CN114980689A - Cooling cabinet and machine room cooling system - Google Patents

Abstract

The application discloses cooling rack and computer lab cooling system. The cooling cabinet comprises a cabinet body, a cooling assembly and an airflow driving assembly, the cabinet body is provided with a closed accommodating cavity, the accommodating cavity comprises a cooling area and a heat exchange area which are communicated with each other, the cooling cabinet is provided with a use state, in the use state, the heat exchange area is used for accommodating the heating element, and the accommodating cavity is used for filling pressurized gas so that the air pressure in the accommodating cavity is higher than 1 atm; the cooling assembly is arranged in the cooling area and used for cooling the pressurized gas; the airflow driving assembly is arranged in the accommodating cavity and used for enabling the pressurized gas to circularly flow between the cooling area and the heat exchange area, and then cooling the heating element. In the use state, the pressurized gas with the air pressure higher than 1atm and the heating element can efficiently exchange heat, and the heating element is prevented from being locally overheated. And the airflow driving component drives the pressurized air to flow, so that the power consumption is lower, and the energy is saved. The holding cavity is in a closed state, so that the heating element can be in a clean environment, and the heating element is effectively protected.

Description

Cooling cabinet and machine room cooling system

Technical Field

The application relates to the technical field of cooling cabinets, in particular to a cooling cabinet and a machine room cooling system.

Background

Rooms such as data center rooms and core rooms are important places for placing computer equipment. A large amount of computer equipment is gathered in the machine room, and the heat dissipation problem of the machine room is the key point of machine room design. At present, with the rapid increase of the computing power demand in China, computer equipment in the data center industry is rapidly developed, for example, the power of a training GPU (Graphics Processing Unit) related to AI (Artificial Intelligence) machine learning is increased from 400W to 500W, even the power of 700W of a single card can be reached, and the requirement of the computer equipment on heat dissipation is higher. When a large amount of computer equipment placed in a concentrated manner operates, if heat cannot be dissipated out in time, abnormal conditions such as heat accumulation or local overheating can occur, and the normal operation of the computer equipment can be influenced.

Disclosure of Invention

The embodiment of the application provides a cooling cabinet and a machine room cooling system, and the problem of low heat dissipation efficiency of a machine room can be solved.

In a first aspect, an embodiment of the present application provides a cooling cabinet, including:

the cooling cabinet is provided with a use state, the heat exchange area is used for accommodating a heating part, and the accommodating cavity is used for filling pressurized gas so that the air pressure in the accommodating cavity is higher than 1 atm;

the cooling assembly is arranged in the cooling area and used for cooling the pressurized gas; and

and the airflow driving component is arranged in the accommodating cavity and is used for enabling the pressurized gas to circularly flow between the cooling area and the heat exchange area so as to cool the heating element.

In a second aspect, embodiments of the present application provide a machine room cooling system, including a cooling cabinet as described above.

Based on cooling rack and computer lab cooling system of this application embodiment, when the cooling rack is in the user state, the gaseous atmospheric pressure of intracavity pressure boost that holds of box is greater than 1atm, makes the pressure boost after being cooled down by cooling module when contacting with the piece that generates heat, and pressure boost can high-efficiently heat transfer with the piece that generates heat to the temperature of each part of the piece that generates heat of quick balance, prevent to generate heat a local overheat, effectively improve the cooling rack to the radiating efficiency who generates heat when the user state. And under the environment that atmospheric pressure is greater than 1atm, the drive of air current drive assembly holds the intracavity pressurized gas and flows the consumption littleer, and then the energy saving. The holding cavity is in a closed state, material exchange with the outside is not needed, the heating part can be in a clean environment, the heating part is prevented from contacting with external materials, and the heating part is effectively protected.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic perspective view of a cooling cabinet according to an embodiment of the present application;

FIG. 2 is an exploded view of a cooling cabinet according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a housing according to an embodiment of the present application;

FIG. 4 is a schematic cross-sectional view taken along the line A-A of FIG. 1 of the present application.

Reference numerals:

100. cooling the cabinet; 101 accommodating cavity

1011. A cooling zone; 1012. a heat exchange zone; x, a preset direction;

101a, an air supply flow equalizing zone; 101b, an air return flow equalizing zone; 101c, a heat source placing area;

110. a box body; 111. a housing; 1111. a first housing; 1112. a second housing;

112. a partition plate; 113. a cabinet door; 112a, an air supply opening; 112b, return air opening;

120. a cooling assembly; 121. a cooling tube; 122. a heat exchanger fin;

102. a heat exchange section; 1211. a liquid inlet section; 1212. a liquid outlet section; 1213. a transition section;

130. an airflow driving assembly; 131. an air supply fan;

140. an air supply flow equalizing piece; 141. an air supply flow equalizing plate; 140a, an air supply hole; 141b, windward side;

150. return air flow equalizing parts; 151. a return air flow equalizing plate; 150a, return air holes; 150b, a return air surface;

160. a scavenging valve;

200. a heat generating member.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The inventor finds that with the improvement of the power density of computer equipment, although the cooling efficiency of the computer equipment with high power density is improved by adopting a liquid cooling system, a large amount of cooling media, cooling pipelines and other materials are still needed to meet the cooling requirement. In the transformation of various computer rooms, if the original air cooling system is directly transformed into a liquid cooling system, the problems of insufficient bearing capacity and the like of a building can exist.

