CN115541064A - Stress monitoring probe and method suitable for high-ground-stress tunnel chaplet surface - Google Patents
Stress monitoring probe and method suitable for high-ground-stress tunnel chaplet surface Download PDFInfo
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- CN115541064A CN115541064A CN202211486563.7A CN202211486563A CN115541064A CN 115541064 A CN115541064 A CN 115541064A CN 202211486563 A CN202211486563 A CN 202211486563A CN 115541064 A CN115541064 A CN 115541064A
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- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
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Abstract
The embodiment of the invention provides a stress monitoring probe and a method suitable for a high ground stress tunnel chaplet surface, which are applied to the technical field of tunnel stress monitoring, wherein the monitoring probe comprises a strain acquisition unit and a probe shell, and the strain acquisition unit comprises a strain pattern, a sorting module, a coding module and a sending module; the strain acquisition units are arranged on the probe shell and used for measuring the stress on the surface of the surrounding rock through the strain rosettes to obtain corresponding electronic signals; the rectification module is used for rectifying the corresponding electronic signals to obtain rectified electronic signals; the coding module is used for coding the sorted electronic signals through a preset coding format to obtain coded data; the sending module is used for transmitting the coded data to a storage chip and storing the coded data, and therefore the method provided by the embodiment of the invention can be used for measuring the stress.
Description
Technical Field
The invention relates to the technical field of tunnel stress monitoring, in particular to a stress monitoring probe and a method suitable for a high ground stress tunnel chaplet surface.
Background
At present, stress monitoring aiming at a high ground stress tunnel is mainly realized through a soil pressure cell, and the equipment is generally arranged in a crack between the outer surface of the top end of a vertical steel frame and a reinforcing mesh and is fixed through sprayed concrete. The soil pressure gauge measures that the cable lead is bound and fixed along the arch reinforcing bar net piece subsection and is led down in the same direction, and the monitoring of the stress is realized with measuring equipment linking to each other. The soil pressure cell has low cost, is firm and durable, and is widely applied to deep surrounding rock engineering.
However, the inventor researches and discovers that the soil pressure box can only measure the pressure between the surface of the surrounding rock and the structural structure, the real stress change condition in the surrounding rock in the excavation process cannot be measured, and the soil pressure box is easily damaged in the installation process due to being arranged on the surface of the supporting surface, so that the stress monitoring is inconvenient.
Disclosure of Invention
The embodiment of the invention aims to provide a stress monitoring probe and a method suitable for a high ground stress tunnel strut surface so as to realize stress measurement. The specific technical scheme is as follows:
in a first aspect of the embodiments of the present invention, a stress monitoring probe suitable for a strut surface of a high ground stress tunnel is disclosed, which includes: the strain acquisition unit comprises a strain flower, a sorting module, a coding module and a sending module;
the strain acquisition units are arranged on the probe shell and used for measuring the stress on the surface of the surrounding rock through the strain rosettes to obtain corresponding electronic signals;
the rectification module is used for rectifying the corresponding electronic signals to obtain rectified electronic signals;
the coding module is used for coding the sorted electronic signals through a preset coding format to obtain coded data;
and the sending module is used for transmitting the coded data to a storage chip and storing the coded data.
In one possible embodiment, the probe further comprises a probe upper end cap;
the probe upper end cover is fixed on the probe shell.
In one possible embodiment, the strain acquisition unit further comprises a resin rubber seal;
the strain flowers are sealed inside the resin rubber seal layer, wherein the strain flowers are filament strain flowers or foil strain flowers.
In a possible implementation mode, the probe further comprises a glue outlet, an electronic bin and a glue extruding piston.
In one possible embodiment, the strain gauge is connected to the electronic magazine by a wire.
In a possible implementation mode, glue is injected between the outer side of the electronic cabin and the probe shell, and when the glue squeezing piston is compressed downwards, the glue flows out of the glue outlet.
In a possible embodiment, the probe further comprises a glue-extruding tool, the seal ring and the groove;
the groove is located on the rubber piston, and the sealing ring is located on the lower portion of the rubber extrusion piston.
In one possible embodiment, the probe further comprises a first line interface and data acquisition channel circuit board, a wireless transmission device and a signal output system housing.
