CN114083433A - Vacuum chuck adjusting device of wafer thinning machine - Google Patents
Vacuum chuck adjusting device of wafer thinning machine Download PDFInfo
- Publication number
- CN114083433A CN114083433A CN202111392571.0A CN202111392571A CN114083433A CN 114083433 A CN114083433 A CN 114083433A CN 202111392571 A CN202111392571 A CN 202111392571A CN 114083433 A CN114083433 A CN 114083433A
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- pitch
- vacuum chuck
- screw
- adjusting
- fixed
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a vacuum chuck adjusting device of a wafer thinning machine, which is used for adjusting the angle of a table top of a vacuum chuck relative to a horizontal plane and is characterized by comprising the following components: the device comprises a vacuum chuck, an adjusting screw, a jacking column, a fixed nut block, a fixed seat, a spherical washer and an adjusted block fixedly connected with the vacuum chuck, wherein the fixed seat is fixedly connected with a rack and used for supporting the adjusted block; the fixed nut block is fixedly connected with the fixed seat; the first screw rod part of the adjusting screw is in threaded connection with the fixed nut block, and the thread has a first thread pitch; the bottom of the jacking column is in threaded connection with the second screw rod part of the adjusting screw, and the threads have a second thread pitch; the top of the jacking column is contacted with the adjusted block through the spherical washer and supports the adjusted block; the first pitch is not equal to the second pitch. The invention can improve the precision of the equipment and meet the requirement of flatness of the wafer.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a vacuum chuck adjusting device of a wafer thinning machine.
Background
Semiconductor silicon wafers are the basic raw material for manufacturing semiconductor devices. The high-purity semiconductor is prepared into a wafer through the procedures of crystal pulling, slicing and the like, the wafer is subjected to a series of semiconductor manufacturing processes to form a tiny circuit structure, and then the wafer is thinned, cut, packaged and tested to form a chip which is widely applied to various electronic equipment, wherein the thinning of the wafer is an important part.
In order to improve the electrical performance of semiconductor chips, it is necessary to thin the back side of the semiconductor wafer, and the device for completing the process is a wafer thinning machine. Wafer thinners typically include a grinding spindle, a vacuum chuck table, and the like. Before the wafer is thinned, the wafer is placed on the table top of the vacuum chuck at the feeding and discharging position, then the table top is moved to the position below the grinding spindle, the grinding spindle descends to grind and thin the wafer, the grinding spindle ascends after grinding is completed, and the table top moves to the feeding and discharging position. The flatness requirement of the surface of the ground wafer is generally about 3um, so that the precision of the angle between the grinding spindle and the spindle of the vacuum chuck table is critical, the adjusting device provided in the prior art provides adjusting screws, adjusting nuts and fixing screws, and in the adjusting process, even if fine threads are used, the adjusting amount is difficult to control, the adjusting precision cannot be ensured, so that the flatness of the ground wafer cannot meet the requirement. Because the flatness requirement of the wafer product is generally less than 3um, the prior art adopts a single-thread structure, and the adjustment of the same adjustment amount of the jacking column needs to screw an adjustment screw with a smaller angle, so that the flatness is not well mastered; if a smaller pitch set screw is machined, firstly the machining becomes more difficult and secondly the bearing capacity of the screw becomes smaller the pitch.
Disclosure of Invention
The invention provides a vacuum chuck adjusting device of a wafer thinning machine, aiming at solving the defects in the prior art, and the vacuum chuck adjusting device can improve the precision of equipment and meet the requirement on wafer flatness.
The invention provides a vacuum chuck adjusting device of a wafer thinning machine, which is used for adjusting the angle of a table top of a vacuum chuck relative to a horizontal plane and comprises: a vacuum chuck, an adjusting screw, a jacking column, a fixing nut block, a fixing seat, a first spherical washer and an adjusted block fixedly connected with the vacuum chuck, wherein
The fixed seat is fixedly connected with the frame and used for supporting the adjusted block,
the fixed nut block is fixedly connected with the fixed seat,
the first screw rod part of the adjusting screw is in threaded connection with the fixed nut block, the thread has a first screw pitch,
the bottom of the jacking column is in threaded connection with the second screw rod part of the adjusting screw, the thread has a second screw pitch,
the top of the jacking column is contacted with the adjusted block through the first spherical washer and supports the adjusted block,
the first pitch is not equal to the second pitch.
Preferably, a tensioning screw is further arranged, the adjusting screw and the jacking column are of hollow structures, the tensioning screw penetrates through the adjusting screw from the top surface of the screw cap of the adjusting screw and the inside of the jacking column to be fixedly connected with the adjusted block through threads, a spring gasket is further sleeved on the part of the tensioning screw exposed out of the adjusting screw, and the tensioning screw is matched with the spring gasket to tension the adjusting screw and the jacking column.
