CN114613584A - Etching method for soft magnetic material and soft magnetic strip - Google Patents
Etching method for soft magnetic material and soft magnetic strip Download PDFInfo
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- CN114613584A CN114613584A CN202210272569.8A CN202210272569A CN114613584A CN 114613584 A CN114613584 A CN 114613584A CN 202210272569 A CN202210272569 A CN 202210272569A CN 114613584 A CN114613584 A CN 114613584A
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- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
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- H01F1/14708—Fe-Ni based alloys
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Abstract
The invention provides a soft magnetic material and a soft magnetic strip etching method, belongs to the field of soft magnetic material etching, and overcomes the defect of poor etching precision of the soft magnetic strip in the prior art. The etching method of the soft magnetic material comprises the following steps: s1, coating photoresist on the soft magnetic material, and carrying out exposure and development; s2, repeatedly and alternately carrying out soaking treatment and cleaning treatment on the soft magnetic material obtained in the step S1 in the etching solution until the soft magnetic material reaches the etching depth; and S3, removing the photoresist.
Description
Technical Field
The invention belongs to the field of etching of soft magnetic materials, and particularly relates to an etching method of a soft magnetic material and a soft magnetic strip.
Background
The soft magnetic material is easy to magnetize and demagnetize, has extremely high maximum magnetic flux density and magnetic permeability and extremely low coercive force, is mainly applied to the field of high-frequency magnetic conduction, such as transformers, inductance coils, generators and the like, and is developed towards high precision and fine structures by virtue of local magnetic field regulation of the soft magnetic material due to high requirements of the electronic industry and the information industry on microelectronic devices in recent years. However, the current etching and forming means for the soft magnetic strip is deficient, and the development of local magnetic field regulation and control in microelectronic devices and other chips is limited.
At present, the amorphous soft magnetic strip is mainly used for magnetic shielding of a circuit board, few processes for forming microstructures of the amorphous soft magnetic strip are available, and extension designs such as magnetic field regulation and control are not provided for forming results.
The electroplated metal sheet preparation method proposed by the patent of 'metal sheet with patterns and manufacturing method thereof' (Chinese patent, application number: 200410078760.0) has complex operation process and small forming depth, can be applied to trademark surface layer decoration, but cannot be applied to industrialized fine structure forming of soft magnetic amorphous metal. If the soft magnetic strip is etched by a wet method, bubbles or other products can be generated in the process to interfere with the subsequent etching effect, so that the etching is uneven and the etching precision is poor. The technology based on the soft magnetic strip microstructure forming is still insufficient, and a simple and convenient soft magnetic strip forming means with high etching precision is still needed at present.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defect of poor etching precision of the soft magnetic strip material in the prior art, thereby providing a soft magnetic material and an etching method of the soft magnetic strip material. The etching resolution ratio of the invention can reach 30 microns, technical support can be provided for the soft magnetic amorphous strip microstructure forming process, the effect of local magnetic field focusing can be realized by utilizing the effect of the ultrahigh magnetic conductivity of the soft magnetic strip, the patterning design of a magnetic field can be realized, the magnetic field control can be realized under the high-precision condition by the soft magnetic strip micro-nano scale etching forming, and the invention has important significance for future microstructure magnetic field control.
Therefore, the invention provides the following technical scheme.
In one aspect, the invention provides an etching method of a soft magnetic material, which comprises the following steps:
s1, coating photoresist on the soft magnetic material, and carrying out exposure and development;
s2, repeatedly and alternately carrying out soaking treatment and cleaning treatment on the soft magnetic material obtained in the step S1 until the soft magnetic material reaches the etching depth;
and S3, removing the photoresist.
Further, in the step S2, each soaking treatment is soaking in the etching solution for 2-3 seconds, and/or
The cleaning treatment is carried out by flushing with water.
Further, the step S1 of coating a photoresist on the soft magnetic material includes: firstly, arranging a tackifier on a soft magnetic material, spin-coating and drying, then spin-coating photoresist, and drying.
In S1, coating a photoresist on the soft magnetic material, specifically: dropwise adding a tackifier on a soft magnetic material, setting a spin coater to operate for 10-12 s at the rotating speed of 300-350 rpm, then operating for 18-22 s at the rotating speed of 3000-3200 rpm, and after the spin coating is finished, putting the obtained whole structure into an oven to bake for 120-150 s at the temperature of 93-95 ℃; and dropwise adding photoresist on the surface of the soft magnetic material, operating the spin coater at the rotating speed of 500-550 rpm for 8-12 s, operating at the rotating speed of 2000-2200 rpm for 30-35 s, and baking at the temperature of 93-95 ℃ for 90-100 s.
In S1, the exposure and development are specifically: the Cr mask plate is sucked by a gas pump on a photoetching machine, the photoresist is exposed by ultraviolet light, and the deposition energy is 135-160 mJ/cm2The exposure time is 10-20 s; developing for 30-35 s by the developer.
