CN115087512A - Laser processing method and laser processing apparatus - Google Patents
Laser processing method and laser processing apparatus Download PDFInfo
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- CN115087512A CN115087512A CN202080095638.1A CN202080095638A CN115087512A CN 115087512 A CN115087512 A CN 115087512A CN 202080095638 A CN202080095638 A CN 202080095638A CN 115087512 A CN115087512 A CN 115087512A
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- 238000003672 processing method Methods 0.000 title claims abstract description 31
- 238000005553 drilling Methods 0.000 claims abstract description 30
- 230000002093 peripheral effect Effects 0.000 claims abstract description 25
- 238000003754 machining Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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Abstract
The present invention uses a laser processing device (100) which eliminates the problem of the existing laser processing method, namely, the whole object to be processed with large area is processed by drilling with high precision to reduce the number of products to be generated, the laser beam (1) emitted from the laser oscillator (2) is scanned by electrically controlled mirrors (3a, 3b) to condense the laser beam (1) on a workpiece (6) placed on a table (9) for drilling, a plurality of scanning areas (44) capable of scanning by electrically controlled mirrors (3a, 3b) are set in a workpiece (6), when the hole drilling in 1 scanning area is completed each time, the processed object (6) is moved by the workbench (9), thus, the scanning region (42) is drilled toward the inside of the workpiece (6) while revolving in the circumferential direction from the outer peripheral side of the workpiece (6).
Description
Technical Field
The present invention relates to a method of drilling a hole in a printed circuit board and a laser processing apparatus used for drilling the hole.
Background
In recent years, when a material such as a printed circuit board is drilled with a laser, machining using a laser machining apparatus has become mainstream. The laser processing apparatus includes an electrically controlled mirror for scanning a laser beam, an f θ lens for condensing the laser beam, an XY table on which a printed circuit board is placed, and a laser oscillator for oscillating the laser beam. On the other hand, in the case of products using printed boards after drilling, the functions and the size of the products have been increased, and in the drilling of printed boards, the number of the drilled holes has been increased and the printed boards have been thinned in accordance with the increased functions and the size of the products. Therefore, the printed circuit board may shrink during the drilling process, and the position of the drilled hole may shift from the desired position of the printed circuit board where the drilling is desired before and after the shrinkage of the printed circuit board.
Disclosed is a laser processing method which can improve the positional deviation of a processing hole relative to a desired position where a hole is desired to be formed in a printed board, which occurs before and after the shrinkage of the printed board caused by the physical deformation of the printed board. According to the disclosed laser processing method, laser processing is performed sequentially from the outer peripheral side of the processing region toward the inner side of the processing region while revolving in the circumferential direction from the outer peripheral side of the processing region in relation to the processing sequence of the processing region in the same region as the scanning region having an area of about 50mm × 50mm, that is, the scanning region capable of being scanned by the galvano mirror.
Patent document 1: japanese laid-open patent publication No. 2004-216385 (page 6, FIG. 1)
Disclosure of Invention
In the conventional laser processing method, the position accuracy of the processing hole of the processing region in the same region as the scanning region that can be scanned by the electrically controlled mirror can be improved. However, when the size of the printed circuit board is large, such as about 500mm × 500mm, the scan area that can be scanned by the galvano-mirror is about 50mm × 50mm, and therefore, a large area, such as about 500mm × 500mm, cannot be scanned at a time by the galvano-mirror. Therefore, an area of about 50mm × 50mm, which is 1 scanning area that can be scanned by the galvano mirror, is set as one division, a large-area printed circuit board is divided into a plurality of divisions, and drilling is performed for each division. In this case, if the scanning area of the first division is compared with the scanning area of the last division, the number of the processing holes occupied in the printed circuit board increases cumulatively, and therefore, a difference occurs in the shrinkage amount in the scanning area. As a result, even if the same drilling process is performed on all the scanning areas as one division, if all the divisions are compared, the positional deviation of the drilled hole occurs before and after the shrinkage of the printed circuit board, and the positional accuracy of the drilled hole deteriorates when the printed circuit board is observed as a whole.
