CN114355144B - Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment - Google Patents
Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment Download PDFInfo
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- CN114355144B CN114355144B CN202210011130.XA CN202210011130A CN114355144B CN 114355144 B CN114355144 B CN 114355144B CN 202210011130 A CN202210011130 A CN 202210011130A CN 114355144 B CN114355144 B CN 114355144B
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- 238000012360 testing method Methods 0.000 title claims abstract description 51
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000003466 welding Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Abstract
The application relates to a signal loop connecting device, a system and a manufacturing method of silicon carbide double-pulse automatic testing equipment, which belong to the field of silicon carbide double-pulse testing equipment, wherein the device comprises a driving plate, and a plurality of ejector pins which are used for being in one-to-one correspondence contact with signal pins on an HPD module are arranged on the driving plate; one side of the driving plate is provided with a positioning plate, a plurality of through holes for the thimble and the signal needle to be inserted are formed in the positioning plate, and the through holes are formed from one side, close to the driving plate, of the positioning plate to one side, far away from the driving plate, of the positioning plate. When the HPD module is driven to one side of the locating plate, a plurality of signal pins are simultaneously inserted into corresponding through holes and move along a fixed path under the limitation of the corresponding through holes until contacting with corresponding ejector pins, and the signal driving circuit is communicated.
Description
Technical Field
The invention relates to the field of silicon carbide double-pulse testing equipment, in particular to a signal loop connecting device, a system and a manufacturing method of silicon carbide double-pulse automatic testing equipment.
Background
Silicon carbide is an inorganic substance, has the advantages of stable chemical property, high heat conductivity coefficient, small thermal expansion coefficient and the like, has at least 70 medium crystal morphology, and is often used for manufacturing power devices such as diodes due to the advantages of silicon carbide, so that the power devices have the advantages of high limit working temperature, high critical breakdown electric field strength, high heat conductivity and the like. Silicon carbide wafers also have good market prospects due to the widespread use of power devices.
Before power devices made from silicon carbide wafers are shipped, they are tested using a silicon carbide test platform, typically using a double pulse automated test equipment in the related art. In the testing process, the noise in the testing loop is an important index for measuring the testing performance, and the good low-noise loop is convenient for ensuring the testing performance.
The test loop mainly comprises a test main loop and a signal driving loop, and the miscellaneous feeling in the current test main loop is controlled to a certain extent. But the signal driving circuit is relatively long and has a large number of signal pins due to the design of the HPD module itself. When the HPD module is connected with the driving plate, the signal pins are ensured to be contacted with the driving plate at the same time, and the signal pins are ensured to be accurately contacted with the driving plate, so that the signal pins of the HPD module are connected with the driving plate in a wire connection mode in the related technology.
Specifically, one end of the twisted pair is connected with the signal pin of the HPD module, and then the other end of the twisted pair is fixed in a connecting device. When the HPD module and the drive board are required to be connected, the drive board is contacted with the connecting device. Because the structure of the connecting device is flexibly and variously arranged, the accurate and simultaneous contact of the signal needle and the driving plate is easier to realize. However, the inventors found that the test performance is lowered because the connection path is prolonged by the wire connection, and thus the noise in the signal driving circuit is increased.
Disclosure of Invention
In order to help reduce the noise in the signal driving circuit, the invention provides a signal circuit connecting device, a system and a manufacturing method of silicon carbide double-pulse automatic test equipment.
In a first aspect, the present application provides a signal loop connection device of a silicon carbide double pulse automatic test equipment, which adopts the following technical scheme:
the signal loop connecting device of the silicon carbide double-pulse automatic test equipment comprises a driving plate, wherein a plurality of ejector pins which are used for being in one-to-one correspondence contact with signal pins on an HPD module are arranged on the driving plate;
one side of the driving plate is provided with a positioning plate, the positioning plate is provided with a plurality of through holes for inserting the ejector pins and the signal pins, and the through holes are formed from one side of the positioning plate, which is close to the driving plate, to one side of the positioning plate, which is far away from the driving plate;
and after the thimble and the corresponding signal pin are inserted into the same through hole and contacted, the thimble and the corresponding signal pin are communicated with a signal driving circuit.
