CN114323012A - Data processing method of double-MEMS (micro-electromechanical systems) inertia measurement unit and double-MEMS inertia measurement device - Google Patents
Data processing method of double-MEMS (micro-electromechanical systems) inertia measurement unit and double-MEMS inertia measurement device Download PDFInfo
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Abstract
The embodiment of the application provides a data processing method of a double-MEMS inertial measurement unit and a double-MEMS inertial measurement device, and relates to the technical field of inertial measurement. The dual MEMS inertial measurement unit includes a first inertial sensor and a second inertial sensor, the method comprising: obtaining calibration data of the double MEMS inertial measurement units; acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor; processing the first sensor data and the second sensor data to obtain inertial measurement data; and compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result. The method can achieve the technical effects of improving the accuracy and stability of the inertial data and reducing the occupied space and cost.
Description
Technical Field
The present application relates to the field of inertial measurement technologies, and in particular, to a data processing method and system for a dual MEMS inertial measurement unit, a dual MEMS inertial measurement apparatus, an electronic device, and a computer-readable storage medium.
Background
At present, an IMU (Inertial Measurement Unit) is used for measuring acceleration and angular velocity of a carrier, is a core information source in SINS (Strapdown Inertial Navigation System), and is widely applied in the fields of intelligent driving, national defense, aerospace, modern agriculture and the like.
In the prior art, along with the development and great progress trend of the current technology, miniaturization is beneficial to reducing product cost, product installation is easy, and a Micro-Electro-Mechanical System (MEMS) inertial sensor has no alternative advantage in the aspect of miniaturization. The existing inertial measurement unit usually adopts a plurality of single-axis MEMS inertial sensors, which can not only ensure the accuracy and stability of data, but also have high cost and large occupied space.
Disclosure of Invention
An object of the embodiments of the present application is to provide a data processing method and system for a dual MEMS inertial measurement unit, an electronic device, and a computer-readable storage medium, which can achieve the technical effects of improving the accuracy and stability of inertial data and reducing the occupied space and cost.
In a first aspect, an embodiment of the present application provides a data processing method for a dual MEMS inertial measurement unit, where the dual MEMS inertial measurement unit includes a first inertial sensor and a second inertial sensor, and the method includes:
obtaining calibration data of the double MEMS inertial measurement units;
acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor;
processing the first sensor data and the second sensor data to obtain inertial measurement data;
and compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result.
In the implementation process, the dual-MEMS inertial measurement unit comprises two inertial sensors (namely a first inertial sensor and a second inertial sensor), and the inertial measurement result is finally obtained by further processing first sensor data and second sensor data acquired by the first inertial sensor and the second inertial sensor; compared with a single inertial sensor, the method can improve the accuracy and stability of inertial measurement data; compared with a plurality of inertial sensors (more than two), the method can reduce the occupied space and cost of equipment, and achieve the balance between the accuracy and stability of data and the occupied space and cost; therefore, the method can achieve the technical effects of improving the accuracy and stability of the inertial data and reducing the occupied space and cost.
Further, before the step of acquiring the first sensor data collected by the first inertial sensor and the second sensor data collected by the second inertial sensor, the method further includes:
and self-checking the double MEMS inertia measurement units to generate a self-checking result.
In the implementation process, the double-MEMS inertial measurement unit is subjected to self-checking before the first inertial sensor and the second inertial sensor start to acquire data, so that the accuracy of data output of the MEMS inertial measurement unit is subjected to self-checking.
Further, the step of performing self-test on the dual MEMS inertial measurement unit to generate a self-test result includes:
configuring a self-checking register of the double MEMS inertial measurement unit for the first time, and acquiring first inertial measurement self-checking data;
performing second configuration on a self-checking register of the double MEMS inertial measurement unit, and acquiring second inertial measurement self-checking data;
and generating the self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
In the implementation process, the double MEMS inertia measurement units are configured twice respectively, data acquisition is carried out under different configurations, and first inertia measurement self-checking data and second inertia measurement self-checking data are obtained; the data accuracy of the double MEMS inertia measurement unit can be verified by the self-checking result through judging the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
Further, the step of writing the calibration data into an internal memory of the dual MEMS inertial measurement unit through a communication interface and storing the calibration data in the internal memory of the dual MEMS inertial measurement unit includes:
and executing the reading operation of the internal memory after the double MEMS inertial measurement unit is electrified, and reading the calibration data.
In the implementation process, the calibration data is built in an internal memory of the dual-MEMS inertial measurement unit, and when the dual-MEMS inertial measurement unit is powered on, the calibration data can be automatically read.
