CN115474336A

CN115474336A - Circuit board assembly, electronic equipment and circuit board assembly manufacturing method

Info

Publication number: CN115474336A
Application number: CN202211009009.XA
Authority: CN
Inventors: 朱雷
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2022-12-13

Abstract

The application discloses circuit board assembly, electronic equipment and circuit board assembly manufacturing method, wherein the circuit board assembly comprises: a chip; the circuit board comprises a circuit board body, wherein a groove-shaped cavity is formed in the surface of one side of the circuit board body and is used for accommodating a chip; a conductive column group is arranged at the bottom of the cavity in a protruding mode and comprises a plurality of conductive columns, the conductive columns are electrically connected with the conductive layer of the circuit board body, the plurality of conductive columns support the chip, and the plurality of conductive columns are electrically connected with the bonding pads on the chip in a one-to-one correspondence mode; the circuit board body is detachably connected with the chip through the connecting structure. In the embodiment of the application, the chip is arranged on the circuit board in a structure which avoids the welding process of the chip, so that the chip can be directly assembled and applied without high-temperature welding, the risk of thermal stress cracking failure of the chip is reduced, the problem of cracking of a welding ball used by the existing chip welding is solved, and the reliability of the chip is favorably improved.

Description

Circuit board assembly, electronic equipment and circuit board assembly manufacturing method

Technical Field

The application belongs to the technical field of communication, and particularly relates to a circuit board assembly, electronic equipment and a circuit board assembly manufacturing method.

Background

With the rapid development of the smart phone industry, people have higher and higher requirements on the diversity of functions and the fluency of experience of the smart phone, and the pressure on the corresponding chip computing capability and the storage efficiency is higher and higher. Meanwhile, in order to improve the competitiveness of products, mobile phone manufacturers increase various research and development investments without paying a cost, and rob the industry first-issue qualification of a Central Processing Unit (CPU) and other key chips.

As the manufacturing process requirements of CPU and other key chips are continuously improved, the process is further improved from 10nm to 5nm and 4nm, the heat resistance of a high-end chip is poor due to poor maturity of the advanced process, and reliability problems such as cracking of the inner part of the chip after welding, cracking of welding spots and the like frequently occur, so that the public praise of products is influenced. And with the popularization and application of the sandwich stacking technology, the times of passing the chips through a reflow oven and heating are continuously increased, and the risk of the chips becoming invalid is higher and higher.

In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art: the existing chip is welded and attached on a Printed Circuit Board (PCB), and the problems that the internal cracking of the chip and the cracking of a welding spot easily cause the chip to lose efficacy exist.

Disclosure of Invention

The application aims to provide a circuit board assembly, electronic equipment and a circuit board assembly manufacturing method, and at least solves one of the problems that the chip is easy to crack inside and welding spots crack to cause the chip to lose efficacy when the existing chip is welded and attached on a Printed Circuit Board (PCB).

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a circuit board assembly, including: a chip; the circuit board comprises a circuit board body, wherein a groove-shaped cavity is formed in the surface of one side of the circuit board body and is used for accommodating the chip; a conductive column group is arranged at the bottom of the cavity in a protruding mode and comprises a plurality of conductive columns, the conductive columns are electrically connected with the conductive layer of the circuit board body, the chip is supported by the plurality of conductive columns, and the plurality of conductive columns are electrically connected with the bonding pads on the chip in a one-to-one corresponding mode; and the circuit board body is detachably connected with the chip through the connecting structure.

In a second aspect, an embodiment of the present application provides an electronic device, including: a housing; the circuit board assembly is the circuit board assembly, and the circuit board assembly is arranged inside the shell.

In a third aspect, an embodiment of the present application provides a method for manufacturing a circuit board assembly, where the circuit board assembly is the above circuit board assembly, and the method includes: manufacturing a first circuit substrate provided with the conductive column group, wherein the conductive column group comprises a plurality of conductive columns, the first ends of the conductive columns protrude out of the first side surface of the first circuit substrate, and the second ends of the conductive columns are electrically connected with the conductive layer of the first circuit substrate; respectively arranging substrate layers on two sides of the first circuit substrate provided with the conductive column group to manufacture a second circuit substrate; a cavity is formed in the side face of the second circuit substrate corresponding to the position of the conductive column group, and the first end of the conductive column protrudes out of the bottom of the cavity to form the circuit board body; and assembling the chip at the cavity to form the circuit board assembly.

In the embodiment of this application, through set up the cavity on circuit board body surface, set up the conductive column group bottom the cavity, set up the chip inside the cavity, the circuit connection of chip is realized to accessible conductive column group, and chip and circuit board body can dismantle the connection through connection structure and fix, the welding process of chip has been avoided to the structure that sets up of this chip on the circuit board, but make the chip direct assembly use, need not to pass through high temperature welding, thereby the risk of chip thermal stress fracture inefficacy has been reduced, the solder ball fracture problem that current chip welding used has been solved simultaneously, be favorable to improving chip reliability, promote user experience.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is an overall schematic view of a circuit board body according to an embodiment of the present invention;

FIG. 2 is a partial schematic view of a circuit board body according to an embodiment of the invention;

FIG. 3 is a schematic top view of a circuit board body according to an embodiment of the invention;

FIG. 4 is a cross-sectional view of a circuit board body at a cavity according to an embodiment of the invention;

FIG. 5 is a schematic view of an arrangement of a sheeting according to an embodiment of the present invention;

FIG. 6 is a schematic flow chart diagram of a method of fabricating a circuit board assembly according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a specific process for manufacturing a first circuit substrate provided with a conductive post group according to an embodiment of the invention;

FIG. 8 is a schematic diagram of a specific structure of a first circuit substrate provided with a conductive post group according to an embodiment of the present invention;

FIG. 9 is a schematic view of a specific process for manufacturing a second circuit substrate and a circuit board body according to an embodiment of the invention;

fig. 10 is a schematic structural diagram of a second circuit substrate and a circuit board body according to an embodiment of the invention.

