CN115389913B - Semiconductor chip integrated package testing device - Google Patents
Semiconductor chip integrated package testing device Download PDFInfo
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- CN115389913B CN115389913B CN202211076803.6A CN202211076803A CN115389913B CN 115389913 B CN115389913 B CN 115389913B CN 202211076803 A CN202211076803 A CN 202211076803A CN 115389913 B CN115389913 B CN 115389913B
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- semiconductor chip
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- shaped shell
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
Abstract
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor chip integrated packaging testing device; comprising the following steps: a display device; the display device is used for displaying the test parameters of the semiconductor chip; a test module; the test module is used for testing the semiconductor chip; a controller; the controller is used for controlling the automatic operation of the invention; the semiconductor chip integrated package testing device further comprises a workbench; the workbench is fixedly connected to the ground through supporting legs and is used for bearing the display device; an inner strip-shaped shell; the inner strip-shaped shells are arranged on the workbench in parallel, and the surfaces, far away from each other, of the two inner strip-shaped shells are openings; compared with the push type electrical test, the semiconductor chip is less damaged in the packaging test process, and the method can be also suitable for testing semiconductor chips of different specifications and models.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor chip integrated packaging testing device.
Background
The semiconductor packaging test refers to a process of processing a wafer passing through the test according to a product model and a function requirement to obtain an independent chip, wherein the packaging process is as follows: the wafer from the wafer front process is cut into small wafers through a dicing process, the cut wafers are attached to the small islands of the corresponding substrate frame through glue, bonding pads of the wafers are connected to corresponding pins of the substrate by utilizing superfine metal wires or conductive resin to form required circuits, then the independent wafers are packaged and protected by a plastic shell, and after plastic packaging, a series of operations such as post-curing, rib cutting, molding, electroplating, printing and the like are further carried out;
the semiconductor chip package test mainly tests the electrical property and inspects the welding pins or appearance defects, so a specific test device is needed, but the existing test device generally firstly places the semiconductor on the concave surface, pins are upwards, then presses the upper cover, presses the electrode plate of the upper cover to be close to the semiconductor chip and contacts with the pins, so the electrical property test is realized, but the pressing type test mode is only applicable to the series type of TSSOP package, namely the pins are horizontally arranged, but not applicable to the series type of DPIP package, namely the pins are vertically arranged, the pins are forced to be pressed for electrical property test in such a mode, the situation of pin crush is caused, and the semiconductor chip after the test is damaged.
In view of the above, the present invention provides a semiconductor chip integrated package testing device, which solves the above technical problems.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a semiconductor chip integrated packaging testing device, which clamps pins through two conductive bags for electrical testing.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to a semiconductor chip integrated package testing device, which comprises:
a display device; the display device is used for displaying the test parameters of the semiconductor chip;
a test module; the test module is used for testing the semiconductor chip;
a controller; the controller is used for controlling the automatic operation of the invention;
the semiconductor chip integrated package testing device further comprises
A work table; the workbench is fixedly connected to the ground through supporting legs and is used for bearing the display device;
an inner strip-shaped shell; the inner strip-shaped shells are arranged on the workbench in parallel, and the surfaces, far away from each other, of the two inner strip-shaped shells are openings;
an outer strip-shaped shell; the outer strip-shaped shells are arranged on the workbench in parallel; the outer strip-shaped shell is positioned at two sides of the inner strip-shaped shell and is parallel to the inner strip-shaped shell; one surface of the outer strip-shaped shell, which is close to each other, is an opening;
a conductive bladder; the conductive bag is strip-shaped and is fixedly connected in the inner strip-shaped shell and the outer strip-shaped shell; one pair of adjacent conductive bags is connected with the test module through a first wire, and the other pair of adjacent conductive bags is connected with the test module through a second wire;
a slide plate; the sliding plate is connected to the support leg in a sliding and sealing manner;
a bellows balloon; the corrugated air bag is sleeved on the support leg; the ripple air bag is fixedly connected to the lower end of the sliding plate;
an air pipe; one end of the air pipe is fixedly connected and communicated with the inside of the corrugated air bag, and the other end of the air pipe is communicated with the inside of the conductive air bag.
