CN114077301B - Virtual reality glove and manufacturing method thereof - Google Patents
Virtual reality glove and manufacturing method thereof Download PDFInfo
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- CN114077301B CN114077301B CN202010844705.7A CN202010844705A CN114077301B CN 114077301 B CN114077301 B CN 114077301B CN 202010844705 A CN202010844705 A CN 202010844705A CN 114077301 B CN114077301 B CN 114077301B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 198
- 239000011241 protective layer Substances 0.000 claims abstract description 51
- 239000004753 textile Substances 0.000 claims abstract description 39
- 239000004744 fabric Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 238000009423 ventilation Methods 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 description 56
- 230000003014 reinforcing effect Effects 0.000 description 26
- -1 polypropylene Polymers 0.000 description 12
- 239000004743 Polypropylene Substances 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229920006380 polyphenylene oxide Polymers 0.000 description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000004088 simulation Methods 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
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- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/011—Arrangements for interaction with the human body, e.g. for user immersion in virtual reality
- G06F3/014—Hand-worn input/output arrangements, e.g. data gloves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2437/00—Clothing
- B32B2437/02—Gloves, shoes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/01—Indexing scheme relating to G06F3/01
- G06F2203/012—Walk-in-place systems for allowing a user to walk in a virtual environment while constraining him to a given position in the physical environment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Push-Button Switches (AREA)
- Gloves (AREA)
- Structure Of Printed Boards (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
Abstract
The invention provides a manufacturing method of a virtual reality glove, which comprises the following steps: providing a flexible circuit substrate, wherein the flexible circuit substrate comprises a base layer and a first conductive circuit layer formed on one surface of the base layer; forming a first protective layer on the first conductive line layer, wherein part of the first conductive line layer is exposed to the first protective layer to form a first connection pad; a touch feedback unit is arranged on the first connecting pad and is electrically connected with the first conductive circuit layer through the first connecting pad; forming a first textile fabric layer on the first protective layer to obtain an intermediate, wherein the haptic feedback unit is exposed to the first textile fabric layer; and producing the virtual reality glove according to at least one intermediate. The volume and the weight of the virtual reality glove manufactured by the invention are smaller. The invention also provides the virtual reality glove manufactured by the method.
Description
Technical Field
The invention relates to the technical field of virtual reality, in particular to a pair of virtual reality gloves and a manufacturing method thereof.
Background
The virtual reality technology is a computer simulation system capable of creating and experiencing a virtual world, a simulation environment is generated by using a computer, and the system simulation of the three-dimensional dynamic view and entity behaviors which are integrated by multi-source information is realized so that a user is immersed in the simulation environment. Virtual reality gloves are important interactive devices in the field of virtual reality. However, the volume and weight of the existing virtual reality gloves are relatively large, and it is difficult to give the user a better immersive experience.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a virtual reality glove with relatively small volume and weight.
In addition, it is also necessary to provide a virtual reality glove manufactured by the method.
The invention provides a manufacturing method of virtual reality gloves, which comprises the following steps:
providing a flexible circuit substrate, wherein the flexible circuit substrate comprises a base layer and a first conductive circuit layer formed on one surface of the base layer;
forming a first protective layer on the first conductive line layer, wherein part of the first conductive line layer is exposed to the first protective layer to form a first connection pad;
a touch feedback unit is arranged on the first connecting pad and is electrically connected with the first conductive circuit layer through the first connecting pad;
forming a first textile fabric layer on the first protective layer to obtain an intermediate, wherein the haptic feedback unit is exposed to the first textile fabric layer; and
and manufacturing the virtual reality glove according to at least one intermediate.
The invention also provides a virtual reality glove comprising:
the flexible circuit substrate comprises a base layer and a first conductive circuit layer formed on one surface of the base layer;
a first protection layer formed on the first conductive line layer, a portion of the first conductive line layer being exposed to the first protection layer to form a first connection pad;
the touch feedback unit is mounted on the first connecting pad and is electrically connected with the first conductive circuit layer through the first connecting pad; and
a first textile layer formed on the first protective layer, wherein the haptic feedback unit is exposed to the first textile layer.