Further, at least one of conditions a or B is satisfied:
A. hydrogen chloride in the etching solution: hydrogen peroxide: the water mass ratio is (0.8-1.2): (3.5-5.5): (20-25);
B. the soft magnetic material is a high permeability alloy comprising at least one of iron, cobalt and nickel elements, preferably 1J46, VAC17 or Metglas 2714A.
On the other hand, the invention also provides an etching method of the soft magnetic strip, wherein the soft magnetic strip is attached to the first substrate, and then the etching method of the soft magnetic material is adopted for etching;
preferably, the photoresist is removed when the etched region is completely transparent to light, and more preferably, the soaking process and the cleaning process are repeated for 100 to 130 times alternately. Excessive soaking and rinsing times can result in laterally expanding etching of the soft magnetic ribbon, thereby affecting the etching accuracy.
Further, attaching the soft magnetic ribbon to the first substrate includes:
(1) coating a first adhesive on the upper surface of the first substrate to obtain a first substrate-first adhesive two-layer structure;
(2) arranging a second adhesive on the side surface of the second substrate, and adhering the part of the soft magnetic strip which exceeds the upper surface of the second substrate after being tightened to the side surface of the second substrate;
(3) pressing the structure obtained in (1) and the structure obtained in (2), wherein the soft magnetic strip is in contact with the first adhesive;
(4) and stripping the second substrate to obtain the soft magnetic strip attached to the first substrate.
Coating a first bonding agent on the upper surface of a first substrate, and specifically comprising: cleaning the surface of a first substrate, then placing the first substrate on a spin coater platform, dripping a first binder into the center of the upper surface of the first substrate, setting the spin coater to operate at 700-850 rpm for 10-12 s, then operating at 4500-5000 rpm for 15-20 s, and taking out the first substrate to obtain a first substrate-first adhesive bonding two-layer structure. Preferably, about 5 to 8ml, and the first adhesive may be epoxy resin of EA M-31CL, EA 1C-LV, 3M DP110, etc.
Further, in the step (2), a metal foil is arranged between the second substrate and the soft magnetic strip, and the method comprises the following steps:
after a second adhesive is arranged on the side surface of the second substrate, covering the upper surface of the second substrate with a metal foil, tightening the metal foil, and adhering the part of the metal foil, which exceeds the upper surface of the second substrate, to the side surface of the second substrate to obtain a second substrate semi-coated with the metal foil;
then covering the upper surface of the metal foil with the soft magnetic strip, and adhering the part of the soft magnetic strip, which exceeds the upper surface of the metal foil, to the side surface of the second substrate to obtain a three-layer structure of the second substrate, the metal foil and the soft magnetic strip;
preferably, the metal foil is an aluminum foil, a silver foil or a copper foil.
Specifically, in the three-layer structure of the second substrate, the metal foil and the soft magnetic strip, the second substrate and the metal foil are only bonded at the side position of the second substrate through the adhesive, the metal foil and the soft magnetic strip are only bonded at the side position of the second substrate through the adhesive, and no adhesive is arranged on the upper surfaces of the second substrate and the metal foil.
Further, in the step (4), the second substrate is peeled off, and then the metal foil is peeled off.
The method specifically comprises the following steps: removing the adhesive between the second substrate and the metal foil to obtain the soft magnetic strip and the metal foil attached to the first substrate; and cutting off the metal foil and the soft magnetic strip which exceed the first substrate, and slowly stripping the metal foil to obtain the soft magnetic strip attached to the first substrate. The metal foil is softer and is more easily peeled off after the second substrate is removed.
Further, at least one of the conditions a-D is satisfied:
A. the thickness of the soft magnetic strip is 10-50 mu m;
B. the thickness of the second substrate is 1-1.5 cm;
C. the thickness of the first substrate is 100-200 μm;
D. the pressing pressure is 1200-1600 Pa, and the pressing time is 9-12 h.
Further, the first substrate and the second substrate also comprise surface cleaning before the adhesive is arranged;
preferably, the surface cleaning comprises rinsing one surface of the first substrate or the second substrate with acetone and isopropanol, followed by blow-drying the surface with nitrogen; more preferably, the surface cleaning process is operated in a vacuum operated cabinet.
Preferably, the water used in the rinsing process is deionized water.
When the soft magnetic strip is subjected to wet etching, the etching rates of different positions are different, so that in the etching process, when a part of the positions are found to be etched completely, the soaking etching process needs to be suspended, and a dropper is used for etching the un-etched positions in a targeted manner.
The technical scheme of the invention has the following advantages:
1. the etching method of the soft magnetic material provided by the invention comprises the following steps: s1, coating photoresist on the soft magnetic material, and carrying out exposure and development; s2, repeatedly and alternately carrying out soaking treatment and cleaning treatment on the soft magnetic material obtained in the step S1 in the etching solution until the soft magnetic material reaches the etching depth; and S3, removing the photoresist.