Preferably, one end of the adjacent inner strip-shaped shell is connected with one end of the outer strip-shaped shell through a sliding block; the upper surface of the workbench is fixedly connected with supporting blocks at two sides of the outer strip-shaped shell; a screw rod is rotationally connected between the two supporting blocks; threads at two ends of the screw rod are oppositely arranged; both ends of the screw are in threaded transmission connection with the sliding block; the sliding block is connected with the workbench in a sliding way; the workbench is fixedly connected with a motor; the motor output shaft is fixedly connected with one end of the screw rod.
Preferably, the inner strip-shaped shell comprises a shell body and an upper cover; the upper end of the shell is also provided with an opening; the upper ends of the surfaces of the two shells, which are close to each other, are hinged with corresponding upper covers through torsion springs.
Preferably, the edge of the upper cover away from the torsion spring is provided in a corrugated shape.
Preferably, the polishing particles are embedded on the surface, which is contacted with the conductive bag.
Preferably, a return spring is arranged in the corrugated air bag; one end of the return spring is connected with the lower end of the sliding plate, and the other end of the return spring is connected with the bottom of the corrugated air bag; the inner walls of the conductive bags are connected through elastic ropes.
Preferably, the upper end of the sliding plate is fixedly connected with a corrugated sleeve in a sealing way; the corrugated sleeve is sleeved around the support leg; one end of the corrugated sleeve is connected with the lower end of the workbench in a sealing way; an air hole is formed in the workbench; one end of the air hole is positioned between the gaps of the two corresponding conductive bags, and the other end of the air hole is communicated with the inside of the corrugated sleeve.
Preferably, the inner sides of one end of the inner strip-shaped shell and one end of the outer strip-shaped shell are rotationally connected with the limiting plate; the inner side of the limiting plate is provided with an eccentric disc, and the eccentric disc is connected to the shell walls of the inner strip-shaped shell and the outer strip-shaped shell through bolts and threads.
The beneficial effects of the invention are as follows:
1. compared with the push type electrical test, the semiconductor chip is less damaged in the packaging test process, and the method can be also suitable for testing semiconductor chips of different specifications and models.
2. Before the semiconductor chips with larger distance difference between some pins are required to be tested, the controller is required to control the motor to rotate, the rotating motor drives the screw to rotate, and the rotating screw drives the two sliding blocks to move away from or close to each other and slide at the upper end of the workbench, so that each sliding block drives the inner strip-shaped shell and the outer strip-shaped shell which are connected with each other to move, the distance between the two positions where the pins are inserted is changed, and the embodiment can be suitable for packaging and testing of the semiconductor chips with different specifications.
3. After the packaging test of a group of semiconductor chips is finished, the skateboard is continuously trampled, so that the skateboard presses residual gas in the corrugated air bag into the conductive bag through the air pipe, the air pressure in the conductive bag is further increased, the upper covers are turned around the edge of the upper end of one face of the shell body by overcoming the torsion force of the torsion springs, the semiconductor chips are jacked up after the two upper covers are turned in opposite directions, a gap is reserved for the operation of the workers on the semiconductor chips, and the adjustment and the taking of the workers on the semiconductor chips are facilitated.
