CN114423259A

CN114423259A - Electronic device and manufacturing method thereof

Info

Publication number: CN114423259A
Application number: CN202210238897.6A
Authority: CN
Inventors: 陈金玉; 张路宽; 孙贵平
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-03-11
Filing date: 2022-03-11
Publication date: 2022-04-29

Abstract

The application provides an electronic device and a manufacturing method thereof. The electronic equipment comprises a shell, a heating element and a heat dissipation module. The heat dissipation module comprises a fan and a heat dissipation pipe. The heat dissipation module and the heating element are both arranged in the shell, and the fan and the heating element are arranged at intervals. The cooling tube includes evaporation zone and condensation segment, and the evaporation zone is connected with the condensation segment, and the pipe diameter of condensation segment is less than the pipe diameter of evaporation zone. The cooling tube is installed in the casing, and evaporation zone and the range upon range of setting of heating element to contact with heating element, the condensation segment is connected with the fan and contacts with the fan. The electronic equipment provided by the application can solve the problem that the internal space of the electronic equipment is tense in the prior art.

Description

Electronic device and manufacturing method thereof

Technical Field

The application relates to the field of heat dissipation technologies, in particular to an electronic device and a manufacturing method thereof.

Background

Electronic devices, such as notebook computers, are becoming increasingly popular with multiple users due to their portability. Most notebook computers use fans and heat pipes for heat dissipation. However, as the notebook computer is gradually developed to be light and thin, the available space inside the notebook computer is smaller and smaller, especially the available space near the fan is short, and as the performance of the notebook computer is continuously improved, the heat flux density is continuously increased, and the common heat pipe is difficult to meet the increasingly short space requirement inside the notebook computer.

Disclosure of Invention

The application provides an electronic device and a manufacturing method thereof, which aim to solve the problem that the internal space of the electronic device is tense in the prior art.

In a first aspect, the present application provides an electronic device comprising: the heat dissipation module comprises a shell, a heating element and a heat dissipation module. The heat dissipation module comprises a fan and a heat dissipation pipe. The heat dissipation module and the heating element are both arranged in the shell, and the fan and the heating element are arranged at intervals. The cooling tube includes evaporation zone and condensation segment, the evaporation zone with the condensation segment is connected, just the pipe diameter of condensation segment is less than the pipe diameter of evaporation zone. The cooling tube install in the casing, just the evaporation zone with heating element stacks up the setting, and with heating element contact, the condensation segment with the fan is connected and with the fan contact.

In this embodiment, through setting up the cooling tube to connect heating element and fan with the cooling tube, thereby can transmit heating element's heat to the fan and retransmit to the external world, in order to realize heating element's heat dissipation, avoid heating element overheated to cause the influence to its performance. And, the cooling tube width that this embodiment provided is different, set up the width that is less than the evaporation zone through the width with the condensation zone, and locate fan one side with the less condensation zone of width, heating element one side is located to the great evaporation zone of width, thereby can play the effect of practicing thrift near fan space, simultaneously, because the evaporation zone width is great, thereby can avoid causing the influence to the heat exchange between evaporation zone and the heating element, and then can avoid causing the influence to electronic equipment's radiating efficiency.

In one embodiment, the heat dissipation pipe further comprises a transition section, the transition section is connected between the evaporation section and the condensation section, and the pipe diameter of the transition section gradually decreases in the direction from the evaporation section to the condensation section.

In this embodiment, through setting up the changeover portion to set up the changeover portion into the shape that the pipe diameter gradually changed, thereby can realize the smooth transition of evaporation zone to condensation segment width, in order to avoid causing the capillary force to weaken and the permeability reduces because the width sudden change, thereby cause the influence to the heat dispersion of cooling tube.

In one embodiment, the heat dissipation module comprises a cooling liquid, the cooling liquid is located in the heat dissipation pipe, and the cooling liquid is gasified in the evaporation section and liquefied in the condensation section.

In this embodiment, through set up the coolant liquid in the cooling tube to the coolant liquid can absorb the heat in evaporation section vaporization, can release the heat at the condensation segment liquefaction, thereby can realize transmitting the heat of evaporation section to the condensation segment, and then realize heating element's heat dissipation.

In one embodiment, the heat dissipation module includes an auxiliary fan, and the auxiliary fan and the fan are respectively located at two opposite sides of the heat generating element. The cooling tube still includes supplementary condensation segment, supplementary condensation segment with the condensation segment connect respectively in the relative both ends of evaporation zone, supplementary condensation segment with supplementary fan is connected, and with supplementary fan contact.

In this embodiment, through setting up auxiliary fan and supplementary condensation segment to make supplementary condensation segment be connected with auxiliary fan, make the heat of evaporation zone can also transmit to supplementary condensation segment, then transmit to auxiliary fan, thereby can increase the radiating efficiency of cooling tube, and then can further promote electronic equipment's heat dispersion.

In one embodiment, the heat dissipation module includes an auxiliary fan, and the auxiliary fan and the fan are respectively located at two opposite sides of the heat generating element. The heat dissipation module comprises an auxiliary heat dissipation pipe, the auxiliary heat dissipation pipe comprises an auxiliary evaporation section and an auxiliary condensation section, the auxiliary evaporation section is connected with the auxiliary condensation section, and the pipe diameter of the auxiliary condensation section is smaller than that of the auxiliary evaporation section; the auxiliary radiating pipe is arranged in the shell, the auxiliary evaporation section is stacked with the heating element and is in contact with the heating element, and the auxiliary condensation section is connected with the auxiliary fan and is in contact with the auxiliary fan.

In this embodiment, through setting up auxiliary fan and vice cooling tube, and make vice cooling tube connect heating element and fan, make the heat that heating element produced can give cooling tube and vice cooling tube simultaneously, the heat of transmission to the cooling tube can be through the fan discharge external world, the heat of transmission to vice cooling tube can be through auxiliary fan transmission to the external world, thereby can further promote electronic equipment's heat dispersion.

In one embodiment, the heat dissipation pipe further comprises a capillary structure, and the capillary structure is disposed on the inner wall of the heat dissipation pipe. In this embodiment, through set up the capillary structure at the inner wall of cooling tube for the coolant liquid that liquefies at the condensation segment can get back to the evaporation zone again through the capillary force of capillary structure, and then the evaporation zone continues the vaporization again, constantly takes place the vaporization-liquefaction circulation, in order to realize heat absorption-heat release circulation, thereby makes the heat that heating element produced constantly transmit to the external world through the cooling tube, in order to play the heat radiating effect, reduces heating element's temperature.

In one embodiment, the capillary structure is a powdered capillary structure, or a fibrous capillary structure, or a reticulated capillary structure, or a grooved capillary structure.

In one embodiment, the fan includes a fan body and a heat dissipation member, the heat dissipation member is mounted on a surface of the fan body and is fixedly connected to the fan body, and the condensation section is stacked on the heat dissipation member and is fixedly connected to the heat dissipation member.

In this embodiment, through setting up the radiating piece to make condensation segment and radiating piece contact, thereby can increase the contact of condensation segment and radiating piece, make the heat of condensation segment can transmit to the fan fast more, high-efficiently, with the radiating efficiency who improves electronic equipment.

In one embodiment, the volume of the cooling liquid is 0.1% to 10% of the cavity volume of the radiating pipe. In this embodiment, the volume of the cooling liquid is set to be 0.1% -10% of the volume of the cavity of the radiating pipe, so that sufficient cooling liquid in the radiating pipe completes vaporization-liquefaction circulation, heat of the evaporation section is transmitted to the condensation section, and meanwhile, sufficient space is reserved for the gas-phase cooling liquid vaporized in the evaporation section to enter the condensation section.

In one embodiment, the heat dissipation module comprises a secondary cooling liquid, the secondary cooling liquid is located in the secondary heat dissipation pipe, and the secondary cooling liquid is gasified in the secondary evaporation section and liquefied in the secondary condensation section.

In this embodiment, through the vice coolant liquid of intussuseption in vice cooling tube to vice coolant liquid can the absorbed heat in the vaporization of vice evaporation zone, can release the heat in the liquefaction of vice condensation segment, thereby can realize transmitting the heat of vice evaporation zone to vice condensation segment, and then make heating element can realize the heat dissipation through vice cooling tube.

In one embodiment, the heat dissipation pipe is a flat strip. The radiating pipe in the embodiment is in a flat strip shape, which can increase the contact area between the radiating pipe and the fan and between the radiating pipe and the heating element, thereby further improving the radiating efficiency of the electronic device. In addition, the size of the radiating pipe in the Z direction can be reduced, so that the thickness of the electronic equipment can be reduced, and the electronic equipment is light and thin.

In a second aspect, the present application provides a method for manufacturing an electronic device, for manufacturing the electronic device, including:

providing a fan and a heating element;

providing a pipe body, wherein the pipe body comprises a first section and a second section which are connected in sequence;

extruding the first section to reduce the first section inner diameter to form a first base pipe;

welding a port of the first base pipe, and closing the first base pipe to obtain a second base pipe;

and pressing the first base pipe to be in a flat strip shape in a direction perpendicular to the length extension direction of the second base pipe to obtain the radiating pipe.

The second section of cooling tube with heating element stacks up the setting, and with heating element contact, first section with the fan is connected, and with the fan contact.

In the embodiment, the inner diameter of the radiating pipe can be changed through the pipe reducing process to prepare the reducing radiating pipe, and the manufacturing process is simple. Through connecting heating element and fan with the cooling tube, can realize giving the fan with the heat transmission that heating element produced, then transmit to the external world by the fan to realize heating element's heat dissipation. In addition, the diameter of the first section of the radiating pipe is reduced, and the first section with the smaller diameter is arranged at one side of the fan, so that the space near the fan can be saved. Meanwhile, the diameter of the second section connected with the heating element is larger, so that influence on heat exchange between the second section and the heating element can be avoided.

In one embodiment, the outer contour of the pipe body is circular, the diameter of the first section of the first base pipe is smaller than the diameter of the second section of the second base pipe, and the difference between the diameter of the first section of the first base pipe and the diameter of the second section of the second base pipe is greater than 0 and less than or equal to 4 mm.

In this example, the diameter of the first section before compression was 8mm, and the diameter of the first section after compression was 4 mm. Alternatively, the diameter of the first section before compression is 8mm, and the diameter of the first section after compression is more than 4mm and less than 8 mm. In other embodiments, the diameter of the first section before compression is 10mm and the diameter of the first section after compression is 6 mm. Alternatively, the diameter of the first section before compression is 10mm, and the diameter of the first section after compression is more than 6mm and less than 10 mm.

In one embodiment, the pipe body further includes a third section, the third section and the first section being connected to opposite ends of the second section, respectively, "extruding the first section to reduce the inner diameter of the first section to form the first base pipe" further includes, after extruding the first section, extruding the third section to reduce the inner diameter of the third section to form the first base pipe. The manufacturing method further comprises the step of providing an auxiliary fan, wherein the third section is connected with the auxiliary fan and is in contact with the auxiliary fan.

In the embodiment, the radiating pipe with the width at two ends smaller than the width in the middle is prepared through the two pipe reducing processes, the manufacturing process is simple, and the effect of saving resources is achieved. And, through connecting heating element and fan with the cooling tube to heating element and auxiliary fan, can realize giving fan and auxiliary fan with the heat that heating element produced simultaneously, then transmit to the external world by fan and auxiliary fan, thereby realize heating element's heat dissipation, can further improve electronic equipment's heat dispersion. In addition, the diameters of the first section and the third section of the radiating pipe are reduced, the first section with the smaller diameter is arranged on one side of the fan, the space near the fan can be saved, and the third section with the smaller diameter is arranged on one side of the auxiliary fan, so the space near the auxiliary fan can be saved. Meanwhile, the diameter of the second section connected with the heating element is larger, so that influence on heat exchange between the second section and the heating element can be avoided.