In one possible embodiment, the second line interface is located at a lower end of the signal output system housing;
and the data acquisition channel circuit board is used for reading the coded data.
In one possible embodiment, the drill bit further comprises a battery;
the battery is fixed beside the data acquisition channel circuit board.
In a second aspect of the embodiments of the present invention, there is provided a stress monitoring method implemented by applying any one of the stress monitoring probes described above, including:
installing the stress monitoring probe into a preset side wall or a preset hole bottom drilling hole;
extruding glue through a glue extruding tool in the stress monitoring probe to fix the stress monitoring probe;
and connecting the stress monitoring probe with a signal output system to output an electronic signal corresponding to the measured stress.
The embodiment of the invention has the following beneficial effects:
the embodiment of the invention provides a stress monitoring probe suitable for a high ground stress tunnel chaplet surface, which comprises: the strain acquisition unit comprises a strain flower, a sorting module, a coding module and a sending module; the strain acquisition units are arranged on the probe shell and used for measuring the stress on the surface of the surrounding rock through the strain rosettes to obtain corresponding electronic signals; the rectification module is used for rectifying the corresponding electronic signals to obtain rectified electronic signals; the coding module is used for coding the sorted electronic signals through a preset coding format to obtain coded data; the sending module is used for transmitting the coded data to a storage chip and storing the coded data, and therefore the method provided by the embodiment of the invention can be used for measuring the stress.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by referring to these drawings.
FIG. 1 is a schematic diagram of a stress monitoring probe suitable for use in a propping surface of a high ground stress tunnel according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a glue-extruding piston and a glue-extruding tool in a stress monitoring probe suitable for a propping surface of a high ground stress tunnel according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a signal output system in a stress monitoring probe suitable for a propping surface of a high ground stress tunnel according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a stress monitoring probe arrangement suitable for a propping surface of a high ground stress tunnel according to an embodiment of the present invention;
fig. 5 is a flowchart of a stress monitoring probe suitable for a propping surface of a high ground stress tunnel according to an embodiment of the present invention.
In all the figures, the same reference numerals denote the same features, in particular: 1-probe upper end cover, 2-probe shell, 3-strain acquisition unit, 4-glue outlet, 5-lead, 6-glue, 7-rubber plug, 8-electronic bin, 9-glue extrusion piston, 10-bolt, 11-second line interface, 12-resin rubber sealing layer, 13-strain flower, 14-sealing ring, 15-glue extrusion tool, 16-groove, 17-first line interface, 18-data acquisition channel circuit board, 19-wireless transmission device, 20-battery, 21-signal output system shell, 22-support surface, 23-horizontal drilling hole, 24-oblique drilling hole, 25-wiring (probe and signal output system), 26-shell, 27-stress monitoring probe and 28-signal output system.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention are within the scope of the present invention.
In a first aspect of the embodiments of the present invention, a stress monitoring probe suitable for a strut surface of a high ground stress tunnel is disclosed, which includes: the strain acquisition unit comprises a strain flower, a sorting module, a coding module and a sending module;
the strain acquisition units are arranged on the probe shell and used for measuring the stress on the surface of the surrounding rock through the strain rosettes to obtain corresponding electronic signals;
the rectification module is used for rectifying the corresponding electronic signals to obtain rectified electronic signals;
the coding module is used for coding the sorted electronic signals through a preset coding format to obtain coded data;
and the sending module is used for transmitting the coded data to a storage chip and storing the coded data.
Specifically, the rectification module may be a module for performing rectification filtering, specifically, a rectification filter, and the rectification module performs rectification filtering on the electronic signal through the rectification filter. The coding module codes the sorted electronic signals through a preset coding format, analog-to-digital conversion can be performed on the sorted electronic signals to obtain converted digital signals, the coding module can perform analog-to-digital conversion, specifically, the coding module can be an analog-to-digital converter, and the sending module can specifically perform a data sending module, so that the output and storage of measurement results are facilitated.
In one possible embodiment, the probe further comprises a probe upper end cap; the upper end cover of the probe is fixed on the probe shell.
In one possible embodiment, the strain acquisition unit further comprises a resin rubber seal; the strain flowers are sealed inside the resin rubber seal layer, wherein the strain flowers are silk strain flowers or foil strain flowers.
