CN114224509A - Main unit connected with surgical instrument and surgical equipment - Google Patents
Main unit connected with surgical instrument and surgical equipment Download PDFInfo
- Publication number
- CN114224509A CN114224509A CN202111529896.9A CN202111529896A CN114224509A CN 114224509 A CN114224509 A CN 114224509A CN 202111529896 A CN202111529896 A CN 202111529896A CN 114224509 A CN114224509 A CN 114224509A
- Authority
- CN
- China
- Prior art keywords
- chassis
- heat sink
- radiator
- host
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/02—Operational features
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surgery (AREA)
- Heart & Thoracic Surgery (AREA)
- General Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Animal Behavior & Ethology (AREA)
- Pathology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a main unit connected with a surgical instrument, including: a chassis; a radiator provided in the chassis; a radiator cover provided in the cabinet and having a first side plate, a second side plate, and an upper cover plate, the first and second side plates being respectively provided on both sides of the radiator in a first direction, the upper cover plate covering the radiator, and the upper cover plate respectively connecting the first and second side plates to define a first opening and a second opening opposite to each other in a second direction, the first direction being perpendicular to the second direction; and at least one fan disposed on or in the chassis, wherein the at least one fan rotates such that an airflow enters the radiator cover from the first opening, flows through the radiator in the second direction, and exits the radiator cover from the second opening. Also discloses a surgical device which comprises a host and a surgical instrument connected with the host.
Description
Technical Field
Embodiments of the present disclosure relate to the field of surgical devices, and more particularly, to a host connected to a surgical instrument having a heat sink.
Background
An active surgical device is any surgical device that relies on electrical or other energy sources to perform its function rather than energy generated directly by the human body or by gravity. Active surgical devices are increasingly used in modern medical fields.
Active surgical devices typically include a host machine and various surgical instruments (e.g., ultrasonic blades, electric blades, etc.) connected to the host machine. The main machine is generally used as a power source for converting electric energy into power for driving the surgical instrument connected with the main machine to function. During the conversion of electrical energy, some heat is often generated, resulting in an increase in the temperature of the host. Therefore, the heat dissipation structure is required to be used in the main machine to dissipate the generated heat, so that the heat dissipation requirement of hardware is met, and the working stability of the active surgical equipment is ensured.
Disclosure of Invention
At least one embodiment of the present disclosure provides a host connected to a surgical instrument, including: a chassis; a radiator disposed in the chassis; a radiator cover disposed in the cabinet and having a first side plate, a second side plate, and an upper cover plate, the first side plate and the second side plate being disposed at both sides of the radiator in a first direction, respectively, the upper cover plate covering the radiator, and the upper cover plate connecting the first side plate and the second side plate, respectively, to define a first opening and a second opening opposite to each other in a second direction, the first direction being perpendicular to the second direction; and at least one fan disposed on or in the chassis, wherein the at least one fan rotates such that airflow enters the heat sink enclosure from the first opening, flows through the heat sink in the second direction, and exits the heat sink enclosure from the second opening.
In the host of at least one embodiment of the present disclosure, the first side plate is spaced apart from the heat sink by a first gap, the second side plate is spaced apart from the heat sink by a second gap, and the upper cover plate is spaced apart from the heat sink by a third gap.
In the host machine according to at least one embodiment of the present disclosure, a buffer member is further included and filled in at least a part of at least one of the first gap, the second gap, and the third gap.
In the host computer of at least one embodiment of the present disclosure, the buffer includes a first portion, a second portion, and a third portion, the first portion is filled in a part of the first gap, the second portion is filled in a part of the second gap, the third portion is filled in the entire third gap, and the third portion connects the first portion and the second portion, respectively.
In the host of at least one embodiment of the present disclosure, in a third direction perpendicular to the first direction and the second direction, a ratio of a height of the first portion to a height of the heat sink is less than or equal to 1:3, and a ratio of a height of the second portion to the height of the heat sink is less than or equal to 1: 3.