Preferably, the jacking column and the threaded connection section of the adjusting screw are further provided with a fixed flat key, and the fixed flat key is used for ensuring the relative linear motion between the fixed nut block and the jacking column.
Preferably, the jacking column is further provided with a fixed flat key, and the fixed flat key penetrates through a slotted hole in the outer wall of the fixed nut block to be in matched threaded fixed connection with a corresponding threaded hole in the jacking column.
Preferably, the slot has a width in the transverse direction slightly larger than that of the fixing flat key so that the fixing flat key cannot move in the transverse direction, and the slot has a length in the longitudinal direction larger than that of the fixing flat key by a certain dimension so that the fixing flat key can move up and down in the slot.
Preferably, the first pitch is 0.5 and the second pitch is 0.75; alternatively, the first pitch is 0.75 and the second pitch is 0.5.
Preferably, the first pitch is 0.75 and the second pitch is 1; or the first pitch is 1 and the second pitch is 0.75.
Preferably, the first pitch is 1 and the second pitch is 1.25; or the first pitch is 1.25 and the second pitch is 1.
Preferably, the first pitch is 1.25 and the second pitch is 1.5; or the first thread pitch is 1.5 and the second thread pitch is 1.25.
The invention has the following beneficial effects: according to the scheme of the invention, the jacking column is lifted or lowered by screwing the adjusting screw, the adjusting quantity is the difference between two sections of threads of the adjusting screw, compared with the prior art, the adjusting screw rotates by the same angle, the jacking column can be lifted or lowered by a smaller quantity, the gap between the threads can be eliminated by the spring gasket and the fixing screw, the equipment precision can be improved, and the requirement on the flatness of the wafer can be met.
Drawings
FIG. 1 is a cross-sectional view of the vacuum chuck adjustment apparatus of the wafer thinner of the present invention.
Fig. 2 is a partial cross-sectional view of a vacuum chuck adjustment device.
Fig. 3 is a schematic view of the attachment point of a vacuum chuck using the present invention.
Detailed Description
The embodiments of the present invention will be described below with reference to the drawings attached to the specification. It should be noted that the embodiments mentioned in the present description are not exhaustive and do not represent the only embodiments of the present invention. The following examples are provided for clarity of the inventive concepts of the present invention and are not intended to limit the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiment without departing from the spirit and scope of the invention, and it is intended to cover all such changes and modifications as fall within the true spirit and scope of the invention.
The vacuum chuck adjusting device of the wafer thinner of the present invention will be described in detail with reference to fig. 1 to 3. The invention discloses a vacuum chuck adjusting device of a wafer thinning machine, which is used for adjusting the angle of a table-board 91 of a vacuum chuck 9 relative to a horizontal plane. The vacuum chuck 9 of the wafer thinner has three connecting points with the fixed seat 4, as shown in fig. 1 and 3, wherein one point a is a fixed point, and the other two points B and C are adjustable points, and the adjusting device of the wafer thinner adjusts the point B, C so as to adjust the angle of the table-board 91 of the vacuum chuck relative to the horizontal plane.
Specifically, as shown in fig. 1 to 2, the wafer thinning machine of the present invention includes: vacuum chuck 9, adjusting screw 1, jacking post 2, fixed nut piece 3, fixing base 4, first spherical washer 5, with vacuum chuck 9 fixed connection by adjusting block 6, lag screw 7 and spring shim 8.
The fixing base 4 is fixedly connected to a frame (not shown) for supporting the adjusted block 6.
The fixing nut block 3 is fixedly connected with the fixing seat 4, for example, by 4 socket head cap screws. Specifically, the fixing nut block 3 has a hollow cylindrical shape with a horizontally protruding rim at the bottom.
The first screw rod part 11 of the adjusting screw 1 is in threaded connection with the fixed nut block 3, and the first screw rod part has a first screw pitch. Specifically, the outer wall of the first screw portion 11 of the adjusting screw 1 is in threaded connection with the inner wall of the fixing nut block 3.
The bottom of the jacking column 2 is in threaded connection with a second screw rod part 12 of the adjusting screw 1, and the second screw rod part has a second screw pitch. Specifically, the bottom of the jacking column 2 is of a hollow structure, and the inner wall of the jacking column 2 is in threaded connection with the outer wall of the second screw rod part 12. The first screw portion 11 is located closer to the set block 6 than the second screw portion 12. The first pitch is not equal to the second pitch and it is preferred that the pitch difference is as small as possible. In a preferred embodiment, the first pitch is 0.5 and the second pitch is 0.75; alternatively, the first pitch is 0.75 and the second pitch is 0.5. In another preferred embodiment, the first pitch is 0.75 and the second pitch is 1; or the first pitch is 1 and the second pitch is 0.75. In yet another preferred embodiment, the first pitch is 1 and the second pitch is 1.25; or the first pitch is 1.25 and the second pitch is 1. In yet another preferred embodiment, the first pitch is 1.25 and the second pitch is 1.5; or the first thread pitch is 1.5 and the second thread pitch is 1.25.
