CN115479873B - Diamond micropowder concentration distribution tester in diamond plating solution - Google Patents
Diamond micropowder concentration distribution tester in diamond plating solution Download PDFInfo
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- CN115479873B CN115479873B CN202210915340.1A CN202210915340A CN115479873B CN 115479873 B CN115479873 B CN 115479873B CN 202210915340 A CN202210915340 A CN 202210915340A CN 115479873 B CN115479873 B CN 115479873B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 109
- 239000010432 diamond Substances 0.000 title claims abstract description 109
- 238000007747 plating Methods 0.000 title claims abstract description 48
- 238000009826 distribution Methods 0.000 title claims abstract description 45
- 239000000843 powder Substances 0.000 claims abstract description 71
- 230000005855 radiation Effects 0.000 claims abstract description 70
- 230000001360 synchronised effect Effects 0.000 claims abstract description 12
- 238000001514 detection method Methods 0.000 claims description 34
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000013527 convolutional neural network Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 101000840267 Homo sapiens Immunoglobulin lambda-like polypeptide 1 Proteins 0.000 claims description 2
- 102100029616 Immunoglobulin lambda-like polypeptide 1 Human genes 0.000 claims description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 abstract description 4
- 239000010446 mirabilite Substances 0.000 abstract description 4
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 238000012549 training Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- DGJPPCSCQOIWCP-UHFFFAOYSA-N cadmium mercury Chemical compound [Cd].[Hg] DGJPPCSCQOIWCP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
-
- G01N15/075—
Abstract
The utility model provides a buddha's warrior attendant mirabilite powder concentration distribution tester in buddha's warrior attendant plating solution, including control module, control module be connected with wave emitter and wave receiver, wave emitter be used for sending time-varying wave signal according to the synchronizing signal that control module sent that contains intensity time-varying control command, wave receiver be used for according to synchronous clock synchronous collection in the synchronizing signal time-varying wave signal direction is to the time-varying radiation signal that the plating solution takes place, wave receiver be connected with judgement module, judgement module be used for judging buddha's warrior attendant mirabilite powder concentration distribution result according to time-varying radiation signal and time-varying wave signal. The scheme utilizes diffraction phenomenon to provide a scheme which can monitor the concentration of diamond micro powder in the cavity in real time and can be used for monitoring the two-dimensional real-time distribution of the diamond micro powder in the cavity, thereby being beneficial to improving the quality of diamond wires.
Description
Technical Field
The application belongs to the field of diamond powder concentration detection, and particularly relates to a diamond powder concentration distribution tester in a diamond plating solution.
Background
The diamond wire is a diamond cutting wire made by embedding diamond tiny particles on a high-strength steel wire. The diamond wire has micro saw teeth, so that the cutting capacity of the steel wire is increased, and the cutting speed can be greatly increased.
The process of embedding diamond onto the wire is called sanding. In the sand feeding cavity of the diamond wire, the nickel plating diamond micro powder in the plating solution is uniformly distributed and fully stirred by the stirrer, so that the concentration of the diamond micro powder in the sand feeding cavity needs to be detected. To ensure uniform distribution of nickel-plated diamond powder in the plating solution, one needs to start from two angles, namely the angle of the device itself and the detection angle. At present, research on technology is generally focused on a device, namely, how to improve the distribution uniformity degree by improving the device, such as a sand feeding device produced by a diamond wire eight-wire machine disclosed in China patent [ publication No.: CN212771026U ]. However, in the detection method, firstly, the detection accuracy is not high because the detection is performed by sampling, and secondly, the detection period from sampling to adjustment is long, usually in hours, the efficiency is low, and the sanding efficiency is not negligibly affected. In addition, as the concentration distribution of the diamond micro powder in the plating solution in the sand feeding cavity cannot be continuously monitored in real time, when the content of the diamond micro powder in the plating solution is reduced/increased due to unexpected situations on a production line, the situation can not be timely mastered, and only a small amount of supplementation can be continuously carried out according to the original setting, the regulation and control process can cause relatively large fluctuation of the content of the diamond micro powder in the plating solution, and the fluctuation of the content of the diamond micro powder can cause the fluctuation of the density of diamond particles on the diamond wire, so that the quality of the diamond wire is fluctuated.
