CN114948428A

CN114948428A - Band-aid device and system for treating wounds

Info

Publication number: CN114948428A
Application number: CN202210592769.1A
Authority: CN
Inventors: 叶涛; 易琛
Original assignee: Southwest University of Science and Technology
Current assignee: Southwest University of Science and Technology
Priority date: 2022-05-27
Filing date: 2022-05-27
Publication date: 2022-08-30

Abstract

An embodiment of the present invention provides a wound dressing device and a wound treatment system, the wound dressing device including: the antenna comprises an antenna layer, a flexible circuit layer and an adhesive layer; the antenna layer is used for being in communication connection with the electronic equipment so as to send state data of the adhesive bandage device to the electronic equipment; the flexible circuit layer is used for monitoring and treating a wound surface; the adhesive layer is used for adhering the band-aid device to the wound surface; the flexible circuit layer comprises an energy supply unit and a treatment unit; the antenna layer is electrically connected with the energy supply unit, and the energy supply unit is electrically connected with the treatment unit. Communicate through antenna layer and electronic equipment to the state information of monitoring woundplast device, thereby realize the monitoring to the surface of a wound, supply power to treatment unit based on energy supply unit, thereby guarantee that treatment unit is in operating condition, realize the treatment to the surface of a wound, realize real time monitoring surface of a wound state, in time control treatment, and surface of a wound control and treatment can influence each other and make the system more have intellectuality.

Description

Band-aid device and system for treating wounds

Technical Field

The invention relates to the field of intelligent electronic medical equipment, in particular to a band-aid device and a wound treatment system.

Background

Wounds are caused by the breakdown of the integrity of the skin, mucosal surfaces or organ tissues, which can cause pain and stress to the patient, and if not properly attended, wounds are easily invaded by pathogens, causing infections, delaying wound healing in severe cases, which can even lead to chronic wounds and a series of complications such as tissue damage, organ failure, sepsis. Therefore, timely monitoring and treatment of wound infection is an important clinical problem.

In medicine, infrared therapeutic apparatuses have been widely used in the treatment and care of chronic ulcers, wound healing, infections after burns, arthritis, and the like. The infrared light instrument emitted by the infrared treatment has large power and wide irradiation range, and can penetrate through the skin to directly cause muscles, subcutaneous tissues and the like to generate heat effect. However, manual control is difficult to obtain the status of the wound surface in real time, and the wound surface status information cannot be used for treatment on demand. In addition, the infrared rays can damage normal skin when irradiated for a long time.

The existing infrared therapeutic apparatus has large power and inconvenient use, and normal skin can be affected by over-long irradiation. And the existing mode can not monitor the wound surface state in real time, so that the treatment and monitoring of the wound surface are in a cleavage state.

Disclosure of Invention

The invention aims to provide a band-aid device and a wound treatment system, which can monitor the state of a wound surface in real time and control treatment in time, and the monitoring and the treatment of the wound surface can be mutually influenced, so that the system is more intelligent.

In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:

in a first aspect, an embodiment of the present application provides an adhesive bandage device, which includes:

the antenna comprises an antenna layer, a flexible circuit layer and an adhesive layer;

the antenna layer is used for being in communication connection with electronic equipment so as to send state data of the woundplast device to the electronic equipment;

the flexible circuit layer is used for monitoring and treating a wound surface;

the adhesive layer is used for adhering the adhesive device to a wound surface;

the flexible circuit layer comprises an energy supply unit and a treatment unit;

the antenna layer is electrically connected with the energy supply unit, the energy supply unit is electrically connected with the treatment unit, wherein the energy supply unit is used for providing electric energy for the treatment unit so that the treatment unit emits treatment light.

In an alternative embodiment, the treatment unit comprises an infrared diode, an MCU processor, and at least one temperature sensor;

the temperature sensor is used for acquiring a first temperature of a wound surface and a second temperature of a non-wound surface;

the MCU processor is used for calculating the difference value of the first temperature and the second temperature and controlling the working state of the infrared diode based on the difference value.

