CN115342901B - Piezoelectric device and preparation method thereof - Google Patents
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Abstract
The application belongs to the technical field of underwater acoustic measurement and semiconductor devices, and provides a piezoelectric device and a preparation method thereof, wherein the piezoelectric device comprises a first piezoelectric module, a second piezoelectric module and a conductive flat plate; the first piezoelectric module includes a first array with a first substrate, the first array including a plurality of first piezoelectric posts having a first height; the second piezoelectric module includes a second array with a second substrate, the second array including a plurality of second piezoelectric posts having a second height; the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate. The piezoelectric device provided by the application adopts the oppositely stacked piezoelectric column array, can comprehensively improve the sensitivity of the piezoelectric device under the condition of keeping the section size of the piezoelectric device unchanged, and is favorable for identifying extremely weak underwater acoustic signals.
Description
Technical Field
The application belongs to the technical field of underwater acoustic measurement and semiconductor devices, and particularly provides a piezoelectric device and a preparation method thereof.
Background
The underwater acoustic transducer converts underwater acoustic signals and electric signals into each other through a piezoelectric effect, and is a key device in the field of underwater acoustic signal processing. The key to improve the performance of the underwater acoustic transducer is to improve the performance of the piezoelectric device (also referred to as a piezoelectric vibrator, a sensitive element) used in the underwater acoustic transducer, for example, current research on improving the performance of the medium-high frequency receiving underwater acoustic transducer (hydrophone) mainly focuses on improving the receiving sensitivity of the transducer, that is, by improving the electromechanical conversion efficiency of the transducer, the receiving sensitivity is improved, so as to enhance the capability of the transducer for receiving weak signals and increase the detection range.
The prior art improves the receiving sensitivity of the transducer mainly by improving the electromechanical conversion efficiency of the transducer. For example, the currently common type 1-3 piezoelectric composite material changes the vibration mode of the material by converting the thickness vibration of a whole piezoelectric material into the longitudinal stretching vibration of a plurality of piezoelectric pillars, thereby improving the performance. By cutting single-phase piezoelectric material into piezoelectric pillar array, the thickness of the whole piezoelectric material vibrates (electromechanical coupling coefficient)
About 0.5) will be converted into a longitudinal length stretching vibration (electromechanical coupling coefficient @) of the piezoelectric pillar array>
About 0.7), the electromechanical coupling coefficient of the 1-3 type piezoelectric composite material equivalent thickness can be improved by about 20 percent compared with the electromechanical coupling coefficient of the pure piezoelectric material thickness by changing the vibration mode of the material. However, the composite material still has thickness vibration as a whole due to the flexible polymer material filled between the piezoelectric pillars, and the use of the composite material increases loss.
The above-mentioned existing technical solutions for increasing the sensitivity of the transducer still have a large room for improvement: on one hand, different influences on the electromechanical coupling coefficient caused by different shapes, sizes and arrangement modes of the piezoelectric pillars need to be deeply researched and an optimal parameter combination needs to be selected, and on the other hand, on the basis of optimizing the piezoelectric pillar array, the overall structure of the piezoelectric device needs to be further improved, so that the effective electromechanical coupling coefficient can be sufficiently improved, a synergistic effect is generated with the optimized piezoelectric pillar parameters, and the performance of the piezoelectric device is further improved.
Disclosure of Invention
In order to solve the above problems in the prior art, an object of the present invention is to provide a piezoelectric device for an underwater acoustic transducer having an ideal effective electromechanical coupling coefficient and high sensitivity, and a method for manufacturing the same.
A first aspect of the present application provides a piezoelectric device, including a first piezoelectric module, a second piezoelectric module, and a conductive plate; the first piezoelectric module includes a first array with a first substrate, the first array including a plurality of first piezoelectric posts having a first height; the second piezoelectric module includes a second array with a second substrate, the second array including a plurality of second piezoelectric posts having a second height; the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate.
Preferably, each first piezoelectric column has a square cross section with a first side length, and a ratio of the first height to the first side length is greater than or equal to 5; the cross section of each second piezoelectric column is a square with a second side length, and the ratio of the second height to the second side length is greater than or equal to 5.
Preferably, the ratio of the array period of the first array to the first side length is 1.3-1.5; the ratio of the array period of the second array to the second side length is 1.3-1.5.