In one embodiment, the manufacturing method further comprises:

providing an auxiliary fan;

providing a secondary pipe body, wherein the secondary pipe body comprises a first secondary section and a second secondary section; extruding the first sub-section to reduce the inner diameter of the first sub-section to form a first sub-base pipe;

welding the port of the first secondary base pipe to close the first secondary base pipe to obtain a second secondary base pipe;

and pressing the second auxiliary base pipe to be in a flat strip shape in a direction perpendicular to the length extending direction of the second auxiliary base pipe to obtain an auxiliary radiating pipe.

The second sub-section of the auxiliary radiating pipe is stacked with the heating element and is in contact with the heating element, and the first sub-section is connected with the auxiliary fan and is in contact with the auxiliary fan.

In this embodiment, through setting up cooling tube and vice cooling tube to with cooling tube connection heating element and fan, heating element and auxiliary fan are connected to vice cooling tube, make the heat that heating element produced can transmit simultaneously for fan and auxiliary fan, then transmit the external world by fan and auxiliary fan, thereby realize heating element's heat dissipation, can further improve electronic equipment's heat dispersion. In addition, the diameter of the first section of the radiating pipe is reduced, and the first section with the smaller diameter is arranged at one side of the fan, so that the space near the fan can be saved. The diameter of the first sub-section of the sub-radiating pipe is reduced, and the first sub-section with the smaller diameter is arranged on one side of the auxiliary fan, so that the space near the auxiliary fan can be saved. Meanwhile, the diameters of the second section and the second auxiliary section connected with the heating element are large, so that influence on heat exchange between the second section and the second auxiliary section and the heating element can be avoided.

In conclusion, in this application, through setting up the cooling tube to connect heating element and fan with the cooling tube, thereby can transmit heating element's heat to the fan and then transmit to the external world, in order to realize heating element's heat dissipation, avoid heating element overheated to cause the influence to its performance. And, the cooling tube width that this embodiment provided is different, set up the width that is less than the evaporation zone through the width with the condensation zone, and locate fan one side with the less condensation zone of width, heating element one side is located to the great evaporation zone of width, thereby can play the effect of practicing thrift near fan space, simultaneously, because the evaporation zone width is great, thereby can avoid causing the influence to the heat exchange between evaporation zone and the heating element, and then can avoid causing the influence to electronic equipment's radiating efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

FIG. 2 is a partial structural diagram of a host in the electronic device shown in FIG. 1 in a first implementation;

FIG. 3 is a schematic structural diagram of a fan in the electronic device shown in FIG. 2;

fig. 4 is an enlarged structural view of a heat dissipating pipe in the electronic device shown in fig. 2;

FIG. 5 is an exploded view of the heat pipe shown in FIG. 4;

fig. 6 is a schematic partial structural diagram of an electronic device according to a second embodiment of the present application;

fig. 7 is an enlarged structural view of a heat dissipating pipe in the electronic apparatus shown in fig. 6;

FIG. 8 is an exploded view of the heat pipe shown in FIG. 7;

fig. 9 is a schematic partial structural diagram of an electronic device according to a third embodiment of the present application;

FIG. 10 is a schematic diagram of a portion of the electronic device shown in FIG. 9;

fig. 11 is an exploded view of the sub-radiator of fig. 10;

FIG. 12 is a flow chart for preparing the electronic device of FIG. 2;

FIG. 13 is a schematic structural view of a mold used to make the first base pipe of FIG. 12;

FIG. 14 is a flow chart of a manufacturing process for the electronic device of FIG. 6;

fig. 15 is a flow chart of the preparation of the electronic device shown in fig. 9.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

Referring to fig. 1, fig. 1 is a schematic view of a partial structure of an electronic device 100 according to an embodiment of the present disclosure.

The electronic device 100 includes, but is not limited to, a mobile phone (cellular phone), a notebook computer (notebook computer), a tablet computer (tablet personal computer), a laptop computer (laptop computer), a personal digital assistant (personal digital assistant), a wearable device (wearable device), or a vehicle-mounted device (mobile device). In the embodiment of the present application, the electronic device 100 is taken as a notebook computer as an example for description.

For convenience of description, the width direction of the electronic apparatus 100 is defined as the X direction, the length direction is defined as the Y direction, and the thickness direction is defined as the Z direction. The X direction, the Y direction and the Z direction are mutually vertical in pairs.

The electronic device 100 includes a host 110, a display 120, and a rotation mechanism 130. The host 110 is used to execute information, and the display 120 is used to display the result of information processing performed by the host 110. The rotating mechanism 130 connects the host 110 and the display 120, so that the display 120 can be turned over relative to the host 110, and the display 120 can be opened or closed relative to the host 110, thereby opening and closing the electronic device 100. Illustratively, the rotating mechanism 130 is a rotating shaft. The edge of the display 120 is connected to the rotating mechanism 130, the edge of the host 110 is provided with a rotating groove matched with the rotating mechanism 130, and the rotating mechanism 130 is installed in the rotating groove and can rotate in the rotating groove, so that the display 120 can be opened and closed relative to the host 110.

Referring to fig. 2, fig. 2 is a partial structural schematic diagram of the host 110 in the electronic device 100 of fig. 1 in a first implementation.

The host 110 includes a housing 10, a heat generating element 20, and a heat dissipating module 1. The heat dissipation module 1 includes a fan 30 and a heat dissipation pipe 40. The heat dissipation module 1 and the heat generating element 20 are both installed in the housing 10, the fan 30 and the heat generating element 20 are disposed at an interval, the heat dissipation pipe 40 and the heat generating element 20 are stacked, and one end of the heat dissipation pipe 40 contacts the heat generating element 20 and the other end contacts the fan 30. The heat generated by the heating element 20 is transmitted to the fan through the heat pipe 40, and then transmitted to the outside through the fan 30, so as to dissipate the heat of the heating element 20.

The housing 10 includes a top plate, a bottom plate (not shown), a first side plate 11, a second side plate 12, a third side plate 13, and a fourth side plate 14. The top plate and the bottom plate are arranged oppositely and at intervals. The first side plate 11 and the second side plate 12 are disposed oppositely, and the length directions of the first side plate 11 and the second side plate 12 are both parallel to the X direction. The first side plate 11 and the second side plate 12 are both fixedly connected with the bottom plate. The third side plate 13 and the fourth side plate 14 are disposed opposite to each other, and the length direction of the third side plate 13 and the fourth side plate 14 is parallel to the Y direction. The third side plate 13 and the fourth side plate 14 are both fixedly connected with the bottom plate and connected between the first side plate 11 and the second side plate 12. That is, the first side panel 11, the third side panel 13, the second side panel 12 and the fourth side panel 14 are connected end to end, surround the bottom panel, and are connected between the bottom panel and the top panel. The bottom plate, the top plate, the first side plate 11, the second side plate 12, the third side plate 13 and the fourth side plate 14 together enclose to form an accommodating space 15.

The bottom plate is provided with a first opening (not shown) which penetrates through the bottom plate and communicates the accommodating space 15 with the external environment. The first opening may be one or a plurality of openings. The first side plate 11 is provided with a second opening 111. The second opening 111 penetrates the first side plate 11 and communicates the accommodating space 15 with the external environment. The second opening 111 may be one or a plurality of openings.

The electronic apparatus 100 includes a heating element 20, an electronic component 21, and a battery 22. The heating element 20, the electronic component 21 and the battery 22 are all mounted in the housing space 15 and are fixedly connected to the housing 10. The battery 22 is located at a side of the accommodating space 15 close to the second side plate 12. The battery 22 is used for storing power and providing power to the electronic device 100. The electronic component 21 is arranged side by side with the battery 22, and the electronic component 21 is located in the positive Y-axis direction of the battery 22. That is, the electronic component 21 is mounted between the battery 22 and the first side plate 11. The electronic components 21 include, but are not limited to, a memory card, a hard disk, a video card, a network card, and the like. The heating element 20 is located at a side of the accommodating space 15 close to the first side plate 11, and the heating element 20, the electronic component 21 and the battery 22 are arranged side by side. In the present embodiment, the heating element 20 is a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), or other devices.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the fan 30 in the electronic device 100 shown in fig. 2.

The fan 30 includes a fan body 31, fan blades 32, and a heat sink 33. The fan blades 32 are mounted on the fan body 31 and rotatably connected to the fan body 31. The fan 30 further includes an intake opening 301 and an exhaust opening 302. The air inlet 301 is used for air to enter the fan 30, and the air outlet 302 is used for exhausting the air in the fan 30. The heat sink 33 is made of copper. In other embodiments, the heat dissipation element 33 may also be made of aluminum or other metals, or may also be made of thermally conductive silicone. The heat sink 33 is installed at the air outlet 302 of the fan body 31, and is in contact with and fixedly connected to the fan body 31. In this embodiment, the heat sink 33 is fixedly connected to the fan body 31 by welding.

The fan 30 is installed in the accommodating space 15, and is arranged in parallel with and spaced apart from the heating element 20, and the fan 30 is located between the heating element 20 and the third side plate 13. The air inlet 301 is disposed opposite to the first opening, and the air outlet 302 is disposed opposite to the second opening 111. The external air enters the accommodating space 15 through the first opening, enters the fan 30 through the air inlet 301, exchanges heat with the fan 30, and then is discharged from the air outlet 302 through the second opening 111 after exchanging heat with the fan 30 under the rotation of the fan blades 32, and is discharged out of the accommodating space 15 through the second opening 111, so that heat dissipation is realized. Also, the heat sink 33 may exchange heat with the fan body 31 and transmit the heat to the fan body 31, and then the heat of the fan body 31 is transmitted to the external environment through the air flow by the rotation of the fan blades 32. Meanwhile, the heat sink 33 may also directly exchange heat with air, and the heat exchanged air is exhausted to the external environment under the rotation of the fan blades 32, thereby achieving the heat dissipation of the heat sink 33.

In one embodiment, the heat sink 33 includes a body and a plurality of heat dissipating fins (not shown). The radiating fins are connected with the body and are vertical to the body. The plurality of radiating fins are arranged at intervals along the extending direction of the body. The heat sink 33 is installed at the air outlet 302 of the fan body 31, and is in contact with and fixedly connected to the fan body 31. In the present embodiment, the heat dissipation efficiency of the heat dissipation member 33 can be improved by providing the heat dissipation member 33 having a plurality of heat dissipation fins so as to increase the contact area between the heat dissipation member 33 and the air and the contact area between the heat dissipation member 33 and the fan body 31. Of course, the heat sink 33 may be a rectangular metal body.

Referring to fig. 4 and 5 together, fig. 4 is an enlarged schematic view illustrating a heat dissipation tube 40 of the electronic apparatus 100 shown in fig. 2, and fig. 5 is an exploded schematic view illustrating the heat dissipation tube 40 shown in fig. 4, wherein the capillary structure 402 is not shown in fig. 5.

