CN114710895A - Camera device and preparation method thereof - Google Patents
Camera device and preparation method thereof Download PDFInfo
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- CN114710895A CN114710895A CN202210365499.0A CN202210365499A CN114710895A CN 114710895 A CN114710895 A CN 114710895A CN 202210365499 A CN202210365499 A CN 202210365499A CN 114710895 A CN114710895 A CN 114710895A
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- 238000002360 preparation method Methods 0.000 title abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 238000009434 installation Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 160
- 238000000034 method Methods 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 14
- 238000005553 drilling Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000003701 mechanical milling Methods 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a camera device and a preparation method thereof, wherein the preparation method of the camera device comprises the following steps: obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position of the first medium layer corresponding to the conductive boss; sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate; controlling depth from one side of the laminated plate far away from the first layer-adding plate based on a preset position to form a mounting groove exposing the conductive boss; the camera shooting assembly is installed in the installation groove until one side of the camera shooting assembly is attached to the conductive boss, and therefore the camera shooting device is manufactured. Through the mode, the complexity of the camera device preparation can be reduced, and the preparation efficiency is improved.
Description
Technical Field
The invention is applied to the technical field of camera devices, in particular to a camera device and a preparation method thereof.
Background
Pcb (printed Circuit board), also known as printed Circuit board or printed Circuit board, is an important electronic component used in a wide range of applications, is a support for electronic components, and is also a carrier for electrical connection of electronic components.
When the CIS needs to sink into the printed circuit board for assembly, a groove needs to be formed in the printed circuit board below the CIS, and the steel sheet reinforcing sheet is attached to reinforce the rigidity of the structure, and is grounded and radiated.
When the scheme needs to use materials such as conductive adhesive, steel sheets and the like, the materials are various, the preparation is complex, and the efficiency is low.
Disclosure of Invention
The invention provides a camera device and a preparation method thereof, which aim to solve the problem that the camera device is complex to prepare.
In order to solve the above technical problem, the present invention provides a method for manufacturing an image pickup apparatus, including: obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position of the first medium layer corresponding to the conductive boss; sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate; controlling depth from one side of the laminated plate far away from the first layer-adding plate based on a preset position to form a mounting groove exposing the conductive boss; the camera shooting assembly is installed in the installation groove until one side of the camera shooting assembly is attached to the conductive boss, and therefore the camera shooting device is manufactured.
The method comprises the following steps of obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position, corresponding to the conductive boss, of the first medium layer, and comprises the following steps: obtaining a multilayer circuit board, and taking the multilayer circuit board as a plate to be processed; obtaining a first medium layer, and controlling the depth of the first medium layer to form a through hole; and obtaining a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate.
The method comprises the following steps of obtaining a first layer adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer adding plate, and the step comprises the following steps: obtaining a first metal layer, a second dielectric layer and a second metal layer; sequentially stacking and laminating the first metal layer, the second dielectric layer and the second metal layer to obtain a first layer-adding plate; and removing part of the first metal layer based on the preset position to form the conductive boss.
The sum of the thickness of the position of the first layer-adding plate where the conductive boss is formed and the thickness of the camera shooting assembly is the same as the thickness of the corresponding pressing plate.
Wherein, to wait to process plate, first dielectric layer and first increase a layer plate and stack up in proper order and correspond and place to carry out the pressfitting, include after the step of obtaining the pressfitting plate: and drilling and metalizing the laminated plate in sequence to realize interlayer interconnection of the laminated plate.
Wherein, drill and metallization to the pressfitting plate in proper order to realize that the step of the interlayer interconnection of pressfitting plate still includes: drilling one side of the pressing plate close to the conductive boss based on a preset position to form a blind hole of the exposed conductive boss; and metalizing the blind holes to form grounding holes.
Wherein, to make a video recording the subassembly and install to the mounting groove in, one side and the electrically conductive boss laminating setting up of subassembly of making a video recording to the step of preparing camera device includes: and welding one side of the camera shooting assembly to the conductive boss, and connecting the camera shooting assembly and the pressing plate through lead bonding.
