CN114551694A - Display device - Google Patents
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- CN114551694A CN114551694A CN202111333184.XA CN202111333184A CN114551694A CN 114551694 A CN114551694 A CN 114551694A CN 202111333184 A CN202111333184 A CN 202111333184A CN 114551694 A CN114551694 A CN 114551694A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention aims to obtain a display device which is not felt when an LED device does not emit light, has excellent display effect when the LED device emits light and has excellent design and flexibility. Specifically, the display device includes: an LED device including a plurality of LED elements soldered to one surface side of a flexible base material; and a porous material that covers at least a part of the LED arrangement surface side of the LED device.
Description
Technical Field
The present invention relates to a display device including a flexible LED device and a porous material covering at least a part of an LED arrangement surface side of the LED device.
Background
LED display devices such as dot matrix display devices, which display information such as arbitrary characters, symbols, and patterns by selectively emitting light from LED elements, have rapidly become widespread.
In the conventional LED display device, a device in which an LED element is mounted on a hard substrate having substantially no flexibility is widely used. However, since the LED display device has a low degree of freedom in design, its application and the like are limited.
As an example of a flexible LED display device that can be deformed into a desired shape, there are known devices disclosed in patent documents 1 and 2.
The LED display devices described in these patent documents have excellent display effects when the LED elements emit light. However, since the presence of the LED element is also obvious when the LED element does not emit light, improvement in design is desired.
Patent document
Patent document 1: japanese patent No. 6738057
Patent document 1: japanese patent laid-open publication No. 2017-157837
Disclosure of Invention
The present invention is to provide a display device which is not perceived to exist when an LED device does not emit light, has an excellent display effect when the LED device emits light, and has excellent design and flexibility.
The present inventors have conducted intensive studies to solve the above problems, and have found that the above problems can be solved by adopting the following configuration, and have completed the present invention.
The details are as follows.
Item 1: a display device is characterized by comprising: an LED device including a plurality of LED elements soldered to one surface side of a flexible base material; and a porous material that covers at least a part of the LED arrangement surface side of the LED device.
Item 2: the display device according to item 1, wherein the LED device includes: a circuit provided on one surface side of the flexible base material; a circuit-side terminal provided in the circuit; and an LED element soldered to the circuit-side terminal by electromagnetic induction heating.
Item 3: the display device according to item 1, wherein the LED device includes: a circuit provided on one surface side of the flexible base material; a circuit-side terminal provided in the circuit; a conductive pad provided at a position corresponding to the circuit-side terminal on the other surface side of the flexible base material; and an LED element soldered to the circuit-side terminal by electromagnetic induction heating.
Item 4: the display device according to item 2 or 3, wherein,
the LED device satisfies at least 1 or more of the following main conditions (1) to (8),
(1) the thickness of the flexible base material is 0.001 mm-5.0 mm,
(2) the number of the LED elements is 1/100 cm2About 4000/100 cm2,
(3) The electrical circuit is formed by printing of a conductive ink,
(4) the circuit is formed by electroplating after forming the plating resist,
(5) the circuit is formed by electroplating the electroplating seed layer after printing
(6) The width of the circuit is 0.01 mm-3.0 mm,
(7) the thickness of the circuit is 0.001 mm-0.3 mm,
(8) the LED device may be wound on a cylinder having a diameter of 1cm or more.
Item 5: the display device according to any 1 of items 1 to 4, wherein the porous material has an open area ratio of 3 to 80% and a visible light transmittance of 5% or more.
Item 6: the display device according to any 1 of items 1 to 5, wherein 2 or more sheets are provided on at least a part of the end portion of the flexible base material with: a plurality of LED elements soldered to one surface side of the flexible base material; and a connecting portion that fits at least a part of the plurality of LED elements, wherein the LED device is formed by fitting the connecting portion to the LED elements and joining the 2 or more sheets.
Item 7: the display device according to any one of items 1 to 6, wherein the LED device and the porous material are bonded by a double-sided adhesive sheet having recesses or holes corresponding to at least a part of the plurality of LED elements soldered to one surface side of the flexible base material.
According to the present invention, a display device which is excellent in design and flexibility and which does not sense the presence of an LED device when the LED device is not emitting light and has an excellent display effect when the LED device is emitting light can be provided.
Since the display device of the present invention does not sense the presence of the LED device when the LED device is not emitting light, the design of the display device can be improved without impairing the beauty of a building and the view in the street. Further, since the sheet is excellent in flexibility, it can be wound around a pole for a traffic sign or a street tree, or can be provided on a curtain or a banner. Further, since the display device can be used as it is at any time and its presence is not sensed when it is not used as a display device, it can be harmonized with the landscape.
Drawings
Fig. 1 is a schematic configuration diagram of a display device according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional configuration diagram of the display device of fig. 1.
Fig. 3 is a schematic configuration diagram of a display device according to another embodiment of the present invention.
Fig. 4 is a schematic cross-sectional configuration view of the display device of fig. 3.
Fig. 5 is a schematic configuration diagram of a display device according to embodiment 3 of the present invention.
Fig. 6 is a schematic configuration development view of the display device of fig. 5.
Fig. 7 is a schematic cross-sectional configuration view of the display device of fig. 5.
Description of the symbols
A D-display device; an L-LED device; la-1 st LED device; lb-2 nd LED device; 1-a porous material; 2-a flexible substrate; 21-circuit side terminal; 22-LED device junction; 3-an LED element; 31-LED element-side terminal; 4-soldering the weld; 5-a conductive pad; 6-LED device junction bonding layer; 7-double-sided adhesive sheet; 71-LED element fitting part.
Detailed Description
A preferred embodiment of the display device according to the present invention will be described below with reference to the drawings, but the present invention is not limited to the following embodiment. In addition, the present invention can be modified as appropriate without departing from the scope of the present invention. Additionally, the use of the same reference numbers in different figures indicates similar or identical items or features.
As shown in fig. 1, a display device D according to an embodiment of the present invention includes an LED device L and a porous material 1. The LED device L is a device in which a plurality of LED elements 3 are soldered to one surface of a flexible base material 2.
As shown in fig. 3, a display device D according to another embodiment of the present invention may be such that the LED device L is formed by fitting the LED device connecting portion 22 to the LED element 3 and by connecting 2 pieces of LED devices La and Lb, each of the 2 pieces of LED devices La and Lb including, at least in part of an end portion of the flexible base material 2: a plurality of LED elements 3 soldered to one surface side of the flexible base material 2; and an LED device connecting portion 22 that fits at least a part of the plurality of LED elements 3. The number of connected LED devices may be 2 or more.
As shown in fig. 5, a display device D according to still another embodiment of the present invention may be configured such that the LED device L and the porous material 1 are joined by a double-sided adhesive sheet 7, and the double-sided adhesive sheet 7 may have an LED element fitting portion 71 corresponding to at least a part of the plurality of LED elements 3 soldered to one surface side of the flexible base material 2.
Next, the LED device L, the porous material 1, and the display device D will be described in detail.
[ LED device ]
< Flexible substrate >
The flexible base material 2 on the LED device L is made of an insulator. For example, the insulating material is not particularly limited as long as it is an insulating material such as a resin film, paper, or cloth and has flexibility. In order to impart desired physical properties, a resin film is preferably provided.
Examples of the resin constituting the resin film include, but are not limited to, polyester resins, polyamide-imide resins, polyimide resins, polyamide resins, polyether ether ketone resins, polysulfone resins, polyphenylene sulfide resins, polyether sulfone resins, fluorine resins, ABS resins, polyphenylene ether resins, acrylic resins, polycarbonate resins, polybutadiene resins, polyurethane resins, polyolefin resins, polyvinyl chloride resins, and polystyrene resins.
Further, a mixture of these resins may be used, and functional materials such as a colorant, an ultraviolet absorber, an infrared-reflective material, and light-scattering particles may be contained as necessary.
The laminate may be formed by combining any of these resin films, paper, and cloth.
The thickness of the flexible base material 2 is not particularly limited as long as it has flexibility, and may be, for example, 0.001mm to 5.0 mm. From the viewpoint of strength and flexibility, it is preferably 0.01mm to 3.0mm, more preferably 0.02 to 1.0 mm.
The optical characteristics of the flexible base material 2 are not particularly limited, and may be colorless transparent, colored transparent, translucent, or opaque. The display device may be appropriately selected according to the use, installation location, and the like of the display device.
The shape of the flexible base material 2 is not particularly limited, and may be polygonal or circular. Further, the three-dimensional structure may be obtained by combining the same or different shapes.
(Circuit and Circuit-side terminal)
At least a circuit and a circuit-side terminal 21 provided in the circuit are formed on one side surface of the flexible base material 2 on which the LED element 3 is mounted by soldering (hereinafter, the circuit and the circuit-side terminal 21 may be collectively referred to as a wiring). The end of the circuit has a connection terminal for connection to a power supply or a control device.
The wiring is made of 1 or more kinds of conductive materials selected from metal materials such as gold, silver, copper, aluminum, nickel, and chromium, conductive polymers, and conductive carbon.
The wiring may be formed by 1 or more methods selected from screen printing, inkjet printing, Gravure offset printing (Gravure offset printing), flexographic printing, etching, metal evaporation, electroplating, silver salt, and the like.
The width of the wiring, particularly the circuit, is preferably 0.01mm to 3.0mm, preferably 0.03mm to 2.0mm, and more preferably 0.1mm to 1.0 mm.
When the width of the wiring is less than 0.01mm, it may be difficult to fabricate the wiring, and the wiring may be disconnected due to failure of the wiring to withstand the stress generated when the display device D and/or the LED device L are deformed. When the width of the wiring exceeds 3.0mm, the wiring may become conspicuous and the design may be impaired when the display device D is formed using a transparent base material as the flexible base material 2.
The wiring, particularly the circuit, preferably has a thickness of 0.001mm to 0.3 mm.
In the LED device L of the present invention, the soldered portion 4 to which the LED element 3 is soldered is rigid and inflexible, and the portion to which the LED element 3 is not soldered is bent and flexible. When the display device D and/or the LED device L of the present invention is bent, stress is applied to the solder portion 4 to which the LED element 3 is soldered. Therefore, if the thickness of the wiring is less than 0.001mm, the stress generated when the display device D and/or the LED device L are deformed may not be received, and peeling, breakage, or the like between the flexible base material 2 and the wiring may occur in the vicinity of the soldered portion 4 of the LED element 3. On the other hand, when the thickness of the wiring exceeds 0.3mm, the wiring increases rigidity, which may cause a decrease in flexibility of the display device D and/or the LED device L. The thickness of the wiring is more preferably 0.003mm to 0.2mm, still more preferably 0.003mm to 0.1mm, yet more preferably 0.003mm to 0.08mm, and most preferably 0.005mm to 0.06 mm.
In the present invention, the wiring provided on one surface side of the flexible base material 2 can be formed by printing a conductive ink. As the printing method, screen printing, ink jet printing, and gravure offset printing are particularly preferable. By forming the circuit by printing, mass production can be easily performed at low cost.
In the present invention, the wiring provided on one surface side of the flexible base material 2 may be formed by plating after forming the plating resist by printing or the like, or by plating a plating seed layer (seed layer) after printing. Even by this method, mass production can be easily performed at low cost.
(LED element)
The LED device L of the present invention has a plurality of LED elements 3 soldered to one surface of a flexible base material 2.
The number of LED elements 3 is not particularly limited, and may be appropriately determined according to the required dot density of the LED device L. For example, the number of the LED elements 3 may be 1/100 cm2About 4000/100 cm2Preferably 30/100 cm2About 3000 pieces/100 cm2More preferably 60/100 cm2About 3000 pieces/100 cm2More preferably 80/100 cm22500/100 cm2。
These plurality of LED elements 3 may be provided on one surface side of the flexible base material 2 at a constant pitch. In addition, the flexible base material 2 may be provided on one surface side thereof in an arbitrary arrangement.
The LED element 3 is not particularly limited, and any element such as a monochromatic LED element or a full-color LED element can be used. In the present invention, it is preferable to use a full-color LED with a built-in control unit from the viewpoint of the expressiveness of the display device D and the like. The full-color LED has at least 3 LED elements of red (R), green (G) and blue (B) in 1LED unit and a control unit. The control unit is configured to selectively emit 1 or more of the LED elements of each color based on an external command signal, thereby emitting an arbitrary color tone.
By transmitting a signal generated by an external main control unit to each control unit and controlling the full-color LED, a plurality of LEDs can function as a color display.
Although more precise display can be performed by increasing the dot density of the LED, it may cause a decrease in flexibility.
< soldering welding >
In the present invention, the method of soldering on one surface side of the flexible base material is not particularly limited. The material properties such as the melting point of the solder used, the heat resistance of the flexible substrate 2 and the LED element 3, and the workability can be determined appropriately.
For example, the LED element may be arranged on the circuit-side terminal via solder, and in this state, the solder is heated and melted, and the circuit-side terminal and the electronic element-side terminal are soldered. Thus, for example, as shown in fig. 2(a) and 2(b), the circuit-side terminal 21 provided in the circuit formed on one surface side of the flexible base material 2 and the LED-element-side terminal 31 attached to the LED element 3 are connected via the solder joint portion 4.
The kind of the solder used in the soldering is not particularly limited. In the present invention, lead-free solder is preferably used from the viewpoint of environmental aspects and the like. For example, high temperature solders (e.g., SnAgCu-based solders having a melting point of about 220 ℃) to low temperature solders (e.g., SnBi-based solders having a melting point of about 140 ℃) can be used.
As a method of soldering, for example, a method such as flow soldering, reflow soldering, soldering using an electromagnetic induction heating technique (IH technique), or the like can be used.
Among them, in the case of bonding many LED elements in order to increase the dot density, workability can be improved by using a flexible base material having heat resistance such as a polyimide resin and by using a method such as reflow soldering.
When a polyester resin or the like such as a polyethylene terephthalate resin (PET resin) or the like, which has not so high heat resistance, is used as the flexible base material, a soldering method using an electromagnetic induction heating technique (IH technique) can be used. A soldering method (electromagnetic induction heating soldering method) using the electromagnetic induction heating technique (IH technique) is a soldering method in which an eddy current is caused to flow through a conductive substance to generate joule heat, and thus the conductive substance itself can generate heat.
As a soldering method using an electromagnetic induction heating technique (IH technique), for example, the method described in patent document 1 can be used.
For example, when the flexible base material 2 having a heat resistance not so high is used, as shown in fig. 2(b), since the circuit is provided on one surface side of the flexible base material 2 with respect to the circuit-side terminals 21 provided in the circuit and the conductive pads (pads) 5 are provided at positions corresponding to the circuit-side terminals 21 on the other surface side of the flexible base material 2, the LED elements 3 can be more reliably soldered to the circuit-side terminals 21 by the electromagnetic induction heating technique (IH technique). This facilitates the arrangement of the LED elements 3 at arbitrary positions.
In the LED device L, the conductive pad 5 provided on the other surface side of the flexible base material 2 has a larger volume than the circuit side terminal 21, the solder, and the like, and thus the amount of heat generated by electromagnetic induction heating is larger. Then, the heat generated in the conductive pad 5 by the electromagnetic induction heating is transferred to the solder through the flexible base material 2 and the circuit-side terminal 21, whereby the solder is efficiently heated and melted, and the LED element 3 is soldered and welded. At this time, since the heat generated in the conductive pad 5 by the electromagnetic induction heating is rapidly transferred to the solder having a high thermal conductivity, and the temperature rise of the flexible substrate 2 is suppressed, the flexible substrate 2 may be a non-heat-resistant substance.
The conductive pad is formed of a metal-based material containing 1 or more metal elements selected from gold, silver, copper, aluminum, nickel, palladium, chromium, and the like. The conductive pad 5 can be formed by the same method as the wiring. The conductive pad 5 has a size including the circuit-side terminals 21 on the opposite surface of the flexible base material 2, and the shape thereof is not particularly limited, but may be circular, polygonal, or the like. For example, it may be circular with a diameter of 3 mm. The thickness of the conductive pad 5 is preferably 0.001mm to 0.3mm, more preferably 0.003mm to 0.2mm, and still more preferably 0.005mm to 0.06mm, as in the case of the wiring.
The conductive pad 5 can increase the amount of heat generated by electromagnetic induction heating, and particularly can increase the temperature of the region where the conductive pad 5 is formed, so that soldering can be performed more reliably.
Further, even when the flexible base material 2 does not have the conductive land 5 on the other surface side as shown in fig. 2(a), for example, the heat generated inside the circuit side terminal 21 and the solder or the like by electromagnetic induction heating can be utilized by extending the heating time, increasing the current, decreasing the resistance, and the like, and the solder welding can be performed by the solder welding portion 4.
When the flexible base material 2 and the LED element 3 have heat resistance, the entire body may be heated in a reflow furnace or the like to be soldered.
< characteristics of LED device >
The LED device L constituting the display device D of the present invention has flexibility. For example, the LED device L may be wound around a cylinder having a diameter of 1cm or more. Here, the winding is to be understood as meaning that the function of the LED device is not damaged, such as disconnection of the wiring or peeling or falling off of the LED element 3, even after winding the LED device around the cylinder.
In the present invention, the winding can be performed on a cylinder having a diameter of 1cm or more, for example, 10cm or more. Further, the corrugated plate may be formed by connecting circular arcs having a diameter of 1cm or more.
[ porous Material ]
The porous material 1 on the display device is not particularly limited as long as it has flexibility. Examples thereof include a cloth (woven cloth, nonwoven cloth, knitted cloth), a net, paper, a porous film, a foamed resin, a punched material (a punched metal mesh plate, a punched (apertured) resin film, a net (mesh), etc.), and the like.
For example, when a cloth is used as the porous material 1, it can be used as a door curtain, a drop curtain, a wall cloth, a banner, clothing, or the like.
When a foamed resin, a porous film or a punched material is used, the resin composition is useful as a building, an interior material, a signboard or the like.
If necessary, the porous material 1 can be improved in design by printing or the like.
In the present invention, the porous material 1 preferably has an open area percentage of 3 to 80%. More preferably 5 to 75%, and still more preferably 10 to 70%. The open area ratio is a ratio of the area of the pores (openings) formed on the surface of the porous material 1.
If the open area ratio is less than 3%, the properties of the porous material 1 may not be substantially exhibited. Further, the porous material 1 having an open area ratio of more than 80% may be difficult to form, and may be impractical from the viewpoint of strength and the like.
In the present invention, the porous material 1 preferably has a visible light transmittance of 5% or more. In the present invention, the wavelength range of the visible light is 360nm to 830 nm. The visible light transmittance is determined by a test method specified in international standard ISO 9050 using a spectrophotometer. For example, it can be determined in accordance with japanese industrial standard JIS S3107 (in japanese industrial standard JIS S3107, a resin film is attached to glass for measurement, but in the present invention, the porous material 1 itself is measured and is not attached to glass).
If the visible light transmittance is less than 5%, it may be difficult to visually recognize the light emission of the LED element 3 on the LED device L through the porous material 1.
The upper limit of the visible light transmittance may be, for example, 80%. If the content exceeds 80%, the presence of the LED device L under the porous material 1 can be easily visually recognized, and the design and the like may be deteriorated.
In the present invention, the visible light transmittance of the porous material 1 is more preferably 7 to 75%, and still more preferably 10 to 70%.
[ constitution and use of display device ]
In the present invention, as shown in fig. 3, 2 or more LED devices La and Lb … are connected to each other, whereby a large-screen LED device L can be formed.
These LED devices La, Lb … include, for example, at least a part of the end portion of the flexible base material 2: a plurality of LED elements 3 soldered to one surface side of the flexible base material 2; and an LED device connecting part 22 capable of fitting at least a part of the plurality of LED elements 3.
For example, as shown in fig. 3 and 4, by fitting a plurality of LED elements 3 soldered to one surface side of the 1 st LED device La to an LED device connection portion 22 provided at an end portion of the flexible base material 2 of the 2 nd LED device Lb, 2 or more LED devices La and Lb can be connected.
With this configuration, the display device D and the LED device L having a large screen can be easily formed.
The LED device connecting portion 22 is not particularly limited as long as it has a shape capable of fitting the LED element 3, and examples thereof include a hole and a recess. For example, since the hole is simple, the LED device connecting portion 22 is preferably a hole. The shape of the hole is not particularly limited as long as the LED element 3 can be fitted therein, and examples thereof include a circular shape, a polygonal shape, and an elliptical shape.
When 2 or more LED devices La and Lb … are connected to each other, it is preferable to form the LED device connecting portion bonding layer 6 for bonding the respective LED devices to each other. The LED device connecting part adhesive layer 6 may be made of an adhesive, an adhesive agent, an adhesive sheet, or the like, so that the LED devices La and Lb … of 2 or more pieces can be reliably connected to each other. Examples of the pressure-sensitive adhesive and the adhesive include silicone resins, urethane resins, polyolefin resins, acrylic resins, rubbers, and epoxy resins. By using an adhesive or an adhesive having elasticity, the display device D can be provided even in a place where an impact is applied such as a floor.
By forming the LED device connecting part adhesive layer 6 with an adhesive, a bonding agent, an adhesive sheet, or the like, when the 2 or more LED devices La, Lb … are connected, the LED elements 3 are fixed to the LED device connecting part 22 and are hard to move, so that it is possible to prevent the arrangement of the LED elements 3 from being disordered and reduce the uncomfortable feeling of the display part associated with the connection of the 2 or more LED devices La, Lb ….
The LED devices formed by connection and having a large screen have flexibility even after connection, and can be used as large LED devices formed as one flexible base material.
In addition, when the LED device connecting portion adhesive layer 6 is formed by a removable adhesive, even when the LED element 3 is broken or the like and a defect occurs, it is only necessary to replace the LED device L to which the corresponding LED element 3 is attached, and therefore, the maintenance property and the like are excellent. As the removable adhesive, silicone resins, polyurethane resins, polyolefin resins, acrylic resins, and the like can be used, and there is no particular limitation.
In the present invention, the LED device L and the porous material 1 may or may not be fixed. The LED device 3 may be sealed in the porous material 1 formed in a bag shape.
For fixing the LED device L and the porous material 1, for example, an adhesive agent, an adhesive sheet, or the like can be used. In addition, methods such as suturing and fitting may be used.
When the LED device L and the porous material 1 are fixed, a part thereof may be fixed, or the entire surface may be fixed.
In the present invention, as shown in fig. 5 to 7, when fixing the LED device L and the porous material 1, it is preferable to use a double-sided adhesive sheet 7, and the double-sided adhesive sheet 7 has an LED element fitting portion 71 corresponding to at least a part of the plurality of LED elements 3 soldered to one surface side of the flexible base material 2.
By using such a double-sided adhesive sheet 7, it is possible to prevent contamination or the like due to overflow of an adhesive or a bonding agent, and to facilitate fixation by a simple method.
When the LED device L and the porous material 1 are not fixed, they may be sandwiched. For example, when the porous material 1 on which decoration such as printing, dyeing, embroidery, or the like is performed as necessary is fixed to a wall or the like, the LED device L may be sandwiched between the porous material 1 and the wall. When the display device D of the present invention is used as a door curtain or a banner, a porous material 1 such as a cloth on which decoration such as printing, dyeing, embroidery, or the like is applied may be hung on the LED device L.
Further, the porous material 1 and the LED device L can be fixed by winding them around a pillar or the like, and do not need to be fixed to each other.
The display device D of the present invention can be used as a conventionally known LED light emitting device. In addition, the display device D of the present invention can be used for various applications as in the LED light emitting device. Further, the display device D of the present invention can be used for applications in which flexibility thereof can be utilized flexibly. Examples of applications of the display device D of the present invention include door curtains, banners, curtains, wall coverings, flags, clothing, interior materials, buildings, advertising boards, toys, amusement machines (Slot machines, etc.), game machines, lighting fixtures, tiles, medical instruments, inspection devices, various industrial machines, transportation equipment, electric equipment, agricultural equipment, fishing gear, and the like. In particular, the display device D of the present invention can be integrated into a landscape because the LED device L does not sense its presence when it does not emit light.
Further, the present invention is useful for evacuation, or attention by using the display devices D (LED devices L) in vehicles, streets, buildings, and the like in an emergency such as an accident, a fire, an earthquake, tsunami, flood, or the like, a disaster, or a concert such as a concert, a memorial ceremony, or the like, and controlling a plurality of the display devices D (LED devices L) to display information in a linked manner according to the situation.
Furthermore, the garment can be developed into a safety vest for police, a concert, a sporting event, and the like.
The power supply of the display device D of the present invention is not particularly limited, and a battery, a household power supply, a vehicle, or the like may be used as the power supply. For example, the battery includes a dry battery, a lithium ion battery, and the like, and the lithium ion battery is particularly preferable because the power source can be repeatedly used by charging.
In the present invention, a product including a control device and a control program for displaying information such as necessary characters and symbols can be further developed in a form of incorporating a power source such as a battery.
Although the present invention has been described in detail above, the above-described configuration can be variously modified without departing from the scope of the present invention. Accordingly, all matters contained in the foregoing description or shown in the accompanying drawings are to be interpreted as illustrative.
Claims (7)
1. A display device is characterized in that a display panel is provided,
comprising: an LED device including a plurality of LED elements soldered to one surface side of a flexible base material; and a porous material that covers at least a part of the LED arrangement surface side of the LED device.
2. The display device according to claim 1,
the LED device is provided with: a circuit provided on one surface side of the flexible base material; a circuit-side terminal provided in the circuit; and an LED element soldered to the circuit-side terminal by electromagnetic induction heating.
3. The display device according to claim 1,
the LED device is provided with: a circuit provided on one surface side of the flexible base material; a circuit-side terminal provided in the circuit; a conductive pad provided at a position corresponding to the circuit-side terminal on the other surface side of the flexible base material; and an LED element soldered to the circuit-side terminal by electromagnetic induction heating.
4. A display device as claimed in claim 2 or 3,
the LED device satisfies at least 1 or more of the following main conditions (1) to (8),
(1) the thickness of the flexible base material is 0.001 mm-5.0 mm,
(2) the number of the LED elements is 1/100 cm2About 4000/100 cm2,
(3) The electrical circuit is formed by printing of a conductive ink,
(4) the circuit is formed by electroplating after forming the plating resist,
(5) the circuit is formed by electroplating the plating seed layer after printing,
(6) the width of the circuit is 0.01 mm-3.0 mm,
(7) the thickness of the circuit is 0.001 mm-0.3 mm,
(8) the LED device may be wound on a cylinder having a diameter of 1cm or more.
5. The display device according to any one of claims 1 to 4,
the porous material has an open area ratio of 3-80% and a visible light transmittance of 5% or more.
6. The display device according to any one of claims 1 to 5,
the 2 or more sheets are provided with, at least in a part of an end portion of the flexible base material: a plurality of LED elements soldered to one surface side of the flexible base material; and a connecting part for fitting at least a part of the plurality of LED elements,
the LED device is formed by fitting the connecting portion to the LED element and connecting the 2 or more sheets.
7. The display device according to any one of claims 1 to 6, wherein the LED device and the porous material are bonded by a double-sided adhesive sheet having a recess or hole corresponding to at least a part of the plurality of LED elements soldered to one surface side of the flexible base material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2020-196367 | 2020-11-26 | ||
JP2020196367A JP2022084458A (en) | 2020-11-26 | 2020-11-26 | Display device |
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Publication Number | Publication Date |
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CN114551694A true CN114551694A (en) | 2022-05-27 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202111333184.XA Pending CN114551694A (en) | 2020-11-26 | 2021-11-11 | Display device |
Country Status (3)
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JP (1) | JP2022084458A (en) |
CN (1) | CN114551694A (en) |
TW (1) | TW202231154A (en) |
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2020
- 2020-11-26 JP JP2020196367A patent/JP2022084458A/en active Pending
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2021
- 2021-11-11 CN CN202111333184.XA patent/CN114551694A/en active Pending
- 2021-11-17 TW TW110142738A patent/TW202231154A/en unknown
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TW202231154A (en) | 2022-08-01 |
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