CN115145329B - Temperature control system and temperature control method for battery piece laser processing - Google Patents
Temperature control system and temperature control method for battery piece laser processing Download PDFInfo
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- CN115145329B CN115145329B CN202110810540.6A CN202110810540A CN115145329B CN 115145329 B CN115145329 B CN 115145329B CN 202110810540 A CN202110810540 A CN 202110810540A CN 115145329 B CN115145329 B CN 115145329B
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- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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Abstract
The invention discloses a temperature control system and a temperature control method for battery piece laser processing, which belong to the technical field of photovoltaic manufacture. The temperature control system and the temperature control method for battery piece laser processing have the advantages of simple system structure, simple control method, strong adjustability and high flexibility, can effectively ensure the reliability of temperature control in the processing process of the processing table module, can meet the application under different use states, ensure the running stability of battery piece laser processing equipment, improve the processing precision and quality of battery piece products, and have better application prospect and popularization value.
Description
Technical Field
The invention belongs to the technical field of photovoltaic manufacturing, and particularly relates to a temperature control system and a temperature control method for battery piece laser processing.
Background
With the continuous development of energy technology in China, the utilization of solar energy is becoming more and more common, and higher requirements are put on the application and the manufacture of solar cells.
In the manufacture of solar cells, laser processing is typically encountered. In the laser processing process of the battery piece, especially in the process of annealing the solar battery by laser to realize light attenuation resistance, the processing quality of the battery piece is closely related to the temperature control of the battery piece in the laser processing process. Therefore, it is generally necessary to provide a temperature control system for the processing table.
At present, most of temperature control systems based on PID algorithm are applied. The PID algorithm is a very classical control algorithm, and is widely applied to some linear process control systems because of the advantages of simple algorithm, good robustness, high reliability and the like. However, for the laser processing of the battery sheet, the temperature control is nonlinear, and the uncertainty is high, which makes it difficult for the conventional temperature control system to meet the accuracy of the temperature control. In addition, most of the temperature control systems have large inertia, i.e. when the temperature control area starts to be heated, the temperature cannot be known to be obviously increased immediately, and likewise, when the heating is stopped, the temperature still has a certain increase. In addition, factors such as the precision of the temperature detection device and the difference of the installation modes can lead to hysteresis of temperature monitoring, which brings great difficulty to temperature control, and leads to insufficient control of laser processing equipment to meet the demands of practical application.
Disclosure of Invention
In response to one or more of the above-mentioned drawbacks or improvements of the prior art, the present invention provides a temperature control system and a temperature control method for laser processing of battery cells, which can effectively achieve
In order to achieve the above object, according to one aspect of the present invention, a temperature control system for laser processing of a battery piece is provided, for controlling a temperature during use of a processing table, and includes a table heating module, a cooling temperature control module, a temperature monitoring module, a first control module and a second control module;
the table top heating module and the cooling temperature control module are respectively arranged corresponding to a processing table top, the former is used for heating the processing table top in the processing and using process, and the latter is used for cooling the processing table top in the heating process;
the temperature control module is arranged corresponding to the processing table top and is used for detecting the temperature of the processing table top in real time;
the first control module is respectively and electrically connected with the temperature monitoring module and the table top heating module and is used for controlling the table top heating module to perform the temperature rising operation of the processing table top by instructions; the second control module is respectively and electrically connected with the temperature monitoring module and the cooling temperature control module and is used for commanding and controlling the cooling control module to complete the corresponding cooling operation process.
As a further improvement of the invention, the cooling temperature control module intermittently acts on the processing table in a pulse controlled manner.
As a further improvement of the invention, the cooling temperature control module is a water cooling plate which can intermittently contact the processing table surface under the control of the second control module so as to finish cooling.
As a further improvement of the invention, the table top heating module is a plurality of heating rods which are arranged corresponding to the processing table top.
As a further improvement of the invention, the temperature monitoring module is a plurality of thermocouples arranged corresponding to the processing table top.
