CN114401478B

CN114401478B - Bone voiceprint sensor

Info

Publication number: CN114401478B
Application number: CN202111602991.7A
Authority: CN
Inventors: 孙延娥; 端木鲁玉; 田峻瑜
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2024-03-08
Anticipated expiration: 2041-12-24
Also published as: CN114401478A; WO2023116864A1

Abstract

The embodiment of the application discloses a bone voiceprint sensor, which comprises a shell, a PCB and a built-in component; a closed cavity is formed between the shell and the PCB; the built-in assembly is arranged in the closed cavity and comprises a base, a vibration assembly and a microphone assembly, wherein the base is arranged on the PCB, the vibration assembly and the microphone assembly are respectively arranged on the base, and a vibration cavity is formed among the base, the vibration assembly, the microphone assembly and the PCB; the vibration component senses external vibration signals and drives air flow in the vibration cavity to change, and the microphone component senses the change of the air flow in the vibration cavity to convert the vibration signals into electric signals. The technical effect of this application embodiment lies in, structural design is reasonable, and the encapsulation mode is simple, has not only improved encapsulation efficiency, is convenient for realize bone voiceprint sensor's miniaturized design moreover.

Description

Bone voiceprint sensor

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a bone voiceprint sensor.

Background

The bone voiceprint sensor is a sensor that uses an acoustic membrane to vibrate to drive air flow and thereby detect a flow signal.

Current bone voiceprint sensors typically include two parts, a vibration assembly and a microphone assembly, the vibration assembly being glued to the microphone assembly. The vibration component is used for sensing external vibration signals; the microphone assembly is used for converting airflow change generated during vibration into an electric signal so as to express an external vibration signal.

However, the existing bone voiceprint sensor is unreasonable in structural design, complicated in process and large in volume, and is unfavorable for the miniaturization design of the bone voiceprint sensor.

Disclosure of Invention

It is an object of embodiments of the present application to provide a new solution for a bone voiceprint sensor.

According to one aspect of embodiments of the present application, there is provided a bone voiceprint sensor comprising:

the device comprises a shell and a PCB, wherein a closed cavity is formed between the shell and the PCB;

the built-in assembly is arranged in the closed cavity and comprises a base, a vibration assembly and a microphone assembly, wherein the base is arranged on the PCB, the vibration assembly and the microphone assembly are respectively arranged on the base, and a vibration cavity is formed among the base, the vibration assembly, the microphone assembly and the PCB;

the vibration component senses external vibration signals and drives air flow in the vibration cavity to change, and the microphone component senses the change of the air flow in the vibration cavity to convert the vibration signals into electric signals.

Optionally, the vibration assembly includes a vibrating diaphragm and a vibrating block;

the base is provided with a first through hole, and the vibrating diaphragm is fixed on the base and covers the first through hole; the vibrating block is arranged on one side of the vibrating diaphragm, which is close to the PCB.

Optionally, a groove is formed in a position, corresponding to the vibrating block, of the PCB.

Optionally, the base comprises a first support table and a second support table; the height of the first supporting table is larger than that of the second supporting table;

forming a first through hole on the first supporting table, wherein the vibrating diaphragm is fixed on the first supporting table and covers the first through hole;

the microphone assembly is fixed to the second support table.

Optionally, the built-in component further comprises a baffle plate, the baffle plate is arranged on one side of the first supporting table, which is close to the PCB board, and extends to the PCB board, and the baffle plate divides the vibration cavity into a first cavity corresponding to the vibration component and a second cavity corresponding to the microphone component;

and a third through hole which is communicated with the first chamber and the second chamber is formed in the partition plate.

Optionally, the microphone assembly includes a mes chip, and the mes chip is disposed on a side of the base away from the PCB;

the base is provided with a second through hole, and the second through hole is communicated with the MEMES chip and the vibration cavity.

Optionally, the vibration component further comprises an ASIC chip, wherein the ASIC chip is located on one side of the base away from the PCB board, and the MEMS chip and the ASIC chip are electrically connected.