In an optional embodiment, the MCU processor is configured to send a difference between the first temperature and the second temperature to an electronic device;

the electronic device is configured to display the difference value.

In an optional embodiment, the MCU processor controls the infrared diode to emit infrared rays when it is determined that the difference is smaller than a preset threshold;

and the MCU processor controls the infrared diode to stop working under the condition that the difference value is determined to be larger than the preset threshold value.

In an alternative embodiment, the energizing unit comprises an NFC chip;

the NFC chip is used for sending the data of the adhesive bandage device to electronic equipment through the antenna layer;

the NFC chip receives radio waves sent by electronic equipment, rectifies and stabilizes the radio waves, and then converts the radio waves into voltage to supply power to the treatment unit.

In an alternative embodiment, the flexible circuit layer further includes a blood oxygen sensor for detecting a blood oxygen saturation level of the wound surface.

In an optional embodiment, the antenna layer, the flexible circuit layer, and the adhesive layer are sequentially stacked.

In an alternative embodiment, the treatment unit comprises a first temperature sensor and a second temperature sensor;

the first temperature sensor is arranged at the central position of the flexible circuit layer;

the second temperature sensor is disposed at an edge location of the flexible circuit layer.

In an alternative embodiment, the adhesive layer is provided with a plurality of holes.

In a second aspect, embodiments of the present application provide a system for treating a wound, the system comprising the adhesive bandage device;

the wound treatment system further comprises: an electronic device;

the electronic equipment is used for receiving data sent by the adhesive bandage device and sending radio waves to the adhesive bandage device, wherein the data comprises a first temperature and a second temperature monitored by a temperature sensor and a difference value between the first temperature and the second temperature.

The application has the following beneficial effects:

the band-aid device comprises an antenna layer, a flexible circuit layer and an adhesive layer; the antenna layer is used for being in communication connection with the electronic equipment so as to send state data of the adhesive bandage device to the electronic equipment; the flexible circuit layer is used for monitoring and treating a wound surface; the adhesive layer is used for adhering the band-aid device to the wound surface; the flexible circuit layer comprises an energy supply unit and a treatment unit; the antenna layer is electrically connected with the energy supply unit, the energy supply unit is electrically connected with the treatment unit, and the energy supply unit is used for supplying electric energy to the treatment unit so that the treatment unit emits treatment light. This application communicates through antenna layer and electronic equipment to the state information of monitoring woundplast device, thereby realize supplying power to the treatment unit based on the energy supply unit to the monitoring of the surface of a wound, thereby guarantee that the treatment unit is in operating condition, realize the treatment to the surface of a wound, realize real time monitoring surface of a wound state, in time control treatment, and surface of a wound control and treatment can influence each other and make the system more have intellectuality.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of a band-aid device according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a treatment unit according to an embodiment of the present invention;

FIG. 3 is a schematic reverse side view of a flexible circuit layer provided in accordance with an embodiment of the present invention;

FIG. 4 is a schematic diagram of a front side of a flexible circuit layer provided in accordance with an embodiment of the invention;

FIG. 5 is a schematic view of a system for treating a wound according to an embodiment of the present invention;

fig. 6 is a second schematic view of a wound treatment system according to an embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Through a great deal of research by the inventor, the skin wound treatment method in the prior art generally adopts means such as cleaning by chemical agents and attaching medicine fees, and the traditional method is effective, but has the defects that the healing condition of an affected part is not easy to observe, the healing time of the wound is long, and in addition, the traditional methods of applying medicines to the wound and oral medicines are difficult to heal aiming at fungal infection diseases, and certain side effects can occur.