Through adopting above-mentioned technical scheme, when needs intercommunication signal drive return circuit, drive HPD module to one side of locating plate, signal pin on the HPD module all inserts in corresponding through-hole, and the thimble on the drive plate all is located corresponding through-hole, makes signal pin and the contact of corresponding thimble. The positioning plate has limiting and guiding functions on the ejector pins and the signal pins, so that a plurality of signal pins can be contacted with the corresponding ejector pins simultaneously and accurately, and the signal driving circuit is communicated. The ejector pins on the positioning plate and the driving plate are utilized to replace wire connection in the related technology, so that the accuracy of the HPD module and the driving plate can be ensured, the connection path length of the signal driving circuit can be shortened conveniently, and the noise in the signal driving circuit can be reduced.
Optionally, a plurality of positioning holes are formed in one side, away from the driving plate, of the positioning plate; each positioning hole corresponds to one through hole and is communicated with the corresponding through hole;
the aperture of the positioning hole, which is close to one side of the driving plate, is larger than the diameter of the signal needle, and the aperture of the positioning hole is gradually increased along the direction away from the driving plate.
Through adopting above-mentioned technical scheme, the aperture that the locating hole is close to HPD module one end is greater than the aperture that is close to drive plate one end, consequently when the signal needle inserts in the locating hole, if the signal needle has certain inclination, the signal needle not only still can get into in the locating hole, and can receive the restriction of locating hole, when entering into the through-hole, by rectifying the pendulum, get back to the exact position, be convenient for a plurality of signal needles can be simultaneously and accurate with the thimble abundant contact that corresponds.
Optionally, the driving plate is attached to the positioning plate and is fixedly connected with the positioning plate, and one end of the thimble, which is close to the positioning plate, is inserted into the corresponding through hole.
Through adopting above-mentioned technical scheme, the drive plate is laminated with the locating plate, is convenient for reduce the clearance between drive plate and the locating plate to help shortening signal drive circuit's path length, reduce miscellaneous sense. The driving plate is fixedly connected with the positioning plate, so that the thimble in the through hole is not easy to move, and the signal needles can be accurately and fully contacted with the corresponding thimble, so that the signal needles can be accurately and fully contacted with the corresponding thimble.
Optionally, the end surface area of the thimble at one end in the through hole is larger than the end surface area of the signal pin corresponding to contact, and a groove for inserting the corresponding signal pin is formed in the end surface of the thimble at one end in the through hole.
Through adopting above-mentioned technical scheme, the recess is seted up to the one end terminal surface of thimble, is convenient for increase thimble and signal needle's area of contact, guarantees signal drive circuit's connection stability.
Optionally, a plurality of ejector pins corresponding to the same HPD module are a group, and a plurality of groups of ejector pins corresponding to different HPD modules are arranged on the driving plate.
By adopting the technical scheme, the signal loop connecting device can be suitable for different HPD modules, and the applicability of the signal loop connecting device is improved.
In a second aspect, the present application provides a signal loop connection system of a silicon carbide double pulse automatic test equipment, which adopts the following technical scheme:
a signal loop connection system of silicon carbide double-pulse automatic test equipment comprises an HPD module, a bearing module and the signal loop connection device;
the HPD module is provided with a plurality of signal pins, and a main loop in the HPD module is electrically connected with the bearing module;
a through groove is formed in the bearing module; the signal loop connecting device is inserted into the through groove, and the positioning plate of the signal loop connecting device is connected with the bearing module.
