CN114131222A - Method for processing special-shaped hole of glass - Google Patents
Method for processing special-shaped hole of glass Download PDFInfo
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- CN114131222A CN114131222A CN202111614332.5A CN202111614332A CN114131222A CN 114131222 A CN114131222 A CN 114131222A CN 202111614332 A CN202111614332 A CN 202111614332A CN 114131222 A CN114131222 A CN 114131222A
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- shaped hole
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- 239000011521 glass Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005520 cutting process Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000005457 optimization Methods 0.000 claims abstract description 17
- 238000003672 processing method Methods 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 4
- 238000010586 diagram Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 14
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the technical field of glass material special-shaped hole processing, and discloses a glass special-shaped hole processing method, which comprises the following steps of 1, editing a processing path of a special-shaped hole; and 2, cutting the glass to be processed by the laser, executing a processing path of the special-shaped hole by the laser moving path, and executing an optimized scanning path by the laser beam to finish the processing of the special-shaped hole of the glass. When the special-shaped hole is processed to be a closed hole, the optimization of the scanning path of the laser beam comprises the following steps: optimizing the scanning filling track in the xy plane, performing round angle on characteristics such as right angle and the like, and optimizing the interval of the filling scanning track and the whole kerf width; cutting seams with narrow top and wide bottom are adopted in the depth direction of the glass, so that powder is discharged and excess materials in holes fall off; spiral filling curves are adopted and the start and end point scanning delay is optimized. When the machined special-shaped hole is a non-closed hole, laser machining is carried out on the edge part away from the opening part of the non-closed hole to form a closed hole with a thin edge wall reserved at the opening part of the non-closed hole, and then the thin edge wall is ground and removed through a machining method to form the non-closed hole.
Description
Technical Field
The invention belongs to the technical field of glass material special-shaped hole processing, and particularly relates to a glass special-shaped hole processing method.
Background
The glass product is widely applied to various fields such as photovoltaics, electronics, buildings and the like, and along with the development requirements of diversified integration of various products, higher requirements are put forward on the processing of special-shaped holes and boundary characteristics on glass.
The traditional processing method of the special-shaped glass hole adopts a diamond drill bit for mechanical processing, the processing method has the defects of poor hole quality, limited hole size and depth-diameter ratio, incapability of processing small curvature radius, abrasion of the diamond drill bit and the like, and incapability of meeting the market demands of miniaturization and high precision. As shown in fig. 1, the machining method of the butterfly clip hole is very likely to cause edge breakage at some parts with right-angle features, such as corners. Some special processing methods, such as an abrasive water jet processing technology, are matched with a numerical control system, are flexible to process, and particularly for special-shaped holes with complex characteristics, the operation is simple, the processing efficiency is high, but the energy consumption is high, the waste treatment is troublesome, and the defects that due to jet flow deflection, the abrasive is unevenly distributed, inclined stripes are easy to appear on the processing surface, and the like are easily caused.
The laser processing is used as a non-contact high-precision processing technology, no mechanical acting force is generated in the processing process, the laser processing is widely applied to processing of hard and brittle materials, and the glass material has the advantages of non-contact, small edge breakage, small internal stress, simplicity in operation and the like when being subjected to hole processing, but the cutting efficiency of the glass material on a special-shaped hole with complex characteristics is low, and the quality is poor. When holes with non-closed features are made to the glass edge, the cutting fails because machining the edge glass-air interface affects the laser focus. In addition, at the chamfer of the glass, due to the influence of laser refraction, the laser beam cannot be normally focused, so that the cutting fails.
Disclosure of Invention
In order to solve the problems, the invention provides a method for processing a special-shaped glass hole, which can solve the problems of the complicated special-shaped glass hole and the laser cutting with the non-closed edge characteristic.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for processing a special-shaped glass hole comprises the following steps:
step 1, editing a processing path of a special-shaped hole;
and 2, cutting the glass to be processed by the laser, executing a processing path of the special-shaped hole by the laser moving path, and executing an optimized scanning path by the laser beam to finish the processing of the special-shaped hole of the glass.
Preferably, when the special-shaped hole is processed to be a closed hole, the optimization of the scanning path of the laser beam comprises: optimizing the scanning filling track in the xy plane, performing round angle on characteristics such as right angle and the like, and optimizing the interval of the filling scanning track and the whole kerf width; cutting seams with narrow top and wide bottom are adopted in the depth direction of the glass, so that powder is discharged, excess materials in holes fall off, and the cutting success rate is improved; and a spiral filling curve is adopted, the scanning delay of starting and ending points is optimized, and the starting point defect is eliminated.