According to the invention, the flexible circuit substrate is used as the body of the virtual reality glove, and no additional cable is required to be added, so that the volume and the weight of the virtual reality glove are reduced, and the thinning of the virtual reality glove is realized.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board according to a preferred embodiment of the present invention.
Fig. 2 is a schematic structural view of the flexible wiring board shown in fig. 1 after forming a conductive portion.
Fig. 3 is a schematic structural diagram after forming a first protective layer and a second protective layer on the first conductive trace layer and the second conductive trace layer shown in fig. 2, respectively.
Fig. 4 is a schematic structural view of the flexible circuit board shown in fig. 3 after forming a first reinforcing sheet and a second reinforcing sheet on both sides thereof.
Fig. 5 is a schematic structural view of the first and second connection pads shown in fig. 4 after the haptic feedback unit and the solar energy conversion unit are mounted thereon, respectively.
Fig. 6 is a schematic structural view of the haptic feedback unit and the solar energy conversion unit shown in fig. 5 after forming a first waterproof layer and a second waterproof layer, respectively.
Fig. 7 is a schematic structural diagram of the first protective layer and the second protective layer shown in fig. 6 after forming a third adhesive layer and a fourth adhesive layer on the first protective layer and the second protective layer, respectively.
Fig. 8 is a schematic structural diagram of the third adhesive layer, the first protective layer, the first adhesive layer, the flexible circuit board, the second adhesive layer, the second protective layer, and the fourth adhesive layer shown in fig. 7 after ventilation holes are formed therein.
Fig. 9 is a schematic structural view of the third adhesive layer and the fourth adhesive layer shown in fig. 8 after forming a first textile fabric layer and a second textile fabric layer, respectively.
Fig. 10 is a schematic view of the structure of a virtual reality glove made from the intermediate shown in fig. 9.
Fig. 11 is a physical diagram of the intermediate shown in fig. 9.
Fig. 12 is a physical view of the virtual glove shown in fig. 10.
Description of the main reference signs
Virtual reality glove 100
Substrate 10
Base layer 101
First conductive trace layer 102
First connection pad 1021
Second conductive line layer 103
Second connection pad 1031
Conductive part 11
First protective layer 20
First opening 201
First slot 202
Second protective layer 21
Second opening 211
Second slot 212
First adhesive layer 22
Second adhesive layer 23
First reinforcing sheet 30
Second reinforcing sheet 31
Haptic feedback unit 40
Solar energy conversion unit 41
First connecting element 42
Second connecting element 43
First waterproof layer 50
Second waterproof layer 51
Third adhesive layer 60
Fourth adhesive layer 61
Air holes 70
First textile fabric layer 80
First fenestration 801
Second textile fabric layer 81
Second fenestration 811
Intermediate 90
First region 901
Second region 902
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The invention will be described in detail below with reference to the drawings and preferred embodiments thereof, in order to further explain the technical means and effects of the invention to achieve the intended purpose.
The preferred embodiment of the invention provides a manufacturing method of a virtual reality glove, which comprises the following steps:
in step S101, referring to fig. 1, at least one flexible circuit substrate 10 is provided.
In this embodiment, the flexible circuit board 10 includes a base layer 101, and a first conductive circuit layer 102 and a second conductive circuit layer 103 formed on opposite sides of the base layer 101. The first conductive trace layer 102 and the second conductive trace layer 103 may be formed by printing or spraying a conductive paste and drying.
The material of the base layer 101 may be one selected from epoxy resin (PP), polypropylene (BT) resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polypropylene (PP), polyimide (PI), thermoplastic polyurethane elastomer rubber (Thermoplastic polyurethanes, TPU), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the base layer 101 is made of polyimide.
Of course, in other embodiments, the number of conductive circuit layers in the flexible circuit board 10 may be changed according to the actual situation.
In step S102, referring to fig. 2, at least one conductive portion 11 is formed in the flexible circuit board 10.
Specifically, at least one blind hole (not shown) is formed in the flexible circuit substrate 10, the blind hole penetrates through the first conductive circuit layer 102 and the base layer 101 in sequence, the bottom of the blind hole corresponds to the second conductive circuit layer 103, and the blind hole is filled with a conductive paste to form the conductive portion 11. The conductive paste can be tin paste, copper paste and the like. The conductive part 11 is used for electrically connecting the first conductive circuit layer 102 and the second conductive circuit layer 103. In other embodiments, the blind holes may also be electroplated to form the conductive portions 11.