In addition, the inventors have found that a precision refrigeration system, for example, a train air conditioner, has a good heat dissipation effect when applied to a high heat density data center, various kinds of modular data centers, a data center with a low PUE value (Power Usage efficiency) requirement, a local hot spot modification of a machine room, a high heat density area of a medium-large machine room, a data center with a tight machine room area, and the like. However, when a precise refrigeration system is adopted for cooling, the problem of large power consumption mainly exists. For example, a compressor of an air-cooled inter-row air conditioner mostly adopts a variable-capacity digital scroll compressor for refrigeration, an EC fan (the EC fan refers to a centrifugal fan adopting a digital brushless direct-current external rotor motor or a centrifugal fan adopting an EC motor, namely an electric exchange motor) is adopted for air supply, the fan is communicated with a pipeline, the pipeline is arranged around the periphery of computer equipment, cold air flows in the pipeline, the compressor and the fan adjust the flowing state of the cold air in the pipeline according to the heat load in the pipeline so as to take away the heat generated by the computer equipment, improve the uniformity of the temperature of the computer equipment and prevent the local overheating of the computer equipment, but the power consumption of the compressor and the fan is very large in the air-cooled cooling mode.

To solve the above problem, as shown in fig. 1 and fig. 2, an embodiment of the present application provides a cooling cabinet 100, where the cooling cabinet 100 includes a cabinet 110, a cooling assembly 120, and an airflow driving assembly 130, and both the cooling assembly 120 and the airflow driving assembly 130 are disposed in the cabinet 110. The cooling cabinet 100 has a use state in which the cooling assembly 120 is used for cooling the air around the cooling cabinet, and the airflow driving assembly 130 is used for driving the air around the cooling cabinet to flow.

As shown in fig. 3, the box body 110 has a closed accommodating chamber 101, for example, at least in a use state, the accommodating chamber 101 of the box body 110 is in a closed state to block foreign matters from entering the accommodating chamber 101 and prevent the foreign matters from contacting with a structure installed in the accommodating chamber 101, and the air pressure in the accommodating chamber 101 is not changed. In the use state, except for adjusting the air pressure in the accommodating cavity 101 to charge the pressurized air into the accommodating cavity 101 or exhausting the air from the accommodating cavity 101, the accommodating cavity 101 of the cooling cabinet 100 does not exchange the substances with the outside, so that a good working environment is provided for the heat generating member 200 in the use state, and the working stability of the heat generating member 200 is further improved. The heat generating member 200 includes, but is not limited to, computer equipment in a computer room.

The containing cavity 101 comprises a cooling area 1011 and a heat exchange area 1012 which are communicated with each other, and the cooling area 1011 and the heat exchange area 1012 can be directly connected to realize the communication, for example, when a separation structure is not arranged in the box body 110, the cooling area 1011 and the heat exchange area 1012 are directly connected to realize the communication, that is, the containing cavity 101 is a complete space which is not divided; alternatively, as shown in fig. 4, when a partition structure is provided in the box body 110, for example, the partition structure is the partition plate 112, the receiving cavity 101 may be divided by the partition structure to form the cooling area 1011 and the heat exchange area 1012, and the partition structure defines an area communicating the cooling area 1011 and the heat exchange area 1012.

Wherein, in the user state, hold chamber 101 and be used for filling pressurized gas to the atmospheric pressure that makes in holding chamber 101 is higher than 1atm, and heat transfer district 1012 is used for the holding to generate heat a 200, makes to generate heat a 200 and is located high pressure environment, and at this moment, the chamber 101 that holds of box 110 is airtight state no longer takes a breath with the external world. The cooling assembly 120 is disposed in the cooling region 1011, and the cooling assembly 120 is operative to cool the pressurized gas in the cooling region 1011. The airflow driving assembly 130 may be disposed at any position in the accommodating cavity 101, and the airflow driving assembly 130 is configured to circulate the pressurized gas between the cooling area 1011 and the heat exchanging area 1012, and absorb heat of the heat generating member 200 to cool the heat generating member 200 when the pressurized gas flows to the vicinity of the heat generating member 200. The pressurized gas absorbing the heat of the heat generating member 200 flows back to the cooling region 1011, and continues to circularly flow to the heat exchanging region 1012 after being re-absorbed by the cooling module 120 to reduce the temperature, so that the pressurized gas circularly flows to continuously reduce the temperature of the heat generating member 200.