Preferably, when the special-shaped hole is processed to be a non-closed hole, the optimization of the scanning path of the laser beam comprises: and performing laser processing on the edge part away from the opening part of the non-closed hole to form a closed hole with an edge thin wall reserved at the opening part of the non-closed hole, and grinding and removing the edge thin wall by a mechanical processing method to form the non-closed hole.
Preferably, the thickness of the edge thin wall is 1mm-3 mm.
Preferably, the laser source is nanosecond green laser, and the scanning system is a digital galvanometer system.
Preferably, the glass material comprises quartz glass, bathroom glass, or photovoltaic glass, and the glass thickness is less than 15 mm.
Preferably, the editing of the machining path of the shaped hole in step 1 includes introducing a shaped hole vector diagram, and optimizing the laser beam scanning path by the shaped hole vector diagram
Preferably, before the special-shaped hole is machined, the laser focusing light spot is regulated, and the regulation and control contents comprise the light spot size, the energy density control and the light spot distortion correction.
Preferably, laser optimization is carried out before the glass special-shaped hole is machined, the laser optimization comprises system delay parameters, laser on delay, laser off delay, scanning delay and idle walking delay, the quality consistency of cutting starting points and end points is ensured, and the hole cutting success rate is improved.
Preferably, when the thickness of the glass to be processed is not more than 5mm, the scanning track interval of the laser beams is 0.03mm-0.05mm, and the whole width of the cutting seam is 0.3mm-0.5 mm.
The beneficial effects of the invention are as follows:
aiming at the characteristics of a special-shaped hole, the processing method optimizes a scanning filling track in an xy plane, performs round angle on characteristics such as right angle and the like, and optimizes the interval of the filling scanning track and the whole kerf width; cutting seams with narrow top and wide bottom are formed in the glass depth direction; and optimizing modes such as spiral filling curves, starting point scanning delay and the like are adopted, so that the cutting success rate can be improved and the starting point defect can be eliminated.
When the machined hole is an open hole, the closed hole is firstly cut based on the optimization method, and a non-closed hole is formed in a mechanical grinding mode, so that the problems of the complex special-shaped hole of the glass material and the laser cutting with the edge non-closed characteristic can be solved.
Drawings
FIG. 1 is a schematic diagram of a prior art butterfly clamp machining process.
Fig. 2 is a schematic diagram of the path optimization of the dumbbell hole in the glass special-shaped hole processing method of the present invention.
Fig. 3 is a laser-mechanical combined machining process of a non-closed hole in the glass special-shaped hole machining method.
Detailed Description
In order to make the purpose, technical solution and advantages of the present technical solution more clear, the present technical solution is further described in detail below with reference to specific embodiments. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present teachings.
The embodiment provides a method for processing a special-shaped glass hole, which comprises the following steps:
step 1, editing a processing path of a special-shaped hole;
and 2, cutting the glass to be processed by the laser, executing a processing path of the special-shaped hole by the laser moving path, and executing an optimized scanning path by the laser beam to finish the processing of the special-shaped hole of the glass.
When the special-shaped hole is processed to be a closed hole, the optimization of the scanning path of the laser beam comprises the following steps: optimizing the scanning filling track in the xy plane, performing round angle on characteristics such as right angle and the like, and optimizing the interval of the filling scanning track and the whole kerf width; cutting seams with narrow top and wide bottom are adopted in the depth direction of the glass, so that powder is discharged, excess materials in holes fall off, and the cutting success rate is improved; and a spiral filling curve is adopted, the scanning delay of starting and ending points is optimized, and the starting point defect is eliminated.
When the special-shaped hole is processed to be a non-closed hole, the optimization of the scanning path of the laser beam comprises the following steps: and performing laser processing on the edge part away from the opening part of the non-closed hole to form a closed hole with an edge thin wall reserved at the opening part of the non-closed hole, and grinding and removing the edge thin wall by a mechanical processing method to form the non-closed hole.
The thickness of the edge thin wall is 1mm-3 mm.
The laser source selects nanosecond green laser, and the scanning system is a digital galvanometer system.
The glass material comprises quartz glass, bathroom glass or photovoltaic glass, and the thickness of the glass is less than 15 mm.
Editing the processing path of the special-shaped hole in the step 1 comprises importing a special-shaped hole vector diagram, and optimizing a laser beam scanning path through the special-shaped hole vector diagram
Preferably, before the machining of the special-shaped hole, in order to ensure the machining precision and quality and meet different machining requirements, the laser focusing light spot needs to be regulated, and the regulation and control content comprises the size of the light spot, the energy density control and the light spot distortion correction.