In step S103, referring to fig. 3, a first protection layer 20 and a second protection layer 21 are formed on the first conductive trace layer 102 and the second conductive trace layer 103, respectively.
Wherein the first protective layer 20 is adhered to the first conductive circuit layer 102 by a first adhesive layer 22, and the second protective layer 21 is adhered to the second conductive circuit layer 103 by a second adhesive layer 23. The first protection layer 20 is used for protecting the first conductive line layer 102, and the second protection layer 21 is used for protecting the second conductive line layer 103.
A first opening 201 is formed in the first protective layer 20, the first opening 201 penetrates through the first protective layer 20 and the first adhesive layer 22, and a portion of the base layer 101 is exposed to the first opening 201. The second protective layer 21 is provided with a second opening 211, the second opening 211 penetrates through the second protective layer 21 and the second adhesive layer 23, and a part of the base layer 101 is exposed to the second opening 211. Wherein, the first opening 201 and the second opening 211 may be formed by die cutting or UV cutting.
The first protection layer 20 is further provided with a first slot 202, the first slot 202 penetrates through the first protection layer 20 and the first adhesive layer 22, and a part of the first conductive circuit layer 102 is exposed to the first slot 202 to form a first connection pad 1021. The second protection layer 21 is further provided with a second slot 212, the second slot 212 penetrates through the second protection layer 21 and the second adhesive layer 23, and a portion of the second conductive circuit layer 103 is exposed to the second slot 212 to form a second connection pad 1031. Wherein, the first slot 202 and the second slot 212 may be formed by die cutting or UV cutting.
In step S104, referring to fig. 4, a first reinforcing sheet 30 and a second reinforcing sheet 31 are respectively formed on two sides of the flexible circuit board 10, wherein the first reinforcing sheet 30 is located in the first opening 201, and the second reinforcing sheet 31 is located in the second opening 211.
The first reinforcing sheet 30 and the second reinforcing sheet 31 serve to reinforce the mechanical strength of the flexible wiring board 10. The material of the first reinforcing sheet 30 and the second reinforcing sheet 31 may be metallic iron or the like.
In step S105, referring to fig. 5, the haptic feedback unit 40 and the solar energy conversion unit 41 are respectively mounted on the first connection pad 1021 and the second connection pad 1031.
The haptic feedback unit 40 is electrically connected to the first connection pad 1021 through the first connection element 42, wherein the first connection element 42 is located in the first slot 202, and the haptic feedback unit 40 is located outside the first slot 202. The solar energy conversion unit 41 is electrically connected to the second connection pad 1031 through the second connection element 43, the second connection element 43 is located in the second slot 212, and the solar energy conversion unit 41 is located outside the second slot 212.
The haptic feedback unit 40 is electrically connected to the first conductive circuit layer 102 through the first connection pad 1021, and the solar energy conversion unit 41 is electrically connected to the second conductive circuit layer 103 through the second connection pad 1031, so that the haptic feedback unit 40 is electrically connected to the solar energy conversion unit 41 through the conductive portion 11. In this embodiment, the haptic feedback unit 40 may be a haptic sensor. The haptic feedback unit 40 is used to sense a haptic sensation. In this embodiment, the solar energy conversion unit 41 may be a solar cell, and the solar energy conversion unit 41 serves as a main power source to supply power to the haptic feedback unit 40. In another embodiment, the flexible circuit board 10 further includes an external power source (not shown), and the solar energy conversion unit 41 is used as a standby power source to supply power to the haptic feedback unit 40.
The material of the first connection element 42 and the second connection element 43 may be solder, conductive paste, or the like.
In step S106, referring to fig. 6, a first waterproof layer 50 and a second waterproof layer 51 are formed on the haptic feedback unit 40 and the solar energy conversion unit 41, respectively.
Wherein the first waterproof layer 50 covers the top and side surfaces of the haptic feedback unit 40, and the second waterproof layer 51 covers the top and side surfaces of the solar energy conversion unit 41. The first waterproof layer 50 and the second waterproof layer 51 may be waterproof glue, and more specifically, the first waterproof layer 50 and the second waterproof layer 51 may be formed by dispensing or pressing. The first waterproof layer 50 is used to improve the waterproof performance of the haptic feedback unit 40, and the second waterproof layer 51 is used to improve the waterproof performance of the solar energy conversion unit 41.