Wherein, will wait to process plate, first dielectric layer and first increase a layer plate and stack up in proper order and place to make electrically conductive boss be located the through-hole and carry out the pressfitting, obtain the step of pressfitting plate and include: obtaining a second layer-adding plate; the second layer-adding plate comprises a third metal layer and a third dielectric layer which are arranged in a fitting mode; sequentially stacking and correspondingly placing the second layer-adding plate, the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate; and one side of the second layer-adding plate, on which the third medium layer is formed, is arranged close to the plate to be processed.
Wherein, drill and metallization to the pressfitting plate in proper order to still include after the step of the interconnection between the layer of realization pressfitting plate: and sequentially carrying out line transfer, solder resistance and surface coating on the laminated plate.
In order to solve the above technical problems, the method for manufacturing the camera device of the present invention first obtains a plate to be processed, a first dielectric layer and a first build-up plate, wherein, a conductive boss is formed at a preset position at one side of the first layer-adding plate, a through hole is formed at a position of the first medium layer corresponding to the conductive boss, and then the plate to be processed, the first medium layer and the first layer-adding plate are sequentially stacked, and the conductive boss is positioned in the through hole for pressing to obtain a pressed plate, depth control is carried out from one side of the pressed plate far away from the first laminated plate based on a preset position to form a mounting groove exposing the conductive boss, finally the camera shooting component is mounted in the mounting groove until one side of the camera shooting component is attached to the conductive boss, with preparation camera device, can utilize electrically conductive boss can dispel the heat and support the subassembly of making a video recording, and the structural rigidity of whole subassembly of making a video recording can also be strengthened to first layer plate spare of adding simultaneously. Therefore, the functions are realized without additionally using materials such as conductive adhesive, steel sheets and the like, so that the complexity of the camera device is reduced, and the preparation efficiency is improved. And the embodiment avoids the use of steel sheets, increases the welding space of a plurality of components, and is favorable for realizing the lightening, thinning and lightening of the camera shooting assembly.
Drawings
Fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing an image pickup device according to the present invention;
fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing an image pickup device according to the present invention;
FIG. 3 is an exploded view of one embodiment of a single-sided build-up laminated panel assembly of the embodiment of FIG. 2;
FIG. 4 is an exploded view of another embodiment of the double-sided laminated board of the embodiment of FIG. 2;
fig. 5 is a schematic structural diagram of an embodiment after the hole is drilled in the press-fit plate in step S23 in the embodiment of fig. 2;
FIG. 6 is a schematic structural diagram of the embodiment after the depth control in step S24 in FIG. 2;
fig. 7 is a schematic structural diagram of an embodiment of the imaging apparatus according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing an image pickup device according to an embodiment of the present invention.
Step S11: the method comprises the steps of obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position, corresponding to the conductive boss, of the first medium layer.
The method comprises the steps of obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein the plate to be processed can comprise a plurality of conducting layers and a plurality of medium layers which are sequentially stacked and attached.
The board to be processed may include a circuit board, and conductive lines may be formed on conductive layers in the circuit board to implement a line function thereof. In a specific application scenario, when the plate to be processed only needs to be subjected to layer addition of the first layer-adding plate, the conducting layer on the side, where the layer addition is not needed, of the plate to be processed does not need to be formed, so that the conducting layer is not formed at first, and then the circuit preparation of the conducting layer is performed after the lamination is finished. In another specific application scenario, when the plate to be processed needs to be subjected to double-sided layer addition, conductive circuits can be formed on each conductive layer in the plate to be processed, so that the circuit function of the plate to be processed is realized.
The first dielectric layer may specifically include one or more of epoxies, polyimides, Bismaleimide Triazine (BT), and ceramic based materials.
The first build-up plate is used for building up a plate to be processed, and can also be formed by a conductive layer and a dielectric layer.
And a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position of the first medium layer corresponding to the conductive boss. The preset position of the embodiment refers to a position on the first build-up plate corresponding to the installation position of the camera shooting assembly.
In a specific application scenario, the conductive bump may be formed by etching the conductive layer on one side of the first build-up plate. In another specific application scenario, the conductive bump may also be formed by directly pressing the conductive block on one side of the first build-up board, which is not limited herein.
In a specific application scenario, the through holes in the first dielectric layer can be matched with the sizes of the corresponding conductive bosses, so that the conductive bosses can penetrate through the first dielectric layer through the corresponding through holes, and the outer walls of the conductive bosses are attached to the inner walls of the through holes.