Laser optimization is carried out before the glass special-shaped hole is machined, the laser optimization comprises system delay parameters, laser on delay, laser off delay, scanning delay and idle walking delay, the quality consistency of cutting starting points and end points is ensured, and the hole cutting success rate is improved.
When the thickness of the glass to be processed is not more than 5mm, the scanning track interval of the laser beams is 0.03mm-0.05mm, and the whole width of the cutting seam is 0.3mm-0.5 mm.
The specific method of the present method for machining a closed shaped hole and an unclosed shaped hole is described in detail below by way of examples.
Example 1
In this embodiment, when the special-shaped hole is a closed hole, as shown in fig. 2, the embodiment provides a method for cutting a dumbbell hole with a glass material, which includes the following steps:
the nanosecond green laser is emitted by a laser, light is emitted from a telecentric field lens through a reflector, a complex light path system (comprising a beam expander and a dynamic focusing unit) and a scanning head, the laser focus is positioned at the bottom of a glass material, a spiral filling curve is adopted, starting and ending point scanning delay is optimized, and starting point defects are eliminated. The state of laser focusing spot and scanning track are controlled by computer.
And optimizing a scanning path, wherein the scanning path comprises the adjustment of the round angle at the corner of the dumbbell hole, the scanning track interval and the whole kerf width. Generally, for glass with the thickness less than or equal to 5mm, the scanning track interval is 0.03-0.05mm, and the whole width of the cutting seam is 0.3-0.5 mm.
And adjusting the state of the focusing light spot, including regulating and controlling parameters such as the size of the light spot, the energy density and the like. The laser selected by the invention is an Nd: YVO4 nanosecond solid laser with the wavelength of 532nm, and the limiting diameter of a central focusing spot is not more than 20 μm.
The laser focusing light spot moves from bottom to top along the scanning path, the temperature of the area to be processed is raised and pressure stress is generated, air convection causes residual stress to be generated in the partial area, and when the residual stress is larger than the strength limit of the glass, microcracks are generated. The crack propagates along the scan path to form a machining cut. The optimization of the scanning path enables the laser processing to be smoother, and the success rate of products is greatly improved.
Example 2
In the present example, in the embodiment of example 1, when the machining hole is an unclosed shaped hole, the unclosed shaped hole is first cut out and machined to form the unclosed shaped hole. The method comprises the following specific steps:
as shown in fig. 3, the present embodiment provides a method for cutting an edge butterfly clip hole in a glass material, wherein the hole belongs to a non-closed special-shaped hole, which comprises the following steps:
and planning a scanning path, namely adopting nanosecond green laser processing at a part within 1-3mm of the deviation edge, introducing a vector diagram of a laser processing part of the special-shaped hole in a computer, and optimizing the scanning path.
And adjusting the position and state of the laser focus, adjusting the height of the workbench, focusing the laser focus on the lower surface of the glass material, and adjusting appropriate processing parameters according to the thickness of the material and the processing requirements.
The thin wall of the edge of the glass edge to be processed is quickly ground by a mechanical grinding head, so that laser-mechanical composite processing is realized.
The foregoing is only a preferred embodiment of the present invention, and many variations in the specific embodiments and applications of the invention may be made by those skilled in the art without departing from the spirit of the invention, which falls within the scope of the claims of this patent.
Claims (10)
1. A method for processing a special-shaped hole of glass is characterized by comprising the following steps: the method comprises the following steps:
step 1, editing a processing path of a special-shaped hole;
and 2, cutting the glass to be processed by the laser, executing a processing path of the special-shaped hole by the laser moving path, and executing an optimized scanning path by the laser beam to finish the processing of the special-shaped hole of the glass.
2. The method of processing a glass shaped hole according to claim 1, characterized in that: when the special-shaped hole is processed to be a closed hole, the optimization of the scanning path of the laser beam comprises the following steps: optimizing the scanning filling track in the xy plane, performing round angle on characteristics such as right angle and the like, and optimizing the interval of the filling scanning track and the whole kerf width; cutting seams with narrow top and wide bottom are adopted in the depth direction of the glass, so that powder is discharged, excess materials in holes fall off, and the cutting success rate is improved; and a spiral filling curve is adopted, the scanning delay of starting and ending points is optimized, and the starting point defect is eliminated.
