CN114343656A - Microneedle for nerve interface - Google Patents
Microneedle for nerve interface Download PDFInfo
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- CN114343656A CN114343656A CN202210023298.2A CN202210023298A CN114343656A CN 114343656 A CN114343656 A CN 114343656A CN 202210023298 A CN202210023298 A CN 202210023298A CN 114343656 A CN114343656 A CN 114343656A
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- 210000005036 nerve Anatomy 0.000 title description 2
- 230000001537 neural effect Effects 0.000 claims abstract description 18
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- 238000000034 method Methods 0.000 claims description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 30
- 229910021389 graphene Inorganic materials 0.000 claims description 27
- 239000000560 biocompatible material Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
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- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 4
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
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- 229910000679 solder Inorganic materials 0.000 claims 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a micro-needle for a neural interface, which comprises at least one micro-needle body, wherein the micro-needle body comprises at least one body electrode, at least one electrode contact is arranged on the body electrode, and the electrode contact is made of a conductive material. At least one electrode contact is arranged on the body electrode, so that more signals can be collected, and further the spatial resolution and the signal accuracy are improved.
Description
Technical Field
The invention belongs to the technical field of neural interfaces, and particularly relates to a microneedle for a neural interface.
Background
In the neural interface system, the brain signals are acquired through the electrodes, wherein the electrodes comprise invasive forms, non-invasive forms and the like, and the brain signals acquired by the invasive electrodes are more accurate and more reliable. At present, an invasive micro-needle structure mostly adopts a silicon-based material, and a metal electrode contact is processed on a body electrode by adopting an electroplating or lift-off process; the metal electrode contact has no excellent biocompatibility, is easy to cause structural damage when being implanted into a brain tissue structure, and is not favorable for long-term stable work.
Disclosure of Invention
The invention relates to a microneedle for a neural interface and a preparation method thereof, and a microneedle for the neural interface and a preparation method of a microneedle structure, which are formed by integrally connecting a microneedle body and an integrated circuit chip, and at least can solve part of defects in the prior art.
In order to solve the foregoing problems, the present embodiment provides a microneedle for a neural interface, including at least one microneedle body, where the microneedle body includes at least one body electrode, and the body electrode is provided with at least one electrode contact, and the electrode contact is made of a conductive material.
Furthermore, the conductive material is made of a biocompatible material.
Further, the biocompatible material comprises graphene, Au, pt, Ti, or an alloy.
Further, the electrode contact is manufactured by adopting a semiconductor process.
Further, the semiconductor process comprises a dry transfer mode or a vapor deposition method.
Further, the electrode contacts are coated with iridium oxide or a polymer.
Furthermore, the tail part of the micro needle body is provided with at least one welding spot, and the welding spot is connected with the corresponding electrode contact through a connecting wire.
Further, the electrode contact is circular or polygonal in shape.
Further, the electrode contacts on the body electrode are arranged in a staggered or array manner.
Further, the width of the bulk electrode is less than 500 microns.
The invention has at least the following beneficial effects: the invention provides a micro-needle for a neural interface, which comprises at least one micro-needle body, wherein the micro-needle body comprises at least one body electrode, at least one electrode contact is arranged on the body electrode, and the electrode contact is made of a conductive material. At least one electrode contact is arranged on the body electrode, so that more signals can be collected, and further the spatial resolution and the signal accuracy are improved. At least one electrode contact is arranged on the body electrode, so that more signals can be collected, and further the spatial resolution and the signal accuracy are improved.
Furthermore, compared with the conventional silicon substrate electrode, the graphene electrode point adopted by the invention has better biocompatibility, and can avoid structural damage to brain tissue structures and the like when the micro-needle is immersed; the graphene electrode point has higher mechanical strength and conductivity, and accordingly, the working reliability of the microneedle can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of a microneedle body according to an embodiment of the present invention;
fig. 2 is a schematic view of a microneedle structure provided in an embodiment of the present invention;
fig. 3 is a process schematic diagram of a TSV interconnection method according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the embodiment provides a micro-needle for a neural interface, which comprises at least one micro-needle body, wherein the micro-needle body comprises at least one body electrode, at least one electrode contact is arranged on the body electrode, and the electrode contact is made of a conductive material.
