CN114925649A - Method and device for adjusting screen printing position number of component - Google Patents
Method and device for adjusting screen printing position number of component Download PDFInfo
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- CN114925649A CN114925649A CN202210608793.XA CN202210608793A CN114925649A CN 114925649 A CN114925649 A CN 114925649A CN 202210608793 A CN202210608793 A CN 202210608793A CN 114925649 A CN114925649 A CN 114925649A
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- G06F30/39—Circuit design at the physical level
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Abstract
The application provides a method and a device for adjusting a screen printing position number of a component, wherein the method adjusts the screen printing position number of a PCB design file to obtain a current PCB design file and a plurality of screen printing position numbers to be adjusted in the current PCB design file; reducing the screen printing position numbers to be adjusted by a preset proportion, and then moving the screen printing position numbers to a first area outside a design area to obtain a new PCB design file and a corresponding first screen printing layer file; amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion to obtain a second silk-screen layer document; replacing the first silk-screen layer document with the second silk-screen layer document to obtain a target PCB design file; moving a second area in the second silk-screen layer document to an idle area in a design area in the target PCB design file; and establishing an incidence relation between the amplified screen printing position number and the corresponding component. The method reduces the adjusting time, increases the adjusting accuracy and improves the working efficiency.
Description
Technical Field
The application relates to the technical field of PCB design, in particular to a method and a device for adjusting a screen printing position number of a component.
Background
At present, a screen printing position number of a component on a Printed Circuit Board (PCB), also called a Printed Circuit board, is often arranged nearby, that is, the screen printing position number is arranged near the corresponding component, and a screen printing layer formed by the screen printing position number is displayed in a PCB design file.
However, for the ultra-high density (high density) PCB, the space between the components is very small or close to zero, so that there is no blank around the components to place the screen printing position number for the designer, and the size of the screen printing position number is larger than the size of the component under some conditions, so that the placement of the screen printing position number becomes a difficult problem under such conditions.
Disclosure of Invention
An object of the embodiments of the present application is to provide a method and an apparatus for adjusting a screen printing position number of a component, so as to solve the above problems in the prior art, reduce adjustment time, increase adjustment accuracy, and improve work efficiency compared with manual operation.
In a first aspect, a method for adjusting a screen printing position number of a component is provided, and the method may include:
adjusting the silk-screen position numbers of PCB design files in PCB design software to obtain a plurality of silk-screen position numbers to be adjusted in the current PCB design files and corresponding files; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
reducing the screen printing position numbers to be adjusted by a preset proportion and then moving the screen printing position numbers to a first area to obtain a new PCB design file and a first screen printing layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped;
amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number;
replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file;
moving a second area containing each amplified silk-screen position number in the second silk-screen layer document to a free area in a design area in the target PCB design file;
and establishing an association relation between the amplified screen printing position number and the corresponding component by utilizing the association function of the SKILL plug-in.
In one possible implementation, adjusting the screen printing position number of a PCB design file in PCB design software to obtain a plurality of screen printing position numbers to be adjusted in a current PCB design file and a corresponding file, includes:
adjusting all screen printing position numbers in the PCB design file according to a preset position number adjusting standard;
moving the adjusted screen printing position number to the central position of a corresponding component to obtain a primary current PCB design file;
acquiring a first component with a non-overlapped screen printing position number and a free space around the corresponding component from the initial current PCB design file, and moving the screen printing position number of the first component to the free space to obtain a current PCB design file;
and determining the silk-screen position number corresponding to the second component which is overlapped in the current PCB design file and has no free space on the periphery of the corresponding component as the silk-screen position number to be adjusted in the current PCB design file.
In one possible implementation, the moving the screen printing position numbers to be adjusted to a first area after reducing the preset proportion to obtain a new PCB design file and a first screen printing layer document in the new PCB design file includes:
and after reducing the preset proportion of each silk-screen position number to be adjusted, respectively moving each reduced silk-screen position number to a first area according to the moving conditions of the same moving distance and the same moving direction to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file.
In one possible implementation, replacing a first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file, including:
deleting a first area containing each reduced silk-screen position number in the first silk-screen layer document in the new PCB design file to obtain a third silk-screen layer document;
and adding a second area containing the amplified silk-screen position number in the second silk-screen layer document outside the design area of the third silk-screen layer document.
In one possible implementation, moving a second area containing the enlarged silk-screen position number in the second silk-screen layer document to a free area in a design area in the target PCB design file includes:
detecting whether the area of the idle area is not smaller than the area of the second area;
and if the area of the idle area is not smaller than that of the second area, moving the second area containing the amplified silk-screen printing position number in the second silk-screen layer document to the idle area in the design area in the target PCB design file.
In a possible implementation, the association relationship between the amplified silk-screen position number and the corresponding component is established by using the association function of the SKILL plug-in, and the method includes the following steps:
acquiring a silk file of the SKILL plug-in, and copying the associated component identification, the silk-screen position number and the position number information of the silk-screen position number of each component in the silk file to a target application file;
for any component, if the associated component identifier corresponding to the component is an empty identifier, replacing the empty identifier with the silk-screen position number in the target application file through the replacement function of the target application corresponding to the target application file to obtain the modified associated component identifier;
and modifying the silk file based on the modified associated component identifier.