In order to improve the positional accuracy of a machined hole when viewed from the entire large-area printed circuit board, there is a method of providing positioning marks in all of the scanning area as one division, measuring the positioning marks during machining, and performing laser machining while correcting shrinkage of the entire printed circuit board, thereby improving the positional accuracy of the machined hole. However, in this method, a measurement step of the positioning mark is required to measure all the positioning marks. As a result, the time required for processing increases. Further, since the positioning marks are provided in all the scanning regions, an area for providing the positioning marks in the printed board is required. As a result, there is a problem that if the area for providing the positioning mark is removed from the printed substrate, the number of products obtained from each printed substrate is reduced.
The present invention has been made to solve the above-described problems, and an object of the present invention is to suppress rapid and partial shrinkage of a printed circuit board as a workpiece, and to suppress positional deviation of a processing hole, which occurs before and after shrinkage of the printed circuit board, with respect to a desired position where a hole is desired to be formed in the printed circuit board.
In the laser processing method according to the present invention, a laser processing apparatus is used which scans a laser beam emitted from a laser oscillator by an galvano-mirror and condenses the laser beam on a workpiece mounted on a table to perform hole drilling, and a plurality of scanning regions which can be scanned by the galvano-mirror are set in the workpiece, and the workpiece is moved by the table every time the hole drilling in 1 scanning region is completed, whereby the hole drilling is performed toward the inside of the workpiece while revolving the scanning regions in the circumferential direction from the outer peripheral side of the workpiece.
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention sets a plurality of scanning areas capable of scanning by an electrically controlled mirror in a workpiece, and moves the workpiece by a table every time drilling in 1 scanning area is completed, thereby drilling the workpiece toward the inner side of the workpiece while revolving the scanning areas in the circumferential direction from the outer peripheral side of the workpiece, and therefore, the present invention has the following effects that rapid and partial shrinkage of the workpiece can be suppressed, and a positional deviation of a machining hole relative to a desired position desired to be drilled in the workpiece before and after the shrinkage of the workpiece can be suppressed.
Drawings
Fig. 1 is a structural diagram of a laser processing apparatus shown in embodiment 1 of the present invention.
Fig. 2 shows the arrangement of scanning regions and the processing sequence in the laser processing method described in embodiment 1 of the present invention.
Fig. 3 is a characteristic diagram showing a relationship between the number of revolutions and the positional deviation amount of the machined hole in embodiment 2 of the present invention.
Fig. 4 is a view showing a processing procedure of the laser processing method described in embodiment 2 of the present invention.
Fig. 5 is a view showing a processing procedure of the laser processing method described in embodiment 2 of the present invention.
Fig. 6 is a view showing a processing procedure of the laser processing method described in example 2 of the present invention.
Fig. 7 is a view showing a processing procedure of the laser processing method described in embodiment 2 of the present invention.
Fig. 8 is a cross-sectional view of a printed circuit board having a through-hole formed therein, the printed circuit board being described in example 4 of the present invention.
Fig. 9 is a cross-sectional view of the printed circuit board shown in example 4 of the present invention after the through-hole processing is performed on the printed circuit board.
Fig. 10 is a view showing a processing procedure of the laser processing method described in example 4 of the present invention.
Fig. 11 is a view showing a processing procedure of the laser processing method described in example 4 of the present invention.
Fig. 12 is a view showing a processing procedure of the laser processing method described in example 4 of the present invention.
Detailed Description
Example 1.
Fig. 1 is a structural diagram of a laser processing apparatus for processing a hole in a printed circuit board shown in embodiment 1 of the present invention. The laser processing apparatus 100 shown in fig. 1 includes a laser oscillator 2 that generates a pulse laser beam 1, 2 galvano- mirrors 3a and 3b that scan the laser beam 1 emitted from the laser oscillator 2 while deflecting the traveling direction of the laser beam 1, and an f θ lens 4 that condenses the laser beam 1. The printed circuit board 6 as a workpiece is placed on an XY stage 9 as a two-dimensionally movable stage, and the focal plane of the f θ lens 4 is aligned with the surface of the printed circuit board 6. The control device 50, which is a part of the laser processing apparatus 100, controls the laser oscillator 2 via the signal line 51, and also controls the electrically controlled mirrors 3a and 3b and the XY table 9, respectively. The control device 50 controls a camera 52 via a signal line 51, and the camera 52 measures a positioning mark provided on the printed circuit board 6 and the shape of the hole before and after processing. As described above, the laser processing method according to embodiment 1 of the present invention is controlled by the control device 50.
