CN115065919A - MEMS sensor and MEMS microphone - Google Patents
MEMS sensor and MEMS microphone Download PDFInfo
- Publication number
- CN115065919A CN115065919A CN202210466852.4A CN202210466852A CN115065919A CN 115065919 A CN115065919 A CN 115065919A CN 202210466852 A CN202210466852 A CN 202210466852A CN 115065919 A CN115065919 A CN 115065919A
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- substrate
- mems
- stress
- mems sensor
- membrane
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- 239000000758 substrate Substances 0.000 claims abstract description 96
- 239000012528 membrane Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims 1
- 230000035882 stress Effects 0.000 abstract description 36
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 230000006355 external stress Effects 0.000 abstract description 6
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
The invention provides a MEMS sensor and a MEMS microphone, wherein the MEMS sensor comprises: the MEMS chip comprises a substrate and an MEMS chip arranged on the substrate; the MEMS chip comprises a substrate arranged on a substrate and an MEMS membrane attached to the substrate; at least one stress containing part is arranged on the substrate and used for isolating stress transmission between the substrate and the MEMS membrane. The invention can reduce the influence of external stress on the performance of the MEMS membrane.
Description
Technical Field
The invention relates to the technical field of MEMS (micro-electromechanical systems) packaging, in particular to an MEMS sensor and an MEMS microphone.
Background
At present, when an MEMS single body is tested and applied to a terminal, the acoustic sensitivity of a microphone can be reduced due to the influence of a test external load condition and the application working condition of the terminal, namely, the force generated by the test external load and the application working condition of the terminal can be transmitted to an MEMS diaphragm through a shell and a PCB (printed Circuit Board) (namely, an MEMS packaging system), so that additional stress is generated on the diaphragm, the stress level of the diaphragm under the original residual processing stress is changed, and the product performance is influenced.
For example, when the additional stress acting on the MEMS diaphragm is compressive stress, the diaphragm rigidity decreases, the deformation under the same sound pressure increases, the output electrical signal increases, and the frequency response increases; when the additional stress acting on the MEMS membrane is tensile stress, the rigidity of the membrane is increased, the deformation is reduced under the same sound pressure, the output electric signal is reduced, and the frequency response is reduced.
Therefore, how to design a MEMS packaging system that can not be affected by external force is a technical problem that needs to be solved.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a MEMS sensor and a MEMS microphone, so as to solve the problem that the product performance is affected due to the influence of external stress in the existing MEMS product.
The invention provides a MEMS sensor, comprising: the MEMS chip comprises a substrate and an MEMS chip arranged on the substrate; the MEMS chip comprises a substrate arranged on the substrate and an MEMS diaphragm attached to the substrate; at least one stress containing part is arranged on the substrate and used for isolating stress transmission between the substrate and the MEMS membrane.
In addition, an optional technical scheme is that the substrate is of a square structure and comprises a bottom part fixed with the base plate and a top part fixed with the MEMS membrane; a through hole is formed in the substrate, and the MEMS membrane is arranged to cover the through hole; the stress accommodating part is arranged at the bottom of the substrate and/or in the through hole.
In addition, an optional technical solution is that, when the stress accommodating portion is disposed at the bottom of the substrate, the stress accommodating portion includes an arc-shaped notch disposed at the bottom and extending toward the top or a continuous or dispersive accommodating groove disposed around the bottom.
In addition, an optional technical scheme is that the substrate is fixed on the base plate through glue, and the glue is partially filled in the stress accommodating part at the bottom.
In addition, an optional technical scheme is that when the stress accommodating part is arranged in the through hole, the through hole is in a polygonal shape with all sides being arc-shaped.
In addition, an optional technical solution is that the MEMS membrane includes a fixing portion and a functional portion disposed inside the fixing portion, the fixing portion is disposed on the substrate, and the functional portion is suspended in the through hole; at least two releasing seams are arranged on the fixing part or the functional part or the combination part of the fixing part and the functional part; the relief slit serves to absorb the stress to which the MEMS membrane is subjected.
In addition, the shape of the release slit is an arc, a circle or an ellipse.