Step S12: and sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, and pressing the conductive boss in the through hole to obtain a pressed plate.
And sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, positioning the conductive boss in the through hole, and pressing to obtain a pressed plate.
In a specific application scenario, the conductive boss of the first layer-adding plate may be inserted into the through hole of the first medium layer, and then one side of the first medium layer, which is far away from the first layer-adding plate, is placed in a manner of being attached to a plate to be processed, and then the plate is pressed, so that a pressed plate is obtained.
The position of the plate to be processed corresponding to the conductive boss can be free of conductive circuits, so that the conductive boss is avoided, the problems of stress contradiction or circuit short circuit and the like between the plate to be processed and the conductive boss after pressing are avoided, and the reliability of the camera device is improved.
In a specific application scenario, when the camera device needs to install a plurality of camera components, the first layer-adding plate can be provided with a plurality of conductive bosses, the first medium layer is correspondingly provided with a plurality of through holes, and when the first medium layer is pressed, each conductive boss is correspondingly inserted into each through hole.
Step S13: and controlling the depth of the laminated plate on the basis of the preset position from one side of the laminated plate far away from the first laminated plate to form a mounting groove for exposing the conductive boss.
After lamination, depth control is carried out from one side of the lamination plate far away from the first lamination plate based on the preset position on the first lamination plate, and a mounting groove for exposing the conductive boss is formed.
In a specific application scenario, the depth control method in this step may include mechanical milling, and depth control is performed on one side of the press-fit plate, which is far away from the first build-up plate, by using a milling cutter until the conductive boss is exposed, so as to form the mounting groove.
In another specific application scenario, the depth control method in this step may also include laser ablation, where laser is used to ablate the side of the press-fit plate away from the first build-up plate until the conductive boss is exposed, so as to form the mounting groove.
Step S14: the camera shooting assembly is installed in the installation groove until one side of the camera shooting assembly is attached to the conductive boss, and therefore the camera shooting device is manufactured.
The camera shooting assembly is installed in the installation groove until one side of the camera shooting assembly is attached to the conductive boss, and therefore the camera shooting device is manufactured.
In a specific application scene, one side of the camera shooting assembly and the conductive boss can be fixed in a welding mode, so that the camera shooting assembly is installed. In another specific application scenario, one side of the camera shooting assembly can be fixed with the conductive boss in a conductive adhesive bonding mode, so that the camera shooting assembly is mounted.
In a specific application scenario, the camera module may include a CIS (image sensor), or other camera modules, and after the camera module is installed, the camera module may be wire-bonded, so as to achieve electrical connection between the camera module and the board.
The conductive boss can dissipate and support the camera shooting assembly, and meanwhile, the first layer adding plate can also strengthen the structural rigidity of the whole camera shooting assembly. The plate type and the preparation process adopted by the preparation method of the embodiment are common processes and materials in circuit board preparation, and materials such as conductive adhesive, steel sheet and the like are not needed to be additionally used for realizing the functions, so that the preparation complexity of the camera device is reduced, and the preparation efficiency is improved.
Through the above steps, the method for manufacturing the camera device of the embodiment first obtains the plate to be processed, the first dielectric layer and the first build-up plate, wherein, a conductive boss is formed at a preset position at one side of the first layer-adding plate, a through hole is formed at a position of the first medium layer corresponding to the conductive boss, and then the plate to be processed, the first medium layer and the first layer-adding plate are sequentially stacked, and the conductive boss is positioned in the through hole for pressing to obtain a pressed plate, depth control is carried out from one side of the pressed plate far away from the first layer-adding plate based on a preset position to form a mounting groove exposing the conductive boss, finally the camera shooting component is mounted in the mounting groove until one side of the camera shooting component is attached to the conductive boss, with preparation camera device, can utilize electrically conductive boss can dispel the heat and support the subassembly of making a video recording, and the structural rigidity of whole subassembly of making a video recording can also be strengthened to first layer plate spare of adding simultaneously. Therefore, the functions are realized without additionally using materials such as conductive adhesive, steel sheets and the like, so that the complexity of the camera device is reduced, and the preparation efficiency is improved. And the embodiment avoids the use of steel sheets in the camera device, increases the welding space of multiple devices, and is favorable for realizing the lightening, thinning and lightening of the camera component.
Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing an image pickup device according to the present invention.
Step S21: obtaining a multilayer circuit board, and taking the multilayer circuit board as a plate to be processed; obtaining a first medium layer, and controlling the depth of the first medium layer to form a through hole; and obtaining a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate.
The method comprises the steps of obtaining a multilayer circuit board, using the multilayer circuit board as a board to be processed, in a specific application scene, when the board to be processed only needs to be subjected to layer adding of a first layer adding board, forming no conducting layer on the side, where the layer adding is not needed, of the board to be processed, so that the conducting layer is not formed at first, the subsequent pressing force is facilitated, and the circuit preparation of the conducting layer is carried out after the pressing is finished. In another specific application scenario, when the plate to be processed needs to be subjected to double-sided layer addition, conductive circuits can be formed on each conductive layer in the plate to be processed, so that the circuit function of the plate to be processed is realized.
And obtaining the first medium layer, and controlling the depth of the first medium layer to form a through hole. Wherein the depth control means may comprise mechanical milling or laser ablation. And controlling the depth of the first medium layer based on the position of the camera shooting assembly to be installed subsequently to form a through hole.
And obtaining a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and the position of the conductive boss corresponds to the position of the through hole on the first medium layer.
In a specific application scenario, a first metal layer, a second dielectric layer and a second metal layer can be obtained, the first metal layer, the second dielectric layer and the second metal layer are sequentially stacked and pressed to obtain a first layer-adding plate, and finally, part of the first metal layer is removed based on a preset position to form a conductive boss. Wherein the removing means may comprise etching or mechanical milling.
In another specific application scenario, at least one first metal block, at least one second dielectric layer, and at least one second metal layer may also be obtained, and the at least one first metal block, the at least one second dielectric layer, and the at least one second metal layer are sequentially stacked and pressed based on a preset position, so as to obtain a first build-up plate on which the conductive bump is formed.
Wherein, the thickness of the electrically conductive boss of this embodiment can be different with the thickness of second metal layer, and the thickness of electrically conductive boss can set up based on the depth of sinking of the subassembly of making a video recording to make the thickness that is formed with the position of the first lamination plate of electrically conductive boss and the thickness sum of the subassembly of making a video recording the same with the thickness of the pressfitting plate that corresponds, specifically, the thickness that is formed with the position of the first lamination plate of electrically conductive boss and the thickness sum of the subassembly of making a video recording the pressfitting plate that the subassembly is close to are the same with the thickness of the subassembly of making a video recording.
Step S22: and sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, and pressing the conductive boss in the through hole to obtain a pressed plate.
And sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, positioning the conductive boss in the through hole, and pressing to obtain a pressed plate.
In a specific embodiment, the conductive boss of the first layer-adding plate may be inserted into the through hole of the first medium layer, and then one side of the first medium layer, which is far away from the first layer-adding plate, is placed in contact with the plate to be processed, and then the plate is pressed to obtain a pressed plate. The pressing mode of the embodiment is applied to the plate to be processed and needs to be subjected to single-side layer adding.
Referring to fig. 3, fig. 3 is an exploded view of an embodiment of a single-sided build-up laminated panel shown in fig. 2.
The laminated board 100 of the present embodiment includes a board 110 to be processed, a first dielectric layer 120, and a first build-up board 130, which are sequentially stacked and attached to each other. The to-be-processed plate 110 includes multiple conductive layers 111 and multiple dielectric layers 112 stacked and attached in sequence, the conductive layer 111 on the side of the to-be-processed plate 110 away from the first dielectric layer 120 is a whole conductive layer, and conductive lines are formed on the other conductive layers 111.
At least one via 121 is formed on the first dielectric layer 120.
The first build-up plate 130 includes a conductive bump 131, a second dielectric layer 132, and a second metal layer 133, which are sequentially stacked and attached to each other. The positions of the conductive bosses 131 correspond to the positions of the through holes 121, and both correspond to the mounting positions of the camera module.
The conductive layer 111 on the side of the plate 110 to be processed close to the first dielectric layer 120 is arranged to avoid the conductive boss 131.
And correspondingly placing the plates and laminating to obtain the laminated plate 100.
