CN114989903B - Composition for cleaning solid wax of LED chip - Google Patents
Composition for cleaning solid wax of LED chip Download PDFInfo
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- CN114989903B CN114989903B CN202210757787.0A CN202210757787A CN114989903B CN 114989903 B CN114989903 B CN 114989903B CN 202210757787 A CN202210757787 A CN 202210757787A CN 114989903 B CN114989903 B CN 114989903B
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- Prior art keywords
- imidazoline
- rosin
- solid wax
- composition
- agent
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- 239000007787 solid Substances 0.000 title claims abstract description 40
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 claims abstract description 49
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 36
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 35
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 26
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 230000000149 penetrating effect Effects 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000002738 chelating agent Substances 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000012498 ultrapure water Substances 0.000 claims abstract description 11
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 19
- 239000008096 xylene Substances 0.000 claims description 13
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 10
- 239000000194 fatty acid Substances 0.000 claims description 10
- 229930195729 fatty acid Natural products 0.000 claims description 10
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 238000003786 synthesis reaction Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000004090 dissolution Methods 0.000 claims description 5
- 238000004821 distillation Methods 0.000 claims description 5
- 150000004668 long chain fatty acids Chemical class 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 4
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 3
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 3
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 claims description 3
- XGDRLCRGKUCBQL-UHFFFAOYSA-N 1h-imidazole-4,5-dicarbonitrile Chemical compound N#CC=1N=CNC=1C#N XGDRLCRGKUCBQL-UHFFFAOYSA-N 0.000 claims description 3
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- KFDNQUWMBLVQNB-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].[Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KFDNQUWMBLVQNB-UHFFFAOYSA-N 0.000 claims description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- 229920001213 Polysorbate 20 Polymers 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 3
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 3
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 3
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- 235000001727 glucose Nutrition 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 claims description 3
- 229920000768 polyamine Polymers 0.000 claims description 3
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims description 3
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims description 3
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 3
- 229920000053 polysorbate 80 Polymers 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 235000011083 sodium citrates Nutrition 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 claims 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 150000002462 imidazolines Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 238000005260 corrosion Methods 0.000 abstract description 12
- 230000007797 corrosion Effects 0.000 abstract description 12
- 239000000126 substance Substances 0.000 abstract description 6
- 239000007772 electrode material Substances 0.000 abstract description 4
- 239000004094 surface-active agent Substances 0.000 abstract description 4
- 230000003670 easy-to-clean Effects 0.000 abstract description 3
- 239000001993 wax Substances 0.000 description 33
- 239000012459 cleaning agent Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 230000002209 hydrophobic effect Effects 0.000 description 6
- 239000012188 paraffin wax Substances 0.000 description 6
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/825—Mixtures of compounds all of which are non-ionic
- C11D1/8255—Mixtures of compounds all of which are non-ionic containing a combination of compounds differently alcoxylised or with differently alkylated chains
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/04—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
- C07D233/06—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms
- C07D233/08—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms with alkyl radicals, containing more than four carbon atoms, directly attached to ring carbon atoms
- C07D233/12—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms with alkyl radicals, containing more than four carbon atoms, directly attached to ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D233/16—Radicals substituted by nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2044—Dihydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/22—Carbohydrates or derivatives thereof
- C11D3/221—Mono, di- or trisaccharides or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/667—Neutral esters, e.g. sorbitan esters
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
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- C11D2111/22—
Abstract
The invention belongs to the technical field of surfactants, and particularly relates to a chemical preparation for the field of LEDs and a composition for cleaning solid wax of an LED chip. Comprises 15-20% of abietyl imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water. According to the invention, the rosin-based imidazoline nonionic surfactant, the penetrating agent and the emulsifying agent are mixed, so that the solid wax can be rapidly emulsified and dissolved, the metal electrode material is protected, the problem of corrosion of a water-based product on the market to the metal electrode is solved, and the water-based product is easy to clean and has no residue.