The soft magnetic material is etched by a conventional wet method, bubbles or other products can be generated in the process to interfere with the subsequent etching effect, so that the etching is uneven and the etching precision is poor. According to the invention, the soft magnetic material is soaked and cleaned in the etching solution repeatedly and alternately for many times, and bubbles and/or other products generated by the soft magnetic material are removed by cleaning after etching for a period of time, so that subsequent etching is prevented from being interfered, the etching precision is improved, and a better etching effect is obtained.
2. In the etching method of the soft magnetic material, in S2, the time of soaking treatment in the etching solution is 2-3S, and/or the cleaning treatment is carried out by washing with water. In the soaking and washing etching processes, a large amount of local bubbles can be generated in the soaking etching process, the bubbles can be attached to block partial metal and acid reaction, and the local solution concentration distribution is uneven, so that the soft magnetic material is etched unevenly. Therefore, the time for single soaking needs to be short, preferably 2-3 s, and each cleaning needs to ensure no acid residue, so that the etching process is stopped. In order to ensure uniform etching in the next round of soaking, no bubble remains after cleaning.
3. The invention provides an etching method of a soft magnetic material, wherein the step of coating photoresist on the soft magnetic material comprises the steps of dropwise adding a tackifier on the soft magnetic material, and after spin coating and drying, dropwise adding the photoresist, spin coating and drying. The tackifier ensures the bonding strength of the photoresist and the soft magnetic material, the function of the tackifier is improved in order to enable the tackifier to be better bonded with the soft magnetic strip through the first drying, and the bonding of the photoresist and the tackifier is directly enhanced through the second drying. The tackifier is arranged between the soft magnetic material and the photoresist, so that the adhesiveness of the photoresist can be enhanced, and the influence on the subsequent etching effect due to the insecure adhesion of the photoresist can be avoided.
4. The etching method of the soft magnetic strip, provided by the invention, comprises the following steps of: (1) coating a first adhesive on the upper surface of the first substrate to obtain a first substrate-first adhesive two-layer structure; (2) arranging a second adhesive on the side surface of the second substrate, and adhering the part of the soft magnetic strip which exceeds the upper surface of the second substrate after being tightened to the side surface of the second substrate; (3) pressing the structure obtained in (1) and the structure obtained in (2), wherein the soft magnetic strip is in contact with the first adhesive; (4) and stripping the second substrate to obtain the soft magnetic strip attached to the first substrate.
The conventional attaching means is difficult to guarantee that no bubble remains between soft magnetic strip and the first base, and if the bubble remains, subsequent etching precision can be influenced, and even only leave the microbubble when soft magnetic material attaches the first base, high-temperature baking also can lead to the soft magnetic material bottom to blister, paste insecurely, influence subsequent etching precision. In the process of attaching the soft magnetic strip to the first substrate, the soft magnetic strip is attached to the first substrate after being tightened on the second substrate by means of the second substrate with high flatness, so that no micro-bubbles are left in the process of combining the soft magnetic material and the first substrate. The pressing operation can ensure high adhesion of the soft magnetic strip to the first substrate. The soft magnetic strip attaching method can ensure that no bubbles remain at the bottom of the soft magnetic strip after attaching, the surface flatness of the soft magnetic strip is high, the side edge is not tilted, the perfect attaching effect can be ensured after photoetching and wet etching, and the etching precision is ensured.
5. The invention provides an etching method of a soft magnetic strip, in the step (2), a metal foil is arranged between a second substrate and the soft magnetic strip, and the etching method comprises the following steps: after a second adhesive is arranged on the side surface of the second substrate, covering the upper surface of the second substrate with a metal foil, tightening the metal foil, and adhering the part of the metal foil, which exceeds the upper surface of the second substrate, to the side surface of the second substrate to obtain a second substrate semi-coated with the metal foil; then covering the upper surface of the metal foil with the soft magnetic strip, and adhering the part of the soft magnetic strip, which exceeds the upper surface of the metal foil, to the side surface of the second substrate to obtain a three-layer structure of the second substrate, the metal foil and the soft magnetic strip; in the step (4), the second substrate is peeled off first, and then the metal foil is peeled off.
The metal foil is arranged between the second substrate and the soft magnetic strip, so that the metal foil and the soft magnetic strip are easier to peel, the peeling effect is good, and the phenomenon that the soft magnetic strip and the first substrate are weakened in adhesion to generate bubbles at the bottom of the soft magnetic strip in the peeling process of the metal foil can be avoided.
6. According to the etching method of the soft magnetic strip, the thickness of the second substrate is 1-1.5 cm. The second substrate with a certain thickness is adopted, so that the parts of the aluminum foil and the soft magnetic strip material, which exceed the second substrate, are attached to the side surface of the second substrate, and the phenomenon that the aluminum foil and the soft magnetic strip material are attached to the back surface of the second substrate to cause the whole unevenness is avoided.
7. According to the etching method of the soft magnetic strip, the surfaces of the first substrate and the second substrate are cleaned before the adhesive is arranged, so that clean surfaces are obtained, the surface flatness of the first substrate and the second substrate is guaranteed, and bubbles are prevented from being generated at the bottom of the soft magnetic strip.
