CN114141810A - Preparation method of display substrate and display panel - Google Patents
Preparation method of display substrate and display panel Download PDFInfo
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- CN114141810A CN114141810A CN202111444924.7A CN202111444924A CN114141810A CN 114141810 A CN114141810 A CN 114141810A CN 202111444924 A CN202111444924 A CN 202111444924A CN 114141810 A CN114141810 A CN 114141810A
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- 239000000758 substrate Substances 0.000 title claims abstract description 162
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 239000010410 layer Substances 0.000 claims abstract description 53
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- 238000000151 deposition Methods 0.000 claims abstract description 5
- 238000000059 patterning Methods 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000012634 fragment Substances 0.000 abstract description 5
- 239000006060 molten glass Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000006124 Pilkington process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000007500 overflow downdraw method Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- DZLPZFLXRVRDAE-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] DZLPZFLXRVRDAE-UHFFFAOYSA-N 0.000 description 1
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- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a preparation method of a display substrate and a display panel, wherein the preparation method of the display substrate comprises the following steps: providing a substrate base plate and a supporting base plate, wherein the hardness of the supporting base plate is greater than that of the substrate base plate; bonding the substrate base plate and the supporting base plate through an adhesive layer; depositing a metal layer on one side of the substrate base plate far away from the supporting base plate; patterning the metal layer to form a metal wire; and removing the supporting substrate and the adhesive layer from the substrate to form a display substrate. The substrate base plate and the supporting base plate are adhered through the adhesive layer, then the metal layer is manufactured on the substrate base plate, the display base plate with the metal wiring is obtained after the supporting base plate and the adhesive layer are separated, the risk of fragment caused by warping due to the fact that the substrate base plate is too thin after the super-thick metal layer is deposited can be avoided, and the yield of the display base plate is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a preparation method of a display substrate and a display panel.
Background
Light Emitting Diodes (LEDs) are semiconductor electronic components that convert electrical energy into Light energy, and are widely used in the fields of lighting, display panels, signal lamps, backlights, toys, etc. because they have the characteristics of small size, long service life, rich colors, and low energy consumption. The Mini-LED is also called a sub-millimeter light emitting diode, the size of the Mini-LED is usually 80-200 microns, the Mini-LED is a new generation of LED technology, the characteristics of high efficiency, high reliability, high brightness and fast reaction time of the small-spacing LED are met, and the power consumption and the cost are lower.
The Mini-LED adopts the glass substrate, so that the size can be smaller, the cost is lower, and the market of the Mini-LED product is more favorably realized; in some designs of Mini-LEDs, the copper film thickness needs to be more than 5um, but the thickness of the glass substrate used in the current large generation panel factory is only usually less than 1mm, and the excessively thick copper film can cause the glass substrate to warp greatly, so that the risk of fragment exists in the processing process.
Therefore, improvement is urgently needed to overcome the defects in the prior art.
Disclosure of Invention
The application aims to provide a preparation method of a display substrate and a display panel, and the preparation method and the display panel are used for solving the problem that after super-thick metal is deposited at present, the substrate is warped due to over-thinness, and therefore fragments are caused.
The embodiment of the application provides a preparation method of a display substrate, which comprises the following steps: providing a substrate base plate and a supporting base plate, wherein the hardness of the supporting base plate is greater than that of the substrate base plate; bonding the substrate base plate and the support base plate through an adhesive layer; depositing a metal layer on one side of the substrate base plate far away from the supporting base plate; patterning the metal layer to form a metal wire; and removing the supporting substrate and the adhesive layer from the substrate to form a display substrate.
Optionally, in some embodiments of the present application, the support substrate has a thickness greater than a thickness of the substrate.
Optionally, in some embodiments of the present application, the support substrate has a thickness of 1mm to 3 mm.
Optionally, in some embodiments of the present application, the substrate base plate comprises a glass base plate.
Optionally, in some embodiments of the present application, the support substrate is a rigid substrate, including a glass substrate, a metal substrate, or a ceramic substrate.
Optionally, in some embodiments of the present application, the metal layer comprises at least one of copper, silver, aluminum, molybdenum, titanium.
Optionally, in some embodiments of the present application, the metal layer has a thickness of 2 μm to 20 μm.
Optionally, in some embodiments of the present application, the glue layer comprises a photosensitive glue capable of losing its adhesiveness under irradiation of ultraviolet light.
Accordingly, an embodiment of the present application further provides a display panel, including: a display substrate prepared by the method of any one of the embodiments; and the display device layer is arranged on one side of the display substrate, which is provided with the metal wiring.