Drawings
The invention will be further described with reference to the drawings and embodiments.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is an enlarged view at A in FIG. 1;
FIG. 3 is a perspective view of the present invention at another angle;
fig. 4 is an enlarged view at B in fig. 2;
FIG. 5 is a cross-sectional view of a bellows balloon and bellows sleeve of the present invention;
FIG. 6 is a block diagram of the inner and outer bar shells of the present invention;
in the figure: the display device 1, the test module 2, the workbench 3, the support legs 31, the air holes 32, the inner bar-shaped shell 4, the sliding block 41, the supporting block 42, the screw 43, the motor 44, the shell 45, the upper cover 46, the torsion spring 47, the outer bar-shaped shell 5, the limiting plate 51, the eccentric disc 52, the bolts 53, the conductive capsules 6, the polishing particles 63, the elastic ropes 64, the sliding plate 7, the corrugated air bags 71, the air pipes 72, the return springs 73 and the corrugated sleeves 74.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 6, a semiconductor chip integrated package testing apparatus according to the present invention includes:
a display device 1; the display device 1 is used for displaying semiconductor chip test parameters;
a test module 2; the test module 2 is used for testing the semiconductor chip;
a controller; the controller is used for controlling the automatic operation of the invention;
the semiconductor chip integrated package testing device further comprises
A work table 3; the workbench 3 is fixedly connected to the ground through the support legs 31, and the workbench 3 is used for bearing the display device 1;
an inner strip-shaped case 4; the inner strip-shaped shells 4 are arranged on the workbench 3 in parallel, and one surface, away from each other, of each inner strip-shaped shell 4 is an opening;
an outer strip-shaped case 5; the outer strip-shaped shells 5 are arranged on the workbench 3 in parallel; the outer strip-shaped shells 5 are positioned on two sides of the inner strip-shaped shell 4 and are parallel to the inner strip-shaped shell 4; the surfaces of the outer strip-shaped shells 5 close to each other are openings;
a conductive capsule 6; the conductive bag 6 is strip-shaped, and the conductive bag 6 is fixedly connected in the inner strip-shaped shell 4 and the outer strip-shaped shell 5; one pair of adjacent conductive bags 6 is connected with the test module 2 through a first wire, and the other pair of adjacent conductive bags 6 is connected with the test module 2 through a second wire;
a slide plate 7; the sliding plate 7 is connected to the supporting leg 31 in a sliding and sealing manner;
a bellows balloon 71; the corrugated air bag 71 is sleeved on the support leg 31; the ripple air bag 71 is fixedly connected to the lower end of the sliding plate 7;
an air pipe 72; one end of the air pipe 72 is fixedly connected and communicated with the inside of the corrugated air bag 71, and the other end is communicated with the inside of the conductive bag 6;
when the conventional testing device works, a semiconductor is firstly placed on a concave surface, pins are upwards, then the upper cover 46 is pressed, an electrode plate of the upper cover 46 is pressed to be close to the semiconductor chip and is contacted with the pins, so that an electrical test is realized, but the pressing type testing mode is only applicable to a series type of TSSOP (semiconductor package on package) packages, namely the pins are horizontally arranged, but not applicable to a series type of DPIP packages, namely the pins are vertically arranged, and the pins are forced to be pressed for electrical test in such a mode, so that the pins are crushed, and the tested semiconductor chip is damaged;
after the encapsulation of the semiconductor chips is completed, the workers transport the semiconductor chips to the periphery of the workbench 3, clean the surface of each conductive bag 6, avoid the influence of impurities on the surface of the conductive bag 6 on the conductive effect, erect the semiconductor chips on two inner strip-shaped shells 4, enable pins on the semiconductor chips to be positioned at openings of the inner strip-shaped shells 4, after the semiconductor chips are lapped in the inner strip-shaped shells 4, the semiconductor chips are driven to move downwards through the pedal 7 to drive the corrugated air bags 71 to compress through the pedal 7, the pressure of gas in the corrugated air bags 71 is increased after being compressed, so that the gas enters the conductive bags 6 along the air pipes 72, the conductive bags 6 can be made of conductive silica gel, or be made of conductive wires through the outer walls of the air bags, the dual purposes of expansion and conduction are met, and the air pressure in the conductive bags 6 can be increased after the gas enters the conductive bags, so that the corresponding two conductive bags 6 are mutually close to each other after being expanded under the gas effect, the pins of the semiconductor chips are clamped by the mutually close two conductive bags 6, and the pins of the semiconductor chips can be simultaneously tested by the semiconductor chips with different specifications, namely, the semiconductor chips can be tested with different specifications, and the different requirements can be tested, and