Reference numerals:

1: a circuit board body; 11: a first circuit substrate; 111: a conductive layer; 112: grooving; 12: a substrate layer; 121: an isolation layer; 13: a second circuit substrate; 131: a trough body; 2: a cavity; 3: a conductive column group; 31: a conductive post; 311: positioning a groove; 4: tabletting; 41: a protruding contact; 5: fixing the column; 6: a dry film of the circuit; 61: a first hole site; 62: a second hole site; 63: and (6) a third hole position.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of those features. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, the character "/" in the specification and the claims generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the present invention, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," "bottom," "inner," "axial," and the like are used in the orientations and positional relationships indicated in the drawings for the purpose of convenience and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

A circuit board assembly, an electronic device, and a method of manufacturing a circuit board assembly according to embodiments of the present invention are described below with reference to fig. 1 to 10.

As shown in fig. 1, a circuit board assembly according to some embodiments of the present invention includes: a chip; the circuit board comprises a circuit board body 1, wherein a groove-shaped cavity 2 is arranged on the surface of one side of the circuit board body 1, and the cavity 2 is used for accommodating a chip; the circuit board body 1 has certain thickness, and cavity 2 is the recess of establishing in circuit board body 1 one side, and the chip is placed inside cavity 2. Referring to fig. 2, the circuit board body 1 further includes a conductive column set 3, the bottom of the cavity 2 is provided with the conductive column set 3 in a protruding manner, the conductive column set 3 includes a plurality of conductive columns 31, the conductive columns 31 are electrically connected with the conductive layer 111 of the circuit board body 1, the plurality of conductive columns 31 support the chip, and the plurality of conductive columns 31 are electrically connected with the pads on the chip in a one-to-one correspondence manner; and the circuit board body 1 is detachably connected with the chip through the connecting structure.

The circuit board assembly in this embodiment sets up the chip in cavity 2 of circuit board body 1 one side, and the chip is placed on conductive column group 3, electrically connects through leading electrical pillar 31, and the electricity is connected electrically conductive promptly, and the circuit that realizes the chip through conductive column group 3 switches on. Specifically, a plurality of conductive columns 31 in the conductive column group 3 are arranged to be in one-to-one correspondence with bonding pads on the chip, so that when the chip is placed in the cavity 2, the bonding pads on the chip are in conductive connection with the conductive columns in one-to-one correspondence, and circuit switching of the chip is achieved. And the conductive column 31 protrudes out of the bottom of the cavity 2, so that a gap is formed between the chip and the bottom of the cavity 2, the unevenness of the connection surface of the chip can be adapted, and the conductive connection of the chip can be better realized.

Further, a connection structure is provided for realizing the fixation of the chip on the circuit board body 1. In this embodiment, the chip is detachably connected to the circuit board body 1 through the connection structure. The connecting structure can be a structure which can realize the detachable arrangement of the chip and the circuit board body 1, for example, the connecting structure can be a bolt structure, and the chip is detachably connected with the circuit board body 1 through a bolt; or a pressing sheet 4 structure is adopted, and the pressing sheet 4 is arranged on the chip at the opening of the cavity 2 to realize the fixation and the disassembly of the chip; the connecting structure may be other structures to achieve the purpose of fixedly connecting and disassembling the chip and the circuit board body 1, and is not limited specifically.

According to the circuit board assembly provided by the embodiment of the invention, the cavity 2 is arranged on the surface of the circuit board body 1, the conductive column group 3 is arranged at the bottom of the cavity 2, the chip is arranged in the cavity 2, the circuit connection of the chip can be realized through the conductive column group 3, and the chip and the circuit board body 1 are detachably connected and fixed through the connecting structure, the arrangement structure of the chip on the circuit board body 1 avoids the welding process of the chip, so that the chip can be directly assembled and applied without high-temperature welding, the risk of thermal stress cracking failure of the chip is reduced, the problem of the cracking of a welding ball used for welding the existing chip is solved, the reliability of the chip is favorably improved, and the user experience is improved.

On the other hand, the chip is arranged in the cavity 2, the wall surface of the cavity 2 can also play a role in protecting the chip, and the transmission path of external mechanical stress can be cut off, so that the risk of failure of the mechanical stress of the chip is reduced.

Further, referring to fig. 3, a plurality of cavities 2 may be disposed on the circuit board body 1, and a plurality of chips may be correspondingly disposed on the plurality of cavities 2, and the cavities 2 may be disposed according to specific setting requirements of the chips. Various electronic components and structural members can be attached to other positions of the circuit board body 1, and the arrangement of the various electronic components and structural members is similar to that in the prior art and is not described again.