Preferably, the first height is equal to the second height and the first array and the second array are mirror symmetric with respect to the conductive plate; the thickness of the first substrate is the same as that of the second substrate, and the first substrate and the second substrate are in mirror symmetry relative to the conductive flat plate.
Optionally, the piezoelectric materials used by the first piezoelectric module and the second piezoelectric module are piezoelectric ceramics and/or piezoelectric crystals.
The conductive flat plate is made of a metal plate with Young modulus more than or equal to 9 multiplied by 10^10Pa and thickness of 0.18 mm-0.3 mm.
Preferably, the gaps of the first piezoelectric columns are filled with air, and the gaps of the second piezoelectric columns are filled with air.
A second aspect of the present application provides a method of manufacturing a piezoelectric device, for manufacturing the above piezoelectric device, including the steps of:
determining piezoelectric device parameters satisfying an electromechanical coupling performance criterion, the piezoelectric device parameters including cross-sectional dimensions of the first and second piezoelectric pillars, the first and second heights, and a period of the first and second arrays;
cutting a sheet-shaped piezoelectric material according to the parameters of the piezoelectric device to form a first piezoelectric module and a second piezoelectric module;
and fixing the end surfaces of the first array and the second array to two surfaces of the conductive flat plate in an opposite mode.
The technical scheme provided by the embodiment of the application at least has the following beneficial effects:
firstly, the novel opposite stacked piezoelectric device structure is adopted, the structure can accommodate two piezoelectric modules which are connected in parallel in the same section size as a single piezoelectric module, and the stacked structure of the piezoelectric modules can amplify the current value of an electric signal obtained by converting an acoustic signal in a multiplying mode under the condition that the section size of the piezoelectric device is not changed, so that the sensitivity of the piezoelectric device is effectively improved, and the identification of a very weak underwater acoustic signal is facilitated;
secondly, by adopting a piezoelectric device structure which is oppositely stacked and amplifies current in parallel, the effective electromechanical coupling coefficient can be further improved relative to a single piezoelectric module or a plurality of piezoelectric module structures which are connected in series;
in addition, the piezoelectric device structure provided by the application integrally prolongs the longitudinal length of the piezoelectric column under the condition that the transverse size of the piezoelectric column is not changed, and the piezoelectric column in a single piezoelectric module is not required to be designed to be too thin, so that the anti-crack or anti-fracture capability of the piezoelectric column is ensured on the basis of improving the longitudinal telescopic performance of the piezoelectric column, and the overall performance of the piezoelectric device is further improved.
Drawings
Fig. 1a is a front view of a piezoelectric device according to an embodiment of the present application;
FIG. 1b is a side view of a piezoelectric device according to an embodiment of the present application;
FIG. 1c is an exploded view of a piezoelectric device according to an embodiment of the present application;
FIG. 2a is a front view of a first piezoelectric module according to an embodiment of the present application;
FIG. 2b is a top view of a first piezoelectric module according to an embodiment of the present application;
FIG. 2c is a side view of a first piezoelectric module according to an embodiment of the present application;
FIG. 3a is a schematic diagram of a piezoelectric cylinder made of pure piezoelectric material;
FIG. 3b is a schematic view of a piezoelectric cylinder made of type 1-3 piezoelectric composite material;
FIG. 3c is a schematic view of a piezoelectric cylinder made of a 1-3-2 type piezoelectric composite material;
FIG. 3d is a schematic diagram of a piezoelectric cylinder made of 2-1-2 type piezoelectric sensitive material;
FIG. 3e is a schematic diagram of a piezoelectric cylinder made of piezoelectric sensitive materials in an opposite stacked structure;
fig. 4 is a longitudinal vibration characteristic of a piezoelectric cylinder in an oppositely stacked piezoelectric device structure according to an embodiment of the present application;
fig. 5 is a schematic diagram of main steps of manufacturing a piezoelectric device according to an embodiment of the present application;
fig. 6 is an exploded view of an underwater acoustic transducer manufactured using a piezoelectric device of an embodiment of the present application;
fig. 7a is a pictorial view of a first step of manufacturing a piezoelectric device according to embodiment 1 of the present application;
fig. 7b is a substance diagram of a second step of manufacturing a piezoelectric device according to embodiment 1 of the present application;
fig. 7c is a substance diagram of a third step of manufacturing a piezoelectric device according to embodiment 1 of the present application;
fig. 8a is a result of an admittance in air test of an underwater acoustic transducer manufactured using the piezoelectric device of embodiment 1 of the present application and an underwater acoustic transducer manufactured using a piezoelectric sensitive material of type 2-1-2;
fig. 8b is a result of underwater admittance testing of an underwater acoustic transducer manufactured by a piezoelectric device according to embodiment 1 of the present application and an underwater acoustic transducer manufactured by using a piezoelectric sensitive material of type 2-1-2;
fig. 9 shows the results of the reception sensitivity test of the underwater acoustic transducer manufactured by the piezoelectric device according to embodiment 1 of the present application and the underwater acoustic transducer manufactured by using the piezoelectric sensitive material of type 2-1-2.
Reference numerals in the figures
100: first piezoelectric module, 110: first piezoelectric column, 120: first substrate, 200: second piezoelectric module, 210: second piezoelectric column, 220: second substrate, 300: conductive flat plate, 400: sealing layer, 500: a housing, 600: a metal cover.
Detailed Description
Hereinafter, the present application will be further described based on preferred embodiments with reference to the accompanying drawings.
In addition, various components on the drawings are enlarged or reduced for convenience of understanding, but this is not intended to limit the scope of the present application.
Singular references also include plural references and vice versa.
In the description of the embodiments of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which is usually arranged when the products of the embodiments of the present application are used, the description is only for convenience and simplicity, but the indication or suggestion that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, the application cannot be construed as being limited. Furthermore, the terms first, second, etc. may be used herein to distinguish between various elements, but these should not be limited by the order of manufacture or by importance to indicate or imply relative importance, and their names may differ from the descriptions and claims provided herein.
The terminology used in the description is for the purpose of describing the embodiments of the application and is not intended to be limiting of the application. It is also to be understood that, unless otherwise expressly stated or limited, the terms "disposed," "connected," and "connected" are intended to be open-ended, i.e., may be fixedly connected, detachably connected, or integrally connected; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present application will be specifically understood by those skilled in the art.
The piezoelectric device has ideal effective electromechanical coupling coefficient and high receiving sensitivity, can be applied to an underwater acoustic transducer, and realizes the mutual conversion of acoustic signals and electric signals through piezoelectric effect.
Fig. 1a illustrates a front view, fig. 1b is a side view, and fig. 1c is an exploded view of a piezoelectric device provided according to some embodiments of the present application. As shown in fig. 1a to 3c, the piezoelectric device according to the embodiment of the present disclosure includes a first piezoelectric module 100, a second piezoelectric module 200, and a conductive plate 300.
Wherein the first piezoelectric module 100 comprises a first array with a first substrate 120, the first array comprising a plurality of first piezoelectric pillars 110 having a first height; similarly, the second piezoelectric module 200 includes a second array with a second substrate 220, the second array including a plurality of second piezoelectric columns 210 having a second height.
Fig. 2a to 2c respectively show a front view, a top view and a side view of the structure of the first piezoelectric module 100, and as shown in fig. 2a and 2c, the first array of the first piezoelectric module 100 includes a plurality of first piezoelectric pillars 110 periodically arranged on the first substrate 120 along the X, Y direction, wherein each of the first piezoelectric pillars 110 has the same height
(i.e., the end faces of the first array are in the same plane), the first substrate 120 has a thickness ≧ greater than or equal to>
。
The second piezoelectric module 200 has a similar structure to the first piezoelectric module 100, and accordingly, each of the second piezoelectric columns 210 has the same height
And the second base 220 has a thickness ≧>
。
The piezoelectric material used in the first piezoelectric module 100 and the second piezoelectric module 200 is piezoelectric ceramic or piezoelectric crystal, and in the embodiment of the present application, the first piezoelectric module 100 may be polarized to have a thickness of
Piezoelectric ceramic plate or piezoelectric crystal plate for/in>
Vertically cutting for cutting depth; likewise, the second piezo module 200 may be activated by polarizing a thickness ≧ or @>
Piezoelectric ceramic sheet or piezoelectricCrystal plate and
vertically cutting for cutting depth; when the first piezoelectric module 100 and the second piezoelectric module 200 are diced, the cutting direction is set so that the first base 120 of the first piezoelectric module 100 and the second base 220 of the second piezoelectric module 200 obtained by dicing have the same electrical polarity.