In one example, referring to fig. 1, the stress monitoring probe suitable for the high ground stress tunnel strut surface mainly comprises a probe upper end cover 1, a probe shell 2, a strain acquisition unit 3, a glue outlet 4, a lead 5, glue 6, a rubber plug 7, an electronic bin 8, a glue extrusion piston 9, a bolt 10, a second line interface 11, a resin rubber seal layer 12 and a strain flower 13. The glue in the embodiment of the present invention may be various types of glues for fixing the drill, and in particular, reference may be made to the prior art, which is not limited by the present invention. The rubber plug can be made of various materials, such as plastics, rubber and the like. Wherein, probe upper end cover 1 passes through bolt 10 to be fixed on probe shell 2, plays the inside effect of protection, can use metal material or other materials in the in-service use process. The probe shell 2 is provided with 6 groups of strain acquisition units 3, the strain acquisition units can be arranged in the using process, and each layer can be provided with a plurality of stress monitoring units, for example, the strain acquisition units can be divided into two layers, each layer is provided with three strain acquisition units 3, and the distribution interval angle is 120 degrees. In practical use, the stress monitoring unit may be of various types, and specifically, the invention may refer to the prior art without limitation. The strain acquisition unit 3 is composed of a resin rubber seal layer 12 and strain rosettes 13, wherein the strain rosettes 13 are sealed inside the resin rubber seal layer 12, strain sheets in the strain rosettes 13 are spaced by 45 degrees and used for measuring strain change of the surface of surrounding rocks, and the strain change can be obtained by combining the deformation modulus and the Poisson ratio of a rock body. The strain rosette 13 is connected with the electronic bin 8 through a lead 5, and transmits the collected electronic signals to a storage chip for storage. Glue 6 is injected into a cavity between the outer side of the electronic bin 8 and the probe shell 2, and the probe can be extruded from the glue outlet 4 through downward compression of the glue extruding piston 9 to be fixed in a drill hole. Before the glue is filled, the glue plug 7 blocks the glue 6, and after the probe enters a designated position, the glue plug 7 can be pushed out by the pressure of the glue extruding piston 9. The electronic cabin 8 is connected with the second line interface 11 through the conducting wire 5, and is connected with the signal output system through the second line interface 11.
In the actual use process, if the density required by stress monitoring is high, a drilling side wall monitoring scheme is adopted, and drilling holes and side wall drilling holes are constructed on the surface of the support; and if the density required by stress monitoring is low, drilling on the surface of the support and drilling at the bottom of the hole are performed by adopting a hole bottom monitoring scheme. In addition, the stress monitoring probe suitable for the high ground stress tunnel chaplet surface has the advantages of small probe volume and low manufacturing cost, can adopt a side wall measurement scheme or a hole bottom measurement scheme according to the requirement of stress monitoring, and is simple and convenient.
The stress monitoring probe suitable for the high ground stress tunnel chaplet surface monitors the stress change of surrounding rocks through the strain acquisition unit 3 arranged on the shell, and realizes the real-time monitoring and acquisition of stress change data through the electronic bin 8. The probe is buried in the drill hole beside the tunnel support surface, so that the normal working performance of the probe can be well protected, and the whole construction period of the high-ground-stress tunnel can be monitored. The method plays an important role in preventing high ground stress stratum disasters such as rock burst, large deformation and the like.
In a possible embodiment, the probe further comprises a glue outlet 4, an electronic bin 8 and a glue extruding piston 9.
In a possible embodiment, the strain rosette 13 is connected to the electronic compartment 8 by a wire 5.
In a possible embodiment, glue 6 is injected between the outside of the electronic cabin 8 and the probe shell 2, and when the glue-extruding piston 9 is compressed downwards, the glue 6 flows out from the glue outlet 4.
The stress monitoring probe suitable for the high-ground-stress tunnel chaplet surface realizes the firm adhesion of the probe in the drill hole through the glue and the glue extruding tool carried by the probe, and has the advantages of simple and convenient operation and accurate and reliable strain measurement.
In a possible embodiment, the probe further comprises a glue extruding tool, the sealing ring and the groove;
the groove is located on the rubber piston, and the sealing ring is located on the lower portion of the rubber extrusion piston.