According to some embodiments of the present invention, referring to fig. 4, one end of the conductive pillar 31 is inserted into the circuit board body 1 corresponding to the bottom of the cavity 2, and one end of the conductive pillar 31 inserted into the circuit board body 1 is electrically connected to the conductive layer 111 of the circuit board body 1. In this embodiment, one end of the conductive pillar 31 is inserted into the bottom of the cavity 2 to a certain depth, that is, the conductive pillar 31 grows on the circuit board body 1 corresponding to the bottom of the cavity 2, which is beneficial to improving the firmness of the conductive pillar and improving the structural stability; one end of the conductive post 31 extends into the circuit board body 1, and is convenient for electrically connecting with the conductive layer 111 inside the circuit board body 1, so as to implement switching of the chip circuit.

In other embodiments, the conductive pillar 31 may also be connected to the bottom of the cavity 2, that is, the end of the conductive pillar 31 is directly connected to the bottom of the cavity 2; the specific connection structure of the conductive post 31 and the circuit board body 1 is not limited, and the purpose of achieving stable connection of the conductive post 31 and achieving electrical connection between the conductive post 31 and the conductive layer 111 of the circuit board body 1 is to achieve this. The conductive post 31 may also be electrically connected to the conductive layer 111 at other parts of the circuit board body 1, for example, the conductive layer 111 of the circuit board body 1 may be led to the bottom surface of the cavity 2 to be connected to the conductive post 31, which is not limited specifically, so as to achieve the purpose of electrically connecting the conductive post 31.

Further, the conductive pillar 31 may be a conductive copper pillar; the conductive reliability is better. The conductive post 31 may also be made of other conductive materials, and is not limited in particular.

According to a further embodiment of the present invention, a positioning groove 311 is disposed on an end surface of the conductive pillar 31 away from the bottom of the cavity 2, and the positioning groove 311 is matched with a pad of the chip. The detents 311 match the pads of the chip, i.e., the detents 311 match the shape and size of the chip pads, so that the pads of the chip are correspondingly placed in the detents 311. The chip is supported and placed on the conductive column 31, one end of the conductive column 31 far away from the bottom of the cavity 2 is the end in contact with the chip, and the end of the conductive column 31 is used for being connected with a pad on the chip. Through set up constant head tank 311 on this end terminal surface at conductive pillar 31, can make the pad on the chip correspond and place in constant head tank 311, be favorable to improving the stability of relative position between chip and the conductive pillar 31, and improve the reliability of the electric connection between chip and the conductive pillar 31.

Further, the positioning groove 311 may be a hemisphere shape. The hemispherical detents 311 can be matched to pads on the bottom of the chip, such as solder balls. In other embodiments, the positioning slot 311 may also have other shapes, such as an irregular slot shape, for the purpose of better matching with the pad on the chip to achieve the matching connection between the chip pad and the conductive pillar 31, which is not limited in particular.

According to some embodiments of the present invention, referring to fig. 1 and 2, the connecting structure includes at least one pressing piece 4, the pressing piece 4 is connected to the circuit board body 1, and the pressing piece 4 is disposed on the chip. Set up connection structure for preforming 4 in this embodiment, preforming 4 can produce spacing fixed action to the chip in the top of chip in cavity 2's cavity department after the chip is placed in cavity 2, prevents that the chip from droing from cavity 2 and playing the effect of fixed chip, and guarantees that the chip is connected with the stable contact who leads electrical pillar 31. The pressing sheet 4 can be connected with the circuit board body 1 for fixing.

According to a further embodiment of the present invention, referring to fig. 4, the side of the wafer 4 that is in mating contact with the chip is provided with protruding contacts 41. After the chip is placed in the cavity 2, one side of the pressing sheet 4 is in contact with the chip, and the pressing sheet 4 is fixedly connected with the circuit board body 1 and simultaneously exerts a pressing and fixing effect on the chip. In this embodiment, a protruding projecting contact 41 is provided on the side of the pressing sheet 4 that contacts the chip, and the projecting contact 41 contacts the chip. The protruding contact 41 is arranged, and the pressing sheet 4 can better realize pressing and fixing of the chip.

Further, the protruding contact 41 may be a flexible structure; for example, the pressing sheet 4 can be a flexible or elastic structure such as rubber, and can be pressed on the chip better, and the chip can be protected, so that the surface of the chip can be prevented from being damaged.

According to a further embodiment of the present invention, the pressing plate 4 is a spring plate, one end of the spring plate is disposed on the chip, and the other end of the spring plate is rotatably connected to the circuit board body 1. In this embodiment, the pressing sheet 4 is a spring sheet, i.e., an elastic structure, and can apply pressure to the chip through its own elasticity, thereby stably pressing and fixing the chip. And the end part provided with the elastic sheet is rotationally connected with the circuit board body 1. The shell fragment can rotate around the relative circuit board body 1 of tip, when assembling the chip or dismantling the chip, can turn the shell fragment open, after the chip assembly, can press the chip to establish fixedly on turning to the chip with the shell fragment. The elastic sheet can rotate 360 degrees relative to the circuit board body 1, so that the chip can be assembled conveniently; the rotation angle of the elastic sheet relative to the circuit board body 1 can be other angles, so that the purpose of assembling the chip can be realized, and the rotation angle is not limited specifically.

Further, referring to fig. 4, the elastic sheet in this embodiment is attached to the surface of the circuit board body 1. The elastic sheet can be attached to the surface of the circuit board body 1; the depth of the cavity 2 can be matched with the thickness of the chip, so that when the chip is placed in the cavity 2, the surface of the chip is flush with the surface of the circuit board body 1. So that the elastic sheet can be pressed on the chip by rotation.