In the host of at least one embodiment of the present disclosure, the buffer is made of foamed plastic.
In the host of at least one embodiment of the present disclosure, the at least one fan includes a first fan disposed to face the second opening.
In at least one embodiment of the present disclosure, the first fan is disposed in the chassis and adjacent to a sidewall of the chassis, and one or more air outlets are disposed on the sidewall of the chassis opposite to the first fan to discharge the airflow exiting the radiator cover from the second opening out of the chassis.
In the mainframe of at least one embodiment of the present disclosure, the first fan is disposed on the side wall of the chassis to discharge the airflow exiting the radiator cover from the second opening out of the chassis.
In the mainframe of at least one embodiment of the present disclosure, the chassis includes a bottom plate, a top plate, and a side wall connected between the bottom plate and the top plate, wherein the bottom plate and the side wall respectively have a plurality of air inlets.
In the mainframe of at least one embodiment of the present disclosure, the sidewalls include four sidewalls connected end-to-end with each other in a closed loop; the at least one fan includes a first fan disposed on one of the four sidewalls of the chassis to discharge the airflow exiting the heat dissipation cover from the second opening out of the chassis; the bottom plate is provided with the one or more air inlets; and one or two side walls among three side walls of the four side walls except the side wall facing the second outlet have the one or more air inlets.
In the host of at least one embodiment of the present disclosure, the method further includes: the power amplifier circuit is arranged in the chassis and comprises a power amplifier tube, wherein the power amplifier tube is fixed on the surface of the radiator, facing the first side plate, and/or the surface of the radiator, facing the second side plate.
In the host of at least one embodiment of the present disclosure, the heat sink, the power amplifier tube, and the heat sink cover are disposed at corners of the chassis.
In the host of at least one embodiment of the present disclosure, in the second direction, a length of the heat sink is less than or equal to a length of each of the first side plate, the second side plate, and the upper cover plate.
In the host of at least one embodiment of the present disclosure, the heat sink includes a main body portion and a plurality of plate-like projecting portions that project from the main body portion in the first direction, and the main body portion and the plurality of plate-like projecting portions each extend in the second direction.
In the host of at least one embodiment of the present disclosure, the case is made of metal or engineering plastic; the heat sink is made of metal; and the radiator cover is made of metal or engineering plastic.
At least one embodiment of the present disclosure further provides a surgical device, including the host and a surgical instrument connected to the host as described in at least one embodiment of the present disclosure.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description relate only to some embodiments of the present disclosure and are not limiting to the present disclosure.
FIG. 1 is a front sectional view of a mainframe coupled to a surgical instrument according to one embodiment of the present disclosure;
FIG. 2 is a top sectional view of the main unit coupled to the surgical instrument of the embodiment of FIG. 1;
FIG. 3 is a front cross-sectional view of a mainframe coupled to a surgical instrument according to another embodiment of the present disclosure;
fig. 4 is a top sectional view of the main unit coupled to the surgical instrument of the embodiment of fig. 3.
Fig. 5 is a schematic view of a surgical device according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
With the rapid development of science and technology, the variety of active surgical equipment is increasing, and the application in medical work is also becoming more extensive. Active surgical devices, unlike passive surgical devices, have stringent requirements for temperature in their working environment. In order to ensure that the main machine of the active surgical equipment works in a proper temperature environment, a heat dissipation structure is generally equipped. The good heat dissipation structure can ensure the main machine of the active operation equipment to work and operate safely and reliably, so that the heat dissipation structure of the main machine of the active operation equipment needs to be designed reasonably so as to quickly and fully dissipate heat generated by the main machine in the working process.