In a specific application scenario, the conductive material is made of a biocompatible material. Wherein the biocompatible material comprises graphene, Au, pt, Ti or an alloy.
In this embodiment, the electrode contact is formed by a semiconductor process. The semiconductor process comprises a dry transfer mode or a vapor deposition method. The vapor deposition method comprises a chemical vapor deposition method and a physical vapor deposition method, wherein the physical vapor deposition method is adopted to deposit metal, and the chemical vapor deposition method is adopted to deposit graphene.
In a preferred embodiment, the electrode contact is coated with iridium oxide or polymer to increase the impedance of the electrode contact, increase the loading capacity of the electrode contact and avoid charge loss.
In this embodiment, the tail of the micro pin body has at least one welding point, and the welding point is connected with the corresponding electrode contact through a connecting wire. The electrode contact is circular or polygonal in shape. The polygon comprises a quadrangle, a hexagon and the like, when the electrode contact is made of graphene, the shape of the electrode contact is hexagonal, and when the electrode contact is made of Au, pt, Ti or alloy, the shape of the electrode contact is quadrangle, hexagon or circle and the like.
In this embodiment, the electrode contacts on the body electrode are arranged in a staggered or array configuration. The width of the bulk electrode is less than 500 microns.
Compared with a conventional silicon substrate electrode, the graphene electrode points are adopted, so that the electrode has better biocompatibility, and structural damage to brain tissue structures and the like caused by the invasion of microneedles can be avoided; the graphene electrode point has higher mechanical strength and conductivity, and accordingly, the working reliability of the microneedle can be improved.
Example two:
referring to fig. 1, an embodiment of the present invention provides a microneedle for a neural interface, including at least one microneedle body 1, where the microneedle body 1 includes a tail 11 of the microneedle body and at least one bulk electrode 12 formed on the tail 11 of the microneedle body, the bulk electrode 12 is provided with at least one electrode contact 121, and the electrode contact 121 is made of a biocompatible material, where the biocompatible material includes graphene, Au, pt, Ti, or an alloy.
In a preferred embodiment, the electrode contact 121 is made of graphene, and iridium oxide or a polymer is coated on the electrode contact to increase the loading capacity of the electrode contact and prevent charge loss.
In one embodiment, as shown in fig. 1, the tail 11 of the microneedle body is plate-shaped, and the individual electrodes 12 are disposed on one side of the tail 11 of the microneedle body, and the individual electrodes 12 are sequentially arranged along the length direction of the side; generally, the individual electrodes 12 are arranged at regular intervals.
Generally, the body electrode 12 has a plurality of electrode contacts 121 thereon for acquiring signals. The bulk electrodes 12 are preferably of the same specification, for example, the shape, length, etc. of the bulk electrodes 12 are the same; the number and arrangement of the electrode contacts 121 on each body electrode 12 may be the same or different, and the same number and arrangement of the electrode contacts 121 are generally used. Optionally, the bulk electrode is a silicon-based substrate; and/or, the tail 11 of the micro needle body is the tail of the silicon-based micro needle body; preferably, both are made of silicon-based materials, and the bulk electrode is integrally extended on the tail 11 of the microneedle body.
Compared with a conventional silicon substrate electrode, the graphene electrode point has better biocompatibility, and structural damage to brain tissue structures and the like caused by microneedle invasion can be avoided; the graphene electrode point has higher mechanical strength and conductivity, and accordingly, the working reliability of the microneedle can be improved.
In one embodiment, the graphene layer is a graphene film. Preferably, the graphene layer is formed as follows:
firstly, preparing a graphene film, specifically: putting the metal foil into a production furnace, introducing protective gas into the production furnace to protect and heat the metal foil to 800-1200 ℃, stabilizing the temperature and keeping the temperature for 15-30 min; then stopping introducing the protective gas, introducing the carbon source gas, cutting off the power supply after the reaction is finished, and stopping introducing the carbon source gas; and introducing protective gas to exhaust the carbon source gas, cooling the furnace to room temperature in the protective gas environment, and taking out the metal foil to obtain the graphene film on the metal foil.