When the plate to be processed needs double-sided layer adding, the plate needs to be additionally obtained to form a second layer adding plate.
In a specific embodiment, the second build-up plate comprises a third metal layer and a third dielectric layer which are attached to each other; sequentially stacking and correspondingly placing the second layer-adding plate, the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate; and one side of the second layer-adding plate, on which the third medium layer is formed, is arranged close to the plate to be processed.
Referring to fig. 4, fig. 4 is an exploded view of another embodiment of the double-sided laminated plate in the embodiment of fig. 2.
The structures of the first dielectric layer 220 and the first build-up plate 230 of the present embodiment are the same as those of the foregoing embodiments, and thus, the description thereof is omitted here.
The plate 210 to be processed of the present embodiment includes multiple conductive layers 211 and dielectric layers 212 stacked and attached in sequence, and a conductive circuit may be formed on each conductive layer 211.
The second build-up plate 240 includes a third metal layer 241 and a third dielectric layer 242, and the side of the second build-up plate 240 where the third dielectric layer 242 is formed is disposed toward the plate 210 to be processed.
In other embodiments, an additional dielectric layer may be disposed between the second build-up board 240 and the board 210 to be processed, so as to facilitate the bonding.
The second build-up plate 240 may include a single-sided copper-clad plate.
And correspondingly placing the plates and laminating to obtain the laminated plate 200.
Step S23: and drilling and metalizing the laminated plate in sequence to realize interlayer interconnection of the laminated plate.
After lamination, the laminated plate is sequentially drilled and metallized so as to form a plurality of via holes on the laminated plate to communicate the plate to be processed with the conductive layers in the build-up plate, thereby realizing interlayer interconnection of the laminated plate.
The drilling of the present embodiment may be performed by mechanical milling or laser ablation. The metallization process may include a plating process or conductive paste curing, etc.
During drilling, drilling is further carried out on one side, close to the conductive boss, of the pressing plate based on the preset position, a blind hole of the exposed conductive boss is formed, and the blind hole is metallized to form a grounding hole communicated with the conductive boss.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment after the plate pressing and drilling operation of step S23 in fig. 2.
In this embodiment, the laminated board 300 is formed with a conductive blind via 301 for conduction and a grounding blind via 302 for grounding, and the conductive blind via 301 and the grounding blind via 302 can be formed with a conductive via and a grounding via after metallization.
The conductive blind via 301 is used to expose a part of the conductive layer 303, and the grounding blind via 302 is used to expose a part of the conductive bump 304, so as to achieve respective electrical connection between the conductive layer 303 and the conductive bump 304 after metallization.
Step S24: depth control is carried out from one side of the laminating plate far away from the first layer-adding plate based on a preset position, and a mounting groove of the exposed conductive boss is formed.
In a specific application scenario, before depth control, circuit preparation can be performed on the conducting layer on the surface layer of the laminated plate, and solder-resisting and surface-coating manufacturing is performed on the whole laminated plate so as to protect the laminated plate, so that lead bonding can be performed on the camera assembly and the conducting layer after circuit preparation.
After lamination, depth control is carried out from one side of the lamination plate far away from the first lamination plate based on the preset position on the first lamination plate, and a mounting groove for exposing the conductive boss is formed.
In a specific application scenario, the depth control method in this step may include mechanical milling, and depth control is performed on one side of the press-fit plate, which is far away from the first build-up plate, by using a milling cutter until the conductive boss is exposed, so as to form the mounting groove.
In another specific application scenario, the depth control method in this step may also include laser ablation, where laser is used to ablate the side of the press-fit plate away from the first build-up plate until the conductive boss is exposed, so as to form the mounting groove.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment after the depth control in step S24 in the embodiment of fig. 2.
The compression-bonding plate member 400 of the present embodiment is formed with a mounting groove 401, and the bottom of the mounting groove 401 is formed by a conductive boss 403.
And a solder mask 402 is formed on the surface of the press-fit board 400, and the solder mask 402 covers a part of the conductive layer on the surface of the press-fit board 400 to protect the conductive layer.
Step S25: and welding one side of the camera shooting assembly on the conductive boss, and connecting the camera shooting assembly and the pressing plate through lead bonding.
