CN114551305B - Device and method for removing and repairing Mini LED chip - Google Patents
Device and method for removing and repairing Mini LED chip Download PDFInfo
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- CN114551305B CN114551305B CN202210195042.XA CN202210195042A CN114551305B CN 114551305 B CN114551305 B CN 114551305B CN 202210195042 A CN202210195042 A CN 202210195042A CN 114551305 B CN114551305 B CN 114551305B
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- 238000000034 method Methods 0.000 title claims abstract description 32
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- 238000003384 imaging method Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims abstract description 14
- 230000008439 repair process Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 60
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- 239000004065 semiconductor Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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Abstract
The invention discloses a device for removing and repairing a Mini LED chip, which comprises a laser, wherein the laser is used for emitting laser; the beam adjusting structure is positioned at one side of the laser emitted by the laser and comprises a beam shaping structure for shaping the laser emitted by the laser into rectangular light spots or linear light spots and an angle adjusting structure for driving the beam shaping structure to rotate so that the rectangular light spots or the linear light spots form specific angles; and a tube mirror positioned at one end of the beam adjusting structure away from the laser for focusing the laser; and the objective lens is positioned at one end of the tube lens far away from the light beam adjusting structure and is used for imaging laser. The invention has the advantages of extremely short processing time, extremely high processing efficiency, simple removal process and high repair rate.
Description
Technical Field
The invention relates to the technical field of laser micromachining application in the display industry, in particular to a device and a method for removing and repairing a Mini LED chip.
Background
Mini LEDs are LED chips with the size of 100 micrometers, and the size is between that of small-pitch LEDs and that of Micro LEDs, and the small-pitch LEDs are the result of continuous downsizing. The Mini LED technology is mature and feasible in mass production, and has large-scale application in the fields of medium-high-end liquid crystal display screen backlight and LED display, in particular to the fields of televisions, notebooks, displays and the like.
Mini LEDs have a number of advantages over conventional display technologies, but at the same time, the disadvantages of Mini LEDs are also apparent: due to the huge conversion, the yield needs to be improved, and the repair cost is too high due to the fact that Mini LED crystal grains are too small.
The Mini LED repairing mode commonly used in the industry at present is as follows: and heating the Mini LED chip bonding pad by using semiconductor laser, controlling the output power of the semiconductor laser and the heating process of the semiconductor laser by using a constant-temperature negative feedback control system, enabling the semiconductor laser to heat the Mini LED bonding pad to a set temperature, and removing a single chip by using a physical method. The process needs to go through the following stages:
1) Preheating: the semiconductor laser heats the welding disk and rises to a preheating temperature, and the welding disk is preheated;
2) Heating: increasing laser power to raise the temperature of the bonding pad from the preheating temperature to the melting temperature of the solder paste/die bonding adhesive;
3) Melting: under the control of a constant temperature negative feedback control system, the temperature of the bonding pad is monitored, and the output power of the laser is controlled, so that the temperature of the bonding pad is kept at the melting temperature of the solder paste/die bonding adhesive for a period of time, and the solder paste/die bonding adhesive is fully melted;
4) Chip removal: and removing the Mini LED chip to be repaired from the bonding pad by using a physical method such as high-pressure air flow, probe or suction nozzle adsorption and the like.
The traditional processing mode has the advantages that the Mini LED chip is large in size, the Mini LED chip needing to be repaired can be removed when the chip density is relatively sparse, and the following problems still exist:
1) The heating time is long, the repair efficiency is low, 10-20 seconds are needed for removing a broken Mini LED chip from preheating to final chip removal, and if the number of the chips to be repaired is large, the repair efficiency is difficult to improve;
2) In the chip removing process, the solder paste/die bonding adhesive is in a molten state, so that the molten solder paste/die bonding adhesive is easy to sputter and adhere to the peripheral area of the bonding pad, the peripheral area of the bonding pad and the adjacent chips are polluted, and even the solder paste/die bonding adhesive of a plurality of adjacent Mini LED chips in one area is heated and melted, thereby loosening the chips in the adjacent areas, introducing new risks, possibly causing additional heat influence to damage the bonding pad and affecting the product performance;
3) Aiming at Mini LED chips with different sizes, DOE lenses with corresponding sizes are required to be customized to adjust the laser spot size, the cost is high, the exchange period is long, the corresponding DOE lenses are required to be replaced at the same time when one product is replaced, and the product compatibility is poor.