At least one embodiment of the present disclosure provides a host connected to a surgical instrument, the host including: a chassis; a radiator disposed in the chassis; a radiator cover disposed in the cabinet and having a first side plate, a second side plate, and an upper cover plate, wherein the first side plate and the second side plate are disposed at both sides of the radiator in a first direction, respectively, the upper cover plate covering the radiator and connecting the first side plate and the second side plate, respectively, to define a first opening and a second opening opposite to each other in a second direction, wherein the first direction is perpendicular to the second direction; and at least one fan disposed on or in the chassis, wherein the at least one fan rotates such that an airflow enters the radiator cover from the first opening, flows through the radiator in the second direction, and exits the radiator cover from the second opening.
At least one embodiment of the present disclosure further provides a surgical device, which includes the above-mentioned host and a surgical instrument connected to the host.
Embodiments of the present disclosure will be described below with reference to the accompanying drawings. For simplicity, in the following embodiments, the chassis is in a rectangular parallelepiped shape, the heat sink is a plate-fin heat sink, and the main unit includes one fan (first fan).
Fig. 1 illustrates a front view cross-section of a mainframe coupled to a surgical instrument according to an embodiment of the present disclosure, and fig. 2 illustrates a top view cross-section of the mainframe.
As shown in fig. 1 and 2, the host 100 includes a chassis 101, a heat sink 102, a heat sink cover 103, and a fan 104.
The chassis 101 is for accommodating or mounting the heat sink 102, the heat sink cover 103, and the fan 104. For example, the enclosure 101 may be in the shape of a rectangular parallelepiped, which may have a bottom plate 1011, a top plate 1012, and a front wall 1013, a right wall 1014, a rear wall 1015, and a left wall 1016 connected end-to-end in a closed loop, wherein the front wall 1013 and the rear wall 1015 are substantially two-by-two parallel, the left wall 1014 and the right wall 1016 are substantially two-by-two parallel, and the front wall 1013, the rear wall 1015, the left wall 1014 and the right wall 1016 are substantially two-by-two perpendicular. In some examples, at least one of the bottom 1011, left side 1014, and right side 1015 of the chassis 101 may each be provided with one or more air intakes.
The heat sink 102 is provided in the case 101, and includes a main body portion and a plurality of plate-like projecting portions. The plurality of tab-like projections project from the body portion in a first direction a, the body portion and the plurality of tab-like projections projecting therefrom together extending in a second direction B substantially perpendicular to the first direction a. Wherein the first direction a is substantially parallel to the front wall 1013 and the rear wall 1015 of the chassis 101, and the second direction B is substantially parallel to the front wall 1013, the right wall 1014, the rear wall 1015, and the left wall 1016. In some examples, adjacent ones of the plurality of tab projections may have a gap therebetween to allow air to flow therethrough.
The radiator cover 103 is provided in the chassis, and has a first side plate 1031, a second side plate 1032, and an upper cover plate 1033. The first side plate 1031 and the second side plate 1032 are respectively provided on both sides of the heat sink 102 in the first direction a. The upper cover plate 1033 covers the heat sink 102 and connects the first and second side plates 1031 and 1032, respectively, to define a first opening and a second opening opposite to each other in the second direction B, wherein the first opening is closer to the inside of the cabinet 101 and the second opening is closer to the rear sidewall 1015 of the cabinet 101. As shown in fig. 1 and 2, the first side plate 1031, the second side plate 1032, and the upper cover plate 1033 collectively define a tunnel-like semi-enclosed space in which the heat sink 102 is integrally accommodated. When the host 100 is operating, air may flow over the surface of the heat sink 102 in the second direction B in the tunnel-like semi-enclosed space to improve the heat dissipation efficiency of the heat sink 102.
In some examples, the first side plate 1031 may be spaced apart from the heat sink 102 by a first gap d1The second side plate 1032 may be spaced apart from the heat sink 102 by a second gap d2The upper cover plate 1033 may be spaced apart from the heat sink 102 by a third gap d3So as to define an air duct for air to flow between the heat sink 102 and the heat sink cover 103, thereby further improving the heat dissipation efficiency of the heat sink 102. First clearance d1A second gap d2And a third gap d3Any two of which may be the same or different. For example, the first gap d1A second gap d2And a third gap d3May be identical to each other; or, the first gap d1Can be spaced from the second gap d2Same but a third gap d3Different; or, the first gap d1A second gap d2And a third gap d3May be different from each other. Embodiments of the present disclosure are not limited in this regard.