Further, before the step of processing the first sensor data and the second sensor data to obtain inertial measurement data, the method further includes:
acquiring configuration data of the double MEMS inertial measurement unit;
obtaining the output frequency of the double MEMS inertia measurement unit according to the configuration data;
and filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
Further, the step of performing filtering processing on the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data includes:
and carrying out mean value filtering processing on the first sensor data and the second sensor data according to the output frequency to obtain first filtering sensor data and second filtering sensor data.
Further, the step of processing the first sensor data and the second sensor data to obtain inertial measurement data includes:
and carrying out mean value processing on the first filtering sensor data and the second filtering sensor data to obtain the inertia measurement data.
Further, before the step of averaging the first filtered sensor data and the second filtered sensor data to obtain the inertial measurement data, the method further includes:
defining the overall coordinate direction of the double MEMS inertial measurement unit;
and adapting the axial direction of the first inertial sensor and/or the axial direction of the second inertial sensor according to the overall coordinate direction.
In the implementation process, the first sensor data and the second sensor data are sequentially subjected to filtering processing and mean value processing, and data calculation of the double-MEMS inertial measurement unit is completed.
Further, after the step of processing the first sensor data and the second sensor data to obtain inertial measurement data, the method further includes:
outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
Further, after the step of compensating the inertial measurement data according to the calibration data to obtain an inertial measurement result, the method further includes:
and outputting compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
In a second aspect, an embodiment of the present application provides a data processing system of a dual MEMS inertial measurement unit, the dual MEMS inertial measurement unit including a first inertial sensor and a second inertial sensor, the system including:
the calibration acquisition module is used for acquiring calibration data of the double MEMS inertial measurement unit;
the sensor data acquisition module is used for acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor;
the data processing module is used for processing the first sensor data and the second sensor data to obtain inertia measurement data;
and the data compensation module is used for compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result.
Further, the data processing system of the dual MEMS inertial measurement unit further includes:
and the self-checking module is used for performing self-checking on the double MEMS inertia measurement unit to generate a self-checking result.
Further, the self-test module comprises:
the first configuration unit is used for carrying out first configuration on a self-checking register of the double-MEMS inertial measurement unit and acquiring first inertial measurement self-checking data;
the second configuration unit is used for carrying out second configuration on the self-checking register of the double MEMS inertia measurement unit and acquiring second inertia measurement self-checking data;
and the self-checking unit is used for generating the self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
Further, the calibration data is written in and stored in an internal memory of the dual MEMS inertial measurement unit through a communication interface, and the calibration acquisition module is specifically configured to execute a read operation of the internal memory after the dual MEMS inertial measurement unit is powered on, and read the calibration data.
Further, the data processing system of the dual MEMS inertial measurement unit further includes:
the configuration acquisition module is used for acquiring configuration data of the double MEMS inertial measurement unit;
the data processing module comprises:
the output frequency unit is used for obtaining the output frequency of the double-MEMS inertial measurement unit according to the configuration data;
and the filtering processing unit is used for filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtering sensor data and second filtering sensor data.
Further, the filtering processing unit is specifically configured to perform mean filtering processing on the first sensor data and the second sensor data according to the output frequency to obtain the first filtered sensor data and the second filtered sensor data.
Further, the data processing module further comprises:
and the mean value processing unit is used for carrying out mean value processing on the first filtering sensor data and the second filtering sensor data to obtain the inertia measurement data.
Further, the data processing system of the dual MEMS inertial measurement unit further includes:
the integral coordinate module is used for defining the integral coordinate direction of the double-MEMS inertial measurement unit;
and the axial adaptation module is used for adapting the axial direction of the first inertial sensor and/or the axial direction of the second inertial sensor according to the overall coordinate direction.
Further, the data processing system of the dual MEMS inertial measurement unit further includes:
and the first output module is used for outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
Further, the data processing system of the dual MEMS inertial measurement unit further includes:
and the second output module is used for outputting the compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
In a third aspect, an embodiment of the present application provides a dual MEMS inertial measurement unit, which is applied to the data processing method of the dual MEMS inertial measurement unit in any one of the first aspect, where the dual MEMS inertial measurement unit includes a housing, a PCB, a communication interface, the first inertial sensor, and the second inertial sensor;
the PCB, the communication interface, the first inertial sensor and the second inertial sensor are assembled in the shell, and the communication interface, the first inertial sensor and the second inertial sensor are installed on the PCB.
Further, the first inertial sensor and the second inertial sensor are both six-axis MEMS inertial sensors, and the six-axis MEMS inertial sensors include a three-axis acceleration sensor and a three-axis angular velocity sensor.
Furthermore, the bottom surface of the first inertial sensor is arranged on the first surface of the PCB, the bottom surface of the second inertial sensor is arranged on the second surface of the PCB, and the first surface and the second surface of the PCB are opposite.
Furthermore, the first inertial sensor and the second inertial sensor are symmetrically mounted on the first surface and the second surface of the PCB.