In another aspect of the present invention, there is provided a temperature control method for laser processing of a battery sheet, comprising the steps of:
(1) The table top heating module for heating and raising the temperature, the cooling temperature control module for cooling and lowering the temperature and the temperature monitoring module for table top temperature measurement and monitoring are arranged corresponding to the processing table top;
(2) Determining the working temperature T of a processing table top, determining a temperature fluctuation allowable value dT in the working process, and determining the working temperature ranges (T-dT) to (T+dT) of the processing table top on the basis;
(3) Determining temperature values T1 and T2 in the working temperature range, so that T is less than T1 and less than T2 < (T+dT), and forming a first temperature control region when laser is not in action and a second temperature control region when the laser is in action in the working stage of the processing table; the temperature control range of the first temperature control region is T1-T2, and the temperature control range of the second temperature control region is T2- (T+dT);
(4) Determining control conditions of the cooling temperature control module in the first temperature control area and the second temperature control area, and respectively determining cooling judgment time and cooling action time of the cooling temperature control module in the two temperature control areas;
(5) When the temperature of the processing table top reaches T1, the cooling temperature control module is controlled to match the processing table top in a pulse mode;
when the temperature is between T1 and T2, controlling the cooling temperature control module to work under the control condition in the first temperature control area, so that the temperature of the processing table top is controlled in the first temperature control area at the moment;
when the temperature rises to T2, the cooling temperature control module is controlled to work under the control condition in the second temperature control area, so that the temperature of the processing table surface is ensured to be controlled in the second temperature control area when the laser acts, and the laser processing of the battery piece is completed.
As a further improvement of the present invention, after the control condition of the second temperature control region is determined in step (4), an adjustment process is further provided for the control condition:
observing the temperature monitoring waveform of the processing table top, and judging the future trend of the temperature of the processing table top; if the temperature of the processing table surface exceeds the upper temperature limit T+dT, the temperature reduction judging time T3 of the T2 and the second temperature control area is reduced, and the cooling action time T4 of the second temperature control area is increased until the maximum value of the temperature fluctuation displayed by the temperature monitoring waveform is lower than the upper limit.
As a further improvement of the invention, after the adjustment process is completed, i.e. after the upper temperature limit of the processing table is controlled, a subsequent adjustment process is provided:
and observing the temperature monitoring waveform of the processing table, if the temperature monitoring waveform judges that the temperature minimum value is larger than the lower limit value T-dT at the moment, continuously regulating down T2, regulating up both T3 and T4, and reducing the frequency of the pulse action of the cooling temperature control module.
As a further improvement of the present invention, after the control condition of the first temperature control area is completed, the adjustment process of the control condition of the first temperature control area is performed with reference to the control condition of the first temperature control area, and at this time, the adjusted T2 is taken as the upper temperature limit, and the cooling judgment time T1 and the cooling action time T2 of the first temperature control area are adjusted based on the upper temperature limit.
As a further improvement of the present invention, in step (5), the operation determination condition of the cooling temperature control module further includes a determination process of a temperature change trend in addition to determining a temperature value:
when the temperature of the processing table top is between T1 and T2 and the results of two adjacent temperature detection show that the temperature change is in an ascending trend, working under the control condition of a determined first temperature control area; when the temperature of the processing table top is between T2 and (T+dT) and the results of two adjacent temperature detections show that the temperature change is in an ascending trend, working under the determined control condition of the second temperature control area; when the temperature of the processing table top is between T1 and (T+dT) and the results of two adjacent temperature detections show that the temperature change is in a descending trend, the cooling temperature control module is controlled to immediately release the matching with the processing table top.
As a further improvement of the invention, the temperature difference between T and T1 is between 0.5 ℃ and 2 ℃; the temperature difference between T1 and T2 is between 1 ℃ and 3 ℃, and the temperature difference between T2 and the extreme value (T+dT) of the working temperature range is between 0.5 ℃ and 3 ℃.
As a further development of the invention, t1 is between 1s and 5 s; t2 is between 1s and 5 s; t3 is between 0.5s and 1.5 s; t4 is between 1s and 5 s.
The above-mentioned improved technical features can be combined with each other as long as they do not collide with each other.
In general, the above technical solutions conceived by the present invention have the beneficial effects compared with the prior art including:
(1) According to the temperature control system for battery piece laser processing, the cooling temperature control module is arranged corresponding to the processing table surface, and the temperature of the processing table surface can be kept in a proper range by utilizing the corresponding control of the cooling temperature control module at different stages when the processing table surface works, so that the temperature fluctuation of the processing table surface in the battery piece laser processing process is effectively avoided to exceed a corresponding temperature value, the accuracy of temperature control in the battery piece laser processing process is ensured, the processing precision and quality of the battery piece are improved, the rejection rate of the battery piece processing is reduced, the cost is saved, and the waste is avoided.