Optionally, in some embodiments of the present application, the display panel comprises one of an LED, a Mini-LED, a Micro-LED, an OLED.
In summary, the method for manufacturing a display substrate and a display panel according to the embodiments of the present application include: providing a substrate base plate and a supporting base plate, wherein the hardness of the supporting base plate is greater than that of the substrate base plate; bonding the substrate base plate and the supporting base plate through an adhesive layer; depositing a metal layer on one side of the substrate base plate far away from the supporting base plate; patterning the metal layer to form a metal wire; and removing the supporting substrate and the adhesive layer from the substrate to form a display substrate. The substrate base plate and the supporting base plate are adhered through the adhesive layer, then the metal layer is manufactured on the substrate base plate, after the supporting base plate and the adhesive layer are separated, the display base plate with the metal wiring is obtained, the risk of fragment caused by warping due to the fact that the substrate base plate is too thin after the super-thick metal layer is deposited can be avoided, and the yield of the display base plate is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for manufacturing a display substrate according to an embodiment of the present disclosure;
FIG. 2 is a first schematic structural diagram illustrating a method of fabricating a display substrate according to an embodiment of the present disclosure;
FIG. 3 is a second schematic structural diagram illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure;
FIG. 4 is a third schematic structural diagram of a method for manufacturing a display substrate according to an embodiment of the present disclosure;
FIG. 5 is a fourth schematic structural diagram of a method for manufacturing a display substrate according to an embodiment of the present disclosure;
FIG. 6 is a fifth schematic structural view illustrating a method of fabricating a display substrate according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of the display panel in the embodiment of the present application.
Description of the main reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise stated, the use of directional terms such as "upper", "lower", "left" and "right" may refer to the actual use or operation of the device, may refer to the drawing direction in the drawings, and may refer to two opposite directions; while "inner" and "outer" are with respect to the outline of the device.
Referring to fig. 1 to fig. 6, in particular, an embodiment of the present invention provides a method for manufacturing a display substrate 10, including the following steps:
as shown in fig. 1 and 2, step S1: providing a substrate base plate 100 and a supporting base plate 200, wherein the hardness of the supporting base plate 200 is greater than that of the substrate base plate 100. Wherein the substrate base plate 100 includes a glass base plate; since the support substrate 200 is not a part of the display substrate 10, but is used to provide a supporting force for the substrate 100 during a device manufacturing process, it is preferable that the support substrate 200 is a hard substrate, including a glass substrate, a metal substrate, or a ceramic substrate. It is to be understood that the material of the support base plate 200 is not limited as long as the support base plate 200 has a hardness greater than that of the substrate base plate 100.
The glass substrate in this application is a thin glass sheet with an extremely flat surface. The glass substrate may be formed by a float process, an overflow fusion process, or a flow-down process. In the float process, molten glass liquid is conveyed to a groove filled with molten liquid tin, the molten glass liquid is naturally flattened under the action of surface tension and gravity of the molten glass liquid by utilizing the density difference of the tin and the glass, and then the molten glass liquid enters a cooling chamber for cooling and forming, and the float glass needs further grinding, polishing and other processing at the rear section. The float method for manufacturing the glass substrate has high productivity, is convenient for manufacturing large-size glass substrates, and has lower cost. The overflow fusion method is to introduce molten glass into a conduit, and the molten glass overflows downwards from two sides of the conduit along the conduit wall after reaching the upper limit of the volume, and converges at the lower part like a waterfall to form a sheet-shaped substrate. The overflow fusion method does not need to contact any medium during glass forming, and can not generate the problems of surface property difference of the glass and the like caused by the contact with the medium, so that the processing such as rear-end polishing and the like is not needed. The orifice down-draw method is to introduce the molten glass into the orifice plate-leaking trough made of platinum alloy, and the glass flows out under the action of gravity, and then through rolling and solidification in cooling chamber. The size of the orifice and the down-draw speed determine the thickness of the glass, and the temperature distribution determines the flatness of the glass.
In an embodiment, the substrate 100 is a glass substrate, and the glass substrate is functional glass, and the functional glass is obtained by sputtering a transparent metal oxide conductive thin film coating on ultra-thin glass and performing high-temperature annealing treatment. The transparent metal oxide may be any one of Indium Gallium Zinc Oxide (IGZO), Indium Zinc Tin Oxide (IZTO), Indium Gallium Zinc Tin Oxide (IGZTO), Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Aluminum Zinc Oxide (IAZO), Indium Gallium Tin Oxide (IGTO), or Antimony Tin Oxide (ATO). The above materials have good conductivity and transparency, and are small in thickness, and do not affect the overall thickness of the base substrate 100. Meanwhile, the electronic radiation, ultraviolet and infrared light which are harmful to human bodies can be reduced.
