is controlled to rotate 45 ° counterclockwise. It should be noted that, one side of the shielding surface of the shielding member 70 close to the laser beam 11 is set as an arc-shaped side, and the curvature radius of the arc-shaped side can be controlled to make the elliptical spots generated in the first quadrant and the third quadrant approximately the same, and the elliptical spots generated in the second quadrant and the fourth quadrant approximately the same, but it is also possible to adjust the shielding area of the shielding member 70 for the laser beam 11 to make the elliptical spots generated in the first quadrant and the third quadrant approximately the same, and the elliptical spots generated in the second quadrant and the fourth quadrant approximately the same, which is not limited herein.
Referring to fig. 6, in an alternative embodiment, the step of moving the laser emission mechanism 100 from the previous processing position to the next processing position according to the preset processing track includes:
step S30: controlling the laser emitting mechanism 100 to process a plurality of test through holes;
step S40: and selecting the parameter of one test through hole, which is closest to the preset crack, of the actual cracks in the test through holes as a target parameter, and setting the target parameter.
In this embodiment, before the laser emitting mechanism 100 performs processing, a target parameter needs to be selected and set to form a laser beam 11 for processing and cutting; therefore, in step S30, a plurality of test through holes are processed on the test workpiece by controlling the laser emitting mechanism 100, for example, the laser beams 11 with different spot areas can be formed by controlling the shielding member 70 to repeatedly move along the horizontal axis direction, or by replacing control members with different sizes, and different test through holes with different cracks can be generated by different laser beams 11; in step S40, one of the test through holes with the actual crack closest to the predetermined crack is selected as a target parameter and set.
Specifically, the test through hole may be subjected to an enlarged shooting process by a high-definition CCD (charge coupled device) device, and the enlargement factor may be approximately four to five thousand times. In some exemplary embodiments, the test through hole may be sequentially moved by a predetermined distance in a direction from the upper surface to the lower surface of the test workpiece to a corresponding plane for shooting and amplifying, and it is determined whether cracks on a plurality of planes from top to bottom of the test through hole coincide, if so, it may be determined as a stable test through hole, and it is selected as a target parameter and set.
Specifically, the manner of judging whether the cracks are overlapped can be various, wherein one of the manners is to select the cracks on the upper surface as preset cracks, judge whether the overlapping rate between the actual cracks of the test through holes on each plane and the areas of the preset cracks meets the preset overlapping rate range, and if so, select the parameters of the test through holes as target parameters and set the target parameters; and the other method is that the crack on the upper surface is selected as a preset crack, an included angle between the extending direction of the preset crack and the long axis direction of the preset crack is selected as a preset included angle, whether the included angle between the extending direction of the crack of the test through hole on each plane and the long axis direction of the test through hole is equal to the preset included angle or not is judged, if yes, the parameter of the test through hole is selected as a target parameter, and setting is carried out.
Further, after selecting a parameter of one of the plurality of test through holes, of which the actual crack is closest to the preset crack, as a target parameter and performing the setting step, the laser emitting mechanism 100 may be controlled to process the plurality of test through holes at intervals along the straight test track according to the set target parameter, and whether two adjacent test through holes are connected is determined; if the two through holes are connected, the laser emitting mechanism 100 is controlled to process a plurality of test through holes at intervals along the circular track according to the set target parameters, whether two adjacent test through holes under the circular track are connected is judged, and if the two adjacent test through holes under the circular track are connected, the parameters of the test through holes are selected as the target parameters and set.
Referring to fig. 12 to 13, in an alternative embodiment, the area of the laser beam 11 blocked at the position of incidence of the shutter 70 is not more than half the area of the spot of the laser beam 11.
In this embodiment, it can be understood that, based on the focusing characteristic of the bessel beam, when the area of the shielding piece 70 at the incident position of the laser beam 11 is not more than half of the area of the spot of the laser beam 11, that is, the shielding piece 70 can only shield one side of the bisector of the spot of the laser beam 11, so as to ensure that the remaining laser beam 11 that is not shielded can be converted into the bessel beam by the bessel cutting head 90, the spot of the bessel beam can be coupled into an elliptical spot, so as to obtain the bessel beam suitable for cutting the workpiece 300 to be machined. Of course, in some other embodiments, the area of the laser beam 11 at the incident position of the shutter 70 may be slightly larger than half of the area of the spot of the laser beam 11, and the workshop may be selected according to the actual processing requirement.