Through adopting above-mentioned technical scheme, the recess of seting up in the carrier module is used for supplying signal return circuit connecting device to insert, and the locating plate is connected with the carrier module, and the drive plate is connected with the locating plate, makes carrier module, locating plate and drive plate integration setting. When the drive board is connected with the HPD module, the drive board is convenient to ensure accurate and stable connection with the HPD module while shortening the connection path.
Optionally, a driving board of the signal loop connection device is connected with one side of the positioning board away from the HPD module;
the bearing module is provided with a connecting hole;
the positioning plate is provided with a fixing hole, and the bearing module and the positioning plate are connected with bolts or positioning pins of the fixing hole through the connecting hole.
Through adopting above-mentioned technical scheme, locating plate utilizes bolt or locating pin fixed connection with bearing module, convenient and fast, and connection stability is convenient for obtain guaranteeing.
Optionally, one end of the ejector pin on the driving plate extends into the through hole of the positioning plate, and the other end extends to one side of the driving plate away from the positioning plate;
and one end of the thimble in the through hole is close to the side surface of the bearing module close to one side of the HPD module.
Through adopting above-mentioned technical scheme, be convenient for when signal pin inserts in the through-hole and contacts with corresponding thimble, the signal pin is shorter with the distance between the side of bearing module close to HPD module one side with the one end that the thimble contacted, the length of the reduction route of being convenient for helps reducing miscellaneous sense.
In a third aspect, the present application provides a method for manufacturing a signal loop connection system of a silicon carbide double-pulse automatic test device, which adopts the following technical scheme:
a method of making a signal loop connection system for silicon carbide double pulse automated test equipment, comprising:
manufacturing a positioning plate with a corresponding size based on the size of the driving plate;
corresponding grooves are formed in the bearing module based on the size of the positioning plate;
inserting the positioning plate into the through groove and connecting the positioning plate with the bearing module;
moving the HPD module to one side of the positioning plate, and punching a through hole on the positioning plate according to the position of a signal pin on the HPD module;
driving the HPD module to a test position;
and connecting the driving plate to one side of the positioning plate far away from the HPD module, and welding a thimble on the driving plate according to the position of the signal pin.
By adopting the technical scheme, the signal driving circuit is convenient to ensure that the path of the signal driving circuit is shorter, and the noise of the signal driving circuit is reduced.
Optionally, before the hole is drilled in the locating plate according to the signal pin position on the HPD module, the method further includes:
and a positioning hole is formed in one side of the positioning plate, which is close to the HPD module, the aperture of one side of the positioning hole, which is far away from the HPD module, is larger than the diameter of the signal pin on the HPD module, and the aperture of the positioning hole is gradually increased along the direction, which is close to the HPD module.
Through adopting above-mentioned technical scheme, the locating hole can be to producing crooked signal needle correction, guarantees that a plurality of signal needles homoenergetic and the thimble accuracy contact that corresponds, and a plurality of signal needles contact with the thimble that corresponds simultaneously.
In summary, through setting up the locating plate and setting up the thimble that is used for contacting with the signal needle on the drive plate, make HPD module and drive plate's connection need not to use the wire can simultaneously and accurate contact to shortened the path length of signal drive return circuit, reduced the miscellaneous sense.
Through the integration setting with drive plate, locating plate and carrier module, help guaranteeing that the accurate through-hole that inserts that corresponds of signal needle inserts appointed infiltration, a plurality of signal needles contact with the thimble that corresponds simultaneously, be convenient for improve test quality.
The locating holes are convenient for rectifying deviation of the signal needles which are deflected, so that the signal needles which are in a non-vertical or horizontal state due to processing precision can still be synchronously inserted into the through holes with other signal needles, and the connection quality of the signal driving circuit is convenient to ensure.
Drawings
Fig. 1 is an exploded view of a signal loop connection system of a silicon carbide double pulse automatic test equipment of the present embodiment.
Fig. 2 is a top view of a signal loop connection system of a silicon carbide double pulse automatic test equipment according to this embodiment.