In one example, as shown in fig. 2, the paste ejection piston and the paste ejection tool mainly include a paste ejection piston 9, a seal ring 14, a paste ejection tool 15, and a groove 16. The recess 16 is located on the glue-extruding piston and has the same shape as the lower end of the glue-extruding tool 15. The sealing ring 14 is located at the lower part of the glue extruding piston 9 and is mainly used for sealing the glue 6. The glue extruding tool 15 is a cylindrical hollow long cylinder, the inner diameter of the lower opening of the glue extruding tool is consistent with that of the upper end cover 1 of the probe, the glue extruding tool can penetrate through the upper end cover 1 of the probe to be connected with the glue extruding piston below the probe, and the glue 6 is extruded from the glue outlet 4 by applying pressure to the glue extruding tool 15 to enable the glue extruding piston to move downwards. In one example, the glue is sealed by the sealing ring, when the glue needs to be squeezed, the glue squeezing tool in the cylindrical hollow long barrel shape moves downwards to apply pressure to the position for storing the glue, and the glue is squeezed out from the glue outlet after the glue squeezing tool moves downwards due to the limited space for storing the glue.
In one possible embodiment, the probe further comprises a first line interface and data acquisition channel circuit board, a wireless transmission device and a signal output system housing.
In one possible embodiment, the second line interface is located at a lower end of the signal output system housing;
and the data acquisition channel circuit board is used for reading the coded data.
In one possible embodiment, the drill bit further comprises a battery;
the battery is fixed beside the data acquisition channel circuit board.
In one example, as shown in fig. 3, the signal output system mainly includes a first line interface 17, a data acquisition channel circuit board 18, a wireless transmission device 19, a battery 20, and a signal output system housing 21. Wherein the signal output system housing 21 is located outside the entire signal output system and functions to protect other components. The second line interface 11 is located at the lower end of the signal output system shell 21 and is used for connecting other stress monitoring probes suitable for the supporting surface of the high ground stress tunnel. The data acquisition channel circuit board 18 is used for reading strain signals transmitted by different stress monitoring probes suitable for the high ground stress tunnel chaplet surface and is connected with the wireless transmission device 19. A battery 20 is secured adjacent the data acquisition channel circuit board 18 for powering the entire measurement system. The wireless transmission device 19 is used for transmitting a stress change signal to the acquisition equipment when the acquisition equipment approaches. In the actual use process, the power can also be supplied by an external power supply in a power transmission mode, for example, a power supply interface is arranged, and the power is supplied by the external power supply through the power supply interface.
In one example, referring to fig. 4, since the requirement for monitoring stress variation in the horizontal bore 23 in the waist region of the shoring face 22 of a high ground stress tunnel is high, a plurality of side wall bores are drilled in the horizontal bore 23, a stress monitoring probe 27 suitable for the shoring face of the high ground stress tunnel is installed by a special installation device, and is connected with a signal output system 28 through a wiring 25, and a housing 26 is provided for protecting the above devices. In the oblique drilling hole 24 of the vault of a certain high-ground stress tunnel strut surface 22, the pressure change condition of surrounding rocks to a supporting structure is mainly concerned, a concentric small hole can be drilled at the bottom of the oblique drilling hole 24, a stress monitoring probe 27 suitable for the high-ground stress tunnel strut surface is installed through special installation equipment, and the stress monitoring probe 27 suitable for the high-ground stress tunnel strut surface is connected with a signal output system 28 through a connecting wire 25.
In a second aspect of the embodiments of the present invention, there is provided a stress monitoring method implemented by applying any one of the stress monitoring probes described above, including:
installing the stress monitoring probe into a borehole on a preset side wall or bottom;
extruding glue through a glue extruding tool in the stress monitoring probe to fix the stress monitoring probe;
and connecting the stress monitoring probe with a signal output system to output an electronic signal corresponding to the measured stress.