In view of the discovery to the above-mentioned problem, this embodiment provides an adhesive bandage device and treatment wound system, can communicate with electronic equipment through the antenna layer, thereby realize the monitoring to the surface of a wound condition with the state information of monitoring adhesive bandage device, supply power to treatment unit based on the energy supply unit, thereby guarantee that treatment unit is in operating condition, realize the treatment to the surface of a wound, realize real time monitoring surface of a wound state, in time control treatment, and surface of a wound control and treatment can influence each other and make the system more intelligent, set forth in detail below to the scheme that this embodiment provided.

Referring to fig. 1, a schematic structural diagram of an adhesive bandage device is shown, and the method including various steps will be described in detail below.

The adhesive bandage device comprises: an antenna layer 101, a flexible circuit layer 102 and an adhesive layer 103; the antenna layer 101 is used for being in communication connection with an electronic device so as to send state data of the woundplast device to the electronic device; the flexible circuit layer 102 is used for treating a wound surface; the adhesive layer 103 is used for adhering the adhesive device to a wound surface; the flexible circuit layer 102 comprises a therapy unit 1021 and an energizing unit 1022; the antenna layer 101 is electrically connected to the energy supply unit 1022, the energy supply unit 1022 is electrically connected to the treatment unit 1021, wherein the energy supply unit 1022 is configured to provide electric energy for the treatment unit 1021, so that the treatment unit 1021 emits treatment light.

The antenna layer can wrap the antenna in the antenna layer by a weaving method, and the antenna can be pasted in the antenna layer, so that the antenna can be fixed in the antenna layer, and the purpose of communicating with the electronic equipment is achieved.

The adhesive bandage device further comprises a flexible circuit layer, and the flexible circuit layer is used for mounting electronic components on a flexible substrate to form a special circuit, wherein the substrate is usually made of polymer materials such as polyimide plastic, polyether ether ketone or transparent conductive polyester. Its advantages include light weight, thin thickness, and high flexibility.

The purpose of the electronic component in the flexible circuit layer is to monitor and treat the wound, and because the flexible circuit layer contains the treatment unit, the treatment unit is used for treating the wound, and the treatment unit can be an electronic component capable of emitting infrared rays or ultraviolet rays and other treatment rays for disinfection and sterilization, for example: electronic components such as infrared diodes, infrared emitters, gallium aluminum nitride LEDs, aluminum nitride LEDs and the like.

Possess the aquogel on pasting the layer, can paste the woundplast device in the surface of a wound to fix the woundplast device in the affected part, and aquogel can be with the fine laminating of woundplast device and skin and make and have fine comfort level when using the woundplast device.

The antenna layer, the flexible circuit layer and the pasting layer are arranged in a mode that the antenna layer is arranged above the flexible circuit layer, the pasting layer is arranged below the flexible circuit layer, the antenna layer, the flexible circuit layer and the pasting layer are sequentially stacked, and the antenna layer is electrically connected with the flexible circuit layer.

In order to ensure the normal use of the adhesive bandage device, a power supply needs to be provided for the adhesive bandage device, so that an energy supply unit is arranged in the flexible circuit layer, and the energy supply unit can be a micro battery element, an NFC chip and the like and is used for supplying power to the adhesive bandage device so as to ensure the normal work of the adhesive bandage device.

In order to realize monitoring and treatment of a wound surface, as shown in fig. 2, a schematic structural diagram of a treatment unit specifically includes:

the therapy unit 1021 includes an infrared diode 10211, an MCU processor 10212, and at least one temperature sensor 10213; the temperature sensor 10213 is configured to obtain a first temperature of the wound surface and a second temperature of the non-wound surface; the MCU processor 10212 is configured to calculate a difference between the first temperature and the second temperature, and control an operating state of the infrared diode 10211 based on the difference.

The MCU processor 10212 is configured to send a difference between the first temperature and the second temperature to an electronic device; the electronic device is configured to display the difference value. The MCU processor 10212 controls the infrared diode 10211 to emit infrared light when it is determined that the difference is smaller than a preset threshold; the MCU processor 10212 controls the infrared diode 10211 to stop working when the difference is greater than the preset threshold.

