CN115577672A - Through hole unit determination method and device, electronic equipment and storage medium - Google Patents
Through hole unit determination method and device, electronic equipment and storage medium Download PDFInfo
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- CN115577672A CN115577672A CN202211437429.8A CN202211437429A CN115577672A CN 115577672 A CN115577672 A CN 115577672A CN 202211437429 A CN202211437429 A CN 202211437429A CN 115577672 A CN115577672 A CN 115577672A
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- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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Abstract
The present application relates to the field of integrated circuit technologies, and in particular, to a method and an apparatus for determining a through hole unit, an electronic device, and a storage medium, which are used to improve the determination efficiency of the through hole unit. The main scheme is as follows: identifying the metal wire width of the wiring metal layer from the current layout design information; calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in a through hole unit library, wherein the through hole unit library comprises different through hole unit information and the different through hole unit metal layers respectively; and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
Description
Technical Field
The present disclosure relates to the field of integrated circuit technologies, and in particular, to a method and an apparatus for determining a through hole unit, an electronic device, and a storage medium.
Background
The technical files required by the digital back-end layout and wiring tool comprise process information of each layer, layout and wiring rules of metal wires and through holes and the like. In the prior art, a through hole unit is usually defined in a technical document, and the through hole unit comprises a through hole size, upper and lower layer metal wire names and a wrapping distance of the upper and lower layer metal wire names to the through hole. In routing, routing is accomplished by selecting the defined via cells. The method has the advantages that the process size is smaller and smaller, the integration level is higher and higher, the design rule is more and more complex, the types of the defined through hole units are more and more, a large number of through hole units need to be defined in a technical file for wiring, the defined through hole units are defined manually, through hole units with different wrapping distances need to be defined with different line widths, the types of the required through hole units are greatly increased along with the increase of the line widths, the data size is large, the content is cumbersome, the problems of definition error, incomplete definition and the like easily occur, the appropriate through hole units cannot be selected during wiring, and the process/chip development efficiency is finally influenced.
Disclosure of Invention
In view of this, the present application provides a method, an apparatus, an electronic device, and a storage medium for determining a through hole unit, so as to improve the determination efficiency of the through hole unit.
In a first aspect, an embodiment of the present application provides a method for determining a via unit, where the method includes:
identifying the metal wire width of the wiring metal layer from the current layout design information;
calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in a through hole unit library, wherein the through hole unit library comprises different through hole unit information and the different through hole unit metal layers respectively;
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
In a second aspect, an embodiment of the present application further provides an apparatus for determining a via unit, where the apparatus includes:
the identification module is used for identifying the metal wire width of the wiring metal layer from the current layout design information;
the calculation module is used for calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in a through hole unit library, and the through hole unit library comprises different through hole unit information and the metal widths corresponding to the different through hole unit metal layers;
and the determining module is used for determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
In a third aspect, an embodiment of the present application further provides an electronic device, including: a processor, a memory and a bus, the memory storing processor-executable machine-readable instructions, the processor and the memory communicating via the bus when the electronic device is operated, the machine-readable instructions being executed by the processor to perform the steps of the method for determining a via unit of the first aspect.
In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, where the computer program is executed by a processor to perform the steps of the method for determining a via unit in the first aspect.
According to the method, the device, the electronic equipment and the storage medium for determining the through hole unit, the metal wire width of the wiring metal layer is firstly identified from the current layout design information; and finally, determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference. Because the through hole unit library in the application comprises different through hole unit information corresponding to the metal widths of different through hole unit metal layers, the corresponding through hole unit can be determined by calculating the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each through hole unit metal layer in the through hole unit library. Compared with the manual definition of the through hole units in the prior art, the method and the device can automatically confirm the corresponding through hole units based on the width of the metal wire of the wiring metal layer, so that the determination efficiency of the through hole units can be improved.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a flowchart illustrating a method for determining a via unit according to an embodiment of the present application;
FIG. 2 is a diagram illustrating a structure of a wiring metal layer provided in an embodiment of the present application;
FIG. 3 is a diagram illustrating a structure of a metal layer of a via cell provided in an embodiment of the present application;
fig. 4 is a structural diagram illustrating an inner hole and an outer hole of a metal layer of a via unit according to an embodiment of the present disclosure;
fig. 5 shows a structural diagram of a long hole in a metal layer of a via unit provided in an embodiment of the present application;
fig. 6 shows a schematic diagram of a via cell array provided by an embodiment of the present application;
FIG. 7 is a schematic diagram of a via unit with a dicing layer according to an embodiment of the present disclosure;
fig. 8 shows a block diagram of a determination apparatus for a via unit according to an embodiment of the present application.