In a possible implementation, after the screen printing position numbers to be adjusted are reduced by a preset proportion and then moved into the first area, the method further includes:
determining the area where a device set consisting of components corresponding to the reduced screen printing position numbers in the first area is located in the current PCB design file; adopting a silk-screen frame to frame the regional boundary of the region where the device set is located;
after the association relationship between the amplified silk-screen position number and the corresponding component is established, the method further comprises the following steps:
correspondingly guiding the second area containing the amplified silk-screen position number and the corresponding component frame by using the configured associated identification; the association identifier is an association label or an association graticule.
In a second aspect, an adjusting device for screen printing position numbers of components is provided, which may include:
the adjusting unit is used for adjusting the silk-screen position numbers of the PCB design files in the PCB design software to obtain a plurality of silk-screen position numbers to be adjusted in the current PCB design files and corresponding files; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
the mobile unit is used for reducing the preset proportion of each silk-screen position number to be adjusted and then moving the silk-screen position number to be adjusted into a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped;
the amplifying unit is used for amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number;
the replacing unit is used for replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file;
the moving unit is further configured to move a second area, which contains each amplified silk-screen position number, in the second silk-screen layer document to an idle area in a design area in the target PCB design file;
and the establishing unit is used for establishing an association relationship between the amplified screen printing position number and the corresponding component by utilizing the association function of the SKILL plug-in.
In a possible implementation, the adjusting unit is specifically configured to:
adjusting all screen printing position numbers in the PCB design file according to a preset position number adjusting standard;
moving the adjusted screen printing position number to the central position of a corresponding component to obtain a primary current PCB design file;
acquiring a first component with a non-overlapped screen printing position number and a free space around the corresponding component from the preliminary current PCB design file, and moving the screen printing position number of the first component to the free space to obtain a current PCB design file;
and determining the silk-screen position number corresponding to the second component which is overlapped in the current PCB design file and has no free space at the periphery of the corresponding component as the silk-screen position number to be adjusted in the current PCB design file.
In a possible implementation, the moving unit is specifically configured to, after reducing each to-be-adjusted screen printing position number by a preset ratio, respectively move each reduced screen printing position number into the first area according to a moving condition of moving the same distance and the same direction, and obtain a new PCB design file and a first screen printing layer document in the new PCB design file.
In a possible implementation, the replacing unit is specifically configured to:
deleting a first area containing each reduced silk-screen position number in the first silk-screen layer document in the new PCB design file to obtain a third silk-screen layer document;
and adding a second area containing the amplified silk-screen position number in the second silk-screen layer document outside the design area of the third silk-screen layer document.
In one possible implementation, the mobile unit is further specifically configured to:
detecting whether the area of the idle area is not smaller than the area of the second area;
and if the area of the idle area is not smaller than the area of the second area, moving the second area containing the amplified silk-screen position number in the second silk-screen layer document to the idle area in the design area in the target PCB design file.
In a possible implementation, the establishing unit is specifically configured to:
acquiring a silk file of the SKILL plug-in, and copying the associated component identification, the silk-screen position number and the position number information of the silk-screen position number of each component in the silk file to a target application file;
for any component, if the associated component identifier corresponding to the component is a null identifier, replacing the null identifier with the silk-screen position number in the target application file through the replacement function of the target application corresponding to the target application file to obtain a modified associated component identifier;
and modifying the silk file based on the modified associated component identifier.
In one possible implementation, the apparatus further comprises a determining unit and a directing unit:
the determining unit is used for determining the area where the device set consisting of the components and parts corresponding to the reduced silk-screen position numbers in the first area is located in the current PCB design file; and the area boundary of the area where the device set is located is framed by a silk-screen frame;
the guiding unit is used for correspondingly guiding the second area containing the amplified silk-screen position number after the amplified silk-screen position number is associated with the corresponding component frame by using the configured associated identification after the amplified silk-screen position number is associated with the corresponding component; the association identifier is an association label or an association graticule.
In a third aspect, an electronic device is provided, which includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory complete communication with each other through the communication bus;
a memory for storing a computer program;
a processor adapted to perform the method steps of any of the above first aspects when executing a program stored in the memory.
In a fourth aspect, a computer-readable storage medium is provided, in which a computer program is stored which, when being executed by a processor, carries out the method steps of any one of the above-mentioned first aspects.
According to the method for adjusting the screen printing position number of the component, provided by the embodiment of the application, the screen printing position number of a PCB design file in PCB design software is adjusted to obtain a plurality of screen printing position numbers to be adjusted in a current PCB design file and a corresponding file; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file; reducing the preset proportion of each silk-screen position number to be adjusted, and moving the silk-screen position number to be adjusted to a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file; the first area is an area outside a design area in a current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped; amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number; replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file; moving a second area containing each amplified silk-screen position number in the second silk-screen layer document to an idle area in a design area in the target PCB design file; and establishing an association relation between the amplified screen printing position number and the corresponding component by using the association function of the SKILL plug-in. According to the method, aiming at the layout area of the components which are densely packaged in a small size, the number of the silk screen printing position is not required to be adjusted manually, and the adjustment time is shortened, the adjustment accuracy is improved and the working efficiency is improved by utilizing third-party software and SKILL plug-in units for adjustment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic flow chart of a method for adjusting a screen printing position number of a component according to an embodiment of the present application;
fig. 2 is a schematic diagram of a local screen printing position number diagram with overlapping screen printing position numbers according to an embodiment of the present application;
FIG. 3 is a schematic diagram of another local silk-screen position number map with overlapping silk-screen position numbers according to an embodiment of the present application;
fig. 4 is a schematic diagram of a local screen printing position number diagram with non-overlapping screen printing position numbers according to an embodiment of the present application;
fig. 5 is a schematic diagram of another non-overlapping local screen printing position number diagram according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an adjusting device for a screen printing position number of a component according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without any creative effort belong to the protection scope of the present application.
