CN115602532A - Method and device for realizing wafer separation - Google Patents
Method and device for realizing wafer separation Download PDFInfo
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- CN115602532A CN115602532A CN202211592297.6A CN202211592297A CN115602532A CN 115602532 A CN115602532 A CN 115602532A CN 202211592297 A CN202211592297 A CN 202211592297A CN 115602532 A CN115602532 A CN 115602532A
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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Abstract
The invention belongs to the field of semiconductor processing equipment, and particularly relates to a method and a device for inducing separation of a thin wafer from a crystal, in particular to a method and a device for realizing wafer separation. The method is characterized in that the crystal base plates and the stripping plates on two sides are respectively applied with forces pointing to the outer sides of the crystals in a mode of bonding the crystal base plates and the stripping plates on the two sides of the crystals, and the forces are transmitted to the modified layer to cause the modified layer to crack and separate. The method of the invention separates the wafer, does not cause the wafer to bend and deform, can effectively avoid the wafer from being broken and reduce the wafer warping.
Description
Technical Field
The invention belongs to the field of semiconductor processing equipment, and particularly relates to a method and a device for inducing separation of a thin wafer from a crystal, in particular to a method and a device for realizing wafer separation.
Background
The development of the fields of 5G communication, national defense and military industry, new energy automobiles, new energy photovoltaic and the like is benefited, and the demand acceleration of SiC and GaN is considerable. However, the crystal hardness is high, the cutting difficulty is high, and the loss of the crystal cutting line is large, so that the cost of the single crystal substrate material accounts for more than 50% of the cost of the device, and the wide application of the device is limited.
The laser slicing technology for crystal ingot is to irradiate laser perpendicularly onto the crystal surface, focus the laser in the position with the given depth from the crystal surface, form crystal destroying layer with the laser energy reaching the destroying threshold of the crystal, and separate the wafer to be stripped from the crystal ingot via various stripping methods. This technique is considered as an effective means for reducing the cost of the SiC substrate, and is expected to become a core process in the third-generation semiconductor substrate processing flow.
The existing mature peeling method in the process is mainly cold peeling, but the cold peeling method needs to prefabricate a PDMS layer with various impurities, the process is complex, crystals need to be put into liquid nitrogen for refrigeration to enable PDMS to generate a contraction force, so that a wafer is peeled, the contraction force control difficulty in the process is large, fragments are easy to cause, the operation is complex, and the automatic production is difficult to realize.
Disclosure of Invention
Aiming at solving the problems of fragile wafers, complex operation and difficulty in realizing automatic production in a cold peeling method adopted by wafer peeling, the invention provides a method and a device for realizing wafer separation aiming at crystals with modified layers generated by a laser modification process.
The invention is realized by adopting the following technical scheme: a method of effecting wafer separation, comprising the steps of:
s1, generating a modified layer on the crystal: adopting a laser vertical irradiation method to generate a modified layer at the appointed depth of the crystal;
s2, sticking a crystal stripping plate and a crystal bottom plate: adopting a stripping plate adhesive to bond one side of the crystal which is modified and provided with the modified layer with the stripping plate, and bonding the other side of the crystal with a crystal bottom plate by using a bottom plate adhesive;
s3, force application and stripping: and applying acting force pointing to the outer side of the crystal to the stripping plate and the crystal bottom plate, so that the acting force is transmitted to the modified layer through the stripping plate adhesive and the bottom plate adhesive, and the modified layer is cracked under the acting force because the strength of the modified layer is far less than that of other materials such as the adhesive, the crystal and the like, thereby realizing the separation of the wafer to be stripped.
According to the method for realizing the wafer separation, the adhesive of the stripping plate adopts the hot melt adhesive film, the hot melt adhesive film is convenient to adhere and separate, and the problems of uneven coating and the like can be avoided; the stripping plate is made of transparent toughened glass, so that the crack propagation and cracking conditions of the modified layer 3 can be observed at any time in the separation process; the bottom plate adhesive is epoxy resin glue.