8. According to the etching method of the soft magnetic strip, the tackifier is baked for 120-150 s at 93-95 ℃ after being coated in a spinning mode; and baking the photoresist at 93-95 ℃ for 90-100 s after the photoresist is spin-coated. The baking temperature can avoid the condition that the edge definition of photoresist distribution is influenced by obvious generation of dissolved air in the first binder (such as epoxy resin) at the bottom of the soft magnetic strip caused by overhigh temperature and poor drying effect caused by overlow temperature, so that the etching geometric morphology is not clear, and the etching precision is improved.
The method has the advantages of simple and convenient operation process and high etching efficiency, can adjust the parameters of the corrosion protection layer by changing the details of the photoetching process, can adjust the corrosion efficiency and the etching edge precision by changing the proportioning parameters of the etching liquid and the etching time, has high controllability and simple and convenient method, and solves the problem of difficult formation of the fine structure of the soft magnetic amorphous metal.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of the process for attaching the soft magnetic strip material in example 1 of the present invention;
FIG. 2 is a graph showing the result of attaching the soft magnetic tape strip in example 1 of the present invention;
FIG. 3 is a flowchart of the process of providing a protective layer on the soft magnetic ribbon in example 1 of the present invention;
FIG. 4 is a graph showing the etching effect of the soft magnetic ribbon after the etching is finished in example 1 of the present invention;
fig. 5 is a graph showing the etching effect of comparative example 1.
Reference numerals:
1-glass sheet, 2-EAM-31CL epoxy resin, 3-thick glass sheet, 4-aluminum foil and 5-soft magnetic strip; 6-HDMS tackifier, 7-S1813 photoresist, 8-mask plate and 9-ultraviolet light.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by manufacturers, and are all conventional reagent products which can be obtained commercially.
Example 1
A method for etching a soft magnetic strip, the soft magnetic strip of the embodiment is 1J46, and the method comprises the following steps:
(1) attachment of the soft magnetic strip 5, as shown in fig. 1:
A. a glass sheet 1 with a diameter of 4 inches and a thickness of 100 μm was taken, the same surface of the glass sheet 1 was rinsed with acetone and isopropanol, and the surface was blown dry with nitrogen to obtain a clean surface. The glass sheet 1 was placed on the spin coater platform with the clean surface facing upward and approximately 7ml of EAM-31CL epoxy 2 was dropped into the center. And setting a spin coater to operate at the rotating speed of 700rpm for 10s, then operating at the rotating speed of 4500rpm for 15s, and taking out the glass sheet 1 to obtain the glass sheet-epoxy resin two-layer structure.
B. Another thick glass sheet 3 with the diameter of 4 inches and the thickness of 1.5cm is taken, one surface of the thick glass sheet 3 is washed by acetone and isopropanol in sequence, and the surface is dried by nitrogen to obtain a clean surface. And adhering double-sided adhesive to the side surface of the thick glass sheet 3, covering the clean surface of the thick glass sheet 3 with the aluminum foil 4, tightening the aluminum foil 4, and adhering the part of the aluminum foil 4, which exceeds the clean surface of the thick glass sheet 3, to the side surface of the thick glass sheet 3 through the double-sided adhesive to obtain the thick glass sheet 3 structure with the aluminum foil 4 semi-coated.
And covering a layer of soft magnetic strip 5 on the upper surface of the thick glass sheet 3 structure which is half-coated by the aluminum foil 4: and (3) tightly covering the upper surface of the aluminum foil 4 with the soft magnetic strip 5, and adhering the part of the soft magnetic strip, which exceeds the clean surface of the thick glass sheet 3, to the side surface by using a double-sided adhesive to obtain a three-layer structure of the thick glass sheet, the aluminum foil and the soft magnetic strip.
C. B, laminating the glass sheet-epoxy resin two-layer structure obtained in the step A and the thick glass sheet-aluminum foil-soft magnetic strip three-layer structure obtained in the step B, so that the epoxy resin layer and the soft magnetic strip 5 are adhered to each other, thus obtaining a thick glass sheet-aluminum foil-soft magnetic strip-epoxy resin-glass sheet five-layer structure, and compacting the five-layer structure by using a C-shaped clamp, wherein the pressure intensity is about 1500Pa, and the laminating time is about 9 hours;
D. stripping the auxiliary structure: and D, placing the five-layer structure obtained in the step C on a table top, enabling the glass sheet 1 to be at the lowest layer, slowly stripping the double-sided adhesive tape between the aluminum foil 4 and the thick glass sheet 3, then cutting off the area of the aluminum foil 4 and the soft magnetic strip 5 exceeding the glass sheet 1, sequentially taking down the thick glass sheet 3 and the aluminum foil 4, and leaving the three-layer structure of the glass sheet-epoxy resin-soft magnetic strip. The surface was rinsed with acetone followed by ethanol to obtain soft magnetic ribbon 5 attached to glass sheet 1, as shown in fig. 2.