Further, respective axial directions of the first inertial sensor and the second inertial sensor are parallel to each other.
In a fourth aspect, an embodiment of the present application provides an electronic device, including: memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the method according to any of the first aspect when executing the computer program.
In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium having instructions stored thereon, which, when executed on a computer, cause the computer to perform the method according to any one of the first aspect.
In a sixth aspect, an embodiment of the present application provides a computer program product, which when run on a computer, causes the computer to perform the method according to any one of the first aspect.
Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the above-described techniques.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic flowchart of a data processing method of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure;
fig. 2 is a schematic flow chart of another data processing method for a dual MEMS inertial measurement unit according to an embodiment of the present disclosure;
fig. 3 is a schematic flowchart of generating a self-test result according to an embodiment of the present application;
FIG. 4 is a block diagram of a data processing system of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a dual MEMS inertial measurement unit provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a first inertial sensor, a second inertial sensor and a PCB provided in the embodiment of the present application;
fig. 7 is a block diagram of an electronic device according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
The embodiment of the application provides a data processing method and system of a double-MEMS inertial measurement unit, a double-MEMS inertial measurement device, electronic equipment and a computer readable storage medium, which can be applied to the data processing process of an MEMS inertial sensor; in the data processing method of the double-MEMS inertial measurement unit, the double-MEMS inertial measurement unit comprises two inertial sensors (namely a first inertial sensor and a second inertial sensor), and the inertial measurement result is finally obtained by further processing the first sensor data and the second sensor data acquired by the first inertial sensor and the second inertial sensor; compared with a single inertial sensor, the method can improve the accuracy and stability of inertial measurement data; compared with a plurality of inertial sensors (more than two), the method can reduce the occupied space and cost of equipment, and achieve the balance between the accuracy and stability of data and the occupied space and cost; therefore, the method can achieve the technical effects of improving the accuracy and stability of the inertial data and reducing the occupied space and cost.
Referring to fig. 1, fig. 1 is a schematic flow chart of a data processing method of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure, where the dual MEMS inertial measurement unit includes a first inertial sensor and a second inertial sensor, and the data processing method of the dual MEMS inertial measurement unit includes the following steps:
s100: and acquiring calibration data of the double MEMS inertial measurement units.
In the dual-MEMS inertial measurement unit, the calibration data refers to an error correction coefficient for compensation calculation calculated by a script after the inertial measurement unit is calibrated at full temperature and by the turntable.
S200: first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor are acquired.
Illustratively, the first sensor data is collected by a first inertial sensor and the second sensor data is collected by a second inertial sensor; in some embodiments, respective axial directions of the first inertial sensor and the second inertial sensor are parallel to each other.
S300: and processing the first sensor data and the second sensor data to obtain inertia measurement data.
Illustratively, the first sensor data and the second sensor data are processed comprehensively to obtain final inertia measurement data; compared with the sensor data collected by a single inertial sensor, the inertial measurement data has higher accuracy and stability, and the uncertainty influence of the single inertial sensor in measurement is reduced. In the process of comprehensively processing the first sensor data and the second sensor data, mean value filtering processing is firstly respectively carried out on the first sensor data and the second sensor data, then mean value processing is carried out on coaxial data after mean value filtering, and finally inertial measurement data are obtained.
S400: and compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result.
Illustratively, the inertial measurement data is compensated, and the accuracy of the inertial measurement result can be further improved.
In some implementation scenarios, the dual-MEMS inertial measurement unit includes two inertial sensors, and the inertial measurement result is finally obtained by further processing the first sensor data and the second sensor data acquired by the first inertial sensor and the second inertial sensor; compared with a single inertial sensor, the method can improve the accuracy and stability of inertial measurement data; compared with a plurality of inertial sensors (more than two), the method can reduce the occupied space and cost of equipment, and achieve the balance between the accuracy and stability of data and the occupied space and cost; therefore, the method can achieve the technical effects of improving the accuracy and stability of the inertial data and reducing the occupied space and cost.
Referring to fig. 2, fig. 2 is a schematic flow chart of another data processing method of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure.
Exemplarily, at S200: before the step of acquiring the first sensor data collected by the first inertial sensor and the second sensor data collected by the second inertial sensor, the method further includes:
s201: and carrying out self-checking on the double MEMS inertia measurement units to generate a self-checking result.
Illustratively, the dual-MEMS inertial measurement unit is self-checked before the first inertial sensor and the second inertial sensor start to collect data, so that the accuracy of the data output of the MEMS inertial measurement unit is self-checked.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a self-test result generation according to an embodiment of the present disclosure.