A device for realizing the separation of wafers comprises a transmission pressurization separation mechanism and a carrying manipulator part, wherein the transmission pressurization separation mechanism comprises a mechanism platen and a jacking electric cylinder, a left vertical plate and a right vertical plate are fixed on the mechanism platen, a transmission shaft is connected between the front end parts of the two vertical plates, a transmission belt wheel is fixed on the transmission shaft, a transmission belt wheel is also installed on an output shaft of a motor fixed on the mechanism platen, the two transmission belt wheels are connected through a transmission synchronous belt, when the motor rotates, the transmission shaft drives the transmission synchronous belt through the two transmission belt wheels, synchronous belt wheels are respectively fixed on the left end part and the right end part of the transmission shaft, the two idle wheels are respectively and symmetrically fixed on the inner sides of the rear ends of the two vertical plates, a synchronous belt is meshed between the synchronous belt wheel on the left side and the idle wheel, a synchronous belt is meshed between the synchronous belt wheel on the right side and the idle wheel, when the transmission shaft rotates, the two synchronous belt wheels synchronously rotate to drive the two synchronous belt wheels meshed on the two synchronous belt wheels to move, a support bar is configured below the synchronous belt, and fixed on the vertical plates, when the synchronous belt moves, the support bar and the synchronous belt moves in a sliding friction motion with the support bar, and the support bar has a certain bearing capacity by configuration, and can drive the load movement of the tooth surface of the support bar. And a limiting plate is respectively fixed on the upper surfaces of the middle parts of the two vertical plates.
The jacking electric cylinder is fixed on the bottom surface of the mechanism bedplate, an electric cylinder extending port is formed in the bedplate of the mechanism bedplate and is positioned between the two vertical plates, the upper end part of the movable part of the jacking electric cylinder can extend out of the electric cylinder extending port, the jacking electric cylinder provides driving force for the device to realize wafer separation, a front jacking knife side plate and a rear jacking knife side plate are fixed on an electric cylinder movable plate at the upper end part of the movable part of the jacking electric cylinder, a gap between the front jacking knife side plate and the rear jacking knife side plate is an assembly groove of a jacking knife, and the jacking knife is assembled in the assembly groove between the two jacking knife side plates to realize the assembly of the jacking knife on the jacking electric cylinder movable plate.
The carrying manipulator component comprises a fixing frame, a horizontal movement module and a vertical movement module, wherein the horizontal movement module is installed on the fixing frame, the vertical movement module is installed on a sliding block of the horizontal movement module, a sucker mounting plate is fixed at the movable end of the vertical movement module, a sucker and a height probe sensor are installed below the sucker mounting plate, the sucker is used for adsorbing a stripping plate after separation, and the height probe sensor is used for detecting the height of the stripping plate.
When the crystal separating device works, the peeling plate and the crystal bottom plate which are well bonded are arranged at the idle wheel end of the synchronous belt, the crystal bottom plate is contacted with the synchronous belt, the synchronous belt is driven by the motor to bear the forward movement of the crystal, at the moment, the top knife side plate is driven by the jacking electric cylinder to ascend to a certain height to block the forward movement of the crystal bottom plate, the motor stops rotating, at the moment, the crystal reaches the wafer separating station, and the crystal bottom plate is inserted into the groove formed by the synchronous belt and the limiting plate.
The movable part of the vertical motion module moves downwards, when the height probe sensor is in contact with the stripping plate, the vertical motion module stops moving, at the moment, the sucker is in contact with the stripping plate, the sucker is connected with negative pressure, and the sucker and the stripping plate are connected together in an adsorption and flexible mode.
The top knife moves upwards under the driving of the jacking electric cylinder, applies force to the stripping plate after contacting the stripping plate, and the crystal bottom plate is limited in the groove formed by the synchronous belt and the limiting plate, so that the jacking electric cylinder applies acting force pointing to the outer side of the crystal to the stripping plate and the crystal bottom plate, and the driving force of the jacking electric cylinder can be transmitted to the modified layer of the crystal to crack the modified layer, thereby realizing the separation of the wafers to be stripped. Then the sucking disc sucks the stripping plate and the separated wafer to move to other stations under the action of the vertical motion module and the horizontal motion module.