the different semiconductor chips can be tested, and different distances can be adjusted; the vertical inclination angles of the pins are different, the conductive bags 6 can be attached as much as possible, then the controller is started to control the test module 2 to electrify the semiconductor chips and detect the electrical property, then the test result is sent to the display device 1 to be displayed, the display device 1 also displays the position of the unqualified semiconductor chips, a worker picks out the unqualified semiconductor chips, then releases the feet of the trampling slide plate 7, the corrugated bags 71 are made of rubber materials, so that the worker has the capability of resetting, in order to improve the resetting effect, a reset spring 73 can be arranged between the slide plate 7 and the inner wall of the corrugated bags 71, the corrugated bags 71 can reset themselves after the worker is not stepped on by feet, namely, the slide plate 7 is driven to move upwards, the gas in the conductive bags 6 can be pumped back into the corrugated bags 71 through the gas pipe 72 in the resetting process, so that the conductive bags 6 are changed into a flat state from the original expansion state, the two conductive bags 6 attached to be separated to form a gap after being dried, and the worker can take off one end of the qualified semiconductor chips from the conductive bags 6 to the inner side of the semiconductor chips along the flat side of the flat plate, and then the semiconductor chips are packaged into the edge of the semiconductor frame 3, and the test is completed;
compared with the push type electrical test, the clamp type electrical test device has the advantages that the damage to the semiconductor chip in the packaging test process is small, and the clamp type electrical test device can be also suitable for testing semiconductor chips of different specifications and models.
As one embodiment of the present invention, the adjacent inner bar-shaped shell 4 is connected with one end of the outer bar-shaped shell 5 through a sliding block 41; the upper surface of the workbench 3 is fixedly connected with supporting blocks 42 at two sides of the outer strip-shaped shell 5; a screw 43 is rotatably connected between the two supporting blocks 42; the threads at the two ends of the screw 43 are oppositely arranged; both ends of the screw 43 are in threaded transmission connection with the sliding block 41; the sliding block 41 is in sliding connection with the workbench 3; the workbench 3 is fixedly connected with a motor 44; the output shaft of the motor 44 is fixedly connected with one end of the screw 43; before the semiconductor chips with larger distance differences between some pins are required to be tested, the motor 44 is controlled by the controller to rotate, the rotating motor 44 drives the screw 43 to rotate, and the rotating screw 43 drives the two sliding blocks 41 to move away from or close to each other and slide at the upper end of the workbench 3, so that each sliding block 41 drives the inner strip-shaped shell 4 and the outer strip-shaped shell 5 which are connected with each other to move, the distance between the two positions where the pins are inserted is changed, and the embodiment can be suitable for semiconductor chip packaging tests of different specifications.
As an embodiment of the present invention, the inner bar-shaped case 4 includes a case 45 and an upper cover 46; the upper end of the shell 45 is also provided with an opening; the upper ends of the two shells 45 close to each other are hinged with corresponding upper covers 46 through torsion springs 47; during operation, after a group of semiconductor chip packaging tests are completed, the slide plate 7 is continuously stepped on, so that the slide plate 7 presses residual gas in the corrugated air bag 71 into the conductive air bag 6 through the air pipe 72, the air pressure in the conductive air bag 6 is further increased, the upper cover 46 is turned around the upper end edge of one face of the shell 45 by overcoming the torsion force of the torsion spring 47, the two upper covers 46 jack up the semiconductor chip after being turned in opposite directions, and a gap is reserved for the operation of the semiconductor chip by a worker, so that the adjustment and the taking of the semiconductor chip by the worker are facilitated.
As an embodiment of the present invention, the edge of the upper cover 46 away from the torsion spring 47 is provided in a corrugated shape; when the semiconductor chip lifting device works, after the upper covers 46 jack up the semiconductor chips, the semiconductor chips are arranged on the two upper covers 46 in a regular manner and incline back and forth due to the fact that the edges of the upper covers 46 are corrugated, so that the adjacent semiconductor chips form a height difference, and further, the semiconductor chip lifting device is beneficial for workers to select unqualified semiconductor chips, the selecting time is saved, and the working efficiency is improved; during the process of loosening the slide plate 7 by a worker, the corrugated air bag 71 is matched with the reset spring 73 in the interior of the slide plate, so that the corrugated air bag 71 is quickly stretched from a flattened state, and the air in the conductive air bag 6 is quickly sucked back through the air pipe 72.
