CN114653503A - Glue spreader and process chamber thereof - Google Patents
Glue spreader and process chamber thereof Download PDFInfo
- Publication number
- CN114653503A CN114653503A CN202011537079.3A CN202011537079A CN114653503A CN 114653503 A CN114653503 A CN 114653503A CN 202011537079 A CN202011537079 A CN 202011537079A CN 114653503 A CN114653503 A CN 114653503A
- Authority
- CN
- China
- Prior art keywords
- wafer
- process chamber
- chamber
- retainer ring
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000008569 process Effects 0.000 title claims abstract description 28
- 239000003292 glue Substances 0.000 title claims abstract description 11
- 238000004140 cleaning Methods 0.000 claims abstract description 28
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 3
- 239000000126 substance Substances 0.000 abstract description 9
- 239000012530 fluid Substances 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
Abstract
The invention discloses a process chamber of a glue spreader, which can prevent photoresist from polluting the back of a wafer and comprises a chamber body, a wafer support, a cup cover, a back cleaning nozzle and a check ring, wherein the bottom of the chamber body is provided with an exhaust structure, the check ring is positioned below the wafer, a narrow gap is formed between the end surface of the top of the check ring and the wafer, and a narrow passage which inclines downwards is formed between the end surface of the top of the check ring and the inner wall of the cup cover. In the gluing process, the air exhaust mechanism runs to form airflow in a specific direction near the periphery of the wafer, the airflow can prevent the photoresist from polluting the back of the wafer, and the back cleaning fluid in the gap between the wafer and the check ring can also prevent the photoresist and other chemical substances from entering the check ring to pollute the back of the wafer. The invention also discloses a glue spreader comprising the process cavity.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a process chamber for preventing photoresist from polluting the back of a wafer and a glue spreader.
Background
The glue coating process plays an important role in the lithography technology. The prior art has the following problems: in the spin coating process, a part of the photoresist may flow to the back surface of the wafer or be splashed back to the back surface of the wafer by the inner wall of the process chamber, which causes contamination to the wafer itself and equipment in the subsequent process steps, and thus the photoresist and chemicals remaining on the back surface of the wafer need to be removed in the coating process.
The conventional glue spreader generally adopts a washing spray head to wash the back of a wafer, and a cleaning solution is upwards sprayed to the back of the rotating wafer and then thrown out under the action of centrifugal force to prevent photoresist from accumulating on the back of the wafer. However, in the actual process, the speed of the cleaning liquid is reduced after reaching the edge of the back surface of the wafer, so that the impact force on the photoresist and other pollutants is reduced, and the phenomenon of incomplete cleaning still exists. Particularly when the wafer is rotated at a low speed, the centrifugal force provided may not be sufficient to cause the cleaning solution to reach the edge of the wafer, resulting in contaminant residue on the outer periphery of the wafer backside. In addition, the cleaning solutions such as EBR and BSR are volatile, and the mixture of the cleaning solution and the photoresist in the process chamber is attached to the back surface of the wafer after being volatilized, so that the cleaning solution is difficult to remove.
Disclosure of Invention
The invention aims to provide a process chamber and a glue spreader aiming at the technical problems, so as to prevent the back surface of a wafer from being polluted.
In order to achieve the above object, an embodiment of the present invention provides a process chamber, including:
the top of the cavity is open, and the bottom of the cavity is provided with an air exhaust mechanism;
a wafer support disposed in the chamber, the wafer support configured to support a wafer;
the cup cover is covered at the top of the cavity, and the top of the cup cover is open;
the back cleaning nozzle is arranged below the wafer; and
the upper half part of the retainer ring is in an inverted truncated cone shape, the end face at the top of the retainer ring inclines downwards, the outer diameter of the end face is larger than the diameter of the wafer, a narrow gap exists between the end face and the back face of the wafer, and a narrow passage which inclines downwards is formed between the end face and the inner wall of the cup cover;
in the gluing process, the back cleaning nozzle sprays cleaning liquid to the back of the wafer and flies out or flows out from the narrow gap, the air exhaust mechanism runs, and air flow enters from the top of the cup cover and is exhausted by the air exhaust mechanism after passing through the narrow channel.