As a method of fixing the printed board 6 to the XY table 9, a plurality of suction holes 53 for sucking the printed board 6 are provided in the XY table 9, and the printed board 6 is fixed by suction from the suction holes 53. Instead of the plurality of suction holes 53, the printed circuit board 6 may be fixed by a mechanical clamping mechanism. The printed board 6 to be subjected to this process uses a copper foil as a conductor layer on the surface thereof and an insulating layer, i.e., a resin, as the lower layer thereof, and has an area of about 500mm on 1 side.
The position of the printed board 6 where the laser processing is performed is positioned by controlling the electronically controlled mirrors 3a and 3b and the XY table 9. When performing positioning, the positioning marks provided on the printed board 6 are measured by the camera 52 for measurement. After the positioning of the position where the laser processing is performed on the printed board 6 is completed, the controller 50 corrects the strain of the printed board 6 generated in the previous step of the laser processing and the tilt of the printed board 6 generated when the printed board is placed on the XY table 9. Next, the coordinates of the desired position of the desired hole of the printed circuit board 6 are irradiated with the laser beam 1 in accordance with the processing program stored in the control device 50.
When laser processing is performed on a printed circuit board 6 having a larger scanning area 60 than the scanning area that can be scanned by the galvano mirrors 3a and 3b, the printed circuit board 6 is divided into a plurality of scanning areas 60 by using the scanning area 60 that can be scanned by the galvano mirrors 3a and 3b as one division, and the plurality of scanning areas 60 are set on the printed circuit board 6. After the division, the electrically controlled mirrors 3a and 3b are controlled to perform the laser processing on 1 scanning area 60, and then the XY table 9 is controlled to move to the next scanning area 60 next time, and the entire printed circuit board 6 is processed by repeating the hole forming processing.
Fig. 2 shows the arrangement of scanning regions and the processing sequence in the laser processing method described in embodiment 1 of the present invention. In the laser processing shown in embodiment 1 of the present invention, first, the scanning area 61, which is a scanning area that can be scanned only by the galvano mirrors 3a and 3b to perform the laser processing, is located in the periphery of the corner portion of the outermost periphery of the printed circuit board 6, and the XY table 9 is moved after the processing hole 7 is formed in the scanning area 61. After the XY table 9 is moved, the outermost peripheral portion is revolved in the machining traveling direction 20a so that the scanning area 62, which is the scanning area, is laser-machined by scanning only by the galvano mirrors 3a, 3 b.
After the machining hole 7 is formed in the outermost peripheral portion, the XY table 9 is moved next time, and scanning is performed only by the galvano mirrors 3a and 3b, thereby performing laser machining of the scanning region 63 located more inside than the outermost peripheral portion. After the machining of the scanning area 63, the XY table 9 is moved to perform the orbiting machining on the inner side of the outermost peripheral portion in the machining traveling direction 20b while orbiting in the circumferential direction. Similarly, after the outermost peripheral portion is machined inward, the XY table 9 is moved next time, and the laser machining of the scanning region 64 located inward is performed by scanning only by the electrically controlled mirrors 3a and 3 b. After the machining of the scanning area 64, the XY table 9 is moved to perform the inner-turn machining in order along the machining traveling direction 20c while turning in the circumferential direction. As described above, the laser processing is sequentially performed while moving the scanning region scanned only by the galvano mirrors 3a and 3b from the outer peripheral side of the printed circuit board 6 to the inner side.
When the printed circuit board 6 is subjected to the hole forming process, since the substrate material of the portion of the printed circuit board 6 where the hole is formed is removed, a stress in the direction of the center of the processed hole 7 is generated in the printed circuit board 6, and the stress acts in the direction of the center of the processed hole 7 in a direction of contracting the printed circuit board 6. Although the stress generated by 1 processing hole 7 is slight, if, for example, more than 10 ten thousand processing holes are laser-processed on the printed circuit board 6, the number of processing holes 7 occupied in the entire printed circuit board 6 increases, and the total of all the stresses generated by many processing holes 7 becomes an inconsiderable value. Therefore, when fine hole forming is performed, the influence of shrinkage of the printed circuit board 6 is more significant.