Fig. 3 is a cross-sectional view of A-A in fig. 2.
Fig. 4 is an enlarged view of a portion a in fig. 3.
Fig. 5 is a flow chart of a method of making a signal loop connection system for a silicon carbide double pulse automatic test equipment according to this embodiment.
Reference numerals illustrate:
1. a signal loop connection device; 11. a driving plate; 111. a thimble; 1111. a groove; 12. a positioning plate; 121. a through hole; 122. positioning holes; 123. a fixing hole; 2. an HPD module; 21. a signal pin; 3. a load bearing module; 31. a through groove; 32. and a connection hole.
Detailed Description
The embodiment of the application discloses a signal loop connection system of silicon carbide double-pulse automatic test equipment, referring to fig. 1, the signal loop connection system comprises a signal loop connection device 1, an HPD module 2 and a bearing module 3, wherein a plurality of signal pins 21 are arranged on the HPD module 2, the whole bearing module 3 is of a plate-shaped structure, an existing circuit structure is embedded, and the bearing module 3 is electrically connected with a main loop in the HPD module 2; the electrical connection may be a circuit connection in the form of a PCB board or a line connection in the form of a twisted pair. Since the electrical connection between the HPD module 2 and the carrier module 3 is preset, i.e. the electrical circuit between the HPD module 2 and the carrier module 3 is already conductive. Therefore, the signal driving circuit is turned on after the HPD module 2 is connected to the signal circuit connection device 1. Since the position of the carrier module 3 and the position of the HPD module 2 are relatively fixed during testing, the path length of the signal driving circuit is mainly determined by the signal connection length between the carrier module 3 and the signal circuit connection device 1. That is, the closer the distance between the carrier module 3 and the signal circuit connection device 1 is, the shorter the path is, and the lower the noise of the signal driving circuit is.
In order to shorten the connection path of the signal driving circuit, referring to fig. 1, a through slot 31 is formed in the carrier module 3, the signal circuit connection device 1 is inserted into the through slot 31, and the positioning plate 12 of the signal circuit connection device 1 is connected with the carrier module 3. Specifically, referring to fig. 2, in the present embodiment, the driving board 11 of the signal circuit connection device 1 is connected to a side of the positioning board 12 away from the HPD module 2, and a plurality of connection holes 32 are formed in the carrier module 3. The central axis of the connecting hole 32 is a straight line, the connecting hole 32 is formed along the thickness direction of the bearing module 3, namely, the connecting hole 32 is formed from one side of the bearing module 3 close to the driving plate 11 to one side of the bearing module 3 far away from the positioning plate 12.
The positioning plate 12 is provided with a fixing hole 123, the fixing hole 123 is arranged corresponding to the connecting hole 32, and the bearing module 3 and the positioning plate 12 are connected with bolts or positioning pins of the fixing hole 123 through the connecting hole 32. It will be appreciated that when the positioning plate 12 and the carrier module 3 are connected by bolts, the fixing holes 123 are screw holes adapted to the bolts; in the case of connection by the connection pin, the positioning pin may be interference-fitted to the fixing hole 123 or the connection hole 32.
Referring to fig. 2, 3 and 4, the driving plate 11 is provided with a plurality of pins 111 in one-to-one correspondence with the signal pins 21, and the positioning plate 12 is provided with a plurality of through holes 121 for inserting the signal pins 21 and/or the pins 111. The ejector pin 111 and the signal pin 21 are made of conductive material, such as copper. After the positioning plate 12 is connected with the bearing module 3, one end of the ejector pin 111 on the driving plate 11 extends into the through hole 121 of the positioning plate 12, and the other end extends to one side of the driving plate 11 away from the positioning plate 12. In order to shorten the signal path, in this embodiment, an end of the ejector pin 111 located in the through hole 121 is close to a side of the carrier module 3 close to the HPD module 2. Compared with fig. 3, the lower surface of the carrying module 3 is a side surface close to the HPD module 2, so that the signal path can be shortened to 15mm, the noise in the signal driving circuit is reduced, and the testing quality is improved conveniently.