The fan 104 is disposed in the chassis 101 between the second opening of the radiator cover 103 and the rear sidewall 1015 of the chassis 101. A plurality of air outlets 105 are disposed on the rear sidewall 1015 at locations opposite the second openings. When in operation, the fan 104 rotates such that an airflow enters the radiator cover 103 from the first opening, flows through the radiator 102 in the second direction B, and exits the radiator cover 103 from the second opening to exit the chassis 101 through the outlet 105. With this arrangement, the hot air flowing from the surface of the heat sink 102 can be made to leave the inside of the chassis 101 as soon as possible, so as to effectively dissipate the heat generated in the host computer 100.
In some examples, the main body of the heat sink 102 may have a partial surface that is a plane, and the heat source element 106 in the host that generates heat may be disposed on this partial surface, and transfer heat to the main body through contact between the heat source element 106 and the partial surface, and further to air flowing therethrough through other partial surfaces (e.g., surfaces of a plurality of sheet-like protruding portions) on the main body, and be discharged out of the chassis 101 along with the air. For example, the heat source element 106 may be a power tube, such as, but not limited to, a MOS power tube. In some examples, the heat source element 106 may be disposed on a surface facing the first side plate 1031, and may also be disposed on a surface facing the second side plate 1032. For example, the heat source element 106 may be disposed on a side surface closer to the inside of the chassis 101 so as to be easily electrically connected with other elements in the chassis. Embodiments of the present disclosure are not limited in this regard.
In the embodiment shown in fig. 1 and 2, the main body 100 may further include a power amplifier circuit disposed in the case 101, a power supply for supplying power to the power amplifier circuit, an output port for connecting with a surgical instrument, and the like. In at least some examples of the present disclosure, non-limiting examples of power amplifier circuits that may be used may include ultrasound power amplifier circuits, high frequency electrotome power amplifier circuits, and the like; non-limiting examples of power sources that may be used may include a direct current or alternating current power source, such as a high voltage direct current or alternating current power source, or the like; non-limiting examples of output ports that may be used may include output ports for connection with an ultrasonic blade or a high frequency electrotome, and the like. Embodiments of the present disclosure are not limited in this regard.
In the embodiment shown in fig. 1 and 2, the cabinet 101 has a rectangular parallelepiped shape. However, in some other embodiments of the present disclosure, other shaped chassis may be used. For example, a chassis having a circular or oval cross-section or other polygonal shape other than a rectangle may be used. In some examples, one or more feet may also be provided on the bottom surface of the chassis floor to elevate the chassis a distance relative to the resting surface to facilitate air entering the chassis through the air intake. The present disclosure is not so limited.
In the embodiment shown in fig. 1 and 2, the heat sink 102 has a main body portion and a plurality of plate-like projecting portions projecting from the main body portion. However, in at least some other embodiments of the present disclosure, other types of heat sinks may also be used, including, but not limited to, finned heat sinks, tube heat sinks, plate heat sinks, and the like. The present disclosure is not so limited.
In the embodiment shown in fig. 1 and 2, a fan 104 is used, which is disposed between the second outlet and the rear side wall of the cabinet and directly opposite the second outlet. However, in some other embodiments of the present disclosure, the fan may be disposed at other positions, for example, the fan may be disposed on the rear side wall of the chassis opposite to the second outlet, or the fan may be disposed on any side wall of the chassis. Alternatively, in still other embodiments of the present disclosure, more than one fan may be used, for example, one fan (first fan) disposed on the rear side wall of the chassis opposite to the second outlet and another fan (second fan) disposed between the first fan and the second outlet opposite to the second outlet, or one fan (first fan) disposed on the rear side wall of the chassis opposite to the second outlet and other fans (second to nth fans, n is a natural number greater than 2) disposed on at least one of the rear side wall or the left and right side walls of the chassis. The present disclosure is not so limited.