The energizing unit 1022 includes an NFC chip; the NFC chip is used for sending the data of the adhesive bandage device to electronic equipment through the antenna layer; the NFC chip receives radio waves sent by electronic equipment, rectifies and stabilizes the radio waves, and then converts the radio waves into voltage to supply power to the treatment unit.

The application of the flexible electronic technology in the wearable medical health care system arouses great interest of people, and continuous point-of-care monitoring of human health indexes based on the flexible circuit and the sensor provides a unique solution for monitoring and treating diseases such as chronic wounds, infected wounds and the like. According to previous studies, the probability of bacterial infection of a wound surface with an elevated temperature is 8 times higher. In addition, the temperature of the infected wound surface is generally 0.5-4 ℃ higher than that of the normal skin. The use of batteries or wired connections with external devices will greatly increase the complexity of the system, reduce the wearing experience of the user, and limit the convenience of real-time detection. Near Field Communication (NFC) is a technology for realizing wireless power supply and data synchronous transmission through inductive coupling, and has become one of important technologies for realizing a passive wearable or implantable sensing system. The systems can realize accurate measurement of the temperature of the wound surface by integrating the NFC antenna, and temperature data can reflect the state of the wound surface and control the treatment time in the infrared treatment process, so that the development of a fully-integrated and intelligent infrared wound surface pasting system is possible.

As shown in fig. 3, which is a schematic reverse view of the flexible circuit layer, when the number of the temperature sensors is two, that is, the treatment unit includes a first temperature sensor and a second temperature sensor, the first temperature sensor is disposed at the center of the flexible circuit layer, and since the wound surface is generally overlapped with the center of the adhesive bandage device when the adhesive bandage device is used, the first temperature sensor is disposed at the center of the flexible circuit layer in order to ensure the collection of the temperature of the wound surface. When the band-aid device is used, the edge position of the band-aid is generally used for fixing, so that the second temperature sensor is arranged at the edge position of the flexible circuit layer, and the position is generally attached to a non-wound surface of normal skin, therefore, the second temperature sensor is arranged at the edge position of the flexible circuit layer, and the collection of the non-wound surface temperature can be ensured.

As shown in fig. 4, which is a schematic front view of the flexible circuit layer, the MCU processor and the NFC chip are both disposed in the flexible circuit layer.

In order to ensure the detection accuracy of the temperature of the wound surface and the effectiveness of the treatment of the wound surface, a plurality of holes are formed in the sticking layer and used for leaking the temperature sensor and the infrared diode of the treatment unit to the naked, so that the temperature collection and the treatment of the wound surface are ensured.

NFC chip is connected with the antenna layer electricity, and electronic equipment and antenna inductive coupling can become the stable voltage energy with the energy of gathering with data transmission to the NFC chip in, and the inside rectification of NFC chip and voltage stabilizing circuit can be peeled off data from the signal through demodulation circuit simultaneously for woundplast device provides the power, and send to electronic equipment, can realize the real-time supervision to the surface of a wound. The wound surface temperature and the temperatures of normal skin and non-wound surface can be monitored through at least one temperature sensor, the difference value of the temperatures of the wound surface and the normal skin is calculated, and data are transmitted to the MCU processor through the ADC in the NFC chip. The MCU processor can analyze the data and control the infrared diode to emit light, so that the wound surface is treated. Meanwhile, in order to prevent the temperature of the wound surface from being excessively increased to a proper healing temperature by infrared treatment, the inside of the system can judge the on-off state of infrared rays according to temperature data, namely that the current temperature is higher under the condition that the temperature difference is greater than a preset threshold value, the infrared diode needs to be controlled to stop working, and the infrared diode is controlled to treat the wound surface under the condition that the temperature difference is less than the preset threshold value.

The MCU processor can also send the first temperature of the monitored wound surface and the second temperature of normal skin, namely the non-wound surface, to the electronic equipment through the NFC chip so as to monitor the wound surface condition.

In order to monitor the wound surface more closely, the flexible circuit board can further comprise a blood oxygen saturation sensor and a PH value detection sensor, the wound surface is monitored more comprehensively based on the sensors, and the blood oxygen saturation and the PH value of the wound surface detected based on the blood oxygen saturation sensor and the PH value detection sensor are sent to the electronic equipment so as to be used for monitoring the wound surface by a user.

The present application further provides a system for treating a wound, as shown in fig. 5, which is a schematic view of the system for treating a wound, the system comprising a band-aid device 201, the system for treating a wound further comprising an electronic device 202;

the electronic device 202 is configured to receive data sent by the adhesive bandage device, wherein the data includes a first temperature and a second temperature monitored by a temperature sensor and a difference between the first temperature and the second temperature, and send radio waves to the adhesive bandage device.

The woundplast device 201 sends the first temperature of the wound surface and the second temperature of the non-wound surface detected by the temperature sensor to the electronic device, the woundplast device also sends the difference value of the first temperature and the second temperature to the electronic device, and the electronic device obtains the trend graph of the wound surface temperature after processing the received data, so that a user can monitor the wound surface in real time.

And when the received first temperature is greater than the temperature threshold value, giving an alarm, thereby prompting the user that the temperature of the wound surface is too high and the user needs to clean the wound surface.

It should be noted that the preset temperature threshold can be set by those skilled in the art according to actual situations.

The application also provides a system for treating wounds, as shown in fig. 6, for a schematic diagram of the system for treating wounds, the system includes a woundplast device 201, the system for treating wounds further includes an electronic device 202, the woundplast device 201 includes an NFC chip, an MCU processor, an ADC module, a temperature sensor, an infrared diode, the NFC chip sends a first temperature of a wound surface and a second temperature of a non-wound surface and a difference value between the first temperature and the second temperature to the electronic device, the NFC chip receives radio waves sent by the electronic device and converts the radio waves into voltage, the NFC chip supplies energy to the MCU processor, and the MCU processor sends data to the NFC chip, where the data includes the first temperature of the wound surface, the second temperature of the non-wound surface, and the difference value between the first temperature and the second temperature. The temperature sensor detects a first temperature of a wound surface and a second temperature of a non-wound surface, the first temperature and the second temperature are sent to the ADC module, after signal conversion, a converted temperature signal is sent to the MCU processor, the MCU processor calculates a difference value of the first temperature and the second temperature based on the temperature signal, and on-off of the infrared diode is controlled based on the difference value.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and system may be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part. The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only for various embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of changes or substitutions within the technical scope of the present application, and all such changes or substitutions are included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wound dressing device, comprising:

the flexible circuit layer is used for monitoring and treating a wound surface;

the adhesive layer is used for adhering the adhesive device to a wound surface;

2. The apparatus of claim 1, wherein the therapy unit comprises an infrared diode, an MCU processor, and at least one temperature sensor;

3. The apparatus of claim 2, wherein the MCU processor is configured to transmit a difference between the first temperature and the second temperature to an electronic device;

the electronic device is configured to display the difference value.

4. The device according to claim 2, wherein the MCU processor controls the infrared diode to emit infrared rays if the difference is determined to be smaller than a preset threshold;

5. The apparatus of claim 1, wherein the energizing unit comprises an NFC chip;

6. The device of claim 1, wherein the flexible circuit layer further comprises a blood oxygen sensor for detecting a blood oxygen saturation of the wound.

7. The apparatus of claim 1, wherein the antenna layer, the flexible circuit layer and the adhesive layer are sequentially stacked.

8. The apparatus of claim 2, wherein the therapy unit comprises a first temperature sensor and a second temperature sensor;

9. The device of claim 1, wherein the adhesive layer is provided with a plurality of holes.

10. A system for treating a wound, the system comprising the adhesive bandage device of any one of claims 1-9;

the system for treating a wound further comprises: an electronic device;