Based on the above, the invention provides a device and a method for removing and repairing Mini LED chips, which are used for solving a plurality of problems in the prior art.
Disclosure of Invention
The invention aims to provide a device and a method for removing and repairing a Mini LED chip, which are used for solving the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: an apparatus for Mini LED chip removal repair, comprising: the laser is used for emitting laser; the beam adjusting structure is positioned at one side of the laser emitted by the laser and comprises a beam shaping structure for shaping the laser emitted by the laser into rectangular light spots or linear light spots and an angle adjusting structure for driving the beam shaping structure to rotate so that the rectangular light spots or the linear light spots form specific angles; and a tube mirror positioned at one end of the beam adjusting structure away from the laser for focusing the laser; and the objective lens is positioned at one end of the tube lens far away from the light beam adjusting structure and is used for imaging laser.
Preferably, the beam shaping structure comprises: a substrate; two transverse beam shaping plates; the transverse adjusting structure is used for adjusting opposite or opposite displacement between the two transverse beam shaping plates; and two longitudinal beam shaping plates, which are overlapped with the two transverse beam shaping plates; the longitudinal adjusting structure is used for adjusting opposite or opposite displacement between the two longitudinal beam shaping plates; the laser beam is shaped into a rectangular or linear spot as it passes through the transverse and longitudinal beam shaping plates.
Preferably, the lateral adjustment structure comprises: the first motor is fixed on the substrate; the first bidirectional screw rod is connected to the output end of the first motor; the first screw rod supporting seat is fixed on the substrate and used for supporting the first bidirectional screw rod; the two first screw nuts are respectively in threaded connection with two sections of threads of the first bidirectional screw rod, and are respectively connected with the two transverse beam shaping plates; the two transverse beam shaping plates are both connected to the base plate in a sliding manner; the two first screw nuts are provided with first distance sensors.
Preferably, the longitudinal adjustment structure comprises: the second motor is fixed on the substrate; the second bidirectional screw rod is connected to the output end of the second motor; the second screw rod supporting seat is fixed on the base plate and used for supporting the second bidirectional screw rod; the two second screw nuts are respectively in threaded connection with two sections of threads of the second bidirectional screw rod, and are respectively connected with the two longitudinal beam shaping plates; the two longitudinal beam shaping plates are both connected to the base plate in a sliding manner; and the two second lead screw nuts are provided with second distance sensors.
Preferably, the angle adjusting structure includes: a platform substrate; and the rotating platform comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate, the rotating part is fixedly connected with the substrate, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven by a motor to rotate.
Preferably, a device for removing and repairing Mini LED chips further comprises: an optical attenuation structure located between the laser and the beam adjustment structure; and a mirror positioned between the optical attenuation structure and the beam adjustment structure.
Preferably, a device for removing and repairing Mini LED chips further comprises: an imaging dichroic mirror located between the tube mirror and the objective lens for introducing the coaxial imaging laser; and a coaxial imaging structure located on the side of the imaging dichroic mirror.
Preferably, a device for removing and repairing Mini LED chips further comprises: a laser dichroic mirror, which is positioned between the imaging dichroic mirror and the objective lens, for guiding in the coaxial signal laser; and the automatic focusing structure is positioned on one side of the laser dichroic mirror.
The invention also provides the following technical scheme:
a method for Mini LED chip removal repair, comprising:
s1, placing a chip, and enabling a chip substrate to be positioned at the upper end of a chip substrate;
s2, bombarding the chip substrate by using high-energy pulse laser to separate the chip substrate and the chip electrode from the chip substrate.