As one embodiment of the present invention, the surface of the conductive capsule 6 contacted with the polishing particles 63 is embedded; during operation, in the process that the upper cover 46 jacks up the semiconductor chip, the conductive bag 6 is in a clamping state for the pins of the semiconductor chip, so that relative friction is generated between the pins and the conductive bag 6, meanwhile, as the polishing particles 63 are embedded on the outer surface of the conductive bag 6, the polishing particles 63 on the conductive bag 6 polish the pins, and in the process that a worker rolls off the semiconductor chip from the upper cover 46, the semiconductor chip is in a corrugated design at the edge of the upper cover 46, so that the pins can move up and down while moving horizontally, the polishing particles 63 on the conductive bag 6 polish the pins in all directions, the surfaces of the pins are polished to be smoother, and the unqualified pins are polished, so that the polished pins meet the standard requirements.
As an embodiment of the present invention, a return spring 73 is provided inside the bellows air bag 71; one end of the return spring 73 is connected with the lower end of the sliding plate 7, and the other end is connected with the bottom of the corrugated air bag 71; the inner walls of the conductive bags 6 are connected through elastic ropes 64; during operation, when a worker steps on the sliding plate 7, the return spring 73 can be extruded to finish storing force in the downward movement process of the sliding plate 7, meanwhile, after the conductive bag 6 is expanded, the elastic rope 64 can be stretched, and after the foot of the worker moves away from the sliding plate 7, the return spring 73 can be quickly restored, so that the sliding plate 7 is driven to quickly rise, the corrugated air bag 71 is quickly stretched and restored, the elastic rope 64 can flatten the conductive bag 6 under the action of pulling force, so that gas in the conductive bag 6 is quickly transferred into the corrugated air bag 71 through the air pipe 72, and the worker can perform packaging test on a new round of semiconductor chips.
As an embodiment of the present invention, the upper end of the sliding plate 7 is fixedly connected with a corrugated sleeve 74 in a sealing way; the corrugated sleeve 74 is sleeved around the support leg 31; one end of the bellows sleeve 74 is connected to the lower end of the workbench 3 in a sealing manner; an air hole 32 is formed in the workbench 3; one end of the air hole 32 is positioned between the gaps of the two corresponding conductive bags 6, and the other end is communicated with the inside of the corrugated sleeve 74; during operation, the corrugated sleeve 74 is extruded in the upward movement process under the drive of the return spring 73, the air pressure in the corrugated sleeve 74 is increased in the volume reduction process without changing the air quantity of the corrugated sleeve 74, the increased air pressure is expanded to one end of the air hole 32 and released, the air is ejected out through one end of the air hole 32, the two opposite conductive bags 6 and the gap between the two opposite conductive bags are impacted, impurities are washed away, the impurity is prevented from affecting the bonding degree of the conductive bags 6 to pins, the stability of the pins in the electric connection is greatly improved, the encapsulation test result is more accurate, in the downward movement process of the sliding plate 7, a one-way air outlet valve is arranged in the air hole 32 for preventing the impurities from being inhaled from one end of the air hole 32, and a one-way air inlet valve is arranged on the outer wall of the corrugated air pipe 72, so that the purpose of one-way air outlet of the air hole 32 is realized.