Further, referring to fig. 4 and 5, a fixing column 5 is connected to the circuit board body 1, and the other end of the elastic sheet is rotatably connected to the fixing column 5. The rotation that shell fragment and circuit board body 1 were connected is realized to the accessible setting up fixed column 5. Specifically, the fixing post 5 can be fixedly connected with the circuit board body 1, and the elastic sheet is rotatably connected with the fixing post 5. The fixing posts 5 may be connected to the circuit board body 1 by bolts, soldering, or the like. The end part of the elastic sheet can be rotationally connected with the fixed column 5 through a pin shaft structure and the like.

Referring to fig. 4, in one embodiment according to the present invention, the fixing posts 5 may be embedded in the circuit board body 1 to be connected with the circuit board body 1. So that the spring plate can be attached to the surface of the circuit board body 1. Mounting holes, such as threaded holes, can be formed in the circuit board body 1, and the fixing posts 5 are inserted into the mounting holes and connected with the circuit board body 1 through threaded structures. The fixing posts 5 can also be connected with the circuit board body 1 in a welding way.

In another embodiment according to the present invention, the fixing post 5 may also be connected to the surface of the circuit board body 1 by soldering or the like, and then rotatably connected to the elastic sheet. The specific connection structure of the fixing column 5 and the circuit board body 1 is not limited, so that the purpose of realizing the rotary connection of the elastic sheet and the circuit board body 1 is achieved.

Further, referring to fig. 3, a plurality of pressing sheets 4 are distributed on the periphery of the cavity 2 in the present embodiment. For any cavity 2, a plurality of pressing sheets 4 can be arranged to press and fix a plurality of parts of the chip. Specifically, in this embodiment, one end of the pressing sheet 4 is connected to the circuit board body 1, and the other end thereof can extend into the cavity 2 to press the chip. The pressing sheets 4 can be respectively arranged at the four corners of the cavity 2, and the chip can be pressed and fixed at the four corners of the chip. The pressing sheet 4 may be disposed at other positions of the cavity 2, for example, at the middle part of the cavity 2 in the length direction or at the middle part of the cavity in the width direction; the specific arrangement position and the number of the pressing sheets 4 can be flexibly arranged according to actual needs, and are not limited specifically.

Further, in other embodiments, the pressing sheet 4 may be arranged in other manners, for example, the pressing sheet 4 may span the cavity 2, and two ends of the pressing sheet are respectively connected to the circuit board body 1, so that the pressing sheet 4 is pressed on the chip at a position corresponding to the opening of the cavity 2 to fix the chip; wherein, the two ends of the pressing sheet 4 can be detachably connected with the circuit board body 1 through bolts; one end of the pressing sheet 4 can be rotatably connected with the circuit board body 1, and the other end can be detachably connected with the circuit board body 1; or, when the pressing sheet 4 is of an elastic structure, the two ends of the pressing sheet 4 can also be connected with the circuit board body 1 respectively, and the chip can be assembled or disassembled by pulling or putting down the pressing sheet 4 through elastic deformation.

Furthermore, the pressing sheet 4 can also be a combination of multiple arrangement forms, for example, when a plurality of pressing sheets 4 are arranged on the periphery of any cavity 2, one end of each pressing sheet 4 can be arranged to be connected with the circuit board body 1, and the other end of each pressing sheet 4 extends into the cavity 2 to press the chip; the arrangement form of the partial pressing sheet 4 is that the pressing sheet 4 strides over the cavity 2, and two ends of the partial pressing sheet are respectively connected with the circuit board body 1; the specific arrangement form of the pressing sheet 4 may be other forms, so as to realize the fixing function of the chip, and is not limited specifically.

According to still other embodiments of the present invention, the connection structure between the chip and the circuit board body 1 may be other structures, for example, the chip may be provided with a mounting hole, and connected and fixed with the circuit board body 1 by a bolt; or a connecting piece is arranged on the chip and connected with the circuit board body 1 through the connecting piece, and the connecting piece and the circuit board body 1 can be connected in a thread mode and the like.

According to the circuit board assembly provided by the embodiment of the invention, the cavity 2 is designed on the circuit board body 1, and the chip is embedded in the cavity 2, compared with the existing chip welding scheme, the chip in the embodiment is in contact conduction with the conductive post 31 in the cavity 2 and is fixed through the connecting structure, and the chip is directly assembled and applied without high-temperature welding, so that the problem of thermal stress failure in the chip welding and heating process is avoided; on the other hand, because the chip is embedded in the cavity 2 of the circuit board body 1, the side wall of the cavity 2 plays an all-round role in protecting the chip, and a transmission path of external mechanical stress is cut off, so that the problem of chip mechanical stress failure is effectively avoided. Meanwhile, welding is not needed in the scheme, the problem of cracking of the existing welding balls is fundamentally solved, and the durability and reliability of the product are greatly improved.

Other configurations of circuit board assemblies according to embodiments of the present invention, such as other electronic components and the like, and operations are known to those of ordinary skill in the art and will not be described in detail herein.

An electronic device according to some embodiments of the invention, the electronic device comprising: a housing; the circuit board assembly is according to the above embodiment, and the circuit board assembly is arranged inside the shell. The circuit board assembly includes a circuit board body 1 and a chip disposed on the circuit board body 1. Specifically, the electronic device may be a mobile phone, and the circuit board assembly may be a motherboard; the electronic device may also be other devices, such as a tablet, a computer, and the like, which need to be provided with a circuit board assembly, and is not limited specifically.