In the embodiments shown in fig. 1a to 1c and fig. 2a to 2c, the cross-sectional shapes of the first substrate 120 and the second substrate 220 are square, and in other alternative embodiments, a person skilled in the art may modify the cross-sectional shapes of the first substrate 120 and the second substrate 220 according to design requirements, for example, the cross-sectional shapes are rectangular, circular, rectangular ring or circular ring, etc.
Returning to fig. 1a to 1c, as shown in fig. 1a to 1c, in the embodiment of the present application, the first piezoelectric module 100 and the second piezoelectric module 200 are fixedly connected by the conductive plate 300, specifically, the connection manner is as follows: the end face of the first array is opposite to the end face of the second array, and is fixedly connected to two side faces of the conductive flat plate 300 by means of conductive adhesive or the like. In the first piezoelectric module 100, the conductive plate 300, and the second piezoelectric module 200, which are fixedly connected to each other, the first substrate 120 and the second substrate 220 have the same electrical polarity, and the end surface of the first array, the end surface of the second array, and the conductive plate 300 have the same electrical polarity.
In this embodiment, the first piezoelectric module 100, the second piezoelectric module 200 and the conductive plate 300 connecting the two piezoelectric modules, which are oppositely arranged in the same electrical polarity mirror image, form a novel opposite stacked piezoelectric device structure, which contains two piezoelectric modules connected in parallel in the same cross-sectional dimension as a single piezoelectric module, and by using the stacked structure of the piezoelectric modules, the current value of the electrical signal obtained by converting the acoustic signal can be amplified in multiples under the condition of keeping the cross-sectional dimension of the piezoelectric device unchanged, so that the sensitivity of the piezoelectric device is effectively improved, and the identification of the very weak acoustic signal is facilitated.
In addition, the piezoelectric device structure stacked oppositely and used for amplifying current in parallel can further improve the effective electromechanical coupling coefficient compared with a single piezoelectric module or a plurality of piezoelectric module structures connected in series. The mechanism by which the effective electromechanical coupling coefficient is improved is described in detail below.
When the performance of the transducer is measured or evaluated, in addition to describing the comprehensive performance of the piezoelectric material by representing the intensity of the piezoelectric effect and the reverse piezoelectric effect energy conversion performance of the piezoelectric material through the electromechanical coupling coefficient, the electromechanical conversion performance of the material can be intuitively described by introducing the effective electromechanical coupling coefficient.
Effective electromechanical coupling coefficient
The piezoelectric device is the most commonly used parameter for measuring the conversion performance of a sensitive element at resonance, and generally, the piezoelectric device with a high effective electromechanical coupling coefficient value has higher receiving sensitivity. The value of the effective electromechanical coupling coefficient is not only related to the vibration mode, but also related to the material and the dimensional parameters thereof, and represents the ratio of the stored energy to the total stored energy of the lossless and unloaded material at resonance, and the calculation formula is shown as the following formula:
in the above formula, the first and second carbon atoms are,
is its anti-resonant frequency.
Based on the analogy principle of electromechanical equivalence, the vibration velocity in an acoustic system can be equivalent to the current in a circuit. Therefore, the larger the current, the larger the vibration velocity at the resonance frequency, that is, the higher the effective electromechanical coupling coefficient for the same sound pressure, the higher the receiving sensitivity.
The current amplifying method and device provided by the embodiment of the application are oppositely stacked and connected in parallelThe piezoelectric device structure can amplify the current of the electric signal in a multiplying power mode in the sound-electricity conversion process, and can improve the vibration speed of the piezoelectric material at the resonant frequency under the condition that other conditions are not changed, so that the piezoelectric component at the resonant frequency is further enabled
The value is effectively improved, so that the sound-electricity conversion performance of the piezoelectric device at the resonant frequency is further improved on the basis of increasing the current to improve the overall sensitivity of the piezoelectric device, and the optimization of the comprehensive performance index of the piezoelectric device is realized.