The terms "comprising" and "having," and any variations thereof, as referred to in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the PCB design, each component has its own silk screen printing position number as an identification mark. Designers can adjust the PCB to a proper size and place the PCB beside a corresponding component, and in subsequent PCB production, a factory can print the PCB on the PCB so as to facilitate relevant personnel to identify the placement position of each component in the processes of subsequent chip mounting, debugging, assembly, maintenance and the like. Due to the limitation of the printing process and the identifiability after printing, the characters in the silk-screen position number need to be adjusted to a proper size. The general bit number adjustment criteria are specified as: the width of the characters of the silk screen position numbers is 22 mils, the height of the characters is 30 mils, the space between the characters is 6 mils, and the thickness of the characters is 6 mils.
Sometimes, in order to ensure the signal characteristics, part of the components are closely arranged together, and in addition, a large amount of applications of 0402, 0201 and even 01005 are added, the arrangement of the components is more and more intensive, so that no space is left beside the components for placing corresponding screen printing position numbers, and for small-size components, the area occupied by the screen printing position numbers is far larger than the area occupied by the body of the components, if the screen printing position numbers of the components are placed nearby, the screen printing position numbers of the components interfere with each other (or are called as 'mutual overlapping'), and because the components are generally placed horizontally and also vertically, and the lengths of the screen printing position numbers of the components are not uniform, namely, the space and the direction occupied by the screen printing position numbers of each component have no special fixed rule, the screen printing position numbers are amplified or reduced by adopting PCB design software, and only the screen printing position numbers of each component can be amplified or reduced on the fixed coordinates thereof (the fixed coordinates are the central positions of each screen printing position number), after the silk-screen position numbers are amplified and adjusted by adopting PCB design software, the relative coordinates among the silk-screen position numbers cannot be changed, and the silk-screen position numbers can be overlapped with each other or other position numbers. Therefore, the screen printing position numbers of the components in the dense layout area can be independently and one by one placed in a place with sufficient space only by a designer according to the actual space, the adjustment of the dense layout area is very troublesome, and the adjustment is easy to be wrong and needs to be checked and confirmed repeatedly.
Based on this, the embodiment of the application provides an adjusting method for screen printing position numbers of components, which is applied to an adjusting device with an adjusting program corresponding to the adjusting method, and is used for amplifying local screen printing position numbers (with overlapped screen printing position numbers) in a PCB design file in a screen printing layer by using third-party software aiming at an intensive layout area of the components, particularly an intensive layout area of small-size components, reintroducing the modified screen printing layer into the PCB design file, reintroducing the screen printing position numbers which are imported into the PCB design file and lose corresponding relations by using an SKILL plug-in, and reestablishing the association relations between the screen printing position numbers and the corresponding components. Compared with manual operation, the method reduces the adjustment time, increases the accuracy of adjustment and improves the working efficiency.
The preferred embodiments of the present application will be described in conjunction with the drawings of the specification, it should be understood that the preferred embodiments described herein are only for illustrating and explaining the present application, and are not intended to limit the present application, and the embodiments and features of the embodiments in the present application may be combined with each other without conflict. In the case of conflict, the embodiments and features of the embodiments in the present application may be combined with each other.
Fig. 1 is a schematic flow chart of a method for adjusting a screen printing position number of a component according to an embodiment of the present application. As shown in fig. 1, the method may include:
step S110, adjusting the silk-screen position number of a PCB design file in PCB design software to obtain a plurality of silk-screen position numbers to be adjusted in the current PCB design file and the corresponding file.
In specific implementation, in order to obtain an attractive PCB design, PCB design software can be adopted, the unified processing of position number characters and position number positions is firstly carried out on the silk-screen position numbers of all components in the PCB design software, and a current PCB design file is obtained, specifically:
adjusting all screen printing position numbers in the PCB design file according to a preset position number adjusting standard; and moving the adjusted screen printing position number to the central position of the corresponding component to obtain the current PCB design file. The position number adjustment is the adjustment of the position number character, and the adjustment of the position number character and the movement of the position number position can be executed simultaneously or successively according to actual conditions.
It should be noted that, before the silk-screen position numbers are adjusted according to the preset position number adjustment standard, if a certain silk-screen position number exists in the PCB design file and meets the preset position number adjustment standard, it is only indicated that the characters of the silk-screen position number before and after adjustment are not changed, but the silk-screen position number is also subjected to the corresponding adjustment operation.