Other configurations of electronic devices according to embodiments of the present invention, such as connections and the like, and operations are known to those of ordinary skill in the art and will not be described in detail herein.

According to some embodiments of the invention, the method for manufacturing a circuit board assembly is a circuit board assembly according to any one of the embodiments, and referring to fig. 6, the method comprises:

s1, manufacturing a first circuit substrate 11 on which the conductive pillar set 3 is disposed, where the conductive pillar set 3 includes a plurality of conductive pillars 31, a first end of each conductive pillar 31 protrudes from a first side surface of the first circuit substrate 11, and a second end of each conductive pillar 31 is electrically connected to a conductive layer 111 of the first circuit substrate 11; s2, respectively arranging substrate layers 12 on two sides of the first circuit substrate 11 provided with the conductive column group 3, and manufacturing a second circuit substrate 13; s3, a cavity 2 is formed in the side face of the second circuit substrate 13 corresponding to the position of the conductive column group 3, and the first end of the conductive column 31 protrudes out of the bottom of the cavity 2 to form the circuit board body 1; and S4, assembling the chip at the cavity 2 to form the circuit board assembly.

According to the manufacturing method of the circuit board assembly of the embodiment, a first circuit substrate 11 provided with a conductive column group 3 is manufactured; then respectively stacking a substrate layer 12 on two sides of a first circuit substrate 11 provided with the conductive column group 3, and manufacturing a second circuit substrate 13 with a target lamination thickness by utilizing a multilayer laminating process, wherein the conductive column group 3 is arranged in the second circuit substrate 13; and then, arranging a cavity 2 at the position of the side surface of the second circuit substrate 13 corresponding to the conductive column group 3, so that the conductive column group 3 is exposed, and finishing the manufacture of the circuit board.

According to the circuit board assembly manufacturing method of the embodiment, the conductive column group 3 is manufactured on the first circuit substrate 11 and then formed inside the second circuit substrate 13 through a pressing process, then the cavity is opened to expose the conductive column group 3, the conductive column group 3 can be inserted into the bottom of the cavity 2 through the manufacturing process, the structural stability of the conductive column group 3 is favorably improved, the first circuit substrate 11 provided with the conductive column group 3 is manufactured independently, the circuit connection between the conductive column group 3 and the first circuit substrate 11 can be conveniently set, the circuit connection between the conductive column group 3 and the first circuit substrate 11 is firstly set according to a preset connection circuit, and the circuit connection setting can be conveniently carried out in a subsequent process.

According to a further embodiment of the present invention, the second end of the conductive column 31 of the conductive column group 3 is inserted into the first circuit substrate 11 and electrically connected to the conductive layer 111 on the second side of the first circuit substrate 11. The stability of the conductive pillar structure is improved, and the conductive pillar 31 and the first circuit substrate 11 are connected in a circuit conveniently.

According to a further embodiment of the present invention, the manufacturing of the first circuit substrate 11 provided with the conductive post group 3 specifically includes: drilling a notch 112 on the first side of the first circuit substrate 11, wherein the notch 112 is communicated with the conductive layer 111 on the second side of the first circuit substrate 11; respectively attaching a dry circuit film 6 to two sides of the first circuit substrate 11, and exposing and developing to form a hole communicated with the slot 112 in the dry circuit film 6 on the first side of the first circuit substrate 11; electroplating the conductive post 31 in the slot 112 and the hole site to form the first circuit substrate 11 provided with the conductive post group 3.

FIG. 8 is a schematic diagram showing a variation of the structure corresponding to the flow shown in FIG. 7; referring to fig. 7 and 8, a specific process of manufacturing the first circuit substrate 1 provided with the conductive post group 3 in this embodiment includes: s11, firstly, cutting materials to manufacture a first circuit substrate 11; the first circuit substrate 11 is a Printed Circuit Board (PCB) structure, and specifically, the first circuit substrate 11 may be a single-layer substrate structure, an insulating medium layer is disposed in the middle of the first circuit substrate 11, and two side surfaces of the medium layer are respectively provided with a conductive layer 111. S12, drilling a groove 112 on the first side of the first circuit substrate 11, and forming the groove 112 by using a laser drilling process. Then, forming a conductive pillar 31, which may be a conductive copper pillar, in the trench 112 by an electroplating process; the conductive post 31 is connected to the conductive layer 111 on the second side surface of the first circuit substrate 11.

Specifically, the plated conductive post 31 includes: s13, respectively attaching the dry circuit films 6 to the two side surfaces of the first circuit substrate 11 with the drilled slot 112, exposing, and developing, so that a hole location communicated with the slot 112 is formed in the dry circuit film 6 on the first side surface of the first circuit substrate 11, where the hole location is the first hole location 61, that is, a structure corresponding to the third step in fig. 8 is formed; s14, electroplating the conductive pillars 31 in the open slots 112 and the first hole sites 61, so as to form the structure corresponding to the fourth step in fig. 8. The circuit dry film 6 is beneficial to protecting the conductive layer 111 of the first circuit substrate 11 in the electroplating process, and the conductive layer 111 is prevented from being damaged; exposing and developing the dry film 6 of the circuit, a hole position can be formed, and the conductive post 31 can be formed by electroplating. The dry wiring film 6 can be set or washed off as needed to form the desired structure.