(2) According to the temperature control system for battery piece laser processing, the specific setting mode of the cooling temperature control module is optimized, the specific setting mode is set to be the action mode of the water cooling plate, the cooling effect of the cooling temperature control module can be effectively improved, the accuracy of cooling temperature control is guaranteed, the heating rod, the thermocouple and other modules/module structures are further correspondingly arranged, on one hand, convenience and flexibility of setting and working of the processing table module are guaranteed, on the other hand, the control accuracy is also guaranteed, and the comprehensive use performance of the temperature control system is greatly improved.
(3) According to the temperature control method for battery piece laser processing, the first temperature control area and the second temperature control area are determined in the working temperature range of the processing table surface, and the control conditions of the cooling temperature control modules in the two temperature control areas are optimized correspondingly, so that the temperature fluctuation of the table surface of the processing table surface can be kept within a certain range when laser is not in action and when the laser is in action, the accuracy and precision of temperature control in the battery piece laser processing process are ensured, the quality of battery piece laser processing is improved, and the cost of battery piece laser processing is reduced.
(4) According to the temperature control method for battery piece laser processing, the temperature change trend judging process is introduced in the control condition judging process of the cooling temperature control module, so that the cooling effect of the cooling temperature control module on the heating table top during cooling can be effectively avoided, the temperature of the processing table top is prevented from being greatly reduced due to temperature detection lag, the temperature control of the processing table top is ensured to be kept in an accurate operation temperature range, and the accuracy of the temperature control is further improved.
(5) According to the temperature control method for battery piece laser processing, the adjustment process is set according to the control conditions of the first temperature control area and the second temperature control area, so that the frequency of the pulse action of the cooling temperature control module is further reduced while the temperature control in the corresponding temperature control area exceeds the limit value, the service life of the cooling temperature control module after setting is prolonged, and the application cost of related equipment is reduced.
(6) The temperature control system and the temperature control method for battery piece laser processing have the advantages of simple system structure, simple control method, capability of effectively avoiding or improving the problem of unstable temperature control of a laser processing system under the multi-factor nonlinear effect, strong adjustability and high flexibility of the temperature control method, capability of meeting the application of different conditions and different equipment conditions, capability of ensuring the reliability and stability of the integral operation of the equipment, capability of improving the processing precision and quality of battery piece products, and good application prospect and popularization value.
Drawings
FIG. 1 is a schematic diagram of a frame structure of a temperature control system for laser processing of battery cells according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing a temperature control division of a temperature control method for laser processing of a battery sheet according to an embodiment of the present invention;
fig. 3 is a schematic diagram showing a temperature variation trend determination of a temperature control method for laser processing of a battery sheet according to an embodiment of the present invention;
FIG. 4 is a perspective view of a processing station module configuration in accordance with one embodiment of the present invention;
FIG. 5 is a front view of a processing station module configuration in accordance with one embodiment of the present invention;
FIG. 6 is a schematic diagram of a cooling temperature control module of a processing station module according to an embodiment of the present invention;
like reference numerals denote like technical features throughout the drawings, in particular:
1. a processing table module; 101. processing a table top; 102. a heat insulating plate; 103. a column; 104. a heating unit; 105. a temperature measuring unit; 106. a bottom plate; 107. a cooling unit; 108. a driving unit;
1081. a driving cylinder; 1082. a connecting plate; 1083. a connecting piece; 1084. and (3) mounting a plate.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
The invention discloses a temperature control system and a temperature control method for laser processing of a battery piece, which aim to control the temperature of a sheet material, especially the laser processing of a solar battery in the photovoltaic field, and more particularly process LIR (photo-induced regeneration/Light induecd regeneration) or LIA (Light-induced annealing/Light-Induced Annealing) and the like on a P-type or N-type battery.
At present, the conventional solar cell processing process mainly comprises the following steps: the solar cell is conveyed to the processing table top, is placed above the processing table top and is irradiated by laser, and after corresponding processing is completed, the solar cell is discharged from the processing table top. Then the next battery piece is transferred to the processing table top again, and the same action is completed.
Before processing, it is generally necessary to control the temperature of the solar cell sheet so as to irradiate the solar cell sheet with laser light at a predetermined temperature. More specifically, the solar cell is preheated by the processing table 101, and the processing temperature of the solar cell is controlled when the laser is irradiated. In order to ensure that the battery piece can be processed in a good temperature control state, a temperature control system for laser processing of the battery piece needs to be ensured to have good temperature control precision, and the range of processing temperature fluctuation is reduced.