Disclosure of Invention
The application aims to solve the problems and provides a diamond powder concentration distribution tester in a diamond plating solution.
In order to achieve the above purpose, the present application adopts the following technical scheme:
the utility model provides a buddha's warrior attendant mirabilite powder concentration distribution tester in carborundum plating solution, includes control module, control module be connected with wave transmitter and wave receiver, wave transmitter be used for sending time-varying wave signal according to the synchronous signal that control module sent that contains intensity time-varying control command, wave receiver be used for according to synchronous clock synchronous collection in the synchronous signal time-varying wave signal leads to the time-varying radiation signal that the plating solution takes place, wave receiver be connected with the judgement module, the judgement module be used for judging buddha's warrior attendant mirabilite powder concentration distribution result according to time-varying radiation signal and time-varying wave signal.
In the diamond powder concentration distribution tester in the diamond powder plating solution, the wave emitter and the wave receiver adopt waves with the wavelength equivalent to the size of the diamond powder.
In the diamond powder concentration distribution tester in the diamond plating solution, the waves corresponding to the wave emitter and the wave receiver are infrared rays, and the wave emitter comprises an infrared light emitting diode array and a light emitting control circuit; the light-emitting control circuit is used for controlling each infrared light-emitting diode to emit a time-varying infrared signal with gradually-changed intensity according to the intensity time-varying control command;
the wave receiver comprises an infrared radiation detection array and a two-dimensional radiation image acquisition module, wherein the infrared radiation detection array is used for detecting infrared radiation signals of the electroplating solution, and the two-dimensional radiation image acquisition module is used for synchronously acquiring time-varying radiation signals from the infrared radiation signals according to a synchronous clock.
In the diamond powder concentration distribution tester in the diamond plating solution, the infrared radiation detection array adopts an array structure consistent with the infrared light-emitting diode array, the infrared detector array with the density larger than or equal to that of the infrared light-emitting diode array is used for detecting the infrared radiation of the plating solution, and the detected infrared radiation is converted into an electric signal in a photoelectric conversion mode, so that a two-dimensional infrared radiation signal is obtained.
In the diamond powder concentration distribution tester in the diamond plating solution, the infrared light emitting diode array comprises a plurality of base members with n-shaped structures, and n infrared light emitting diodes which are uniformly distributed are arranged in each base member, wherein n is more than or equal to 3.
In the diamond powder concentration distribution tester in the diamond plating solution, n infrared light emitting diodes in each base member have different wavelengths;
the wavelength of each infrared light-emitting diode is within the range of lambda + -5um, wherein lambda is the size of the diamond powder;
the detection range of the infrared radiation detection array comprises all infrared radiation in the wave bands of lambda-5 um to lambda+5um.
In the diamond powder concentration distribution tester in the diamond plating solution, the n-sided shape of each base member is divided into n triangles with equal area and size, and n infrared light emitting diodes are distributed in the centers of the n triangles so that the n infrared light emitting diodes are uniformly distributed in the corresponding base members;
among the plurality of base members forming the infrared light emitting diode array, any two base members have the same infrared light emitting diode and wavelength composition, and the infrared light emitting diodes with the same wavelength of any two base members correspond to the same position in the two base members, so that the distance between two adjacent infrared light emitting diodes with any fixed wavelength in the infrared light emitting diode array is equal.
In the diamond powder concentration distribution tester in the diamond plating solution, the wavelength of each infrared light emitting diode is more than or equal to 3um and less than or equal to 8um, and the detection range of the infrared radiation detection array comprises all infrared radiation in the wave bands of 3um to 8um;
the n=6, and the wavelengths of the 6 infrared light emitting diodes are respectively 3um, 4um, 5um, 6um, 7um and 8um; in the infrared light emitting diode array, each base member has the same wavelength and composition of the infrared light emitting diode, and the infrared light emitting diodes with the same wavelength among the base members are positioned in the same position in the base member.
In the diamond powder concentration distribution tester in the diamond plating solution, the infrared wave is a middle infrared wave;
the infrared light emitting diode array is a circular array formed by a plurality of base pieces.
In the diamond powder concentration distribution tester in the diamond plating solution, the judging module acquires the time-varying wave signal from a wave transmitter, a wave receiver or a control module;
the judging module comprises a trained convolutional neural network.