After the separation is finished, the jacking electric cylinder drives the movable part of the jacking electric cylinder to descend, the advancing direction of the crystal bottom plate is avoided, the motor drives the synchronous belt to bear the crystal bottom plate, and the residual crystals are separated and moved to the next station. At this point, the separation of one wafer is completed.
The device for realizing the separation of the wafers is characterized in that the middle parts of the two top knife side plates are also provided with the supporting rotating shafts, the grooves in the middle parts of the top knives fall on the supporting rotating shafts, and when the top knives apply force, the contact surfaces of the top knives can be flatly attached to the stress surfaces, so that the stress is uniform, and the local stress is avoided.
According to the device for separating the wafers, the visual system fixing seat positioned above the sucker mounting plate is fixed on the vertical movement module, the camera is installed on the visual system fixing seat, the camera lens is connected with the lower portion of the camera, the annular light source is fixed on the lower portion of the camera lens through the light source fixing piece, and the middle of the sucker mounting plate is provided with the observation port.
The device for realizing the separation of the wafers is characterized in that the front end parts of the two vertical plates are respectively provided with a bearing with a seat, the transmission shaft is arranged between the two bearings with the seats, and the transmission shaft can rotate.
The crystal base plates and the stripping plates on the two sides are respectively applied with forces pointing to the outer sides of the crystal by bonding the crystal base plates and the stripping plates on the two sides of the crystal, and the forces are transmitted to the modified layer to cause the modified layer to crack and separate. The method separates the wafer, does not cause the wafer to bend and deform, can effectively avoid the wafer from being broken and reduce the wafer warping; in addition, the hot melt adhesive film is used as the adhesive when the stripping plate is adhered, so that the adhering and separating processes only need to be heated, and the problems of uneven coating, complex operation, influence on crystal separation and the like can be avoided by adopting the hot melt adhesive film instead of other liquid adhesives, so that the whole process is simple, convenient and reliable to operate and easy to realize automation.
Drawings
FIG. 1 is a schematic diagram of a crystal modification process.
Fig. 2 is a schematic view of a scanning path of a laser beam.
FIG. 3 is a schematic illustration of the application of an external force to a crystal.
Fig. 4 is a schematic view of a wafer separating apparatus.
Fig. 5 is a schematic view of a transport pressure separation mechanism.
Fig. 6 is a schematic view of the top knife assembly relationship.
Fig. 7 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 6.
Fig. 8 is a schematic top-cutter view.
Fig. 9 is a schematic view of the parts of the handling robot.
Fig. 10 is a schematic view of a bonded crystal.
Fig. 11 is a schematic view of the operation of the separating apparatus.
In the figure: 1-laser objective, 2-laser beam, 3-modified layer, 4-crystal, 5-scanning path, 6-stripper plate adhesive, 7-base plate adhesive, 8-crystal base plate, 9-stripper plate, 10-transmission pressure separation mechanism, 11-handling robot part, 12-mechanism platen, 13-vertical plate, 14-pedestal bearing, 15-transmission shaft, 16-synchronous pulley, 17-transmission pulley, 18-transmission synchronous belt, 19-motor, 20-fixing base, 21-synchronous belt, 22-idle pulley, 23-pin shaft, 24-supporting bar, 25-limiting plate, 26-top knife, 27-top knife side plate, 28-supporting rotary shaft, 29-electric cylinder fixing member, 30-top electric cylinder, 31-electric cylinder movable plate, 32-fixing base, 33-horizontal motion module, 34-adapter plate, 35-vertical motion module, 36-vision system fixing base, 37-camera, 38-lens, 39-light source fixing member, 40-annular light source, 41-mounting plate, 42-suction cup, 43-height probe, 44-wafer to-be stripped.
Detailed Description
A method of effecting wafer separation, comprising the steps of:
s1, generating a modified layer 3 on the crystal 4. By adopting a laser vertical irradiation method, a laser beam 2 is focused after passing through a laser objective lens 1, a modified layer 3 is generated at a specified depth of a crystal 4 according to a scanning path 5 in a schematic scanning mode, and the modified layer 3 is greatly reduced in strength compared with the original crystal material and can be broken under a smaller stress.