In a use state, except for adjusting the air pressure in the accommodating cavity 101 to charge the pressurized air into the accommodating cavity 101 or exhausting the air from the accommodating cavity 101, the accommodating cavity 101 of the cooling cabinet 100 does not exchange the substances with the outside, so that a good working environment is provided for the heat generating member 200, and the working stability of the heat generating member 200 is further improved.

In the user state, when holding chamber 101 internal gas pressure and being greater than 1atm, the pressurized gas is higher with the heat transfer efficiency when generating heat the piece 200 contact to make the pressurized gas to the cooling of generating heat piece 200 faster, and along with the increase of atmospheric pressure, heat transfer efficiency is faster, in addition, under the condition of the same heat transfer requirement, still can make the consumption of air current drive assembly 130 littleer. It can be understood that when the pressurized gas circulates in the cooling area 1011 and the heat exchanging area 1012, the pressurized gas is influenced by the heat of the heat generating member 200, and the like, and the pressure in different areas in the accommodating chamber 101 has a slight difference, and the pressure in the accommodating chamber 101 according to the embodiment of the present application is the average pressure in each area in the accommodating chamber 101.

Alternatively, the pressure range of the pressurized gas is greater than or equal to 2atm and less than or equal to 5atm, within which the heat exchange efficiency of the pressurized gas with the heat generating member 200 can be effectively improved, and the power consumption of the airflow driving assembly 130 can be effectively reduced.

Optionally, the pressurized gas is nitrogen or air, the nitrogen is inactive gas, and the air is ambient gas in which the heat generating member 200 is located at the normal pressure state, so that the nitrogen or air is filled into the accommodating chamber 101 as the pressurized gas and pressurized, and the nitrogen or air contacts the heat generating member 200, so that the pressurized gas is prevented from reacting with components of the heat generating member 200, and the heat generating member 200 is protected.

Among them, it can be derived from the following equations (1) to (15) that the power consumption of the airflow driving assembly 130 is low in the high-pressure state where the air pressure is greater than 1 atm. The method comprises the following specific steps:

the power N of the airflow driving assembly 130 is shown in the following formula (1):

N＝Vp _f /(3600*1000*η0*η1) (1)

in equation (1), V is the volumetric flow rate of pressurized gas through the gas flow driving assembly 130, p _f The total air pressure of the airflow driving component 130 (i.e. the air pressure difference between the air outlet and the air inlet of the airflow driving component 130), η 0 is the internal efficiency of the airflow driving component 130, and η 1 is the mechanical efficiency of the airflow driving component 130. When the internal efficiency η 0, the mechanical efficiency η 1, and the full wind pressure pf of the airflow driving assembly 130 are all unchanged, the power N of the airflow driving assembly 130 is directly proportional to the volume flow V of the pressurized gas.

As can be seen from the Darcy formula, the loss Δ l of the internal resistance of the air channel in the airflow driving assembly 130 is proportional to the square of the wind speed v and is proportional to the density ρ of the pressurized air, i.e., Δ l is proportional to v ² ·ρ。

And the full wind pressure p generated by the airflow driving assembly 130 _f The pressurized gas can be driven to circulate by overcoming the internal resistance loss delta l of the air channel, namely p _f From this, p is known as _f Is proportional to v ² ·ρ。

In the following formula, the subscript air represents the pressurized gas at a pressure of 1atm, and the subscript high represents the pressurized gas at a pressure of more than 1atm, and can be obtained:

p _f,air /p _f,high ＝(v _air ² ·ρ _air )/(v _high ² ·ρ _high ) (2)

since the volumetric flow rate V of the pressurized gas is s · V, where s is the cross-sectional area of the pressurized gas passing through the gas flow driving assembly 130, when the cross-sectional area s is the same, then:

V _air /V _high ＝v _air /v _high (3)

obtainable from the above formula (1), formula (2) and formula (3):

N _air /N _high ＝(V _air ³ ·ρ _air )/(V _high ³ ·ρ _high ) (4)

the pyrolysis power Q of the heat generating member 200 is shown by the following formula (5):

Q＝ρC _p V△t (5)

in the formula (5), ρ is the density of the supercharged gas, C _p The specific heat capacity of the pressurized gas is constant pressure, V is the volume flow rate of the pressurized gas, and Δ t is the return air temperature difference of the pressurized gas (the temperature difference between the pressurized gas near the cooling module 120 and the pressurized gas near the heating element 200 is taken as the return air temperature difference).