The application has the advantages that:
the diffraction phenomenon is utilized to provide a scheme which can monitor the concentration of the diamond micro powder in the cavity in real time and can be used for monitoring the two-dimensional real-time distribution of the diamond micro powder in the cavity, thereby being beneficial to improving the quality of diamond wires;
the convolutional neural network technology is adopted, the trained convolutional neural network is utilized, the original time-varying wave signal and the time-varying radiation signal under the action of diamond micropowder are taken as input and output concentration distribution conditions, and a more accurate judgment result can be given.
Drawings
FIG. 1 is a system block diagram of a diamond powder concentration distribution tester in a diamond plating solution according to the application;
FIG. 2 is a block diagram of a system configuration of an infrared wavelength-based diamond powder concentration distribution tester in a diamond plating solution according to the present application;
FIG. 3 is a schematic view of a base member structure of a trilateral structure in a diamond powder concentration distribution tester in a diamond plating solution of the present application;
FIG. 4 is a schematic view of the structure of a base member of a quadrangular structure in a diamond powder concentration distribution tester in a diamond plating solution according to the present application;
FIG. 5 is a schematic view of a hexagonal structure of a base member of a diamond powder concentration distribution tester in a diamond plating solution according to the present application;
fig. 6 is an array structure diagram of an infrared light emitting diode array composed of a hexagonal base member structure in the diamond powder concentration distribution tester in the diamond plating solution of the present application.
Reference numerals: a control module 1; a wave emitter 2; an infrared light emitting diode array 21; a light emission control circuit 22; a wave receiver 3; an infrared radiation detection array 31; a two-dimensional radiation image acquisition module 32; and a judging module 4.
Detailed Description
The application will be described in further detail with reference to the drawings and the detailed description.
The embodiment discloses diamond powder concentration distribution tester in diamond powder plating solution for solve the real-time supervision to the concentration of diamond powder in the cavity, and can be used for monitoring the two-dimensional real-time distribution of diamond powder in the cavity, thereby make the user in time and pertinently adjust the diamond powder concentration in the plating solution, and then promote the quality of buddha's warrior attendant line.
As shown in fig. 1, the tester specifically includes a control module 1, the control module 1 is connected with a wave emitter 2 and a wave receiver 3, the control module 1 simultaneously sends synchronization signals to the wave emitter 2 and the wave receiver 3, the synchronization signals include an intensity time-varying control signal and a synchronization clock, the wave emitter 2 sends out an intensity gradual change time-varying wave signal according to the intensity time-varying control command of the control module 1, the wave receiver 3 synchronously collects the time-varying wave signal according to the synchronization clock and guides the time-varying wave signal to a time-varying radiation signal generated by the electroplating solution, the wave receiver 3 is connected with a judging module 4, the judging module 4 obtains the time-varying wave signal from the wave emitter 2, obtains the time-varying radiation signal from the wave receiver 3, and judges the distribution result of the diamond powder concentration according to the time-varying radiation signal and the time-varying wave signal. The wave can diffract when encountering an obstacle in the propagation process, the wave is guided to the electroplating solution by utilizing the diffraction phenomenon of the wave, the wave encounters the obstacle in the electroplating solution, namely the diamond powder can diffract, and the judging module can judge the concentration distribution result of the diamond powder according to the original time-varying wave signal and the time-varying radiation signal acted by the diamond powder. Both the wave emitter 2 and the wave receiver 3 may be located in the plating solution or outside the plating solution, and the setting position and the setting manner are not limited, so long as the requirements of the present application can be satisfied, the wave emitted by the wave emitter 2 is directed to the plating solution, the wave receiver 3 can receive the radiation wave acted by the plating solution, preferably, the wave emitted by the wave emitter 2 is all directed to the plating solution, and the wave receiver 3 can completely receive the corresponding radiation wave.