According to a further embodiment of the present invention, the manufacturing of the first circuit substrate 11 provided with the conductive post group 3 further includes: and manufacturing a positioning groove 311 on the end surface of the first end of the conductive column 31 formed by electroplating, wherein the positioning groove 311 is matched with a bonding pad on a chip.

According to a further embodiment of the present invention, the forming of the positioning groove 311 on the first end surface of the conductive pillar 31 formed by electroplating specifically includes: s15, after the conductive post group 3 is formed in the slot 112 and the first hole site 61 by electroplating, respectively attaching a dry circuit film 6 to both sides of the first circuit substrate 11, exposing, and developing, so that a second hole site 62 communicating with the first end of the conductive post is formed in the dry circuit film 6 on the first side of the first circuit substrate 11; s16, etching the positioning groove 311 on the end surface of the first end of the conductive pillar through the second hole location 62.

Specifically, referring to fig. 7 and 8, after the conductive posts 31 are electroplated in the slots 112 and the hole sites to form the conductive post group 3, the dry circuit film 6 may not be washed away first, the dry circuit films 6 are continuously attached to the two side surfaces of the first circuit substrate 11, and the exposure and the development are continued, so that a hole site communicating with the first end of the conductive post 31 is formed in the dry circuit film 6 on the first side surface of the first circuit substrate 11, and the hole site is the second hole site 62, that is, a structure corresponding to the fifth step in fig. 8 is formed. Then, the end face of the first end of the conductive post 31 is etched in the second hole site 62 to form a positioning slot 311, and the structure corresponding to the sixth step in fig. 8 is formed. The positioning slot 311 may be of a ball shape. Then, S17, the dry circuit films 6 on the two sides may be removed, and the first circuit substrate 11 on which the conductive post group 3 is grown is formed, that is, the structure corresponding to the seventh step in fig. 8.

According to a further embodiment of the present invention, the manufacturing of the first circuit substrate 11 provided with the conductive post group 3 further includes: and respectively etching the conductive layers 111 on the two sides of the first circuit substrate 11 according to a preset connecting circuit of the circuit board assembly. That is, after the conductive posts 31 are plated, referring to the structure corresponding to the seventh step in fig. 8, the second ends of the conductive posts 31 are connected to the conductive layer 111 on the second side surface of the first circuit substrate 11. In practical application, the bonding pads on the chip are not all connected together, but have a preset connecting circuit, and the bonding pads on the chip need to be conductively connected according to the preset connecting circuit; correspondingly, the conductive pillars in the conductive pillar group 3 need to be electrically connected according to a preset connection circuit, that is, there is a disconnection portion between the second ends of the plurality of conductive pillars 31 and the conductive layer 111 of the first circuit substrate 11 according to the preset connection circuit, and the conductive layer 111 should be etched according to the preset connection circuit.

Specifically, according to the preset connection circuit of the circuit board, etching the conductive layers 111 on both sides of the first circuit substrate 11 respectively includes: s18, attaching the dry circuit film 6 to the second side surface of the first circuit substrate 11, exposing and developing, and forming a third hole 63 communicated with the conductive layer 111 on the second side surface of the first circuit substrate 11 on the second side of the first circuit substrate 11; s19, etching the conductive layers 111 on both sides of the first circuit substrate 11 according to a predetermined connection circuit; and S110, removing the circuit dry film 6, and finishing the manufacture of the conductive column group 3 on the first circuit substrate 11.

That is, in this embodiment, after the positioning groove 311 is manufactured, the circuit dry film 6 is removed; then, the dry film wiring film 6 is attached to the second side of the first circuit substrate 11, exposed and developed to form third via holes 63, as shown in the eighth step of fig. 8. In this embodiment, the conductive layer 111 on the first side of the first circuit substrate 11 is etched completely, and the conductive layer 111 on the second side of the first circuit substrate 11 is etched according to the predetermined connection circuit, as shown in the ninth step in fig. 8; to facilitate subsequent circuit connections. Therefore, the dry film circuit traces 6 are attached to the second side of the first circuit board 11, exposed and developed to protect the conductive layer 111 on the second side of the first circuit board 11 where etching is not needed, and the third holes 63 are the conductive layer 111 where etching is needed. After the conductive layers 111 on both sides of the first circuit substrate 11 are etched, the dry film circuit 6 may be removed to form the first circuit substrate 11 on which the conductive pillar group 3 grows, and the conductive pillar in the conductive pillar group 3 is electrically connected to the first circuit substrate 11 according to a predetermined connection circuit, as shown in the tenth step in fig. 8.

According to a further embodiment of the present invention, a substrate layer is respectively disposed on both sides of the first circuit substrate 11 on which the conductive column group 3 is disposed, wherein the substrate layer includes: an isolation layer 121 is provided on the substrate layer 12 adjacent to the first ends of the conductive posts. That is, the isolation layer 121 may be disposed on the substrate layer 12 adjacent to the first end of the conductive pillar in advance, then the substrate layer 12 provided with the isolation layer 121 is disposed above the first circuit substrate 11 and adjacent to the first end of the conductive pillar 31, and then the second circuit substrate 13 is formed by performing multi-layer pressing, so that the isolation layer 121 is embedded above the conductive pillar 31 in the second circuit substrate 13, so as to facilitate subsequent cavity opening. Because the second circuit substrate 13 formed by the multi-layer laminating process has a relatively high integrity, if the cavity 2 is not easily opened without the isolation layer 121, the isolation layer 121 is first disposed in this embodiment, and the second circuit substrate 13 is disconnected at the isolation layer 121, which is beneficial to opening the subsequent cavity 2.