The signal-circuit connection device 1 will be described in detail below in connection with the above system.
The embodiment of the application also discloses a signal loop connecting device of silicon carbide double-pulse automatic testing equipment, referring to fig. 1, the signal loop connecting device comprises a driving plate 11 and a positioning plate 12, and a plurality of ejector pins 111 which are used for being in one-to-one correspondence contact with signal pins 21 on an HPD module 2 are arranged on the driving plate 11. The drive plate 11 is located on one side of the positioning plate 12, in particular, the drive plate 11 is located on the side of the positioning plate 12 remote from the HPD module 2 during testing. Referring to fig. 3, the positioning plate 12 is provided with a plurality of through holes 121 for inserting the ejector pins 111 and the signal pins 21. It should be noted that, only one thimble 111 and one signal pin 21 are inserted into each through hole 121, and the thimble 111 and the signal pin 21 inserted into the same through hole 121 are regarded as one-to-one correspondence. Since the signal pins 21 on the HPD module 2 are fixed in position, the opening positions of the through holes 121 on the positioning plate 12 and the soldering positions of the ejector pins 111 on the driving plate 11 are known. The through hole 121 is opened from a side of the positioning plate 12 close to the driving plate 11 to a side of the positioning plate 12 remote from the driving plate 11, as shown in fig. 3. During testing, the HPD module 2 is driven by the air cylinder to move towards the direction approaching to the positioning plate 12, so that the signal pins 21 are inserted into the corresponding through holes 121 and are contacted with the corresponding ejector pins 111, and then the signal driving circuit is communicated.
In this embodiment, in order to enable the signal circuit connection device 1 to be applied to HPD modules 2 of different types, several pins 111 corresponding to the same HPD module 2 are grouped into one group, and a plurality of groups of pins 111 corresponding to different HPD modules 2 are provided on the driving board 11.
Referring to fig. 3, a plurality of positioning holes 122 are formed in a side of the positioning plate 12 away from the driving plate 11, and each positioning hole 122 corresponds to and communicates with one through hole 121. The aperture of the positioning hole 122 on the side close to the driving plate 11 is larger than the diameter of the signal pin 21, and the aperture of the positioning hole 122 gradually increases in the direction away from the driving plate 11, specifically, the aperture of the positioning hole 122 refers to the diameter. For ease of understanding, referring to fig. 3, the aperture of the positioning hole 122 is gradually increased from top to bottom, and the aperture of the upper end of the positioning hole 122 is slightly larger than the diameter of the signal pin 21.
In the case of manufacturing and welding the signal pins 21, among the plurality of signal pins 21 on the same HPD module 2, the signal pins 21 in a non-completely vertical state are likely to occur due to the problem of precision, and if the signal pins 21 are directly brought into contact with the corresponding pins 111, it is difficult to ensure that the plurality of signal pins 21 are simultaneously and accurately brought into contact with the corresponding pins 111. In this embodiment, once the signal pin 21 is slightly inclined, when passing through the positioning hole 122, the inclined signal pin 21 contacts the hole wall of the positioning hole 122 due to the limitation of the shape of the positioning hole 122, and is stressed by the reverse supporting force, the signal pin 21 is rebound to return to the correct position, and is in a vertical state after being inserted into the through hole 121, so that the HPD module 2 can be simultaneously and accurately contacted with the thimble 111 on the driving plate 11 when rising to the testing position.
Referring to fig. 3, the driving plate 11 is attached to and fixedly connected with the positioning plate 12, and the fixed connection may be glue joint, welding or pressing, and the end of the thimble 111 near the positioning plate 12 is inserted into the corresponding through hole 121. Bringing the driving board 11 and the positioning board 12 into contact with each other facilitates shortening of the signal path.