In the embodiment shown in fig. 1 and 2, a plurality of air intakes are provided on the bottom 1011, right side wall 1014, and left side wall 1016 of the cabinet 101, respectively. However, in some other embodiments of the present disclosure, one or more air intakes may be provided only on the floor of the chassis; or one or more air intakes may be provided in the base plate and at least one of the side walls other than or adjacent to the (first) fan. The present disclosure is not so limited.
In the embodiment shown in fig. 1 and 2, the length of the heat sink 102 in the second direction B is less than or equal to the length of each of the first side plate 1031, the second side plate 1032, and the upper cover plate 1033 of the heat sink cover 103, i.e., the heat sink 102 is entirely within the interior space defined by the heat sink cover 103. However, in some other embodiments of the present disclosure, the length of the heat sink 102 may be greater than the length of at least one of the first side plate 1031, the second side plate 1032, and the upper cover plate 1033 of the heat sink cover 103, such that the heat sink 102 is partially outside the internal space defined by the heat sink cover 103 in the second direction B. The present disclosure is not so limited.
In the embodiment shown in fig. 1 and 2, the heat sink 102, the heat sink cover 103, and the fan 104 are disposed at the corners of the chassis 101. However, in some other embodiments of the present disclosure, the heat sink 102, the heat sink cover 103, and the fan 104 may be disposed at other positions of the chassis. The present disclosure is not so limited.
The chassis and radiator covers useful in at least one embodiment of the present disclosure may be made of metal or engineering plastic, and may have various functional coatings on at least one of the inner and outer surfaces thereof, such as coatings having functions of insulation, thermal insulation, corrosion protection, and the like. Heat sinks useful in at least one embodiment of the present disclosure may be made of metals, such as cast iron, aluminum, steel aluminum composites, and the like. The present disclosure is not so limited.
The embodiments shown in fig. 1 and 2 have at least the following advantages: the first side plate 1031, the second side plate 1032 and the upper cover plate 1033 of the radiator cover 103 collectively define a tunnel-like semi-closed space in which the radiator 102 is integrally accommodated, and define an air passage between the radiator 102 and the radiator cover 103 through which air flows over the radiator surface substantially in the second direction B, thereby improving the heat radiation efficiency of the radiator 102.
Fig. 3 illustrates a front sectional view of a main unit connected with a surgical instrument according to another embodiment of the present disclosure, and fig. 4 illustrates a top sectional view of the main unit, wherein the main unit further includes a buffer member filling a first gap, a second gap, and a third gap between the heat sink and the heat sink cover.
As shown in fig. 3 and 4, the host 200 includes a chassis 201, a heat sink 202, a heat sink cover 203, a fan 204, and a buffer 207.
In the embodiment shown in fig. 3 and 4, the chassis 201, the heat sink 202, the heat sink cover 203, and the fan 204 are similar in structure, material, and location to the chassis 101, the heat sink 102, the heat sink cover 203, and the fan 204 shown in fig. 1 and 2, and are not described again here.
In the embodiment shown in fig. 3 and 4, the heat sink 202 is separated from the first side plate 2031 of the heat sink cover 203 by a first gap d1And is spaced apart from the second side plate 2032 by a second gap d2And is spaced apart from the upper cover plate 2033 by a third gap d3. The buffer member 207 includes a part of the first gap d1Is filled in part of the second gap d2And filling the entire third gap d3In (1)A third portion connecting the first and second portions, respectively. As shown in fig. 3 and 4, the first, second and third portions of the buffer 207 may be integrally molded in a "Π -like" shape and filled in at least a portion of the first gap, at least a portion of the second gap and the entire third gap. Providing a buffer in a partial gap between the heat sink and the heat sink cover can improve structural stability and reduce heat radiation from the heat sink to the heat sink cover, preventing heat from being re-dissipated through the heat sink cover into the host machine.