Further, an isolation layer 121 is provided on the substrate layer 12 adjacent to the first ends of the conductive posts 31; correspondingly, a cavity 2 is formed in a position, corresponding to the conductive column group 3, on the side surface of the second circuit substrate 13, and the first end of the conductive column protrudes out of the bottom of the cavity 2, which specifically includes: a slot 131 to the isolation layer 121 is formed in the side surface of the second circuit substrate 13 corresponding to the position of the conductive post group 3; etching the bottom of the slot body 131 to form the cavity 2, so that the first end of the conductive column protrudes out of the bottom of the cavity 2,

specifically, the structure shown in fig. 10 is a schematic diagram of a structural change corresponding to the flow shown in fig. 9; referring to fig. 9 and 10, the operation steps of this embodiment specifically include: s21, firstly, a substrate layer 12 is manufactured by cutting materials; s22, manufacturing an isolating layer 121 on one side surface of the substrate layer 12; s23, the substrate layer 12 is placed above the first circuit substrate 11 so that the isolation layer 121 is placed near the first ends of the conductive pillars, and then stacked and laminated to form the second circuit substrate 13 as shown in the third step in fig. 10. S24, using laser drilling, electroplating, circuit manufacturing, and other processes, and repeating the pressing process, and circulating layer by layer to the target lamination thickness to form the second circuit substrate 13 having a thickness reaching the target lamination thickness and a circuit connected to a predetermined connection circuit, as shown in the fourth step in fig. 10, which is the second circuit substrate 13 structure. The laser drilling, electroplating, circuit manufacturing and other processes and the repeated pressing process are conventional process flows for manufacturing the multilayer circuit board, and specific operations are not repeated.

Further, the opening of the cavity 2 on the second circuit substrate 13 specifically includes: s31, the slot 131 is formed first, and the depth of the slot 131 on the side of the second circuit substrate 13 reaches the position of the isolation layer 121, which is convenient for forming the slot 131 because of the isolation layer 121, and at this time, the conductive pillar is not exposed out of the cavity 2, as shown in the fifth step in fig. 10. S32, the bottom of the groove 131 may be processed by using plasma etching, so that the conductive pillar is exposed and reaches a predetermined depth of the cavity 2, so as to form the cavity 2, as shown in fig. 10. And S33, completing the manufacture of the circuit board after the cavity 2 is processed.

Further, the circuit board manufacturing method further comprises the following steps: a connection structure is provided on the second circuit substrate 13. The connecting structure can be the pressing sheet 4 or a mounting hole and the like.

According to some embodiments of the present invention, a technical solution for implementing chip switching by using a cavity-structured printed circuit board (cavity PCB) is provided. Firstly, a corresponding cavity structure (cavity) is designed at a chip placing position on the PCB, namely, the whole circuit board is a cavity PCB, and the cavity structure is a cavity 2 on the circuit board. The cavity 2 is used for placing a target chip, and various electronic components and structural parts are welded on the upper/lower surfaces of other positions of the cavity PCB according to design and application requirements. A PCB copper column similar to a needle bed is designed in the cavity 2 structure, namely, a conductive column, and electric signal conduction between the PCB and the chip is realized through the contact of the copper column and a tin ball (or a bonding pad) at the bottom of the chip. The cavity PCB is attached with an elastic sheet, and the elastic sheet is contacted with the top of the chip and provides a downward pressure after the chip is assembled, so that the tin balls (or bonding pads) at the bottom of the chip are ensured to be well contacted with the copper columns/needle beds of the PCB.

Specifically, the cavity PCB is a PCB having a cavity structure, a plurality of cavity cavities 2 are designed according to requirements, and various electronic components and structural members are attached to other positions. cavity structure: the chip is manufactured on the PCB through a PCB process, and the chip is mainly limited in structure; the size processing precision can reach 20um, and the limiting precision can be greatly improved. Spring plate: the elastic sheet fixing column is pasted or assembled on the PCB and can rotate around the elastic sheet fixing column 5; the device mainly provides downward pressure for a test chip, the test chip is tightly pressed and fixed in a cavity 2 structure, and a solder ball on the chip is ensured to be in close contact with a PCB copper column/needle bed, so that good conduction is realized; the microstructure is shown in fig. 5. PCB copper cylinder/needle bed: the microstructure is shown in fig. 2 and fig. 4, and is manufactured by a PCB process, and the top of the microstructure is provided with a hemispherical groove which can be tightly contacted with a solder ball of a test chip to ensure good conduction. Elastic sheet fixing column 5: the spring plate is welded or assembled on the PCB and plays a role in fixing the spring plate. And the elastic sheet can rotate around the central shaft thereof, thereby realizing the opening and closing of the structure and the replacement of the test chip.