The end surface area of the thimble 111 positioned at one end in the through hole 121 is larger than the corresponding contact end surface area of the signal needle 21, and the end surface of the thimble 111 positioned at one end in the through hole 121 is provided with a groove 1111 for the signal needle 21 to be inserted, so that the contact area and the contact stability of the thimble 111 and the signal needle 21 are conveniently increased.
The implementation principle of the signal loop connecting device of the silicon carbide double-pulse automatic testing equipment is as follows: the ejector pins 111 are arranged on the driving plate 11, and through the through holes 121 formed in the positioning plate 12, the ejector pins 111 and the signal pins 21 on the HPD module 2 are limited and guided, so that a plurality of signal pins 21 can be accurately contacted with the corresponding ejector pins 111 at the same time during testing. Since the drive board 11 and the HPD module 2 are not connected by wires, the signal path is shortened, and the noise in the signal drive circuit is reduced.
The embodiment of the application also discloses a method for manufacturing the signal loop connection system of the silicon carbide double-pulse automatic test equipment. Referring to fig. 5, comprising:
and S100, manufacturing a positioning plate 12 with a corresponding size based on the size of the driving plate 11.
The length of the positioning plate 12 is made not smaller than the length of the driving plate 11, and the width of the positioning plate 12 is made not smaller than the width of the driving plate 11. It should be noted that the size of the drive plate 11 cannot be smaller than the size of the HPD module 2.
S200, corresponding through grooves 31 are formed in the bearing module 3 based on the size of the positioning plate 12.
I.e. the cross-sectional area and shape of the through slot 31 is adapted to the cross-section of the positioning plate 12.
S300, inserting the positioning plate 12 into the through groove 31 and connecting the positioning plate 12 with the bearing module 3.
The connection mode can be through bolts or locating pins, or glue or welding.
S400, moving the HPD module 2 to one side of the positioning plate 12, and forming a positioning hole 122 on one side of the positioning plate 12 close to the HPD module 2.
The number of the positioning holes 122 is the same as the number of the signal pins 21 on the HPD module 2 or is more than the number of the signal pins 21 on the HPD module 2, but at least a plurality of positioning holes 122 should correspond to the positions of the signal pins 21 on the same HPD module 2 for the signal pins 21 to be inserted during the test. The aperture of the positioning hole 122 on the side away from the HPD module 2 is larger than the diameter of the signal pin 21 on the HPD module 2, and the aperture of the positioning hole 122 gradually increases in the direction approaching the HPD module 2.
S500, punching a through hole 121 on the positioning plate 12 according to the position of the signal pin 21 on the HPD module 2.
It will be understood that the position of the positioning hole 122 corresponds to the position of the signal pin 21, so that when the through holes 121 are formed, the through holes 121 may be formed according to the positions of the positioning holes 122, and each through hole 121 is correspondingly communicated with one positioning hole 122, and the central axes of the through holes are collinear.
S600, driving the HPD module 2 to the testing position.
The test position refers to the last positioning position of the HPD module 2 during test.
S700, connecting the driving board 11 to the side of the positioning board 12 away from the HPD module 2, and welding the ejector pins 111 on the driving board 11 according to the positions of the signal pins 21.
When the ejector pins 111 are welded, one end of the ejector pin 111 is inserted into the corresponding through hole 121 and is brought into contact with the signal pin 21 in the through hole 121.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (8)
1. The signal loop connecting device of the silicon carbide double-pulse automatic test equipment is characterized by comprising a driving plate (11), wherein a plurality of ejector pins (111) which are used for being in one-to-one corresponding contact with signal pins (21) on an HPD module (2) are arranged on the driving plate (11);
a positioning plate (12) is arranged on one side of the driving plate (11), a plurality of through holes (121) for inserting the ejector pins (111) and the signal pins (21) are formed in the positioning plate (12), and the through holes (121) are formed from one side of the positioning plate (12) close to the driving plate (11) to one side of the positioning plate (12) far away from the driving plate (11);
the thimble (111) and the corresponding signal needle (21) are inserted into the same through hole (121) and contacted with each other, and then are communicated with a signal driving circuit;
a plurality of positioning holes (122) are formed in one side, far away from the driving plate (11), of the positioning plate (12); each positioning hole (122) corresponds to one through hole (121) and is communicated with the corresponding through hole (121);
the aperture of the positioning hole (122) close to one side of the driving plate (11) is larger than the diameter of the signal needle (21), and the aperture of the positioning hole (122) is gradually increased along the direction away from the driving plate (11).
2. A signal loop connection apparatus for a silicon carbide double pulse automatic test equipment according to claim 1, wherein: the driving plate (11) is attached to the positioning plate (12) and fixedly connected with the positioning plate, and one end, close to the positioning plate (12), of the thimble (111) is inserted into the corresponding through hole (121).
3. A signal loop connection apparatus for a silicon carbide double pulse automatic test equipment according to claim 2, wherein: the end face area of one end of the thimble (111) positioned in the through hole (121) is larger than the end face area of the corresponding contact of the signal needle (21), and a groove (1111) for inserting the corresponding signal needle (21) is formed in the end face of one end of the thimble (111) positioned in the through hole (121).
4. A signal loop connection for a silicon carbide double pulse automatic test equipment according to any of claims 1-3, wherein: the plurality of ejector pins (111) corresponding to the same HPD module (2) are in one group, and a plurality of groups of ejector pins (111) corresponding to different HPD modules (2) are arranged on the driving plate (11).
5. A signal loop connection system of silicon carbide double-pulse automatic test equipment is characterized in that: comprising an HPD module (2), a carrier module (3) and a signal loop connection device (1) according to any of claims 1-4;
a plurality of signal pins (21) are arranged on the HPD module (2), and a main loop in the HPD module (2) is electrically connected with the bearing module (3);
a through groove (31) is formed in the bearing module (3); the signal loop connecting device (1) is inserted into the through groove (31), and the positioning plate (12) of the signal loop connecting device (1) is connected with the bearing module (3).
6. A signal loop connection system for a silicon carbide double pulse automatic test equipment according to claim 5, wherein: a driving plate (11) of the signal loop connecting device (1) is connected with one side of the positioning plate (12) far away from the HPD module (2);
the bearing module (3) is provided with a connecting hole (32);
the positioning plate (12) is provided with a fixing hole (123), and the bearing module (3) and the positioning plate (12) are connected with bolts or positioning pins of the fixing hole (123) through the connecting hole (32).
7. A signal loop connection system for a silicon carbide double pulse automatic test equipment according to claim 5 or 6, wherein: one end of a thimble (111) on the driving plate (11) extends into a through hole (121) of the positioning plate (12), and the other end extends to one side of the driving plate (11) away from the positioning plate (12);
one end of the thimble (111) positioned in the through hole (121) is close to the side surface of the carrying module (3) close to one side of the HPD module (2).