The first spherical washer 5 is arranged between the top of the jacking column 2 and the adjusted block 6 to support the adjusted block 6, so that a vacuum chuck 9 fixedly connected with the adjusted block 6 is supported. Here, the first spherical washer 5 is composed of an upper member and a lower member, and the two members are in spherical contact with each other, and are in surface contact during relative movement of the two members, so that the force is better.
By adopting the structure, the jacking column 2 is lifted or lowered by screwing the adjusting screw 1, so that the adjusted block 6 is driven to lift or lower, the adjustment amount is the pitch difference of the two sections of threads of the first screw rod part and the second screw rod part of the adjusting screw 1, and compared with the prior art, the adjusting screw 1 rotates by the same angle, and the jacking column 2 can be lifted or lowered by a smaller amount. Specifically, as seen from the direction of the arrow shown in fig. 1, the adjusting screw 1 is rotated clockwise to make the adjusting screw 1 drive the jacking column 2 to move upward together, and at the same time, the fine-section screw thread (the second screw part 12) of the adjusting screw 1 makes the jacking column 2 move downward, so that the actual moving distance of the jacking column 2 is the difference between the screw pitches of the first screw part and the second screw part of the adjusting screw, and thus, a smaller amount of adjustment can be performed, and higher adjustment accuracy can be obtained.
Preferably, adjusting device still sets up lag screw 7, adjusting screw 1 and jacking post 2 are hollow structure, lag screw 7 follow its inside and jacking post 2 inside are passed to the nut 13 top surface of adjusting screw 1 and with by adjusting block 6 screw thread fixed connection, lag screw 7 exposes adjusting screw 1's part still overlaps establishes spring shim 8, lag screw 7 with spring shim 8 cooperation is taut adjusting screw 1 with jacking post 2. Therefore, the clearance between threads can be eliminated, the equipment precision can be improved, and the requirement on the flatness of the wafer can be met.
Preferably, the threaded connection section of the jacking column 2 and the adjusting screw 1 is further provided with a fixed flat key 10, and the fixed flat key is used for ensuring the relative linear motion between the jacking column 2 and the fixed nut block 3, namely the relative rotation motion between the jacking column 2 and the fixed nut block is not generated, and only the relative ascending or descending motion is generated. Specifically, the outer wall of the fixing nut block 3 is provided with a slot 31, the fixing flat key 10 passes through the slot 31 to be in fit thread fixed connection with a corresponding threaded hole on the jacking column 2, the slot 31 has a slightly larger width than the fixing flat key 10 in the transverse direction (i.e. the radial direction of the fixing nut block), so that the fixing flat key 10 cannot move in the transverse direction, and the slot 31 has a length larger than the fixing flat key 10 by a certain dimension in the longitudinal direction (i.e. the axial direction of the fixing nut block), so that the fixing flat key 10 can move up and down in the slot 31.
Referring to fig. 2, for the fixing point a, the fixing block 14 of the vacuum chuck is fixedly connected to the fixing base 4 by the thread of the socket head cap 16, and second spherical washers 15 are disposed under the nut and between the fixing block and the fixing base 4. For the adjustable points B and C, a spherical washer 5 is provided between the adjusted block 6 of the vacuum chuck 9 and the fixed seat 4. When the adjustable point B or C is adjusted, taking point B as an example, the lifting column 2 at point B drives the adjusted block 6 to ascend or descend, and due to the influence of point a and point C, the angle of the adjusted block 6 relative to the horizontal plane changes (i.e., the adjusted block 6 tilts), and conversely, point a and point C also change relative to the horizontal plane due to the influence of point B. But through the structure of the second spherical washer 15 and the first spherical washer 5, the slight movement between the upper spherical surface and the lower spherical surface can ensure that all the structure contacts are surface contacts, so that the angle of the adjusted block 6, namely the angle of the vacuum chuck table-board 91, is more stable and smoother when changed, and the adjusted structure is more stable.
The structure of the invention can adjust the angle of the adjusted block 6 by screwing the outer hexagonal part of the adjusting screw 1 to enable the jacking column 2 to ascend or descend, and simultaneously, the tightening screw 7 is screwed by the inner hexagonal screw in the middle to eliminate the thread clearance between the adjusting screw 1 and the fixed nut block 3, etc., thereby ensuring that the adjusting result is not changed due to vibration after adjustment and further improving the adjusting precision of the wafer thinning machine.