In the embodiment, an integrated cavity PCB design is adopted, compared with the traditional scheme that various chips are welded on the surface of a PCB through solder paste to realize the fixation and electrical performance conduction of the chips, the cavity 2 is designed in the PCB firstly, and then the chips are embedded in the cavity 2 of the PCB, so that the embodiment is different from the original welding scheme, and the chips are in contact conduction with conductive copper columns in the cavity PCB. This embodiment switches on through the switching that does not have the welding mode realization chip, and beneficial effect is as follows: the cavity technology is utilized for chip switching, the chip does not need to be welded at high temperature and is directly assembled and applied, the welding and heating process of the chip is effectively avoided, the problem that the thermal stress fails in the welding and heating process of the chip is solved, the durability and the reliability of electronic equipment products such as mobile phones can be greatly improved, the market retreat rate is reduced, and the product public praise and brand image are improved. And because the chip is embedded in the cavity PCB, the side wall of the cavity PCB plays an all-round protective role for the chip, and cuts off the transmission path of external mechanical stress, thereby effectively avoiding the problem of chip mechanical stress failure. Meanwhile, welding is not needed in the scheme, the problem of cracking of the existing welding balls is fundamentally solved, and the durability and reliability of the mobile phone product are greatly improved.

On the other hand, the upgrading of the chip and the change of the platform each time can lead to the problem that the project is opened die again for research and development, the research and development period is long, and the resource input is large.

The scheme of the embodiment is suitable for modularized PCB design, such as modules of CPU, storage, charging chips, antenna chips and the like for mass production of electronic products. Therefore, the research and development cycle of electronic products such as mobile phones is reduced, and the user differentiation design is realized. In addition, the invention includes but is not limited to the application in electronic products such as mobile phones.

The scheme of the embodiment is also suitable for testing the chips in the early period, and can replace the existing socket and bracket, which is the test scheme of the chip test switching needle bed (socket). The chip testing period can be effectively shortened, and the proofing cost is reduced.

In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, comprising:

a chip;

the circuit board comprises a circuit board body, wherein a groove-shaped cavity is formed in the surface of one side of the circuit board body and is used for accommodating the chip; a conductive column group is arranged at the bottom of the cavity in a protruding mode and comprises a plurality of conductive columns, the conductive columns are electrically connected with the conductive layer of the circuit board body, the chip is supported by the plurality of conductive columns, and the plurality of conductive columns are electrically connected with the bonding pads on the chip in a one-to-one corresponding mode;

the circuit board body is detachably connected with the chip through the connecting structure.

2. The circuit board assembly of claim 1, wherein one end of the conductive post is inserted into the circuit board body corresponding to the bottom of the cavity and electrically connected to the conductive layer of the circuit board body.

3. The circuit board assembly according to claim 1, wherein a positioning groove is formed on an end surface of the conductive pillar away from the bottom of the cavity, and the positioning groove is matched with the bonding pad of the chip.

4. A circuit board assembly according to any of claims 1-3, wherein the connection structure comprises at least one press tab connected to the circuit board body, the press tab being provided on the chip.

5. The circuit board assembly of claim 4, wherein the press tab has a protruding contact on a side thereof that is in mating contact with the chip.

6. The circuit board assembly of claim 4, wherein the pressing plate is a spring plate, one end of the spring plate is disposed on the chip, and the other end of the spring plate is rotatably connected to the circuit board body.

7. An electronic device, comprising:

a housing;

a circuit board assembly according to any one of claims 1 to 6, the circuit board assembly being disposed inside the housing.

8. A method of manufacturing a circuit board assembly, wherein the circuit board assembly is a circuit board assembly according to any one of claims 1-6, the method comprising:

manufacturing a first circuit substrate provided with the conductive column group, wherein the conductive column group comprises a plurality of conductive columns, the first ends of the conductive columns protrude out of the first side surface of the first circuit substrate, and the second ends of the conductive columns are electrically connected with the conductive layer of the first circuit substrate;

respectively arranging substrate layers on two sides of the first circuit substrate provided with the conductive column group to manufacture a second circuit substrate;

a cavity is formed in the side face of the second circuit substrate corresponding to the position of the conductive column group, and the first end of the conductive column protrudes out of the bottom of the cavity to form the circuit board body;

and assembling the chip at the cavity to form the circuit board assembly.

9. The method for manufacturing a circuit board according to claim 8, wherein the manufacturing of the first circuit substrate provided with the conductive post group specifically includes:

drilling a notch on the first side surface of the first circuit substrate, wherein the notch is communicated with the conductive layer on the second side surface of the first circuit substrate;

respectively attaching a circuit dry film, exposing and developing on two sides of the first circuit substrate to form hole sites communicated with the slots in the circuit dry film on the first side surface of the first circuit substrate;

and electroplating the conductive columns in the grooves and the hole sites to form the first circuit substrate provided with the conductive column group.

10. The method for manufacturing a circuit board according to claim 9, wherein the manufacturing of the first circuit substrate provided with the conductive pillar group further comprises:

and manufacturing a positioning groove on the end surface of the first end of the conductive column formed by electroplating, wherein the positioning groove is matched with a bonding pad on the chip.

11. The method for manufacturing a circuit board according to any one of claims 8 to 10, wherein the manufacturing of the first circuit substrate provided with the conductive post group further includes:

and respectively etching the conducting layers on two sides of the first circuit substrate according to a preset connecting circuit of the circuit board assembly.

12. The method for manufacturing a circuit board according to any one of claims 8 to 10, wherein a substrate layer is disposed on each of two sides of the first circuit substrate on which the set of conductive posts are disposed, and the method includes:

and arranging an isolation layer on a substrate layer adjacent to the first end of the conductive column.