Detailed Description
The terms "first," "second," and "third," etc. in the description and claims of this application and the above-described drawings are used for distinguishing between different objects and not for limiting a particular order.
In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present relevant concepts in a concrete fashion for ease of understanding.
In the description of the present application, a "/" indicates a relationship in which the objects associated before and after are an "or", for example, a/B may indicate a or B; in the present application, "and/or" is only an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, and may mean: a exists singly, A and B exist simultaneously, and B exists singly, wherein A and B can be singular or plural. Also, in the description of the present application, "a plurality" means two or more than two unless otherwise specified. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.
In the embodiments of the present application, at least one may also be described as one or more, and a plurality may be two, three, four or more, which is not limited in the present application.
As shown in fig. 1, an embodiment of the present application provides a method for determining a through hole unit, where the method for determining a through hole unit provided by the present application may include:
and S10, identifying the metal wire width of the wiring metal layer from the current layout design information.
The wiring metal layer comprises a wiring metal layer top layer and a wiring metal bottom layer. As shown in fig. 2, reference numeral 1 is a top layer of the wiring metal layer, and w1 is a metal line width of the top layer of the wiring metal layer; reference numeral 2 denotes a wiring metal underlayer, and w2 denotes a metal line width of the wiring metal underlayer.
And S20, calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in the through hole unit library.
Wherein the via cell metal layer comprises: the metal width of the via unit metal top layer and the via unit metal bottom layer. As shown in fig. 3, reference numeral 11 is a via unit metal top layer, and w11 is a metal width of the via unit metal top layer; reference numeral 22 is a via unit metal underlayer, and w22 is a metal width of the via unit metal underlayer.
The through hole unit library in the embodiment comprises different through hole unit information respectively corresponding to the metal widths of different through hole unit metal layers, wherein the through hole unit information comprises the size of a through hole, the wrapping distance of the through hole, the number of the through holes and the distance between the through holes. The wrapping distance of the through hole comprises distances in four directions of the through hole, and if the through hole is a square hole, the wrapping distance does not distinguish the directions; if the through hole is a long hole, the wrapping distance is defined according to the rule that the wrapping distance in the two short side directions of the through hole is in the front and the wrapping distance in the two long side directions is in the back.
It should be noted that, in the present embodiment, a via library can be generated in an automatic place and route tool according to design check rules in a technical document, where the design check rules in the technical document include: a range of metal line widths, via sizes, wrap distances of the wide metal lines to the sized vias, and via minimum numbers and via spacings defined in design check rules. The width of the metal wire, the size of the through hole and the wrapping distance of the metal wire with the width to the through hole with the size are a set of data, the relation of the wrapping distances can be various according to the width of the metal wire and the size of the through hole, and the wrapping distances of the cutting layers are distinguished in an inspection mode.
Preferably, the embodiment can automatically select a suitable via unit according to the width of the metal line, the size of the via, and the wrapping distance. When the metal wire width is smaller, the selected through hole unit is also smaller, and when the metal wire width is larger, the generated through hole unit is larger or a through hole unit array is generated. And finally, automatically generating a through hole unit library through a design check rule, and preferentially finishing wiring work by using through hole units based on the through hole unit library in the subsequent step.
As shown in fig. 4 and 5, the through hole unit includes a through hole 3, a through hole unit metal top layer 11, a through hole unit metal bottom layer 22, and a wrapping distance of the through hole unit metal top layer 11 and the through hole unit metal bottom layer 22 to the through hole 3. The types of through-hole units listed in fig. 4 and 5 are only two types of through-hole units defined in the design check rule to be checked, and fig. 4 is a square hole and fig. 4 is a long hole. Fig. 4 and 5 also indicate the wrapping distances of the via unit metal top layer 11 and the via unit metal bottom layer 22 to the via 3, which are respectively E1, E2, E3 and E4. When the through hole is a long hole, the wrapping distance in the technical file can be defined according to a certain rule, namely the rule that the wrapping distance in the two short side directions of the through hole is in front of the wrapping distance in the two long side directions of the through hole is in back of the wrapping distance in the two long side directions of the through hole, and the rule is defined by a checking mode.
In an optional embodiment of the present invention, the calculating a width difference between a metal line width of the routing metal layer and a metal width of each via cell metal layer in a via cell library, includes:
s201, obtaining the metal width of the through hole unit metal layer of which the metal width of the through hole unit metal top layer is within a preset range of the metal line width of the wiring metal layer top layer from the through hole unit library; and/or obtaining the metal width of the through hole unit metal layer within the preset range of the metal wire width of the wiring metal layer bottom layer.