Optionally, the MEMS chip is disposed side by side with the ASIC chip, and the MEMS chip is in contact with the ASIC chip.

Optionally, the ASIC chip is connected with the PCB board through a gold wire.

Optionally, a pressure relief hole is formed in the housing.

One technical effect of the embodiment of the application is that:

in this application embodiment, constitute built-in subassembly and set up in the airtight chamber that shell and PCB board formed through base, vibration subassembly and microphone subassembly, the encapsulation mode is simpler, is favorable to improving encapsulation efficiency, practices thrift the encapsulation cost.

In addition, the bone voiceprint sensor in the embodiment of the application has the advantages that the structural design is quite reasonable, the vibration component and the microphone component share one vibration cavity, the space inside the bone voiceprint sensor is fully utilized, the size of the bone voiceprint sensor is reduced, and the miniaturized design of the bone voiceprint sensor is facilitated.

Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.

Fig. 1 is a schematic structural view of a first implementation of a bone voiceprint sensor provided in an embodiment of the present application;

FIG. 2 is a schematic structural view of a second embodiment of a bone voiceprint sensor provided in an embodiment of the present application;

fig. 3 is a schematic structural view of a third implementation of a bone voiceprint sensor according to an embodiment of the present disclosure.

In the figure: 1. a housing; 101. a closed cavity; 102. a pressure relief hole; 103. a first chamber; 104. a second chamber; 105. a vibration chamber; 2. a PCB board; 21. a groove; 31. a base; 311. a first support table; 3111. a first through hole; 3112. a second through hole; 312. a second support table; 32. a vibration assembly; 321. a vibrating diaphragm; 322. a vibrating block; 33. a microphone assembly; 331. MEMES chip; 332. an ASIC chip; 34. a partition plate; 341. a third through hole; 4. gold wire.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

As shown in fig. 1 to 3, the present embodiment provides a bone voiceprint sensor that uses slight vibration of head and neck bones caused when a person speaks to collect sound signals into electrical signals. Because it is different from traditional microphone through air conduction collection sound, so can also be in very noisy environment can be with high definition conduction out, the precision of conduction is higher.

Specifically, referring to fig. 1, the bone voiceprint sensor includes a housing 1, a PCB board 2, and a built-in component; a closed cavity 101 is formed between the housing 1 and the PCB 2, and the accommodating cavity is used for accommodating the built-in component, and the housing 1 can better protect the built-in component.

Further specifically, the built-in component is disposed in the closed cavity 101, and the built-in component includes a base 31, a vibration component 32 and a microphone component 33, where the base 31, the vibration component 32 and the microphone component 33 can be assembled to form an integral structure before the bone voiceprint sensor is assembled, then the integral structure is fixed on the PCB board 2, and then the shell is assembled on the PCB board 2, so that the packaging mode of the bone voiceprint sensor is greatly simplified, the packaging efficiency is improved, and the packaging cost is reduced.

In one particular embodiment, the vibration assembly 32 and the base 31 are integrally formed and are assembled together as a single piece. The advantage of encapsulation like this, on the one hand make full use of the space of the long and wide dimension in the airtight cavity 101 of bone voiceprint sensor, on the other hand also effectively reduced bone voiceprint sensor's height. Meanwhile, the base 31 can provide a platform for mounting the MEMS chip of the microphone assembly 33 and the ASIC chip 332, so as to facilitate mounting the MEMS chip and the ASIC chip 332.

For example, the soldering of the built-in component can be easily achieved by solder paste or silver paste only by designing a corresponding solder ring on the PCB board 2. The advantage of using solder paste or silver paste is that on the one hand the soldering strength can be improved and on the other hand the built-in components can be grounded, reducing the risk of static electricity or other properties. Of course, when the grounding treatment is not performed, the bone voiceprint sensor can be bonded by glue, so that the bone voiceprint sensor can be packaged conveniently.