Specifically, the judgment module 4 includes a trained convolutional neural network CNN, which can be trained using a typical diamond powder suspension sample until convergence. The network structure, the loss function and the like used by the convolutional neural network CNN are directly used in the prior art, the method is not limited herein, and a person skilled in the art can select any available model for training, and the specific training mode is consistent with that of the general neural network training and is not described herein. The collection of the samples can be that each diamond powder suspension sample is sampled and detected by a traditional arbitrary method, then the concentration distribution situation of the diamond powder is marked according to the sampling and detecting results, the time-varying radiation signals and the time-varying wave signals of each sample are obtained through the wave emitter 2 and the wave receiver 3, and the time-varying radiation signals and the time-varying wave signals marked with the concentration distribution situation are input into a model in batches or not in batches for training and testing until the model converges.
Specifically, the wave emitter 2 and the wave receiver 3 use waves with the wavelength corresponding to the size of the diamond micro powder, for example, the embodiment selects mid-infrared with the wavelength corresponding to the general size lambda micron of the diamond micro powder, and of course, near-infrared, far-infrared or other types of waves can be selected in practical application. The diamond powder size refers to the diameter of the diamond powder, and the general size lambda micron can be determined by taking a part of the diamond powder and measuring the size and then taking the average value. Meaning that both are approximately in the same order of magnitude.
In this embodiment, the mid-infrared is taken as an example, the waves corresponding to the wave emitter 2 and the wave receiver 3 are mid-infrared, the multi-wavelength mid-infrared light emitting diode array is used to emit infrared light with continuously variable intensity, and the infrared light emitting diode corresponding to the average size lambda micron of the diamond micro powder is selected, and the infrared light emitting diode generates more obvious infrared light diffraction when being guided to the electroplating solution, so that the receiving end can observe complex diffraction patterns to realize accurate detection.
Specifically, as shown in fig. 2, the wave transmitter 2 includes an infrared light emitting diode array 21 and a light emission control circuit 22, and the light emission control circuit 22 controls each infrared light emitting diode in the infrared light emitting diode array 21 to emit a time-varying infrared signal with gradually varying intensity according to an intensity time-varying control command. The light-emitting control circuit 22 is used for controlling each infrared light-emitting diode to emit a time-varying infrared signal with gradually-varying intensity according to the intensity time-varying control command, guiding the electroplating solution, and simultaneously taking intensity information (instant wave-varying signal) of different time as an input signal of the convolutional neural network. The wave receiver 3 comprises an infrared radiation detection array 31 and a two-dimensional radiation image acquisition module 32, wherein the infrared radiation detection array 31 is used for detecting infrared radiation signals of the electroplating solution, and the two-dimensional radiation image acquisition module 32 is used for synchronously acquiring time-varying radiation signals from the infrared radiation signals according to a synchronous clock.
Further, the outer surface of the infrared radiation detection array 31 is preferably protected using infrared transmissive PC plastic. The infrared radiation detection array 31 detects infrared radiation of the plating solution, such as a tellurium cadmium mercury array, by using an infrared detector array, and converts the detected infrared radiation into an electric signal by a photoelectric conversion manner, so as to obtain a two-dimensional infrared radiation signal for being collected by the two-dimensional radiation image collecting module 32.
The led array 21 includes a plurality of base members having n-sided polygonal structures, each of the base members having n leds of different wavelengths uniformly distributed therein, n being greater than or equal to 3, and one of the base members having n or less than n leds of different wavelengths. One wave emitter 2 may have only one light emission control circuit 22, or one wave emitter 2 may have a plurality of light emission control circuits 22, with one light emission control circuit 22 for each base member.
As shown in fig. 3-5, the n-sided structure may be a polygonal structure such as a triangle, a square, a hexagon, etc. that can span the entire plane. The n-sided structure of each base member is divided into n triangles with equal area sizes, and n infrared light emitting diodes are distributed in the centers of the n triangles so that the n infrared light emitting diodes are uniformly distributed in the corresponding base members. Among the plurality of base members constituting the infrared light emitting diode array 21, any two base members have the same infrared light emitting diode and wavelength composition, and the infrared light emitting diodes of the same wavelength of any two base members correspond to the same position in the two base members, so that the distance between two adjacent infrared light emitting diodes of any fixed wavelength in the infrared light emitting diode array is equal.