Referring to fig. 7, in an alternative embodiment, the step of moving the laser emitting mechanism 100 from the previous processing position to the next processing position according to the preset processing track includes:
step S11: the laser emission mechanism 100 is kept still;
step S12: the workpiece 300 to be processed is controlled to move along the preset processing track, so that the laser emitting mechanism 100 moves from the previous processing position to the next processing position.
In this embodiment, according to the preset processing track, the laser emitting mechanism 100 can move from the previous processing position to the next processing position for processing through the relative movement between the laser emitting mechanism 100 and the workpiece 300 to be processed. In step S11, the laser emitting mechanism 100 is kept from performing the translational motion to be kept stationary, and in step S12, the workpiece 300 to be processed may be placed on the moving platform 200, and the moving platform 200 is controlled to move horizontally to drive the workpiece 300 to be processed to move horizontally, so that the workpiece 300 to be processed may be controlled to move along the preset processing track, and the relative movement between the two is realized, so that the laser emitting mechanism 100 is moved from the previous processing position to the next processing position. Because the laser emitting mechanism 100 comprises the laser 10 and the Bessel cutting head 90 which are inconvenient to move, the laser emitting mechanism 100 can be controlled to move integrally in the mode without controlling the laser emitting mechanism 100, and only the workpiece 300 to be machined is controlled to move, so that the operation is convenient, and the processing and production are convenient. Of course, in some other embodiments, the workpiece 300 to be processed may be kept still, and the laser emitting mechanism 100 is controlled to move along the preset processing track, so that the laser emitting mechanism 100 moves from the previous processing position to the next processing position; the laser emitting mechanism 100 can also be controlled to move along a first direction according to a preset processing track, and the workpiece 300 to be processed is controlled to move along a second direction according to the preset processing track, so that the laser emitting mechanism 100 is controlled to move from a previous processing position to a next processing position by respectively controlling the laser emitting mechanism 100 to move along the first direction and the workpiece 300 to be processed to move along the second direction, wherein the first direction and the second direction are two directions which are arranged on a horizontal plane and form an included angle.
Referring to fig. 8, in an alternative embodiment, after the step of controlling the blocking piece 70 of the laser emission mechanism 100 located upstream of the bezier cutting head 90 to rotate to block the portion of the laser beam 11, so that the crack of the through hole formed by the laser emission mechanism 100 at the current processing position coincides with or is tangent to the preset processing track and is connected to the crack of the previous through hole, the method further includes:
step S50: and separating the product and the residual material along a preset processing track.
In this embodiment, after the laser emitting mechanism 100 sequentially processes the workpiece 300 to be processed from the initial processing position to the final processing position along the preset processing track, a splitting auxiliary line that is formed by connecting a through hole and a crack and separates a product from a residual material is formed on the workpiece 300, at this time, the product and the residual material can be obtained by only dividing the product and the residual material along the splitting auxiliary line, and the formation of the splitting auxiliary line can reduce the defects of edge breakage and the like during product separation.
Referring to fig. 9, in an alternative embodiment, the step of separating the product and the cull along the predetermined processing trajectory comprises:
step S51: and applying external force to the product or the residual material to separate the product and the residual material along a preset processing track.
In this embodiment, the product and the residue are separated along the splitting auxiliary line by applying an external force to the residue or the product, and at this time, the product or the residue may be pressed to completely break the splitting auxiliary line, so as to separate the product and the residue, thereby obtaining a final product.
Referring to fig. 10, in an alternative embodiment, the step of separating the product and the cull along the predetermined processing trajectory comprises:
step S52: and heating the product or the residual material to separate the product and the residual material along a preset processing track.
In this embodiment, through heating product or defective material for product or defective material thermal expansion, and when expanding to lobe auxiliary line one side, just can make still continuous not totally cracked crackle extrusion fracture of material, thereby make product and defective material separation, obtain final product.