Further, the applicant found in actual work that when a single, regular factor acts on the battery sheet, for example, the temperature of the processing table is controlled by the heating rod alone, the temperature control accuracy is high (±0.5 ℃ or less). However, when a plurality of factors having a large influence on the temperature act on the processing table surface irregularly, for example, laser processing is performed while the heating rod is heated, as high-energy laser irradiates the battery piece, the instantaneous temperature of the battery piece and the processing table surface is raised, the temperature curve fluctuation is large, the regular performance is poor, the control difficulty is high, and the accuracy cannot meet the control requirement. As such, the preferred embodiments of the present invention correspondingly provide a temperature control system for laser processing of battery cells, and a temperature control method based thereon has been studied.
Specifically, the temperature control system for laser processing of battery pieces in the preferred embodiment of the present invention is shown in fig. 1, which is provided corresponding to the processing table 101 of the processing table module 1 shown in fig. 2, for controlling the temperature fluctuation of the processing table 101 both at the time of static heating and at the time of processing heating to be kept within a suitable range.
In more detail, the temperature control system in the preferred embodiment includes a table heating module, a cooling temperature control module, and a temperature monitoring module provided for the processing table 101. Wherein the table heating module is used for heating the processing table 101; the cooling temperature control module is used for cooling and controlling the temperature of the processing table top 101 to avoid that the temperature of the processing table top 101 exceeds the upper limit of a preset fluctuation range; the temperature monitoring module is used for detecting the real-time temperature of the processing table top 101, feeding back the real-time temperature condition of the processing table top 101, and judging the control conditions of the table top heating module and the cooling temperature control module based on the real-time temperature condition.
In a preferred embodiment, the cooling temperature control module is preferably a liquid working medium cooling temperature control module, and more particularly preferably a water cooling temperature control module, and the action mode of the cooling temperature control module and the processing table 101 is preferably a pulse action mode, that is, after the cooling temperature control module acts on the processing table 101 for a certain time, the cooling action on the processing table 101 is removed, and after a certain time, the cooling temperature of the processing table 101 is continuously reduced. The above-mentioned selection is because after comprehensively researching the cooling effect of the cooling temperature control module and the heating effect of the laser irradiation and the table-board heating module during the full-power operation, the cooling effect of the former is larger than the sum of the heating effects of the former and the latter, so that the table-board heating module in the preferred embodiment adopts the full-power operation and the cooling temperature control module adopts the pulse mode for control.
Correspondingly, a first control module is arranged corresponding to the table-board heating module, and a second control module is arranged corresponding to the cooling temperature control module; the two control modules are respectively and electrically connected with the temperature monitoring module, can receive temperature data detected by the temperature monitoring module in real time, and accordingly generate corresponding control instructions to complete the control process of the table top heating module and the cooling temperature control module.
In a preferred embodiment, the temperature control method in the battery piece laser processing process is implemented according to a temperature control system, and preferably comprises the following steps:
(1) According to the actual machining requirement, the working temperature T (DEG C) of the machining table 101 is determined, and the temperature fluctuation allowable value dT (DEG C) during the working process is determined, namely, the working temperature range T+/-dT (DEG C) of the machining table 101 is determined.
Obviously, in order to ensure the processing quality of the battery piece, the working temperature of the processing table 101 should be kept between T-dT (°c) and t+dt (°c).
It will be appreciated that in actual operation, the determination of the temperature T, dT may be obtained through process experimentation with the battery sheet process, and those skilled in the art may be able to obtain this according to the particular process results or process requirements.
(2) Temperature values T1, T2 are determined within the operating temperature range of the process table 101 such that T < T1 < T2 < (t+dt) and form a first temperature controlled region and a second temperature controlled region as shown in fig. 2.
The first temperature control region is a static temperature control region, and the temperature of the processing table 101 is between T1 and T2. In the first temperature control area, the processing table 101 has no laser irradiation effect and is heated only by the table heating module, and at this time, the temperature of the object stage is stably maintained within the set temperature range through the temperature rise of the table heating module and the temperature reduction of the cooling temperature control module.
The second temperature control zone is a process temperature control zone, where the temperature of the process platen 101 is between T2 and (t+dt). In the second temperature control area, the processing table 101 is irradiated by laser except the effect of the table heating module, and at this time, the temperature of the object stage is stably maintained within the set temperature range through the temperature rise of the table heating module and the combined effect of the laser and the temperature reduction of the cooling temperature control module.
Obviously, during operation of the process table 101, its temperature control will go through the stages of the two temperature control zones described above. The temperature reduction control of the cooling temperature control module is introduced in the first temperature control area because inertia exists in the heating temperature of the table top heating module, if the control of the cooling temperature control module is not introduced before the laser action, the processing table top 101 is easy to quickly rise after the laser action and exceeds the upper temperature limit value.