In order to verify the effect of the opposite stacking structure provided by the application on the improvement of the effective electromechanical coupling coefficient, the effective electromechanical coupling coefficients corresponding to different piezoelectric cylinder structures are respectively calculated. Fig. 3a to 3e respectively show schematic diagrams of piezoelectric cylinders made of different piezoelectric materials, wherein fig. 3a shows a piezoelectric cylinder made of a pure piezoelectric material, fig. 3b shows a piezoelectric cylinder made of a 1-3 type piezoelectric composite material, fig. 3c shows a piezoelectric cylinder made of a 1-3-2 type piezoelectric composite material, fig. 3d shows a piezoelectric cylinder made of a 2-1-2 type piezoelectric sensitive material, fig. 3e shows a piezoelectric cylinder made of a piezoelectric sensitive material of the present application in an opposite stacking structure, in order to keep consistency of variables, the transverse dimension of the piezoelectric cylinder in fig. 3a, the overall transverse dimension of the structure of the piezoelectric cylinder in fig. 3b and 3c are consistent with the transverse dimension of the base of the piezoelectric cylinder in fig. 3d and 3e, and the transverse dimension of the piezoelectric cylinder wrapped by a flexible material in fig. 3b and 3c are consistent with the transverse dimension of the piezoelectric cylinder in fig. 3d and 3 e. In the five device structures, metal plates of the same size and thickness were covered, and in order to obtain effective electromechanical coupling coefficients, the structures were simulated, and the effective electromechanical coupling coefficients were calculated and listed in table 1.
Table 1 comparison of the performances of piezoelectric devices of different structures
As can be seen from table 1, under the same other conditions, the effective electromechanical coupling coefficient of the piezoelectric device structure provided in the embodiment of the present application is the highest, and the comprehensive performance of the piezoelectric device can be significantly improved as a whole by combining the effect of the piezoelectric device structure on improving the weak signal identification capability generated by amplifying the current.
Further, as shown in fig. 2a to 2c, in some preferred embodiments of the present application, each first piezoelectric column 110 has a cross-section with a first side length
And->
. Similarly, in some preferred embodiments, each second piezoelectric column 210 has a cross section in which the length of a side is greater than or equal to a length of a side +>
And->
。
Research shows that by reasonably designing the size parameters of the piezoelectric cylinder, the ratio of the longitudinal length to the cross section size of the piezoelectric cylinder is increased as much as possible (i.e. the overall structure of the piezoelectric cylinder is designed to be in a slender shape as much as possible), and the electromechanical coupling coefficient of the longitudinal stretching vibration mode of the piezoelectric cylinder can be effectively improved, so that the receiving sensitivity is improved.
Fig. 4 shows a finite element analysis of the longitudinal vibration characteristic of a specific piezoelectric cylinder in the oppositely stacked piezoelectric device structure provided by the present application, as shown in fig. 4, the piezoelectric device structure provided by the present application integrally extends the longitudinal length of the piezoelectric cylinder under the condition that the transverse size of the piezoelectric cylinder is not changed, and the piezoelectric cylinder in a single piezoelectric module does not need to be designed to be too thin, so that the anti-crack or fracture capability of the piezoelectric cylinder is ensured on the basis of improving the longitudinal expansion and contraction performance of the piezoelectric cylinder, and the overall performance of the piezoelectric device is further improved.
Further, as shown in FIG. 2a, in the above preferred embodiment, the array period of each first piezoelectric column 110 in the first array is
And->
. Similarly, in some preferred embodiments, each second piezoelectric column 210 in the second array has an array period of +>
And->
。
Further, in some preferred embodiments of the present application, the dimensional parameters of the first piezoelectric module 100 are identical to the dimensional relationships of the second piezoelectric module 200, namely:
is equal to->
And the first array and the second array are mirror symmetric with respect to the conductive plate 300; and->
And the first substrate 120 and the second substrate 220 are mirror-symmetrical with respect to the conductive plate 300.
By disposing the conductive plate 300 between the end faces of the first array and the second array, and disposing the first substrate 120 and the second substrate 220, a stress amplification effect can be achieved to further improve the receiving sensitivity of the transducer. The material of the conductive flat plate 300 may be gold, silver, copper, or other metal having good conductivity, and generally, by reducing the thickness of the conductive flat plate 300, the influence on the longitudinal expansion and contraction vibration of the piezoelectric column due to its mass can be reduced, but the thinner the thickness is not, the better it is because: when the conductive flat plate 300 is too thin, due to insufficient rigidity of the whole conductive flat plate, different regions of the conductive flat plate may deform differently with longitudinal extension and contraction of different conductive columns, thereby affecting the uniformity of array vibration, and therefore, in some preferred embodiments of the present application, the conductive flat plate 300 is made of metal (e.g. brass) with Young's modulus of 9 × 10^10Pa or more and thickness of 0.18mm to 0.3mm, thereby ensuring that the conductive flat plate 300 has a desirable balance between mass and rigidity.
As shown in fig. 1a to 1c and fig. 2a to 2c, in the embodiment of the present application, air is filled between the gaps of each first piezoelectric column 110 and each second piezoelectric column 210. Generally, people are used to prepare 1-3 type and 1-3-2 type piezoelectric composite materials by a cutting-filling method, polymers filled between piezoelectric columns are generally epoxy resin or silicon rubber, and the prepared piezoelectric composite materials enable the piezoelectric materials to be converted from the integral thickness vibration mode to the longitudinal stretching vibration mode of the piezoelectric small column array, so that the electromechanical coupling coefficient is improved. But due to the addition of the polymer, the loss is increased, and the electromechanical coupling coefficient is reduced. In the application, the air is used for replacing polymers to fill gaps of the piezoelectric columns, so that the longitudinal vibration behavior of the piezoelectric columns can be fully highlighted, the thickness vibration of the piezoelectric materials can be reflected to the longitudinal vibration behavior of the array formed by the piezoelectric columns to a greater extent, and the electromechanical coupling coefficient can be improved to the maximum extent.
The present application further provides a method for manufacturing the piezoelectric device, and specifically, the method includes the following steps:
(1) Determining piezoelectric device parameters satisfying an electromechanical coupling performance criterion, the piezoelectric device parameters including cross-sectional dimensions of the first and second piezoelectric pillars, the first and second heights, and a period of the first and second arrays;
(2) Cutting the sheet piezoelectric material according to the parameters of the piezoelectric device to form a first piezoelectric module and a second piezoelectric module;
(3) And fixing the end surfaces of the first array and the second array to two surfaces of the conductive flat plate in an opposite mode.
Fig. 5 schematically provides an implementation flow of further performing the piezoelectric device fabrication after determining the parameters of the piezoelectric device, and as shown in fig. 5, after completing the fabrication of the piezoelectric device, the piezoelectric device may be further integrally packaged by an elastic sealing layer 400 to improve the waterproof sealing performance thereof.
Fig. 6 is an exploded view further showing a constituent structure of an underwater acoustic transducer manufactured using the piezoelectric device of the embodiment of the present application. The underwater acoustic transducer shown in fig. 6 encapsulates the piezoelectric device (the first piezoelectric module 100, the second piezoelectric module 200, and the conductive plate 300 are prepared by the above preparation method), the exterior of the piezoelectric device is sealed by an elastic sealing layer 400, one of two electrode leads of the underwater acoustic transducer is connected to the conductive plate, and the other electrode lead is connected to the first substrate and the second substrate. Further, the piezoelectric device has a waterproof sound-transmitting case 500 outside thereof, and the upper portion thereof is encapsulated by a metal cover 600, thereby completing the manufacture of the underwater acoustic transducer.
Example 1
In this embodiment, the piezoelectric device is prepared according to the above method for preparing a piezoelectric device, and the performance of the prepared piezoelectric device applied to an underwater acoustic transducer is tested.
Specific structural parameters of the piezoelectric device are listed in table 2 below.
TABLE 2 structural parameters of piezoelectric devices
1) Preparation process
Specifically, fig. 7a to 7c show a process for manufacturing a piezoelectric device in this embodiment, in which a piezoelectric ceramic block is taken and cut into a suitable size by using a precision ceramic cutting machine, and further, the piezoelectric ceramic block is cut into a piezoelectric pillar array with a substrate, so as to form a plurality of piezoelectric modules (as shown in fig. 7 a) having identical shape and structure; then, a thin layer of epoxy resin is coated to adhere the flat plate made of the brass material to the upper surface of the piezoelectric column array of one of the piezoelectric modules, and high pressure is applied to cure the flat plate, so that the 2-1-2 type piezoelectric sensitive material is formed (as shown in fig. 7 b); finally, the upper surface of the piezoelectric column array of another piezoelectric module is mirror-symmetrically adhered to the other side of the flat plate and high voltage is applied to cure, thereby forming the piezoelectric device of the present embodiment (as shown in fig. 7 c).
After the preparation of the piezoelectric device is completed, the prepared material can be subjected to sealing treatment and is placed into an independently designed packaging grinding tool, and the prepared polyurethane is poured into the packaging grinding tool for high-temperature curing and cooling demolding, so that the waterproof and sealed piezoelectric device is obtained.