Preferably, step S2 includes:
s2a, emitting high-energy pulse laser;
s2, attenuating high-energy pulse laser;
s2c, adjusting the laser beam into rectangular light spots or linear light spots with the same inclination as the chip substrate;
s2d, focusing the laser;
s2e. laser imaging.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention discloses a device and a method for removing and repairing a Mini LED chip, which bombard a substrate of the Mini LED chip by using high-energy pulse laser, so that the high-energy pulse laser interacts with a material on the surface of the substrate to generate high-temperature plasma with extremely high density; the directional local isothermal expansion emission of high temperature plasma to the normal direction of the solid surface, while the expansion speed of the plasma in the reverse laser beam direction is obviously higher than other directions, the nonuniform expansion forms ellipsoidal plasma, namely an elongated plasma area outwards along the normal direction of the target surface, namely so-called plasma plume, and the directional expansion emission process is extremely short (10 -8 ～10 -3 s), the LED chip has the characteristic of instant explosion and the axial constraint property emitted along the normal direction of the target surface, so that shock waves are generated, the shock waves are directionally conducted to the Mini LED chip and interact with the Mini LED chip, and the welding position is broken under the shock action of the shock waves due to the fact that the position connecting force between the chip substrate and the chip electrode is relatively weak, so that the Mini LED chip drops from the chip substrate and is instantly flicked;
2. according to the device and the method for removing and repairing the Mini LED chip, disclosed by the invention, only one or more laser pulses are needed to bombard the substrate of the Mini LED chip in the processing process, the processing time is extremely short, the processing process is less than 1 second, and the Mini LED chip can be separated from the substrate and flicked at the moment of laser pulse bombardment, so that the processing efficiency is extremely high;
3. according to the device and the method for removing and repairing the Mini LED chip, unlike the traditional processing mode, the processing method adopted by the invention does not need to use high-pressure gas or components such as a probe, a suction nozzle and the like to enable the Mini LED chip to be removed to fall off from a substrate, and the Mini LED chip to be removed can fall off from the substrate and shake under the action of oscillation force generated by laser directly, so that the removing process is simple;
4. the device and the method for removing and repairing the Mini LED chip can accurately bombard the damaged chip, cannot influence adjacent chips and bonding pads, and further ensure the repair rate.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
fig. 1 is a schematic structural diagram of a device for removing and repairing Mini LED chips in embodiment 1 of the present invention;
FIG. 2 is a perspective view of a beam adjusting structure in embodiment 1 of the present invention;
FIG. 3 is a perspective view of a lateral adjustment structure in embodiment 1 of the present invention;
FIG. 4 is a perspective view of a longitudinal adjustment structure in embodiment 1 of the present invention;
FIG. 5 is a schematic diagram of a method for removing and repairing Mini LED chips in embodiment 2 of the present invention;
FIG. 6 is a schematic diagram II of a method for removing and repairing Mini LED chips in embodiment 2 of the invention;
in the figure:
a laser 1;
a beam adjusting structure 2, a beam shaping structure 21, a base plate 211, a transverse beam shaping plate 212, a transverse adjusting structure 213, a first motor 2131, a first bi-directional screw 2132, a first screw support 2133, a first screw nut 2134, a longitudinal beam shaping plate 214, a longitudinal adjusting structure 215, a second motor 2151, a second bi-directional screw 2152, a second screw support 2153, a second screw nut 2154, an angle adjusting structure 22, a platform base plate 221, a rotating platform 222;
a tube mirror 3;
an objective lens 4;
an optical attenuation structure 5;
a reflecting mirror 6;
an imaging dichroic mirror 7;
a coaxial imaging structure 8;
a laser dichroic mirror 9;
an auto-focus structure 10;
a chip substrate 11;
a chip substrate 12;
a chip electrode 13;
and a die bond adhesive 14.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the conventional processing scheme, in order to solve the problem of removing and repairing the Mini LED chip, the semiconductor laser is used for heating the bonding pad of the Mini LED chip, and meanwhile, the constant-temperature negative feedback control system is used for controlling the output power of the semiconductor laser and the heating process of the semiconductor laser, so that the semiconductor laser heats the bonding pad of the Mini LED chip to a set temperature, and the Mini LED chip is removed from the substrate 211 through the stages of preheating, heating, melting, physical removal and the like.