The cushioning members useful in at least one embodiment of the present disclosure may be made of any suitable material, such as foamed plastic, and the like. The present disclosure is not so limited.
In the embodiment shown in fig. 3 and 4, the buffer 207 fills a portion of the first gap d in a shape like "Π1Part of the second gap d2And the entire third gap d3. However, in some other embodiments of the present disclosure, the buffer 207 may also be filled in at least part of at least one of the first gap, the second gap, and the third gap in other manners. For example, the third portion of the buffer may comprise two separate halves which are integrally formed with the first and second portions, respectively, in a shape resembling "Γ", and which fill in at least part of the first gap + part of the third gap and at least part of the second gap + part of the third gap, respectively. In this case, in use, there may be a gap between the two separate halves of the third portion; alternatively, two separate halves of the third portion may fit together to fill the entire third gap. Embodiments of the present disclosure are not limited in this regard.
In some examples, the height ratio of the first portion to the heat sink 202 may be the same as or different from the height ratio of the second portion to the heat sink 202 in a third direction C perpendicular to the first and second directions a and B described above. For example, the ratio between the height of the first portion of the buffer 207 and the height of the heat sink 202 may be less than or equal to 2:3, e.g., less than or equal to 1:2, e.g., less than or equal to 1:3, e.g., less than or equal to 1: 4; the ratio between the height of the second portion and the height of the heat sink 202 may be less than or equal to 2:3, such as less than or equal to 1:2, such as less than or equal to 1:3, such as less than or equal to 1:4, so as to define an air duct between the heat sink 202 and the heat sink cover 203 through which air may flow. Embodiments of the present disclosure are not limited in this regard.
The embodiments shown in fig. 3 and 4 have at least the following advantages: the first side plate 2031, the second side plate 2032, and the upper cover plate 2033 of the radiator cover 203 collectively define a tunnel-like semi-closed space in which the radiator 202 is integrally housed, and define an air passage between the radiator 202 and the radiator cover 203 through which air flows substantially in the second direction B over the radiator surface, thereby improving the heat radiation efficiency of the radiator 202; a buffer 207 is arranged between the radiator 202 and the radiator cover 203, so that the structural stability is improved; the buffer 207 may also prevent heat radiation from the heat sink 202 to the heat sink cover 203, thereby preventing heat from re-dissipating through the heat sink cover into the host.
At least one embodiment of the present disclosure also provides a surgical device, which includes a main machine as shown in at least one embodiment of the present disclosure and a surgical instrument connected to the main machine.
Fig. 5 illustrates a surgical device including the host 201 and the surgical instrument 302 as shown in fig. 3 and 4 in accordance with at least one embodiment of the present disclosure.
In the embodiment shown in fig. 5, the surgical instrument 302 may include, but is not limited to, an ultrasonic blade, a high frequency electric blade, or the like. In operation, the host 201 outputs energy to the surgical instrument 302 to drive the surgical instrument 202 to operate.
The embodiment shown in fig. 5 has at least the following advantages: the first side plate 2031, the second side plate 2032, and the upper cover plate 2033 of the radiator cover 203 of the host 201 collectively define a tunnel-like semi-closed space in which the radiator 202 is integrally housed, and define an air duct between the radiator 202 and the radiator cover 203 through which air flows substantially in the second direction B over the radiator surface, thereby improving the heat radiation efficiency of the radiator 202; a buffer 207 is arranged between the radiator 202 and the radiator cover 203, so that the structural stability is improved; the buffer 207 may also prevent heat radiation from the heat sink 202 to the heat sink cover 203, thereby preventing heat from re-dissipating through the heat sink cover into the host.
For the present disclosure, the following points are also noted.
(1) The drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.
(2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale.