As shown in fig. 7b and 7c, the adhered brass plates need to be slightly larger than the piezoelectric material to leave a place for bonding the lead, and silver paste can be used to compensate for the electrode being forced to be broken by cutting and other experimental processes.
2) Performance testing and comparison
According to a standard test procedure, an underwater acoustic transducer manufactured by using the piezoelectric device of the present embodiment and an underwater acoustic transducer manufactured by using the piezoelectric sensitive material of type 2-1-2 shown in fig. 7b are subjected to an in-air admittance test and an underwater performance test, respectively, wherein the underwater performance test includes an underwater admittance test and a reception sensitivity test.
Fig. 8a shows the results of the in-air admittance test of two underwater acoustic transducers, and fig. 8b shows the results of the underwater admittance test of two underwater acoustic transducers. Fig. 9 shows the reception sensitivity test results of two kinds of underwater acoustic transducers. Wherein the solid line is a test result of the underwater acoustic transducer manufactured using the piezoelectric device of the present embodiment, and the dotted line is a test result of the underwater acoustic transducer manufactured using the type 2-1-2 piezoelectric sensitive material.
Referring to fig. 8b and 9, when the underwater acoustic transducer manufactured by using the piezoelectric device of this embodiment and the underwater acoustic transducer manufactured by using the 2-1-2 type piezoelectric sensitive material operate in water, the resonant frequencies are about 118kHz and 228kHz, the receiving sensitivities are-166 dB and-180 dB, respectively, and both frequencies are in the high frequency range, and the receiving sensitivity (-166 dB) of the underwater acoustic transducer manufactured by using the piezoelectric device of this embodiment is better than that of the underwater acoustic transducer manufactured by using the 2-1-2 type piezoelectric sensitive material alone (-180 dB), and is far better than that of various curved surface, cylindrical and planar underwater acoustic transducers (the receiving sensitivity is less than-200 dB).
While the present invention has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope thereof as defined in the appended claims.
Claims (7)
1. A piezoelectric device, characterized in that:
the piezoelectric module comprises a first piezoelectric module, a second piezoelectric module and a conductive flat plate;
the first piezoelectric module includes a first array with a first substrate, the first array including a plurality of first piezoelectric pillars having a first height;
the second piezoelectric module includes a second array with a second substrate, the second array including a plurality of second piezoelectric posts having a second height;
the electric polarities of the first substrate and the second substrate are the same, and the end faces of the first array and the end faces of the second array are oppositely and fixedly connected to two sides of the conductive flat plate;
the gaps of the first piezoelectric columns are filled with air, and the gaps of the second piezoelectric columns are filled with air.
2. A piezoelectric device according to claim 1, wherein:
the cross section of each first piezoelectric column is a square with a first side length, and the ratio of the first height to the first side length is greater than or equal to 5;
the cross section of each second piezoelectric column is a square with a second side length, and the ratio of the second height to the second side length is greater than or equal to 5.
3. A piezoelectric device according to claim 2, wherein:
the ratio of the array period of the first array to the first side length is 1.3-1.5;
the ratio of the array period of the second array to the second side length is 1.3-1.5.
4. A piezoelectric device according to claim 1, wherein:
the first height is equal to the second height and the first array and the second array are mirror symmetric with respect to the conductive plate;
the thickness of the first substrate is the same as that of the second substrate, and the first substrate and the second substrate are in mirror symmetry relative to the conductive flat plate.
5. A piezoelectric device according to claim 1, wherein:
the piezoelectric materials adopted by the first piezoelectric module and the second piezoelectric module are piezoelectric ceramics and/or piezoelectric crystals.
6. A piezoelectric device according to claim 1, wherein:
the conductive flat plate is made of a metal plate with Young modulus more than or equal to 9 multiplied by 10^10Pa and thickness of 0.18 mm-0.3 mm.
7. A method of manufacturing a piezoelectric device, for manufacturing a piezoelectric device according to claim 1, comprising the steps of:
determining piezoelectric device parameters satisfying an electromechanical coupling performance criterion, the piezoelectric device parameters including cross-sectional dimensions of the first and second piezoelectric pillars, the first and second heights, and a period of the first and second arrays;
cutting a sheet-shaped piezoelectric material according to the parameters of the piezoelectric device to form a first piezoelectric module and a second piezoelectric module;
and fixing the end surfaces of the first array and the second array to two surfaces of the conductive flat plate in an opposite mode.
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