CN115327711A - ONT optical module based on COB packaging - Google Patents
ONT optical module based on COB packaging Download PDFInfo
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- CN115327711A CN115327711A CN202210770320.XA CN202210770320A CN115327711A CN 115327711 A CN115327711 A CN 115327711A CN 202210770320 A CN202210770320 A CN 202210770320A CN 115327711 A CN115327711 A CN 115327711A
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- optical
- port
- fiber array
- light
- light receiving
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- 230000003287 optical effect Effects 0.000 title claims abstract description 98
- 238000004806 packaging method and process Methods 0.000 title abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 34
- 239000010703 silicon Substances 0.000 claims abstract description 34
- 239000013307 optical fiber Substances 0.000 claims abstract description 32
- 230000007704 transition Effects 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 abstract description 13
- 238000010168 coupling process Methods 0.000 abstract description 13
- 238000005859 coupling reaction Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 6
- 239000000835 fiber Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication, and provides an ONT (optical network terminal) optical module based on COB (chip on board) packaging, which comprises an optical receiving component, an optical transmitting component, an optical port and an optical fiber array, wherein one port of the optical fiber array is used as the optical port, and the other two ports are respectively coupled with the optical receiving component and the optical transmitting component. According to the ONT optical module based on COB packaging, the optical fiber array is connected with the light emitting assembly, the optical port and the light receiving assembly which are independent, only one-time coupling is needed, and the coupling is not carried out successively, so that the optical module can be carried out synchronously, and the production efficiency is improved; through COB packaged silicon optical chip, multi-wavelength signal transmission can be realized.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an ONT optical module based on COB packaging.
Background
The PON network is an access network, and is applied to a network in which optical distribution networks composed of a passive optical cable, an optical splitter/combiner, and the like are connected between a local end device (OLT) and a plurality of customer premise devices (ONU/ONTs). The ONT is used as a main component of an access network for a large number of applications in data, multimedia and integrated service requirements, and the demand is increasing. The traditional 10G ONT adopts a BOSA packaging structure which cannot be compatible with multi-wavelength signal transmission. In the process, the coupling mode of the BOSA is to perform coupling of the transmitting component first and then to perform coupling of the receiving component, which cannot be performed synchronously, and thus, the production efficiency is low.
Disclosure of Invention
The invention aims to provide an ONT optical module based on COB packaging, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: the utility model provides a ONT optical module based on COB encapsulation, includes optical receiving component, optical transmission component, optical port and fiber array, one of them port of fiber array is as the optical port, and optical receiving component and optical transmission component are coupled respectively to two other ports.
Further, the light receiving assembly, the light emitting assembly, the light port and the optical fiber array are located in the same plane.
Further, the light port and the light emitting component are not on the same axis, and the light port and the light emitting component are arranged side by side.
Further, the light port and the light emitting component are arranged in parallel at intervals.
Further, the light receiving assembly is located on a side of the optical fiber array away from the light port.
Further, the light receiving component includes a silicon optical chip in which a PD and a WDM are integrated.
Further, the light receiving assembly further comprises a TEC, and the silicon optical chip is arranged on the TEC.
Further, the light receiving assembly further comprises a thermistor and a transition block which are arranged on the TEC, and the transition block is positioned on one side of the silicon optical chip.
Furthermore, a pressing block is arranged on the silicon optical chip and used for connecting the optical fiber array with the silicon optical chip.
Further, the light receiving assembly is covered with a cover.
Compared with the prior art, the invention has the beneficial effects that:
1. the optical fiber array is connected with the light emitting component, the light port and the light receiving component which independently exist, only one-time coupling is needed, and the coupling is not sequential, so that the coupling can be synchronously carried out, and the production efficiency is improved.
2. Through COB packaged silicon optical chip, multi-wavelength signal transmission can be realized.
Drawings
Fig. 1 is a schematic diagram (with an upper cover removed) of an ONT optical module based on COB package according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an optical receiving assembly of a COB package-based ONT optical module according to an embodiment of the present invention;
in the reference symbols: 1-a light emitting component; 2-a light receiving component; 3-a light port; 4-an optical fiber array; 5-a silicon optical chip; 6-TEC; 7-a thermistor; 8-a transition block; 9-briquetting; 10-TIA; 11-a cover; 12-PCB board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1 and fig. 2, an embodiment of the invention provides an ONT optical module based on COB package, including an optical receiving module 2, an optical transmitting module 1, an optical port 3, and an optical fiber array 4, where one port of the optical fiber array 4 is used as the optical port 3, and the other two ports are respectively coupled to the optical receiving module 2 and the optical transmitting module 1. In this embodiment, the optical fiber array 4 is connected to the light emitting module 1, the light port 3 and the light receiving module 2 which are independent, only one-time coupling is needed, and the coupling is not sequential, so that the coupling can be performed synchronously, and the production efficiency is improved. Specifically, through setting up fiber array 4 on the circuit board, couple together light emission component 1 and light receiving component 2 through fiber array 4 and carry out optical signal's input and output, then carry out the electric mouth through the golden finger and connect, PCB board 12 controls the transmission of electric signal, and then realizes photoelectric signal's transmission and conversion. The traditional 10G ONT adopts a BOSA packaging structure, and the structure needs to be coupled twice, which is divided into two parts, so that the two parts cannot be synchronously performed, and the production efficiency is reduced.