As shown in fig. 1 and 3, step S2: the substrate base plate 100 and the supporting base plate 200 are adhered by an adhesive layer 300. In one embodiment, the adhesive layer 300 includes a photosensitive adhesive that is capable of losing its adhesiveness under irradiation of ultraviolet light. In other words, the adhesive force of the adhesive layer 300 can be adjusted, before the ultraviolet light is irradiated, the substrate base plate 100 and the support base plate 200 have certain adhesion with the adhesive layer 300, respectively, and the adhesion of the adhesive layer 300 can gradually disappear as the irradiation time of the ultraviolet light increases. The supporting substrate 200 can provide a certain supporting force to the substrate 100 through the adhesive layer 300, so that the bending resistance of the substrate 100 is effectively improved, the substrate 100 can be prevented from warping in subsequent processes, and adverse effects on the subsequent device layer manufacturing are avoided.
As shown in fig. 1 and 4, step S3: a metal layer 400 is deposited on the side of the substrate base plate 100 remote from the support base plate 200. Preferably, the method of forming the metal layer 400 includes: the metal layer 400 is formed by a physical vapor deposition or magnetron sputtering method. Specifically, the metal layer 400 is formed by a physical vapor deposition or magnetron sputtering method, so that a dense strong bonding force is formed between the metal layer 400 and the substrate 100, and the metal layer 400 is not easy to fall off and has high reliability and high reliability.
In one embodiment, the metal layer 400 includes at least one of copper, silver, aluminum, molybdenum, and titanium. Preferably, the metal layer 400 is copper. Further, in order to better combine the copper metal layer with the substrate base plate 100 and prevent the copper metal layer from being separated from the substrate base plate 100, a connection metal layer (not shown in fig. 4) may be disposed between the copper metal layer and the substrate base plate 100, and the material of the connection metal layer may be selected to be molybdenum or titanium or a combination of the two.
As shown in fig. 1 and 5, step S4: the metal layer 400 is patterned to form metal traces 410. Preferably, the method for forming the metal trace 410 includes: and laser-etching the metal layer 400 by laser to form the metal trace 410.
As shown in fig. 1 and 6, step S5: the supporting substrate 200 and the adhesive layer 300 are removed from the base substrate 100 to form the display substrate 10. Specifically, after the ultraviolet irradiation is performed on the adhesive layer 300, the viscosity of the adhesive layer 300 gradually disappears along with the increase of the irradiation time, so that the support substrate 200 and the adhesive layer 300 are separated from the substrate 100, respectively, thereby obtaining the display substrate 10. With the adhesive layer 300 whose adhesive force can be adjusted, it is possible to prevent the risk of the base substrate 100 being broken due to an excessive adhesive force of the adhesive layer 300 when the support base plate 200 and the adhesive layer 300 are peeled from the base substrate 100. It should be noted that the display substrate 10 only includes the substrate 100 and the metal traces 410, and the supporting substrate 200 and the adhesive layer 300 are only auxiliary functions.
In one embodiment, the thickness of the support substrate 200 is greater than the thickness of the substrate 100. Preferably, the thickness of the support substrate 200 is 1mm to 3 mm; for example: 2 mm. Further, the thickness of the substrate base plate 100 in the present application is less than 1mm, for example: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, etc.
In this application, the support substrate 200 can provide a certain supporting force to the substrate 100 through the adhesive layer 300, so that the bending resistance of the substrate 100 is effectively improved, after the support substrate 200 is adhered to the substrate 100 through the adhesive layer 300, the ultra-thick metal layer 400 can be prepared on the substrate 100, and the support substrate 200 can prevent the warp phenomenon caused by an excessive acting force between the ultra-thick metal layer 400 and the substrate 100. After the metal layer 400 is patterned to form the metal trace 410, the acting force between the metal trace 410 and the substrate base plate 100 is obviously reduced, and at this time, after the supporting base plate 200 is peeled off, the acting force between the metal trace 410 and the substrate base plate 100 is not enough to cause the substrate base plate 100 to generate a warping phenomenon. By the preparation method of the display substrate 10, the thickness of the metal layer 400 can be increased, and the substrate 100 can be prevented from warping. The thickness of the metal layer 400 is 2 to 20 μm in the present application. Preferably, the thickness of the metal layer 400 is greater than 5 μm, for example: 5-20 μm. That is, the thickness of the metal trace 410 is 2 μm to 20 μm. Preferably, the thickness of the metal trace 410 is greater than 5 μm, for example: 5-20 μm.