Alternatively, the inner diameter of the end face of the top of the retainer ring is smaller than or equal to the diameter of the wafer.
Optionally, the exhaust mechanism includes an exhaust outlet disposed at the bottom of the cavity, and an exhaust channel and an exhaust pump connected to the exhaust outlet.
Optionally, more than two air exhaust mechanisms are provided.
Alternatively, the retainer ring is made of teflon material by integral molding.
Optionally, the height of the gap between the top of the retainer ring and the back of the wafer is 0.5 mm-10 mm.
Optionally, a rotary actuator is connected to the bottom of the wafer support.
Optionally, a base is disposed at the bottom of the cavity, the wafer support is located above the base, the rotary actuator is connected to the wafer support through a rotary shaft, and a lower half portion of the rotary shaft is accommodated in the base.
Alternatively, the bottom of the retainer ring is connected to the upper surface of the base.
Another embodiment of the invention provides a coater that includes the process chamber of the previous embodiment and a photoresist spraying assembly disposed above the wafer support.
According to the invention, the retainer ring is arranged below the wafer, and by utilizing the shape and position relationship among the cup cover, the retainer ring and the wafer, when the air exhaust structure at the bottom of the cavity works, air flow in a specific direction can be formed near the periphery of the wafer, the air flow can prevent photoresist and other chemical substances from polluting the back of the wafer, and the back cleaning liquid in the gap between the wafer and the retainer ring can also prevent the photoresist and other chemical substances from entering the retainer ring to pollute the back of the wafer.
Drawings
Fig. 1 illustrates a schematic structural view of the process chamber of this embodiment 1.
Fig. 2 illustrates a partially enlarged schematic view of fig. 1.
Fig. 3 illustrates a schematic cross-sectional view of the cup of example 1.
FIG. 4 is a schematic view illustrating the structure of a process chamber according to example 2.
Fig. 5 illustrates a schematic structural view of the glue spreader of example 3.
Detailed Description
To explain the technical content, structural features, and achieved objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in combination with the embodiments.
Example 1
As shown in fig. 1 to 3, a process chamber of a coater for preventing photoresist from contaminating the back surface of a wafer includes a chamber body 101, a wafer support 102, a cup 103, a back surface cleaning nozzle 104, and a retaining ring 105.
The top of the cavity 101 is open, the bottom of the cavity 101 is provided with an air exhaust mechanism, and the air exhaust mechanism comprises an air exhaust port 1011, an air exhaust channel 108 connected with the air exhaust port 1011, and an air exhaust pump 109 connected with the air exhaust channel 108. The exhaust pump 109 may be replaced with a functionally equivalent exhaust fan or the like.
A wafer support 102 is disposed in the chamber body 101 for supporting a wafer 107, and the wafer support 102 may be a vacuum chuck. A rotary actuator 106 is coupled to the bottom of wafer support 102, and rotary actuator 106 may be a motor, and is configured to rotate wafer support 102 in a horizontal plane. The rotary actuator 106 is connected to the chamber 101 through a rotary shaft. Specifically, the bottom of the chamber 101 is provided with a base 1012, the wafer support 102 is positioned above the base 1012, the top of the rotation axis is connected to the wafer support 102, the lower half is accommodated in the base 1012, and the bottom is connected to the rotary actuator 106.
The cup 103 is disposed on the top of the chamber 101 and is used for shielding the photoresist flying from the surface of the wafer 107 and flowing down along the inner wall thereof. The top of the cup cover 103 is open. Since there is a distance between the wafer 107 and the inner wall of the chamber 101, and the cup 103 should extend above the wafer 107 to cover the outer ring of the wafer 107, the lower half of the cup 103 is in a cone shape, i.e. the lower half of the cup wall is inclined downward.
The backside cleaning nozzle 104 is disposed under the wafer 107 for spraying a cleaning solution or deionized water to the backside of the wafer 107.