Because the adjusting amount of the invention is the difference of the two-section thread pitch of the adjusting screw 1, the adjusting amount is smaller than that of the prior art, and the adjusting amount can be slightly adjusted, thereby ensuring the adjusting precision. In addition, the wafer thinning machine only needs to process one group of threads, so that the thread difference is ensured to be as small as possible, and the micro adjustment can be realized.
It will be apparent to those skilled in the art that the above embodiments are merely illustrative of the present invention and are not to be construed as limiting the present invention, and that changes and modifications to the above described embodiments may be made within the spirit and scope of the present invention as defined in the appended claims.
Claims (9)
1. The utility model provides a wafer attenuate machine vacuum chuck adjusting device, the device is used for adjusting the angle of the relative horizontal plane of vacuum chuck's mesa, its characterized in that includes: vacuum chuck, adjusting screw, jack-up post, fixed nut piece, fixing base, first spherical surface packing ring, with vacuum chuck fixed connection by the adjusting piece, wherein
The fixed seat is fixedly connected with the frame and used for supporting the adjusted block,
the fixed nut block is fixedly connected with the fixed seat,
the first screw rod part of the adjusting screw is in threaded connection with the fixed nut block, the thread has a first thread pitch,
the bottom of the jacking column is in threaded connection with the second screw rod part of the adjusting screw, the thread has a second screw pitch,
the top of the jacking column is contacted with the adjusted block through the first spherical washer and supports the adjusted block,
the first pitch is not equal to the second pitch.
2. The vacuum chuck adjusting device of the wafer thinning machine as claimed in claim 1, further comprising a tightening screw, wherein the adjusting screw and the lifting column are hollow, the tightening screw passes through the adjusting screw and the lifting column from the top surface of the adjusting screw, and is fixedly connected with the adjusted block through a thread, a spring washer is further sleeved on a portion of the tightening screw exposed out of the adjusting screw, and the tightening screw and the lifting column are tightened by matching the tightening screw with the spring washer.
3. The vacuum chuck adjusting device of claim 2, wherein the lifting column and the threaded connection section of the adjusting screw further have a flat fixing key for ensuring the relative linear motion between the fixing nut block and the lifting column.
4. The vacuum chuck adjusting device of claim 3, further comprising a fixing flat key, wherein the fixing flat key penetrates through the slotted hole in the outer wall of the fixing nut block and is fixedly connected with the corresponding threaded hole in the jacking column in a matching and threaded manner.
5. The vacuum chuck adjustment apparatus for a wafer thinner as claimed in claim 4, wherein the slot has a width in a lateral direction slightly larger than that of the fixed flat key so that the fixed flat key cannot move in the lateral direction, and the slot has a length in a longitudinal direction larger than that of the fixed flat key by a certain dimension so that the fixed flat key can move up and down in the slot.
6. The vacuum chuck adjustment apparatus of claim 1, wherein the first pitch is 0.5 and the second pitch is 0.75; alternatively, the first pitch is 0.75 and the second pitch is 0.5.
7. The wafer thinner machine vacuum chuck adjustment apparatus of claim 1, wherein the first pitch is 0.75 and the second pitch is 1; or the first pitch is 1 and the second pitch is 0.75.
8. The vacuum chuck adjustment device of claim 1, wherein the first pitch is 1 and the second pitch is 1.25; or the first pitch is 1.25 and the second pitch is 1.
9. The vacuum chuck adjustment device of claim 1, wherein the first pitch is 1.25 and the second pitch is 1.5; or the first thread pitch is 1.5 and the second thread pitch is 1.25.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111392571.0A CN114083433A (en) | 2021-11-23 | 2021-11-23 | Vacuum chuck adjusting device of wafer thinning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111392571.0A CN114083433A (en) | 2021-11-23 | 2021-11-23 | Vacuum chuck adjusting device of wafer thinning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114083433A true CN114083433A (en) | 2022-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111392571.0A Pending CN114083433A (en) | 2021-11-23 | 2021-11-23 | Vacuum chuck adjusting device of wafer thinning machine |
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| CN (1) | CN114083433A (en) |
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| CN111823084A (en) * | 2020-07-30 | 2020-10-27 | 华海清科(北京)科技有限公司 | Grinding apparatus with differential thread structure |
| CN213794648U (en) * | 2021-05-14 | 2021-07-27 | 黑龙江昂拓科技开发有限公司 | Quick-change nondestructive adjustable screw milling cutter |
| CN216278814U (en) * | 2021-11-23 | 2022-04-12 | 上海世禹精密机械有限公司 | Double-thread jacking adjusting mechanism |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| CN101905433A (en) * | 2009-06-03 | 2010-12-08 | 昭进半导体设备(上海)有限公司 | Grinding head adjusting mechanism of wafer back grinding machine |
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| CN213794648U (en) * | 2021-05-14 | 2021-07-27 | 黑龙江昂拓科技开发有限公司 | Quick-change nondestructive adjustable screw milling cutter |
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