Further, S201: the method comprises the following steps of carrying out self-checking on the double MEMS inertia measurement unit and generating a self-checking result, wherein the steps comprise:
s2011: the method comprises the steps that a self-checking register of a double-MEMS inertial measurement unit is configured for the first time, and first inertial measurement self-checking data are obtained;
s2012: performing second configuration on a self-checking register of the double MEMS inertia measurement unit, and acquiring second inertia measurement self-checking data;
s2013: and generating a self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
Exemplarily, two MEMS inertial measurement units are configured twice respectively, data acquisition is carried out under different configurations, and first inertial measurement self-checking data and second inertial measurement self-checking data are obtained; the data accuracy of the double MEMS inertia measurement unit can be verified by the self-checking result through judging the first inertia measurement self-checking data and the second inertia measurement self-checking data.
Optionally, the self-checking registers of the dual-MEMS inertial measurement unit are configured twice (first configuration and second configuration), and data (first inertial measurement self-checking data and second inertial measurement self-checking data) are collected twice, and a difference between the first inertial measurement self-checking data and the second inertial measurement self-checking data is calculated to determine whether the dual-MEMS inertial measurement unit completes self-checking.
In some implementation scenarios, the specific process of performing S2011-S2013 is as follows:
after the first configuration, acquiring data a1 of a first inertial sensor and data b1 of a second inertial sensor;
after the second configuration, acquiring data a2 of the first inertial sensor and data b2 of the second inertial sensor;
then, respectively calculating a difference value (a1-a2) and a difference value (b1-b2), and if the difference value (a1-a2) and the difference value (b1-b2) are within a specified threshold range, indicating that the first inertial sensor and the second inertial sensor both meet the requirements, and determining that the self-test is successful; otherwise, the self-checking fails.
Alternatively, the embodiment of the application can perform self-test on only one inertial sensor. For example, only data a1 and a2 of the first inertial sensor are collected, then a difference value (a1-a2) is calculated, and if the difference value (a1-a2) is within a specified threshold range, the first inertial sensor meets the requirement, and the self-checking is regarded as successful; otherwise, the self-checking fails. The self-test process of the second inertial sensor is similar and is not described in detail herein.
In some implementation scenarios, the self-check verification of the dual MEMS inertial measurement unit is done under static conditions.
In some implementation scenarios, an SPI (Serial Peripheral Interface) Interface is used when the main control unit collects the first sensor data and the second sensor data.
Exemplarily, the calibration data is written in and stored in an internal memory of the dual MEMS inertial measurement unit through the communication interface, S100: the method comprises the following steps of obtaining calibration data of the double MEMS inertial measurement unit, wherein the calibration data comprises the following steps:
s110: and executing the reading operation of the internal memory after the double MEMS inertia measurement unit is electrified, and reading the calibration data.
Illustratively, the calibration data is built in an internal memory of the dual MEMS inertial measurement unit, and when the dual MEMS inertial measurement unit is powered on, the calibration data can be automatically read.
Exemplarily, S300: before the step of processing the first sensor data and the second sensor data to obtain the inertial measurement data, the method further includes:
s310: acquiring configuration data of the double MEMS inertial measurement unit;
s320: obtaining the output frequency of the double MEMS inertia measurement unit according to the configuration data;
s330: and filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
Illustratively, the configuration data includes, but is not limited to, a baud rate configuration, an output frequency configuration, an output frame mode, etc. of the serial port, and is used for configuring the baud rate, the output frequency and the data output mode of the serial port; the configuration data can be written in and stored in the internal memory of the double MEMS inertia measurement unit through the communication interface, so that the reading operation of the internal memory is executed after the double MEMS inertia measurement unit is electrified, and the configuration data is read; therefore, when the double MEMS inertia measurement unit is powered on, the reading of the configuration data can be automatically completed.
In some embodiments, the filtering process in S330 may be a mean filtering process; thus, the first sensor data and the second sensor data are subjected to mean value filtering processing according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
S340: and carrying out mean value processing on the first filtering sensor data and the second filtering sensor data to obtain inertia measurement data.
Illustratively, mean value filtering processing and mean value processing are sequentially performed on the first sensor data and the second sensor data, data calculation of the dual-MEMS inertial measurement unit is completed, and inertial measurement data are obtained.
In some embodiments, S340: before the step of performing mean value processing on the first filtered sensor data and the second filtered sensor data to obtain the inertial measurement data, the method further includes:
defining the overall coordinate direction of the double MEMS inertial measurement units;
the axial direction of the first inertial sensor and/or the axial direction of the second inertial sensor are adapted according to the global coordinate direction.
Exemplarily, after determining the overall coordinate direction of the dual MEMS inertial measurement unit, the axial directions of the first inertial sensor and the second inertial sensor are adapted to the axial direction of the overall coordinate system, and the mean value processing is performed after the adaptation. Alternatively, the global coordinate axis of the inertial measurement unit is first defined, and the global coordinate axis of the dual MEMS inertial measurement unit may be axially coincident with the coordinate axis of one of the inertial sensors.