The preferred hexagonal structure of the base member of this embodiment is shown in fig. 5, which shows the preferred structure of the base member of the infrared led array 21 of this embodiment. Each circle in the hexagon is the placement position of an infrared Light Emitting Diode (LED), namely the center position of an equilateral triangle, and the wavelengths of the six infrared Light Emitting Diodes (LEDs) are respectively: the wavelengths of six infrared light emitting diodes are respectively 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers and 8 micrometers because the size of the general diamond powder is about 6 micrometers, and the numbers beside circles in the figure represent the wavelengths of the infrared light emitting diodes.
As shown in fig. 6, among the plurality of base members constituting the led array 21, the hexagonal structures of any two base members have the same arrangement manner of leds, the leds of the same wavelength correspond to the same positions of the two base members, for example, the leds of 5um, 7um, 3um, 8um, 4um, and 6um are sequentially arranged in the hexagonal structure of the uppermost base member from the 12 point position clockwise in fig. 6, the rest of base members are the leds of 5um, 7um, 3um, 8um, 4um, and 6um are sequentially arranged in the clockwise circumference from the 12 point position, so that the distance between two adjacent leds of any fixed wavelength (such as 4 um) is equal, the infrared light of the same wavelength can be uniformly distributed by such a structure, the diffraction pattern is more regular, the receiving end can be helped to judge, the array size of the transmitting end can be changed according to the actual requirement, but the method shown in fig. 6 is contracted or expanded as a criterion.
The array structure of the infrared radiation detection array 31 is consistent with that of the infrared light emitting diode array 21, but the density of the infrared radiation detection array 31 may be greater than or equal to that of the infrared light emitting diode array 21, and the detection range of the infrared radiation detection array 31 includes all infrared radiation in the 3um to 8um wave band so as to detect all infrared radiation generated by the present instrument.
When other types of waves are adopted, the above devices may be replaced in a targeted manner, for example, the infrared light emitting diode array 21 is changed to a device array capable of emitting other types of waves, the infrared radiation detection array 31 is changed to a device array capable of detecting other wave radiation, and the like, which are not described herein.
The method utilizes the diffraction phenomenon of waves, and then judges the distribution condition of diamond micro powder in the electroplating solution based on an original time-varying wave signal and a time-varying radiation signal under the action of the diamond micro powder, thereby realizing that the concentration of the diamond micro powder can be monitored in real time. In addition, the method adopts the wave with the wavelength equivalent to the size of the diamond powder, so that the diamond powder enables the wave guided to the electroplating solution to generate more obvious diffraction phenomenon, and a diffraction image can be acquired more clearly. In addition, the detection effect of the instrument is further ensured through the unique transmitting end structure and the corresponding receiving end structure, for example, a base piece uniformly distributes a plurality of transmitting tubes, each transmitting tube has different wavelengths, meanwhile, the different wavelengths are synchronously staggered and changed through time-varying control signals, and the receiving end can judge the concentration distribution of diamond derivatives with different thicknesses according to the change of diffraction images. For example, the distance between two light emitting diodes with any fixed wavelength in the infrared light emitting diode array 21 in the present embodiment is equal, so that the emitted infrared light with equal wavelength is uniformly distributed, and the diffraction pattern is more regular, and the detection of the receiving end is easier and more accurate.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the application. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the application or exceeding the scope of the application as defined in the accompanying claims. In addition, those skilled in the art should know the circuit diagram of the electrical field, that is, the circuit is connected to the two ends by marking the same identifier, and the specific connection relationship is only required to refer to the drawing, and in this embodiment, each connection relationship is not described one by one.
Although the control module 1 is used more herein; a wave emitter 2; an infrared light emitting diode array 21; a light emission control circuit 22; a wave receiver 3; an infrared radiation detection array 31; a two-dimensional radiation image acquisition module 32; the judgment module 4 and the like, but does not exclude the possibility of using other terms. These terms are used merely for convenience in describing and explaining the nature of the application; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present application.
Claims (8)
1. The diamond powder concentration distribution tester in the diamond plating solution is characterized by comprising a control module (1), wherein the control module (1) is connected with a wave emitter (2) and a wave receiver (3), the wave emitter (2) is used for emitting a time-varying wave signal according to a synchronous signal which is sent by the control module (1) and contains an intensity time-varying control command, the wave receiver (3) is used for synchronously collecting the time-varying wave signal according to a synchronous clock in the synchronous signal and guiding the time-varying wave signal to a time-varying radiation signal generated by the plating solution, the wave receiver (3) is connected with a judging module (4), and the judging module (4) is used for judging a diamond powder concentration distribution result according to the time-varying radiation signal and the time-varying wave signal;
the wave corresponding to the wave emitter (2) and the wave receiver (3) is infrared, and the wave emitter (2) comprises an infrared light emitting diode array (21) and a light emitting control circuit (22); the light-emitting control circuit (22) is used for controlling each infrared light-emitting diode to emit a time-varying infrared signal with gradually-changed intensity according to the intensity time-varying control command;
the wave receiver (3) comprises an infrared radiation detection array (31) and a two-dimensional radiation image acquisition module (32), wherein the infrared radiation detection array (31) is used for detecting infrared radiation signals of the electroplating solution, and the two-dimensional radiation image acquisition module (32) is used for synchronously acquiring time-varying radiation signals from the infrared radiation signals according to a synchronous clock;
the infrared light-emitting diode array (21) comprises a plurality of base members with n-shaped structures, n infrared light-emitting diodes are uniformly distributed in each base member, and n is more than or equal to 3;
the n infrared light emitting diodes in each base member have different wavelengths, and infrared light with continuously variable intensity is emitted by using a multi-wavelength mid-infrared light emitting diode array.
2. The tester for the concentration distribution of diamond powder in the diamond plating solution according to claim 1, wherein the wave emitter (2) and the wave receiver (3) adopt waves with the wavelength corresponding to the size of the diamond powder.
3. The tester for the concentration distribution of diamond powder in the diamond plating solution according to claim 2, wherein the infrared radiation detection array (31) adopts an array structure consistent with the infrared light emitting diode array (21), and the infrared detector array with the density greater than or equal to the infrared light emitting diode array (21) detects the infrared radiation of the plating solution, and converts the detected infrared radiation into an electric signal by a photoelectric conversion mode, so as to obtain a two-dimensional infrared radiation signal.
4. The tester for the distribution of the concentration of diamond powder in the diamond plating solution according to claim 3, wherein,
the wavelength of each infrared light-emitting diode is within the range of lambda + -5um, wherein lambda is the general size of the diamond powder;
the detection range of the infrared radiation detection array (31) includes all infrared radiation in the wavelength band of lambda-5 um to lambda +5 um.
5. The tester for the concentration distribution of diamond powder in the diamond plating solution according to claim 4, wherein the n-sided shape of each base member is divided into n triangles with equal area sizes, and n infrared light emitting diodes are distributed in the centers of the n triangles so that the n infrared light emitting diodes are uniformly distributed in the corresponding base member;
among the plurality of base members constituting the infrared light emitting diode array (21), any two base members have the same infrared light emitting diode and wavelength composition, and the infrared light emitting diodes of the same wavelength of any two base members correspond to the same position in the two base members, so that the distance between two adjacent infrared light emitting diodes of any fixed wavelength in the infrared light emitting diode array (21) is equal.
6. The tester for the concentration distribution of diamond powder in the diamond plating solution according to claim 5, wherein the wavelength of each infrared light emitting diode is more than or equal to 3um and less than or equal to 8um, and the detection range of the infrared radiation detection array (31) comprises all infrared radiation in the wave band of 3um to 8um;
the n=3, and the wavelengths of the 3 light emitting diodes are respectively 4um, 5um and 6um;
the n=4, and the wavelengths of the 4 light emitting diodes are respectively 4um, 5um, 6um and 7um;
the n=6, and the wavelengths of the 6 infrared light emitting diodes are respectively 3um, 4um, 5um, 6um, 7um and 8um; in the infrared light emitting diode array (21), all the base parts have the same infrared light emitting diode wavelength and composition, and the infrared light emitting diodes with the same wavelength among all the base parts are positioned in the same position in the base parts.
7. The tester for the concentration distribution of diamond powder in the diamond plating solution according to claim 6, wherein the infrared wave is a mid-infrared wave;
the infrared light emitting diode array (21) is a circular array formed by a plurality of base members.
8. The diamond powder concentration distribution tester in the diamond plating solution according to claim 1, wherein the judging module (4) obtains the time-varying wave signal from a wave emitter (2), a wave receiver (3) or a control module (1);
the judging module (4) comprises a trained convolutional neural network.
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