Based on this, the present application provides embodiment 1, as an optimal solution for a device for Mini LED chip removal repair, to efficiently, accurately and cost-effectively remove and repair Mini LED chips.
Specifically, to achieve this, as shown in fig. 1, the apparatus includes a laser 1, where the laser 1 is used to emit high-energy pulse laser light; the laser is preferably a 532nm laser with a pulse width of about 10 nanoseconds and a single pulse energy of more than 10mJ, or a 355nm laser with a pulse width of about 10 nanoseconds and a single pulse energy of more than 15mJ, and can also be a high single pulse laser with other pulse widths.
Further, as shown in fig. 1, the device further includes an optical attenuation structure 5, where the optical attenuation structure 5 is located between the laser 1 and the beam adjustment structure 2, and is used for attenuating laser power; specifically, the optical attenuation structure 5 comprises a half-wave plate, a rotating motor, a polarizing crystal, a control motor and a light source, wherein the half-wave plate is used for changing the polarization state of laser, the rotating motor is used for driving the half-wave plate to rotate, the polarizing crystal is used for separating lasers with different polarization states into orthogonal light beams, the motor is controlled to drive the half-wave plate to rotate, and the linear polarization laser power transmitted from the polarizing crystal can be adjusted, so that the adjustment and the change of the output laser power from 0.1-100.0% are accurately controlled, and the laser power, the adjustment precision and the resolution are improved.
Further, as shown in fig. 1, the device further includes a reflecting mirror 6, where the reflecting mirror 6 is located between the optical attenuation structure 5 and the beam adjusting structure 2, and the reflecting mirror 6 is used to reflect the laser beam to change the propagation direction of the laser beam, so that the space occupation of the device is reasonable.
Further, as shown in fig. 1-2, the device further comprises a beam adjusting structure 2, the beam adjusting structure 2 is located at one side of the laser 1 emitting laser, the beam adjusting structure 2 comprises a beam shaping structure 21 for shaping the laser emitted by the laser 1 into rectangular light spots or linear light spots, the size of the light spots can be adjusted within the range of 0.1 mm-6 mm, and the beam shaping structure 21 is driven to rotate, so that the rectangular light spots or linear light spots form an angle adjusting structure 22 with a specific angle, the angle of the light spots is kept consistent with the angle of a chip, and the accuracy of laser bombardment is ensured;
further, as shown in fig. 2, the beam shaping structure 21 includes a substrate 211, wherein the substrate 211 serves as a support structure; two transverse beam shaping plates 212; and a lateral adjustment structure 213, wherein the lateral adjustment structure 213 is configured to adjust a displacement between the two lateral beam shaping plates 212 in opposite directions, so that the laser passes between the two lateral beam shaping plates 212, thereby shaping the laser in one dimension; and two longitudinal beam shaping plates 214, the two longitudinal beam shaping plates 214 being placed overlapping the two transverse beam shaping plates 212; and a longitudinal adjustment structure 215, the longitudinal adjustment structure 215 being used for adjusting the displacement between the two longitudinal beam shaping plates 214 in opposite directions, so that the laser passes between the two longitudinal beam shaping plates 214, thereby shaping the laser in the other dimension; i.e. shaped in two dimensions into a rectangular or linear spot as the laser beam passes through the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214;
further, as shown in fig. 2, since the thicknesses of the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214 affect the diffraction of the laser light, in order to ensure the diffraction effect after the laser light passes through the beam shaping structure 21, the thicknesses of the transverse beam shaping plate 212 and the longitudinal beam shaping plate 214 are 0.5mm;