(2) And (3) attaching a protective layer on the surface of the soft magnetic strip 5, as shown in figure 3:
A. spin coating adhesion promoter: putting the glass sheet-epoxy resin-soft magnetic strip 5 structure obtained in the step (1) on a spin coater platform, enabling the soft magnetic strip 5 to face upwards, dripping 8ml of HDMS tackifier 6 on the soft magnetic strip 5, setting the spin coater to run at the rotating speed of 300rpm for 10s, then running at the rotating speed of 3000rpm for 20s, and after the spin coating is finished, putting the whole structure obtained in the step (1) into an oven to be baked at the temperature of 95 ℃ for 2 min.
B. Spin coating a photoresist: and putting the whole structure on a platform of a spin coater again to enable the surface of the soft magnetic strip 5 to face upwards, dripping 8ml of S1813 photoresist 7 on the soft magnetic strip 5, setting the spin coater to run at 500rpm for 10S, then at 2000rpm for 30S, and putting the whole structure obtained after the spin coating into an oven to bake at 95 ℃ for 1.5 min. It should be noted that, starting from the photoresist spin coating process, the subsequent process flow needs to be performed under the condition of protecting from light or yellow light.
C. Exposure and development: c, a Cr mask plate 8 is sucked by a gas pump on a photoetching machine, one side of the photoresist obtained in the step B is exposed by ultraviolet light 9, and the deposition energy is 150mJ/cm2The exposure time was 10 s. And developing for about 30s by using MF 312 developing solution after exposure is finished, and washing by using water to remove the developing solution to obtain a 4-layer structure of the glass sheet, the epoxy resin, the soft magnetic strip and the photoresist.
(3) The soft magnetic strip 5 is selectively etched by wet etching:
A. preparing an etching solution: according to the mass ratio of HCl to H2O2:H2H is added in sequence of 1:5:232O2And HCl are added into deionized water to prepare acid etching solution, and the acid etching solution is slowly and uniformly stirred by a glass rod.
B. And (3) placing the 4-layer structure of the glass sheet, the epoxy resin, the soft magnetic strip and the photoresist obtained in the step (2) in the etching solution prepared in the step (A) for soaking for 2-3 s, taking the structure out of the etching solution, cleaning the structure by using deionized water until no residual bubbles exist on the surface of the structure, repeating the etching process for 120 times, and etching the soft magnetic strip thoroughly. And then, dripping a small amount of etching liquid by a dropper on the part, which is not completely etched, of the soft magnetic strip 5, cleaning the soft magnetic strip by deionized water after 2-3 s, repeating the steps for multiple times to completely etch the soft magnetic strip 5, and finally washing the soft magnetic strip by water.
(4) Removing the photoresist:
and (3) immersing the structure obtained in the step (3) into an AZ 400T stripping agent for 1min, clamping the surface photoresist protective layer by using forceps, washing the surface of the soft magnetic strip 5 by using acetone and isopropanol in sequence, and drying the surface by using nitrogen, so that a clean soft magnetic strip 5 etching structure is obtained on the glass sheet 1, as shown in figure 4.
Example 2
A method for etching a soft magnetic strip, the soft magnetic strip of the embodiment is 1J46, and the method comprises the following steps:
(1) attachment of soft magnetic strip
A. A glass sheet 1 having a diameter of 4 inches and a thickness of 100 μm was taken, one surface of the glass sheet 1 was washed with acetone and isopropyl alcohol in this order, and the surface was dried with nitrogen gas to obtain a clean surface. The glass sheet 1 was placed on the spin coater platform with the clean surface facing upward and approximately 7ml of EAM-31CL epoxy 2 was dropped into the center. And setting a spin coater to operate at the rotating speed of 700rpm for 12s, then operating at the rotating speed of 4500rpm for 13s, and taking out the glass sheet 1 to obtain the glass sheet-epoxy resin two-layer structure.
B. Another thick glass sheet 3 with the diameter of 4 inches and the thickness of 1cm is taken, one surface of the thick glass sheet 3 is washed by acetone and isopropanol in sequence, and the surface is dried by nitrogen to obtain a clean surface. And adhering double-sided adhesive to the side surface of the thick glass sheet 3, covering the clean surface of the thick glass sheet 3 with the aluminum foil 4, tightening the aluminum foil 4, and adhering the part of the aluminum foil 4, which exceeds the clean surface of the thick glass sheet 3, to the side surface of the thick glass sheet 3 through the double-sided adhesive to obtain the thick glass sheet 3 structure with the aluminum foil 4 semi-coated.
And covering a layer of soft magnetic strip 5 on the upper surface of the thick glass sheet 3 structure which is half-coated by the aluminum foil 4: and tightly covering the soft magnetic strip 5 on the upper surface of the aluminum foil 4, and adhering the part of the soft magnetic strip exceeding the clean surface of the thick glass sheet 3 to the side surface by using double-sided adhesive to obtain a three-layer structure of the thick glass sheet-aluminum foil-soft magnetic strip.