Further, since the components are generally placed horizontally (parallel to the interface boundary in the horizontal direction in the display interface) and vertically (parallel to the interface boundary in the vertical direction in the display interface), in order to further obtain an attractive PCB design, PCB design software may be used to adjust the direction of the silk screen position numbers before moving the adjusted silk screen position numbers to the central positions of the corresponding components, that is, the directions of the corresponding silk screen position numbers are adjusted according to the placing directions of the components, and the silk screen position numbers corresponding to the components with the same placing directions have the same direction and the orientations of the silk screen position numbers are also the same.
In one example, each silk-screen position number in the PCB design file a is adjusted to 22mil wide, 30mil high, 6mil pitch between characters, and 6mil thick according to a preset position number adjustment standard. And then, based on the transverse placing direction or the vertical placing direction of the components, the direction of the adjusted silk-screen position number is adjusted in the same direction.
And moving the screen printing position number after the direction adjustment from the current position to the central position of the corresponding component, namely placing the screen printing position number after the direction adjustment in the corresponding component to obtain a preliminary current PCB design file.
The design area in the preliminary current PCB design file may include a local screen printing position number diagram with overlapping screen printing position numbers as shown in fig. 2, where fig. 2 includes 9 densely distributed components and devices with resistors R83, R87, R851, R1, R20, R3025, C929, C459, and C18, and the screen printing position numbers of all the components and devices are uniform in character size, pitch, and thickness, and are located in the centers of the corresponding components and devices. The 4 components of the resistor R1, the resistor R20, the capacitor C929 and the capacitor C459 are vertically placed, and the corresponding screen printing position numbers R1, R20, C929 and C459 are also vertically placed and face to the left; the 5 components of the resistor R83, the resistor R87, the resistor R851, the resistor R3025 and the capacitor C18 are transversely placed, and the corresponding screen printing position numbers R3_1 and C1_1 are also transversely placed and face upwards. The size of the 7 components of the resistor R83, the resistor R87, the resistor R851, the resistor R1, the resistor R20, the capacitor C929 and the capacitor C459 is the same, and the size of the 2 components of the resistor R3025 and the capacitor C18 is the same.
As shown in fig. 2, the length of the screen printing position number of the resistor R1 is shortest, and the length of the screen printing position number of the resistor R3025 is longest, and the screen printing position numbers in the dense area are overlapped due to non-uniform lengths of the screen printing position numbers of the components: the silk-screen position number of the resistor R83 is overlapped with the silk-screen position number of the resistor R1; the silk-screen position number of the resistor R87 is overlapped with the silk-screen position number of the resistor R20; the silk-screen position number of the resistor R851 is overlapped with the silk-screen position number of the resistor R20; the silk-screen position number of the capacitor C929 is overlapped with the silk-screen position number of the capacitor C459; the silk-screen position number of the resistor R1 is overlapped with the silk-screen position number of the capacitor C929; the screen printing position number of the resistor R20 is overlapped with the screen printing position number of the capacitor C459. The overlapped screen printing position numbers result in that the screen printing position numbers of the corresponding components cannot be accurately identified.
Then, a first component, such as the resistor R3025 and the capacitor C18 in fig. 2, is obtained, where the screen printing position numbers in the preliminary current PCB design file are not overlapped and a free space is left around the corresponding component, and the screen printing position number of the first component is moved to the free space, so as to obtain the current PCB design file, as shown in fig. 3. Specifically, the first component may be moved in response to a movement operation of the designer for the movement of the first component to the target position; or, the first component may be moved based on a preset movement rule, where the preset movement rule may include moving a screen printing position number of the corresponding component based on a position of a peripheral free space of the component.
And determining the silk-screen position numbers corresponding to the second components which are overlapped in the current PCB design file and have no free space around the corresponding components as the silk-screen position numbers to be adjusted in the current PCB design file, wherein the silk-screen position numbers corresponding to the resistor R83, the resistor R87, the resistor R851, the resistor R1, the resistor R20, the capacitor C929 and the capacitor C459 in the current PCB design file are all the silk-screen position numbers to be adjusted.
Further, for a scene with a free space beside the component, the corresponding screen printing position number may be moved to a free space nearby, that is, the size of the screen printing position number is smaller than the size of the component, and the screen printing position numbers at this time may not overlap with each other, for example, there is a free space between the upper side of the resistor R3025 and the lower side of the capacitor C18, so that at this time, only the screen printing position number R3025 needs to be moved to the upper side of the resistor R3025, and the screen printing position number C18 needs to be moved to the lower side of the capacitor C18, as shown in fig. 3.
And step S120, reducing the silk-screen position numbers to be adjusted by a preset proportion, and moving the silk-screen position numbers to a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file.
And the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped.
In specific implementation, the screen printing position numbers to be adjusted are respectively reduced by a preset proportion by adopting PCB design software so as to realize that the reduced screen printing position numbers are not overlapped, as shown in FIG. 4, the screen printing position numbers corresponding to a resistor R83, a resistor R87, a resistor R851, a resistor R1, a resistor R20, a capacitor C929 and a capacitor C459 are all reduced by the preset proportion, so that the reduced screen printing position numbers are not overlapped, and the screen printing position numbers corresponding to the resistor R3025 and the capacitor C18 are not reduced;
and moving each reduced silk-screen position number to a first area outside the design area in the current PCB design file to obtain a new PCB design file, specifically moving the area where each reduced silk-screen position number is located into the first area integrally, and framing the area boundary of the first area by adopting a 2D silk-screen frame.