As one embodiment of the present invention, the inner bar-shaped shell 4 and the outer bar-shaped shell 5 are rotatably connected with a limiting plate 51 at the inner side of one end; an eccentric disc 52 is arranged on the inner side of the limiting plate 51, and the eccentric disc 52 is connected to the shell walls of the inner strip-shaped shell 4 and the outer strip-shaped shell 5 through bolts 53 in a threaded manner; during operation, in the process that a worker strips the tested semiconductor chip along one end of the conductive bag 6 to the other end, the limiting plate 51 which is close to the inner wall of the other end of the conductive bag 6 limits the conductive bag 6, so that after the semiconductor chip of the same model is extruded and guided by the conductive bag 6 outside the limiting plate 51, pins of the semiconductor chip are guided to be broken to a standard angle, the aim of calibrating the pins of the tested semiconductor chip is achieved, and the problem that the pins are bent to influence the subsequent use in the semiconductor measurement process is avoided.
The specific working procedure is as follows:
after packaging the semiconductor chips, a worker transports the semiconductor chips to the periphery of a workbench 3, then cleans the surface of each conductive bag 6, avoids the influence of impurities on the surface of each conductive bag 6 on the conductive effect, erects the semiconductor chips on two inner strip-shaped shells 4, leads on the semiconductor chips to be positioned at the openings of the inner strip-shaped shells 4, after a plurality of semiconductor chips are lapped in the inner strip-shaped shells 4, the semiconductor chips are driven to move downwards through a pedal 7 to drive a corrugated airbag 71 to compress through the pedal 7, the pressure of gas in the corrugated airbag 71 is increased after being pressed, so that the gas can enter the conductive bags 6 along an air pipe 72, the conductive bags 6 can be made of conductive silica gel, or be made of conductive wires through bonding wires on the outer walls of the airbags, the dual purpose of expansion and conduction is met, and the air pressure in the conductive bags 6 can be increased after the gas enters the conductive bags 6, so that the corresponding two conductive bags 6 are mutually close to each other after being expanded, the leads of the semiconductor chips are clamped by the mutually close to each other, and the leads of the semiconductor chips can be simultaneously tested by the two conductive bags 6, namely, the semiconductor chips can be applied for different semiconductor chips have different requirements, and the different semiconductor chips can be tested, and the different semiconductor chips have different requirements can be tested; the vertical inclination angles of the pins are different, the conductive bags 6 can be attached as much as possible, then the controller is started to control the test module 2 to electrify the semiconductor chips and detect the electrical property, then the test result is sent to the display device 1 to be displayed, the display device 1 also displays the position of the unqualified semiconductor chips, a worker picks out the unqualified semiconductor chips, then releases the feet of the trampling slide plate 7, the corrugated bags 71 are made of rubber materials, so that the worker has the capability of resetting, in order to improve the resetting effect, a reset spring 73 can be arranged between the slide plate 7 and the inner wall of the corrugated bags 71, the corrugated bags 71 can reset themselves after the worker is not stepped on by feet, namely, the slide plate 7 is driven to move upwards, the gas in the conductive bags 6 can be pumped back into the corrugated bags 71 through the gas pipe 72 in the resetting process, so that the conductive bags 6 are changed into a flat state from the original expansion state, the two conductive bags 6 attached to be separated to form a gap after being dried, and the worker can take off one end of the qualified semiconductor chips from the conductive bags 6 to the inner side of the semiconductor chips along the flat side of the flat plate, and then the semiconductor chips are packaged into the edge of the semiconductor frame 3, and the test is completed;
before testing a semiconductor chip with larger distance difference between some pins, the controller is used for controlling the motor 44 to rotate, the rotating motor 44 drives the screw 43 to rotate, and the rotating screw 43 drives the two sliding blocks 41 to move away from or close to each other and slide at the upper end of the workbench 3, so that each sliding block 41 drives the inner strip-shaped shell 4 and the outer strip-shaped shell 5 which are connected with each sliding block to move, and the distance between two positions where the pins are inserted is changed; after the packaging test of a group of semiconductor chips is finished, the sliding plate 7 is continuously stepped on, so that the sliding plate 7 presses residual gas in the corrugated air bag 71 into the conductive air bag 6 through the air pipe 72, the air pressure in the conductive air bag 6 is further increased, the upper covers 46 are turned around the upper end edge of one face of the shell 45 by overcoming the torsion force of the torsion springs 47, the two upper covers 46 jack up the semiconductor chips after being turned in opposite directions, and a gap is reserved for the operation of the semiconductor chips by workers, so that the adjustment and the taking of the semiconductor chips by the