Description
Technical Field
The invention belongs to the technical field of surfactants, and particularly relates to a chemical preparation composition for the field of LEDs, which is used for cleaning solid wax of an LED chip.
Background
Before the LED chip packaging test, one surface of the functional area needs to be coated with solid wax, the functional area is fixed on a grinding disc under the pressure, and the exposed surface of the chip is subjected to grinding and polishing operation. After grinding and polishing, the chip is cleaned by a solid wax cleaning agent to recover the functional surface of the chip. The main components of solid waxes currently used in the industry are long chain fatty acids, rosin and denatured rosin derivatives.
The water-based paraffin removal liquid adopted by the solid paraffin cleaning agent on the market has low dissolution rate of solid paraffin, corrodes electrodes on the surface of a chip, can thoroughly clean dirt only by cleaning with subsequent chemical acetone, and has the problems of complex cleaning process, low paraffin dissolution efficiency, electrode corrosion, additional solvent acetone cleaning, increased use cost and the like. Patent CN 105779151A discloses a paraffin removal cleaning liquid, a preparation method and application thereof, and adopts a high-efficiency nonionic surfactant, a low-foam inhibition surfactant, a dispersion stabilizer and a deionized water system to clean solid paraffin. The water-based solid wax cleaning agent has the problems of complex cleaning process, low wax dissolving efficiency, electrode corrosion, extra solvent acetone cleaning, increased use cost and the like. The water-based solid wax cleaning agent adopted by the invention can quickly emulsify and dissolve solid wax by mixing the rosin-based imidazoline nonionic surfactant, the penetrant and the emulsifier, has a protective effect on metal electrode materials, solves the problem of corrosion of water-based products on the market on metal electrodes, and is easy to clean and free of residues.
Disclosure of Invention
The invention mainly solves the technical problem of providing a composition for cleaning the solid wax of an LED chip, which can quickly emulsify and dissolve the solid wax by mixing a rosin-based imidazoline nonionic surfactant, a penetrating agent and an emulsifying agent, has a protective effect on a metal electrode material, solves the problem of corrosion of a water-based product on the market on the metal electrode, and is easy to clean without residues.
In order to solve the problems, the invention is realized by adopting the following technical scheme.
The composition for cleaning the solid wax of the LED chip comprises the following components in percentage by mass as 100 percent: 15-20% of rosin-based imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water.
The structural formula of the rosin-based imidazoline nonionic surfactant is as follows:
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
The preparation method of the rosin-based imidazoline nonionic surfactant comprises the following steps:
1) Synthesis of fatty acid amide 3:
long chain fatty acid 1 (0.02 mol) and xylene (20 mL) were placed in a dry 250mL three neck round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. A solution of polyamine compound 2 (0.02 mol) in xylene (20 mL) was added dropwise to a 250mL three-necked flask and stirred. The mixture was reacted at 140-180℃for 2 hours, cooled to room temperature, and then distilled under reduced pressure to remove xylene. Fatty acid amide 3 was obtained in the following yields: 90%.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
2) Synthesis of imidazoline 4:
fatty acid amide 3 (0.02 mol) was dissolved in 40mL of xylene and placed in a 250mL three neck round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. The reaction is carried out for 3 hours at 200-240 ℃ at room temperature. The solvent was removed by distillation under reduced pressure. Imidazoline 4 was obtained in 90.2% yield.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
3) Synthesis of rosin-based imidazoline a:
imidazoline 4 (0.01 mol) was dissolved in 10mL of xylene and placed in a 250mL reaction flask and heated with a magnetic stirrer. Rosin acid 5 (0.01 mol) was dissolved in 10mL of xylene solution and added dropwise to a 250mL reaction flask. The mixture was then heated with stirring to 140-180 ℃ and reacted for 2 hours. The solvent was removed by distillation under reduced pressure, and dried to give rosin-based imidazoline a in a yield of 81.5%.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
The rosin radical and long-chain fatty hydrocarbon in the rosin radical imidazoline nonionic surfactant are similar to the wax in structure and are compatible, so that various components in the wax can be dissolved; the imidazoline has a special molecular structure, and the hydrophilic group of the imidazoline contains N atoms with lone pair electrons, and is easy to form coordination bonds with metal atoms, so that chemical adsorption is performed to slow down Fuhai, and the hydrophobic branched chain of the imidazoline can form a hydrophobic film on the surface far away from the metal, so that further corrosion of corrosive media is effectively prevented.
The penetrating agent is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrating agent SF.
The emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, tween 20, tween 60 and Tween 80.
The organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
The chelating agent is any one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown ether-6.
The high-purity water is deionized water, and the resistivity of the high-purity water at 25 ℃ is not lower than 18MΩ & cm.
The preparation method of the composition comprises the following steps: firstly adding an organic auxiliary agent, then adding a rosin-based imidazoline nonionic surfactant, after complete dissolution, adding a penetrating agent and an emulsifying agent, then adding water, forming a uniform system at a stirring speed of 200rpm, and then adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
The invention has the remarkable advantages that:
by adding the rosin-based imidazoline nonionic surfactant, wherein the rosin groups and the long-chain fatty hydrocarbon groups are compatible with the structural similarity of the wax, various compositions in the wax can be dissolved; the imidazoline has a special molecular structure, and the hydrophilic group of the imidazoline contains N atoms with lone pair electrons, and is easy to form coordination bonds with metal atoms, so that chemical adsorption is performed to slow down Fuhai, and the hydrophobic branched chain of the imidazoline can form a hydrophobic film on the surface far away from the metal, so that further corrosion of corrosive media is effectively prevented.
According to the invention, the rosin-based imidazoline nonionic surfactant is mixed with the penetrant and the emulsifier, wherein the penetrant can accelerate the penetration of the system to the solid wax on the surface of the substrate, so that the emulsifier and the rosin-based imidazoline nonionic surfactant can rapidly react with the solid wax to enable the solid wax to be rapidly emulsified and dissolved, and the rosin-based imidazoline nonionic surfactant has a protective effect on a metal electrode material, so that the problem of corrosion of a water-based product on the market to the metal electrode is solved, and meanwhile, the composition has the characteristics of small odor, no pollution to the environment, low foaming, easiness in rinsing and the like.
Detailed Description
A composition for cleaning solid wax of an LED chip, which is characterized in that: the total weight percentage is 100%, and the composition comprises the following components in percentage by mass: 15-20% of rosin-based imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water.
The rosin-based imidazoline nonionic surfactant is selected from the following structural components:
at least one of the surfactants, wherein n is an integer between 14 and 18, and m is an integer between 0 and 2. The preparation method of the rosin-based imidazoline nonionic surfactant comprises the following steps:
1) Synthesis of fatty acid amide 3:
long chain fatty acid 1 (0.02 mol) and xylene (20 mL) were placed in a dry 250mL three neck round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. A solution of polyamine compound 2 (0.02 mol) in xylene (20 mL) was added dropwise to a 250mL three-necked flask and stirred. The mixture was reacted at 140-180℃for 2 hours, cooled to room temperature, and then distilled under reduced pressure to remove xylene. Fatty acid amide 3 was obtained in the following yields: 90%.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
2) Synthesis of imidazoline 4:
fatty acid amide 3 (0.02 mol) was dissolved in 40mL of xylene and placed in a 250mL three neck round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. The reaction is carried out for 3 hours at 200-240 ℃ at room temperature. The solvent was removed by distillation under reduced pressure. Imidazoline 4 was obtained in 90.2% yield.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
3) Synthesis of rosin-based imidazoline a:
imidazoline 4 (0.01 mol) was dissolved in 10mL of xylene and placed in a 250mL reaction flask and heated with a magnetic stirrer. Rosin acid 5 (0.01 mol) was dissolved in 10mL of xylene solution and added dropwise to a 250mL reaction flask. The mixture was then heated with stirring to 140-180 ℃ and reacted for 2 hours. The solvent was removed by distillation under reduced pressure, and dried to give rosin-based imidazoline a in a yield of 81.5%.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
The rosin-based imidazoline nonionic surfactant used when n=17, m=1, the characterization data for compound a are as follows:
1 H NMR(300MHz，DMSO-d6),δ:0.88(m,9H,CH3),1.13-1.38(m,CH2,26H),1.47-1.91(m,10H,CH2),1.5(m,1H,NH),1.63(m,1H,CH),1.88(m,1H,CH),2.16-2.26(m,6H,CH2),2.64-2.66(m,4H,CH2),3.02(t,1H,CH),3.32-3.48(m,6H,CH2),3.75(t,2H,CH2),5.43-5.47(m,3H,CH),5.97(m,1H,CH),8.01(t,1H,NH).
13 C NMR(125MHz，DMSO-d6),δ:14.1,21.1,21.8,21.9,22.7,22.7,26,27.8,28.7,29.3,29.4,29.5,29.6,29.7,29.9,31.9,32.3,33.7,34.1,34.8,35.0,35.6,39.7,40.0,42.2,46.9,48.5,49.0,51.2,54.1,129.0,130.6,131.0,132.7,142.0,166,174.1.
HRMS calculated C42H73N4O (m+h) + 649.57, found 649.15.
The rosin radical and long-chain fatty hydrocarbon in the rosin radical imidazoline nonionic surfactant are similar to the wax in structure and are compatible, so that various components in the wax can be dissolved; the imidazoline has a special molecular structure, and the hydrophilic group of the imidazoline contains N atoms with lone pair electrons, and is easy to form coordination bonds with metal atoms, so that chemical adsorption is performed to slow down Fuhai, and the hydrophobic branched chain of the imidazoline can form a hydrophobic film on the surface far away from the metal, so that further corrosion of corrosive media is effectively prevented.
The penetrating agent is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrating agent SF.
The emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, tween 20, tween 60 and Tween 80.
The organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
The chelating agent is any one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown ether-6.
The high-purity water is deionized water, and the resistivity of the high-purity water at 25 ℃ is not lower than 18MΩ & cm.
The preparation method of the composition comprises the following steps: firstly adding an organic auxiliary agent, then adding a rosin-based imidazoline nonionic surfactant, after complete dissolution, adding a penetrating agent and an emulsifying agent, then adding water, forming a uniform system at a stirring speed of 200rpm, and then adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
In order to make the contents of the present invention more easily understood, the technical scheme of the present invention will be further described with reference to the specific embodiments, but the present invention is not limited thereto.
Cleaning agent compositions of different compositions were formulated according to the formulation of table 1.
TABLE 1 Components and amounts of the various cleaning agent compositions
The chips coated with solid wax were immersed in the cleaning agent compositions prepared in comparative examples 1 to 5 of examples 1 to 4, respectively, and the operation time was set at the set operation temperature, and were taken out, rinsed with deionized water, and dried with nitrogen gas. Observation was performed by using an optical microscope and an electron microscope to confirm the cleaning effect. The operating conditions and results are shown in Table 2.
TABLE 2 cleaning effect of different cleaning agent compositions on solid wax on chip
As can be seen from the combination of tables 1-2, the cleaning agent combination of the invention can effectively dissolve solid wax on a chip in a set temperature and time to obtain a solution which is uniformly dissolved, has no corrosion to electrodes, is easy to rinse and has no residue.
In contrast to example 1, comparative example 1 does not contain a rosin-based imidazoline nonionic surfactant, does not dissolve the wax on the chip surface at the operating temperature and time, and has a large amount of solid wax remaining and corroding the electrode.
In comparison with example 1, comparative example 2 contained no penetrant, most of the solid wax was dissolved at the operating temperature and time, and a small amount of the solid wax remained on the chip surface, and no corrosion to the electrode was caused.