In addition, an optional technical scheme is that the opening area of the release slit on the MEMS membrane is in direct proportion to the force applied to the corresponding position of the substrate.
In addition, an optional technical solution is that, when the substrate is rectangular, the release slit includes two arc-shaped slits arranged along a major axis direction of the substrate and two elliptical slits arranged along a minor axis direction of the substrate; and the area of the elliptic seam is larger than that of the arc-shaped seam.
According to another aspect of the present invention, there is provided a MEMS speaker including the above MEMS sensor.
By utilizing the MEMS sensor and the MEMS microphone, the substrate is provided with at least one stress containing part which is used for isolating stress transmission between the substrate and the MEMS membrane, when external load is transmitted to the substrate, the stress containing part can reduce external stress transmission to the substrate, and finally the purpose of isolating external stress transmission to the MEMS membrane is achieved, so that the stable and reliable performance of the MEMS microphone is ensured.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
FIG. 1 is a schematic diagram of a PCB and substrate structure of a MEMS sensor according to an embodiment of the invention;
FIG. 2 is a bottom view of a substrate of a MEMS sensor according to an embodiment of the invention;
FIG. 3 is a schematic view of a substrate structure according to a second embodiment of the present invention;
FIG. 4 is a schematic view of a substrate structure according to a third embodiment of the present invention;
FIG. 5 is a schematic view of a MEMS diaphragm in accordance with an embodiment of the invention.
Wherein the reference numerals include: PCB1, substrate 2, through-hole 21, arc-shaped notch 22, accommodating groove 23, arc-shaped slot 31, oval slot 32.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
To describe the MEMS sensor microphone of the present invention in detail, specific embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 shows a schematic structure of a PCB and a substrate of a MEMS sensor according to an embodiment of the invention; fig. 2 shows a bottom view of a substrate according to an embodiment of the invention.
As shown in fig. 1 and fig. 2 together, the MMES sensor according to the embodiment of the present invention includes a substrate and a MEMS chip disposed on the substrate; the MEMS chip further comprises a substrate 2 arranged on the base plate and an MEMS diaphragm attached to the substrate 2; and, be provided with at least one stress portion of acceping on substrate 2, stress portion of acceping is used for keeping apart the stress transmission between base plate and the MEMS diaphragm, and the power that the application condition of external load and terminal produced when entering and preventing the test transmits to the MEMS diaphragm, reduces the influence of the external stress that the functional area of MEMS diaphragm received.
Specifically, the substrate may be a PCB1, and the substrate 2 disposed thereon has a square hollow structure, including a bottom fixed to the substrate and a top fixed to the MEMS membrane; the substrate 2 is provided with a through hole 21 inside, the periphery of the MEMS membrane is fixed on the substrate 2 and is arranged to cover the through hole 21, the stress accommodating part is arranged at the bottom of the substrate 2 and/or in the through hole 21, and when the substrate 2 is fixed on the substrate through glue, the glue can be partially filled in the stress accommodating part at the bottom.
When the stress accommodating part is arranged at the bottom of the substrate 2, the stress accommodating part comprises an arc-shaped notch 22 which is arranged at the bottom and extends towards the top or a continuous or dispersive accommodating groove 23 which is arranged around the bottom, the arc-shaped notch 22 can be arranged at the positions of four edges of the substrate 2, namely, the bottom of the substrate 2 is arranged to be an arch structure, glue for fixing the substrate 2 and the base plate can be filled in the arc-shaped notch 22, the thickness of the glue layer of the substrate 2 is increased in a phase-changing manner, more external loads are absorbed through the glue layer, and the glue layer is prevented from being transmitted to the MEMS membrane through the substrate 2.
Further, while the arc-shaped notch 22 is provided, the bottom of the substrate 2 may also be provided with one accommodating groove 23, and the accommodating groove 23 may be a continuous groove arranged around the bottom of the substrate 2, that is, one accommodating groove 23 is provided; or the accommodating grooves 23 may be continuous grooves surrounding the bottom of the entire substrate 2, the width of the grooves is smaller than the thickness of the side walls of the substrate 2, the accommodating grooves 23 may also be elongated or circular grooves provided on the substrate 2, the amount of glue applied between the substrate 2 and the base plate can be increased by providing the accommodating grooves 23, the thickness of the glue layer can be increased or decreased, and the anti-drop performance of the sensor and the product thereof can be improved.