When the temperature difference Deltat of the returned air is the same as the pyrolysis power Q of the heating element 200, namely Q _air ＝Q _high ，△t _air ＝△t _high Obtained according to formula (5):

ρ _air C _p,air V _air ＝ρ _high C _p,high V _high (6)

obtained according to equation (6):

V _air /V _high ＝(ρ _high ·C _p,high )/(ρ _air ·C _p,air ) (7)

the following can be obtained from the above formulae (4) and (7):

the ideal gas state equation includes the following formulas (9) to (12):

pV＝nRT (9)

ρV＝m＝nM (10)

Rg＝R/M (11)

Cp＝(k/k-1)Rg (12)

in the above formula (9) -formula (12), P is the pressure of the pressurized gas, M is the molar mass of the pressurized gas, R is the universal constant of the pressurized gas, T is the temperature of the pressurized gas, n is the amount of the pressurized gas, M is the mass of the pressurized gas, Cp is the constant-pressure specific heat capacity of the pressurized gas, and k is the specific heat capacity ratio of the gas.

Obtained from the above formulas (9) to (10):

ρ＝pM/RT (13)

obtained from the above formulas (11) to (12):

Cp＝(k/k-1)·(R/M) (14)

from the above formulae (8), (13) and (14):

in the use state, the pressure in the housing chamber 101 is constant, the pressurized gas is an ideal gas, and when the pressure in the housing chamber 101 is greater than 1atm, the influence of the pressure on the specific heat capacity ratio k is negligible. For example, in an environment at room temperature of 25 ℃, the specific heat capacity of air is 1.4017kJ/(kg K) when the air pressure is 1atm, the specific heat of air is 1.4070kJ/(kg K) when the air pressure is 4atm, and the specific heat capacity of air at two air pressures changes very little, i.e., the influence of the air pressure on the specific heat ratio K of the supercharged gas is negligible.

As can be seen from the above equation (15), when the molar mass M and the specific heat capacity ratio k are constant, the power consumption N of the airflow driving assembly 130 gradually decreases as the air pressure p in the accommodating chamber 101 increases.

As shown in fig. 4, in some embodiments, cooling cabinet 100 may also include supply air flow equalizers 140. The air supply flow equalizing member 140 is disposed in the heat exchanging region 1012 and forms an air supply flow equalizing region 101a with the inner wall of the box body 110, the air supply flow equalizing member 140 is provided with a plurality of air supply holes 140a, and the cooling region 1011, the air supply flow equalizing region 101a and the air supply holes 140a are sequentially communicated. In a use state, the air supply holes 140a are arranged toward the heating element 200, so that the pressurized air in the cooling area 1011 can enter the air supply flow equalizing region 101a from the cooling area 1011, and is delivered to the heating element 200 through the air supply holes 140a after being equalized by the air supply flow equalizing element 140. The pressurized gas after being flow equalized by the air supply flow equalizing member 140 can be uniformly delivered to the heating member 200, so that the pressurized gas is prevented from being delivered to the layout part of the heating member 200, the contact quantity of the pressurized gas and each part of the heating member 200 is prevented from being different, and the local overheating of the heating member 200 is avoided.

The air supply flow equalizing region 101a and the area for accommodating the heating element 200 are arranged side by side along the preset direction X, and the cooling region 1011 is arranged on one side of the air supply flow equalizing region 101a and the area for accommodating the heating element 200 along the direction perpendicular to the preset direction X. After the pressurized air in the cooling area 1011 is delivered to the air flow equalizing area 101a, the pressurized air can turn in the air flow equalizing area 101a, and then flows through the air supply holes 140a of the air flow equalizing member 140 to the space where the heating member 200 is located, so as to contact with the heating member 200. The pressurized air turns in the air supply flow equalizing region 101a, so that the air flow of each part in the air supply flow equalizing region 101a tends to be uniform, and the pressurized air in the air supply flow equalizing region 101a passes through the air supply flow equalizing member 140 and can be more uniformly delivered to the heating member 200.

Optionally, the air supply flow equalizing member 140 is an air supply flow equalizing plate 141, the air supply flow equalizing plate 141 is disposed in the box body 110, a plate surface of the air supply flow equalizing plate 141 is perpendicular to the preset direction X, the air supply flow equalizing plate 141 is connected to the box body 110, the air supply flow equalizing plate 141 has a windward side 141b, and the windward side 141b of the air supply flow equalizing plate 141 and a wall surface of the box body 110 jointly define the air supply flow equalizing region 101 a. The air holes 140a penetrate the air-supply flow equalizing plate 141 from the windward surface 141b in the predetermined direction X, and in a use state, a surface of the air-supply flow equalizing plate 141 facing away from the windward surface 141b faces the heat generating member 200.