The preset range is specifically set according to actual wiring information, and if the preset range is preset within a wiring metal top layer/bottom layer line width interval of 20-100 nm. In this embodiment, the via cell library may be sorted from small to large or from large to small according to the numerical value of the metal width of the metal top layer of the via cell and/or the metal width of the metal bottom layer of the via cell, and then the metal width of the via cell metal layer of the metal top layer of the via cell within the preset range of the metal line width of the metal top layer of the wiring metal layer is obtained from the via cell library according to the sorting result; and/or obtaining the metal width of the metal bottom layer of the through hole unit in the preset range of the metal line width of the metal bottom layer of the wiring metal layer.
For example, in the current layout, the minimum width w1 of the metal line on the top layer of the wiring metal layer is 20nm, the maximum width w2 is 100nm, the minimum width w2 of the metal line on the bottom layer of the wiring metal layer is 40nm, the maximum width is 120nm, and the preset range is as follows: the preset interval of the top wiring metal layer is 20 to 100nm, and the preset interval of the bottom wiring metal layer is 40 to 120nm; then the metal width w11 of the metal top layer of the through hole unit is 20-100nm corresponding to the metal width of the metal layer of the through hole unit, and/or the metal width w22 of the metal bottom layer of the through hole unit is 40-120 nm corresponding to the metal width of the metal layer of the through hole unit.
S202, calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer obtained from the through hole unit library.
Wherein, the calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer obtained from the through hole unit library respectively comprises: calculating a first difference absolute value of the metal line width of the wiring metal layer top layer and the metal width of the through hole unit metal top layer; calculating a second absolute difference value between the metal wire width of the wiring metal layer bottom layer and the metal width of the through hole unit metal bottom layer; determining a sum of the first difference absolute value and the second difference absolute value as the width difference.
As shown in fig. 6, reference numeral 3 denotes a via hole, a in fig. 6 denotes a wiring metal layer, and b1, b2, and b3 in fig. 6 denote via hole units. Then, first absolute difference values corresponding to the metal line width w1 of the top layer of the wiring metal layer and the metal width w11 of the top layer of the via unit metal in b1, b2 and b3 in fig. 6 respectively are calculated, first absolute difference values corresponding to the metal line width w2 of the bottom layer of the wiring metal layer and the metal width w22 of the bottom layer of the via unit metal in b1, b2 and b3 in fig. 6 respectively are calculated, then the sum of the first absolute difference values and the second absolute difference values corresponding to b1, b2 and b3 in fig. 6 respectively is determined, and if the difference between b1 in fig. 6 and the width of the a wiring metal layer in fig. 6 is the smallest, then b1 in fig. 6 is determined as the via unit of the wiring metal layer.
And S30, determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
By checking a series of design check rules defined in the technical document, including the width of the metal wire, the size of the through hole, the wrapping distance of the metal wire with the width to the through hole with the size, the minimum number of the through holes and the through hole interval, the automatic layout and wiring tool can automatically generate a proper through hole unit library according to the above conditions, the generated through hole units conform to the size and the number in the design check rules, and the through hole units are preferentially selected according to specific layout information in the layout and wiring. The width of the metal wire and the size of the through hole in the technical file are defined according to a certain sequence, the listed width of the metal wire is all the widths defined in the design check rule, the size of the through hole is all the sizes defined in the design check rule, and the wrapping distance is all the distances defined in the design check rule. The listed width of the metal wire, the size of the through hole and the wrapping distance of the metal wire with the width to the through hole with the size can generate a library containing all types of through hole units, and the through hole units can be selected automatically and preferentially during wiring.
According to the method, through the width of the metal wire, the size of the through hole, the wrapping distance of the metal wire with the width to the through hole with the size, the minimum number of the through holes and the through hole interval defined in the design check rule defined in the technical file, the through hole unit is preferentially selected according to specific layout information, and the through hole unit is preferentially selected by a layout and wiring tool according to the layout design information. The method can effectively simplify writing of the technical file, is not easy to make mistakes, obtains comprehensive types of the through hole units, automatically lays out the wiring marks and selects the proper through hole units, has stronger automation and compatibility, has compatibility for the self-defined through hole units in the layout, and can greatly improve the design efficiency.
In an optional embodiment of the advanced process, before determining via cells of the routing metal layer according to via cell information corresponding to a via cell metal layer with a smallest width difference, the method further includes:
determining whether the wiring metal layer includes a cut layer;
if the wiring metal layer comprises a cutting layer, obtaining the metal width of the through hole unit metal layer, wherein the wrapping distance of the through hole in the through hole unit information meets the design rule;
determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal width of the through hole unit metal layer with the wrapping distance of the through hole meeting the design rule.