3. The method of processing a glass profile hole according to claim 2, characterized in that: when the special-shaped hole is processed to be a non-closed hole, the optimization of the scanning path of the laser beam comprises the following steps: and performing laser processing on the edge part away from the opening part of the non-closed hole to form a closed hole with an edge thin wall reserved at the opening part of the non-closed hole, and grinding and removing the edge thin wall by a mechanical processing method to form the non-closed hole.
4. The method of processing a glass profile hole according to claim 3, characterized in that: the thickness of the edge thin wall is 1mm-3 mm.
5. The method of processing a glass shaped hole according to claim 1, characterized in that: the laser source selects nanosecond green laser, and the scanning system is a digital galvanometer system.
6. The method of processing a glass shaped hole according to claim 1, characterized in that: the glass material comprises quartz glass, bathroom glass or photovoltaic glass, and the thickness of the glass is less than 15 mm.
7. The method of processing a glass shaped hole according to claim 1, characterized in that: and editing the processing path of the special-shaped hole in the step 1, wherein the editing comprises the introduction of a special-shaped hole vector diagram, and the optimization of a laser beam scanning path is carried out through the special-shaped hole vector diagram.
8. The method of processing a glass shaped hole according to claim 1, characterized in that: before the special-shaped hole is machined, laser focusing light spots are regulated, and the regulation and control contents comprise light spot size, energy density control and light spot distortion correction.
9. The method of processing a glass shaped hole according to claim 1, characterized in that: laser optimization is carried out before the glass special-shaped hole is machined, the laser optimization comprises system delay parameters, laser on delay, laser off delay, scanning delay and idle walking delay, the quality consistency of cutting starting points and end points is ensured, and the hole cutting success rate is improved.
10. The method of processing a glass shaped hole according to claim 1, characterized in that: when the thickness of the glass to be processed is not more than 5mm, the scanning track interval of the laser beams is 0.03mm-0.05mm, and the whole width of the cutting seam is 0.3mm-0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111614332.5A CN114131222A (en) | 2021-12-27 | 2021-12-27 | Method for processing special-shaped hole of glass |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111614332.5A CN114131222A (en) | 2021-12-27 | 2021-12-27 | Method for processing special-shaped hole of glass |
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| CN114131222A true CN114131222A (en) | 2022-03-04 |
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| CN202111614332.5A Pending CN114131222A (en) | 2021-12-27 | 2021-12-27 | Method for processing special-shaped hole of glass |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174968A (en) * | 2023-03-24 | 2023-05-30 | 中国科学院西安光学精密机械研究所 | Linear track planning method for laser processing of special-shaped holes |
| CN116252057A (en) * | 2023-03-24 | 2023-06-13 | 中国科学院西安光学精密机械研究所 | Contour following track planning method for laser processing of special-shaped holes |
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| US3543979A (en) * | 1968-03-29 | 1970-12-01 | Pilkington Brothers Ltd | Cutting of glass with a laser beam |
| CN101035645A (en) * | 2004-08-04 | 2007-09-12 | 电子科学工业公司 | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| CN101363188A (en) * | 2008-07-29 | 2009-02-11 | 瑞安市博业激光应用技术有限公司 | Cutting method along boundary of laser cutting equipment |
| CN103011171A (en) * | 2011-09-28 | 2013-04-03 | 深圳市木森科技有限公司 | Glass processing method |
| US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
-
2021
- 2021-12-27 CN CN202111614332.5A patent/CN114131222A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3543979A (en) * | 1968-03-29 | 1970-12-01 | Pilkington Brothers Ltd | Cutting of glass with a laser beam |
| CN101035645A (en) * | 2004-08-04 | 2007-09-12 | 电子科学工业公司 | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| CN101363188A (en) * | 2008-07-29 | 2009-02-11 | 瑞安市博业激光应用技术有限公司 | Cutting method along boundary of laser cutting equipment |
| CN103011171A (en) * | 2011-09-28 | 2013-04-03 | 深圳市木森科技有限公司 | Glass processing method |
| US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116174968A (en) * | 2023-03-24 | 2023-05-30 | 中国科学院西安光学精密机械研究所 | Linear track planning method for laser processing of special-shaped holes |
| CN116252057A (en) * | 2023-03-24 | 2023-06-13 | 中国科学院西安光学精密机械研究所 | Contour following track planning method for laser processing of special-shaped holes |
| CN116174968B (en) * | 2023-03-24 | 2023-09-29 | 中国科学院西安光学精密机械研究所 | Linear track planning method for laser processing of special-shaped holes |
| CN116252057B (en) * | 2023-03-24 | 2023-12-08 | 中国科学院西安光学精密机械研究所 | Contour following track planning method for laser processing of special-shaped holes |
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