C. B, laminating the glass sheet-epoxy resin two-layer structure obtained in the step A and the thick glass sheet-aluminum foil-soft magnetic strip three-layer structure obtained in the step B, so that the epoxy resin layer and the soft magnetic strip 5 are adhered to each other, thus obtaining a thick glass sheet-aluminum foil-soft magnetic strip-epoxy resin-glass sheet five-layer structure, and compacting the five-layer structure by using a C-shaped clamp, wherein the pre-tightening pressure is about 1200Pa, and the compacting time is about 9 hours;
D. stripping the auxiliary structure: and D, placing the five-layer structure obtained in the step C on a table top, enabling the glass sheet 1 to be at the lowest layer, slowly stripping the double-sided adhesive tape between the soft magnetic strip 5 and the aluminum foil 4, then stripping the double-sided adhesive tape between the aluminum foil 4 and the thick glass sheet 3, and successively taking down the thick glass sheet 3 and the aluminum foil 4 to leave a three-layer structure of the glass sheet-epoxy resin-soft magnetic tape 5. The surface was rinsed with acetone, ethanol, and then, a soft magnetic ribbon 5 attached to the glass sheet 1 was obtained.
(2) And (3) adhering a protective layer on the surface of the soft magnetic strip 5:
A. spin coating adhesion promoter: putting the glass sheet-epoxy resin-soft magnetic strip 5 structure obtained in the step (1) on a spin coater platform, enabling the soft magnetic strip 5 to face upwards, dripping 8ml of HDMS tackifier 6 on the soft magnetic strip 5, setting the spin coater to run at 350rpm for 12s, then running at 3200rpm for 22s, and putting the whole structure obtained after spin coating into an oven to bake at 93 ℃ for 2.5 min.
B. Spin coating a photoresist: and putting the whole structure on a platform of a spin coater again to enable the soft magnetic strip 5 to face upwards, dripping 8ml of S1813 photoresist 7 on the soft magnetic strip 5, setting the spin coater to run at 550rpm for 12S, then at 2200rpm for 35S, and putting the whole structure obtained after the spin coating into an oven to bake at 95 ℃ for 100S. It should be noted that, starting from the photoresist spin coating process, the subsequent process flow needs to be performed under the condition of protecting from light or yellow light.
C. Exposure and development: c, a Cr mask plate 8 is sucked by a gas pump on a photoetching machine, one side of the photoresist obtained in the step B is exposed by ultraviolet light 9, and the deposition energy is 135mJ/cm2The exposure time was 15 s. And developing for about 30s by using MF 312 developing solution after exposure is finished, and washing by using water to remove the developing solution to obtain a glass sheet-epoxy resin-soft magnetic strip 5-photoresist 4-layer structure.
(3) The soft magnetic strip 5 is selectively etched by wet etching:
A. preparing an etching solution: according to the mass ratio of HCl to H2O2:H2H is sequentially substituted by 0.8:5.5:222O2And HCl are added into deionized water to prepare acid etching solution, and the acid etching solution is slowly and uniformly stirred by a glass rod.
B. And (3) preparing the 4-layer structure of the glass sheet, the epoxy resin, the soft magnetic strip and the photoresist obtained in the step (2) into an etching solution, soaking for 2-3 s, taking the structure out of the etching solution, cleaning the structure by using deionized water until no residual bubbles exist on the surface of the structure, repeating the etching process for 120 times, and etching the soft magnetic strip thoroughly. And then, dripping a small amount of etching liquid by a dropper on the part, which is not completely etched, of the soft magnetic strip, cleaning the soft magnetic strip by deionized water after 2-3 s, repeating the steps for multiple times to completely etch the soft magnetic strip 5, and finally washing the soft magnetic strip by water.
(4) Removing the photoresist:
and (4) immersing the structure obtained in the step (3) into an AZ 400T stripping agent for 70s, clamping the surface photoresist protective layer out by using tweezers when the surface photoresist protective layer disappears, washing the surface of the soft magnetic strip 5 by using acetone and isopropanol in sequence, and drying the surface of the soft magnetic strip 5 by using nitrogen, thereby obtaining a clean etched structure of the soft magnetic strip 5 on the glass sheet 1.
Example 3
A method for etching a soft magnetic strip, the soft magnetic strip of the embodiment is VAC17, and the method comprises the following steps:
(1) attachment of soft magnetic strip 5
A. A glass sheet 1 having a diameter of 4 inches and a thickness of 100 μm was taken, one surface of the glass sheet 1 was washed with acetone and isopropyl alcohol in this order, and the surface was dried with nitrogen gas to obtain a clean surface. The glass sheet 1 was placed on the spin coater platform with the clean surface facing upward and approximately 7ml of EAM-31CL epoxy 2 was dropped into the center. And setting a spin coater to operate at the rotating speed of 700rpm for 12s, then operating at the rotating speed of 4500rpm for 13s, and taking out the glass sheet 1 to obtain the glass sheet-epoxy resin two-layer structure.
B. Another thick glass sheet 3 with the diameter of 4 inches and the thickness of 1cm is taken, one surface of the thick glass sheet 3 is washed by acetone and isopropanol in sequence, and the surface is dried by nitrogen to obtain a clean surface. And adhering double-sided adhesive to the side surface of the thick glass sheet 3, covering the clean surface of the thick glass sheet 3 with the aluminum foil 4, tightening the aluminum foil 4, and adhering the part of the aluminum foil 4, which exceeds the clean surface of the thick glass sheet 3, to the side surface of the thick glass sheet 3 through the double-sided adhesive to obtain the thick glass sheet 3 structure with the aluminum foil 4 semi-coated.
And covering a layer of soft magnetic strip 5 on the upper surface of the structure of the thick glass sheet 3 which is half-coated by the aluminum foil 4: and tightly covering the soft magnetic strip 5 on the upper surface of the aluminum foil 4, and adhering the part of the soft magnetic strip exceeding the clean surface of the thick glass sheet 3 to the side surface by using double-sided adhesive to obtain a three-layer structure of the thick glass sheet-aluminum foil-soft magnetic strip.
C. B, laminating the glass sheet-epoxy resin two-layer structure obtained in the step A and the thick glass sheet-aluminum foil-soft magnetic strip three-layer structure obtained in the step B, so that the epoxy resin layer and the soft magnetic strip 5 are adhered to each other, thus obtaining a thick glass sheet-aluminum foil-soft magnetic strip-epoxy resin-glass sheet five-layer structure, and compacting the five-layer structure by using a C-shaped clamp, wherein the pre-tightening pressure is about 1600Pa, and the compacting time is about 9 hours;
D. stripping the auxiliary structure: and D, placing the five-layer structure obtained in the step C on a table top, enabling the glass sheet 1 to be at the lowest layer, slowly stripping the double-sided adhesive tape between the soft magnetic strip 5 and the aluminum foil 4, then stripping the double-sided adhesive tape between the aluminum foil 4 and the thick glass sheet 3, and successively taking down the thick glass sheet 3 and the aluminum foil 4 to leave the three-layer structure of the glass sheet-epoxy resin-soft magnetic strip. The surface was rinsed with acetone, ethanol, and then, a soft magnetic ribbon 5 attached to the glass sheet 1 was obtained.
(2) And (3) adhering a protective layer on the surface of the soft magnetic strip 5:
A. spin coating of adhesion promoter: putting the glass sheet-epoxy resin-soft magnetic strip structure obtained in the step (1) on a spin coater platform, enabling the soft magnetic strip 5 to face upwards, dripping 8ml of HDMS tackifier 6 on the soft magnetic strip 5, setting the spin coater to run at 350rpm for 12s, then running at 2800rpm for 18s, and after the spin coating is finished, putting the whole structure obtained in the step (1) into an oven to bake for 2.5min at 93 ℃.
B. Spin coating a photoresist: and putting the whole structure on a platform of a spin coater again to enable the surface of the soft magnetic strip 5 to face upwards, dripping 8ml of S1813 photoresist 7 on the soft magnetic strip 5, setting the spin coater to run at 500rpm for 8S, then running at 2000rpm for 30S, and putting the whole structure obtained after the spin coating into an oven to bake at 93 ℃ for 1.5 min. It should be noted that, starting from the photoresist spin coating process, the subsequent process flow needs to be performed under the condition of protecting from light or yellow light.
C. Exposure and development: c, on a photoetching machine, a Cr mask plate 8 is sucked by a gas pump, one side of the photoresist obtained in the step B is exposed by ultraviolet light 9, and the deposition energy is 160mJ/cm2The exposure time was 20 s. And developing for about 35 seconds by using MF 312 developing solution after exposure is finished, and washing by using water to remove the developing solution to obtain a 4-layer structure of the glass sheet, the epoxy resin, the soft magnetic strip and the photoresist.
(3) The soft magnetic strip 5 is selectively etched by wet etching:
A. preparing an etching solution: according to the mass ratio of HCl to H2O2:H2H is added after 1.2:4.5:232O2And HCl are added into deionized water to prepare acid etching solution, and the acid etching solution is slowly and uniformly stirred by a glass rod.
B. And (3) preparing the 4-layer structure of the glass sheet, the epoxy resin, the soft magnetic strip and the photoresist obtained in the step (2) into an etching solution, soaking for 2-3 s, taking the structure out of the etching solution, cleaning the structure by using deionized water until no residual bubbles exist on the surface of the structure, repeating the etching process for 120 times, and etching the soft magnetic strip thoroughly. And dripping a small amount of etching liquid by using a dropper on the part, which is not completely etched, of the soft magnetic strip 5, cleaning the soft magnetic strip 5 by using deionized water after 2-3 s, repeating the steps for multiple times to completely etch the soft magnetic strip 5, and finally washing the soft magnetic strip by using water.
(4) Removing the photoresist:
and (3) immersing the structure obtained in the step (3) into an AZ 400T stripping agent for 1min, clamping the surface photoresist protective layer by using forceps, washing the surface of the soft magnetic strip 5 by using acetone and isopropanol in sequence, and drying the surface by using nitrogen, thereby obtaining a clean soft magnetic strip 5 etching structure on the glass sheet 1.
Comparative example 1
The comparative example provides an etching method of a soft magnetic strip, the operation steps are basically the same as those of the example 1, and the difference is that the wet etching method of the comparative example comprises the following steps: and soaking the soft magnetic strip in the etching solution for 3min, taking out and cleaning the soft magnetic strip 5 after the soft magnetic strip is etched completely, wherein the etching result is shown in figure 5.
As can be seen from fig. 5, the soft magnetic strip 5 is directly immersed in the etching solution for one time until the etching solution is completely etched, and the soft magnetic strip 5 is laterally etched during the etching process due to the direct immersion, so that the portion protected by the photoresist is also etched, the etching is extremely uneven, the precision is very poor, the required microstructure cannot be obtained, and the method cannot be applied to subsequent magnetic field regulation.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (10)
1. The etching method of the soft magnetic material is characterized by comprising the following steps of:
s1, coating photoresist on the soft magnetic material, and carrying out exposure and development;
s2, repeatedly and alternately carrying out soaking treatment and cleaning treatment on the soft magnetic material obtained in the step S1 until the soft magnetic material reaches the etching depth;
and S3, removing the photoresist.
2. The etching method of the soft magnetic material according to claim 1, wherein in the step S2, each soaking treatment is soaking in the etching solution for 2-3S, and/or
The cleaning treatment is carried out by flushing with water.
3. The etching method of the soft magnetic material according to claim 1 or 2, wherein the coating of the photoresist on the soft magnetic material in S1 includes: firstly, arranging a tackifier on a soft magnetic material, spin-coating and drying, then spin-coating a photoresist, and drying.
4. A method for etching a soft magnetic material according to any one of claims 1 to 3, wherein at least one of conditions a or B is satisfied:
A. hydrogen chloride in etching liquid used for immersion treatment: hydrogen peroxide: the mass ratio of water is (0.8-1.2): (3.5-5.5): (20-25);
B. the soft magnetic material is a high permeability alloy comprising at least one of iron, cobalt and nickel elements, preferably 1J46, VAC17 or Metglas 2714A.
5. A method for etching a soft magnetic strip is characterized in that the soft magnetic strip is attached to a first substrate and then etched by the method for etching the soft magnetic material according to any one of claims 1 to 4;
preferably, the photoresist is removed when the etched region is completely transparent to light, and more preferably, the soaking process and the cleaning process are repeated for 100 to 130 times alternately.
6. The method of etching a soft magnetic tape according to claim 5, wherein attaching the soft magnetic tape to the first substrate comprises:
(1) coating a first adhesive on the upper surface of the first substrate to obtain a first substrate-first adhesive two-layer structure;
(2) arranging a second adhesive on the side surface of the second substrate, and adhering the part of the soft magnetic strip which exceeds the upper surface of the second substrate after being tightened to the side surface of the second substrate;
(3) pressing the structure obtained in (1) and the structure obtained in (2), wherein the soft magnetic strip is in contact with the first adhesive;
(4) and stripping the second substrate to obtain the soft magnetic strip attached to the first substrate.
7. The etching method of the soft magnetic strip according to claim 6, wherein in the step (2), a metal foil is disposed between the second substrate and the soft magnetic strip, comprising the steps of:
after a second adhesive is arranged on the side surface of the second substrate, covering the upper surface of the second substrate with a metal foil, tightening the metal foil, and adhering the part of the metal foil, which exceeds the upper surface of the second substrate, to the side surface of the second substrate to obtain a second substrate semi-coated with the metal foil;
then covering the upper surface of the metal foil with the soft magnetic strip, and adhering the part of the soft magnetic strip, which exceeds the upper surface of the metal foil, to the side surface of the second substrate to obtain a three-layer structure of the second substrate, the metal foil and the soft magnetic strip;
preferably, the metal foil is an aluminum foil, a silver foil or a copper foil.
8. The etching method of soft magnetic strip according to claim 7, wherein in the step (4), the second substrate is peeled off first, and then the metal foil is peeled off.
9. A method of lithography of a soft magnetic strip according to claim 8, characterized in that at least one of the conditions A-D is fulfilled:
A. the thickness of the soft magnetic strip is 10-50 mu m;
B. the thickness of the second substrate is 1-1.5 cm;
C. the thickness of the first substrate is 100-200 μm;
D. the pressing pressure is 1200-1600 Pa, and the pressing time is 9-12 h;
E. after the spin coating of the tackifier is finished, baking the tackifier at the temperature of 93-95 ℃ for 120-150 s; and baking the photoresist at the temperature of 93-95 ℃ for 90-100 s after the photoresist is spin-coated.
10. A method for etching a soft magnetic ribbon according to any of claims 6 to 9, wherein the first and second substrates further comprise surface cleaning before the adhesive is provided;
preferably, the surface cleaning comprises rinsing the surface of the first substrate or the second substrate with acetone and isopropanol in sequence, and blow-drying the surface with nitrogen; more preferably, the surface cleaning process is operated in a vacuum operated cabinet.
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