In order to improve the layout uniformity of the reduced screen printing position numbers and the corresponding components, the reduced screen printing position numbers are respectively moved into a first area according to the moving conditions of the same moving distance and the same moving direction, namely the arrangement information of the reduced screen printing position numbers in the first area is the same as the arrangement information in the current PCB design file. The arrangement information includes information such as an arrangement direction, an arrangement order of each reduced screen printing position number, and an arrangement position of an adjacent reduced screen printing position number.
In addition, since the PCB design file is a three-dimensional design file including a plurality of design layers, and the adjustment is an adjustment of a silk-screen layer among the plurality of design layers, a display interface of the PCB design software may be adjusted to display only the silk-screen layer, thereby exporting a corresponding Drawing Exchange file (DXF) file, which is a silk-screen layer file in the new PCB design file, i.e., a first silk-screen layer file.
Further, determining a region where a device set consisting of the devices and components corresponding to the reduced screen printing position numbers is located in the current PCB design file, namely determining the region as the region consisting of the devices and components corresponding to the screen printing position numbers to be adjusted; and 2D silk screen frame is adopted to frame the regional boundary of the region where the device set is located.
Step S130, amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using an area adjusting function of third-party software to obtain a second silk-screen layer document.
The third-party software can be AUTO CAD software or other software capable of realizing the overall simultaneous adjustment of a plurality of screen printing position numbers.
In specific implementation, third-party software is adopted, for example, AUTO CAD software is used to open a first silk-screen layer document, and the adjustment function of the third-party software is utilized to amplify the whole area of a first area, which includes each reduced silk-screen position number, in the first silk-screen layer document according to a preset proportion, specifically, the AUTO CAD software may respond to the amplification operation of a designer to amplify the whole area of the first area, which includes each reduced silk-screen position number, in the first silk-screen layer document, or automatically amplify the whole area of the first area, which includes each reduced silk-screen position number, in the first silk-screen layer document according to a configured adjustment program, and the specific manner of the embodiment of the present application is not limited herein. At the moment, the amplified silk-screen position numbers are as large as other silk-screen position numbers which are not reduced and amplified, and the contents in the first area and the first area are amplified integrally, namely, the relative coordinates of the silk-screen position numbers are amplified while the position numbers are adjusted, so that the amplified silk-screen position numbers cannot interfere with each other.
That is, each reduced silk-screen position number is amplified by a preset proportion, the area of the first region is also amplified by the preset proportion, and a second region containing each amplified silk-screen position number is obtained, so that a second silk-screen layer document, namely another DXF file, is obtained. The second silk-screen layer document is a silk-screen layer document of the second area containing the amplified silk-screen position numbers.
And step S140, replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file.
In specific implementation, the second silk-screen layer document is imported into the silk-screen layer of the PCB design software, and then the replacement operation is performed, wherein the replacement operation may include the following steps:
in the mode 1, the first silk-screen layer document in the new PCB design file can be completely replaced by the second silk-screen layer document, that is, the second silk-screen layer document is used as the silk-screen layer document in the new PCB design file, so as to obtain the target PCB design file.
In a mode 2, deleting a first area containing each reduced silk-screen position number in a first silk-screen layer document in a new PCB design file to obtain a third silk-screen layer document; and adding a second area containing the amplified silk-screen position number in the second silk-screen layer document outside the design area of the third silk-screen layer document to obtain a target PCB design file. The position of the second area added in the third silk-screen layer document outside the design area can be the same as or different from the position of the second area in the second silk-screen layer document outside the design area.
And S150, moving a second area containing each amplified silk-screen position number in the second silk-screen layer document to a free area in the design area in the target PCB design file.
In specific implementation, detecting whether the area of an idle area in a design area in a target PCB design file is not smaller than the area of a second area;
if the area of the idle area is not smaller than the area of the second area, it is indicated that there is enough space in the design area in the target PCB design file to place the whole second area, so that the second area containing each amplified silk-screen position number in the second silk-screen layer document is subjected to area movement to the idle area in the design area in the target PCB design file by adopting PCB design software.
In an example, referring to fig. 4, the design region of the target PCB design document may include a local screen printing bit number diagram without overlapping screen printing bit numbers as shown in fig. 5, where a region 1 where 7 components, namely, the resistor R83, the resistor R87, the resistor R851, the resistor R1, the resistor R20, the capacitor C929, and the capacitor C459, are located is a dense layout region, and a region 2 is a second region, where the region includes the amplified screen printing bit numbers corresponding to the 7 components.