The retaining ring 105 is made of a corrosion-resistant material such as teflon, and is integrally formed and fixed below the wafer 107, specifically, it can be fixed in the chamber 101 by a bolt connection or by adhesion. In this embodiment, the retaining ring 105 is fixedly attached to the base 1012. As shown in fig. 3, the upper half of the retainer ring 105 has an inverted truncated cone shape, and an end surface 1051 of the top of the retainer ring 105 is inclined downward, and a narrow passage inclined downward is formed between the end surface 1051 and the inner wall of the cup cover 103. The outer diameter d2 of the end surface 1051 is slightly larger than the diameter of the wafer 107, so that the retainer ring 105 can completely cover the whole back surface of the wafer from the lower part of the wafer, and the photoresist can be better prevented from being splashed to the back surface of the wafer by the inner wall of the cup cover 103; the inner diameter d1 of the end surface 1051 is substantially the same as the diameter of the wafer 107, but may be slightly smaller than the diameter of the wafer 107, so that even if photoresist or cleaning fluid drops off from the front surface of the wafer, it will drip onto the end surface 1051 and then slide down the inclined end surface 1051 toward the outside of the retaining ring 105, without directly dripping or sliding down into the retaining ring 105. As shown in fig. 2, the inner diameter of the end face 1051 in this embodiment is smaller than the diameter of the wafer. As shown in fig. 3, the broken line is the central axis of the retainer ring 105, r2 represents the outer radius of the end face 1051, and r1 represents the inner radius of the end face 1051.
The end face 1051 presents a narrow gap with the back side of the wafer 107 that cannot be too large or there may be a flow of gas across the back side of the wafer 107 that introduces volatilized chemicals into the back side of the wafer 107; the narrow gap cannot be too small, and the requirement for timely discharge of the cleaning solution is met. As shown in fig. 2, the height h of the narrow gap may be 0.5mm to 5mm, specifically, set according to the size of the wafer 107, the flow rate of the cleaning solution, and the like, and in the present embodiment, the height h of the narrow gap is 1 mm.
The shape of the lower half of the retainer ring 105 is not required and may be cylindrical. Of course, the entire retainer ring 105 may be integrally molded into an inverted truncated cone shape for ease of manufacturing.
In the glue coating process, the wafer 107 rotates at a high speed, the cleaning solution on the back surface of the wafer 107 is thrown away under the action of centrifugal force, and near the edge of the wafer 107, due to the reduction of the liquid speed, effective impact on contaminants such as photoresist cannot be formed, and part of chemical substances such as photoresist remains on the back surface of the wafer. The retaining ring 105 of the present embodiment can solve this problem, and the principle is:
1) when the photoresist is sprayed, the air exhaust pump 109 operates. As shown by the arrows in fig. 1, an air flow is formed in the chamber 101 from the top opening of the cup 103 to the air outlet 108 at the bottom of the chamber 101. The gas flow can guide the volatile chemical inside the chamber 101 to volatilize and then not flow to the back side of the wafer 107, thereby preventing the chemical from accumulating on the back side of the wafer 107.
Further, as shown in fig. 2, since the end surface 1051 at the top of the retaining ring 105 is inclined downward, a narrow passage inclined downward is formed between the end surface 1051 and the inner wall of the cup 103, and the downward air flow moves to the narrow passage at a high speed, a circle of "wind wall" is formed to closely adhere to the outer periphery of the wafer 107 and the end surface 1051, so that the photoresist on the front surface of the wafer 107 is difficult to pass through the "wind wall" to reach the back surface of the wafer 107 or the inner wall of the retaining ring 105. The size requirement of the narrow passage is as follows: the gas flow is brought to a velocity sufficient to block the photoresist from passing through the "wind wall", typically on the order of millimeters or centimeters.
2) When the wafer 107 is rotated, the back side cleaning nozzle 104 sprays the cleaning liquid onto the back side of the wafer 107, and the cleaning liquid flies out or flows out from between the retainer ring 105 and the wafer 107, and the gap between the retainer ring 105 and the wafer 107 is small, so that the cleaning liquid can fly out from the gap uniformly over the entire gap. As a result, the cleaning solution may form a ring of "liquid barrier" through which photoresist or other chemicals are difficult to penetrate to contaminate the backside of the wafer 107 or the interior of the retaining ring 105.