And S2, adhering a crystal stripping plate 9 and a crystal bottom plate 8. The modified layer 3 side of the modified crystal 4 is bonded with a stripping plate 9 by a stripping plate adhesive 6, the stripping plate adhesive 6 is preferably a hot melt adhesive film, the hot melt adhesive film is convenient to bond and separate, and the problems of uneven coating and the like can be avoided; the stripping plate 9 is preferably made of transparent toughened glass, so that the crack propagation and cracking conditions of the modified layer 3 can be observed at any time in the separation process. The other side of the crystal 4 is bonded with a crystal bottom plate 8, the crystal bottom plate 8 only needs to meet the strength requirement, and no special requirement is required on the material; since crystal base plate 8 does not need to be removed during the entire ingot peeling process, epoxy glue or the like having a strong adhesive force can be used as base plate adhesive 7 here.
And S3, applying force to peel off. As shown in fig. 3, the crystal 4, the peeling plate 9 and the crystal base plate 8 which are bonded together are put into the wafer separating device according to the present invention, and a force directed to the outside of the crystal is applied to the peeling plate 9 and the crystal base plate 8 by the mechanism in the separating device, so that the force is transmitted to the modified layer 3 through the peeling plate adhesive 6 and the base plate adhesive 7, and the strength of the modified layer 3 is much smaller than that of other materials such as an adhesive and a crystal, so that the modified layer 3 is cracked by the force of the separating device, and the wafer is separated.
A device for realizing wafer separation applies a force pointing to the outside of a crystal as shown in figure 3, and the force is transmitted to a modified layer 3, so that the modified layer 3 is subjected to a large tensile stress to crack and separate, and the final separation of the wafer is realized. An apparatus for separating wafers is shown in fig. 4 and includes a transfer press-separating mechanism 10 and a transfer robot assembly 11.
The conveying and pressurizing separation mechanism 10 is shown in fig. 5, and is used for conveying and separating the processed crystal. The mechanism comprises a mechanism bedplate 12, wherein a left long plate-shaped vertical plate 13 and a right long plate-shaped vertical plate 13 are fixed on the mechanism bedplate 12, a bearing with a seat 14 is arranged at the front end of each vertical plate 13, a transmission shaft 15 is arranged between the two bearings with the seat 14, and the transmission shaft 15 can rotate. A transmission belt wheel 17 is fixed in the middle of the transmission shaft 15, a transmission belt wheel 17 is also installed on the output shaft of a motor 19 fixed on the mechanism platen 12 through a fixing seat 20, the two transmission belt wheels 17 are connected through a transmission synchronous belt 18, and when the motor 19 rotates, the transmission shaft 15 rotates through the transmission of the two transmission belt wheels 17 and the transmission synchronous belt 18. Synchronous belt wheels 16 are respectively fixed at the end parts of the left end and the right end of the transmission shaft 15, and when the transmission shaft 15 rotates, the two synchronous belt wheels 16 synchronously rotate to drive two synchronous belts 21 meshed on the two synchronous belt wheels 16 to move. The other end of the synchronous belt is meshed with an idle wheel 22 for transmission, and the two idle wheels 22 are symmetrically fixed on the inner sides of the two vertical plates 13 through two pin shafts 23 respectively. A supporting strip 24 is arranged below the synchronous belt 21, the supporting strip 24 is fixed on the vertical plate 13, when the synchronous belt 21 moves, the tooth surface of the synchronous belt and the supporting strip 24 slide and rub to move, and the supporting strip 24 is arranged, so that the synchronous belt 21 has certain bearing capacity and can drive a load arranged on the synchronous belt to move. And a limiting plate 25 is respectively fixed on the upper surfaces of the middle parts of the two vertical plates 13.
The jacking electric cylinder 30 with double guide rods is fixed on the bedplate 12 through the electric cylinder fixing piece 29, and the jacking electric cylinder 30 provides driving force for realizing the separation of the wafer. Front and rear two top knife side plates 27 are fixed on an electric cylinder movable plate 31 at the upper end part of the movable part of the jacking electric cylinder 30, a gap between the front and rear two top knife side plates 27 is an assembly groove of the top knife 26, and the top knife 26 is assembled in the assembly groove between the two top knife side plates 27, so that the assembly of the top knife 26 on the electric cylinder movable plate 31 is realized. The middle parts of the two top knife side plates 27 are also provided with a supporting rotating shaft 28, a groove in the middle part of the top knife 26 falls on the supporting rotating shaft 28, and when the top knife 26 applies force, the contact surface of the top knife can be flatly attached to the stress surface, so that the stress is uniform, and the local stress is avoided.