Optionally, the first inertial sensor and the second inertial sensor are both six-axis MEMS inertial sensors, and the six-axis MEMS inertial sensor data refers to X, Y, Z triaxial acceleration and triaxial angular velocity that satisfy a right-hand rule read from a designated register address of the MEMS inertial sensor.
Illustratively, the sampling frequency of the six-axis MEMS inertial sensor in the program is 1000Hz, the output frequency of the dual MEMS inertial measurement unit is determined according to the configuration data acquired in S100, and the first sensor data and the second sensor data are filtered according to the output frequency. Alternatively, the output frequency of the dual MEMS inertial measurement unit may be set to 100Hz, 200Hz, 250Hz, 500Hz, 1000Hz, etc., which is not specifically limited herein.
Exemplarily, in the process of performing mean value processing on the first filtering sensor data and the second filtering sensor data, it is required to first determine each axial relationship of the first inertial sensor and the second inertial sensor; optionally, the X-axis directions of the first inertial sensor and the second inertial sensor are the same, the Y-axis directions of the first inertial sensor and the second inertial sensor are opposite, and the Z-axis directions of the first inertial sensor and the second inertial sensor are opposite, then:
here, forward direction data of each axis (angular velocity) of the gyro of the first inertial sensor is represented as Gx1Is just，Gy1Is just，Gz1Is justAnd the reverse data is Gx1Inverse direction，Gy1Inverse direction，Gz1Inverse direction(ii) a The positive direction data of each axis (acceleration) of the first inertia sensor accelerometer is recorded as Ax1Is just，Ay1Is just，Az1Is justAnd the reverse direction data is recorded as Ax1Inverse direction，Ay1Inverse direction，Az1Inverse direction；
Similarly, the positive direction data of each axis (angular velocity) of the second inertial sensor gyro is recorded as Gx2Is just，Gy2Is just，Gz2Is justAnd the reverse data is Gx2Inverse direction，Gy2Inverse direction，Gz2Inverse directionThe positive data of each axis (acceleration) of the accelerometer 2 is recorded asAx2Is just，Ay2Is just，Az2Is justAnd the reverse direction data is recorded as Ax2Inverse direction，Ay2Inverse direction，Az2Inverse direction。
According to the above data, the inertia measurement data obtained by the averaging process is as follows:
each axial gyro data (angular velocity):
Gxis just＝(Gx1Is just+Gx2Is just)/2；
GxInverse direction＝-(|Gx1Inverse direction|+|Gx2Inverse direction|)/2；
GyIs just＝(Gy1Is just+|Gy2Inverse direction|)/2；
GyInverse direction＝-(|Gx1Inverse direction|+Gx2Is just)/2；
GzIs just＝(Gz1Is just+|Gz2Inverse direction|)/2；
GzInverse direction(| Gz1 trans | + Gz 2)Is just)/2；
Axial accelerometer data (acceleration):
Axis just＝-(|Ax1Is just|+|Ax2Is just|)/2；
AxInverse direction＝(Ax1Inverse direction+Ax2Inverse direction)/2；
AyIs just＝-(|Ay1Is just|+Ay2Inverse direction)/2；
AyInverse direction＝(Ax1Inverse direction+|Ax2Is just|)/2；
AzIs just＝-(|Az1Is just|+Az2Inverse direction)/2；
AzInverse direction＝(Az1Inverse direction+|Az2Is just|)/2。
As shown in fig. 6, it is assumed that at a certain time, the values of the measured accelerations of the first inertial sensor and the second inertial sensor are-0.48 g and +0.52g, respectively, in the Y + axis direction of the first inertial sensor; if the axial direction of the global coordinate system of the dual MEMS inertial measurement unit is defined to be consistent with the axial direction of the first inertial sensor, the final value of the dual MEMS inertial measurement unit in the Y + axis direction of the first inertial sensor is- (0.48g +0.52 g)/2-0.5 g.
Alternatively, since the respective axes of the first and second inertial sensors of the dual MEMS inertial measurement unit are parallel to each other, but the respective axes may be different, certain axes of the first and second inertial sensors may be opposite. As shown in fig. 6, if the global coordinate system of the dual MEMS inertial measurement unit is defined to be consistent with the coordinate system of the first inertial sensor, sign processing is required when processing acceleration data of the Y axis and the Z axis of the first inertial sensor, and the specific rule of the sign processing refers to the above-mentioned correlation formula of each axial gyro data and each axial tabulation data.