Example 2
As shown in fig. 4, this embodiment is a process chamber of a coater for preventing photoresist from contaminating the backside of a wafer. Different from embodiment 1, the bottom of the chamber 101 is provided with two or more air outlets 1011 to improve uniformity of the air flow, and correspondingly, the air discharge channels 108 and the air discharge pumps 109 are also provided in the same number as the air outlets 1011, and the air flow flows downward from the top of the cup 103 and flows out of the air outlets 1011, respectively.
The rest of the structure is the same as in example 1.
Example 3
As shown in fig. 5, this embodiment is a wafer coater, which includes all the structures of embodiment 1, and further includes a photoresist spraying assembly 1010 disposed above the wafer support 102, where the photoresist spraying assembly 1010 may include a rotating arm, a photoresist nozzle, and other components.
In summary, the present invention has been described in detail with reference to the above embodiments and the accompanying drawings, so that those skilled in the art can implement the invention. The above-described embodiments are intended to be illustrative, but not limiting, of the present invention, the scope of which is defined by the appended claims. Variations on the number of elements described herein or substitutions of equivalent elements are intended to be within the scope of the present invention.
Claims (10)
1. A process chamber of a glue spreader, comprising:
the top of the cavity is open, and the bottom of the cavity is provided with an exhaust mechanism;
a wafer support disposed in the cavity, the wafer support configured to support a wafer;
the cup cover is covered at the top of the cavity, and the top of the cup cover is open;
the back cleaning nozzle is arranged below the wafer; and
the upper half part of the retainer ring is in an inverted truncated cone shape, the end face at the top of the retainer ring inclines downwards, the outer diameter of the end face is larger than the diameter of the wafer, a narrow gap exists between the end face and the back face of the wafer, and a narrow passage which inclines downwards is formed between the end face and the inner wall of the cup cover;
in the gluing process, the back cleaning nozzle sprays cleaning liquid to the back of the wafer and flies out or flows out from the narrow gap, the air exhaust mechanism runs, and air flow enters from the top of the cup cover and is exhausted by the air exhaust mechanism after passing through the narrow channel.
2. The process chamber of claim 1, wherein an inner diameter of the end surface of the top of the retaining ring is less than or equal to a diameter of the wafer.
3. The process chamber as claimed in claim 1, wherein the exhaust mechanism comprises an exhaust outlet arranged at the bottom of the chamber body, and an exhaust channel and an exhaust pump connected with the exhaust outlet.
4. The process chamber as claimed in claim 1, wherein there are more than two of the exhaust mechanisms.
5. The process chamber as claimed in claim 1, wherein the retainer ring is integrally formed of teflon.
6. The process chamber as claimed in claim 1, wherein the height of the gap between the top of the retainer ring and the back surface of the wafer is 0.5mm to 10 mm.
7. The chamber of claim 1, wherein a rotary actuator is coupled to a bottom of the wafer support.
8. The process chamber as claimed in claim 7, wherein a pedestal is provided at the bottom of the chamber body, the wafer support is located above the pedestal, and the rotary actuator is connected to the wafer support through a rotary shaft, and a lower half portion of the rotary shaft is accommodated in the pedestal.
9. The process chamber of claim 8, wherein a bottom of the baffle is coupled to an upper surface of the base.
10. A coater comprising a process chamber according to any of claims 1 to 9 and a photoresist dispensing assembly disposed above the wafer support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011537079.3A CN114653503A (en) | 2020-12-23 | 2020-12-23 | Glue spreader and process chamber thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011537079.3A CN114653503A (en) | 2020-12-23 | 2020-12-23 | Glue spreader and process chamber thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114653503A true CN114653503A (en) | 2022-06-24 |
Family
ID=82024187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011537079.3A Pending CN114653503A (en) | 2020-12-23 | 2020-12-23 | Glue spreader and process chamber thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114653503A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114950869A (en) * | 2022-07-15 | 2022-08-30 | 上海图双精密装备有限公司 | Gluing machine convenient to operate and operation method thereof |
-
2020
- 2020-12-23 CN CN202011537079.3A patent/CN114653503A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114950869A (en) * | 2022-07-15 | 2022-08-30 | 上海图双精密装备有限公司 | Gluing machine convenient to operate and operation method thereof |
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