workers are facilitated; after the upper covers 46 jack up the semiconductor chips, the semiconductor chips are inclined back and forth in a regular shape after being lapped on the two upper covers 46 due to the fact that the edges of the upper covers 46 are corrugated, so that the adjacent semiconductor chips form a height difference, and further, the semiconductor chips which are unqualified are selected by workers, the selecting time is saved, and the working efficiency is improved; in the process that a worker releases the slide plate 7, the corrugated air bag 71 is matched with the reset spring 73 in the interior of the corrugated air bag 71, so that the corrugated air bag 71 is quickly stretched from a flattened state; in the process of jacking the semiconductor chip by the upper cover 46, the conductive bag 6 is in a clamping state to enable the pins of the semiconductor chip to generate relative friction with the conductive bag 6, meanwhile, as polishing particles 63 are embedded on the outer surface of the conductive bag 6, the polishing particles 63 on the conductive bag 6 polish the pins, and in the process of rolling down the semiconductor chip from the upper cover 46 by staff, the semiconductor chip is in a corrugated design at the edge of the upper cover 46, so that the pins can move horizontally and simultaneously can move up and down, and the polishing particles 63 on the conductive bag 6 polish the pins in all directions; when a worker steps on the sliding plate 7, the return spring 73 can be extruded to finish storing force in the downward movement process of the sliding plate 7, meanwhile, after the conductive bag 6 is expanded, the elastic rope 64 can be stretched, and after the foot of the worker moves away from the sliding plate 7, the return spring 73 can be quickly restored, so that the sliding plate 7 is driven to quickly rise, the corrugated air bag 71 is quickly stretched and restored, the elastic rope 64 can flatten the conductive bag 6 under the action of tension, and gas in the conductive bag 6 is quickly transferred into the corrugated air bag 71 through the gas pipe 72; the corrugated sleeve 74 is extruded in the upward movement process of the sliding plate 7 driven by the return spring 73, the air pressure in the corrugated sleeve 74 is increased in the volume reduction process of the corrugated sleeve 74 due to the unchanged air quantity, the increased air pressure is expanded to one end of the air hole 32 and released, so that the air is sprayed out through one end of the air hole 32, and the two opposite conductive bags 6 and the gap between the two opposite conductive bags are impacted, so that impurities are washed away; in the process that a worker strips the tested semiconductor chip along one end of the conductive bag 6 to the other end, the limiting plate 51 which is close to the inner wall of the other end of the conductive bag 6 limits the conductive bag 6, so that after the semiconductor chips of the same model are extruded and guided by the conductive bag 6 outside the limiting plate 51, pins of the semiconductor chips are guided and pulled to a standard angle.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in fig. 1, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present invention, and furthermore, the terms "first", "second", "third", etc. are merely used for distinguishing the description, and should not be construed as indicating or implying relative importance.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A semiconductor chip integrated package testing apparatus, comprising:
a display device (1); the display device (1) is used for displaying semiconductor chip test parameters;
a test module (2); the test module (2) is used for testing the semiconductor chip;
a controller; the controller is used for controlling the automatic operation of the invention;
the semiconductor chip integrated package testing device is characterized by further comprising
A work table (3); the workbench (3) is fixedly connected to the ground through support legs (31), and the workbench (3) is used for bearing the display device (1);
an inner strip-shaped case (4); the inner strip-shaped shells (4) are arranged on the workbench (3) in parallel, and one surface, away from each other, of each inner strip-shaped shell (4) is an opening;
an outer strip-shaped case (5); the outer strip-shaped shells (5) are arranged on the workbench (3) in parallel; the outer strip-shaped shells (5) are positioned on two sides of the inner strip-shaped shell (4) and are parallel to the inner strip-shaped shell (4); one surface of the outer strip-shaped shell (5) close to each other is an opening;
a conductive capsule (6); the conductive bag (6) is strip-shaped, and the conductive bag (6) is fixedly connected in the inner strip-shaped shell (4) and the outer strip-shaped shell (5); wherein one pair of adjacent conductive bags (6) is connected with the test module (2) through a first wire, and the other pair of adjacent conductive bags (6) is connected with the test module (2) through a second wire;
a slide plate (7); the sliding plate (7) is connected to the supporting leg (31) in a sliding and sealing manner;
a bellows airbag (71); the corrugated air bag (71) is sleeved on the supporting leg (31); the corrugated air bag (71) is fixedly connected to the lower end of the sliding plate (7);
a trachea (72); one end of the air pipe (72) is fixedly connected and communicated with the inside of the corrugated air bag (71), and the other end of the air pipe is communicated with the inside of the conductive air bag (6).