As shown in fig. 9, the horizontal movement module 33 of the part is mounted on the fixing frame 32, and the vertical movement module 35 of the part is an electric module with double guide rods and is mounted on the sliding block of the horizontal movement module 33 through the adapter plate 34. The sucker mounting plate 41 is fixed at the movable end of the vertical movement module 35, 4 organ-type rubber suckers and a height probe sensor 43 are mounted below the sucker mounting plate 41, the sucker 42 is used for adsorbing the separated stripping plate 9, and the height probe sensor 43 is used for detecting the height of the stripping plate 9. The vertical motion module 35 is further fixed with a vision system fixing seat 36 located above the suction cup mounting plate 41, the camera 37 is mounted on the vision system fixing seat 36, the lens 38 is connected with the lower portion of the camera 37, and the annular light source 40 is fixed on the lower portion of the lens 38 through a light source fixing member 39.
The bonded crystal is shown in fig. 10. In operation, the bonded crystal is placed at the idler end of the synchronous belt 21 as shown in fig. 11, the crystal bottom plate 8 is in contact with the synchronous belt 21, the motor 19 drives the synchronous belt 21 to bear the crystal to move forward, at this time, the top knife side plate 27 is driven by the jacking electric cylinder 30 to rise to a certain height to block the advance of the crystal bottom plate 8, the motor 19 stops rotating, at this time, the crystal reaches the wafer separation station, and the crystal bottom plate 8 is inserted into the groove formed by the synchronous belt 21 and the limiting plate 25.
The movable part of the vertical movement module 35 moves downward, when the height probe sensor 43 senses the peeling plate 9 in contact, the vertical movement module 35 stops moving, at this time, the four suction cups 42 contact with the peeling plate 9, and the suction cups 42 are connected with negative pressure, so that the suction cups 42 and the peeling plate 9 are connected together in an adsorption and flexible manner.
The top knife 26 moves upwards under the driving of the top lifting electric cylinder 30, applies force to the stripping plate 9 after contacting with the stripping plate, and the crystal bottom plate 8 is limited in the groove formed by the synchronous belt 21 and the limit plate 25, so the driving force of the top lifting electric cylinder 30 can be transmitted to the modified layer 3 of the crystal, the crystal is cracked, and the separation of the wafer is realized. The suction cups 42 then suck the peeling plates 9 and the separated wafer is moved to other stations by the vertical movement module 35 and the horizontal movement module 33.
After the separation is completed, the jacking electric cylinder 30 drives the movable part to descend to avoid the advancing direction of the crystal bottom plate 8, the motor 19 drives the synchronous belt 21 to bear the crystal bottom plate 8, and the residual crystals are separated and moved to the next station. At this point, the separation of one wafer is completed.
In the separation process, the visual part is used for observing the expansion state of the cracks when the crystal is stressed, and optimizing parameters such as the movement speed and the output force of the jacking electric cylinder 30 on the basis of the expansion state, so that the optimization of process parameters and the monitoring of the process are realized.
Claims (6)
1. A method of effecting wafer separation, comprising: the method comprises the following steps:
s1, producing a modified layer (3) on the crystal (4): adopting a laser vertical irradiation method to generate a modified layer (3) at a specified depth of the crystal (4);
s2, sticking a crystal stripping plate (9) and a crystal bottom plate (8): the side of the crystal (4) which is modified and is provided with the modified layer (3) is bonded with a stripping plate (9) by a stripping plate adhesive (6), and the other side of the crystal (4) is bonded with a crystal bottom plate (8) by a bottom plate adhesive (7);
s3, force application and stripping: and applying acting force pointing to the outer side of the crystal to the stripping plate (9) and the crystal base plate (8), transmitting the acting force to the modified layer (3) through the stripping plate adhesive (6) and the base plate adhesive (7), and cracking the modified layer (3) under the acting force, thereby realizing the separation of the wafer (44) to be stripped.