Referring to fig. 11 to 13, the present application further provides a laser apparatus, which can be used to implement the laser processing method in any of the above embodiments, wherein the laser apparatus includes a laser emitting mechanism 100, the laser emitting mechanism 100 includes a laser 10, a reflector 50, a shield 70 and a bessel cutting head 90, the laser 10 is configured to emit a laser beam 11, the reflector 50, the shield 70 and the bessel cutting head 90 are sequentially disposed on an optical path of the laser beam 11, wherein the bessel cutting head 90 is configured to convert the laser beam 11 into a bessel beam, the shield 70 can rotate around an optical axis of the laser beam 11 to shield a portion of the laser beam 11 incident to the bessel cutting head 90, so that the remaining shielded laser beam 11 can be converted into the bessel beam having an elliptical spot after being converted by the bessel cutting head 90, thereby cracks generated by the bessel beam when cutting the workpiece 300 can be broken along a long axis direction, and simultaneously the rotation of the shield 70 is controlled, and different rotation positions of the shield 70 are used to form different long axes, thereby forming cracks in different machining directions, and adjusting through-hole extending directions of the through-holes can be controlled to prevent the cracks from being connected with each other through-hole, and to prevent the crack from being formed by the through-hole.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.
Claims (10)
1. A laser processing method, characterized by comprising the steps of:
moving the laser emitting mechanism from the previous processing position to the next processing position according to a preset processing track;
and controlling a shielding piece positioned at the upstream of the Bessel cutting head in the laser emitting mechanism to rotate so as to shield a part of the laser beam, so that the crack of the through hole formed at the current processing position of the laser emitting mechanism is superposed or tangent with the preset processing track and is connected with the crack of the previous through hole.
2. The laser processing method of claim 1, wherein the step of controlling a blocking piece of the laser emitting mechanism located upstream of the bessel cutting head to rotate so as to block a portion of the laser beam, so that the crack of the through hole formed by the laser emitting mechanism at the current processing position coincides with or is tangent to the preset processing track, and is connected with the crack of the previous through hole comprises the steps of:
acquiring a tangent included angle between the current processing position and the last processing position on the preset processing track;
according to the included angle of the tangent line, acquiring a deflection angle of a vertical moving position of the laser beam on the Bezier cutting head relative to the current position of the laser beam on the Bezier cutting head;
and controlling the shielding piece of the laser emitting mechanism to rotate according to the deflection angle.
3. The laser processing method according to claim 2, wherein before the step of controlling the shutter of the laser emitting mechanism to rotate, the method further comprises:
judging whether the deflection angle meets a preset correction condition or not;
if yes, correcting the deflection direction and generating a correction angle;
and controlling the shielding piece of the laser emission mechanism to rotate according to the new deflection direction and the correction angle.
4. The laser processing method according to claim 3, wherein the step of determining whether the deflection angle satisfies a preset correction condition includes:
judging whether the deflection angle exceeds 180 degrees;
if yes, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
and if so, correcting the deflection direction and setting the difference between 360 degrees and the deflection angle as a correction angle.
5. The laser processing method according to claim 3, wherein the step of determining whether the deflection angle satisfies a preset correction condition includes:
judging whether the deflection angle exceeds 90 degrees;
if so, the step of correcting the deflection direction and generating the correction angle comprises the following steps:
if yes, correcting the deflection direction and setting the difference between 180 degrees and the deflection angle as a correction angle.
6. The laser processing method of claim 1, wherein the step of moving the laser emitting mechanism from the previous processing position to the next processing position according to the predetermined processing trajectory comprises:
controlling the laser emitting mechanism to process a plurality of test through holes;
and selecting the parameter of one test through hole, which is closest to the preset crack, of the actual cracks in the test through holes as a target parameter, and setting the target parameter.
7. The laser processing method according to claim 1, wherein an area of the laser beam blocked at the position of incidence of the blocking piece is not more than half of an area of a spot of the laser beam.
8. The laser processing method according to any one of claims 1 to 7, wherein the step of moving the laser emission mechanism from the previous processing position to the next processing position in accordance with the predetermined processing trajectory includes:
keeping the laser emitting mechanism still;
and controlling the workpiece to be processed to move along a preset processing track, so that the laser emitting mechanism moves from the previous processing position to the next processing position.
9. The laser processing method according to any one of claims 1 to 7, wherein after the step of controlling a blocking piece located upstream of the Bezier cutting head in the laser emitting mechanism to rotate so as to block a portion of the laser beam, so that the crack of the through hole formed by the laser emitting mechanism at the current processing position coincides with or is tangent to the preset processing track and is connected with the crack of the previous through hole, the method further comprises:
and separating the product and the residual material along the preset processing track.
10. The laser machining method of claim 9 wherein the step of separating the product and the cull along the predetermined machining path comprises:
applying external force to the product or the residual material to separate the product and the residual material along the preset processing track;
or heating the product or the residual material to separate the product and the residual material along the preset processing track.
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