The cooling cabinet 100 further includes a return air flow equalizing member 150, the return air flow equalizing member 150 is disposed in the heat exchanging region 1012, and forms a return air flow equalizing region 101b with the inner wall of the cabinet 110, and forms a heat source placing region 101c with at least the supply air flow equalizing member 140, where the heat source placing region 101c is a region for accommodating the heat generating member 200. The return air flow equalizing member 150 has a plurality of return air holes 150a, and the air supply hole 140a, the heat source placing area 101c, the return air hole 150a, the return air flow equalizing area 101b and the cooling area 1011 are sequentially communicated, so that the pressurized air in the supply air flow equalizing area 101a can pass through the air supply hole 140a to reach the heat source placing area 101c, then enters the return air flow equalizing area 101b from the return air hole 150a and flows back to the cooling area 1011, and thus the pressurized air circularly flows in the accommodating cavity 101.

The return air flow equalizing member 150 is used for uniformly receiving the pressurized air in the heat source placing area 101c, so that the pressurized air can flow more uniformly after entering the heat source placing area 101c from the air supply hole 140a and before reaching the return air hole 150a, and uniformly contacts with all parts of the heating member 200, thereby uniformly cooling the heating member 200 and preventing the heating member 200 from being locally overheated.

Optionally, the return air flow equalizing member 150 is a return air flow equalizing plate 151, the return air flow equalizing plate 151 is disposed in the box body 110, a plate surface of the return air flow equalizing plate 151 is perpendicular to the preset direction X, the return air flow equalizing plate 151 is connected to the box body 110, the return air flow equalizing plate 151 has a return air surface 150b, and the return air surface 150b of the return air flow equalizing plate 151 and an inner wall surface of the box body 110 define a return air flow equalizing zone 101 b. The return air hole 150a penetrates from the surface of the return air equalizing plate 151 facing the heat source placement area 101c to the return air surface 150b in the predetermined direction X, so that the pressurized air from the heat source placement area 101c can pass through the return air hole 150a to reach the return air equalizing area 101 b.

Alternatively, when the return air flow equalizing member 150 is a return air flow equalizing plate 151 and the supply air flow equalizing member 140 is a supply air flow equalizing plate 141, the surface of the return air flow equalizing plate 151 facing away from the return air surface 150b, the surface of the supply air flow equalizing plate 141 facing away from the windward surface 141b, and a part of the inner wall surface of the case 110 together define the heat source accommodating area 101 c. In other embodiments, the return air flow straightener 150 and the supply air flow straightener 140 are not limited to be plate-shaped, and can be selected according to actual needs.

As shown in fig. 4, the return air flow equalizing member 150 and the supply air flow equalizing member 140 are disposed opposite to each other along the predetermined direction X, so that the return air flow equalizing region 101b and the supply air flow equalizing region 101a are disposed at opposite sides of the heat source placing region 101c along the predetermined direction X, so that the pressurized air passing through the supply air holes 140a directly passes through the heat source placing region 101c along the predetermined direction X and then enters the return air holes 150a, so that the pressurized air can flow more uniformly in the heat source placing region 101 c.

In some embodiments, the plurality of blowing holes 140a of the supply air equalizing member 140 are uniformly arranged in a plane perpendicular to the predetermined direction, and at this time, the supply air fan 131 may be configured to supply the pressurized air to the supply air equalizing region 101a along a direction perpendicular to the predetermined direction X, so that the pressurized air is reversed after contacting the wall surface of the box 110, and the pressurized air can be distributed more uniformly in the supply air equalizing region 101a, and thus can more uniformly pass through the plurality of blowing holes 140. Further, the return holes 150a of the return air equalizing zone 150 are uniformly arranged in a plane perpendicular to the preset direction X, so that the pressurized air in each area in the heat source placing zone 101c can pass through the corresponding return holes 150a along the preset direction X or a direction approaching the preset direction X, and the flow of the pressurized air in the heat source placing zone 101c is more stable.

In a use state, the position of placing of adjustable cooling rack 100, make return air flow equalizing piece 150 and air supply flow equalizing piece 140 along presetting the relative setting of direction X, at this moment, it is the horizontal direction to preset direction X, heat transfer district 1012 is located the below of cooling district 1011 along the direction of gravity (vertical direction promptly), so that the low temperature pressurized gas after the cooling district 1011 is cooled sinks to the heat transfer district 1012 in along the direction of gravity, the high temperature pressurized gas after absorbing heat-generating component 200 heat in the heat transfer district 1012 floats to the cooling district 1011, so, pressurized gas's circulation can be promoted, and heat exchange efficiency is improved.