further, as shown in fig. 3, the lateral adjustment structure 213 includes a first motor 2131, the first motor 2131 is fixed on the base plate 211, and the first motor 2131 is preferably a high-resolution stepper motor, so as to ensure that the minimum movement amount of the screw is 6um; the first bidirectional screw rod 2132 is connected to the output end of the first motor 2131 through a coupling, and the movement precision of the first bidirectional screw rod 2132 is +/-0.055+5um; and a first screw support 2133, the first screw support 2133 being fixed to the base plate 211 and supporting the first bidirectional screw 2132 through a bearing; and two first lead screw nuts 2134, the two first lead screw nuts 2134 are respectively screwed on two sections of threads of the first bidirectional lead screw 2132, and the two first lead screw nuts 2134 are respectively connected with two transverse beam shaping plates 212; the two transverse beam shaping plates 212 are both connected to the base plate 211 in a sliding manner through a sliding rail and a sliding block; when the distance between the two transverse beam shaping plates 212 needs to be adjusted, the first motor 2131 is started to rotate to drive the first bidirectional screw rod 2132 to rotate, so that the two first screw nuts 2134 and the first bidirectional screw rod 2132 perform screw movement, and under the limiting action of the sliding rail sliding block, the two first screw nuts 2134 are driven to displace in opposite directions, so that the two transverse beam shaping plates 212 displace in opposite directions;
further, a second distance sensor is arranged on each of the two first screw nuts 2134 for sensing the displacement distance, so as to form a feedback mechanism, thereby being convenient for accurately controlling the size of the light spot;
further, as shown in fig. 4, the longitudinal adjustment structure 215 includes a second motor 2151, where the second motor 2151 is fixed on the base 211, and the second motor 2151 is preferably a high resolution stepper motor, so as to ensure that the minimum movement amount of the screw is 6um; and a second bidirectional screw 2152, the second bidirectional screw 2152 is connected to the output end of the second motor 2151 through a coupling, and the movement precision of the second bidirectional screw 2152 is ±0.055+5um; and a second screw support 2153, the second screw support 2153 being fixed to the base 211, supporting the second bidirectional screw 2152 through a bearing; and two second screw nuts 2154, the two second screw nuts 2154 are respectively screwed on two sections of threads of the second bidirectional screw 2152, and the two second screw nuts 2154 are respectively connected with the two longitudinal beam shaping plates 214; the two longitudinal beam shaping plates 214 are both slidably connected to the base plate 211 through a sliding rail; when the distance between the two longitudinal beam shaping plates 214 needs to be adjusted, the second motor 2151 is started to rotate to drive the second bidirectional screw rod 2152 to rotate, so that the two second screw nuts 2154 and the second bidirectional screw rod 2152 perform screw movement, and under the limiting action of the sliding rail sliding block, the two second screw nuts 2154 are driven to displace in opposite directions, so that the two longitudinal beam shaping plates 214 displace in opposite directions;
further, the two second screw nuts 2154 are provided with second distance sensors for sensing displacement distances, so as to form a feedback mechanism, thereby being convenient for accurately controlling the size of the light spot;
further, as shown in fig. 2, the angle adjusting structure 22 includes a platform substrate 221, and the platform substrate 221 serves as a supporting structure; the rotating platform 222 comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate 221, the rotating part is fixedly connected with the substrate 211, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven to rotate by a motor; the beam shaping structure 21 can be driven to rotate in this way, so as to adjust the laser spot angle, wherein the center of the angle adjusting structure 22 and the center of the beam shaping structure 21 are coaxial, so that the laser center is unchanged when the angle adjusting structure 22 rotates.