In comparison with example 1, comparative example 3 contains no emulsifier, the system is unstable and delaminates, and the solid wax is not completely emulsified and dissolved at the operating temperature and time, and has no corrosion to the electrode.
In contrast to example 1, comparative example 4 contained no chelating agent, the solid wax dissolved at the operating temperature and time, and the electrode was non-corrosive with a small amount of solid wax sticking back to the chip surface.
Compared with example 1, comparative example 5 contains no organic auxiliary agent, the system is unstable, the solid is dissolved at the operating temperature and time, and greasy dirt remains on the chip surface.
As can be seen from the above examples 1 and comparative examples 1 to 5, the interaction of the rosin-based imidazoline nonionic surfactant with the penetrant and the emulsifier can emulsify and dissolve the solid wax on the chip surface, and the electrode is protected, the organic aid helps to clean and stabilize the system, the chelating agent has antistatic and anti-fouling effects, and the components are indispensable.
The above-described embodiments are provided to illustrate the present invention in detail, but are not intended to limit the scope of the present invention. All equivalent modifications and substitutions of the present invention using the description of the present invention are also included in the scope of the present invention.
Claims (8)
1. A composition for cleaning solid wax of an LED chip, which is characterized in that: the components in percentage by mass are: 15-20% of rosin-based imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water;
the structural formula of the rosin-based imidazoline nonionic surfactant is as follows:
，
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
2. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the preparation method of the rosin-based imidazoline nonionic surfactant comprises the following steps:
1) Synthesis of fatty acid amide 3:
stirring and mixing long-chain fatty acid, dimethylbenzene and polyamine compound, then reacting for 2 hours at 140-180 ℃, cooling to room temperature, and then distilling under reduced pressure to remove dimethylbenzene to obtain fatty acid amide;
2) Synthesis of imidazoline:
dissolving the fatty acid amide obtained in the step (1) in dimethylbenzene, and reacting for 3 hours at 200-240 ℃ to obtain imidazoline;
3) Synthesis of rosin-based imidazolines:
dissolving the imidazoline obtained in the step (2) in xylene, adding rosin acid, stirring and heating the mixture to 140-180 ℃ for reaction for 2 hours, removing the solvent by reduced pressure distillation, and drying to obtain rosin-based imidazoline;
the long chain fatty acid isPolyamine compound is->Fatty acid amide isImidazoline is->Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2; the abietic acid is->。
3. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the penetrating agent is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrating agent SF.
4. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, tween 20, tween 60 and Tween 80.
5. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
6. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the chelating agent is any one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown ether-6.
7. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the high-purity water is deionized water, and the resistivity of the high-purity water at 25 ℃ is not lower than 18MΩ & cm.
8. The composition for cleaning solid wax of LED chips as set forth in claim 1, wherein: the preparation method of the composition comprises the following steps: firstly adding an organic auxiliary agent, then adding a rosin-based imidazoline nonionic surfactant, after complete dissolution, adding a penetrating agent and an emulsifying agent, then adding high-purity water, forming a uniform system at a stirring speed of 200rpm, and then adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
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| CN113621443A (en) * | 2021-09-10 | 2021-11-09 | 福建省佑达环保材料有限公司 | Composition for cleaning semiconductor chip solid wax |
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| US20050277564A1 (en) * | 2004-06-15 | 2005-12-15 | Heise Karl A | Method of formulating a cleaning composition for use in cleaning surfaces |
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| US6162766A (en) * | 1998-05-29 | 2000-12-19 | 3M Innovative Properties Company | Encapsulated breakers, compositions and methods of use |
| CN108822148A (en) * | 2018-07-30 | 2018-11-16 | 广东石油化工学院 | A kind of synthetic method and its application of Rosin-based Imidazoline derivative corrosion inhibiter |
| WO2020024601A1 (en) * | 2018-07-30 | 2020-02-06 | 广东石油化工学院 | Synthesis method for rosin-based imidazoline derivative corrosion inhibitor and application thereof |
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