2. A method of effecting wafer separation as recited in claim 1, wherein: the adhesive (6) of the stripping plate adopts a hot melt adhesive film, the stripping plate (9) adopts a transparent toughened glass material, and the adhesive (7) of the bottom plate adopts an epoxy resin adhesive.
3. An apparatus for effecting separation of wafers, comprising: the device is used for realizing the method for realizing the wafer separation as claimed in claim 1, and comprises a transmission pressurization separation mechanism (10) and a carrying manipulator component (11), wherein the transmission pressurization separation mechanism (10) comprises a mechanism bedplate (12) and a jacking electric cylinder (30), a left vertical plate and a right vertical plate (13) are fixed on the mechanism bedplate (12), a transmission shaft (15) is connected between the front end parts of the two vertical plates (13), a transmission belt pulley (17) is fixed on the transmission shaft (15), a transmission belt pulley (17) is also installed on an output shaft of a motor (19) fixed on the mechanism bedplate (12), the two transmission belt pulleys (17) are connected through a transmission synchronous belt (18), a synchronous belt pulley (16) is respectively fixed on the end parts of the left end part and the right end part of the transmission shaft (15), the two vertical plates (22) are respectively and symmetrically fixed on the inner sides of the rear ends of the two vertical plates (13), a synchronous belt (21) is meshed between the synchronous belt pulley (16) and the idle pulley (22) on the left side, a synchronous belt (21) is meshed between the synchronous belt pulley (16) and the idle pulley (22), a support bar (24) is arranged below the synchronous belt (21), and a support bar (24) is respectively fixed on the limited support bar (13), and a limited support bar (25) is fixed on the upper surface of the two vertical plate (13);
the jacking electric cylinder (30) is fixed on the bottom surface of the mechanism bedplate (12), an electric cylinder extension opening is formed in the tabletop of the mechanism bedplate (12), the electric cylinder extension opening is positioned between the two vertical plates (13), the upper end part of the movable part of the jacking electric cylinder (30) can extend out of the electric cylinder extension opening, a front jacking knife side plate and a rear jacking knife side plate (27) are fixed on an electric cylinder movable plate (31) at the upper end part of the movable part of the jacking electric cylinder (30), a gap between the front jacking knife side plate and the rear jacking knife side plate (27) is an assembly groove of a jacking knife (26), the jacking knife (26) is assembled in the assembly groove between the two jacking knife side plates (27), and the assembly of the jacking knife (26) on the electric cylinder movable plate (31) is realized;
the carrying manipulator component (11) comprises a fixed frame (32), a horizontal movement module (33) and a vertical movement module (35), wherein the horizontal movement module (33) is installed on the fixed frame (32), the vertical movement module (35) is installed on a sliding block of the horizontal movement module (33), a sucker mounting plate (41) is fixed at the movable end of the vertical movement module (35), and a sucker (42) and a height probe sensor (43) are installed below the sucker mounting plate (41).
4. An apparatus for performing wafer separation as recited in claim 3, wherein: and a supporting rotating shaft (28) is also arranged in the middle of the two top knife side plates (27), and a groove in the middle of the top knife (26) falls on the supporting rotating shaft (28).
5. An apparatus for performing wafer separation as recited in claim 4, wherein: a visual system fixing seat (36) positioned above the sucker mounting plate (41) is fixed on the vertical movement module (35), the camera (37) is installed on the visual system fixing seat (36), the lens (38) is connected with the lower part of the camera (37), the annular light source (40) is fixed on the lower part of the lens (38) through a light source fixing piece (39), and the middle part of the sucker mounting plate (41) is provided with an observation port.
6. An apparatus for performing wafer separation as recited in claim 5, wherein: the front end parts of the two vertical plates (13) are respectively provided with a bearing (14) with a seat, and the transmission shaft (15) is arranged between the two bearings (14) with the seats.