(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above are merely exemplary embodiments of the present disclosure and are not intended to limit the scope of the present disclosure, which is defined by the appended claims.
Claims (17)
1. A host connected to a surgical instrument, comprising:
a chassis;
a radiator disposed in the chassis;
a radiator cover disposed in the cabinet and having a first side plate, a second side plate, and an upper cover plate, the first side plate and the second side plate being disposed at both sides of the radiator in a first direction, respectively, the upper cover plate covering the radiator, and the upper cover plate connecting the first side plate and the second side plate, respectively, to define a first opening and a second opening opposite to each other in a second direction, the first direction being perpendicular to the second direction; and
at least one fan disposed on or in the chassis, wherein the at least one fan rotates such that airflow enters the heat sink enclosure from the first opening, flows through the heat sink in the second direction, and exits the heat sink enclosure from the second opening.
2. The host of claim 1, wherein,
the first side plate is spaced apart from the heat sink by a first gap, the second side plate is spaced apart from the heat sink by a second gap, and the upper cover plate is spaced apart from the heat sink by a third gap.
3. The host of claim 2, further comprising a buffer filled in at least a portion of at least one of the first gap, the second gap, and the third gap.
4. The host according to claim 3, wherein,
the buffer comprises a first portion, a second portion and a third portion,
the first portion is filled in a part of the first gap, the second portion is filled in a part of the second gap, the third portion is filled in the whole third gap, and the third portion respectively connects the first portion and the second portion.
5. The host according to claim 4, wherein,
in a third direction perpendicular to the first direction and the second direction, a ratio of a height of the first portion to a height of the heat sink is less than or equal to 1:3, and a ratio of a height of the second portion to the height of the heat sink is less than or equal to 1: 3.
6. The host according to claim 3, wherein,
the buffer is made of foamed plastic.
7. The host of claim 1, wherein,
the at least one fan includes a first fan disposed to face the second opening.
8. The host according to claim 7, wherein,
the first fan is disposed in the chassis adjacent to a sidewall of the chassis, and one or more air outlets are disposed in the sidewall of the chassis opposite the first fan to discharge the airflow exiting the radiator cover from the second opening out of the chassis.
9. The host according to claim 7, wherein,
the first fan is disposed on the chassis sidewall to discharge the airflow exiting the radiator cover from the second opening out of the chassis.
10. The host of claim 1, wherein,
the chassis comprises a bottom plate, a top plate and a side wall connected between the bottom plate and the top plate, wherein the bottom plate and the side wall are respectively provided with a plurality of air inlets.
11. The host of claim 1, wherein,
the side walls comprise four side walls connected end to form a closed loop;
the at least one fan includes a first fan disposed on one of the four sidewalls of the chassis to discharge the airflow exiting the heat dissipation cover from the second opening out of the chassis;
the bottom plate is provided with the one or more air inlets; and is
Among three side walls of the four side walls except the side wall facing the second outlet, one or two side walls have the one or more air inlets.
12. The host according to any one of claims 1-11, further comprising:
a power amplifier circuit arranged in the chassis, the power amplifier circuit comprising a power amplifier tube,
the power amplification tube is fixed on the surface of the radiator facing the first side plate and/or the surface of the radiator facing the second side plate.
13. The host according to claim 12, wherein,
the radiator, the power amplifier tube and the radiator cover are arranged at corners of the case.
14. The host according to any one of claims 1-11,
in the second direction, a length of the heat sink is less than or equal to a length of each of the first side plate, the second side plate, and the upper cover plate.
15. The host according to any one of claims 1-11,
the heat sink includes a main body portion and a plurality of plate-like protrusions that protrude from the main body portion in the first direction, and the main body portion and the plurality of plate-like protrusions each extend in the second direction.
16. The host according to any one of claims 1 to 11,
the case is made of metal or engineering plastics;
the heat sink is made of metal; and is
The radiator cover is made of metal or engineering plastic.