Further, as shown in fig. 1, the device further comprises a tube mirror 3, and the tube mirror 3 is located at one end of the beam adjusting structure 2 away from the laser 1, and is used for focusing laser light; the laser imaging device also comprises an objective lens 4, wherein the objective lens 4 is positioned at one end of the tube lens 3 away from the beam adjusting structure 2 and is used for imaging laser, so that the laser is focused on the surface of the chip and bombards the chip substrate.
Further, as shown in fig. 1, the device further comprises an imaging dichroic mirror 7, wherein the imaging dichroic mirror 7 is positioned between the tube mirror 3 and the objective lens 4 and is used for guiding in coaxial imaging laser; and a coaxial imaging structure 8, the coaxial imaging structure 8 being located on one side of the imaging dichroic mirror 7, wherein the coaxial imaging structure 8 comprises a camera and an imaging lens for observing and monitoring the product and the process.
Further, as shown in fig. 1, the device also comprises a laser dichroic mirror 9, wherein the laser dichroic mirror 9 is positioned between the imaging dichroic mirror 7 and the objective lens 4 and is used for guiding in coaxial signal laser; the automatic focusing structure 10, the automatic focusing structure 10 is located at one side of the laser dichroic mirror 9, the automatic focusing structure 10 is used for measuring the distance between the Mini LED chip substrate and the laser objective lens, and further controlling the motion control system to move in the vertical direction, so that the laser focus is just focused on the chip substrate, and the automatic focusing structure 10 comprises a laser diode for emitting laser, and a laser position sensor for receiving the emitted laser so as to measure the distance between the Mini LED chip substrate and the objective lens.
Based on the device for removing and repairing the Mini LED chip provided in the embodiment 1, the present application further provides embodiment 2, which is an optimal solution for a method for removing and repairing the Mini LED chip, and is used for assisting the device to remove and repair the Mini LED chip.
Specifically, as shown in fig. 5 to 6, a method for removing and repairing a Mini LED chip includes:
s1, placing a chip, and enabling a chip substrate 11 to be positioned at the upper end of a chip substrate 12;
s2, bombarding the chip substrate 11 by using high-energy pulse laser to separate the chip substrate 11 and the chip electrode 13 from the chip substrate 12;
s2a, emitting high-energy pulse laser;
s2, attenuating high-energy pulse laser;
s2c, adjusting the laser beam into a rectangular light spot or a linear light spot with the same inclination as the chip substrate 11;
s2d, focusing the laser;
s2e. laser imaging.
Furthermore, the removing method also comprises the steps of observing and monitoring the processing process and performing laser real-time focusing compensation on the laser processing process.
The principle is as follows: as shown in fig. 5-6, the Mini LED chip substrate 11 is bombarded by high-energy pulse laser, so that the high-energy pulse laser interacts with the substrate surface material to generate high-temperature plasma with extremely high density; the directional local isothermal expansion emission of high temperature plasma to the normal direction of the solid surface, while the expansion speed of the plasma in the reverse laser beam direction is obviously higher than other directions, the nonuniform expansion forms ellipsoidal plasma, namely an elongated plasma area outwards along the normal direction of the target surface, namely so-called plasma plume, and the directional expansion emission process is extremely short (10 -8 ～10 -3 s), the chip has the characteristic of instant explosion and the axial constraint property emitted along the normal direction of the target surface, so that shock waves are generated, the shock waves are directionally conducted to the Mini LED chip and interact, as the chip substrate 12 and the chip electrode 13 are connected through the die bonding adhesive 14, the connection force is relatively weak, and the welding position is broken under the shock wave oscillation effect, so that the Mini LED chip falls off from the chip substrate 12 and is instantly flicked.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The device for removing and repairing the Mini LED chip is characterized by comprising the following components:
a laser for emitting laser light, the laser being a 532nm laser with single pulse energy >10mJ or a 355mm laser with single pulse energy >15 mJ;