After the installation groove is formed in the press-fit plate, one side of the camera shooting assembly is welded on the conductive boss in the installation groove, and the camera shooting assembly and the press-fit plate are connected through lead bonding, so that the electric connection between the camera shooting assembly and the press-fit plate is realized.
After the camera shooting assembly is installed, the thickness of the position of the first layer adding plate formed with the conductive boss and the sum of the thicknesses of the camera shooting assemblies are the same as the thickness of the corresponding press-fit plate, so that after the camera shooting assembly is installed, the surface of the camera shooting assembly is flush with the press-fit plate, the lead bonding of the camera shooting assembly is facilitated, the situation that the camera shooting assembly is stressed externally is reduced, and the reliability and the stability of the camera shooting device are improved.
Through the above steps, the method for manufacturing the camera device of the embodiment can obtain the plate to be processed, the first dielectric layer, the second layer-adding plate and the first layer-adding plate, then sequentially stack the plate to be processed, the first dielectric layer, the second layer-adding plate and the first layer-adding plate, and the conductive lug boss is positioned in the through hole for pressing to obtain a pressed plate, the pressed plate is sequentially drilled and metallized, to realize interlayer interconnection of the laminated plate, depth control is carried out from one side of the laminated plate far away from the first layer-adding plate based on a preset position to form a mounting groove exposing the conductive boss, finally one side of the camera component is welded on the conductive boss, the camera shooting component and the pressing plate are connected through wire bonding, the conductive lug boss can be used for radiating and supporting the camera shooting component, and simultaneously, the first layer-adding plate and the second layer-adding plate can also enhance the structural rigidity of the whole camera shooting assembly. Therefore, materials such as conductive adhesive and steel sheets do not need to be additionally used for realizing the functions, the complexity of the camera device is reduced, and the preparation efficiency is improved. And the embodiment avoids the use of steel sheets, increases the welding space of a plurality of components, and is favorable for realizing the lightening, thinning and lightening of the camera shooting assembly.
Referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment of an image capturing device according to the present invention.
The image pickup apparatus 500 of the present embodiment includes at least an image pickup assembly 550 and a panel main body (not shown).
The plate main body comprises a first plate 510, a first medium layer 530 and a second plate 520 which are sequentially stacked and attached, and the first plate 510 and the second plate 520 are fixedly bonded through the first medium layer 530.
At least one mounting groove is formed on the first plate 510, at least one conductive boss 521 is formed at a preset position on one side of the second plate 520, the conductive boss 521 is arranged corresponding to the mounting groove, and the conductive boss 521 passes through the through hole on the first dielectric layer 530 to form the bottom of the corresponding mounting groove.
The camera module 550 is mounted in the mounting groove, and one side of the camera module 550 is attached to the conductive boss 521.
Through the structure, the camera device of the embodiment can utilize the conductive boss to radiate and support the camera component, and meanwhile, the first plate can also strengthen the structural rigidity of the whole camera component. Therefore, the functions are realized without additionally using materials such as conductive adhesive, steel sheets and the like, so that the complexity of the camera device is reduced, and the preparation efficiency is improved. And the embodiment avoids the use of steel sheets, increases the welding space of a plurality of components, and is favorable for realizing the lightening, thinning and lightening of the camera shooting assembly.
In other embodiments, the first board 510 includes a plurality of sequentially stacked and attached conductive layers 511 and dielectric layers 512. The camera module 550 is wire-bonded to the conductive layer 511 on the surface of the first board 510, so that the camera module 550 is electrically connected.
In other embodiments, part of the surface of the image pickup apparatus 500 is further covered with a solder resist layer 540, so that the image pickup apparatus 500 is protected by the solder resist layer 540.
In other embodiments, the side of the camera module 550 away from the conductive bump 521 is flush with the corresponding side surface of the camera device 500, so that the camera module 550 is protected by the board body of the camera device 500.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method of manufacturing an image pickup apparatus, comprising:
obtaining a plate to be processed, a first medium layer and a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate, and a through hole is formed at a position of the first medium layer corresponding to the conductive boss;
sequentially stacking the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate;
controlling depth from one side of the pressing plate far away from the first layer-adding plate based on the preset position to form a mounting groove exposing the conductive boss;
and installing a camera shooting assembly in the installation groove until one side of the camera shooting assembly is attached to the conductive boss to prepare the camera shooting device.
2. The method for manufacturing the imaging device according to claim 1, wherein the step of obtaining the plate to be processed, the first dielectric layer, and the first build-up plate, wherein a conductive boss is formed at a preset position on one side of the first build-up plate, and a through hole is formed at a position of the first dielectric layer corresponding to the conductive boss includes:
obtaining a multilayer circuit board, and taking the multilayer circuit board as the plate to be processed;
obtaining a first medium layer, and controlling the depth of the first medium layer to form the through hole;
and obtaining a first layer-adding plate, wherein a conductive boss is formed at a preset position on one side of the first layer-adding plate.
3. The method according to claim 2, wherein the step of obtaining the first build-up sheet member in which the conductive bumps are formed at predetermined positions on one side of the first build-up sheet member includes:
obtaining a first metal layer, a second dielectric layer and a second metal layer;
sequentially stacking and laminating the first metal layer, the second dielectric layer and the second metal layer to obtain a first layer-adding plate;
and removing part of the first metal layer based on the preset position to form the conductive boss.
4. The method for manufacturing an image pickup apparatus according to any one of claims 1 to 3, wherein a sum of a thickness of a position of the first build-up sheet where the conductive land is formed and a thickness of the image pickup element is the same as a thickness of the corresponding lamination sheet.
5. The method for manufacturing the imaging device according to claim 1, wherein the step of sequentially stacking and correspondingly placing the plate to be processed, the first dielectric layer, and the first build-up plate, and performing press-fitting to obtain a press-fitted plate includes:
and sequentially drilling and metalizing the laminated plate to realize the interlayer interconnection of the laminated plate.
6. The method for manufacturing an image pickup apparatus according to claim 5, wherein the step of sequentially drilling and metalizing the laminated board to interconnect the layers of the laminated board further comprises:
drilling one side of the pressing plate close to the conductive boss based on the preset position to form a blind hole exposing part of the conductive boss;
and metalizing the blind holes to form grounding holes.
7. The method for manufacturing an image pickup apparatus according to claim 5, wherein the step of sequentially drilling and metalizing the laminated board to interconnect the layers of the laminated board further comprises:
and sequentially carrying out line transfer, solder resistance and surface coating on the laminated plate.
8. The method according to claim 1, wherein the step of mounting a camera module in the mounting groove until one side of the camera module is attached to the conductive projection to manufacture the camera device comprises:
and welding one side of the camera shooting assembly on the conductive boss, and connecting the camera shooting assembly and the pressing plate through lead bonding.
9. The method for manufacturing the imaging device according to claim 1, wherein the step of sequentially stacking the plate to be processed, the first dielectric layer, and the first build-up plate, and positioning the conductive bump in the through hole for lamination to obtain a laminated plate includes:
obtaining a second layer-adding plate; the second layer-adding plate comprises a third metal layer and a third dielectric layer which are arranged in a fitting mode;
sequentially stacking and correspondingly placing the second layer-adding plate, the plate to be processed, the first medium layer and the first layer-adding plate, and enabling the conductive boss to be positioned in the through hole for pressing to obtain a pressed plate;
and one side of the second layer-adding plate, on which the third medium layer is formed, is arranged close to the plate to be processed.
10. The camera device is characterized by at least comprising a camera component and a plate body;
the plate main body comprises a first plate, a first medium layer and a second plate which are sequentially stacked and attached, and the first plate and the second plate are bonded and fixed through the first medium layer;
at least one mounting groove is formed in the first plate, at least one conductive boss is formed in a preset position on one side of the second plate, the conductive boss is arranged corresponding to the mounting groove, and the conductive boss penetrates through the through hole in the first medium layer to form the bottom of the corresponding mounting groove;
the camera shooting component is installed in the installation groove, and one side of the camera shooting component is attached to the conductive boss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210365499.0A CN114710895A (en) | 2022-04-07 | 2022-04-07 | Camera device and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210365499.0A CN114710895A (en) | 2022-04-07 | 2022-04-07 | Camera device and preparation method thereof |
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| CN114710895A true CN114710895A (en) | 2022-07-05 |
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| CN202210365499.0A Pending CN114710895A (en) | 2022-04-07 | 2022-04-07 | Camera device and preparation method thereof |
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