When the heat exchange area 1012 is located below the cooling area 1011 along the gravity direction, and the return air flow equalizing area 101b and the supply air flow equalizing area 101a are located at two opposite sides of the heat source placement area 101c along the horizontal direction, the pressurized air in the cooling area 1011 sinks to the supply air flow equalizing area 101a, contacts the wall surface of the box body 110 for limiting the supply air flow equalizing area 101a, then reverses to flow through the air supply holes 140a to enter the heat source placement area 101c, and after absorbing the heat of the heating element 200, the pressurized air enters the return air flow equalizing area 101b from the return air holes 150a, reverses to float upwards in the return air flow equalizing area 101b to flow back to the cooling area 1011. Optionally, the cooling area 1011 and the heat source placement area 101c at least partially overlap in the direction of gravity to simplify the flow path of the pressurized gas from the cooling area 1011 to the supply air flow equalizing area 101a and to simplify the flow path of the pressurized gas from the return air flow equalizing area 101b back to the cooling area 1011. Further, in the direction of gravity, the cooling zone 1011 covers the heat exchange zone 1012.

Referring to fig. 2 and 4, the box 110 includes a housing 111 and a partition 112, the housing 111 has a receiving cavity 101, the partition 112 is disposed in the receiving cavity 101 and fixed to the housing 111, the partition 112 divides the receiving cavity 101 into a cooling area 1011 and a heat exchange area 1012, the partition 112 has an air supply opening 112a or the partition 112 and the housing 111 form the air supply opening 112a, the pressurized air in the cooling area 1011 enters the heat exchange area 1012 from the air supply opening 112a, the partition 112 further has a return air opening 112b or the partition 112 and the housing 111 form the return air opening 112b, and the pressurized air in the heat exchange area 1012 flows back to the cooling area 1011 from the return air opening 112 b. When the cooling cabinet 100 further comprises the air supply flow equalizing piece 140 and the return air flow equalizing piece 150, the accommodating cavity 101 is divided into four ordered spaces, namely a cooling area 1011, an air supply flow equalizing area 101a, a heat source placing area 101c and a return air flow equalizing area 101b, by the air supply flow equalizing piece 140, the return air flow equalizing piece 150 and the partition plate 112, so that the pressurized gas sequentially and circularly flows in the four areas, the pressurized gas in the four areas is prevented from being mutually interfered, and the heat exchange efficiency is further improved.

The air supply opening 112a and the air return opening 112b can be directly communicated with the heat exchange area 1012, that is, the air supply opening 112a is directly communicated with the air supply equalizing area 101a of the heat exchange area 1012, and the air return opening 112b is directly communicated with the air return equalizing area 101b of the heat exchange area 1012, at this time, the end of the partition 112 provided with the air supply opening 112a, the air supply equalizing plate 141 and the shell 111 jointly define the air supply equalizing area 101a, the other end of the partition 112 provided with the air return opening 112b, the air return equalizing plate 151 and the shell 111 jointly define the air return equalizing area 101b, and the middle part of the partition 112, the air supply equalizing plate 141, the air return equalizing plate 151 and the shell 111 jointly define the heat source placing area 101c, and in the use state, the bottom of the shell 111 is used for bearing the heat generating element 200.

It should be noted that, in order to make the pressurized air smoothly enter the air supply equalizing zone 101a from the cooling zone 1011 through the air supply opening 112a and make the pressurized air smoothly enter the cooling zone 1011 from the return air equalizing zone 101b through the return air opening 112b, the air flow driving assembly 130 may be disposed in other areas outside the cooling zone 1011, for example, the air flow driving assembly 130 may be disposed at least one of the air supply opening 112a and the return air opening 112 b.

The airflow driving assembly 130 may include at least one of a blower fan 131 and an exhaust fan to drive the pressurized air to circulate in the receiving chamber 101.

When the airflow driving assembly 130 is located at the air supply opening 112a, the airflow driving assembly 130 is arranged to include an air supply fan 131, the air supply fan 131 supplies the pressurized air in the cooling area 1011 to the air supply equalizing area 101a in an air supply manner, and the direction of an air outlet of the air supply fan 131 is set so that the pressurized air entering the air supply equalizing area 101a flows in a direction perpendicular to the preset direction X, and the pressurized air is reversed after contacting the inner wall of the housing 111 and passes through the air supply hole 140 a. Alternatively, the air supply fan 131 is provided in the air supply opening 112a and fixed to the partition 112. When the air supply opening 112a is formed by the partition 112 and the casing 111, the air supply fan 131 may be located in the air supply opening 112a and fixed to at least one of the plate 112 and the casing 111.

When the airflow driving assembly 130 is located at the return air opening 112b, the airflow driving assembly 130 is configured to include an air extracting fan, and the air extracting fan pumps the pressurized air in the return air uniform flow region 101b to the cooling region 1011 in an air extracting manner, so as to drive the pressurized air in each region in the accommodating cavity 101 to circularly flow. Optionally, an extractor fan is positioned within the return air opening 112b and secured to the partition 112. When the return air opening 112b is formed by the partition 112 and the casing 111, the exhaust fan may be located in the return air opening 112b and fixed to at least one of the plate 112 and the casing 111.