In one example, referring to fig. 5, fig. 5 is a flowchart of a test scheme of a stress monitoring probe suitable for a propping surface of a high geostress tunnel according to an embodiment of the present invention. The specific scheme is as follows:
(1) Calibrating a stress monitoring probe 27 suitable for the strut surface of the high-ground stress tunnel indoors, then plugging a glue outlet by using a rubber plug 7, and injecting glue 6 into the annular space of the equipment;
(2) Determining a monitoring scheme according to the field condition;
(3) If the density required by stress monitoring is high, a drilling side wall monitoring scheme is adopted, and drilling is carried out on the surface of the support and the side wall;
(4) If the density required by stress monitoring is low, drilling holes and hole bottom drilling holes are constructed on the surface of the support by adopting a hole bottom monitoring scheme;
(5) Installing a stress monitoring probe 27 suitable for the support surface of the high-geostress tunnel into a drilled hole on the side wall or the bottom of the hole by adopting special installation equipment;
(6) Extruding the glue 6 by using a glue extruding tool 15, and fixing after the glue is solidified;
(7) Connecting each probe with a signal output system 28;
(8) Securing a signal output system to the orifice;
(10) The stress change data is read periodically.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, cause the processes or functions described in accordance with the embodiments of the invention to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, from one website site, computer, server, or data center to another website site, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device, such as a server, a data center, etc., that incorporates one or more of the available media. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid State Disk (SSD)), among others.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel is characterized by comprising a strain acquisition unit (3) and a probe shell (2), wherein the strain acquisition unit (3) comprises a strain flower (13), a sorting module, a coding module and a sending module;
the strain acquisition units (3) are arranged on the probe shell (2), and the strain acquisition units (3) are used for measuring the stress of the surface of the surrounding rock through the strain rosettes (13) to obtain corresponding electronic signals;
the rectification module is used for rectifying the corresponding electronic signals to obtain rectified electronic signals;
the coding module is used for coding the sorted electronic signals through a preset coding format to obtain coded data;
and the sending module is used for transmitting the coded data to a storage chip and storing the coded data.
2. The stress monitoring probe suitable for the propping surface of a high ground stress tunnel according to claim 1, characterized in that the probe further comprises a probe upper end cover (1);
the probe upper end cover (1) is fixed on the probe shell (2).
3. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel according to claim 1, characterized in that the strain acquisition unit (3) further comprises a resin rubber seal layer (12);
the strain flowers (13) are sealed inside the resin rubber seal layer (12), wherein the strain flowers (13) are silk strain flowers or foil strain flowers.
4. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel according to claim 1, wherein the probe further comprises a glue outlet (4), an electronic bin (8) and a glue extruding piston (9).
5. The stress monitoring probe suitable for the propping surface of a high ground stress tunnel according to claim 4, characterized in that the strain rosette (13) is connected with the electronic cabin (8) through a lead (5).
6. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel according to claim 4, characterized in that glue (6) is injected between the outside of the electronic cabin (8) and the probe shell (2), and when the glue extruding piston (9) is compressed downwards, the glue (6) flows out from the glue outlet (4).
7. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel according to claim 4, characterized in that the probe further comprises a glue extruding tool (15), the glue extruding tool (15), a sealing ring (14) and a groove (16);
the groove (16) is positioned on the glue extruding piston (9), and the sealing ring (14) is positioned at the lower part of the glue extruding piston (9).
8. The stress monitoring probe suitable for the propping surface of the high ground stress tunnel according to claim 1, characterized in that the probe further comprises a first line interface (17), a data acquisition channel circuit board (18), a wireless transmission device (19) and a signal output system shell (21);
the second line interface (11) is positioned at the lower end of the signal output system shell (21);
the data acquisition channel circuit board (18) is used for reading the coded data.
9. A stress-monitoring probe suitable for use in a high geostress tunnel shoring face as claimed in claim 8, wherein the probe further comprises a battery (20);
the battery (20) is fixed beside the data acquisition channel circuit board (18).
10. A method for monitoring stress applied to a propping surface of a high ground stress tunnel, which is characterized in that the method for applying the stress monitoring probe applied to the propping surface of the high ground stress tunnel as claimed in any one of claims 1 to 9 comprises the following steps:
installing the stress monitoring probe into a preset side wall or a preset hole bottom drilling hole;
extruding glue (6) through a glue extruding tool (15) in the stress monitoring probe to fix the stress monitoring probe;
and connecting the stress monitoring probe with a signal output system (28) so as to output an electronic signal corresponding to the measured stress.
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