After the graphene film is grown and manufactured, the graphene film can be transferred to the bulk electrode by means of dry transfer and the like.
In further embodiments, a graphene material is deposited on the bulk electrode to form the graphene layer. Preferably, the graphene layer is deposited as follows.
Further optimizing the structure of the micro pin body 1, as shown in fig. 1, a plurality of connecting through holes 100 are formed on the tail 11 of the micro pin body, and each connecting through hole 100 is filled with a conductive metal; electrical connection lines are provided in the body electrodes and to which the corresponding electrode contacts 121 are connected, the electrical connection lines being connected to the conductive metal in a portion of the connection through-holes 100. Preferably, the connection Via 100 is formed by a TSV (Through-Silicon-Via) process, and as a preferred scheme, the manufacturing of the connection Via 100 and the filling of the conductive metal specifically include the following steps:
(1) as shown in fig. 3, a groove 101 is etched on one side surface of the tail 11 of the micro-needle body, wherein, understandably, the groove depth direction is parallel to the thickness direction of the member; in one embodiment, after the tail 11 of the micro-needle body is coated with photoresist, the groove 101 with a certain depth is formed by etching through a DRIE process (i.e. a deep silicon etching process), obviously, the groove depth of the groove 101 is less than the thickness of the tail 11 of the micro-needle body;
(2) as shown in fig. 3, a metal film is deposited on the grooved side surface of the tail 11 of the micro-needle body as a plating seed layer 102; the deposition method of the metal film is the conventional technology in the field, and is omitted here;
(3) and electroplating conductive metal on the grooved side surface of the tail part 11 of the micro needle body, and forming a metal column 104 at the grooved position, wherein the top end of the metal column 104 protrudes out of the groove. Wherein, the electroplating of the conductive metal can adopt the conventional electroplating metal operation, and the details are not described herein; it will be appreciated that the metal posts 104 extend outwardly from the bottom of the slot, and may protrude slightly beyond the slot; preferably, before the electroplating operation, the photoresist 103 is coated on the side surface of the groove to be developed, so that the metal film in the groove is exposed, and the electroplating accuracy is ensured;
(4) removing the metal layer except the metal column 104; optionally, removing the metal layer by a wet etching method;
(5) thinning the other side surface of the tail 11 of the micro needle body to expose the bottom end of the metal column 104; the thinning process may be polishing or the like.
Thus, even if the above-mentioned via hole 100 is formed and the via hole 100 is filled with a conductive metal, the structure of the via hole 100 and the structure of the conductive metal bonded to the via hole 100 are also clearly defined in the above-mentioned method (for example, the conductive metal includes a plating seed layer 102 attached to the wall surface of the via hole 100 and a plating body formed by plating on the plating seed layer 102).
In one embodiment, the conductive metal is copper; preferably, titanium is used as the plating seed layer 102, which can function as an adhesion for better adhesion of the conductive metal to the corresponding structure. Of course, copper is not limited to be used as the conductive metal, and other conductive metals are also suitable.
Because the top end of the metal column 104 protrudes out of the groove, when the two connecting through holes 100 are butted, the top end of the metal column 104 of one through hole is abutted with the bottom end of the metal column 104 of the other through hole, so that the condition that the metal column 104 can not be reliably contacted due to the clearance between the components when the two components are jointed and connected can be avoided, and the reliability of the electrical connection between the tail 11 of the micro-needle body and other components can be ensured. In one embodiment, as shown in fig. 3, the top end of the metal pillar 104 is curved, and the metal pillar 104 is easily formed by electroplating, and is easily pressed and fastened when other metal pillars 104 are abutted.
Further preferably, as shown in fig. 1 and fig. 2, the connection through holes 100 on the tail 11 of the micro-needle body are distributed in an array, wherein the row direction of the through hole array is parallel to the length direction of the body electrodes 12, the column direction of the through hole array is parallel to the arrangement direction of the body electrodes 12, the number of rows in the through hole array is the same as the number of the body electrodes 12, and the through holes 100 are arranged in a one-to-one correspondence manner, and each row of the connection through holes 100 is connected with the electrical connection line of the corresponding body electrode 12. Wherein, preferably, the extension line of the root portion of each body electrode 12 passes through a row of the connection through holes 100. Based on the structure, the reliability of the connection between the tail part 11 of the micro needle body and the body electrode 12 can be ensured, and the accuracy and the reliability of signal transmission are further ensured.
In this embodiment, the connecting through hole 100 is formed on the tail 11 of the microneedle body by using a TSV process, and is suitable for being electrically connected with other members by using a TSV interconnection technology, so that signal input and signal output can be realized, the functionality of the neural interface system can be optimized accordingly, and clinical requirements can be better met.
Example three:
the embodiment of the present invention provides a method for preparing a microneedle for a neural interface in the first embodiment, including:
preparing a combined structure of the tail 11 of the micro needle body and a body electrode 12, wherein a plurality of electrode contacts 121 are reserved on the surface of the body electrode;
a graphene layer is formed on the bulk electrode corresponding to the bulk electrode 12.
As for the graphene film type graphene layer and the method for forming the deposited graphene layer, it has been described in the first embodiment, and will not be described herein.
Example four:
referring to fig. 2, the microneedle for neural interfaces according to an embodiment of the present invention includes a microneedle body 1 and an integrated circuit chip 2, where the microneedle body 1 is the microneedle for neural interfaces according to the first embodiment, and the integrated circuit chip 2 is integrally connected to a tail 11 of the microneedle body.
The micro pin body 1 preferably adopts a structure that a plurality of connecting through holes 100 are formed on the tail 11 of the micro pin body, and each connecting through hole 100 is filled with conductive metal; the integrated circuit chip 2 is also preferably provided with a connecting through hole 100 filled with conductive metal by adopting a TSV (through silicon via) process; the tail 11 of the micro needle body 1 is fixedly attached to the integrated circuit chip 2, and the connecting through holes 100 of the micro needle body and the integrated circuit chip are identical in number and are communicated in a one-to-one opposite mode.
The manufacturing method of the "connecting through hole 100 filled with conductive metal" on the integrated circuit chip 2 can refer to the related scheme on the micro pin body 1, and is not described herein again.
In one embodiment, the ic chip 2 is a plate-shaped or block-shaped member, which can be attached and fixed to the tail 11 of the plate-shaped micro-needle body in a surface-attachment manner. In this embodiment, the integrated circuit chip 2 employs a CMOS (Complementary Metal Oxide Semiconductor) circuit unit, which has the characteristics of low cost, high integration level, low power consumption, high compatibility, and the like, and can realize input and output of signals, thereby facilitating acquisition of brain signals and signal transmission to a neural interface system (including processing of screening and amplifying the acquired brain signals); particularly, the CMOS circuit unit adopts a silicon-based circuit structure, and is suitable for being well combined and fixed with the tail 11 of the silicon-based micro pin body.
In one embodiment, the tail 11 of the micro pin body is bonded and connected with the integrated circuit chip 2, and particularly for the silicon-based circuit structure and the tail 11 of the silicon-based micro pin body, the operation is convenient, and the connection stability is high.
Optionally, the integrated circuit chip 2 is provided with a test pad 21, the test pad 21 may adopt a structure such as a test pad, and the test pad 21 is widely applied in a CMOS circuit unit, which is not described herein again.
In the microneedle structure provided by the embodiment, the microneedle body 1 and the integrated circuit chip 2 are integrated, so that signal input and signal output can be realized, the functionality of a neural interface system is correspondingly optimized, and clinical requirements are better met; the micro pin body 1 and the integrated circuit chip 2 are electrically connected based on the TSV interconnection technology, the connection reliability is high, the accuracy and the reliability of signal acquisition and transmission can be improved, meanwhile, the micro pin body 1 and the integrated circuit chip 2 can be prepared by respectively adopting mature processes, the process compatibility is high, and the preparation cost can be effectively reduced.