In an optional embodiment provided by the present invention, before determining the via cell of the routing metal layer according to the via cell information corresponding to the via cell metal layer with the smallest width difference, the method further includes:
obtaining the metal width of a through hole unit metal layer of which the size of the through hole meets the design rule in the through hole unit information;
determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal widths of the through hole unit metal layers meeting the design rule.
It should be noted that, in the embodiment, different via units can be selected according to different metal line widths and the presence or absence of a cutting layer of the metal line. As shown in fig. 6, when the width of the metal line is small, the smaller via unit can be automatically selected during wiring. As shown in fig. 7, when the metal wire has the cutting layer 4, the via unit selected during wiring corresponds to the wrapping distance when the cutting layer 4 is present. The presence or absence of a cutting layer of a metal line is defined by means of inspection in a technical document.
In this embodiment, if the minimum number of the through holes is 1, the through hole pitch is set to 0; if the minimum number of the through holes is larger than 1, the through hole distance is the maximum distance defined in the design check rule; if the minimum number of the defined through holes is larger than 1, the through hole unit array which accords with the design check rule can be automatically generated. Specifically, when the width of the metal line is large, a large-sized through hole unit or through hole unit array is required, as shown in fig. 6, the width of the metal line is large, the minimum number of required through holes is greater than 1, and an automatic layout and wiring tool can automatically generate and select the through hole unit array to meet the size and number of the through holes required by the design and inspection rules.
According to the method for determining the through hole unit, the metal wire width of the wiring metal layer is identified from the current layout design information; and finally, determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference. Because the through hole cell library in the application comprises different through hole cell information respectively corresponding to the metal widths of different through hole cell metal layers, the corresponding through hole cell can be determined by calculating the width difference respectively corresponding to the metal line width of the wiring metal layer and the metal width of each through hole cell metal layer in the through hole cell library. Compared with the manual definition of the through hole units in the prior art, the method and the device can automatically confirm the corresponding through hole units based on the width of the metal wire of the wiring metal layer, so that the determination efficiency of the through hole units can be improved.
In the case of dividing each functional module by corresponding functions, fig. 8 shows a schematic diagram of a possible composition of the determination apparatus of the via unit mentioned above and in the embodiment, and as shown in fig. 8, the determination apparatus of the via unit may include:
the identification module 81 is used for identifying the metal wire width of the wiring metal layer from the current layout design information;
a calculating module 82, configured to calculate a width difference between a metal line width of the routing metal layer and a metal width of each through-hole unit metal layer in a through-hole unit library, where the through-hole unit library includes different through-hole unit information and corresponds to different metal widths of the through-hole unit metal layers;
and a determining module 83, configured to determine the via unit of the routing metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference.
In an alternative embodiment, the routing metal layer comprises a routing metal layer top layer and a routing metal bottom layer, and the via cell metal layer comprises a metal width of the via cell metal top layer and a via cell metal bottom layer; the calculating module 82 is specifically configured to:
obtaining the metal width of the through hole unit metal layer of which the metal width of the through hole unit metal top layer is within a preset range of the metal wire width of the wiring metal layer top layer from the through hole unit library; and/or obtaining the metal width of the through hole unit metal layer within the preset range of the metal wire width of the wiring metal layer bottom layer;
and calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer obtained from the through hole unit library.
In an alternative embodiment, the calculation module 82 is specifically configured to:
calculating a first difference absolute value of the metal line width of the top layer of the wiring metal layer and the metal width of the top layer of the through hole unit metal;
calculating a second absolute difference value between the metal wire width of the wiring metal layer bottom layer and the metal width of the through hole unit metal bottom layer;
determining a sum of the first difference absolute value and the second difference absolute value as the width difference.
In an optional embodiment, the through hole unit information includes a size of the through hole, a wrapping distance of the through hole, and a number of the through holes and a distance between the through holes.
In an optional embodiment, the determining module 83 is further configured to:
determining whether the wiring metal layer includes a cut layer;
if the wiring metal layer comprises a cutting layer, obtaining the metal width of the through hole unit metal layer, wherein the wrapping distance of the through hole in the through hole unit information meets the design rule;
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal width of the through hole unit metal layer with the wrapping distance of the through hole meeting the design rule.
In an optional embodiment, the determining module 83 is further configured to:
obtaining the metal width of a through hole unit metal layer of which the size of the through hole meets the design rule in the through hole unit information;
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal widths of the through hole unit metal layers meeting the design rule.