17. A surgical device comprising a host as claimed in any one of claims 1 to 16 and a surgical instrument connected to the host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111529896.9A CN114224509A (en) | 2021-12-14 | 2021-12-14 | Main unit connected with surgical instrument and surgical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111529896.9A CN114224509A (en) | 2021-12-14 | 2021-12-14 | Main unit connected with surgical instrument and surgical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114224509A true CN114224509A (en) | 2022-03-25 |
Family
ID=80756075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111529896.9A Pending CN114224509A (en) | 2021-12-14 | 2021-12-14 | Main unit connected with surgical instrument and surgical equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114224509A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010117869A1 (en) * | 2009-04-06 | 2010-10-14 | Tufts Medical Center | Cannula |
| CN102375510A (en) * | 2010-08-17 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation system for computer case |
| CN105744720A (en) * | 2015-12-19 | 2016-07-06 | 深圳市恒湖科技有限公司 | Protection device and method for pins of transistors on radiator |
| CN105992486A (en) * | 2015-01-28 | 2016-10-05 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation module |
| US20190298162A1 (en) * | 2018-03-30 | 2019-10-03 | Olympus Corporation | Endoscopic device and heat radiator |
| US20200085530A1 (en) * | 2017-05-03 | 2020-03-19 | Lsi Solutions, Inc. | Surgical equipment holder |
-
2021
- 2021-12-14 CN CN202111529896.9A patent/CN114224509A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010117869A1 (en) * | 2009-04-06 | 2010-10-14 | Tufts Medical Center | Cannula |
| CN102375510A (en) * | 2010-08-17 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation system for computer case |
| CN105992486A (en) * | 2015-01-28 | 2016-10-05 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation module |
| CN105744720A (en) * | 2015-12-19 | 2016-07-06 | 深圳市恒湖科技有限公司 | Protection device and method for pins of transistors on radiator |
| US20200085530A1 (en) * | 2017-05-03 | 2020-03-19 | Lsi Solutions, Inc. | Surgical equipment holder |
| US20190298162A1 (en) * | 2018-03-30 | 2019-10-03 | Olympus Corporation | Endoscopic device and heat radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6352103B1 (en) | High performance notebook PC cooling system | |
| US9232684B2 (en) | Power converter | |
| CN110235536B (en) | Cooling device and robot control device having the same | |
| US6292363B1 (en) | Servo amplifier unit | |
| JP2006245529A (en) | Electronic apparatus provided with both water-proofing structure and heat dissipating structure | |
| JP2006054215A (en) | Heat radiating structure of electronic equipment | |
| WO2014147961A1 (en) | Electronic-device cooling apparatus and power conversion apparatus provided with same | |
| WO2006001273A1 (en) | Arc welding control device | |
| US20060266052A1 (en) | Passive thermoacoustic cooling apparatus | |
| KR20180070270A (en) | Heat sink structure of inverter | |
| WO2024045981A1 (en) | Power device and photovoltaic system | |
| WO2016185613A1 (en) | Electronic device | |
| CN114224509A (en) | Main unit connected with surgical instrument and surgical equipment | |
| CN213152665U (en) | Heat dissipation device and electronic equipment | |
| CN216673642U (en) | Radio frequency power supply | |
| CN217159528U (en) | Radio frequency power supply with heat dissipation air duct | |
| CN216673641U (en) | Radio frequency power supply with radiator shell | |
| WO2017187898A1 (en) | Heat sink and housing | |
| CN210042701U (en) | Heat radiation structure and power converter with same | |
| TWI680629B (en) | Motor and heat-dissipation device thereof | |
| JPH07131953A (en) | Air cooling structure of electrical power apparatus | |
| JP6569888B2 (en) | Semiconductor device with cooling function | |
| JP2019165549A (en) | Power conversion device and power storage system | |
| CN219761707U (en) | Inverter underframe heat radiation structure and inverter | |
| CN220693617U (en) | Heat dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |