CN114184359B - Ground test verification method for bending moment resistance of satellite waveguide switch - Google Patents
Ground test verification method for bending moment resistance of satellite waveguide switch Download PDFInfo
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Abstract
A ground test verification method for the bending moment resistance of a satellite waveguide switch comprehensively considers possible technological deviation, satellite mechanical test, force and thermal load influence in a thermal test in the final assembly process, reasonably designs the ground test verification technical state of the waveguide switch, verifies the bending moment resistance of the waveguide switch through reasonably making force and thermal test, and is finally used for evaluating the rotation clamping stagnation risk of the waveguide switch after the satellite application.
Description
Technical Field
The invention relates to a ground test verification method for bending moment resistance of a satellite waveguide switch, and belongs to the field of satellite waveguide test design.
Background
The waveguide switch is a key component of satellite payloads and is mainly used for ring backup of amplifiers in satellite transponder subsystems to improve satellite reliability. Waveguide switches are widely used in current high-flux communication satellites, and the single star usage can reach hundreds.
The typical waveguide switch consists of a driving motor head and a radio frequency shell, and the working principle is as follows: after receiving the instruction signal, the driving motor provides a rotating moment to drive the motor rotor and the radio frequency rotating shaft to rotate towards a target state, and after the motor rotor and the radio frequency rotating shaft reach the target state, the position locking magnet provides a locking moment to enable the switch to be kept in a working state and complete radio frequency channel switching. In order to ensure good radio frequency performance of the waveguide switch, the gap between the inner cavity of the radio frequency housing and the rotor needs to be controlled to be in the order of tens of micrometers. On the other hand, the miniaturization and light weight design of waveguide switches continue to advance due to the pressure of the weight of spacecraft control. The waveguide switch has the potential risk of switch rotation clamping stagnation caused by overlarge bending moment deformation of the radio frequency shell in actual use on the satellite due to various factors such as complex waveguide layout, various switch connection modes, force and heat coupling effect, total assembly process deviation and the like. Once the problem of jamming occurs in orbit, the correct switching of the repeater passage cannot be realized, the satellite function performance can be reduced, and the use requirement cannot be met.
In order to evaluate the rotational clamping stagnation risk of the waveguide switch after star application, the waveguide switch and the waveguide layout are combined, the possible technological deviation in the assembly process, the influence of force and heat load in satellite mechanical tests and heat tests are comprehensively considered, the technical state is verified by reasonably designing the ground test of the waveguide switch, and the bending moment resistance of the waveguide switch is verified by reasonably formulating the force and heat tests. At present, no test and verification method capable of comprehensively considering the related factors is available at home and abroad.
The bending moment resistance of the current waveguide switch is mainly carried out through a switch bending moment resistance test. The test method comprises the steps of connecting a single waveguide switch with a waveguide with the length of 80-100 mm, applying concentrated acting forces (the product of the force and the length of the waveguide is the bending moment born by the waveguide switch in the direction) with different directions and different magnitudes on the cantilever end of the waveguide through a spring dynamometer or a weight, rotating the waveguide switch by using ground detection equipment, and measuring the maximum bending moment bearable by normal rotation of the waveguide switch. The existing method only can measure the bending moment resistance of the waveguide switch, and has the following defects: (1) The method does not consider the bending moment influence generated by the layout of the switch and the waveguide, and can not explain whether the measured bending moment resistance can meet the requirements of the layout on the satellite or not; (2) The method does not consider the bending moment introduced by the process deviation in the assembly process, and can not explain whether the measured bending moment resistance can meet the control requirement of the process deviation of the assembly; (3) The method does not consider the change of the bending moment resistance capability when the multi-yoke switch is used together, and can not explain whether the measured bending moment resistance capability can meet the requirement of star utilization of the multi-yoke switch; (4) The method does not consider the influence of the force and the heat load of the emission mechanical environment and the on-orbit heat environment, and can not explain whether the measured bending moment resistance can meet the use requirements of the emission and the on-orbit force and the heat environment.
In summary, the existing method does not comprehensively consider bending moment generated by various factors such as layout, process deviation, multiple use, force and heat environment and the like, and cannot be used for evaluating whether the risk of rotation clamping stagnation exists after the waveguide switch is applied in a star.