Exemplarily, at S300: after the step of processing the first sensor data and the second sensor data to obtain inertial measurement data, the method further includes:
s350: outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
Exemplarily, at S400: after the step of compensating the inertial measurement data according to the calibration data to obtain the inertial measurement result, the method further comprises the following steps:
s410: and outputting the compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
Referring to fig. 4, fig. 4 is a block diagram of a data processing system of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure, where the dual MEMS inertial measurement unit includes a first inertial sensor and a second inertial sensor, and the data processing system of the dual MEMS inertial measurement unit includes:
a calibration obtaining module 100, configured to obtain calibration data of the dual MEMS inertial measurement unit;
a sensor data acquisition module 200, configured to acquire first sensor data acquired by a first inertial sensor and second sensor data acquired by a second inertial sensor;
a data processing module 300, configured to process the first sensor data and the second sensor data to obtain inertia measurement data;
and the data compensation module 400 is configured to compensate the inertia measurement data according to the calibration data to obtain an inertia measurement result.
Illustratively, the data processing system of the dual MEMS inertial measurement unit further comprises:
and the self-checking module is used for performing self-checking on the double MEMS inertia measurement unit to generate a self-checking result.
Illustratively, the introspection module includes:
the first configuration unit is used for carrying out first configuration on a self-checking register of the double MEMS inertial measurement unit and acquiring first inertial measurement self-checking data;
the second configuration unit is used for carrying out second configuration on the self-checking register of the double MEMS inertia measurement unit and acquiring second inertia measurement self-checking data;
and the self-checking unit is used for generating a self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
Illustratively, the calibration data is written in and stored in an internal memory of the dual MEMS inertial measurement unit through the communication interface, and the calibration obtaining module 100 is specifically configured to execute a read operation of the internal memory after the dual MEMS inertial measurement unit is powered on, and read the calibration data.
Illustratively, the data processing system of the dual MEMS inertial measurement unit further comprises:
the configuration acquisition module is used for acquiring configuration data of the double MEMS inertial measurement unit;
the data processing module 300 includes:
the output frequency unit is used for obtaining the output frequency of the double-MEMS inertia measurement unit according to the configuration data;
and the filtering processing unit is used for filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
Illustratively, the filtering processing unit is specifically configured to perform mean filtering processing on the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
Illustratively, the data processing module further comprises:
and the mean value processing unit is used for carrying out mean value processing on the first filtering sensor data and the second filtering sensor data to obtain inertia measurement data.
Illustratively, the data processing system of the dual MEMS inertial measurement unit further comprises:
the integral coordinate module is used for defining the integral coordinate direction of the double MEMS inertial measurement unit;
and the axial adaptation module is used for adapting the axial direction of the first inertial sensor and/or the axial direction of the second inertial sensor according to the overall coordinate direction.
Illustratively, the data processing system of the dual MEMS inertial measurement unit further comprises:
and the first output module is used for outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
Illustratively, the data processing system of the dual MEMS inertial measurement unit further comprises:
and the second output module is used for outputting the compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
It should be understood that the data processing system of the dual MEMS inertial measurement unit shown in fig. 4 corresponds to the method embodiments shown in fig. 1 to fig. 3, and is not repeated here to avoid repetition.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a dual MEMS inertial measurement unit according to an embodiment of the present disclosure, which is applied to the data processing method of the dual MEMS inertial measurement unit shown in fig. 1 to 3, and the dual MEMS inertial measurement unit includes a housing 11, a PCB 12, a communication interface 13, a first inertial sensor 21, and a second inertial sensor 22.
Illustratively, the PCB board 12, the communication interface 13, the first inertial sensor 21, and the second inertial sensor 21 are assembled within the housing 11, and the communication interface 13, the first inertial sensor 21, and the second inertial sensor 22 are mounted to the PCB board 12.
Illustratively, the first inertial sensor 21 and the second inertial sensor 22 are each a six-axis MEMS inertial sensor, which includes a three-axis acceleration sensor and a three-axis angular velocity sensor.
Optionally, each MEMS inertial sensor includes an acceleration sensor, an angular velocity sensor, and a temperature sensor, wherein the acceleration sensor may measure acceleration in the X, Y, Z axes that meets the right-hand rule, the angular velocity sensor may measure angular velocity in the X, Y, Z axes that meets the right-hand rule, and the temperature sensor may measure the temperature of the current environment.
Optionally, the housing 11 includes an upper housing 111 and a lower housing 112.
Referring to fig. 6, fig. 6 is a schematic structural diagram of the first inertial sensor, the second inertial sensor and the PCB according to the embodiment of the present disclosure.
Illustratively, the bottom surface of the first inertial sensor 21 is disposed on a first side of the PCB 12, the bottom surface of the second inertial sensor 22 is disposed on a second side of the PCB 12, and the first side and the second side of the PCB 12 are opposite.
Illustratively, the first inertial sensor 21 and the second inertial sensor 22 are symmetrically mounted on the first surface and the second surface of the PCB 12.