When the printed circuit board 6 is drilled, the coordinates of the machining hole 7 to be laser-machined are obtained based on the positioning marks measured in advance by the camera 52, the coordinates are written in a machining program stored in the control device 50, and laser machining is performed in accordance with the machining program. If the printed circuit board 6 shrinks and changes shape before laser processing, the position of the positioning mark measured before processing shifts with the shrinkage, and therefore, as laser processing progresses, a shift occurs between the coordinates that should originally be drilled and the coordinates on the printed circuit board 6 on which drilling is actually desired, which are written in the processing program, resulting in production of a defective printed circuit board with a shifted processing position.
When many processed holes 7 are present in the center portion of the printed circuit board 6, shrinkage occurs in the center portion, and as a result, the degree of deformation in the vicinity of the outer periphery of the printed circuit board 6 becomes large. On the other hand, when there are a large number of processing holes 7 near the outer periphery of the printed circuit board 6, the contraction occurs near the outer periphery, but the central portion of the printed circuit board 6 does not contract, and as a result, the degree of contraction occupied by the entire printed circuit board 6 is suppressed as compared with the case where there are many processing holes 7 in the central portion of the printed circuit board 6.
In the laser processing method shown in embodiment 1 of the present invention, first, a scanning area 61, which is a scanning area that can be scanned only by the galvano mirrors 3a and 3b, is set at a corner portion near the outer periphery of the printed circuit board 6. After the machining hole 7 is formed in the scanning region 61, the XY stage 9 is moved. After the XY table 9 is moved, the scanning is performed only by the galvano mirrors 3a, 3b, the scanning area 62 as the scanning area is laser-processed, and the orbiting processing of the outermost peripheral portion is performed in the processing traveling direction 20 a. Therefore, the shrinkage of the printed circuit board 6 caused by the circling process of the outermost peripheral portion occurs only in the outermost peripheral portion, and does not affect the inside of the printed circuit board 6. As a result, in the laser processing in which the orbiting processing is sequentially performed inward of the outermost peripheral portion in the processing traveling direction 20b while orbiting in the circumferential direction from the scanning region 63 inward of the outermost peripheral portion to be subjected to the laser processing next, the coordinate to be originally drilled written in the processing program and the coordinate on the printed circuit board 6 on which the drilling is actually desired are not shifted from each other. Similarly, in the laser processing in which the inner-side orbiting processing is sequentially performed in the processing traveling direction 20c while orbiting in the circumferential direction from the scanning region 64 located further inward to be subjected to the laser processing next, there is no deviation between the coordinates to be originally drilled written in the processing program and the coordinates on the printed circuit board 6 on which the drilling is actually desired.
According to the laser processing method described in embodiment 1 of the present invention, the scanning region 61, which is a scanning region that can be scanned by the galvano mirrors 3a and 3b only, is set in the corner portion of the outermost peripheral portion of the printed circuit board 6, and the scanning region 62, which is a scanning region that can be scanned by the galvano mirrors 3a and 3b only, is set in the outermost peripheral portion in order. When the laser processing of the outermost peripheral portion is completed, the scanning region 63, which is a scanning region that can be scanned only by the galvano mirrors 3a and 3b, is set next time inside the outermost peripheral portion, and the scanning regions, which are scanning regions that can be scanned only by the galvano mirrors 3a and 3b, are set in order inside the outermost peripheral portion. As described above, by performing the multi-turn processing by sequentially setting the scanning regions inward from the outermost peripheral portion of the printed circuit board 6, it is possible to suppress rapid and partial shrinkage of the printed circuit board 6, which has been a conventional problem, and to suppress positional deviation of the processing hole 7 from a desired position where it is desired to open a hole in the printed circuit board 6, which occurs before and after the shrinkage of the printed circuit board 6.
Example 2.
In the case where the multi-revolution processing as shown in fig. 2 explained in embodiment 1 of the present invention is performed, the shrinkage amount differs for each revolution. Therefore, in the case where the shrinkage amount is changed more greatly every revolution, the electronically controlled mirrors 3a and 3b and the XY table 9 can be used by the shrinkage amount every revolution to correct the machining position by the positional deviation amount between the coordinates to be originally drilled in the machining program and the coordinates on the printed circuit board 6 on which drilling is actually desired. Fig. 3 is a characteristic diagram showing a relationship between the number of revolutions and the positional deviation amount of the machined hole in embodiment 2 of the present invention. The printed board 6 has different shrinkage amounts depending on the type of material and the thickness of the material. Therefore, a characteristic diagram showing a relationship between the number of revolutions and the positional displacement amount of the processed hole as shown in fig. 3 can be obtained in advance as a database for each type of material of the printed circuit board 6 and for each thickness of the material. The amount of positional deviation of the processed hole is calculated by actually performing laser processing on the printed circuit board 6 and measuring the shrinkage amount thereof.