2. A semiconductor chip integrated package testing apparatus according to claim 1, wherein: one end of the adjacent inner strip-shaped shell (4) is connected with one end of the outer strip-shaped shell (5) through a sliding block (41); the upper surface of the workbench (3) is fixedly connected with supporting blocks (42) at two sides of the outer strip-shaped shell (5); a screw rod (43) is rotatably connected between the two supporting blocks (42); threads at two ends of the screw rod (43) are oppositely arranged; both ends of the screw rod (43) are in threaded transmission connection with the sliding block (41); the sliding block (41) is in sliding connection with the workbench (3); a motor (44) is fixedly connected to the workbench (3); the output shaft of the motor (44) is fixedly connected with one end of the screw rod (43).
3. A semiconductor chip integrated package testing apparatus according to claim 2, wherein: the inner strip-shaped shell (4) comprises a shell (45) and an upper cover (46); the upper end of the shell (45) is also provided with an opening; the upper ends of the surfaces of the two shells (45) close to each other are hinged with corresponding upper covers (46) through torsion springs (47).
4. A semiconductor chip integrated package testing apparatus according to claim 3, wherein: the edge of the upper cover (46) far away from the torsion spring (47) is corrugated.
5. The semiconductor chip integrated package testing apparatus according to claim 4, wherein: the surface of the conductive bag (6) contacted with the polishing particles (63) is embedded.
6. A semiconductor chip integrated package testing apparatus according to claim 1, wherein: a return spring (73) is arranged in the corrugated air bag (71); one end of the return spring (73) is connected with the lower end of the sliding plate (7), and the other end of the return spring is connected with the bottom of the corrugated air bag (71); the inner walls of the conductive bags (6) are connected through elastic ropes (64).
7. The semiconductor chip integrated package testing apparatus according to claim 6, wherein: the upper end of the sliding plate (7) is fixedly connected with a corrugated sleeve (74) in a sealing way; the corrugated sleeve (74) is sleeved around the support leg (31); one end of the corrugated sleeve (74) is connected with the lower end of the workbench (3) in a sealing way; an air hole (32) is formed in the workbench (3); one end of the air hole (32) is positioned between the gaps of the two corresponding conductive bags (6), and the other end of the air hole is communicated with the inside of the corrugated sleeve (74).
8. A semiconductor chip integrated package testing apparatus according to claim 1, wherein: the inner sides of one ends of the inner strip-shaped shell (4) and the outer strip-shaped shell (5) are rotationally connected with a limiting plate (51); an eccentric disc (52) is arranged on the inner side of the limiting plate (51), and the eccentric disc (52) is connected to the shell walls of the inner strip-shaped shell (4) and the outer strip-shaped shell (5) through bolts (53) in a threaded mode.
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| CN202211076803.6A CN115389913B (en) | 2022-09-05 | 2022-09-05 | Semiconductor chip integrated package testing device |
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| CN202211076803.6A CN115389913B (en) | 2022-09-05 | 2022-09-05 | Semiconductor chip integrated package testing device |
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| CN115389913B true CN115389913B (en) | 2023-07-07 |
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| CN115389913A (en) | 2022-11-25 |
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