Meanwhile, as the temperature rising action conditions of the first temperature control area and the second temperature control area are different, the control conditions of the cooling temperature control module in the two temperature control areas are different, and the specific embodiment is that the cooling judgment time and the action time are different. The first temperature control area has small heating amplitude, long cooling judgment time and short cooling action time, and the second temperature control area has large heating amplitude, short cooling judgment time and long cooling action time.
In addition, due to the hysteresis of the temperature control, after the temperature control module acts on the processing table 101, the temperature of the processing table 101 still rises in a small range, so as to ensure that the temperature of the processing table 101 does not exceed the upper temperature setting limit, and when the temperature value T2 is set, a margin should be left relative to the upper temperature setting limit, i.e. the temperature range of the second temperature control area cannot be too small.
(3) And determining the control conditions of the cooling temperature control module in the first temperature control area and the second temperature control area, and respectively determining the cooling judgment time and the cooling action time of the cooling temperature control module in the two temperature control areas.
The cooling judgment time refers to the interval between two adjacent detection temperatures of the temperature monitoring module, and the cooling action time refers to the time of the cooling temperature control module acting on the processing table top 101 in a pulse interval.
In actual operation, the time of the two temperature control areas is preferably determined synchronously with the initial temperature of the corresponding temperature control area, and can be adjusted according to actual conditions after the determination. The adjustment of the control condition of the second temperature control area after entering the continuous production state is taken as an example for description, and the specific method is as follows:
judging future trend of the temperature of the processing table 101 according to the temperature monitoring waveform; if the temperature still exceeds the upper temperature limit, the T2 and the T3 (the cooling judgment time of the second temperature control area) are reduced, and the T4 (the cooling action time of the second temperature control area) is increased until the maximum value of the temperature fluctuation displayed by the temperature monitoring waveform is lower than the upper limit. When the upper temperature limit is controlled, if the temperature minimum value is larger than the lower limit value, T2 can be continuously regulated down to reduce the temperature fluctuation range, and simultaneously T3 and T4 are both regulated up to reduce the frequency of the pulse cooling action until the temperature can reach the set range, and the temperature fluctuation range is minimum and the cooling frequency is minimum.
Accordingly, the control conditions of the first temperature control area can be determined by referring to the above manner, and T1, T1 (cooling judgment time of the first temperature control area) and T2 (first temperature control area) can be determined, wherein at this time, the upper temperature limit is T2 after determination, and the equipment state is the non-processing state during debugging.
However, it was found in the actual verification process that the above-described manner still had a case where the control was not satisfied, more specifically, a case where the process lower limit temperature was not satisfied. After analyzing the reasons, it is found that the above problem is caused because the thermocouple as the temperature monitoring module in the specific embodiment has the disadvantages of slow response speed and large hysteresis, and the water cooling plate as the cooling temperature control module has strong cooling effect and long action time, so that the temperature drop is large, and the temperature control of the lower processing limit cannot be accurately satisfied.
For the above reasons, in the preferred embodiment, the determination process of the temperature change trend is correspondingly increased in the first temperature control region and the second temperature control region in addition to the determination of the above control conditions.
Specifically, when the temperature is greater than T1 and less than T2 and the temperature change is in an ascending trend, the cooling temperature control module applies the first temperature control region parameters (T1, T2) to the processing table 101 in a pulse manner to cool; when the temperature is greater than T2 and less than (t+dt) and the temperature change is in an ascending trend, the water-cooled plate acts on the processing table 101 in a pulse manner by adopting the second temperature control zone parameters (T2, T3, T4) to cool down. In addition, when the temperature change in any one of the temperature control zones is in a decreasing trend, the cooling temperature control module immediately disengages from the processing table 101, which is briefly described in the illustrated case as shown in fig. 3.
In fact, the temperature monitoring module receives a waveform of the change in temperature that is not a smooth curve, but a broken line as shown in fig. 3. After the interval dt, the temperature Temp1 at the time t5 is recorded, the temperature Temp2 at the time t6 is recorded, and at this time Temp1-Temp2 obtains the temperature change value dTemp. If dTemp > 0, the temperature change is judged to be in an ascending trend, and if dTemp is less than or equal to 0, the temperature change is judged to be in a descending trend. Accordingly, the time dt between the collection of two adjacent temperatures can be preferably set according to the response speed of the temperature monitoring module, and the set time dt is preferably required to be larger than the time of one change of the temperature collected by the temperature monitoring module.
By using the findings after verification, by judging the temperature change trend while determining the temperature control region parameter, it is possible to sufficiently ensure that the temperature control of the processing table 101 satisfies the operation temperature range of the processing table 101. The reason for this is that the above-described results are obtained by analyzing the reason that the cooling temperature control module cools only when the processing table 101 is at the temperature rising stage, thereby reducing the time for which the cooling temperature control module acts, ensuring the upper limit of the temperature, and greatly suppressing the temperature drop caused by the temperature detection lag.
Obviously, it can be understood that in the actual operation process, the specific values of the processing temperature T and the allowable fluctuation temperature dT can be optimized according to actual needs, so that the values of the T1 and T2 and the values of the related parameters (T1, T2, T3 and T4) are correspondingly changed. In a preferred embodiment, the temperature difference between the operating temperature T and the temperature T1 is between 0.5℃and 2 ℃; the temperature difference between T1 and T2 is between 1 ℃ and 3 ℃, the temperature difference between T2 and the extremum (t+dt) of the fluctuation range is between 0.5 ℃ and 3 ℃, and the specific selection of the temperature difference can be correspondingly determined according to the change of factors such as the processing temperature T, the equipment components, the process parameters and the like, and will not be described herein. In addition, in the determination of the control condition, the value range of each time is preferably: t1 is between 1s and 5 s; t2 is between 1s and 5 s; t3 is between 0.5s and 1.5 s; t4 is between 1s and 5s, and specific values can be optimized according to actual needs.
(4) And (3) processing the product to be processed by using the processing table module 1, and performing related control of the cooling temperature control module according to the control conditions determined in the step (3), so as to correspondingly complete temperature control in the processing process of the product to be processed.
In a specific embodiment, the arrangement forms of the processing table 101, the table heating module, the cooling temperature control module and the temperature monitoring module are shown in fig. 4 to 6, wherein the processing table 101 has a plate-shaped structure, and is supported and connected on the bottom plate 106 through a plurality of upright posts 103, and the bottom plate 106 can be correspondingly installed on a workbench of related equipment, so that the application of the processing table module 1 is realized.
Meanwhile, the processing table 101 is made of a material having good heat conductive properties, and is further preferably made of an alloy material, such as an aluminum alloy material. Accordingly, in the preferred embodiment, the table heating modules corresponding to the processing table 101 are a plurality of heating units 104 corresponding to each other, and when actually disposed, the heating units 104 are further preferably electric heating rods. In order to ensure the uniformity of temperature rise at each position of the processing table 101, the electric heating rods in the preferred embodiment are a plurality of electric heating rods arranged at uniform intervals.
Of course, in actual arrangement, the heating unit 104 may also be preferably of another form, for example, a plate/sheet form or a bent tube form, which is closely attached to the bottom surface of the processing table 101, as required, and this may be specifically arranged as required. In addition, in order to reduce heat dissipation, the processing table 101 may be configured as a hollow structure, and the heating unit 104 is accommodated in the internal cavity, so that interference to other components below the processing table 101 caused by the arrangement of the heating unit 104 may be effectively avoided.
In addition, in order to avoid overheating damage of heat transfer loss and other components, the post 103 for supporting the processing table 101 in the preferred embodiment is preferably made of a heat insulating material or a material having poor heat conductive properties. However, as shown in fig. 3, a heat insulating plate 102 may be provided between the processing table 101 and the upright 103, and heat on the processing table 101 is prevented from being transferred to the upright 103 and the bottom plate 106 by heat insulation of the heat insulating plate 102.
Further, the cooling temperature control module in this embodiment includes a cooling unit 107 and a driving unit 108. The cooling unit 107 is preferably a plate structure opposite to the back side of the processing table 101, and one side of the cooling unit facing away from the processing table 101 is correspondingly matched with the driving unit 108, and can be driven by the driving unit 108 to approach or separate from the bottom of the processing table 101, so that the cooling temperature control module is matched with or unmatched from the processing table 101.
Specifically, the cooling unit 107 is actually configured as a water cooling plate, which is made of a heat conducting material, and is internally provided with a pipe or a cavity for cooling water to pass through, and is correspondingly provided with a water inlet and a water outlet on the bottom surface or the side periphery of the plate body, so that when the cooling unit 107 is matched with the processing table 101, the cooling water passes through the cooling unit 107, and the cooling water takes away the heat on the processing table 101, thereby realizing the temperature reduction of the processing table 101.
In a particularly preferred embodiment, the temperature of the cooling water in the water cooling plate is controlled to be 20 ℃ by an external water chiller, and the temperature difference is +/-1 ℃. Of course, it is understood that the water cooling plate or other cooling units of other arrangements of the cooling unit 107 can be correspondingly adjusted in the operating temperature according to the needs, so long as the actual application needs are satisfied.
In more detail, the driving unit 108 in the preferred embodiment includes a driving cylinder 1081 connected to the base plate 106 with a mounting plate 1084, and the cooling unit 107 is correspondingly connected to an output shaft of the driving cylinder 1081. In order to ensure the driving stability of the cooling unit 107, a connection plate 1082 is provided at the output end of the driving cylinder 1081, which is correspondingly connected to the cooling unit 107 via a plurality of connection members 1083. The connectors 1083 in the preferred embodiment are further preferably four equal-height connecting bolts. By the corresponding arrangement of the connection plate 1082 and the plurality of connection pieces 1083, a reliable support of the cooling unit 107 can be achieved.
It is to be understood that the arrangement of the driving unit 108 is not limited to the driving cylinder 1081, and may be configured as other driving modes such as hydraulic cylinder driving, servo motor driving, and the like, according to the actual arrangement.
Further, the temperature monitoring modules corresponding to the processing table 101 in this embodiment are a plurality of temperature measuring units 105 disposed at the bottom of the processing table 101, and the temperature measuring units 105 may further be specifically thermocouples.
According to the above method and control procedure, in a specific embodiment, the target processing temperature is 200 ℃, at this time, dT is 5 ℃, i.e. the operating temperature range is 195 ℃ to 205 ℃, when the actual parameter is designed, T1 is preferably 201 ℃, and T2 is preferably 203 ℃, at this time, the corresponding processing is performed by the above temperature control system and temperature control method, and the actually detected controllable temperature range of the processing table 101 is 198 ℃ to 202 ℃, which belongs to the operating temperature range, and meets the control requirements of system design and product processing.
For the temperature control system in the above embodiment, before performing the laser annealing processing of the product to be processed, the operation temperature range of the processing table 101 is correspondingly determined, and based on this, the temperature values T1 and T2 are selected such that T < T1 < T2 < (t+dt), thereby determining the first temperature control region and the second temperature control region; after that, the control conditions of the two temperature control areas are determined, and the cooling judgment time and the cooling action time of the cooling temperature control module in the two temperature control areas are defined; the cooling temperature control module is controlled according to the control conditions to perform the operation process of the processing table 101 when the laser is not in operation and when the laser is in operation, and the temperature change trend of the two adjacent temperature acquisitions is judged in the control process until the processing table 101 completes the operation process.
The temperature control system and the temperature control method for battery piece laser processing have the advantages of simple system structure, simple control method, capability of effectively avoiding or improving the problem of unstable temperature control of a laser processing system under the multi-factor nonlinear effect, strong adjustability and high flexibility of the temperature control method, capability of meeting the application of different conditions and different equipment conditions, capability of ensuring the reliability and stability of the integral operation of equipment, capability of improving the processing precision and quality of battery piece products, and good application prospect and popularization value.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The temperature control method for battery piece laser processing is characterized by comprising the following steps:
(1) The table top heating module for heating and raising the temperature, the cooling temperature control module for cooling and lowering the temperature and the temperature monitoring module for table top temperature measurement and monitoring are arranged corresponding to the processing table top;
(2) Determining the working temperature T of a processing table top, determining a temperature fluctuation allowable value dT in the working process of the processing table top, and determining the working temperature range (T-dT) to (T+dT) of the processing table top on the basis of the temperature fluctuation allowable value dT;
(3) Determining temperature values T1 and T2 in the working temperature range, so that T is less than T1 and less than T2 < (T+dT), and forming a first temperature control region when laser is not in action and a second temperature control region when the laser is in action in the working stage of the processing table; the temperature control range of the first temperature control area is T1-T2, and the temperature control range of the second temperature control area is T2- (T+dT);
(4) Determining control conditions of the cooling temperature control module in the first temperature control area and the second temperature control area, and respectively determining cooling judgment time and cooling action time of the cooling temperature control module in the two temperature control areas; after determining the control condition of the second temperature control area, an adjusting process is further set for the control condition:
observing the temperature monitoring waveform of the processing table top, and judging the future trend of the temperature of the processing table top; if the temperature of the processing table surface is judged to exceed the upper temperature limit T+dT, the temperature reduction judging time T3 of the T2 and the second temperature control area is reduced, and the cooling action time T4 of the second temperature control area is increased until the maximum value of the temperature fluctuation displayed by the temperature monitoring waveform is lower than the upper limit;
(5) When the temperature of the processing table top reaches T1, the cooling temperature control module is controlled to match the processing table top in a pulse mode;
when the temperature is between T1 and T2, controlling the cooling temperature control module to work under the control condition in the first temperature control area, so that the temperature of the processing table top is controlled in the first temperature control area at the moment;
when the temperature rises to T2, the cooling temperature control module is controlled to work under the control condition in the second temperature control area, so that the temperature of the processing table surface is ensured to be controlled in the second temperature control area when the laser acts, and the laser processing of the battery piece is completed.
2. The temperature control method for battery piece laser processing according to claim 1, wherein after the adjustment process in step (4) is completed, i.e., after the upper temperature limit of the processing mesa is controlled, a subsequent adjustment process is further provided:
and observing the temperature monitoring waveform of the processing table, if the temperature monitoring waveform judges that the temperature minimum value is larger than the lower limit value T-dT at the moment, continuously regulating down T2, regulating up both T3 and T4, and reducing the frequency of the pulse action of the cooling temperature control module.
3. The temperature control method for battery piece laser processing according to claim 1, wherein after the control condition of the first temperature control region is completed, an adjustment process of the control condition of the first temperature control region is performed with reference to the control condition of the first temperature control region, and at this time, the adjusted T2 is taken as an upper temperature limit, and the cooling judgment time T1 and the cooling action time T2 of the first temperature control region are adjusted based on the upper temperature limit.
4. The method for controlling temperature for laser processing of battery pieces according to any one of claims 1 to 3, wherein in step (5), the operation determination condition of the cooling temperature control module further includes a determination process of a temperature variation trend in addition to determining a temperature value:
when the temperature of the processing table top is between T1 and T2 and the results of two adjacent temperature detection show that the temperature change is in an ascending trend, working under the control condition of a determined first temperature control area; when the temperature of the processing table top is between T2 and (T+dT) and the results of two adjacent temperature detections show that the temperature change is in an ascending trend, working under the determined control condition of the second temperature control area; when the temperature of the processing table top is between T1 and (T+dT) and the results of two adjacent temperature detection show that the temperature change is in a descending trend, the cooling temperature control module is controlled to immediately release the matching with the processing table top.
5. The temperature control method for battery piece laser processing according to any one of claims 1 to 3, wherein a temperature difference between T and T1 is between 0.5 ℃ and 2 ℃; the temperature difference between T1 and T2 is between 1 ℃ and 3 ℃, and the temperature difference between T2 and the extreme value (T+dT) of the operating temperature range is between 0.5 ℃ and 3 ℃.
6. The temperature control method for battery piece laser processing according to claim 3, wherein t1 is between 1s and 5 s; t2 is 1 s-5 s; t3 is between 0.5s and 1.5 s; t4 is 1 s-5 s.
7. A temperature control system for battery piece laser processing is used for realizing temperature control in the use process of a processing table surface according to the temperature control method for battery piece laser processing according to any one of claims 1-6, and is characterized in that,
the temperature control system comprises a table top heating module, a cooling temperature control module, a temperature monitoring module, a first control module and a second control module;
the table top heating module and the cooling temperature control module are respectively arranged corresponding to a processing table top, the former is used for heating the processing table top in the processing and using process, and the latter is used for cooling the processing table top in the heating process;
the temperature monitoring module is arranged corresponding to the processing table top and is used for detecting the temperature of the processing table top in real time;
the first control module is respectively and electrically connected with the temperature monitoring module and the table top heating module and is used for controlling the table top heating module to perform the temperature rising operation of the processing table top by instructions; the second control module is respectively and electrically connected with the temperature monitoring module and the cooling temperature control module and is used for controlling the cooling temperature control module to finish the corresponding cooling operation process.
8. The temperature control system for laser processing of battery cells of claim 7, wherein the cooling temperature control module intermittently acts on the processing mesa in a pulse controlled manner.
9. The temperature control system for laser processing of battery cells of claim 7, wherein the cooling temperature control module is a water cooled plate that intermittently contacts the processing table under control of the second control module to achieve cooling.
10. The temperature control system for battery cell laser processing according to any one of claim 7 to 9, wherein,
the table surface heating module is a plurality of heating rods which are arranged corresponding to the processing table surface;
and/or
The temperature monitoring module is a plurality of thermocouples which are arranged corresponding to the processing table top.
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