Illustratively, the first inertial sensor 21 and the second inertial sensor 22 have the same X axis, opposite Y axis, and opposite Z axis.
Illustratively, respective axial directions of the first inertial sensor 21 and the second inertial sensor 22 are parallel to each other.
Fig. 7 shows a block diagram of an electronic device according to an embodiment of the present disclosure, where fig. 7 is a block diagram of the electronic device. The electronic device may include a processor 510, a communication interface 520, a memory 530, and at least one communication bus 540. Wherein the communication bus 540 is used for realizing direct connection communication of these components. In this embodiment, the communication interface 520 of the electronic device is used for performing signaling or data communication with other node devices. Processor 510 may be an integrated circuit chip having signal processing capabilities.
The Processor 510 may be a general-purpose Processor including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components. The various methods, steps, and logic blocks disclosed in the embodiments of the present application may be implemented or performed. A general purpose processor may be a microprocessor or the processor 510 may be any conventional processor or the like.
The Memory 530 may be, but is not limited to, a Random Access Memory (RAM), a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Read Only Memory (EPROM), an electrically Erasable Read Only Memory (EEPROM), and the like. The memory 530 stores computer readable instructions, which when executed by the processor 510, enable the electronic device to perform the steps involved in the method embodiments of fig. 1-3 described above.
Optionally, the electronic device may further include a memory controller, an input output unit.
The memory 530, the memory controller, the processor 510, the peripheral interface, and the input/output unit are electrically connected to each other directly or indirectly, so as to implement data transmission or interaction. For example, these elements may be electrically coupled to each other via one or more communication buses 540. The processor 510 is used to execute executable modules stored in the memory 530, such as software functional modules or computer programs included in the electronic device.
The input and output unit is used for providing a task for a user to create and start an optional time period or preset execution time for the task creation so as to realize the interaction between the user and the server. The input/output unit may be, but is not limited to, a mouse, a keyboard, and the like.
It will be appreciated that the configuration shown in fig. 7 is merely illustrative and that the electronic device may include more or fewer components than shown in fig. 7 or have a different configuration than shown in fig. 7. The components shown in fig. 7 may be implemented in hardware, software, or a combination thereof.
The embodiment of the present application further provides a storage medium, where the storage medium stores instructions, and when the instructions are run on a computer, when the computer program is executed by a processor, the method in the method embodiment is implemented, and in order to avoid repetition, details are not repeated here.
The present application also provides a computer program product which, when run on a computer, causes the computer to perform the method of the method embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (24)
1. A method of data processing for a dual MEMS inertial measurement unit comprising a first inertial sensor and a second inertial sensor, the method comprising:
obtaining calibration data of the double MEMS inertial measurement units;
acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor;
processing the first sensor data and the second sensor data to obtain inertial measurement data;
and compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result.
2. The data processing method of a dual MEMS inertial measurement unit of claim 1, further comprising, prior to the step of acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor:
and self-checking the double MEMS inertia measurement units to generate a self-checking result.
3. The data processing method of the dual-MEMS inertial measurement unit of claim 2, wherein the step of performing a self-test on the dual-MEMS inertial measurement unit to generate a self-test result comprises:
configuring a self-checking register of the double MEMS inertial measurement unit for the first time, and acquiring first inertial measurement self-checking data;
performing second configuration on a self-checking register of the double MEMS inertial measurement unit, and acquiring second inertial measurement self-checking data;
and generating the self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
4. The data processing method of the dual-MEMS inertial measurement unit according to claim 1, wherein the calibration data is written and stored in an internal memory of the dual-MEMS inertial measurement unit through a communication interface, and the step of obtaining the calibration data of the dual-MEMS inertial measurement unit includes:
and executing the reading operation of the internal memory after the double MEMS inertial measurement unit is electrified, and reading the calibration data.
5. The data processing method of a dual MEMS inertial measurement unit of claim 1, further comprising, prior to the step of processing the first sensor data and the second sensor data to obtain inertial measurement data:
acquiring configuration data of the double MEMS inertial measurement unit;
obtaining the output frequency of the double MEMS inertia measurement unit according to the configuration data;
and filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data.
6. The method of data processing for a dual MEMS inertial measurement unit of claim 5, wherein the step of filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtered sensor data and second filtered sensor data comprises:
and carrying out mean value filtering processing on the first sensor data and the second sensor data according to the output frequency to obtain first filtering sensor data and second filtering sensor data.
7. The method of data processing for a dual MEMS inertial measurement unit of claim 5, wherein the step of processing the first sensor data and the second sensor data to obtain inertial measurement data comprises:
and carrying out mean value processing on the first filtering sensor data and the second filtering sensor data to obtain the inertia measurement data.