The processing procedure of the laser processing method described in example 2 of the present invention is as follows. Fig. 4 to 7 are processing sequences of the laser processing method shown in embodiment 2 of the present invention. As shown in fig. 4, first, 1 reference hole 41 which is located at the outermost periphery of the printed circuit board 6 and serves as a reference is laser-processed, and the position of the reference hole 41 is measured by a camera 52 for position measurement. The reference hole 41 may be a part of the product pattern in the scanning area 42 at the outermost periphery of the printed substrate 6 where the printed substrate is actually perforated. Next, as shown in fig. 5, if the laser processing of the scanning area 42 is completed, the XY table 9 is moved to the next scanning area at the outermost periphery of the printed substrate 6, and the 1 st revolution processing is performed in the processing traveling direction 43. As a result, the processed region 44 is formed on the outermost periphery of the printed circuit board 6. Next, as shown in fig. 6, if the 1 st revolution machining is completed, the positional displacement amount of the reference hole 41 is measured again by the camera 52. Then, the value measured by the camera 52 before the 1 st revolution is compared with the value measured by the camera 52 after the 1 st revolution, and the difference is stored in the control device 50 as the correction value for the 1 st revolution.
Next, if the processed processing region 44 is formed in the outermost periphery of the printed circuit board 6, then, as shown in fig. 7, the circling processing is performed inside the outermost periphery. Similarly, 1 reference hole 45 serving as a reference located inside the processing region 44 processed on the outermost periphery of the printed circuit board 6 is laser-processed, and the position of the reference hole 45 is measured by the camera 52 for position measurement. The reference hole 45 may be a part of the product pattern in the scanning area 46 on the inner side of the outermost periphery of the printed circuit board 6, where the printed circuit board is actually perforated. When the laser processing of the scanning area 46 is completed, the XY table 9 is moved to the next scanning area located at the outermost periphery of the printed board 6, and the 2 nd revolution processing is performed in the processing traveling direction. If the 2 nd revolution processing is completed, the positional displacement amount of the reference hole 45 is measured again by the camera 52. Then, the value measured by the camera 52 before the 2 nd week of processing and the value measured by the camera 52 after the 2 nd week of revolving processing are compared, and the difference is stored in the control device 50 as a correction value for the 2 nd week. This process is repeated every time a plurality of revolutions are performed, and a characteristic diagram showing a relationship between the number of revolutions and the positional displacement amount of the machining hole as shown in fig. 3 is created and acquired.
The characteristic diagram showing the relationship between the number of revolutions and the positional deviation of the processed hole is obtained when the 1 st printed circuit board 6 is laser-processed, and when the 2 nd and subsequent printed circuit boards are laser-processed after the 1 st printed circuit board 6 is laser-processed, the revolution processing is performed using the correction value for each revolution shown in the characteristic diagram obtained in the laser processing of the 1 st printed circuit board 6 without performing the measurement by the camera 52.
According to the laser processing method described in embodiment 2 of the present invention, since the printed circuit board 6 has different shrinkage amounts for each type of material and each thickness of material, a characteristic diagram showing the relationship between the number of revolutions and the positional deviation amount of the processed hole for each type of material and each thickness of material of the printed circuit board 6 is obtained by actually performing laser processing on the printed circuit board 6. The characteristic diagram showing the relationship between the number of revolutions and the positional deviation of the processed hole is obtained when the printed circuit board 6 of the 1 st sheet is laser-processed. When the laser processing is performed on the 2 nd and subsequent printed boards, the measurement by the camera 52 is not performed, but the circling processing is performed using the correction value for each circling shown in the characteristic diagram showing the relationship between the number of revolutions and the positional deviation amount of the processing hole measured in the laser processing of the 1 st printed board 6. As described above, by performing the position correction based on the shrinkage of the printed circuit board 6 using the characteristic diagram showing the relationship between the number of revolutions and the positional deviation amount of the processed hole, it is possible to further suppress the positional deviation of the processed hole 7 with respect to the desired position where the hole is desired to be formed in the printed circuit board 6, which occurs before and after the shrinkage of the printed circuit board 6.