Referring to fig. 7, in particular, an embodiment of the present invention provides a display panel 1, where the display panel 1 includes: a display substrate 10, the display substrate 10 being prepared by the method for preparing the display substrate 100 according to any one of the above embodiments; and a display device layer 20 disposed on one side of the display substrate 10 where the metal traces 410 are disposed. It can be understood that the display device layer 20 and the display substrate 10 can form a complete display panel, and the specific structure of the display device layer 20 is a conventional structure in the art, which is not described in detail herein.
In some embodiments, the display panel 1 provided herein includes an Organic Light-Emitting Diode (OLED) panel, a Light-Emitting Diode (LED) panel, a Mini-LED panel, or a Micro-LED panel. The display panel 1 may be used in an electronic device, and the electronic device may be at least one of a smart phone (smartphone), a tablet personal computer (tablet personal computer), a mobile phone (mobile phone), a video phone, an electronic book reader (E-book reader), a desktop computer (desktop PC), a laptop PC, a netbook computer, a workstation (workstation), a server, a personal digital assistant (personal digital assistant), a portable media player (portable multimedia player), an MP3 player, a mobile medical machine, a camera, a game machine, a digital camera, a car navigation device, an electronic billboard, an automatic teller machine, or a wearable device (wearable device).
In summary, the present application discloses a method for manufacturing a display substrate 10 and a display panel 1, where the method for manufacturing the display substrate 10 includes the steps of: providing a substrate base plate 100 and a supporting base plate 200, wherein the hardness of the supporting base plate 200 is greater than that of the substrate base plate 100; bonding the substrate base plate 100 and the support base plate 200 through a glue layer 300; depositing a metal layer 400 on the side of the substrate base plate 100 away from the support base plate 200; patterning the metal layer 400 to form a metal trace 410; and removing the support substrate 200 and the glue layer 300 from the base substrate 100 to form the display substrate 10. The substrate base plate 100 and the support base plate 200 are adhered by the glue layer 300, then the metal layer 400 is manufactured on the substrate base plate 100, after the support base plate 200 and the glue layer 300 are separated, the display base plate 10 with the metal wiring 410 is obtained, the risk of fragment caused by warping due to the fact that the substrate base plate 100 is too thin after an ultra-thick metal layer is deposited can be avoided, and the yield of the display base plate 10 is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The technical solutions provided by the embodiments of the present application are introduced in detail, and specific examples are applied in the description to explain the principles and embodiments of the present application, and the descriptions of the embodiments are only used to help understanding the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A preparation method of a display substrate is characterized by comprising the following steps:
providing a substrate base plate and a supporting base plate, wherein the hardness of the supporting base plate is greater than that of the substrate base plate;
bonding the substrate base plate and the support base plate through an adhesive layer;
depositing a metal layer on one side of the substrate base plate far away from the supporting base plate;
patterning the metal layer to form a metal wire; and
and removing the supporting substrate and the adhesive layer from the substrate to form a display substrate.
2. The method of manufacturing a display substrate according to claim 1, wherein a thickness of the support substrate is larger than a thickness of the substrate base substrate.
3. The method of manufacturing a display substrate according to claim 2, wherein the support substrate has a thickness of 1mm to 3 mm.
4. The method of manufacturing a display substrate according to claim 1, wherein the base substrate comprises a glass substrate.
5. The method of manufacturing a display substrate according to claim 1, wherein the support substrate is a hard substrate including a glass substrate, a metal substrate, or a ceramic substrate.
6. The method of manufacturing a display substrate according to claim 1, wherein the metal layer comprises at least one of copper, silver, aluminum, molybdenum, and titanium.
7. The method of manufacturing a display substrate according to claim 6, wherein the metal layer has a thickness of 2 μm to 20 μm.
8. The method of claim 1, wherein the glue layer comprises a photosensitive glue capable of losing its adhesiveness under irradiation of ultraviolet light.
9. A display panel, comprising:
a display substrate prepared by the method for preparing a display substrate according to any one of claims 1 to 8;
and the display device layer is arranged on one side of the display substrate, which is provided with the metal wiring.
10. The display panel of claim 9, wherein the display panel comprises one of an LED, Mini-LED, Micro-LED, OLED.
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| CN202111444924.7A CN114141810A (en) | 2021-11-30 | 2021-11-30 | Preparation method of display substrate and display panel |
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| CN202111444924.7A CN114141810A (en) | 2021-11-30 | 2021-11-30 | Preparation method of display substrate and display panel |
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