In other embodiments, the airflow driving assembly 130 may also be disposed in other areas besides the cooling area 1011, the air supply opening 112a and the return air opening 112b, which is not limited in this application and may be selected according to actual requirements, for example, the airflow driving assembly 130 includes an air extracting fan, and the air extracting fan is disposed in the return air flow equalizing area 101b and fixed to the housing 111. It should be noted that, when the installation position of the airflow driving assembly 130 is selected, preferably, the airflow driving assembly 130 is disposed on a side of the return air flow equalizing member 150 away from the heat source placing area 101c, and the pressurized air is driven to sequentially pass through the supply air flow equalizing member 140 and the return air flow equalizing member 150 by air suction, so that the pressurized air can flow more uniformly and stably in the heat source placing area 101 c.

As shown in fig. 2 and 4, the cooling assembly 120 includes a cooling pipe 121, the cooling pipe 121 includes a heat exchange section 102 accommodated in the cooling area 1011, and in a use state, a flow direction of a cooling medium flowing in the heat exchange section 102 is opposite to a flow direction of a pressurized gas flowing in the cooling area 1011, so as to facilitate heat exchange and improve heat exchange efficiency.

Optionally, the cooling pipe 121 is a straight pipe, and the straight pipe extends in parallel to the predetermined direction X, and at this time, the portion of the straight pipe accommodated in the cooling area 1011 forms the heat exchange section 102.

Optionally, the cooling pipe 121 includes a liquid inlet section 1211, a liquid outlet section 1212, and a transition section 1213 connected between the liquid inlet section 1211 and the liquid outlet section 1212, the liquid inlet section 1211 and the liquid outlet section 1212 may be arranged side by side along a direction perpendicular to the preset direction X, and the liquid inlet section 1211 and the liquid outlet section 1212 are arranged to penetrate through a portion of the housing 111 away from the air supply opening 112a, at this time, a flow direction of the cooling fluid in the liquid outlet section 1212 is opposite to a flow direction of the pressurized air, that is, the liquid outlet section 1212 forms the heat exchange section 102; alternatively, the liquid inlet section 1211 and the liquid outlet section 1212 are disposed through the portion of the casing 111 adjacent to the air blowing opening 112a, at this time, the flow direction of the cooling fluid in the liquid inlet section 1211 is opposite to the flow direction of the pressurized air, that is, the liquid inlet section 1211 forms the heat exchange section 102.

The cooling module 120 may further include a plurality of heat exchanger fins 122, and at least one of the cooling tubes 121 and the heat exchanger fins 122 is fixed to the case 110. A plurality of heat exchanger fins 122 all connect in heat exchanger section 102 periphery, and two adjacent heat exchanger fins 122 interval sets up, and heat exchanger fins 122 through the interval setting improve cooling module 120 and cooling area 1011 interior pressurized gas's area of contact. When the cooling pipe 121 includes the liquid inlet section 1211, the liquid outlet section 1212 and the transition section 1213, the heat exchange fins 122 are disposed to be connected to the peripheries of the liquid inlet section 1211, the liquid outlet section 1212 and the transition section 1213, so as to further improve the heat exchange efficiency.

The box body 110 comprises a cabinet door 113, the cabinet door 113 is movably mounted on the outer shell 111, the cabinet door 113 can be opened or closed, and when the cabinet door 113 is closed, the cabinet door 113 and the outer shell 111 jointly define the accommodating cavity 101. Cabinet door 113 is disposed at least corresponding to heat exchanging area 1012, for example, cabinet door 113 is disposed corresponding to heat source placing area 101c, and further, cabinet door 113 may be disposed corresponding to both heat source placing area 101c and cooling area 1011. The cabinet door 113 can be opened to place the heating member 200 in the heat source placing area 101c, and in a use state, the cabinet door 113 is closed to place the heating member 200 in the closed accommodating cavity 101.

When the cabinet door 113 is disposed corresponding to the heat source placing area 101c, the housing 111 may include a first housing 1111 and a second housing 1112, the partition plate 112 is fixed to the first housing 1111, and the cabinet door 113 is movably installed in the first housing 1111, and at this time, the first housing 1111, the cabinet door 113 and the partition plate 112 jointly define the heat exchanging area 1012. The second housing 1112 is disposed on a side of the partition 112 away from the heat exchange area 1012 and is mounted to the first housing 1111, in which case the first housing 1111 and the partition together define the cooling area 1011.

Referring to fig. 1 and 2, the cooling cabinet 100 further includes a ventilation valve 160 disposed in the box body 110, the ventilation valve 160 is communicated with the accommodating chamber 101, pressurized gas is injected into the accommodating chamber 101 through the ventilation valve 160, so that the pressure in the accommodating chamber 101 is greater than 1atm, or the pressurized gas in the accommodating chamber 101 is discharged through the ventilation valve 160 when the cabinet door 113 needs to be opened to inspect the heat generating component 200.