8. The method of data processing for a dual MEMS inertial measurement unit of claim 6, further comprising, prior to the step of averaging the first filtered sensor data and the second filtered sensor data to obtain the inertial measurement data:
defining the overall coordinate direction of the double MEMS inertial measurement unit;
and adapting the axial direction of the first inertial sensor and/or the axial direction of the second inertial sensor according to the overall coordinate direction.
9. The data processing method of a dual MEMS inertial measurement unit of claim 1, further comprising, after the step of processing the first sensor data and the second sensor data to obtain inertial measurement data:
outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
10. The data processing method of a dual MEMS inertial measurement unit of claim 1, further comprising, after the step of obtaining inertial measurements by compensating the inertial measurement data based on the calibration data:
and outputting compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
11. A data processing system of a dual MEMS inertial measurement unit, the dual MEMS inertial measurement unit comprising a first inertial sensor and a second inertial sensor, the system comprising:
the calibration acquisition module is used for acquiring calibration data of the double MEMS inertial measurement unit;
the sensor data acquisition module is used for acquiring first sensor data acquired by the first inertial sensor and second sensor data acquired by the second inertial sensor;
the data processing module is used for processing the first sensor data and the second sensor data to obtain inertia measurement data;
and the data compensation module is used for compensating the inertia measurement data according to the calibration data to obtain an inertia measurement result.
12. The data processing system of a dual MEMS inertial measurement unit of claim 11, the system further comprising:
and the self-checking module is used for performing self-checking on the double MEMS inertia measurement unit to generate a self-checking result.
13. The data processing system of a dual MEMS inertial measurement unit of claim 12, wherein the self-test module comprises:
the first configuration unit is used for carrying out first configuration on a self-checking register of the double-MEMS inertial measurement unit and acquiring first inertial measurement self-checking data;
the second configuration unit is used for carrying out second configuration on the self-checking register of the double MEMS inertia measurement unit and acquiring second inertia measurement self-checking data;
and the self-checking unit is used for generating the self-checking result according to the difference value of the first inertia measurement self-checking data and the second inertia measurement self-checking data.
14. The data processing system of a dual-MEMS inertial measurement unit according to claim 11, wherein the calibration data is written into and stored in an internal memory of the dual-MEMS inertial measurement unit through a communication interface, and the calibration acquisition module is specifically configured to perform a read operation of the internal memory after the dual-MEMS inertial measurement unit is powered on, and read the calibration data.
15. The data processing system of a dual MEMS inertial measurement unit of claim 11, further comprising:
the configuration acquisition module is used for acquiring configuration data of the double MEMS inertial measurement unit;
the data processing module comprises:
the output frequency unit is used for obtaining the output frequency of the double-MEMS inertial measurement unit according to the configuration data;
and the filtering processing unit is used for filtering the first sensor data and the second sensor data according to the output frequency to obtain first filtering sensor data and second filtering sensor data.
16. The data processing system of a dual MEMS inertial measurement unit of claim 11, the system further comprising:
and the first output module is used for outputting uncompensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement data.
17. The data processing system of a dual MEMS inertial measurement unit of claim 11, the system further comprising:
and the second output module is used for outputting the compensated triaxial acceleration data and triaxial angular velocity data according to the inertial measurement result.
18. A dual MEMS inertial measurement unit data processing method applied to the dual MEMS inertial measurement unit according to any one of claims 1 to 7, wherein the dual MEMS inertial measurement unit includes a housing, a PCB board, a communication interface, the first inertial sensor, and the second inertial sensor;
the PCB, the communication interface, the first inertial sensor and the second inertial sensor are assembled in the shell, and the communication interface, the first inertial sensor and the second inertial sensor are installed on the PCB.
19. The dual MEMS inertial measurement unit of claim 18, wherein the first and second inertial sensors are each six-axis MEMS inertial sensors including a three-axis acceleration sensor and a three-axis angular velocity sensor.
20. The dual MEMS inertial measurement unit of claim 18, wherein the bottom surface of the first inertial sensor is disposed on a first side of the PCB board, and the bottom surface of the second inertial sensor is disposed on a second side of the PCB board, the first and second sides of the PCB board being opposite.
21. The dual MEMS inertial measurement unit of claim 20, wherein the first and second inertial sensors are symmetrically mounted to the first and second sides of the PCB.
22. The dual MEMS inertial measurement unit of claim 18, wherein respective axial directions of the first inertial sensor and the second inertial sensor are parallel to each other.
23. An electronic device, comprising: memory, a processor and a computer program stored in the memory and executable on the processor, the processor implementing the steps of the data processing method of a dual MEMS inertial measurement unit according to any of claims 1 to 10 when executing the computer program.
24. A computer-readable storage medium having stored thereon instructions which, when run on a computer, cause the computer to perform the method of data processing of a dual MEMS inertial measurement unit of any one of claims 1 to 10.
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