The embodiment of the invention also provides a preparation method of the microneedle for the neural interface, which comprises the following steps,
s1, providing a micro-needle body 1 and an integrated circuit chip 2;
s2, forming connection through holes 100 on the tail 11 of the micro pin body and the ic chip 2, respectively, wherein the method for forming the connection through holes 100 includes:
s21, etching a groove 101 on one side surface of the corresponding component;
s22, depositing a metal film on the grooved side surface of the corresponding member as a plating seed layer 102;
s23, plating conductive metal on the side surface of the corresponding component, forming a metal column 104 at the position of the groove, wherein the top end of the metal column 104 protrudes out of the groove; removing the metal layer except the metal column 104;
s24, thinning the other side surface of the corresponding component to expose the bottom end of the metal column 104;
s3, the tail 11 of the micro needle body is attached to the integrated circuit chip 2, so that the connecting through holes 100 of the micro needle body and the integrated circuit chip are aligned one by one, and in the two opposite connecting through holes 100, the top end of the metal column 104 of one through hole is abutted against the bottom end of the metal column 104 of the other through hole; the tail 11 of the micro-pin is then attached to the integrated circuit chip 2.
The method for forming the connecting through hole 100 is described in detail in the first embodiment, and related contents are omitted here.
In S3, the tail 11 of the micro-pin and the ic chip 2 are preferably bonded.
In addition, the connection scheme based on the TSV interconnection technology can better meet the expansion requirements of the microneedle device, enables integration of a plurality of microneedle bodies 1 to be possible, improves the accuracy, comprehensiveness and effectiveness of signal acquisition, and is beneficial to clinical application. As in fig. 2, specifically:
the micro needle structure comprises two micro needle bodies 1 and an integrated circuit chip 2, wherein the two micro needle bodies 1 are distributed on two sides of the integrated circuit chip 2, and each micro needle body 1 and the integrated circuit chip 2 are electrically connected by adopting the TSV interconnection technology;
or, the micro-needle structure comprises a plurality of micro-needle bodies 1 and a plurality of integrated circuit chips 2, wherein each micro-needle body 1 and each integrated circuit chip 2 are arranged in a staggered layer, and each micro-needle body 1 and the adjacent integrated circuit chip 2 are electrically connected by adopting the TSV interconnection technology.
Compared with the conventional single-row microneedle, the microneedle structure provided by the embodiment can form a microneedle array, has more electrode contacts 121, collects signals more comprehensively and accurately, and has extremely high reliability.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A micro-needle for a neural interface comprises at least one micro-needle body, wherein the micro-needle body comprises at least one body electrode, at least one electrode contact is arranged on the body electrode, and the electrode contact is made of a conductive material.
2. A microneedle according to claim 1, wherein the conductive material is made of a biocompatible material.
3. A microneedle according to claim 2, wherein the biocompatible material comprises graphene, Au, pt, Ti or an alloy.
4. A microneedle according to claim 1, wherein the electrode contact is made using a semiconductor process.
5. A microneedle according to claim 4, wherein the semiconductor process comprises a dry transfer method or a vapor deposition method.
6. A microneedle according to claim 1, wherein the electrode contact is coated with iridium oxide or a polymer.
7. A microneedle according to any one of claims 1 to 6, wherein the end portion of the microneedle body has at least one solder joint connected to the corresponding electrode contact by a connecting wire.
8. A microneedle according to any of claims 1 to 6, in which the electrode contact is circular or polygonal in shape.
9. A microneedle according to any of claims 1 to 6, wherein the electrode contacts on the bulk electrode are staggered or arrayed.
10. A microneedle according to any of claims 1 to 6, in which the width of the bulk electrode is less than 500 microns.
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| CN202210023298.2A CN114343656A (en) | 2022-01-10 | 2022-01-10 | Microneedle for nerve interface |
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