The embodiment of the present application further provides a machine room cooling system, which includes the cooling cabinets 100 as described above, where the number of the cooling cabinets 100 is multiple and the cooling cabinets are arranged side by side. The machine room cooling system further includes a liquid supply device (not shown) and a control module (not shown), wherein the liquid supply device is used for supplying a cooling medium into the cooling pipe 121, and the cooling medium includes cooling water and the like. The control module is electrically connected to the liquid supply device and the air flow driving assembly 130, respectively. In the use state, the flow state of the cooling medium is adjusted through the liquid supply device, and the flow state of the pressurized gas in the accommodating cavity 101 is adjusted through the gas flow driving assembly 130, so that various heat exchange requirements can be met. And, the computer lab cooling system of this application is through being equipped with as above cooling rack 100, still has the advantage that weight is little, the low power dissipation, and is applicable in multiple application scene, for example, when reforming transform the air cooling system, adopt the computer lab cooling system of this application, at the inclosed cavity 101 that holds of cooling rack 100 intussuseption pressurized gas that fills, can effectively improve the radiating efficiency, reduce the consumption of air current drive assembly 130, can save the quantity of cooling medium and cooling tube at least, prevent to receive the building to weigh the restriction and influence the condition of reforming transform and take place.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and operate, and therefore the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the above terms can be understood according to the specific situation by those skilled in the art.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A cooling cabinet, comprising:

the cooling cabinet is provided with a use state, the heat exchange area is used for accommodating a heating part, and the accommodating cavity is used for filling pressurized gas so that the air pressure in the accommodating cavity is higher than 1 atm;

the cooling assembly is arranged in the cooling area and used for cooling the pressurized gas; and

and the airflow driving component is arranged in the accommodating cavity and is used for enabling the pressurized gas to circularly flow between the cooling area and the heat exchange area so as to further cool the heating element.

2. The cooling cabinet of claim 1, further comprising:

the air supply flow equalizing piece is arranged in the heat exchange area and forms an air supply flow equalizing area with the inner wall of the box body, the air supply flow equalizing piece is provided with a plurality of air supply holes, and the cooling area, the air supply flow equalizing area and the air supply holes are sequentially communicated.

3. The cooling cabinet of claim 2, further comprising:

the return air flow equalizing part is arranged in the heat exchange area, forms a return air flow equalizing area with the inner wall of the box body, and forms a heat source placing area at least with the air supply flow equalizing part, the return air flow equalizing part is provided with a plurality of return air holes, and the air supply holes, the heat source placing area, the return air holes, the return air flow equalizing area and the cooling area are sequentially communicated.

4. The cooling cabinet of claim 3, wherein the return air flow equalizing zone and the supply air flow equalizing zone are disposed at opposite sides of the heat source placement zone along a predetermined direction;

in the use state, the preset direction is the horizontal direction, and the heat exchange area is located below the cooling area along the gravity direction.

5. The cooling cabinet of claim 1, wherein the cabinet comprises:

a housing having the receiving cavity;

the partition board is arranged in the accommodating cavity and fixed on the shell, the accommodating cavity is divided into the cooling area and the heat exchange area by the partition board, the partition board is provided with an air supply opening or the partition board and the shell form the air supply opening, the pressurized air in the cooling area enters the heat exchange area from the air supply opening, the partition board is also provided with an air return opening or the partition board and the shell form the air return opening, and the pressurized air in the heat exchange area flows back to the cooling area from the air return opening.

6. The cooling cabinet of claim 5, wherein the airflow drive assembly comprises

The air supply fan is arranged at the air supply opening; and/or the presence of a gas in the gas,

and the air exhaust fan is arranged at the air return opening.

7. The cooling cabinet of claim 1, wherein the cooling assembly comprises:

the cooling pipe comprises a heat exchange section accommodated in the cooling area, and the flowing direction of a cooling medium flowing in the heat exchange section is opposite to the flowing direction of the pressurized gas in the cooling area in the use state;

the heat exchange plates are connected to the periphery of the heat exchange section, and two adjacent heat exchange plates are arranged at intervals;

wherein at least one of the cooling tube and the heat exchanger fin is fixed to the box body.

8. The cooling cabinet of claim 1,

the box body comprises a cabinet door, and the cabinet door at least corresponds to the heat exchange area; and/or

The cooling cabinet also comprises a scavenging valve arranged on the box body, and the scavenging valve is communicated with the accommodating cavity.

9. Cooling cabinet according to any of the claims 1-8,

the pressurized gas is nitrogen or air; and/or the presence of a gas in the gas,

the pressure range of the pressurized gas is greater than or equal to 2atm and less than or equal to 5 atm.

10. A machine room cooling system comprising a cooling cabinet according to any one of claims 1 to 9.

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