The following are specific examples:
in order to optimize the above scheme, referring to fig. 1 and fig. 2, the light receiving module 2, the light emitting module 1, the light port 3, and the optical fiber array 4 are located on the same plane, and the light port 3 and the light emitting module 1 are not located on the same axis, and the light port 3 and the light emitting module 1 are arranged side by side. The light port 3 and the light emitting component 1 are arranged in parallel at intervals. In this embodiment, the light receiving module 2, the light emitting module 1, the optical port 3 and the optical fiber array 4 are all designed in the same plane by COB packaging, and do not share an optical center, which can improve the production efficiency compared with the existing coaxial packaging. The optical transmission component 1, the optical port 3 and the optical receiving component 2 of the embodiment are all independent, the optical transmission component 1 and the optical receiving component 2 are not coaxially arranged, so that the structure can be coupled in place at one time, the optical transmission component 1 and the optical receiving component 2 can be synchronously carried out, the two do not interfere with each other, and the production efficiency is greatly improved.
As an optimized solution of the embodiment of the present invention, please refer to fig. 1 and fig. 2, the light receiving assembly 2 is located on a side of the optical fiber array 4 away from the light port 3. In this embodiment, the light receiving module 2 is disposed on a side of the optical fiber array 4 away from the optical port 3, which facilitates the layout of the optical fiber array 4 on the PCB 12, and facilitates the connection of the optical fiber array 4 with the light receiving module 2 and the optical port 3, respectively.
Referring to fig. 1 and 2 as an optimized solution of the embodiment of the present invention, the light receiving module 2 includes a silicon optical chip 5, and a PD (detector) and a WDM (wavelength division multiplexer) are integrated in the silicon optical chip 5. In the present embodiment, the light receiving module 2 may include a silicon optical chip 5, and the silicon optical chip 5 integrates the PD and the WDM to have functions of the PD and the WDM. And because the light receiving component 2, the light emitting component 1, the light port 3 and the optical fiber array 4 are located in the same plane, the silicon optical chip 5 can be adopted, and the silicon optical chip 5 cannot be adopted in the conventional coaxial arrangement. In the embodiment, the silicon optical chip 5 is used for integrating the PD and the WDM, so that the silicon optical chip can have multiple wavelength choices, and the conventional coaxial arrangement can only have one wavelength choice, because the silicon optical chip 5 integrates the WDM, the silicon optical chip can have the filtering capability.
As an optimization scheme of the embodiment of the present invention, referring to fig. 1 and fig. 2, the light receiving component 2 further includes a TEC6, and the silicon optical chip 5 is disposed on the TEC 6. In the present embodiment, by disposing a TEC6 (thermoelectric cooler) below the silicon microchip 5, since there are a plurality of wavelengths to be selected, the TEC6 can stabilize the wavelength and adjust the temperature to meet the required wavelength. Preferably, the light emitting module 1 also includes a TEC, and the light emitting module 1 can also be selected with various wavelengths, and the TEC can stabilize the wavelength and adjust the temperature to meet the required wavelength.
In order to further optimize the above solution, referring to fig. 1 and fig. 2, the light receiving assembly 2 further includes a thermistor 7 and a transition block 8 disposed on the TEC6, where the transition block 8 is located on one side of the silicon microchip 5. In this embodiment, the thermistor 7 can sense the temperature, and the transition block 8 can lead out the gold wire on the silicon optical chip 5, thereby facilitating the routing.
As an optimization scheme of the embodiment of the present invention, please refer to fig. 1 and fig. 2, a pressing block 9 is disposed on the silicon optical chip 5. And a TIA10 (transimpedance amplifier) is arranged on one side of the silicon optical chip 5, which is far away from the optical fiber array 4. In this embodiment, the pressing block 9 is used to connect the optical fiber array 4 and the silicon optical chip 5, and during operation, the pressing block is firstly adhered to the silicon optical chip 5, and then the optical fiber array 4 is fixed by applying glue to the side points of the pressing block 9 after the coupling is completed.