In an optional embodiment, the wrapping distance of the through hole includes distances in four directions to the through hole, and if the through hole is a square hole, the wrapping distance does not distinguish the directions; if the through hole is a long hole, the wrapping distance is defined according to the rule that the wrapping distance in the two short side directions of the through hole is in the front and the wrapping distance in the two long side directions is in the back.
Based on the same application concept, the present application further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method for determining a via unit provided in the foregoing embodiment are performed.
Specifically, the storage medium can be a general-purpose storage medium, such as a removable disk, a hard disk, or the like, and when a computer program on the storage medium is executed, the method for determining the via unit can be executed, and the corresponding via unit can be determined by calculating a width difference between a metal line width of the routing metal layer and a metal width of each via unit metal layer in the via unit library. Compared with the manual definition of the through hole units in the prior art, the method and the device can automatically confirm the corresponding through hole units based on the width of the metal wire of the wiring metal layer, so that the determination efficiency of the through hole units can be improved.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the system and the apparatus described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A method of determining a via cell, the method comprising:
identifying the metal wire width of the wiring metal layer from the current layout design information;
calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in a through hole unit library, wherein the through hole unit library comprises different through hole unit information and the metal widths corresponding to different through hole unit metal layers respectively;
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
2. The method of claim 1, wherein the routing metal layer comprises a top routing metal layer and a bottom routing metal layer, and the via cell metal layer comprises a metal width of the top via cell metal layer and a bottom via cell metal layer; the calculating the width difference corresponding to the metal line width of the wiring metal layer and the metal width of each through hole unit metal layer in the through hole unit library respectively comprises the following steps:
obtaining the metal width of the through hole unit metal layer of which the metal width of the through hole unit metal top layer is within a preset range of the metal wire width of the wiring metal layer top layer from the through hole unit library; and/or obtaining the metal width of the through hole unit metal layer within the preset range of the metal wire width of the wiring metal layer bottom layer;
and calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer acquired from the through hole unit library.
3. The method of claim 2, wherein calculating the width difference between the metal line width of the routing metal layer and the metal width of each via cell metal layer obtained from the via cell library comprises:
calculating a first difference absolute value of the metal line width of the top layer of the wiring metal layer and the metal width of the top layer of the through hole unit metal;
calculating a second absolute difference value between the metal wire width of the wiring metal layer bottom layer and the metal width of the through hole unit metal bottom layer;
determining a sum of the first difference absolute value and the second difference absolute value as the width difference.
4. The method according to any one of claims 1 to 3, wherein the via unit information includes via size, wrapping distance of the vias, and number of vias and via pitch.
5. The method of claim 4, wherein before determining via cells of the routing metal layer according to via cell information corresponding to a via cell metal layer with a smallest width difference, the method further comprises:
determining whether the wiring metal layer includes a cut layer;
if the wiring metal layer comprises a cutting layer, acquiring the metal width of the through hole unit metal layer, wherein the wrapping distance of the through hole in the through hole unit information meets the design rule;
determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal width of the through hole unit metal layer with the wrapping distance of the through hole meeting the design rule.
6. The method of claim 4, wherein before determining via cells of the routing metal layer according to via cell information corresponding to a via cell metal layer with a smallest width difference, the method further comprises:
obtaining the metal width of a through hole unit metal layer of which the size of the through hole meets the design rule in the through hole unit information;
determining the via unit of the wiring metal layer according to the via unit information corresponding to the via unit metal layer with the smallest width difference, including:
and determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the smallest width difference in the metal widths of the through hole unit metal layers meeting the design rule.
7. The method of claim 4, wherein the wrapping distance of the through hole comprises a distance to the through hole in four directions, and if the through hole is a square hole, the wrapping distance does not distinguish the directions; if the through hole is a long hole, the wrapping distance is defined according to the rule that the wrapping distance in the two short edge directions of the through hole is in the front and the wrapping distance in the two long edge directions is in the back.
8. An apparatus for determining a via unit, the apparatus comprising:
the identification module is used for identifying the metal wire width of the wiring metal layer from the current layout design information;
the calculation module is used for calculating the width difference corresponding to the metal wire width of the wiring metal layer and the metal width of each through hole unit metal layer in a through hole unit library, and the through hole unit library comprises different through hole unit information and the metal widths corresponding to the different through hole unit metal layers;
and the determining module is used for determining the through hole unit of the wiring metal layer according to the through hole unit information corresponding to the through hole unit metal layer with the minimum width difference.
9. An electronic device, comprising: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating over the bus when the electronic device is operated, the machine-readable instructions, when executed by the processor, performing the steps of the method of determining a via unit according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, performs the steps of the method for determining a via unit according to any one of claims 1 to 7.
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