a beam adjusting structure, located at one side of the laser emitting laser, the beam adjusting structure comprising a laser beam shaping device for shaping the laser emitting laser into a rectangular light spot or a linear light spot, and making the light spot size be 0.1mm0.1mm to 6mm* The device comprises a beam shaping structure and an angle adjusting structure, wherein the beam shaping structure is adjusted within a range of 6mm, and the angle adjusting structure is used for driving the beam shaping structure to rotate, and a rectangular light spot or a linear light spot forms a specific angle through the angle adjusting structure so that the angle of the light spot is consistent with the angle of a chip; the center of the angle adjusting structure and the center of the beam shaping structure are coaxially arranged, so that the laser center is unchanged when the angle adjusting structure rotates;
wherein the beam shaping structure comprises: a substrate; two transverse beam shaping plates; the transverse adjusting structure is used for adjusting opposite or opposite displacement between the two transverse beam shaping plates; and two longitudinal beam shaping plates, wherein the two longitudinal beam shaping plates and the two transverse beam shaping plates are overlapped and placed; the longitudinal adjusting structure is used for adjusting opposite or opposite displacement between the two longitudinal beam shaping plates; when the laser beam passes through the transverse beam shaping plate and the longitudinal beam shaping plate, the laser beam is shaped into rectangular light spots or linear light spots;
wherein, the angle adjustment structure includes: a platform substrate; the rotary platform comprises a fixed part and a rotating part, the fixed part is fixedly connected with the platform substrate, the rotating part is fixedly connected with the substrate, the fixed part is connected with the rotating part through a bearing, and the rotating part is driven by a motor to rotate;
the tube mirror is positioned at one end of the beam adjusting structure, which is far away from the laser and is used for focusing laser;
the objective lens is positioned at one end of the tube lens far away from the light beam adjusting structure and is used for imaging laser;
the optical attenuation structure is positioned between the laser and the beam adjusting structure and comprises a half-wave plate for changing the polarization state of laser, a rotating motor for driving the half-wave plate to rotate and a polarizing crystal for separating the laser with different polarization states into orthogonal beams; the half-wave plate is driven to rotate by the rotating motor so as to adjust the line polarization laser power transmitted from the polarized crystal, and the output laser power is changed within the range of 0.1-100.0%;
a mirror positioned between the optical attenuation structure and the beam conditioning structure;
an imaging dichroic mirror located between the tube mirror and the objective lens for introducing a coaxial imaging laser;
a coaxial imaging structure located on one side of the imaging dichroic mirror;
a laser dichroic mirror located between the imaging dichroic mirror and the objective lens for introducing a coaxial signal laser;
an auto-focus structure located on one side of the laser dichroic mirror;
the laser is matched with the light beam adjusting structure, the tube mirror, the objective lens, the optical attenuation structure, the reflecting mirror, the imaging dichroic mirror, the coaxial imaging structure, the laser dichroic mirror and the automatic focusing structure to process, so that the Mini LED chip is broken at a welding position under the action of shock wave oscillation, falls off from a chip substrate and is separated from the chip substrate instantaneously and flicked.
2. The apparatus for Mini LED chip removal repair as in claim 1, wherein,
the transverse adjusting structure comprises a first motor, and the first motor is fixed on the base plate;
the first bidirectional screw rod is connected to the output end of the first motor;
the first screw rod supporting seat is fixed on the substrate and used for supporting the first bidirectional screw rod;
the two first screw nuts are respectively in threaded connection with two sections of threads of the first bidirectional screw rod, and the two first screw nuts are respectively connected with the two transverse beam shaping plates;
both the transverse beam shaping plates are slidably connected to the base plate.
3. The apparatus for Mini LED chip removal repair of claim 1, wherein said longitudinal adjustment structure comprises:
the second motor is fixed on the substrate;
the second bidirectional screw rod is connected to the output end of the second motor;
the second screw rod supporting seat is fixed on the substrate and used for supporting the second bidirectional screw rod;
the two second screw nuts are respectively in threaded connection with two sections of threads of the second bidirectional screw rod, and the two second screw nuts are respectively connected with the two longitudinal beam shaping plates;
both longitudinal beam shaping plates are slidably connected to the base plate.
4. A method for Mini LED chip removal repair, using the device for Mini LED chip removal repair according to any one of claims 1 to 3, characterized by comprising the steps of:
s1, placing a chip, and enabling a chip substrate to be positioned at the upper end of a chip substrate;
s2, matching the laser with the light beam adjusting structure, the tube mirror, the objective lens, the optical attenuation structure, the reflecting mirror, the imaging dichroic mirror, the coaxial imaging structure, the laser dichroic mirror and the automatic focusing structure to bombard a chip substrate by using high-energy pulse laser, so that a Mini LED chip is broken at a welding position under the action of shock wave oscillation and falls off from a chip substrate and is separated from the chip substrate instantly by shock waves generated by high-temperature plasma generated by the action of laser pulse and a substrate surface material, wherein the laser is a 532nm laser with single pulse energy of >10mJ or a 355mm laser with single pulse energy of >15 mJ;
wherein, the step S2 at least comprises the following steps:
s2a, emitting high-energy pulse laser;
s2, attenuating high-energy pulse laser;
s2c, adjusting the laser beam into rectangular light spots or linear light spots with the same inclination as the chip substrate;
s2d, focusing the laser;
s2e. laser imaging.
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| CN202310772759.0A CN116799110B (en) | 2022-03-01 | 2022-03-01 | Method for removing and repairing Mini LED chip |
| CN202210195042.XA CN114551305B (en) | 2022-03-01 | 2022-03-01 | Device and method for removing and repairing Mini LED chip |
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| AU7304098A (en) * | 1996-11-22 | 1998-06-10 | Jmar Technology Co. | Solid state laser system for ultra-violet micro-lithography |
| US6281471B1 (en) * | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
| JP4509578B2 (en) * | 2004-01-09 | 2010-07-21 | 浜松ホトニクス株式会社 | Laser processing method and laser processing apparatus |
| AU2012272486B2 (en) * | 2011-06-24 | 2015-10-29 | Tornado Spectral Systems Inc. | Spectrograph with anamorphic beam expansion |
| JP5960826B2 (en) * | 2011-08-26 | 2016-08-02 | カール ツァイス エスエムエス リミテッド | Method and apparatus for locally deforming an optical element for photolithography |
| JP6762356B2 (en) * | 2016-03-24 | 2020-09-30 | 国立大学法人九州大学 | Laser annealing equipment |
| CN109434289B (en) * | 2018-12-18 | 2021-03-30 | 北京工业大学 | Femtosecond laser manufacturing method for tunable phase-change nano-structure super surface |
| CN210848791U (en) * | 2019-09-17 | 2020-06-26 | 北京兆维电子(集团)有限责任公司 | Bidirectional adjustable electric slit device |
| JP7383339B2 (en) * | 2019-10-16 | 2023-11-20 | 株式会社ディスコ | Processing method and equipment for workpiece |
| CN110976428A (en) * | 2019-11-19 | 2020-04-10 | 大族激光科技产业集团股份有限公司 | Cleaning device and cleaning method for micro LED |
| CN211236473U (en) * | 2020-01-15 | 2020-08-11 | 东莞威森智能科技有限公司 | Laser shaping module and industrial laser lens |
| KR20200103583A (en) * | 2020-08-19 | 2020-09-02 | 레이저쎌 주식회사 | Apparatus for removing an electronic device from a pcb board |
| CN113284989A (en) * | 2021-06-21 | 2021-08-20 | 北京火龙果科学仪器有限公司 | Micro LED chip stripping device, stripping machine and use method of stripping machine |
| CN113857610A (en) * | 2021-09-27 | 2021-12-31 | 苏州科韵激光科技有限公司 | Laser welding and removing method and device |
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