The heat pipe 40 has a hollow flat tubular structure, and the heat pipe 40 has a curved outer contour, i.e. a curved extension in the length direction. In practice, the radiating pipe 40 is formed by flattening a circular pipe. The radiating pipe 40 has a rectangular or oval cross-section with four corners having arc-shaped chamfers. The pipe diameter of the radiating pipe 40 can be understood as the size of the radiating pipe 40 in the width direction. That is, the size of the side having the larger size in the cross section of the radiating pipe 40. The thickness of the radiating pipe 40 is the size of the side having the smaller size in the cross section of the radiating pipe 40. The heat dissipating pipe 40 is provided therein with a heat dissipating passage 401. In this embodiment, the heat dissipation tube 40 is made of copper. In other embodiments, the material of the heat dissipation tube 40 may also be carbon fiber. The radiating pipe 40 made of copper or carbon fiber has excellent heat conductive performance. In other embodiments, the material of the heat dissipation tube 40 may also be graphene or graphite sheet.

The radiating pipe 40 includes an evaporating section 41, a transition section 42, an adiabatic section 43, and a condensing section 44. The evaporation section 41, the transition section 42, the adiabatic section 43 and the condensation section 44 are connected in sequence. In this embodiment, the outer contour of the evaporation section 41 is circular arc, and the length direction of the evaporation section 41 is consistent with the length direction of the circular arc. In other embodiments, the outer contour of the evaporation section 41 may also be rectangular. The width of the evaporation section 41 is uniform. The evaporation stage 41 is provided with a first heat dissipation channel 411. The first heat dissipation channel 411 includes a first opening 412. The extending direction of the first heat dissipation channel 411 is the same as the extending direction of the evaporation section 41, and the first opening 412 penetrates through one end of the evaporation section 41. That is, one end of the evaporation section 41 is closed, and the other end is provided with the first opening 412.

The transition section 42 includes a first end 421 and a second end 422, the first end 421 is disposed opposite to the second end 422, and the width of the transition section 42 in the direction from the first end 421 to the second end 422 is gradually reduced. The transition section 42 is provided with a second heat dissipation channel 423. The extending direction of the second heat dissipation channel 423 is the same as the extending direction of the transition section 42, and the second heat dissipation channel 423 penetrates the transition section 42 in the extending direction thereof. The first end 421 of the transition section 42 is fixedly connected to the end of the evaporation section 41 provided with the first opening 412, the first opening 412 faces the transition section 42, and the first heat dissipation channel 411 is communicated with the second heat dissipation channel 423. The width of the first end 421 is the same as the width of the evaporation section 41, and the size of the transition section 42 at other positions except the first end 421 is larger than the size of the evaporation section 41, and of course, the width of the first end 421 may have a small deviation from the width of the evaporation section 41. That is, the width of the evaporation section 41 is greater than the entire width of the transition section 42.

The outer contour of the heat insulating section 43 is arc-shaped, the length direction of the heat insulating section 43 is consistent with the length direction of the arc, and the bending direction of the heat insulating section 43 is opposite to the bending direction of the evaporation section 41. The heat insulating section 43 is provided with a third heat dissipation channel 431, and the extension direction of the third heat dissipation channel 431 is consistent with the extension direction of the heat insulating section 43. The third heat dissipation channel 431 penetrates the heat insulation section 43 in the extending direction thereof. One end of the adiabatic section 43 is fixedly connected to the second end 422 of the transition section 42, and the third heat dissipation channel 431 is communicated with the second heat dissipation channel 423. The width of the adiabatic section 43 coincides with the width of the second end 422 of the transition section 42. Of course, the width of the insulated segments 43 may also deviate by a small amount from the width of the second end 422. It will be appreciated that the width of the insulated segments 43 is less than or equal to the width of the transition segments 42, i.e., the width of the insulated segments 43 is less than the overall width of the transition segments 42. And, the width of the adiabatic section 43 is smaller than that of the evaporation section 41.

In this embodiment, the condensation section 44 has a rectangular outer contour. In other embodiments, the outer contour of the condensation section 44 may also be curved, or other shapes. The width of the condensation section 44 coincides with the width of the adiabatic section 43. The condensation section 44 is provided with a fourth heat dissipation channel 441. The fourth heat dissipation channel 441 includes a second opening 442. The extending direction of the fourth heat dissipation channel 441 is the same as the extending direction of the condensation section 44, and the second opening 442 penetrates through one end of the condensation section 44. That is, one end of the condensing section 44 is closed, and the other end is provided with the second opening 442. The end of the condensation section 44 provided with the second opening 442 is fixedly connected with the end of the heat insulation section 43 opposite to the transition section 42, the second opening 442 faces the heat insulation section 43, and the fourth heat dissipation channel 441 is communicated with the third heat dissipation channel 431.

In this embodiment, the heat dissipation tube 40 is an integrally formed member. The evaporation section 41, the transition section 42, the heat insulation section 43 and the condensation section 44 are connected in sequence to form the heat radiation pipe 40. The first heat dissipation channel 411, the second heat dissipation channel 423, the third heat dissipation channel 431 and the fourth heat dissipation channel 441 are sequentially communicated to jointly form the heat dissipation channel 401 of the heat dissipation tube 40, and two opposite ends of the heat dissipation channel 401 in the extending direction are closed. Wherein, the width of the evaporation section 41 is larger than the whole width of the transition section 42, the width of the heat insulation section 43 and the condensation section 44 is smaller than the whole width of the transition section 42, and the width of the condensation section 44 and the heat insulation section 43 are both smaller than the width of the evaporation section 41.

In this embodiment, by providing the transition section 42 and setting the transition section 42 to be a shape with gradually changing width, the width of the evaporation section 41 to the condensation section 44 can be smoothly transited, so as to avoid liquefaction of the cooling liquid caused by sudden change of width, thereby affecting the heat dissipation performance of the heat dissipation pipe 40.

Referring to fig. 4, the heat dissipation tube 40 further includes a capillary structure 402. In this embodiment, the capillary structure 402 is formed by sintering a powder. In other embodiments, the capillary structure 402 may also be fibrous, or mesh-like, or groove-like. The capillary structure 402 is located in the radiating passage 401 and is fixedly connected to the inner wall of the radiating pipe 40. Specifically, the capillary structure 402 is a continuous structure, and the capillary structure 402 extends from the evaporation section 41 to the condensation section 44 along the transition section 42 and the heat insulation section 43.

The heat dissipation module 1 further includes a cooling liquid (not shown). In this embodiment, the coolant is pure water. In other embodiments, the cooling liquid may be other liquid with large specific heat capacity and high thermal conductivity. The cooling fluid is filled in the radiating pipe 40. The cooling liquid can be vaporized in the evaporation section 41 to be converted into a gas-phase cooling liquid, and then enters the condensation section 44, and then is liquefied in the condensation section 44 to release heat, and is converted into a liquid-phase cooling liquid, and then the liquid-phase cooling liquid flows back to the evaporation section 41 along the capillary structure 402. In this way, during the vaporization-liquefaction cycle of the cooling liquid, the heat of the evaporation section 41 can be transferred to the condensation section 44 to achieve heat dissipation of the evaporation section 41.

Wherein, the volume of the cooling liquid is 0.1% -10% of the volume of the heat dissipation channel 401. On one hand, enough cooling liquid in the radiating pipe 40 completes the vaporization-liquefaction cycle to transfer the heat of the evaporation section 41 to the condensation section 44, and at the same time, enough space is provided for the vaporized gas-phase cooling liquid in the evaporation section 41 to enter the condensation section 44.

Referring to fig. 2, the heat pipe 40 is installed in the receiving space 15. The evaporation stage 41 is stacked on the heating element 20, and is fixedly connected to and in contact with the heating element 20. The condensation section 44 is fixedly connected to the heat sink 33 and is in contact with the heat sink 33. The heat insulating section 43 and the transition section 42 are located between the heat sink 33 and the heat generating element 20.

When the heat generating element 20 works, heat is generated and transferred to the evaporation section 41 of the heat dissipating tube 40, so that the temperature of the evaporation section 41 is increased, the liquid-phase cooling liquid in the first heat dissipating channel 411 is heated and vaporized and converted into a gas-phase cooling liquid, and the gas-phase cooling liquid flows from the first heat dissipating channel 411 along the second heat dissipating channel 423 into the third heat dissipating channel 431 and the fourth heat dissipating channel 441. The gas-phase coolant entering the third heat dissipation channel 431 and the fourth heat dissipation channel 441 is liquefied and converted into liquid-phase coolant while encountering the heat insulation section 43 and the condensation section 44 having lower temperatures. The vapor phase cooling liquid releases heat when the condensing section 44 is liquefied, and transfers the heat to the condensing section 44. After the temperature of the condensation section 44 rises, the condensation section is in heat exchange with the heat sink 33 and transmits heat to the heat sink 33, a part of the heat in the heat sink 33 is directly transmitted to the surrounding air and exhausted to the outside under the action of the fan 30, a part of the heat is transmitted to the fan body 31 through the heat sink 33 and then exchanges heat with the surrounding air of the fan body 31, and meanwhile, the gas absorbing the heat is exhausted to the outside under the action of the fan 30, so that the heat is exhausted to the outside, and the heat dissipation effect is achieved.

The liquid-phase coolant liquefied in the condensation section 44 flows in the direction of the evaporation section 41 along the capillary structure 402 by capillary force, and the liquid-phase coolant flowing from the condensation section 44 to the evaporation section 41 continues to absorb heat in the evaporation section 41 and vaporize, and is converted into a gas-phase coolant. The gaseous phase coolant then enters the condenser section 44 and liquefies to release heat and convert it to a liquid phase coolant. In the continuous vaporization-liquefaction cycle process, the heat absorption-heat release cycle is completed to achieve the effect of heat transfer, so that the heat of the evaporation section 41 is continuously transmitted to the condensation section 44, and is transmitted to the external environment from the condensation section 44 through the heat dissipation member 33 and the fan 30, thereby realizing the heat dissipation of the heating element 20.

It should be noted that, when the evaporation rate of the cooling liquid in the evaporation section 41 is greater than the return rate of the capillary structure 402, the cooling liquid in the condensation section 44 flows along the capillary structure 402 toward the evaporation section 41 under the action of the capillary force generated by the capillary structure 402 to compensate the cooling liquid in the evaporation section 41, so that the cooling liquid in the evaporation section 41 can be continuously vaporized to absorb heat, thereby performing a heat dissipation function to reduce the temperature of the heat generating element 20.

In this embodiment, by providing the heat dissipation pipe 40 and connecting the heat dissipation pipe 40 to the heating element 20 and the heat dissipation member 33, the heat of the heating element 20 can be transmitted to the heat dissipation member 33 and the fan 30 and then transmitted to the outside, so as to dissipate the heat of the heating element 20 and prevent the overheating of the heating element 20 from affecting the performance of the heating element. The width of the heat dissipation pipe 40 provided by the embodiment is different, the width of the condensation section 44 is set to be smaller than that of the evaporation section 41, the condensation section 44 with smaller width is arranged on one side of the fan 30, the evaporation section 41 with larger width is arranged on one side of the heating element 20, so that the volume of the heat dissipation module 1 can be saved, namely, the space occupied by the heat dissipation member 33 and the fan 30 is reduced, and meanwhile, the width of the evaporation section 41 is larger, so that the influence on the heat exchange between the evaporation section 41 and the heating element 20 can be avoided, and further the influence on the heat dissipation efficiency of the electronic device 100 can be avoided. Moreover, the heat dissipation tube 40 in the present embodiment is a flat strip shape, which can increase the contact area between the heat dissipation tube 40 and the fan 30 and between the heat dissipation tube 40 and the heat generating element 20, and reduce the heat flux density, thereby further improving the heat dissipation efficiency of the electronic device 100. In addition, the dimension of the heat pipe 40 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a portion of an electronic device 100 according to a second embodiment of the present application.

The difference from the embodiment shown in fig. 2 is that the bottom plate is provided with a third opening, which is spaced apart from the first opening 412. The third opening penetrates the bottom plate and communicates the accommodating space 15 with the external environment. The third opening may be one or a plurality of openings. The first side plate 11 is provided with a fourth opening 112, and the fourth opening 112 and the second opening 111 are spaced apart. The fourth opening 112 penetrates the first side plate 11 and communicates the accommodating space 15 with the external environment. The number of the fourth holes may be one or more.

The heat dissipation module 1 further includes an auxiliary fan 50, and the structure of the auxiliary fan 50 is the same as that of the fan 30. The auxiliary fan 50 includes an auxiliary fan body 51, auxiliary fan blades 52, and an auxiliary heat sink 53. The auxiliary fan blades 52 are mounted on the auxiliary fan body 51 and rotatably connected to the auxiliary fan body 51. The auxiliary heat sink 53 is installed at an air outlet of the auxiliary fan 50, and is in contact with and fixedly connected to the auxiliary fan 50. The auxiliary fan 50 is installed in the accommodating space 15, and is arranged side by side with and spaced from the heating element 20, and the auxiliary fan 50 is located between the heating element 20 and the fourth side plate 14. That is, the fan 30 and the auxiliary fan 50 are respectively located at opposite sides of the heat generating element 20. The air inlet of the auxiliary fan 50 is opposite to the third opening, and the air outlet of the auxiliary fan 50 is opposite to the fourth opening 112.

The external air enters the accommodating space 15 through the third opening, enters the auxiliary fan 50 through the air inlet of the auxiliary fan 50, exchanges heat with the auxiliary fan 50, and then is discharged from the air outlet of the auxiliary fan 50 through the fourth opening 112 after exchanging heat with the auxiliary fan 50 under the rotation of the auxiliary fan blades 52, so as to achieve heat dissipation. Also, the auxiliary heat sink 53 may exchange heat with the auxiliary fan body 51 and transfer the heat to the auxiliary fan body 51, and then transfer the heat to the external environment through the air flow by the rotation of the auxiliary fan blades 52. Meanwhile, the auxiliary heat sink 53 may also directly exchange heat with air and be exhausted to the external environment, thereby achieving heat dissipation of the auxiliary heat sink 53.

Referring to fig. 7 and 8, fig. 7 is an enlarged structural diagram of the heat dissipation tube 40 in the electronic device 100 shown in fig. 6, and fig. 8 is an exploded structural diagram of the heat dissipation tube 40 shown in fig. 7, wherein the capillary structure 402 is not shown in fig. 8.

The radiating pipe 40 has a horn-shaped structure with a flat strip-like outer contour. In other embodiments, the heat dissipation pipe 40 may have a "C" shape, a "Z" shape, or other shapes. Specifically, the radiating pipe 40 includes an evaporating section 41, a transition section 42, an adiabatic section 43, a condensing section 44, an auxiliary transition section 45, an auxiliary adiabatic section 46, and an auxiliary condensing section 47. The outer contour of the evaporation section 41 is circular arc, and the width of the evaporation section 41 is uniform. A first heat dissipation channel 411 is disposed in the evaporation section 41. The extending direction of the first heat dissipation channel 411 is the same as the extending direction of the evaporation section 41. The first heat dissipation channel 411 penetrates the evaporation section 41 in the extending direction thereof.

The transition section 42 includes a first end 421 and a second end 422, the first end 421 is disposed opposite to the second end 422, and the width of the transition section 42 in the direction from the first end 421 to the second end 422 is gradually reduced. The transition section 42 is provided with a second heat dissipation channel 423. The extending direction of the second heat dissipation channel 423 is the same as the extending direction of the transition section 42, and the second heat dissipation channel 423 penetrates the transition section 42 in the extending direction thereof. The first end 421 of the transition section 42 is fixedly connected to one end of the evaporation section 41, and the first heat dissipation channel 411 is communicated with the second heat dissipation channel 423. The width of the first end 421 is the same as the width of the evaporation section 41, and the size of the transition section 42 is larger than that of the evaporation section 41 except the first end 421. Of course, the width of the first end 421 may also deviate from the width of the evaporation section 41 by a small amount. That is, the width of the evaporation section 41 is greater than the entire width of the transition section 42.

The width of the adiabatic section 43 is uniform, and the width of the adiabatic section 43 is smaller than the width of the evaporation section 41. The heat insulating section 43 is provided with a third heat dissipation channel 431, and the extension direction of the third heat dissipation channel 431 is consistent with the extension direction of the heat insulating section 43. The third heat dissipation channel 431 penetrates the heat insulation section 43 in the extending direction thereof. One end of the adiabatic section 43 is fixedly connected to the second end 422 of the transition section 42, and the third heat dissipation channel 431 is communicated with the second heat dissipation channel 423. The width of the adiabatic section 43 coincides with the width of the second end 422 of the transition section 42. Of course, the width of the insulated segments 43 may also deviate by a small amount from the width of the second end 422. It will be appreciated that the width of the insulated segments 43 is less than or equal to the width of the transition segments 42, i.e., the width of the insulated segments 43 is less than the overall width of the transition segments 42. And, the width of the adiabatic section 43 is smaller than that of the evaporation section 41.

The condensation section 44 is provided with a fourth heat dissipation channel 441. The fourth heat dissipation channel 441 includes a second opening 442. The extending direction of the fourth heat dissipation channel 441 is the same as the extending direction of the condensation section 44, and the second opening 442 penetrates through one end of the condensation section 44. That is, one end of the condensing section 44 is closed, and the other end is provided with the second opening 442. The end of the condensation section 44 provided with the second opening 442 is fixedly connected with the end of the heat insulation section 43 opposite to the transition section 42, the second opening 442 faces the heat insulation section 43, and the fourth heat dissipation channel 441 is communicated with the third heat dissipation channel 431. The width of the condensation section 44 coincides with the width of the adiabatic section 43.

The auxiliary transition section 45 includes a third end 451 and a fourth end 452, the third end 451 is opposite to the fourth end 452, and the width of the auxiliary transition section 45 gradually decreases from the third end 451 to the fourth end 452. The auxiliary transition section 45 is provided with a fifth heat dissipation channel 453. The fifth heat dissipation channel 453 extends in the same direction as the auxiliary transition section 45, and the fifth heat dissipation channel 453 penetrates the transition section 42 in the extending direction thereof. The first end 421 of the auxiliary transition section 45 is fixedly connected to the end of the evaporation section 41 opposite to the transition section 42, and the fifth heat dissipation channel 453 is communicated with the first heat dissipation channel 411. The auxiliary transition section 45 extends in the opposite direction to the transition section 42. The width of the third end 451 corresponds to the width of the evaporation section 41. The auxiliary transition section 45 is larger than the evaporation section 41 except for the third end 451. Of course, the width of the third end 451 may also deviate by a small amount from the width of the evaporation section 41. That is, the width of the evaporation section 41 is greater than the entire width of the auxiliary transition section 45.

The width of the auxiliary adiabatic section 46 is uniform, and the width of the auxiliary adiabatic section 46 is smaller than the width of the evaporation section 41. The auxiliary heat insulating section 46 is provided with a sixth heat dissipation channel 461, and the extension direction of the sixth heat dissipation channel 461 coincides with the extension direction of the auxiliary heat insulating section 46. The sixth heat dissipation channel 461 penetrates the auxiliary heat insulation section 46 in the extending direction thereof. One end of the auxiliary heat insulating section 46 is fixedly connected to the fourth end 452 of the auxiliary transition section 45, and the fifth heat dissipating channel 453 is in communication with the sixth heat dissipating channel 461. The auxiliary adiabatic segment 46 extends in the direction opposite to the direction in which the adiabatic segment 43 extends. The width of the auxiliary insulating segments 46 corresponds to the width of the fourth end 452. Of course, the width of the auxiliary insulating segments 46 may also deviate slightly from the width of the fourth end 452. It will be appreciated that the width of the auxiliary insulating section 46 is less than or equal to the width of the auxiliary transition section 45, and the width of the insulating section 46 is less than the width of the evaporating section 41. That is, the width of the auxiliary adiabatic section 46 is smaller than the entire width of the auxiliary transition section 45.

The auxiliary condensing section 47 is provided with a seventh heat discharging passage 471. The seventh heat dissipation channel 471 includes a third opening 472. The seventh heat dissipation channel 471 extends in the same direction as the auxiliary condensation section 47, and the third opening 472 penetrates through one end of the auxiliary condensation section 47. That is, one end of the auxiliary condensing section 47 is closed, and the other end is provided with a third opening 472. One end of the auxiliary condensing section 47, which is provided with a third opening 472, is fixedly connected to one end of the auxiliary heat insulation section 46, which faces away from the auxiliary transition section 45, the third opening 472 faces the auxiliary heat insulation section 46, and the seventh heat dissipation channel 471 is communicated with the sixth heat dissipation channel 461. The auxiliary condensation section 47 extends in the opposite direction to the condensation section 44.

In this embodiment, the heat dissipation tube 40 is an integrally formed member. The condensation section 44, the heat insulation section 43, the transition section 42, the evaporation section 41, the auxiliary transition section 45, the auxiliary heat insulation section 46 and the auxiliary condensation section 47 are sequentially connected to form the heat dissipation pipe 40. The fourth heat dissipation channel 441, the third heat dissipation channel 431, the second heat dissipation channel 423, the first heat dissipation channel 411, the fifth heat dissipation channel 453, the sixth heat dissipation channel 461 and the seventh heat dissipation channel 471 are sequentially communicated to jointly form the heat dissipation channel 401 of the heat dissipation tube 40, and the opposite ends of the heat dissipation channel 401 in the extending direction are closed. Wherein, the width of the evaporation section 41 is larger than the whole width of the transition section 42, the width of the heat insulation section 43 and the condensation section 44 is smaller than the whole width of the transition section 42, and the width of the condensation section 44 and the heat insulation section 43 are both smaller than the width of the evaporation section 41. Moreover, the width of the evaporation section 41 is greater than the entire width of the auxiliary transition section 45, the widths of the auxiliary heat insulation section 46 and the auxiliary condensation section 47 are less than the entire width of the auxiliary transition section 45, and the widths of the auxiliary condensation section 47 and the auxiliary heat insulation section 46 are both less than the width of the evaporation section 41.

Referring to fig. 7, the capillary structure 402 is located in the heat dissipation channel 401 and is fixedly connected to the inner wall of the heat dissipation tube 40. Specifically, the capillary structure 402 is a continuous structure, and one end of the capillary structure 402 extends from the evaporation section 41 to the condensation section 44 along the transition section 42 and the heat insulation section 43, and the other end extends from the evaporation section 41 to the auxiliary condensation section 47 along the auxiliary transition section 45 and the auxiliary heat insulation section 46.

The radiating pipe 40 is filled with a cooling liquid (not shown). The cooling liquid can be vaporized in the evaporation section 41 to be converted into a gas-phase cooling liquid, and then enters the condensation section 44 and the auxiliary condensation section 47, and then is liquefied in the condensation section 44 and the auxiliary condensation section 47 to release heat, and is converted into a liquid-phase cooling liquid, and then the liquid-phase cooling liquid flows back to the evaporation section 41 along the capillary structure 402. In this way, during the vaporization-liquefaction cycle of the cooling liquid, the heat of the evaporation section 41 can be transferred to the condensation section 44 and the auxiliary condensation section 47 to achieve heat dissipation of the evaporation section 41.

Referring to fig. 6, the heat dissipation tube 40 is installed in the accommodating space 15, and the evaporation section 41 is stacked with the heating element 20 and is fixedly connected and contacted with the heating element 20. The condensation section 44 is fixedly connected to the heat sink 33 and is in contact with the heat sink 33. The heat insulating section 43 and the transition section 42 are located between the heat sink 33 and the heat generating element 20. The auxiliary condensation section 47 is fixedly connected to the auxiliary heat sink 53 and is in contact with the auxiliary heat sink 53. The auxiliary heat insulating section 46 and the auxiliary transition section 45 are located between the auxiliary heat sink 53 and the heat generating element 20.

When the heat generating element 20 works, heat is generated and transferred to the evaporation section 41 of the heat dissipating pipe 40, so that the temperature of the evaporation section 41 is raised, the liquid-phase cooling liquid in the first heat dissipating passage 411 is heated and vaporized and converted into a gas-phase cooling liquid, a part of the gas-phase cooling liquid enters the third heat dissipating passage 431 and the fourth heat dissipating passage 441 from the first heat dissipating passage 411 along the second heat dissipating passage 423, and a part of the gas-phase cooling liquid enters the sixth heat dissipating passage 461 and the fourth heat dissipating passage 441 from the first heat dissipating passage 411 along the fifth heat dissipating passage 453.

The gas-phase coolant entering the third heat dissipation channel 431 and the fourth heat dissipation channel 441 is liquefied and converted into liquid-phase coolant while encountering the heat insulation section 43 and the condensation section 44 having lower temperatures. The vapor phase cooling liquid releases heat when the condensing section 44 is liquefied, and transfers the heat to the condensing section 44. After the temperature of the condensation section 44 rises, the condensation section is in heat exchange with the heat sink 33 and transmits heat to the heat sink 33, a part of the heat in the heat sink 33 is directly transmitted to the surrounding air and exhausted to the outside under the action of the fan 30, a part of the heat is transmitted to the fan body 31 through the heat sink 33 and then exchanges heat with the surrounding air of the fan body 31, and meanwhile, the gas absorbing the heat is exhausted to the outside under the action of the fan 30, so that the heat is exhausted to the outside, and the heat dissipation effect is achieved.

The gas-phase coolant entering the sixth and seventh

heat dissipation channels

461, 471 is liquefied and converted into liquid-phase coolant while encountering the auxiliary heat insulating section 46 and the auxiliary condensing section 47, which have relatively low temperatures. The gas-phase cooling liquid releases heat when the auxiliary condensing section 47 is liquefied, and transfers the heat to the auxiliary condensing section 47. After the temperature of the auxiliary condensation section 47 rises, the auxiliary condensation section exchanges heat with the auxiliary heat dissipation member 53 and transfers the heat to the auxiliary heat dissipation member 53, a part of the heat in the auxiliary heat dissipation member 53 is directly transferred to the surrounding air and is discharged outside, a part of the heat is transferred to the auxiliary fan body 51 through the auxiliary heat dissipation member 53 and then exchanges heat with the surrounding air of the auxiliary fan body 51, and the gas after absorbing the heat is discharged outside under the effect of the auxiliary fan 50, so that the heat is discharged outside, and the heat dissipation effect is realized.

The liquid-phase cooling liquid that is liquefied in the condensation section 44 and the auxiliary condensation section 47 flows along the capillary structure 402 toward the evaporation section 41 under the action of capillary force, and the liquid-phase cooling liquid that flows from the condensation section 44 to the evaporation section 41 and the liquid-phase cooling liquid that flows from the auxiliary condensation section 47 to the evaporation section 41 continue to absorb heat in the evaporation section 41 and vaporize, and then turn into vapor-phase cooling liquid. Then, the gas-phase cooling liquid enters the condensing section 44 and the auxiliary condensing section 47 again, is liquefied to release heat, and is converted into liquid cooling liquid. In the continuous vaporization-liquefaction cycle process, the heat absorption-heat release cycle is completed to achieve the effect of heat transfer, so that the heat of the evaporation section 41 is continuously transmitted to the condensation section 44 and the auxiliary condensation section 47, and is transmitted to the external environment from the condensation section 44 through the heat dissipation member 33 and the fan 30, and is transmitted to the external environment from the auxiliary condensation section 47 through the auxiliary heat dissipation member 53 and the auxiliary fan 50, thereby realizing the heat dissipation of the heating element 20.

In this embodiment, by providing the heat dissipation pipe 40, connecting the heat dissipation pipe 40 to the heating element 20, the heat dissipation member 33, the heating element 20 and the auxiliary heat dissipation member 53, the heat of the heating element 20 can be transmitted to the heat dissipation member 33, the fan 30, the auxiliary heat dissipation member 53 and the auxiliary fan 50, and then transmitted to the outside, so as to dissipate the heat of the heating element 20, and avoid the overheating of the heating element 20 from affecting the performance of the heating element. In addition, in this embodiment, the auxiliary heat insulation section 46 and the auxiliary condensation section 47 are disposed on the heat dissipation pipe 40, so that the coolant in the first heat dissipation channel 411 can enter the fourth heat dissipation channel 441 and the seventh heat dissipation channel 471 simultaneously after being vaporized, and thus the heat can be transmitted to the condensation section 44 and the auxiliary condensation section 47 simultaneously, and the heat dissipation efficiency of the heat dissipation pipe 40 can be improved, so as to improve the heat dissipation efficiency of the electronic device 100.

The heat dissipation pipe 40 provided in this embodiment has different widths, and the width of the condensation section 44 is set to be smaller than that of the evaporation section 41, and the condensation section 44 with the smaller width is disposed on one side of the fan 30, and the evaporation section 41 with the larger width is disposed on one side of the heating element 20, so that the volume of the heat dissipation module 1 can be saved, that is, the space occupied by the heat dissipation member 33 and the fan 30 is reduced. Moreover, the width of the auxiliary condensing section 47 is set to be smaller than that of the evaporating section 41, the auxiliary condensing section 47 with a smaller width is disposed on one side of the auxiliary fan 50, and the evaporating section 41 with a larger width is disposed on one side of the heating element 20, so that the size of the heat dissipation module 1 can be further saved, that is, the space occupied by the auxiliary fan 50 is reduced. Meanwhile, since the width of the evaporation section 41 is large, the influence on the heat exchange between the evaporation section 41 and the heating element 20 can be avoided, and the influence on the heat dissipation efficiency of the electronic device 100 can be avoided. Moreover, the heat dissipation tube 40 in the present embodiment is a flat strip shape, which can increase the contact area between the heat dissipation tube 40 and the fan 30, between the heat dissipation tube 40 and the heat generating element 20, and between the heat dissipation tube 40 and the auxiliary fan 50, thereby further improving the heat dissipation efficiency of the electronic device 100. In addition, the dimension of the heat pipe 40 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

Referring to fig. 9, fig. 9 is a schematic partial structure diagram of an electronic device 100 according to a third embodiment of the present application.

The difference between this embodiment and the embodiment shown in fig. 2 is that the bottom plate is provided with a third opening, and the third opening is spaced from the first opening. The third opening penetrates the bottom plate and communicates the accommodating space 15 with the external environment. The third opening may be one or a plurality of openings. The first side plate 11 is provided with a fourth opening 112, and the fourth opening 112 and the second opening 111 are spaced apart. The fourth opening 112 penetrates the first side plate 11 and communicates the accommodating space 15 with the external environment. The number of the fourth holes may be one or more.

The heat dissipation module 1 further includes an auxiliary fan 50, and the structure of the auxiliary fan 50 is the same as that of the fan 30. The auxiliary fan 50 includes an auxiliary fan body 51, auxiliary fan blades 52, and an auxiliary heat sink 53. The auxiliary fan blades 52 are mounted on the auxiliary fan body 51 and rotatably connected to the auxiliary fan body 51. The auxiliary heat sink 53 is installed at an air outlet of the auxiliary fan 50, and is in contact with and fixedly connected to the auxiliary fan 50. The auxiliary fan 50 is installed in the accommodating space 15, and is arranged side by side with and spaced from the heating element 20, and the auxiliary fan 50 is located between the heating element 20 and the fourth side plate 14. That is, the fan 30 and the auxiliary fan 50 are respectively located at opposite sides of the heat generating element 20. The air inlet of the auxiliary fan 50 is opposite to the third opening, and the air outlet 302 of the auxiliary fan 50 is opposite to the fourth opening 112. The external air enters the accommodating space 15 through the third opening, enters the auxiliary fan 50 through the air inlet of the auxiliary fan 50, exchanges heat with the auxiliary fan 50, and then is discharged from the air outlet of the auxiliary fan 50 through the fourth opening 112 after exchanging heat with the auxiliary fan 50 under the rotation of the auxiliary fan blades 52, so as to achieve heat dissipation.

Referring to fig. 10 and 11, fig. 10 is a partial structural schematic view of the electronic device 100 shown in fig. 9, and fig. 11 is an exploded structural schematic view of the sub-radiating pipe 60 shown in fig. 10.

The heat dissipation module 1 includes a heat dissipation pipe 40 and a sub heat dissipation pipe 60. The heat dissipation tube 40 of the present embodiment is different from the heat dissipation tube 40 of the embodiment of fig. 4 in that the evaporation section 41 of the heat dissipation tube 40 of the present embodiment is rectangular.

In this embodiment, the structure of the sub-radiating pipe 60 is the same as that of the radiating pipe 40 in this embodiment. The sub radiating pipe 60 includes a sub evaporation section 61, a sub transition section 62, a sub adiabatic section 63, and a sub condensation section 64. The auxiliary evaporation section 61, the auxiliary transition section 62, the auxiliary heat insulation section 63 and the auxiliary condensation section 64 are connected in sequence. In this embodiment, the outer contour of the secondary evaporation section 61 is circular arc. In other embodiments, the outer contour of the secondary evaporator section 61 may also be rectangular. The secondary evaporation section 61 has a uniform width. The sub-evaporation section 61 is provided with a first sub-heat dissipation channel 611. The first sub heat dissipation channel 611 includes a fourth opening 612. The extending direction of the first auxiliary heat dissipation channel 611 is the same as the extending direction of the auxiliary evaporation section 61, and the fourth opening 612 penetrates through one end of the auxiliary evaporation section 61. That is, one end of the secondary evaporation section 61 is closed, and the other end is provided with the fourth opening 612.

The secondary transition section 62 includes a fifth end 621 and a sixth end 622, the fifth end 621 is disposed opposite to the sixth end 622, and the width of the secondary transition section 62 gradually decreases from the fifth end 621 to the sixth end 622. The sub-transition section 62 is provided with a second sub-heat dissipation passage 623. The extending direction of the second sub heat dissipation channel 623 is the same as the extending direction of the sub transition section 62, and the second sub heat dissipation channel 623 penetrates the sub transition section 62 in the extending direction thereof. The fifth end 621 of the auxiliary transition section 62 is fixedly connected with the end of the auxiliary evaporation section 61 provided with the fourth opening 612, the fourth opening 612 faces the auxiliary transition section 62, and the first auxiliary heat dissipation channel 611 is communicated with the second auxiliary heat dissipation channel 623. The width of the fifth end 621 corresponds to the width of the sub-evaporation section 61. The dimensions of the secondary transition section 62 at other positions than the fifth end 621 are larger than those of the secondary evaporation section 61, and the width of the fifth end 621 may deviate from the width of the secondary evaporation section 61 by a small amount. That is, the width of the secondary evaporator section 61 is greater than the overall width of the secondary transition section 62.

The outer contour of the secondary adiabatic section 63 is arc-shaped. The length direction of the sub-adiabatic section 63 coincides with the arc length direction. The sub-adiabatic section 63 is provided with a third sub-heat dissipation channel 631, and the extension direction of the third sub-heat dissipation channel 631 coincides with the extension direction of the sub-adiabatic section 63. The third secondary heat dissipation channel 631 penetrates the secondary heat insulation section 63 in the extending direction thereof. One end of the secondary insulation section 63 is fixedly connected with the sixth end 622 of the secondary transition section 62, and the third secondary heat dissipation channel 631 communicates with the second secondary heat dissipation channel 623. The width of the secondary adiabatic section 63 coincides with the width of the sixth end 622 of the secondary transition section 62. Of course, the width of the secondary insulating segment 63 may also deviate by a small amount from the width of the sixth end 622. It will be appreciated that the width of the secondary insulation section 63 is less than or equal to the width of the secondary transition section 62, and that the width of the secondary insulation section 63 is less than the width of the secondary evaporator section 61. That is, the width of the secondary insulation section 63 is smaller than the entire width of the secondary transition section 62.

In this embodiment, the outer contour of the secondary condensation section 64 is rectangular. In other embodiments, the outer contour of the secondary condensation section 64 may also be curved, or other shapes. The width of the secondary condensation section 64 is identical to that of the secondary adiabatic section 63. The sub condensation section 64 is provided with a fourth sub heat dissipation channel 641. One end of the secondary condensing section 64 is closed and the other end is provided with an opening. The end of the auxiliary condensation section 64 with the opening is fixedly connected with the end of the auxiliary heat insulation section 63 back to the auxiliary transition section 62, the end of the auxiliary condensation section 64 with the opening faces the auxiliary heat insulation section 63, and the fourth auxiliary heat dissipation channel 641 is communicated with the third auxiliary heat dissipation channel 631.

In this embodiment, the sub-heat pipe 60 is an integrally formed member. The auxiliary evaporation section 61, the auxiliary transition section 62, the auxiliary heat insulation section 63 and the auxiliary condensation section 64 are sequentially connected to form an auxiliary heat dissipation pipe 60. The first sub heat dissipation channel 611, the second sub heat dissipation channel 623, the third sub heat dissipation channel 631 and the fourth sub heat dissipation channel 641 are sequentially communicated to jointly form the sub heat dissipation channel 601 of the sub heat dissipation pipe 60, and the two opposite ends of the sub heat dissipation channel 601 in the extending direction thereof are closed. The width of the auxiliary evaporation section 61 is greater than the whole width of the auxiliary transition section 62, the widths of the auxiliary heat insulation section 63 and the auxiliary condensation section 64 are less than the whole width of the auxiliary transition section 62, and the widths of the auxiliary condensation section 64 and the auxiliary heat insulation section 63 are less than the width of the auxiliary evaporation section 61.

In this embodiment, by providing the sub-transition section 62 and setting the sub-transition section 62 into a shape with gradually changing width, the smooth transition from the sub-evaporation section 61 to the sub-condensation section 64 can be realized, so as to avoid liquefaction of the coolant due to sudden change of width, thereby affecting the heat dissipation performance of the sub-radiating pipe 60.

The sub radiating pipe 60 is provided with a sub capillary structure (not shown). In this embodiment, the secondary capillary structure is composed of a metal mesh and fibers. The sub capillary structure is located in the radiating passage 401 of the sub radiating pipe 40 and is fixedly connected with the inner wall of the sub radiating pipe 60. Specifically, the secondary capillary structure is a continuous structure, and the secondary capillary structure extends from the secondary evaporator section 61 to the secondary condenser section 64 along the secondary transition section 62 and the secondary insulation section 63.

The heat dissipation module 1 further includes a sub-cooling liquid (not shown). In this embodiment, the sub-coolant is pure water. The sub heat dissipation pipe 60 is filled with the sub cooling liquid. The secondary cooling liquid can be converted into gas-phase cooling liquid through heat absorption vaporization in the secondary evaporation section 61, and then enters the secondary condensation section 64, then is liquefied and releases heat in the secondary condensation section 64, and is converted into liquid-phase cooling liquid, and then the liquid-phase cooling liquid flows back to the secondary evaporation section 61 along the capillary structure 402. In this way, during the vaporization-liquefaction cycle of the secondary cooling liquid, the heat of the secondary evaporation section 61 can be transferred to the secondary condensation section 64 to achieve heat dissipation of the secondary evaporation section 61. Wherein the volume of the auxiliary cooling liquid is 0.1% -10% of the volume of the auxiliary heat dissipation channel 401.

Referring to fig. 9, the heat pipe 40 and the sub-heat pipe 60 are installed in the receiving space 15, and the evaporation section 41 is stacked on the heating element 20 and is fixedly connected to and contacts the heating element 20. The condensation section 44 is fixedly connected to the heat sink 33 and is in contact with the heat sink 33. The heat insulating section 43 and the transition section 42 are located between the heat sink 33 and the heat generating element 20. The sub-evaporation section 61 is stacked with the heating element 20 and arranged side by side with the evaporation section 41, and the sub-evaporation section 61 is fixedly connected and contacted with the heating element 20. The sub condensation section 64 is fixedly connected to the auxiliary heat sink 53 and contacts the auxiliary heat sink 53. The secondary heat insulating section 63 and the secondary transition section 62 are located between the auxiliary heat sink 53 and the heat generating element 20. In this embodiment, the evaporation section 41 and the auxiliary evaporation section 61 are arranged side by side along the Y direction, and the evaporation section 41 is in contact with the auxiliary evaporation section 61. In other embodiments, the evaporation section 41 and the sub-evaporation section 61 may be disposed at intervals, as long as both the evaporation section 41 and the sub-evaporation section 61 are in contact with the heating element 20.

The heating element 20 generates heat during operation and transfers the heat to the evaporation section 41 of the radiating pipe 40 and the sub-evaporation section 61 of the sub-radiating pipe 60, so that the temperatures of the evaporation section 41 and the sub-evaporation section 61 are increased. The temperature of the evaporation section 41 is increased to heat and vaporize the coolant in the first heat dissipation channel 411, and the vaporized coolant enters the third heat dissipation channel 431 and the fourth heat dissipation channel 441 from the first heat dissipation channel 411 along the second heat dissipation channel 423, is liquefied and converted into liquid-phase coolant in the heat insulation section 43 and the condensation section 44, releases heat, and transfers the heat to the condensation section 44. Then, the condensation section 44 transfers the heat to the heat sink 33, and a portion of the heat in the heat sink 33 is directly discharged to the outside, and a portion of the heat is transferred to the fan 30 and then discharged to the outside by the fan 30. The liquid coolant liquefied in the condensing section 44 flows along the capillary structure 402 to the evaporating section 41, and then continues to absorb heat and vaporize in the evaporating section 41, and is converted into a liquid coolant in a gas phase. The gaseous phase coolant then enters the condenser section 44 and liquefies to release heat and convert it to a liquid phase coolant. In the continuous vaporization-liquefaction cycle process, the heat absorption-heat release cycle is completed to achieve the heat transfer effect, so that the heat of the evaporation section 41 is continuously transferred to the condensation section 44, and is transferred to the external environment through the heat dissipation member 33 and the fan 30, thereby achieving the heat dissipation of the heating element 20.

The temperature of the auxiliary evaporation section 61 rises to heat and vaporize the auxiliary cooling liquid located in the first auxiliary heat dissipation channel 611, and the vaporized auxiliary cooling liquid enters the third auxiliary heat dissipation channel 631 and the fourth auxiliary heat dissipation channel 641 from the first auxiliary heat dissipation channel 611 along the second auxiliary heat dissipation channel 623, is liquefied in the auxiliary heat insulation section 63 and the auxiliary condensation section 64, releases heat, and transfers the heat to the auxiliary condensation section 64. Then, the sub condensation section 64 transfers the heat to the auxiliary heat sink 53, and a portion of the heat at the auxiliary heat sink 53 is directly discharged to the outside, and a portion of the heat is transferred to the auxiliary fan body 51 and then discharged to the outside. The sub-cooling fluid liquefied at the sub-condensing section 64 flows to the sub-evaporation section 61 along the sub-capillary structure in the sub-radiating pipe 60, continues to absorb heat and vaporize at the sub-evaporation section 61, and then enters the sub-condensing section 64 again to be liquefied and release heat. In the continuous vaporization-liquefaction cycle process, the heat of the auxiliary evaporation section 61 is continuously transmitted to the auxiliary condensation section 64, and is transmitted to the external environment through the auxiliary fan 50, thereby realizing the heat dissipation of the heating element 20.

In this embodiment, the heat of the heat generating element 20 can be transmitted to the heat dissipating pipe 40 and the sub heat dissipating pipe 60 simultaneously by providing the sub heat dissipating pipe 60, so that the heat dissipating efficiency of the electronic device 100 can be increased. And, the width of the sub-radiating pipe 60 that this embodiment provided is different, set up the width through the sub-condensation section 64 to be less than the width of the sub-evaporation section 61, and locate the sub-condensation section 64 that the width is less in one side of auxiliary fan 50, the sub-evaporation section 61 that the width is great is located heating element 20 one side, thereby can practice thrift the volume of thermal module 1, that is to say, the space that auxiliary fan 50 took reduces, and simultaneously, because the sub-evaporation section 61 width is great, thereby can avoid causing the influence to the heat exchange between sub-evaporation section 61 and heating element 20, and then can avoid causing the influence to electronic equipment 100's radiating efficiency. Moreover, the sub-radiating tube 60 in the present embodiment is a flat strip, which can increase the contact area between the sub-radiating tube 60 and the auxiliary fan 50 and between the sub-radiating tube 60 and the heating element 20, thereby further improving the heat dissipation efficiency of the electronic device 100. In addition, the dimension of the sub-radiator 60 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

Referring to fig. 12, fig. 12 is a flowchart illustrating a manufacturing process of the electronic device 100 shown in fig. 2.

The method for manufacturing the electronic device 100 includes:

s1: providing a fan and a heating element;

s2: providing a pipe body, wherein the pipe body comprises a first section and a second section which are sequentially connected;

s3: extruding the first section to reduce the inner diameter of the first section to form a first base pipe;

s4: welding a port of the first base pipe, and closing the first base pipe to obtain a second base pipe;

s5: and pressing the second base pipe to be in a flat strip shape in a direction perpendicular to the length extension direction of the second base pipe to obtain the radiating pipe.

The second section of the radiating pipe 40 is stacked with the heating element 20 and is in contact with the heating element 20, and the first section is connected with the fan 30 and is in contact with the fan 30.

In S2, the tube is an elongated circular tube, and the outer contour thereof is cylindrical. In this embodiment, the tube is made of copper. In other embodiments, the material of the tube body may also be aluminum, stainless steel or other metal material, or heat conductive material. The body still includes first port and second port, and first port and second port run through the body respectively at body length direction's relative both ends. Wherein, the first port is located the first section and keeps away from the one end of second section, and the second port is located the second section and keeps away from the one end of first section.

S2 also includes cutting the pipe body to adjust the length of the pipe body according to actual needs.

Referring to fig. 13, fig. 13 is a schematic structural view of a mold 200 used to fabricate the first base pipe of fig. 12.

The mold 200 has a hollow structure. The mold 200 is provided with a receiving cavity 210 therein, and the receiving cavity 210 penetrates through the mold 200 in an extending direction of the mold 200. The mold 200 includes a first portion 220 and a second portion 230. The first portion 220 is cylindrical. The first portion 220 has a uniform inner diameter. The second portion 230 is frustoconical. Of course, the second portion 230 may also be approximately frustoconical. The second portion 230 includes a connecting end 231 and a free end 232, the connecting end 231 and the free end 232 being located at opposite ends of the second portion 230, respectively. The second portion 230 has an inner diameter that gradually increases from the connecting end 231 to the free end 232. The connection end 231 is fixedly connected with the first part 220, and the inner diameter of the connection end 231 is the same as that of the first part 220.

At S3, the first port of the barrel is placed into the second portion 230 of the mold 200 toward the free end 232 of the mold 200. The mold 200 is rotated using the rotating device and the first section of the barrel is gradually extended into the second portion 230. The change in the inner diameter is used to compress the diameter of one end of the first section to approximately the same inner diameter as the connecting end 231. The first section continues to extend into the first portion 220, causing the remainder of the first section to become smaller in diameter under the compression of the second portion 230 until the diameter of the first section is the same as the inner diameter of the connecting end 231, resulting in a first base pipe.

Wherein the difference between the diameter of the first section before compression and the diameter of the first section after compression is more than 0 and less than or equal to 4 mm. In this example, the diameter of the first section before compression was 8mm, and the diameter of the first section after compression was 4 mm. Alternatively, the diameter of the first section before compression is 8mm, and the diameter of the first section after compression is more than 4mm and less than 8 mm. In other embodiments, the diameter of the first section before compression is 10mm and the diameter of the first section after compression is 6 mm. Alternatively, the diameter of the first section before compression is 10mm, and the diameter of the first section after compression is more than 6mm and less than 10 mm.

Step S4 includes:

(1) the first base pipe is cleaned.

(2) Welding the second port of the first base pipe to close the second port to obtain a first closed pipe.

(3) Providing fibers and metal powder, and filling the fibers and the metal powder in the first closed tube.

In step (3), the fibers are spread over the first and second sections of the first closed tube. The metal powder is located around the fibers and a portion of the metal powder is in contact with the fibers. In this example, the metal powder was copper powder, and the fiber was copper fiber. In other embodiments, the metal powder may also be aluminum powder, and the fiber may also be aluminum fiber or carbon fiber.

(4) And (4) sintering the first closed tube filled with the fibers and the metal powder in the step (3) to enable the inner wall of the first closed tube to form a capillary structure 402 so as to form a second closed tube.

In step (4), the metal powder is converted into a dense body by the high temperature of the sintering process.

(5) And filling cooling liquid in the second closed pipe.

In the step (5), the cooling liquid is pure water, and the cooling liquid is poured into the second closed pipe from the first port. The volume of the cooling liquid is 0.1% -10% of the volume of the second closed pipe.

(6) And removing the air in the second closed pipe to enable the second closed pipe to be in a vacuum state or a near vacuum state.

(7) Welding the first port of the second closed tube to close the first port to obtain a second base tube.

In step S5, first, the second foundation pipe is straightened; then, bending the second base pipe by punching to bend the second base pipe into a preset shape; and then pressing the second base pipe into a flat strip shape along the direction vertical to the length extension direction of the second base pipe to obtain the radiating pipe. The radiating pipe here has the same structure as the radiating pipe 40 shown in fig. 4. The first section of the radiating pipe is the condensing section 44 and the heat insulating section 43, and the second section is the evaporating section 41.

Then, the heat dissipating pipe 40 is polished, and then the performance of the heat dissipating pipe 40 is tested. In the embodiment, the heat dissipation tube 40 is in the shape of a flat strip, so that after the heat dissipation tube 40 is mounted on the electronic device body, the thickness of the electronic device 100 can be reduced, and the contact area between the heat dissipation tube 40 and the heat generating element 20 can be increased, thereby achieving high heat dissipation efficiency.

S5 also includes testing the performance of the electronic device 100. Specifically, the heat dissipation performance is included.

In this embodiment, by connecting the heat pipe 40 to the heat generating element 20 and the fan 30, the heat generated by the heat generating element 20 can be transferred to the fan 30, and then transferred to the outside by the fan 30, thereby dissipating the heat of the heat generating element 20. Also, by reducing the diameter of the first section of the heat dissipating pipe 40 and installing the first section having a smaller diameter at one side of the fan 30, the volume of the heat dissipating module, that is, the space occupied by the fan 30, can be saved. Meanwhile, the diameter of the second section connected to the heating element 20 is large, so that influence on heat exchange between the second section and the heating element 20 can be avoided. Moreover, the heat dissipation tube 40 is pressed into the flat strip shape, so that the contact area between the heat dissipation tube 40 and the fan 30 and the contact area between the heat dissipation tube 40 and the heat generating element 20 can be increased, and the heat dissipation efficiency of the electronic device 100 can be further improved. In addition, the dimension of the heat pipe 40 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

In this embodiment, the inner diameter of the heat dissipation tube 40 can be changed by the tube shrinking process to manufacture the heat dissipation tube 40 with variable diameter, and the manufacturing process is simple.

In one embodiment, the difference from the previous embodiment is that,

the step of S3 includes:

(1) providing fibers and metal powder, and filling the fibers and the metal powder into the pipe body.

(2) And (3) sintering the pipe body filled with the fibers and the metal powder in the step (1) to enable the inner wall of the pipe body to form a capillary structure 402.

(3) And (3) extruding the first section of the pipe body obtained in the step (2) to reduce the inner diameter of the first section so as to form a first base pipe.

Step S4 includes:

(1) the first base pipe is cleaned.

(3) And filling the cooling liquid in the first closed pipe.

(4) And removing the air in the first closed pipe to enable the first closed pipe to be in a vacuum state or a near vacuum state.

(5) Welding the first port of the first closed tube to close the first port to obtain a second base tube.

That is, in the embodiment shown in fig. 12, the first section of the tube is squeezed to shrink the tube, and then the powder is filled in the tube to form the capillary structure. In this embodiment, the capillary structure is formed in the tube, and then the first section is extruded to shrink the tube.

Referring to fig. 14, fig. 14 is a flowchart illustrating a manufacturing process of the electronic device 100 shown in fig. 6.

The method for manufacturing the electronic device 100 includes:

s1': providing a fan, an auxiliary fan and a heating element;

s2': providing a pipe body, wherein the pipe body comprises a first section, a second section and a third section which are sequentially connected;

s3': extruding the first section to reduce the inner diameter of the first section and extruding the third section to reduce the diameter of the third section to form a first base pipe;

s4': welding a port of the first base pipe, and sealing the first base pipe to obtain a second base pipe;

s5': and pressing the second base pipe into a flat strip shape in a direction perpendicular to the length extension direction of the second base pipe to obtain the radiating pipe.

The fan 30 and the auxiliary fan 50 are both arranged side by side with the heating element 20, and the fan 30 and the auxiliary fan 50 are respectively positioned at two opposite sides of the heating element 20; the second section of the radiating pipe 40 is stacked with the heating element 20 and is in contact with the heating element 20, the first section of the radiating pipe 40 is connected with the fan 30 and is in contact with the fan 30, and the third section of the radiating pipe 40 is connected with the auxiliary fan 50 and is in contact with the auxiliary fan 50.

In S2', the tube is an elongated circular tube, and the outer contour thereof is cylindrical. In this embodiment, the tube is made of copper. The second section of the tube is positioned between the first section and the third section. The body still includes first port and second port, and first port and second port run through the body respectively at body length direction's relative both ends. The first port is located at one end of the first section, which is far away from the second section, and the second port is located at one end of the third section, which is far away from the second section.

At S3', the die 200 of fig. 12 is used to extrude the first and third segments of the tubular body.

First, a first section of the circular tube is inserted into the second portion 230 of the mold 200, and the first section is extruded by using the change of the inner diameter of the second portion 230, so that the diameter of the first section is reduced until the diameter of the first section is the same as the inner diameter of the connecting end 231. Then, the round tube is taken out, the third section of the round tube is inserted into the second part 230 of the mold 200, and the third section is extruded by using the change of the inner diameter of the second part 230, so that the diameter of the third section is reduced until the diameter of the third section is the same as the inner diameter of the connecting end 231, so as to obtain the first base tube.

Wherein the difference between the diameter of the first section before compression and the diameter of the first section after compression is more than 0 and less than or equal to 4 mm. The difference between the diameter of the third section before compression and the diameter of the third section after compression is more than 0 and less than or equal to 4 mm. In this example, the diameter of the third section before compression is 8mm, and the diameter of the third section after compression is 4 mm. Or the diameter of the third section before compression is 8mm, and the diameter of the third section after compression is more than 4mm and less than 8 mm. In other embodiments, the diameter of the third section before compression is 10mm and the diameter of the third section after compression is 6 mm. Or the diameter of the third section before compression is 10mm, and the diameter of the third section after compression is more than 6mm and less than 10 mm. That is, the first and third sections of the second base pipe each have a diameter that is less than the diameter of the second section.

In the S4' step, the difference from the S4 step in the embodiment shown in fig. 11 is that the capillary structures 402 are formed at the first, second, and third sections of the first base pipe.

The radiating pipe structure formed in step S5' is the same as the radiating pipe structure shown in fig. 7. Wherein. The first section is a condensation section 44 and an adiabatic section 43, the second section is an evaporation section 41, and the third section is an auxiliary adiabatic section 46 and an auxiliary condensation section 47.

In this embodiment, by connecting the heat dissipation pipe 40 to the heat generating element 20 and the fan 30, and the heat generating element 20 and the auxiliary fan 50, the heat generated by the heat generating element 20 can be simultaneously transmitted to the fan 30 and the auxiliary fan 50, and then transmitted to the outside by the fan 30 and the auxiliary fan 50, so that the heat dissipation of the heat generating element 20 is realized, and the heat dissipation performance of the electronic device 100 can be further improved. In addition, by reducing the diameters of the first and third sections of the heat dissipation pipe 40 and installing the first section with a smaller diameter on one side of the fan 30, the size of the heat dissipation module can be reduced, that is, the space occupied by the fan 30 is reduced, and the third section with a smaller diameter is installed on one side of the auxiliary fan 50, the size of the heat dissipation module can be further reduced, that is, the space occupied by the auxiliary fan 50 is reduced. Meanwhile, the diameter of the second section connected to the heating element 20 is large, so that influence on heat exchange between the second section and the heating element 20 can be avoided. Moreover, the heat dissipation tube 40 is pressed into the flat strip shape, so that the contact area between the heat dissipation tube 40 and the fan 30 and the contact area between the heat dissipation tube 40 and the heat generating element 20 can be increased, and the heat dissipation efficiency of the electronic device 100 can be further improved. In addition, the dimension of the heat pipe 40 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

In this embodiment, the heat dissipation tube 40 with the width at the two ends smaller than the width in the middle is manufactured through the two pipe shrinking processes, so that the manufacturing process is simple, and the resource is saved.

In this embodiment, the capillary structure may be formed in the pipe body first, and then the pipe shrinking process is performed to form the heat dissipation pipe 40 with a variable diameter.

Referring to fig. 15, fig. 15 is a flowchart illustrating a manufacturing process of the electronic device 100 shown in fig. 9.

The method for manufacturing the electronic device 100 shown in fig. 9 includes:

s1': providing a fan, an auxiliary fan and a heating element;

s2': providing a pipe body, wherein the pipe body comprises a first section and a second section which are sequentially connected;

s3': extruding the first section to reduce the inner diameter of the first section to form a first base pipe;

s4': welding a port of the first base pipe, and closing the first base pipe to obtain a second base pipe;

s5': pressing the second base pipe into a flat strip shape in a direction perpendicular to the length extension direction of the second base pipe to obtain a radiating pipe;

s6': providing an auxiliary pipe body, wherein the auxiliary pipe body comprises a first auxiliary section and a second auxiliary section;

s7': extruding the first secondary section to reduce the inner diameter of the first secondary section to form a first secondary base pipe;

s8': welding the port of the first auxiliary base pipe, and closing the first auxiliary base pipe to obtain a second auxiliary base pipe;

s9': and pressing the second auxiliary base pipe into a flat strip shape in the length extending direction vertical to the second auxiliary base pipe to obtain the auxiliary radiating pipe.

The fan 30 and the auxiliary fan 50 are both arranged side by side with the heating element 20, and the fan 30 and the auxiliary fan 50 are respectively positioned at two opposite sides of the heating element 20; the second section of the radiating pipe 40 is stacked with the heating element 20 and is in contact with the heating element 20, the first section of the radiating pipe 40 is connected with the fan 30 and is in contact with the fan 30, the second sub-section of the heating element 20 of the sub-radiating pipe 60 is stacked and is in contact with the heating element 20, and the first section of the sub-radiating pipe 60 is connected with the auxiliary fan 50 and is in contact with the auxiliary fan 50.

Step S2 ″ in the present embodiment is the same as S2 in the manufacturing method shown in fig. 12, step S3 ″ is the same as S3 in the manufacturing method shown in fig. 12, and step S4 ″ is the same as S4 in the manufacturing method shown in fig. 12. Step S5' is the same as step S5 in the manufacturing method shown in FIG. 12.

In S6', the secondary tube is a long strip-shaped circular tube with a cylindrical outer contour. In this embodiment, the sub-tube is made of copper. The auxiliary pipe body further comprises a first auxiliary port and a second auxiliary port, and the first auxiliary port and the second auxiliary port penetrate through the auxiliary pipe body at two opposite ends of the auxiliary pipe body in the length direction. The first auxiliary port is located at one end, far away from the second auxiliary section, of the first auxiliary section, and the second port is located at one end, far away from the first auxiliary section, of the second auxiliary section.

At S7 ″, the first sub-segment of the tubular body is extruded using the die 200 shown in fig. 12. The first sub section of the sub round tube is inserted into the second part 230 of the mold 200, and the first sub section is extruded by using the inner diameter variation of the second part 230, so that the diameter of the first sub section is reduced until the diameter of the first sub section is the same as the inner diameter of the connecting end 231, to obtain the first sub base tube. Wherein the difference between the diameter of the first sub-section before compression and the diameter of the first sub-section after compression is more than 0 and less than or equal to 4 mm.

The step of S8 '' includes:

(1) welding the second secondary port of the first secondary base pipe to close the second secondary port to obtain a first secondary closed pipe.

(2) And providing fibers and metal powder, filling the fibers and the metal powder into the first secondary closed tube, and sintering the first secondary closed tube filled with the fibers and the metal powder to form a capillary structure on the inner wall of the first secondary closed tube so as to form a second secondary closed tube.

In the step (2), the fibers are fully distributed in the first secondary section and the second secondary section of the first secondary closed pipe. The metal powder is located around the fibers and a portion of the metal powder is in contact with the fibers. In this example, the metal powder was copper powder, and the fiber was copper fiber. The metal powder is converted into a dense body by the high temperature of the sintering process.

(3) And filling the secondary cooling liquid in the second secondary closed pipe.

In the step (3), the secondary cooling liquid is pure water, and the cooling liquid is poured into the second secondary closed pipe from the first port. The volume of the auxiliary cooling liquid is 0.1% -10% of the volume of the second auxiliary closed pipe.

(4) And removing the air in the second secondary closed pipe to enable the second secondary closed pipe to be in a vacuum state or a near vacuum state.

(5) Welding the first secondary port of the second secondary closed tube to close the first secondary port to obtain the second secondary base tube.

In this embodiment, the capillary structure may be formed in the sub-pipe first, and then the pipe shrinking process is performed to form the sub-radiating pipe with a variable diameter.

The structure of the heat pipe formed in S5 ″ is the same as the structure of the heat pipe 40 shown in fig. 10. The first section is a condensation section 44 and an adiabatic section 43, and the second section is an evaporation section 41. The sub-radiating pipe structure formed in the step of S7 ″ is the same as the structure of the sub-radiating pipe 60 shown in fig. 10. Wherein. The first secondary section is the secondary condensation section 64 and the secondary insulation section 63, and the second secondary section is the secondary evaporation section 61.

In this embodiment, the heat radiating performance of the electronic device 100 can be further improved by disposing the heat radiating pipe 40 and the sub heat radiating pipe 60, and connecting the heat radiating pipe 40 to the heat generating element 20 and the fan 30, and connecting the sub heat radiating pipe 60 to the heat generating element 20 and the auxiliary fan 50, so that the heat generated by the heat generating element 20 can be transmitted to the fan 30 and the auxiliary fan 50 at the same time, and then transmitted to the outside by the fan 30 and the auxiliary fan 50. Also, by reducing the diameter of the first section of the heat dissipating pipe 40 and installing the first section having a smaller diameter at one side of the fan 30, the volume of the heat dissipating module, that is, the space occupied by the fan 30, can be saved. By reducing the diameter of the first sub-section of the sub-radiating pipe 60 and installing the first sub-section having a smaller diameter at one side of the auxiliary fan 50, the size of the radiating module can be further saved, that is, the space occupied by the auxiliary fan 50 is reduced. Meanwhile, the diameters of the second section and the second sub-section connected with the heating element 20 are large, so that influence on heat exchange between the second section and the second sub-section and the heating element 20 can be avoided. Moreover, the sub-radiating pipe 60 is pressed into the flat strip shape, so that the contact area between the sub-radiating pipe 60 and the auxiliary fan 50 and the contact area between the sub-radiating pipe 60 and the heating element 20 can be increased, and the heat dissipation efficiency of the electronic device 100 can be further improved. In addition, the dimension of the sub-radiator 60 in the Z direction can be reduced, so that the thickness of the electronic device 100 can be reduced, and the electronic device 100 can be made thinner.

The above embodiments and embodiments of the present application are only examples and embodiments, and the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising: the heat dissipation module comprises a shell, a heating element and a heat dissipation module;

the heat dissipation module comprises a fan and a heat dissipation pipe;

the heat dissipation module and the heating element are both arranged in the shell, and the fan and the heating element are arranged at intervals;

the radiating pipe comprises an evaporation section and a condensation section, the evaporation section is connected with the condensation section, and the pipe diameter of the condensation section is smaller than that of the evaporation section;

the cooling tube install in the casing, just the evaporation zone with heating element stacks up the setting, and with heating element contact, the condensation segment with the fan is connected and with the fan contact.

2. The electronic device as claimed in claim 1, wherein the heat dissipating pipe further comprises a transition section connected between the evaporation section and the condensation section, and wherein the pipe diameter of the transition section gradually decreases in a direction from the evaporation section to the condensation section.

3. The electronic device of claim 1 or 2, wherein the heat dissipation module comprises a cooling liquid, the cooling liquid is located in the heat dissipation tube, and the cooling liquid is vaporized in the evaporation section and liquefied in the condensation section.

4. The electronic device of claim 3, wherein the heat dissipation module comprises an auxiliary fan, and the auxiliary fan and the fan are respectively located at two opposite sides of the heat generating element;

the cooling tube still includes supplementary condensation segment, supplementary condensation segment with the condensation segment connect respectively in the relative both ends of evaporation zone, supplementary condensation segment with supplementary fan is connected, and with supplementary fan contact.

5. The electronic device of claim 3, wherein the heat dissipation module comprises an auxiliary fan, and the auxiliary fan and the fan are respectively located at two opposite sides of the heat generating element;

the heat dissipation module comprises an auxiliary heat dissipation pipe, the auxiliary heat dissipation pipe comprises an auxiliary evaporation section and an auxiliary condensation section, the auxiliary evaporation section is connected with the auxiliary condensation section, and the pipe diameter of the auxiliary condensation section is smaller than that of the auxiliary evaporation section; the auxiliary radiating pipe is arranged in the shell, the auxiliary evaporation section is stacked with the heating element and is in contact with the heating element, and the auxiliary condensation section is connected with the auxiliary fan and is in contact with the auxiliary fan.

6. The electronic device as claimed in claim 4 or 5, wherein the heat dissipation tube further comprises a capillary structure, and the capillary structure is disposed on an inner wall of the heat dissipation tube.

7. The electronic device of claim 6, wherein the capillary structure is a powder capillary structure, or a fiber-like capillary structure, or a mesh-like capillary structure, or a groove-like capillary structure.

8. The electronic device according to claim 4 or 5, wherein the fan includes a fan body and a heat dissipation member, the heat dissipation member is mounted on a surface of the fan body and is fixedly connected to the fan body, and the condensation section is stacked on the heat dissipation member and is fixedly connected to the heat dissipation member.

9. The electronic device of claim 3, wherein the volume of the cooling liquid is 0.1% to 10% of the cavity volume of the heat dissipation pipe.

10. The electronic device of claim 5, wherein the heat dissipation module comprises a secondary cooling fluid, the secondary cooling fluid is located in the secondary heat dissipation tube, and the secondary cooling fluid is vaporized in the secondary evaporation section and liquefied in the secondary condensation section.

11. The electronic device as claimed in claim 1, wherein the heat dissipation pipe is a flat strip.

12. A method for manufacturing an electronic device, for manufacturing the electronic device of any one of claims 1-11, comprising:

providing a fan and a heating element;

pressing the first base pipe to be in a flat strip shape perpendicular to the length extension direction of the second base pipe to obtain a radiating pipe;

13. The method of manufacturing an electronic device according to claim 12, wherein an outer contour of the pipe body is circular, a diameter of the first section of the first base pipe is smaller than a diameter of the second section of the second base pipe, and a difference between the diameter of the first section of the first base pipe and the diameter of the second section of the second base pipe is greater than 0 and less than or equal to 4 mm.

14. The method of claim 12 or 13, wherein the tube further comprises a third section and a first section, the third section and the first section being connected to opposite ends of the second section, respectively, and wherein extruding the first section to reduce the inner diameter of the first section to form a first base tube further comprises extruding the third section to reduce the inner diameter of the third section to form a first base tube after extruding the first section;

the manufacturing method further comprises the step of providing an auxiliary fan, wherein the third section is connected with the auxiliary fan and is in contact with the auxiliary fan.

15. The method of manufacturing an electronic device according to claim 12 or 13, further comprising:

providing an auxiliary fan;

providing a secondary pipe body, wherein the secondary pipe body comprises a first secondary section and a second secondary section;

extruding the first sub-section to reduce the inner diameter of the first sub-section to form a first sub-base pipe;

pressing the second auxiliary base pipe to be in a flat strip shape in a direction perpendicular to the length extension direction of the second auxiliary base pipe to obtain an auxiliary radiating pipe;