Example 3.
In the laser processing method described in embodiment 2 of the present invention, the characteristic diagram showing the relationship between the number of revolutions and the positional deviation amount of the processed hole for each type of material and each thickness of the material of the printed circuit board 6 is obtained by performing laser processing on the printed circuit board 6 of the 1 st piece. When laser processing is performed on the 2 nd and subsequent printed boards, the curl processing is performed using a correction value for each curl shown in a characteristic diagram showing a relationship between the number of laps measured in the laser processing of the 1 st printed board 6 and a positional deviation amount of the processed hole. In the laser processing method described in embodiment 3 of the present invention, a characteristic diagram showing a relationship between the number of revolutions and the positional deviation amount of the processed hole, which correspond to the type of material, the thickness of the material, and the number of processed holes of the printed circuit board 6 on which laser processing has been performed in the past, is stored in the control device 50 as a database. By applying the accumulated database to the next laser processing, it is possible to suppress a positional deviation of the processing hole 7 from a desired position where it is desired to form a hole in the printed circuit board 6, which occurs before and after the shrinkage of the printed circuit board 6.
According to the laser processing method shown in embodiment 3 of the present invention, since it is not necessary to measure the shrinkage amount of the printed circuit board 6 before processing, it is possible to reduce the time required for calculating the position correction based on the shrinkage of the printed circuit board 6, and it is not necessary to use the material of the printed circuit board 6 for calculating the position correction based on the shrinkage of the printed circuit board 6, and it is possible to reduce the material cost.
Example 4.
In the case of through-hole drilling processing in which laser light 1 is irradiated from the front and back surfaces of a copper foil, which is a conductor layer applied to both the front and back surfaces of the printed circuit board 6, and laser processing is performed, the amount of substrate material removed further increases, and therefore the degree of shrinkage of the printed circuit board 6 due to laser processing further increases. Fig. 8 and 9 are sectional views of the printed circuit board after the through hole processing is performed on the printed circuit board in embodiment 4 of the present invention. The printed board 6 is composed of copper foils 31a and 31b as conductor layers applied to both the front and back surfaces, and a resin 32 interposed between the copper foils 31a and 31 b. As shown in fig. 8, in the through-hole drilling process in which the laser beam 1 is irradiated from both the front and back copper foils 31a and 31b, since the laser beam machining is performed in accordance with the machining program in which the coordinates of the desired position of the desired hole to be drilled on the front and back surfaces match with the coordinates of the machined hole 33a from the front surface and the machined hole 33b from the back surface, the printed circuit board 6 is drilled without positional deviation, when the printed circuit board 6 is not shrunk.
On the other hand, as shown in fig. 9, when the degree of shrinkage of the printed circuit board 6 caused by the laser processing is large, even if the laser processing is performed in accordance with the processing program in accordance with the coordinates of the desired position of the desired hole on the front and rear surfaces, the printed circuit board 6 is shrunk because the laser processing of the front surface is performed previously. As a result, the machining hole 34b on the back surface to be subsequently drilled according to the machining program is displaced from the desired position to be drilled due to the shrinkage of the printed circuit board 6 caused by the influence of the machining hole 34a previously drilled, and the printed circuit board 6 may not penetrate.
The processing sequence of the through hole processing method corresponding to the occurrence of shrinkage of the printed circuit board 6 shown in embodiment 4 of the present invention is as follows. Fig. 10 to 12 show a processing sequence of the laser processing method according to embodiment 4 of the present invention. As shown in fig. 10, first, the surface of the printed circuit board 6 is laser-processed. In fig. 10, the laser processing is performed by the 1 st revolution processing 83a from the scanning area 82a located at the outermost periphery of the printed board 6. When the 1 st revolution processing 83a is completed, next, revolution processing on the inner side of the outermost circumference is performed as 2 nd revolution processing 84 a. Then, if the 2 nd revolution processing 84a is completed, the further inside revolution processing is performed as the 3 rd revolution processing 85a next. The processed region 86 is formed by performing the multi-turn processing.