Disclosure of Invention
The invention solves the technical problems that: aiming at the problem that the traditional test method cannot be used for evaluating whether the risk of rotation clamping stagnation exists after the waveguide switch is applied to the satellite in the prior art, the ground test verification method for the bending moment resistance of the satellite waveguide switch is provided.
The invention solves the technical problems by the following technical proposal:
a ground test verification method for the bending moment resistance of a satellite waveguide switch comprises the following steps:
(1) According to the waveguide switch structure and the layout of the on-board waveguide switch, the trend layout conditions of the waveguide switch and the waveguide combination test piece are designed;
(2) According to the stress sources received in the whole star assembly process after the waveguide switch is stared, carrying out static analysis on the deformation condition of the waveguide switch port under the influence of various stress sources, and obtaining the equivalent preset deviation of each waveguide switch and the strain level at the appointed distance from the flange port;
(3) Determining test items, test conditions and test success criteria of a piece to be tested, wherein the test items comprise a mechanical test and a thermal test;
(4) According to the equivalent preset deviation of each waveguide switch and the test conditions of the to-be-tested piece, pre-test analysis is performed to predict that each waveguide switch can pass each test item, and if the waveguide switch cannot pass each test item, the bending moment resistance of the failed waveguide switch is improved; if each waveguide switch can pass each test item, respectively acquiring the maximum response position of the waveguide of the to-be-tested piece and the sticking position of the temperature measuring point according to the analysis and prediction result of each test item;
(5) Determining the pasting position of an acceleration sensor according to the maximum response position of the waveguide of the to-be-tested piece, processing, producing and assembling the waveguide switch and the to-be-tested piece, applying preset deviations of given size and direction to each waveguide port according to the data obtained in the step (2) and the step (4), and plugging a gasket according to the preset deviations;
(6) Carrying out mechanical test on a to-be-tested piece, sticking an acceleration sensor on the to-be-tested piece, sticking a control sensor on an installation bottom plate, installing the to-be-tested piece on a vibration table, and respectively carrying out each test item of the to-be-tested piece;
(7) Carrying out thermal test on a to-be-tested piece, mounting the to-be-tested piece in a temperature box, pasting a temperature sensor, starting the temperature box, carrying out thermal test, and carrying out switch rotation test on a high-temperature section and a low-temperature section of each cycle;
(8) And (3) collecting the data obtained in the step (6) and the step (7) for finishing and recording, and finishing the ground test verification of the satellite waveguide.
In the step (1), the trend layout condition of the waveguide switch and the waveguide combination test piece specifically includes:
the number and trend layout of waveguide switches, waveguides, waveguide supports and supporting columns are determined, the thickness of the invar base plate is determined, and the preset deviation required by each waveguide port is determined.
In the step (2), the stress source comprises port misalignment, port non-parallelism and satellite cabin plate gravity deformation of the waveguide switch in the final assembly process, and the specified distance from the flange opening is 5mm to 20mm.
In the step (3), the test items comprise a sinusoidal vibration test, a random vibration test and a thermal cycle test;
the mechanical test comprises the following steps: sinusoidal vibration test, random vibration test, test conditions are:
covering the maximum response of the cabin plate obtained by the satellite system level mechanical test;
the thermal test includes: thermal cycle test, test conditions were:
covering the maximum temperature difference of a cabin board of a satellite system level thermal vacuum test;
the test success criterion is as follows:
the waveguide switch can still rotate normally after a sinusoidal vibration test, a random vibration test and a thermal cycle test.
In the step (4) and the step (5), the maximum response position of the waveguide of the to-be-tested piece is calculated according to the sinusoidal vibration test and the random vibration test, the sticking position of the acceleration sensor is determined according to the calculation result, and the sticking position of the temperature measuring point in the thermal cycling test is determined according to the thermal deformation analysis of the thermal cycling test.
In the step (5), before the preset deviation is applied, two unidirectional dynamic strain gages are stuck on each waveguide at the designated position away from the flange opening, the waveguide mounting operation is adjusted according to the strain reading, so that the unidirectional dynamic strain gages are not affected by bending moment, after the gasket is plugged in, the strain change of the unidirectional dynamic strain gages is recorded and compared with the strain level of the step (2), and the applied preset deviation is confirmed to be correct.
In the step (6), the acceleration sensor is adhered according to the adhering position of the acceleration sensor, and after the test piece is installed on the vibration table, three sinusoidal vibration tests and random vibration tests in orthogonal directions are sequentially completed.
And (3) carrying out a switch rotation test and a characteristic level curve scanning before and after the sinusoidal vibration test and the random vibration test in each orthogonal direction, and dismantling the acceleration sensor and the unidirectional dynamic strain gauge after all the tests are completed.
Compared with the prior art, the invention has the advantages that:
(1) According to the ground test verification method for the satellite waveguide switch bending moment resistance, in the technical state process of designing the waveguide switch and the waveguide assembly test verification thereof, the bending moment influence generated by the switch and the waveguide layout is considered, the bending moment resistance of the test waveguide switch can be proved to meet the satellite layout requirement, meanwhile, in the technical state process of designing the waveguide switch and the waveguide assembly test verification thereof, the bending moment influence caused by process deviation in the assembly process is considered, and the test waveguide switch can prove that the bending moment resistance of the test waveguide switch can meet the control requirement of the assembly process deviation;
(2) The invention adopts a mode of considering the change of bending moment resistance when the multi-way switch is used together in the technical state process of designing the waveguide switch and the waveguide assembly test certificate thereof, and loads according to the worst direction during the test; the bending moment resistance of the waveguide switch through the test can be proved to meet the requirement of satellite-on-the-road use of the multi-gang switch, and in the test conditions of the waveguide switch and the waveguide assembly test verification thereof, the test for the influence of force and thermal load which can cover the mechanical environment of the transmitting section and the on-orbit thermal environment is added, and the waveguide switch through the test can be proved to meet the use requirement of the transmitting and on-orbit force and thermal environment.
Drawings
FIG. 1 is a flow chart of a ground test verification method provided by the invention;
FIG. 2 is a schematic diagram of the state of the art and the direction of the preset deviations of the waveguide switch and waveguide assembly test piece provided by the invention;
FIG. 3 is a schematic illustration of a waveguide switch provided by the invention "misalignment D" with a waveguide flange face;
FIG. 4 is a schematic view of the waveguide switch and the waveguide flange surface "non-parallelism P" provided by the invention;
FIG. 5 is a schematic view of the influence of gravity deformation of the satellite deck on the waveguide switch at the final assembly stage provided by the invention;
FIG. 6 is a schematic diagram of the worst stress direction of the triple waveguide switch provided by the invention;
FIG. 7 is a schematic diagram of the test piece acceleration measurement point position provided by the invention;
FIG. 8 is a schematic diagram of the test piece temperature measurement point positions provided by the invention;
FIG. 9 is a flow chart of a mechanical test provided by the invention;
Detailed Description
A ground test verification method for the bending moment resistance of a satellite waveguide switch solves the problems that the conventional method does not comprehensively consider bending moment generated by various factors such as layout, process deviation, multiple use, force and heat environment and the like and cannot be used for evaluating whether the risk of rotation clamping stagnation exists after the satellite waveguide switch is applied on the satellite, and the specific method comprises the following steps:
(1) According to the waveguide switch structure and the layout of the on-board waveguide switch, the trend layout conditions of the waveguide switch and the waveguide combination test piece are designed;
(2) According to the stress sources received in the whole star assembly process after the waveguide switch is stared, carrying out static analysis on the deformation condition of the waveguide switch port under the influence of various stress sources, and obtaining the equivalent preset deviation of each waveguide switch and the strain level at the appointed distance from the flange port;
(3) Determining test items, test conditions and test success criteria of a piece to be tested, wherein the test items comprise a mechanical test and a thermal test;
(4) According to the equivalent preset deviation of each waveguide switch and the test conditions of the to-be-tested piece, pre-test analysis is performed to predict that each waveguide switch can pass each test item, and if the waveguide switch cannot pass each test item, the bending moment resistance of the failed waveguide switch is improved; if each waveguide switch can pass each test item, respectively acquiring the maximum response position of the waveguide of the to-be-tested piece and the sticking position of the temperature measuring point according to the analysis and prediction result of each test item;
(5) Determining the pasting position of an acceleration sensor according to the maximum response position of the waveguide of the to-be-tested piece, processing, producing and assembling the waveguide switch and the to-be-tested piece, applying preset deviations of given size and direction to each waveguide port according to the data obtained in the step (2) and the step (4), and plugging a gasket according to the preset deviations;
(6) Carrying out mechanical test on a to-be-tested piece, sticking an acceleration sensor on the to-be-tested piece, sticking a control sensor on an installation bottom plate, installing the to-be-tested piece on a vibration table, and respectively carrying out each test item of the to-be-tested piece;
(7) Carrying out thermal test on a to-be-tested piece, mounting the to-be-tested piece in a temperature box, pasting a temperature sensor, starting the temperature box, carrying out thermal test, and carrying out switch rotation test on a high-temperature section and a low-temperature section of each cycle;
(8) Collecting the data obtained in the step (6) and the step (7) for finishing and recording, and finishing the ground test verification of the satellite waveguide;
in the step (1), the trend layout condition of the waveguide switch and the waveguide combination test piece specifically includes:
determining the number and trend layout of waveguide switches, waveguides, waveguide supports and supporting columns, determining the thickness of an invar base plate, and determining the preset deviation required by each waveguide port;
in the step (2), the stress sources comprise port misalignment degree, port non-parallelism degree and satellite cabin plate gravity deformation condition of the waveguide switch in the final assembly process, and the specified distance range from the flange port is 5-20 mm;
in the step (3), the test items comprise a sinusoidal vibration test, a random vibration test and a thermal cycle test;
the mechanical test comprises the following steps: sinusoidal vibration test, random vibration test, test conditions are:
covering the maximum response of the cabin plate obtained by the satellite system level mechanical test;
the thermal test includes: thermal cycle test, test conditions were:
covering the maximum temperature difference of a cabin board of a satellite system level thermal vacuum test;
the test success criterion is as follows:
the waveguide switch can still normally rotate after a sinusoidal vibration test, a random vibration test and a thermal cycle test;
in the step (4) and the step (5), the maximum response position of the waveguide of the to-be-tested piece is calculated according to a sinusoidal vibration test and a random vibration test, the sticking position of the acceleration sensor is determined according to a calculation result, and the sticking position of the temperature measuring point in the thermal cycling test is determined according to thermal deformation analysis of the thermal cycling test;
in the step (5), before the preset deviation is applied, two unidirectional dynamic strain gages are stuck on each waveguide at a specified distance from the flange opening, the waveguide mounting operation is adjusted according to the strain reading, so that the unidirectional dynamic strain gages are not affected by bending moment, after the gasket is plugged in, the strain change of the unidirectional dynamic strain gages is recorded and compared with the strain level of the step (2), and the applied preset deviation is confirmed to be correct;
in the step (6), the acceleration sensor is stuck according to the sticking position of the acceleration sensor, and three sinusoidal vibration tests and random vibration tests in orthogonal directions are sequentially completed after a test piece is mounted on a vibration table;
and (3) carrying out a switch rotation test and a characteristic level curve scanning before and after the sinusoidal vibration test and the random vibration test in each orthogonal direction, and dismantling the acceleration sensor and the unidirectional dynamic strain gauge after all the tests are completed.
Further description of specific embodiments follows:
in the current embodiment, the ground test verification method of the bending moment resistance of the satellite waveguide switch is shown in fig. 1, and comprises the following steps:
step one, according to the structural design result of the waveguide switch and the layout method of the on-board waveguide switch, designing the trend layout state of the waveguide switch and the waveguide assembly test piece, wherein the typical state is shown in fig. 2, and the typical state is as follows:
determining the number of waveguide switches; as shown in fig. 2, 3 switches are selected to form a group of triple switches; the reason is that the triple switch can represent the most common situation on the satellite-if a single switch is used, the situation of multiple switches cannot be considered, and fewer switches are used; if a double-link switch is used, the situation of an intermediate switch is not considered; if a four-way switch is used, more switches are used, and the situation of more than four-way switches on the satellite is slightly less; therefore, the triple switch is optimal;
determining the trend and layout of the waveguide; the triple switch can be connected with 8 waveguides, one end of each waveguide is connected to the switch opening, the other end of each waveguide is connected to the supporting column, and the supporting column is used for simulating electronic equipment which is accessed into the waveguide on the satellite; the waveguide trend layout principle comprises: a) Including the shortest and shorter waveguides on the star, such as WG01, WG06 and WG08 in fig. 2, the waveguide length is about 100-240 mm; b) The arrangement of the waveguide bracket can cover typical working conditions on the satellite, such as WG03 and WG04 in fig. 2, the waveguide bracket is not arranged, but the waveguide bracket comprises a turn, and the waveguide lengths are about 120mm and 160mm respectively; WG02, WG05, WG07 in fig. 2, each comprising a waveguide support, the switch port spans about 80mm, 360mm, 600mm from the waveguide support, respectively;
determining the area size and thickness of an invar steel bottom plate; in FIG. 2, the test piece invar substrate has dimensions of about 900mm by 600mm and a thickness of about 8mm; the bottom plate material is made of invar steel, and the invar steel has a small thermal expansion coefficient and can be approximately considered to be equivalent to a carbon fiber skin composite material panel of a satellite; the determination method of the thickness of the bottom plate is that the bending rigidity of the vertical panel of the bottom plate is equivalent to the bending rigidity of the composite material cabin plate of the satellite through finite element simulation analysis;
according to the layout of the mounting hole sites on the surface of the vibrating table, the positions and the sizes of the mounting holes of the invar base plate and the vibrating table top are designed and determined;
step two, carding the stress sources (such as port misalignment, port non-parallelism, satellite cabin plate gravity deformation and the like of the waveguide switch) received in the whole star assembly process after the waveguide switch is stared, and performing static analysis on the deformation condition of the waveguide switch port under the influence of various stresses to obtain equivalent preset deviation (measured by port misalignment and port imbalance) of each waveguide switch port and a strain level of 10mm away from the waveguide flange port, wherein:
the stress sources to which the comb waveguide switch is subjected in the whole star assembly process after staring are described as main stress sources on the star: (a) Misalignment, which means that before the waveguide flange is connected with the waveguide switch port, the waveguide flange has horizontal misalignment relative to the switch port, as shown in fig. 3, and the horizontal misalignment can be measured by a feeler gauge; at this time, after the waveguide flange is connected with the waveguide switch port by a screw, the waveguide switch is radially deformed under the action of bending moment due to the horizontal dislocation before connection; (b) The non-parallelism is the amount of clearance generated by non-parallelism of the flange surface of the waveguide and the mounting plane of the switch port, and as shown in fig. 4, the non-parallelism also causes radial deformation of the switch after the switch is connected with the waveguide; (C) The principle of the influence of gravity deformation on the switch is shown in fig. 5, most of waveguide switches and waveguides are arranged on a satellite south plate and a satellite north plate which are perpendicular to a Y axis, in the satellite waveguide assembly stage, satellites are fixedly supported at the root through satellite supports and horizontally arranged on a two-axis turntable, the +X axis is upwards or downwards and is in a cantilever beam state, and the satellite cabin plate can slightly deform with the maximum magnitude of mm; at the moment, the waveguide switch is installed, and the waveguide is connected with the switch in the state and cannot deform due to the influence of gravity; however, when the satellite turns 180 degrees around the Z axis, the waveguide will deform along with the cabin plate, and further a bending moment is applied to the opening of the waveguide switch, so that the switch is radially deformed; other stress sources can also be combed and calculated according to the method, and the details are not repeated;
based on the waveguide length and layout trend of the test piece, the misalignment deviation of each waveguide WG0i (i=1 to 8 for fig. 2) of the test piece is combed for control at the time of on-board assemblyAnd non-parallelism deviation->The shorter the waveguide is, the larger the influence of the misalignment and the unparallel on the bending moment generated by the waveguide switch opening is, and the smaller the misalignment deviation and the unparallel deviation which need to be controlled are; />And->Specific values of (2) are not listed here, all less than 0.5mm;
establishing a finite element model of the test piece state by finite element commercial software such as ANSYS, and performing simulation analysis on deviation of each waveguide WG0i in assembly misalignmentAnd non-parallelism deviation->Lower, to the waveguide switch who connects with itRadial deformations D respectively generated (i) And P (i) The unit is mu m; in addition, the radial deformation G of each waveguide WG0i, which is generated by the gravity deformation of the deck, on the waveguide switch connected with the waveguide WG is calculated (i) ；D (i) +P (i) +G (i) The allowable maximum radial deformation of the waveguide switch is not exceeded, otherwise, the bending moment resistance of the waveguide switch is insufficient;
the preset deviation of each waveguide WG0i at the time of the test is uniformly converted into an misalignment by usingOr non-parallelism->To facilitate the test implementation:
calculating the misalignment degree of the waveguide WG0i by using the established finite element modelOr non-parallelism->Presetting worst combination of deviation under different application directions, and calculating strain level of 10mm from flange opening on each waveguide WG0i>And->Wherein positive sign indicates tension and negative sign indicates compression; />And->The subsequent strain gauge sticking position is also to be;
step three, determining test items, test conditions and test success criteria of the test piece; the test items are generally sinusoidal vibration test, random vibration test and thermal cycle test; the sine vibration and random vibration test conditions should cover the maximum response of the deck of the satellite system level mechanical test; the thermal cycle test conditions should cover the maximum temperature difference of the cabin plate of the satellite system level thermal vacuum test; the waveguide switch can still normally rotate before and after mechanical test and during high and low temperature of thermal cycle, which is the most main test success criterion; for the test piece shown in FIG. 2, the sinusoidal vibration test conditions were 15g (5-100 Hz) per axis, and the sweep rate was 2 octaves/min; the total root mean square of the random vibration test conditions is about 10-15 g (20-2000 Hz) per axial direction, and the test time is 2 minutes per axial direction; the thermal cycle test condition is-5-60 ℃, and the cycle times are 8.5 times; wherein, the determination process of the thermal cycle test conditions considers the situation that the waveguide switch is installed on the following two composite material cabins:
in the first case, the waveguide switch is installed on the cabin board of the carbon fiber skin+aluminum honeycomb, and the waveguide switch is a switch of a microwave input passage section: for an input section waveguide switch, the in-orbit temperature of the input section waveguide switch is basically consistent with the temperature of a satellite cabin board; the bottom surface of the waveguide switch is made of aluminum alloy, and the thermal expansion coefficient of the satellite carbon fiber cabin plate is far smaller than that of the aluminum alloy, so that the thermal stress suffered by the waveguide switch in-orbit mainly comes from the deviation between high and low temperature and initial total assembly temperature, and is recorded as delta T 1 The method comprises the steps of carrying out a first treatment on the surface of the The thermal expansion coefficient of the invar bottom plate of the test piece is very small, so that the carbon fiber cabin plate of the satellite can be simulated; at the moment, the ground test can be ensured to verify fully as long as the temperature range of the thermal cycle test of the test piece can cover the worst temperature range of the waveguide switch in whole star thermal analysis and has a certain margin; for the thermal cycle test conditions of-5 to 60℃and the initial total assembly temperature of 25℃it was possible to verify that DeltaT= + -35℃Temperature deviation;
in case two, the waveguide switch is mounted on the deck of aluminum skin + aluminum honeycomb, and the switch is applied both on the microwave input path section and on the microwave output path section: in this case, since the waveguide switch and the satellite cabin board are both made of aluminum alloy materials, the thermal expansion coefficients of the two materials are consistent, so that the main thermal stress suffered by the waveguide switch in-orbit mainly comes from the temperature difference delta T between the output section waveguide switch and the satellite cabin board 2 The temperature difference can be equivalently converted into a first case in the test piece, namely the temperature deviation of delta T (plus or minus 35 ℃) verified in the first case can cover delta T 2 The ground test can be ensured to be sufficiently verified by a certain margin;
step four, according to preset deviation and test conditions, adopting commercial finite element software such as ANSYS to conduct analysis prediction before test, confirming that the maximum radial deformation of the waveguide switch under the preset deviation, mechanical test conditions and thermal cycle test conditions is smaller than an allowable value, and checking through the mechanical test and the thermal cycle test, otherwise, carrying out improved design on the bending moment resistance of the switch; the maximum response position of the waveguide of the test piece is calculated through sine vibration and random vibration analysis to determine the pasting position of the acceleration sensor in mechanics, as shown in fig. 7, and the pasting position of the temperature measuring point in the thermal cycling test is determined through thermal deformation analysis, as shown in fig. 8;
step five, processing, producing and assembling the waveguide switch and the waveguide combination test piece, and applying preset deviation with given size and direction to each waveguide port in a gasket plugging manner according to the results of the step two and the step four; before the preset deviation is applied, two unidirectional dynamic strain gages are stuck near 10mm of each waveguide port according to the strain gage sticking position determined in the fourth step, and the mounting operation is adjusted firstly, so that the strain gages are free from bending moment according to strain readings; then a gasket with given thickness is plugged in, and the actual strain value of each waveguide WG0i is recordedAnd->So that the actual difference +.>From theoretical analysis value->As small as possible to ensure that the preset deviations applied are correct;
step six, carrying out a sine vibration and random vibration mechanical test on the test piece; the flow is as follows: firstly, pasting an acceleration sensor on a test piece and pasting a control sensor on an installation bottom plate according to the result of the step four; then the test piece is arranged on a vibrating table, and three sine and random vibration tests in the orthogonal directions are sequentially completed; before and after the large-magnitude sine and random vibration test in each direction, a switch rotation test and a characteristic level curve scan are also carried out; after the test is completed, the acceleration sensor and the strain gauge are removed; a typical flow is shown in fig. 9; the method comprises the steps of carrying out a dynamic test, wherein in the mechanical test process, active recessing treatment can be carried out on sinusoidal vibration and random vibration test conditions according to the conditions, and the principle of recessing of the sinusoidal vibration test conditions is that the maximum response of a waveguide covers the maximum response of a whole-satellite sinusoidal vibration test; the principle of the dip of the random vibration test condition is that the maximum response of the waveguide covers the maximum response of the whole-satellite noise test, and the random vibration test condition after dip covers the maximum response of the whole-satellite noise test cabin board;
step seven, carrying out a thermal cycle test on the test piece; the flow is as follows: firstly, mounting a test piece in an incubator, and pasting a temperature sensor on the test piece according to the result of the step four; then starting the incubator to develop a thermal cycle test; and performing a switch rotation test on the high-temperature section and the low-temperature section of each cycle.
Although the present invention has been described in terms of the preferred embodiments, it is not intended to be limited to the embodiments, and any person skilled in the art can make any possible variations and modifications to the technical solution of the present invention by using the methods and technical matters disclosed above without departing from the spirit and scope of the present invention, so any simple modifications, equivalent variations and modifications to the embodiments described above according to the technical matters of the present invention are within the scope of the technical matters of the present invention.
What is not described in detail in the present specification belongs to the known technology of those skilled in the art.
Claims (8)
1. A ground test verification method for the bending moment resistance of a satellite waveguide switch is characterized by comprising the following steps:
(1) According to the waveguide switch structure and the layout of the on-board waveguide switch, the trend layout conditions of the waveguide switch and the waveguide combination test piece are designed;
(2) According to the stress sources received in the whole star assembly process after the waveguide switch is stared, carrying out static analysis on the deformation condition of the waveguide switch port under the influence of various stress sources, and obtaining the equivalent preset deviation of each waveguide switch and the strain level at the appointed distance from the flange port;
(3) Determining test items, test conditions and test success criteria of a piece to be tested, wherein the test items comprise a mechanical test and a thermal test;
(4) According to the equivalent preset deviation of each waveguide switch and the test conditions of the to-be-tested piece, pre-test analysis is performed to predict that each waveguide switch can pass each test item, and if the waveguide switch cannot pass each test item, the bending moment resistance of the failed waveguide switch is improved; if each waveguide switch can pass each test item, respectively acquiring the maximum response position of the waveguide of the to-be-tested piece and the sticking position of the temperature measuring point according to the analysis and prediction result of each test item;
(5) Determining the pasting position of an acceleration sensor according to the maximum response position of the waveguide of the to-be-tested piece, processing, producing and assembling the waveguide switch and the to-be-tested piece, applying preset deviations of given size and direction to each waveguide port according to the data obtained in the step (2) and the step (4), and plugging a gasket according to the preset deviations;
(6) Carrying out mechanical test on a to-be-tested piece, sticking an acceleration sensor on the to-be-tested piece, sticking a control sensor on an installation bottom plate, installing the to-be-tested piece on a vibration table, and respectively carrying out each test item of the to-be-tested piece;
(7) Carrying out thermal test on a to-be-tested piece, mounting the to-be-tested piece in a temperature box, pasting a temperature sensor, starting the temperature box, carrying out thermal test, and carrying out switch rotation test on a high-temperature section and a low-temperature section of each cycle;
(8) And (3) collecting the data obtained in the step (6) and the step (7) for finishing and recording, and finishing the ground test verification of the satellite waveguide.
2. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 1, wherein the ground test verification method comprises the following steps:
in the step (1), the trend layout condition of the waveguide switch and the waveguide combination test piece specifically includes:
the number and trend layout of waveguide switches, waveguides, waveguide supports and supporting columns are determined, the thickness of the invar base plate is determined, and the preset deviation required by each waveguide port is determined.
3. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 1, wherein the ground test verification method comprises the following steps:
in the step (2), the stress source comprises port misalignment, port non-parallelism and satellite cabin plate gravity deformation of the waveguide switch in the final assembly process, and the specified distance from the flange opening is 5mm to 20mm.
4. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 1, wherein the ground test verification method comprises the following steps:
in the step (3), the test items comprise a sinusoidal vibration test, a random vibration test and a thermal cycle test;
the mechanical test comprises the following steps: sinusoidal vibration test, random vibration test, test conditions are:
covering the maximum response of the cabin plate obtained by the satellite system level mechanical test;
the thermal test includes: thermal cycle test, test conditions were:
covering the maximum temperature difference of a cabin board of a satellite system level thermal vacuum test;
the test success criterion is as follows:
the waveguide switch can still rotate normally after a sinusoidal vibration test, a random vibration test and a thermal cycle test.
5. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 4, wherein the ground test verification method comprises the following steps:
in the step (4) and the step (5), the maximum response position of the waveguide of the to-be-tested piece is calculated according to the sinusoidal vibration test and the random vibration test, the sticking position of the acceleration sensor is determined according to the calculation result, and the sticking position of the temperature measuring point in the thermal cycling test is determined according to the thermal deformation analysis of the thermal cycling test.
6. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 5, wherein the ground test verification method comprises the following steps:
in the step (5), before the preset deviation is applied, two unidirectional dynamic strain gages are stuck on each waveguide at the designated position away from the flange opening, the waveguide mounting operation is adjusted according to the strain reading, so that the unidirectional dynamic strain gages are not affected by bending moment, after the gasket is plugged in, the strain change of the unidirectional dynamic strain gages is recorded and compared with the strain level of the step (2), and the applied preset deviation is confirmed to be correct.
7. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 6, wherein the ground test verification method comprises the following steps:
in the step (6), the acceleration sensor is adhered according to the adhering position of the acceleration sensor, and after the test piece is installed on the vibration table, three sinusoidal vibration tests and random vibration tests in orthogonal directions are sequentially completed.
8. The ground test verification method for bending moment resistance of a satellite waveguide switch according to claim 7, wherein the ground test verification method comprises the following steps:
and (3) carrying out a switch rotation test and a characteristic level curve scanning before and after the sinusoidal vibration test and the random vibration test in each orthogonal direction, and dismantling the acceleration sensor and the unidirectional dynamic strain gauge after all the tests are completed.
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| CN202282432U (en) * | 2011-10-31 | 2012-06-20 | 西安空间无线电技术研究所 | Waveguide switch |
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| US6985651B2 (en) * | 2003-08-05 | 2006-01-10 | Xerox Corporation | Thermal actuator with offset beam segment neutral axes and an optical waveguide switch including the same |
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| CN202282432U (en) * | 2011-10-31 | 2012-06-20 | 西安空间无线电技术研究所 | Waveguide switch |
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| CN110312918A (en) * | 2016-09-26 | 2019-10-08 | 学术医疗中心 | Spectrometer based on high-resolution integrated optical device |
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