In this embodiment, the base 31 is disposed on the PCB 2, the vibration component 32 and the microphone component 33 are disposed on the base 31, and the base 31 is configured to support the vibration component 32 and the microphone component 33, and meanwhile, the manner of disposing the microphone component 33 and the vibration component 32 in the bone voiceprint sensor can be simplified. The base 31, the vibration component 32, the microphone component 33 and the PCB 2 form a vibration cavity 105, and when the vibration component 32 vibrates, the vibration cavity 105 can be compressed, so that the airflow sound in the vibration cavity 105 changes.

In the embodiment of the present application, the vibration assembly 32 senses an external vibration signal and drives the airflow in the vibration cavity 105 to change, and the microphone assembly 33 senses the change of the airflow in the vibration cavity 105 to convert the vibration signal into an electrical signal. Wherein, the vibration component 32 and the microphone component 33 share the same vibration cavity 105, thereby fully utilizing the internal space of the bone voiceprint sensor and being beneficial to reducing the volume of the bone voiceprint sensor. Meanwhile, the vibration assembly 32 and the microphone assembly 33 share the same vibration chamber 105, and the vibration assembly 32 vibrates in the vibration chamber 105; the change in airflow in the vibration cavity 105 detected by the microphone assembly 33 improves the accuracy of the detection by the microphone assembly 33, thereby facilitating accurate conversion of the vibration signal into an electrical signal.

In the embodiment of the application, the base 31, the vibration component 32 and the microphone component 33 form a built-in component and are arranged in the closed cavity 101 formed by the shell 1 and the PCB 2, so that the packaging mode is simpler, the packaging efficiency is improved, and the packaging cost is saved.

Moreover, the bone voiceprint sensor in the embodiment of the present application has a reasonable structural design, and the vibration component 32 and the microphone component 33 share one vibration cavity 105, so that the space inside the bone voiceprint sensor is fully utilized, the volume of the bone voiceprint sensor is reduced, and the miniaturized design of the bone voiceprint sensor is facilitated.

Optionally, referring to fig. 1, the vibration assembly 32 includes a diaphragm 321 and a vibration mass 322;

the base 31 is provided with a first through hole 3111, and the diaphragm 321 is fixed on the base 31 and covers the first through hole 3111; the vibration block 322 is disposed on one side of the vibration film 321, which is close to the PCB 2.

In the above embodiment, the diaphragm 321 covers the first through hole 3111, and the vibration block 322 is disposed on the side of the diaphragm 321 close to the PCB board 2, so as to help to improve the vibration amplitude of the vibration component 32, and further, the airflow sounding change in the driving cavity can be driven well, so that the microphone component 33 is convenient to convert the vibration signal into the sound signal.

In addition, the MEMS chip in the vibration module 32 and the microphone module 33 share one vibration cavity 105. When the bone voiceprint sensor senses external vibration, the mass moves relatively, thereby compressing air in the vibration cavity 105, and then the MEMS chip senses fluctuation of air in the vibration cavity 105 through the second through hole 3112 and outputs an electrical signal. Vibration subassembly 32 and MEMS chip share a vibration chamber 105, only need open a third through hole 341 on base 31, just can give the MEMS chip with the vibration signal that vibration subassembly 32 felt, do not need like traditional bone voiceprint product preparation two airtight chamber 101, also do not need the air current in balanced product that punches on the quality piece, in order to prevent that bone voiceprint product from exploding the shell when backward flowing, therefore the bone voiceprint sensor that this application provided has saved the inner space, the processing degree of difficulty of the relevant material of bone voiceprint sensor has been reduced simultaneously.

Preferably, the vibration component 32 is located on a side of the base 31 close to the PCB 2, and the microphone component 33 is located on a side of the base 31 remote from the PCB 2. The vibration component 32 and the microphone component 33 are respectively located on two opposite sides of the base 31, which on one hand helps to fix the vibration component 32 and the microphone component 33 on the base 31, and on the other hand helps to fully utilize the structural surface of the base 31, so as to help to further optimize the structure of the bone voiceprint sensor, and further reduce the volume of the bone voiceprint sensor.

Optionally, referring to fig. 1, a groove 21 is provided at a position of the PCB 2 corresponding to the vibration block 322.

In the above embodiment, the grooves 21 increase the vibration space of the mass block, so that the mass block and the diaphragm 321 can vibrate in the vibration cavity 105 better, thereby driving the airflow in the vibration cavity 105 to change better, and helping to improve the accuracy of the microphone assembly 33 in sensing the airflow change.

Further, the groove 21 may be designed as a cuboid structure, and its width, length, and height may be designed according to the size of the vibration block 322 and the performance requirement of the bone voiceprint sensor. Of course, the shape of the recess 21 is not limited to a rectangular parallelepiped, but may be other shapes, such as an ellipsoid, etc.

Optionally, referring to fig. 2, the base 31 includes a first support stand 311 and a second support stand 312; the first support stand 311 has a height greater than that of the second support stand 312. A first through hole 3111 is formed on the first support table 311, and the diaphragm 321 is fixed to the first support table 311 and covers the first through hole 3111;

the microphone assembly 33 is fixed to the second support table 312.

In the above embodiment, since the microphone assembly 33 is disposed on the side of the second support table 312 away from the PCD plate, and the mass is disposed on the side of the diaphragm 321 close to the PCB 2, the first support table 311 and the second support table 312 are disposed with a certain height difference, which helps to further reduce the height of the built-in assembly, so that the volume of the bone acoustic line sensor can be further reduced.

Optionally, referring to fig. 3, the built-in assembly further includes a partition 34, the partition 34 being disposed at a side of the first support stand 311 near the PCB board 2 and extending to the PCB board 2, the partition 34 dividing the vibration cavity 105 into a first chamber 103 corresponding to the vibration assembly 32 and a second chamber 104 corresponding to the microphone assembly 33;

the partition 34 is provided with a third through hole 341 for communicating the first chamber 103 and the second chamber 104.

In the above embodiment, in order to improve the strength of the built-in component to meet the stress applied when the MEMS chip and the ASIC chip 332 chip are mounted, the built-in component is provided with a spacer 34, so that the structural strength of the bone voiceprint sensor is ensured, and the overall stability of the bone voiceprint sensor is improved. Meanwhile, the third through hole 341 is formed in the spacer 34, so that a vibration signal can be well transmitted to the MEMS chip.

Optionally, the microphone assembly 33 includes a mes chip 331, and the mes chip 331 is disposed on a side of the base 31 away from the PCB 2;

the base 31 is provided with a second through hole 3112, and the second through hole 3112 is communicated with the mes chip 331 and the vibration cavity 105.

In the above embodiment, the second through hole 3112 can better transmit the vibration signal of the vibration assembly 32 to the microphone assembly 33, which is advantageous for the microphone assembly 33 to accurately and rapidly convert the vibration signal into an electrical signal.

Optionally, the vibration assembly 32 further comprises an ASIC chip 332, the ASIC chip 332 is on a side of the chassis 31 remote from the PCB board 2, and the MEMS chip and the ASIC chip 332 are electrically connected. The capacitance of the MEMS chip will change correspondingly with the change of the incoming sound, and the ASIC chip 332 is used to process and output the changed capacitance signal, so as to pick up the sound. This enables the microphone assembly 33 to better convert the vibration signal into an electrical signal and output.

Alternatively, the MEMS chip is disposed side by side with the ASIC chip 332, and the MEMS chip is in contact with the ASIC chip 332. This helps to further optimize the structural design within the bone voiceprint sensor, facilitating quick placement of the ASIC chip 332 and MEMS chip on the chassis 31, while also being able to further reduce the space occupation of the microphone assembly 33 within the bone voiceprint sensor, facilitating further reduction of the volume of the bone voiceprint sensor.

Optionally, the ASIC chip 332 is connected to the PCB 2 through a gold wire 4. This makes the electrical connection between the ASIC chip 332 and the PCB board 2 very stable, facilitating signal transmission between the microphone assembly 33 and the PCB board 2.

Optionally, a pressure relief hole 102 is provided on the housing 1. The pressure relief hole 102 is beneficial to better balance the air pressure in the closed cavity 101, effectively prevents the bone voiceprint sensor from bursting, and improves the use safety of the bone voiceprint sensor. The bone voiceprint sensor provided by the embodiment of the application is reasonable in structural design, simple in packaging mode, and convenient to realize the miniaturized design of the bone voiceprint sensor, and not only improves the packaging efficiency.

Although specific embodiments of the present application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the application is defined by the appended claims.

Claims

1. A bone voiceprint sensor comprising:

the device comprises a shell (1) and a PCB (printed circuit board) (2), wherein a closed cavity (101) is formed between the shell (1) and the PCB (2);

the built-in assembly is arranged in the closed cavity (101), the built-in assembly comprises a base (31), a vibration assembly (32) and a microphone assembly (33), the base (31) is arranged on the PCB (2), the vibration assembly (32) and the microphone assembly (33) are respectively arranged on the base (31), a vibration cavity (105) is formed among the base (31), the vibration assembly (32), the microphone assembly (33) and the PCB (2), the vibration assembly (32) and the microphone assembly (33) share one vibration cavity (105), and the vibration assembly (32) and the microphone assembly (33) share one closed cavity (101);

the vibration assembly (32) senses an external vibration signal and drives the airflow in the vibration cavity (105) to change, and the microphone assembly (33) senses the change of the airflow in the vibration cavity (105) to convert the vibration signal into an electric signal.

2. The bone voiceprint sensor according to claim 1, wherein the vibrating assembly (32) includes a diaphragm (321) and a vibrating mass (322);

the base (31) is provided with a first through hole (3111), and the vibrating diaphragm (321) is fixed on the base (31) and covers the first through hole (3111); the vibrating block (322) is arranged on one side, close to the PCB (2), of the vibrating diaphragm (321).

3. Bone voiceprint sensor according to claim 2, wherein the PCB board (2) is provided with grooves (21) in a position corresponding to the vibrating mass (322).

4. The bone voiceprint sensor according to claim 2, wherein the base (31) includes a first support table (311) and a second support table (312); the height of the first supporting table (311) is larger than that of the second supporting table (312);

forming a first through hole (3111) on the first support (311), the diaphragm (321) being fixed to the first support (311) and covering the first through hole (3111);

the microphone assembly (33) is fixed to the second support table (312).

5. The bone voiceprint sensor according to claim 4, wherein the built-in assembly further comprises a diaphragm (34), the diaphragm (34) being disposed on a side of the first support table (311) proximate to the PCB board (2) and extending to the PCB board (2), the diaphragm (34) separating the vibration cavity (105) into a first chamber (103) corresponding to the vibration assembly (32) and a second chamber (104) corresponding to the microphone assembly (33);

the partition plate (34) is provided with a third through hole (341) which communicates the first chamber (103) and the second chamber (104).

6. Bone voiceprint sensor according to any one of claims 1-5, wherein the microphone assembly (33) comprises a MEMS chip (331), the MEMS chip (331) being disposed on a side of the chassis (31) remote from the PCB board (2);

the base (31) is provided with a second through hole (3112), and the second through hole (3112) is communicated with the MEMS chip (331) and the vibration cavity (105).

7. The bone voiceprint sensor according to claim 6, wherein the vibration assembly (32) further comprises an ASIC chip (332), the ASIC chip (332) is on a side of the chassis (31) remote from the PCB board (2), and the MEMS chip and the ASIC chip (332) are electrically connected.

8. The bone voiceprint sensor of claim 7, wherein the MEMS chip is disposed side-by-side with the ASIC chip (332) and the MEMS chip is in contact with the ASIC chip (332).

9. Bone voiceprint sensor according to claim 7, wherein the ASIC chip (332) is connected to the PCB board (2) by gold wires (4).

10. Bone voiceprint sensor according to claim 1, wherein the housing (1) is provided with a pressure relief hole (102).