In addition, the conventional through hole 21 is generally a circular structure, which makes the wall thickness of the substrate different from place to place, the side wall at the corner of the substrate is thicker in size, and the side wall at the side of the substrate is thinner in size, and when the PCB1 or the substrate receives an external load, the thinner position of the wall is easily deformed, thereby transmitting the force to the MEMS membrane; for this reason, in the MMES sensor of the present invention, when the stress accommodating portion is provided in the through-hole 21, the shape of the through-hole 21 can be made a non-circular structure, thereby reducing the difference in wall thickness at each position of the substrate 2.
In particular, fig. 3 and 4 show schematic structures of substrates of two different embodiments of the present invention, respectively.
As shown in fig. 1 to 4, the shape of the through hole 21 may be a regular polygon, and the cross section of the through hole is a polygonal shape with all sides being arc-shaped, such as by setting all sides of the polygon to be arc-shaped structures, and changing the right angle of the polygon to be an arc angle.
FIG. 5 shows a schematic structure of a MEMS diaphragm in accordance with an embodiment of the invention.
In one embodiment of the present invention, as shown in fig. 5, the MEMS membrane includes a fixed portion and a functional portion disposed inside the fixed portion, the fixed portion is disposed on the substrate 2, and the functional portion is suspended in the through hole 21; at least two releasing seams are arranged on the fixing part or the functional part or the joint of the fixing part and the functional part, and the stress transmitted to the MEMS membrane is further absorbed through the releasing seams.
The release slits are holes in the MEMS membrane, the release slits can be in various shapes such as arc, circle, ellipse or crescent, the release slits in various shapes can be arranged on the same MEMS membrane to form a local rigidity weakening area, when external load is transmitted to the MEMS membrane, the external load can be absorbed through deformation of the local rigidity weakening area, the influence of the external load on the performance of the MEMS membrane is reduced, and the performance of the sensor can be improved.
Further, the opening area of the release slit at different positions can be adjusted according to the stress magnitude of the corresponding position of the substrate 2, and generally, the opening area of the release slit on the MEMS membrane is proportional to the stress magnitude of the corresponding position of the substrate 2. As a specific example, when the substrate is rectangular, the rigidity in the short axis direction is large and the stress transmitted to the MEMS membrane is also large when an external load is applied, so that a large area of relief slit can be provided in the short axis direction and a small area of relief slit can be provided in the long axis direction. For example, the release slits may include two arc-shaped slits 31 arranged in the major axis direction of the substrate and two elliptical slits 32 arranged in the minor axis direction of the substrate, and the area of the elliptical slits 32 is larger than that of the arc-shaped slits 31.
Correspondingly to the MEMS sensor, the invention also provides an MEMS microphone comprising the MEMS sensor.
It should be noted that, for the embodiments of the electronic device, reference may be made to the description of the embodiments of the MEMS sensor, and details are not repeated here.
According to the MEMS sensor and the MEMS microphone, the shape of the bottom and the through hole of the substrate can be improved, the stress accommodating part is arranged on the substrate, the stress transmission between the substrate or the substrate and the MEMS membrane is isolated through the stress accommodating part, when external load is transmitted to the substrate, the transmission of external stress on the substrate can be reduced through glue in the stress accommodating part, the MEMS membrane can be protected, the anti-falling performance of the MEMS microphone can be improved through increasing the glue coating amount, and the stable and reliable performance of the MEMS microphone can be ensured.
The MEMS sensor and MEMS microphone according to the present invention are described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the MEMS sensor and MEMS microphone of the present invention as set forth above without departing from the spirit of the invention. Accordingly, the scope of the invention should be determined from the content of the appended claims.
Claims (10)
1. A MEMS sensor comprises a substrate and a MEMS chip arranged on the substrate; it is characterized in that the preparation method is characterized in that,
the MEMS chip comprises a substrate arranged on the substrate and an MEMS membrane attached to the substrate; and the number of the first and second electrodes,
at least one stress containing part is arranged on the substrate and used for isolating stress transfer between the substrate and the MEMS membrane.