If the laser processing of the front surface of the printed substrate 6 is completed, the back surface of the printed substrate 6 is next subjected to laser processing. In the case of performing the processing of the back surface, the printed circuit board 6 is reversed, but as shown in fig. 11 and 12, the circling processing 83b, 84b, and 85b of the back surface of the printed circuit board 6 in the same traveling direction as the circling processing 83a, 84a, and 85a of the front surface of the printed circuit board 6, that is, the back surface of the printed circuit board 6 is performed from the scanning area 82b of the back surface of the printed circuit board 6 which is in the same position as the scanning area 82a of the front surface of the printed circuit board 6. As described above, by performing laser processing on the rear surface of the printed circuit board 6 in the same processing order as the front surface of the printed circuit board 6 that has been previously subjected to laser processing, the f θ lens 4 and the galvano mirrors 3a and 3b are located at the same positions with respect to the processing area, and therefore, through-hole drilling can be performed without the influence of shrinkage caused by the previous drilling of the front surface of the printed circuit board 6.
Description of the reference numerals
1 laser, 2 laser oscillator, 3a, 3b electric control reflector, 4f theta lens, 6 printed substrate, 7, 33a, 33b, 34a, 34b processing hole, 9XY working table, 20a, 20b, 20c, 43 processing advancing direction, 31a, 31b copper foil, 32 resin, 41, 45 reference hole, 44, 86 processing area, 50 control device, 51 signal line, 52 camera, 53 absorbing hole, 42, 46, 60, 61, 62, 63, 64, 82a, 82b scanning area, 83a, 83b, 84a, 84b, 85a, 85b revolving processing, 100 laser processing device.
Claims (5)
1. A laser processing method using a laser processing apparatus for performing hole drilling by scanning a laser beam emitted from a laser oscillator by an electrically controlled mirror and condensing the laser beam on a workpiece placed on a table, wherein a plurality of scanning regions capable of being scanned by the electrically controlled mirror are set in the workpiece, and the workpiece is moved by the table every time hole drilling in 1 of the scanning regions is completed, whereby the hole drilling is performed while the scanning regions are revolved in a circumferential direction from an outer peripheral side of the workpiece toward an inner side of the workpiece.
2. The laser processing method according to claim 1,
the method includes measuring a shrinkage amount of the workpiece for each revolution generated by drilling toward an inner side of the workpiece while revolving the scan region in a circumferential direction from an outer peripheral side of the workpiece before machining, and correcting a positional deviation of a machined hole generated before and after shrinkage of the workpiece based on the shrinkage amount.
3. The laser processing method according to claim 2,
the shrinkage amount is accumulated in the laser processing apparatus as a database, and a positional deviation of the processed hole occurring before and after shrinkage of the processed object is corrected based on the database.
4. The laser processing method according to any one of claims 1 to 3,
the hole forming process using the laser processing apparatus is performed from both the front surface and the back surface of the workpiece, and the hole forming process on the front surface and the hole forming process on the back surface are performed in the same processing sequence.
5. A laser processing apparatus is characterized by comprising:
a laser oscillator that emits laser light;
an electrically controlled mirror that scans the laser light;
a stage on which a workpiece to be drilled by condensing the laser beam is placed; and
and a controller configured to set a plurality of scanning areas capable of being scanned by the electrically controlled mirror in the workpiece, and to move the workpiece by the table every time drilling in 1 of the scanning areas is completed, thereby drilling the workpiece inward while revolving the scanning areas in a circumferential direction from an outer peripheral side of the workpiece.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/005073 WO2021161367A1 (en) | 2020-02-10 | 2020-02-10 | Laser processing method and laser processing device |
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| CN115087512A true CN115087512A (en) | 2022-09-20 |
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| CN202080095638.1A Pending CN115087512A (en) | 2020-02-10 | 2020-02-10 | Laser processing method and laser processing apparatus |
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| JP7451049B2 (en) * | 2020-09-30 | 2024-03-18 | ビアメカニクス株式会社 | Laser processing equipment and laser processing method |
| CN113099615B (en) * | 2021-04-01 | 2022-09-06 | 深圳市祺利电子有限公司 | Drilling positioning method for large-size circuit board |
| JP7469680B2 (en) | 2022-03-28 | 2024-04-17 | 日亜化学工業株式会社 | Method for manufacturing a light emitting device |
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| WO2021161367A1 (en) | 2021-08-19 |
| TW202130443A (en) | 2021-08-16 |
| JP6793892B1 (en) | 2020-12-02 |
| TWI754521B (en) | 2022-02-01 |
| JPWO2021161367A1 (en) | 2021-08-19 |
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