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
| JP2001332606A (en) * | 2000-05-19 | 2001-11-30 | Nec Kyushu Ltd | Apparatus and method for fabricating semiconductor device |
| JP2003197724A (en) * | 2001-12-28 | 2003-07-11 | Mitsubishi Electric Corp | Apparatus and method for separating pasted wafer |
| US20050260829A1 (en) * | 2004-05-20 | 2005-11-24 | Toshihide Uematsu | Manufacturing method of a semiconductor device |
| US20100243125A1 (en) * | 2009-03-27 | 2010-09-30 | Masayuki Yamamoto | Protective tape separating method and protective tape separating apparatus using the same |
| US20110214805A1 (en) * | 2010-03-02 | 2011-09-08 | Alta Devices, Inc. | Epitaxial Lift Off Systems and Methods |
| JP2016111147A (en) * | 2014-12-04 | 2016-06-20 | 株式会社ディスコ | Generation method of wafer |
| JP2016111145A (en) * | 2014-12-04 | 2016-06-20 | 株式会社ディスコ | Generation method of wafer |
| DE102017213961A1 (en) * | 2016-08-18 | 2018-02-22 | Disco Corporation | REMOVAL PROCEDURE AND REMOVAL DEVICE |
| CN110640572A (en) * | 2019-09-17 | 2020-01-03 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Profile grinding and chamfering actuating mechanism for special-shaped wafer with good waterproof performance |
| CN113714649A (en) * | 2021-08-25 | 2021-11-30 | 大族激光科技产业集团股份有限公司 | Method for manufacturing wafer |
| CN115172229A (en) * | 2022-09-07 | 2022-10-11 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Full-automatic device for stripping wafer from laser modified crystal |
| CN115178884A (en) * | 2022-09-13 | 2022-10-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Wafer thermal separation method |
| CN115223851A (en) * | 2022-09-21 | 2022-10-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Mechanical wafer separation method and device |
-
2022
- 2022-12-13 CN CN202211592297.6A patent/CN115602532B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148451A (en) * | 1994-11-18 | 1996-06-07 | Komatsu Electron Metals Co Ltd | Semiconductor wafer automatic exfoliation device |
| JP2001332606A (en) * | 2000-05-19 | 2001-11-30 | Nec Kyushu Ltd | Apparatus and method for fabricating semiconductor device |
| JP2003197724A (en) * | 2001-12-28 | 2003-07-11 | Mitsubishi Electric Corp | Apparatus and method for separating pasted wafer |
| US20050260829A1 (en) * | 2004-05-20 | 2005-11-24 | Toshihide Uematsu | Manufacturing method of a semiconductor device |
| US20100243125A1 (en) * | 2009-03-27 | 2010-09-30 | Masayuki Yamamoto | Protective tape separating method and protective tape separating apparatus using the same |
| US20110214805A1 (en) * | 2010-03-02 | 2011-09-08 | Alta Devices, Inc. | Epitaxial Lift Off Systems and Methods |
| JP2016111147A (en) * | 2014-12-04 | 2016-06-20 | 株式会社ディスコ | Generation method of wafer |
| JP2016111145A (en) * | 2014-12-04 | 2016-06-20 | 株式会社ディスコ | Generation method of wafer |
| DE102017213961A1 (en) * | 2016-08-18 | 2018-02-22 | Disco Corporation | REMOVAL PROCEDURE AND REMOVAL DEVICE |
| CN110640572A (en) * | 2019-09-17 | 2020-01-03 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Profile grinding and chamfering actuating mechanism for special-shaped wafer with good waterproof performance |
| CN113714649A (en) * | 2021-08-25 | 2021-11-30 | 大族激光科技产业集团股份有限公司 | Method for manufacturing wafer |
| CN115172229A (en) * | 2022-09-07 | 2022-10-11 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Full-automatic device for stripping wafer from laser modified crystal |
| CN115178884A (en) * | 2022-09-13 | 2022-10-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Wafer thermal separation method |
| CN115223851A (en) * | 2022-09-21 | 2022-10-21 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Mechanical wafer separation method and device |
Non-Patent Citations (2)
| Title |
|---|
| 刘月豹等: "真空镀膜系统基片架与双磁导向体系的设计与应用", 《玻璃》 * |
| 董佳？等: "用于柔性液晶显示器件的粘结膜材料研究", 《复旦学报(自然科学版)》 * |
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