8. A method of making a signal loop connection system of a silicon carbide double pulse automatic test equipment of any one of claims 5-7, comprising:
manufacturing a positioning plate (12) with corresponding size based on the size of the driving plate (11);
corresponding through grooves (31) are formed in the bearing module (3) based on the size of the positioning plate (12);
inserting the positioning plate (12) into the through groove (31) and connecting the positioning plate (12) and the bearing module (3);
moving the HPD module (2) to one side of the positioning plate (12), and punching a through hole (121) on the positioning plate (12) according to the position of a signal pin (21) on the HPD module (2);
driving the HPD module (2) to a test position;
connecting the driving plate (11) to one side of the positioning plate (12) far away from the HPD module (2), and welding a thimble (111) on the driving plate (11) according to the position of the signal pin (21);
before a through hole (121) is formed in the locating plate (12) according to the position of the signal pin (21) on the HPD module (2), a locating hole (122) is formed in one side, close to the HPD module (2), of the locating plate (12), the aperture of one side, far away from the HPD module (2), of the locating hole (122) is larger than the diameter of the signal pin (21) on the HPD module (2), and the aperture of the locating hole (122) is gradually increased along the direction, close to the HPD module (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210011130.XA CN114355144B (en) | 2022-01-05 | 2022-01-05 | Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210011130.XA CN114355144B (en) | 2022-01-05 | 2022-01-05 | Signal loop connecting device, system and manufacturing method of silicon carbide double-pulse automatic test equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114355144A CN114355144A (en) | 2022-04-15 |
| CN114355144B true CN114355144B (en) | 2024-02-09 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4866375A (en) * | 1984-06-22 | 1989-09-12 | Malloy James T | Universal test fixture |
| TW201226947A (en) * | 2010-12-22 | 2012-07-01 | Foxconn Advanced Tech Inc | Apparatus for testing printed circuit board and method for testing printed circuit board |
| CN203894283U (en) * | 2014-04-30 | 2014-10-22 | 上海华力微电子有限公司 | Probe card and probe device having the above probe card |
| KR101479929B1 (en) * | 2013-08-30 | 2015-01-22 | 윌테크놀러지(주) | needle block for semiconductor test apparatus improving performance in high frequency |
| CN207036996U (en) * | 2017-06-21 | 2018-02-23 | 科络普线束技术（绵阳）有限公司 | A kind of wire harness conducting test device |
| CN108020770A (en) * | 2017-10-31 | 2018-05-11 | 东莞华贝电子科技有限公司 | The test system and method for circuit board assemblies |
| CN112305409A (en) * | 2020-10-30 | 2021-02-02 | 珠海太川云社区技术股份有限公司 | Circuit board testing device and manufacturing method thereof |
| TWM611776U (en) * | 2020-12-30 | 2021-05-11 | 致茂電子股份有限公司 | An automated test system using bridge connection |
| CN113725641A (en) * | 2020-05-25 | 2021-11-30 | 深南电路股份有限公司 | Cable connecting device, connecting assembly and manufacturing method of connecting assembly |
-
2022
- 2022-01-05 CN CN202210011130.XA patent/CN114355144B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4866375A (en) * | 1984-06-22 | 1989-09-12 | Malloy James T | Universal test fixture |
| TW201226947A (en) * | 2010-12-22 | 2012-07-01 | Foxconn Advanced Tech Inc | Apparatus for testing printed circuit board and method for testing printed circuit board |
| KR101479929B1 (en) * | 2013-08-30 | 2015-01-22 | 윌테크놀러지(주) | needle block for semiconductor test apparatus improving performance in high frequency |
| CN203894283U (en) * | 2014-04-30 | 2014-10-22 | 上海华力微电子有限公司 | Probe card and probe device having the above probe card |
| CN207036996U (en) * | 2017-06-21 | 2018-02-23 | 科络普线束技术（绵阳）有限公司 | A kind of wire harness conducting test device |
| CN108020770A (en) * | 2017-10-31 | 2018-05-11 | 东莞华贝电子科技有限公司 | The test system and method for circuit board assemblies |
| CN113725641A (en) * | 2020-05-25 | 2021-11-30 | 深南电路股份有限公司 | Cable connecting device, connecting assembly and manufacturing method of connecting assembly |
| CN112305409A (en) * | 2020-10-30 | 2021-02-02 | 珠海太川云社区技术股份有限公司 | Circuit board testing device and manufacturing method thereof |
| TWM611776U (en) * | 2020-12-30 | 2021-05-11 | 致茂電子股份有限公司 | An automated test system using bridge connection |
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| CN114355144A (en) | 2022-04-15 |
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