Referring to fig. 1 and 2, as an optimized solution of the embodiment of the present invention, a cover 11 covers the light receiving module 2. In this embodiment, the cover 11 covers the light receiving module 2 to protect the light receiving module 2. Preferably, the optical fiber array 4 is also within the hood of the hood 11.
The specific packaging process is as follows:
1. the transmitting assembly with refrigeration is packaged according to the performance requirement of the module, and the conventional TOSA coaxial packaging can be adopted; 2. COB packaging is adopted, and the silicon optical chip 5, the TIA10, the transition block 8, the TEC6 and the thermistor 7 are assembled and fixed on the PCBA board by glue according to the patch position and the routing requirement; 3. fixedly connecting the transmitting component on the PCBA; 4. connecting the optical ports 3 of one optical port 3TOSA (transmitter) of the optical fiber array 4 together, starting to couple the optical fiber array 4 with a silicon optical chip 5 and fixing the optical fiber array on a PCBA (printed circuit board assembly) board by glue, wherein the other optical port 3 of the optical fiber array 4 is used for inputting and outputting optical signals of the whole module; 5. and putting the optical device after the coupling into the tube shell and the cover plate to complete the module packaging.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an ONT optical module based on COB encapsulation which characterized in that: the optical fiber array comprises a light receiving component, a light emitting component, optical ports and an optical fiber array, wherein one port of the optical fiber array is used as the optical port, and the other two ports are respectively coupled with the light receiving component and the light emitting component.
2. The COB package-based ONT optical module of claim 1, wherein: the light receiving assembly, the light emitting assembly, the light port and the optical fiber array are located in the same plane.
3. The COB package-based ONT optical module of claim 2, wherein: the light port and the light emitting component are not on the same axis, and the light port and the light emitting component are arranged side by side.
4. The COB package-based ONT optical module of claim 3, wherein: the light port and the light emitting component are arranged in parallel at intervals.
5. The COB package-based ONT optical module of claim 2, wherein: the light receiving assembly is positioned on one side of the optical fiber array far away from the light port.
6. The COB package-based ONT optical module of claim 1, wherein: the light receiving component comprises a silicon optical chip, and the PD and the WDM are integrated in the silicon optical chip.
7. The COB package-based ONT optical module of claim 6, wherein: the light receiving assembly further comprises a TEC, and the silicon optical chip is arranged on the TEC.
8. The COB package-based ONT optical module of claim 7, wherein: the light receiving assembly further comprises a thermistor and a transition block, wherein the thermistor and the transition block are arranged on the TEC, and the transition block is positioned on one side of the silicon optical chip.
9. The COB package-based ONT optical module of claim 6, wherein: and a pressing block is arranged on the silicon optical chip and used for connecting the optical fiber array and the silicon optical chip.
10. The COB package-based ONT optical module of claim 1, wherein: the light receiving assembly is covered with a cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770320.XA CN115327711A (en) | 2022-06-30 | 2022-06-30 | ONT optical module based on COB packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770320.XA CN115327711A (en) | 2022-06-30 | 2022-06-30 | ONT optical module based on COB packaging |
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| Publication Number | Publication Date |
|---|---|
| CN115327711A true CN115327711A (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210770320.XA Pending CN115327711A (en) | 2022-06-30 | 2022-06-30 | ONT optical module based on COB packaging |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN109407230A (en) * | 2018-12-04 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN110474688A (en) * | 2019-08-16 | 2019-11-19 | 武汉光迅信息技术有限公司 | A kind of optical module |
| CN210401753U (en) * | 2019-08-13 | 2020-04-24 | 苏州旭创科技有限公司 | Optical transceiver module and optical module |
| CN111061019A (en) * | 2019-12-02 | 2020-04-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| CN112965183A (en) * | 2021-03-11 | 2021-06-15 | 宁波芯速联光电科技有限公司 | Silicon optical module |
| CN114647037A (en) * | 2020-12-17 | 2022-06-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
-
2022
- 2022-06-30 CN CN202210770320.XA patent/CN115327711A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407230A (en) * | 2018-12-04 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN210401753U (en) * | 2019-08-13 | 2020-04-24 | 苏州旭创科技有限公司 | Optical transceiver module and optical module |
| CN110474688A (en) * | 2019-08-16 | 2019-11-19 | 武汉光迅信息技术有限公司 | A kind of optical module |
| CN111061019A (en) * | 2019-12-02 | 2020-04-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN114647037A (en) * | 2020-12-17 | 2022-06-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| CN112965183A (en) * | 2021-03-11 | 2021-06-15 | 宁波芯速联光电科技有限公司 | Silicon optical module |
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