If the area of the free area is smaller than that of the second area, it is indicated that there is not enough space in the design area in the target PCB design file to place the whole second area, and at this time, the step of reducing the screen printing position numbers to be adjusted by a preset proportion is returned to; carrying out position division on the position of each reduced silk-screen position number to obtain each reduced silk-screen position number corresponding to each position division in a plurality of position divisions;
and then, respectively moving each reduced silk-screen position number corresponding to each position partition into a first area outside the design area in the current PCB design file to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file, wherein the first silk-screen layer document at the moment comprises a plurality of first areas corresponding to the plurality of position partitions one by one, and executing the step S130 for each first area until all amplified silk-screen position numbers corresponding to the silk-screen position numbers to be adjusted are moved to a free area in the design area in the target PCB design file.
And step S160, establishing an association relationship between the amplified screen printing position number and the corresponding component by using the association function of the SKILL plug-in.
Because the compatibility problem exists between different software, namely the compatibility problem also exists between the PCB design software and the third-party software, the silk screen position number in the second silk screen layer document derived by the third-party software does not have the association relation with the corresponding component, and the silk screen position number is only in a 2D line form, so that the association relation between the silk screen position number without the association relation and the corresponding component is required to be established for the convenience of subsequent PCB design.
If the replacing operation adopted in step S140 is the replacing operation in the mode 1, it indicates that the silk-screen layer document in the target PCB design file is imported into the whole second silk-screen layer document, and at this time, all the silk-screen position numbers in the second silk-screen layer document in the target PCB design file do not have an association relationship with the corresponding components.
If the replacing operation adopted in step S140 is the replacing operation in the mode 2, it indicates that the silk-screen layer document in the target PCB design file is only imported into the second area containing the amplified silk-screen position numbers in the second silk-screen layer document, and at this time, no association relationship exists between the silk-screen position numbers in the second area in the second silk-screen layer document in the target PCB design file and the corresponding components.
It should be noted that, the specific manner of the above replacement operation may be determined according to actual service conditions; or the number of the screen printing position numbers outside the second area in the second screen printing layer document (the screen printing position numbers not reduced or processed by the method) may be determined, for example, when the number of the screen printing position numbers outside the second area is large, if the number of the associated screen printing position numbers to be established is larger than the number of the associated screen printing position numbers to be established corresponding to the replacement operation in the mode 1 through the replacement operation in the mode 2, the replacement operation in the mode 1 may be selected, so that the number of times of executing the step S160 may be reduced.
In specific implementation, a silk file of the SKILL plug-in is obtained, and the associated component identifier, the silk screen position number and the position number information of the corresponding silk screen position number of each component in the silk file are copied into a target application file; the position number information comprises the angle of the silk-screen position number, the coordinate in the target PCB design file, the design layer where the position number is located and the like.
Detecting whether the associated component identifier of each component in the silk file is an empty identifier, such as whether the component identifier is NIL;
and if the associated component identifier corresponding to a certain component is not an empty identifier and is the same as the silk-screen position number in the target application file, indicating that the component is associated with the corresponding silk-screen position number.
If the associated component identifier corresponding to a certain component is a null identifier, replacing the null identifier with the silk-screen position number in the target application file through the replacement function of the target application corresponding to the target application file to obtain a modified associated component identifier; the silk file is modified based on the modified associated component identification.
Further, the moved second area containing the amplified silk-screen position number in the target PCB design file is correspondingly guided with the corresponding component frame by using the configured associated identification; the configured associated identification can be an associated label or an associated marking line so as to complete the placing processing of the whole silk screen position number.
In the above example, referring to fig. 5, the area 1 and the area 2 are correspondingly indicated by the associated reference line L1.
Therefore, aiming at a more densely packaged small-size component layout area, the conventional manual adjustment method needs to sequentially adjust each screen printing position number according to an approximately relative position, the time consumption is long, and errors are easy to occur.
Corresponding to the foregoing method, an embodiment of the present application further provides an adjusting device for a screen printing position number of a component, where as shown in fig. 6, the device includes: an adjusting unit 610, a moving unit 620, an amplifying unit 630, a replacing unit 640, and a establishing unit 650;
the adjusting unit 610 is configured to adjust a screen printing position number of a PCB design file in PCB design software to obtain a current PCB design file and a plurality of screen printing position numbers to be adjusted in a corresponding file; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
the moving unit 620 is configured to reduce each screen printing position number to be adjusted by a preset proportion and then move the screen printing position number into a first area to obtain a new PCB design file and a first screen printing layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped;
the amplifying unit 630 is configured to amplify, by using an adjusting function of third-party software, a first area, which includes each reduced silk-screen position number, in the first silk-screen layer document by a preset proportion to obtain a second silk-screen layer document, where the second silk-screen layer document is a silk-screen layer document of a second area including each amplified silk-screen position number;
a replacing unit 640, configured to replace, based on the second silk-screen layer document, a first silk-screen layer document in the new PCB design file to obtain a target PCB design file;
the moving unit 620 is further configured to move a second area, which includes each amplified screen printing position number, in the second screen printing layer document to an idle area in a design area in the target PCB design file;
and the establishing unit 650 is used for establishing an association relationship between the amplified screen printing position number and the corresponding component by using the association function of the SKILL plug-in.
The functions of the functional units of the apparatus provided in the foregoing embodiments of the present application may be implemented by the foregoing method steps, and therefore, detailed working processes and beneficial effects of the units in the apparatus provided in the embodiments of the present application are not repeated herein.
The embodiment of the present application further provides an electronic device, as shown in fig. 7, which includes a processor 710, a communication interface 720, a memory 730, and a communication bus 740, where the processor 710, the communication interface 720, and the memory 730 complete communication with each other through the communication bus 740.
A memory 730 for storing a computer program;
the processor 710, when executing the program stored in the memory 730, implements the following steps:
adjusting the screen printing position number of a PCB design file in PCB design software to obtain a plurality of screen printing position numbers to be adjusted in the current PCB design file and a corresponding file; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
reducing the preset proportion of each silk-screen position number to be adjusted, and then moving the silk-screen position number to be adjusted to a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped;
amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number;
replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file;
moving a second area containing each amplified silk-screen position number in the second silk-screen layer document to a free area in a design area in the target PCB design file;
and establishing an association relation between the amplified screen printing position number and the corresponding component by utilizing the association function of the SKILL plug-in.
The aforementioned communication bus may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The communication bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown, but this is not intended to represent only one bus or type of bus.
The communication interface is used for communication between the electronic equipment and other equipment.
The Memory may include a Random Access Memory (RAM) or a Non-Volatile Memory (NVM), such as at least one disk Memory. Optionally, the memory may also be at least one memory device located remotely from the processor.
The Processor may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components.
Since the implementation manner and the beneficial effects of the electronic device in the foregoing embodiment for solving the problems can be implemented by referring to the steps in the embodiment shown in fig. 1, detailed working processes and beneficial effects of the electronic device provided in the embodiment of the present application are not described herein again.
In another embodiment provided by the present application, a computer-readable storage medium is further provided, where instructions are stored in the computer-readable storage medium, and when the instructions are run on a computer, the computer is enabled to execute the method for adjusting the screen printing position number of the component according to any one of the foregoing embodiments.
In another embodiment provided by the present application, a computer program product containing instructions is further provided, and when the computer program product runs on a computer, the computer is enabled to execute the method for adjusting the screen printing position number of the component according to any one of the above embodiments.
As will be appreciated by one of skill in the art, the embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, embodiments of the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
Embodiments of the present application are described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the embodiments of the present application.
It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if such modifications and variations of the embodiments of the present application fall within the scope of the claims of the embodiments of the present application and their equivalents, the embodiments of the present application are also intended to include such modifications and variations.
Claims (10)
1. A method for adjusting a screen printing position number of a component is characterized by comprising the following steps:
adjusting the screen printing position number of a PCB design file in PCB design software to obtain a plurality of screen printing position numbers to be adjusted in the current PCB design file and a corresponding file; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
reducing the preset proportion of each silk-screen position number to be adjusted, and then moving the silk-screen position number to be adjusted to a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion for ensuring that adjacent screen printing position numbers are not overlapped;
amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number;
replacing the first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file;
moving a second area containing each amplified silk-screen position number in the second silk-screen layer document to a free area in a design area in the target PCB design file;
and establishing an association relation between the amplified screen printing position number and the corresponding component by utilizing the association function of the SKILL plug-in.
2. The method of claim 1, wherein adjusting the silk-screen position numbers of the PCB design files in the PCB design software to obtain a plurality of silk-screen position numbers to be adjusted in the current PCB design file and the corresponding file comprises:
adjusting all screen printing position numbers in the PCB design file according to a preset position number adjusting standard;
moving the adjusted screen printing position number to the central position of a corresponding component to obtain a primary current PCB design file;
acquiring a first component with a non-overlapped screen printing position number and a free space around the corresponding component from the initial current PCB design file, and moving the screen printing position number of the first component to the free space to obtain a current PCB design file;
and determining the silk-screen position number corresponding to the second component which is overlapped in the current PCB design file and has no free space at the periphery of the corresponding component as the silk-screen position number to be adjusted in the current PCB design file.
3. The method of claim 1, wherein the moving of each silk-screen position number to be adjusted into the first area after reducing by a preset ratio to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file comprises:
and after reducing the preset proportion of each silk-screen position number to be adjusted, respectively moving each reduced silk-screen position number into a first area according to the moving conditions of the same moving distance and the same moving direction to obtain a new PCB design file and a first silk-screen layer file in the new PCB design file.
4. The method of claim 1, wherein replacing a first silk-screened layer document in the new PCB design file based on the second silk-screened layer document to obtain a target PCB design file, comprises:
deleting a first area containing each reduced silk-screen position number in the first silk-screen layer document in the new PCB design file to obtain a third silk-screen layer document;
and adding a second area containing the amplified silk-screen position number in the second silk-screen layer document outside the design area of the third silk-screen layer document.
5. The method of claim 1, wherein moving a second area of the second silk-screen layer document containing the enlarged silk-screen position number to a free area within a design area of the target PCB design file comprises:
detecting whether the area of the idle area is not smaller than the area of the second area;
and if the area of the idle area is not smaller than that of the second area, moving the second area containing the amplified silk-screen printing position number in the second silk-screen layer document to the idle area in the design area in the target PCB design file.
6. The method of claim 1, wherein the step of establishing an association relationship between the amplified screen printing position number and the corresponding component by using an association function of a SKILL plug-in comprises the following steps:
acquiring a silk file of the SKILL plug-in, and copying the associated component identification, the silk-screen position number and the position number information of the silk-screen position number of each component in the silk file to a target application file;
for any component, if the associated component identifier corresponding to the component is an empty identifier, replacing the empty identifier with the silk-screen position number in the target application file through the replacement function of the target application corresponding to the target application file to obtain the modified associated component identifier;
and modifying the silk file based on the modified associated component identifier.
7. The method as claimed in claim 1, wherein after moving each screen position number to be adjusted into the first area after reducing it by a preset ratio, the method further comprises:
determining the area where a device set consisting of components and parts corresponding to the reduced screen printing position numbers in the first area is located in the current PCB design file; adopting a silk-screen frame to frame the regional boundary of the region where the device set is located;
after the association relationship between the amplified silk-screen printing position number and the corresponding component is established, the method further comprises the following steps:
the second area which contains the amplified silk screen position number and is moved is correspondingly guided with the corresponding component frame by the configured associated identification; the association identifier is an association label or an association graticule.
8. The utility model provides an adjusting device of components and parts silk screen printing position number, its characterized in that, the device includes:
the adjusting unit is used for adjusting the silk-screen position numbers of the PCB design files in the PCB design software to obtain a plurality of silk-screen position numbers to be adjusted in the current PCB design files and corresponding files; the silk-screen position number to be adjusted is the silk-screen position number overlapped in the current PCB design file;
the mobile unit is used for reducing the preset proportion of each silk-screen position number to be adjusted and then moving the silk-screen position number to be adjusted into a first area to obtain a new PCB design file and a first silk-screen layer document in the new PCB design file; the first area is an area outside a design area in the current PCB design file; the arrangement information of each reduced silk-screen position number in the first area is the same as the arrangement information in the current PCB design file; the preset proportion is a change proportion which ensures that adjacent screen printing position numbers are not overlapped;
the amplifying unit is used for amplifying a first area containing each reduced silk-screen position number in the first silk-screen layer document by a preset proportion by using the adjusting function of third-party software to obtain a second silk-screen layer document, wherein the second silk-screen layer document is the silk-screen layer document of a second area containing each amplified silk-screen position number;
the replacing unit is used for replacing a first silk-screen layer document in the new PCB design file based on the second silk-screen layer document to obtain a target PCB design file;
the moving unit is further configured to move a second area, which contains each amplified silk-screen position number, in the second silk-screen layer document to an idle area in a design area in the target PCB design file;
and the establishing unit is used for establishing an association relationship between the amplified screen printing position number and the corresponding component by utilizing the association function of the SKILL plug-in.
9. An electronic device, characterized in that the electronic device comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory are communicated with each other through the communication bus;
a memory for storing a computer program;
a processor for implementing the method steps of any of claims 1-7 when executing a program stored on a memory.
10. A computer-readable storage medium, characterized in that a computer program is stored in the computer-readable storage medium, which computer program, when being executed by a processor, carries out the method steps of any one of claims 1 to 7.
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| CN202210608793.XA CN114925649A (en) | 2022-05-31 | 2022-05-31 | Method and device for adjusting screen printing position number of component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115334758A (en) * | 2022-08-25 | 2022-11-11 | 苏州浪潮智能科技有限公司 | Arrangement method and system for silk screen printing of stacked device assembly layer |
| CN115767933A (en) * | 2022-12-22 | 2023-03-07 | 广州市保伦电子有限公司 | Element silk-screen adjusting method and system based on PCB drawing |
| CN116095963A (en) * | 2023-01-06 | 2023-05-09 | 深圳市金锐显数码科技有限公司 | PCB screen printing adjustment method and device and electronic equipment |
| CN117173707A (en) * | 2023-10-30 | 2023-12-05 | 宁德时代新能源科技股份有限公司 | Method, device, equipment and storage medium for generating bit number diagram of printed circuit board |
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2022
- 2022-05-31 CN CN202210608793.XA patent/CN114925649A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115334758A (en) * | 2022-08-25 | 2022-11-11 | 苏州浪潮智能科技有限公司 | Arrangement method and system for silk screen printing of stacked device assembly layer |
| CN115334758B (en) * | 2022-08-25 | 2024-01-16 | 苏州浪潮智能科技有限公司 | Arrangement method and system for silk screen printing of assembly layers of stacked devices |
| CN115767933A (en) * | 2022-12-22 | 2023-03-07 | 广州市保伦电子有限公司 | Element silk-screen adjusting method and system based on PCB drawing |
| CN115767933B (en) * | 2022-12-22 | 2024-03-12 | 广东保伦电子股份有限公司 | Component silk screen printing adjusting method and system based on PCB drawing |
| CN116095963A (en) * | 2023-01-06 | 2023-05-09 | 深圳市金锐显数码科技有限公司 | PCB screen printing adjustment method and device and electronic equipment |
| CN117173707A (en) * | 2023-10-30 | 2023-12-05 | 宁德时代新能源科技股份有限公司 | Method, device, equipment and storage medium for generating bit number diagram of printed circuit board |
| CN117173707B (en) * | 2023-10-30 | 2024-04-02 | 宁德时代新能源科技股份有限公司 | Method, device, equipment and storage medium for generating bit number diagram of printed circuit board |
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