2. The MEMS sensor of claim 1,
the substrate is of a square structure and comprises a bottom part fixed with the substrate and a top part fixed with the MEMS diaphragm;
a through hole is formed in the substrate, and the MEMS membrane is arranged to cover the through hole;
the stress accommodating part is arranged at the bottom of the substrate and/or in the through hole.
3. The MEMS sensor of claim 2,
when the stress accommodating part is arranged at the bottom of the substrate, the stress accommodating part comprises an arc-shaped notch arranged at the bottom and extending towards the top or a continuous or dispersive accommodating groove arranged around the bottom.
4. The MEMS sensor of claim 3,
the substrate is fixed on the base plate through glue, and the glue is partially filled in the stress accommodating part at the bottom.
5. The MEMS sensor of claim 2,
when the stress accommodating part is arranged in the through hole, the shape of the through hole is a polygonal shape with all sides being arc-shaped.
6. The MEMS sensor of claim 2,
the MEMS membrane comprises a fixed part and a functional part arranged in the fixed part, the fixed part is arranged on the substrate, and the functional part is suspended in the through hole; and the number of the first and second electrodes,
at least two releasing seams are arranged on the fixing part or the functional part or the combination part of the fixing part and the functional part;
the relief slit is used for absorbing stress to which the MEMS membrane is subjected.
7. The MEMS sensor of claim 6,
the release slit is arc-shaped, circular or elliptical in shape.
8. The MEMS sensor of claim 6,
the opening area of the release slit on the MEMS membrane is in direct proportion to the stress of the corresponding position of the substrate.
9. The MEMS sensor of claim 6,
when the substrate is rectangular, the release seam comprises two arc-shaped seams arranged along the long axis direction of the substrate and two oval seams arranged along the short axis direction of the substrate;
and the area of the elliptic seam is larger than that of the arc-shaped seam.
10. A MEMS microphone comprising a MEMS sensor according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466852.4A CN115065919A (en) | 2022-04-29 | 2022-04-29 | MEMS sensor and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466852.4A CN115065919A (en) | 2022-04-29 | 2022-04-29 | MEMS sensor and MEMS microphone |
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| Publication Number | Publication Date |
|---|---|
| CN115065919A true CN115065919A (en) | 2022-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210466852.4A Pending CN115065919A (en) | 2022-04-29 | 2022-04-29 | MEMS sensor and MEMS microphone |
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| Country | Link |
|---|---|
| CN (1) | CN115065919A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012070166A1 (en) * | 2010-11-24 | 2012-05-31 | パナソニック株式会社 | Converter module and method for producing same |
| JP2015188946A (en) * | 2014-03-27 | 2015-11-02 | 新日本無線株式会社 | MEMS element |
| CN212851000U (en) * | 2020-09-27 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Piezoelectric microphone chip, microphone and electronic equipment |
| CN212850999U (en) * | 2020-09-27 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Piezoelectric microphone chip, microphone and electronic equipment |
| CN214177566U (en) * | 2020-12-30 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | Capacitance microphone |
| CN113993021A (en) * | 2020-07-11 | 2022-01-28 | 知微电子有限公司 | Acoustic transducer and wearable sound device |
-
2022
- 2022-04-29 CN CN202210466852.4A patent/CN115065919A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012070166A1 (en) * | 2010-11-24 | 2012-05-31 | パナソニック株式会社 | Converter module and method for producing same |
| JP2015188946A (en) * | 2014-03-27 | 2015-11-02 | 新日本無線株式会社 | MEMS element |
| CN113993021A (en) * | 2020-07-11 | 2022-01-28 | 知微电子有限公司 | Acoustic transducer and wearable sound device |
| CN212851000U (en) * | 2020-09-27 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Piezoelectric microphone chip, microphone and electronic equipment |
| CN212850999U (en) * | 2020-09-27 | 2021-03-30 | 潍坊歌尔微电子有限公司 | Piezoelectric microphone chip, microphone and electronic equipment |
| CN214177566U (en) * | 2020-12-30 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | Capacitance microphone |
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