In step S107, referring to fig. 7, a third adhesive layer 60 and a fourth adhesive layer 61 are formed on the first protective layer 20 and the second protective layer 21, respectively.
Wherein the third adhesive layer 60 is further filled in the first opening 201 and covers the first reinforcing sheet 30, and the fourth adhesive layer 61 is further filled in the second opening 211 and covers the second reinforcing sheet 31. The third adhesive layer 60 and the fourth adhesive layer 61 may be formed by lamination. In the present embodiment, the haptic feedback unit 40 protrudes from the third adhesive layer 60, and the solar conversion unit 41 protrudes from the fourth adhesive layer 61.
In step S108, referring to fig. 8, at least one ventilation hole 70 is formed in the third adhesive layer 60, the first protective layer 20, the first adhesive layer 22, the flexible circuit board 10, the second adhesive layer 23, the second protective layer 21, and the fourth adhesive layer 61.
The ventilation holes 70 sequentially penetrate the third adhesive layer 60, the first protective layer 20, the first adhesive layer 22, the flexible circuit board 10, the second adhesive layer 23, the second protective layer 21, and the fourth adhesive layer 61.
Wherein the ventilation holes 70 are provided at a distance from the haptic feedback unit 40 and the solar energy conversion unit 41.
In step S109, referring to fig. 9, a first textile fabric layer 80 and a second textile fabric layer 81 are formed on the third adhesive layer 60 and the fourth adhesive layer 61, respectively, to obtain an intermediate 90.
Wherein, the position of the first textile layer 80 corresponding to the haptic feedback unit 40 includes a first window 801, and the haptic feedback unit 40 is located in the first window 801 and is exposed to the first window 801. The second textile layer 81 includes a second window 811 at a position corresponding to the solar energy conversion unit 41, and the solar energy conversion unit 41 is located in the second window 811 and exposed to the second window 811.
In this embodiment, the first textile layer 80 is substantially flush with the first waterproof layer 50, and the second textile layer 81 is substantially flush with the second waterproof layer 51. It will be appreciated that the first textile layer 80 does not cover the first waterproof layer 50, and the second textile layer 81 does not cover the second waterproof layer 51.
In step S110, referring to fig. 10, the virtual reality glove 100 is manufactured according to at least one intermediate 90.
Referring to fig. 11, in this embodiment, the intermediate body 90 includes a first region 901 corresponding to the front surface of the glove and a second region 902 corresponding to the back surface of the glove, and the first region 901 is connected to the second region 902. Specifically, the intermediate body 90 may be bent along a connecting line of the first region 901 and the second region 902 of the intermediate body 90 to form a glove pattern, and then edges of the bent first region 901 and second region 902 may be sewn, thereby obtaining the virtual reality glove 100.
Referring to fig. 12, in other embodiments, the intermediate body 90 may include only the first region 901 or the second region 902. Therefore, it is necessary to first laminate the two intermediate bodies 90 to each other to form a glove pattern, and then stitch the edges of the two intermediate bodies 90 after the connection, thereby obtaining the virtual reality glove 100.
Referring to fig. 10, a virtual reality glove 100 is further provided in the preferred embodiment of the present invention, wherein the virtual reality glove 100 includes a flexible circuit board 10, a first protective layer 20, a second protective layer 21, a first reinforcing sheet 30, a second reinforcing sheet 31, a haptic feedback unit 40, a solar energy conversion unit 41, a first waterproof layer 50, a second waterproof layer 51, a third adhesive layer 60, a fourth adhesive layer 61, a first textile fabric layer 80 and a second textile fabric layer 81.
In this embodiment, the flexible circuit board 10 includes a base layer 101, and a first conductive circuit layer 102 and a second conductive circuit layer 103 formed on opposite sides of the base layer 101.
The material of the base layer 101 may be one selected from epoxy resin (PP), polypropylene (BT) resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polypropylene (PP), polyimide (PI), thermoplastic polyurethane elastomer rubber (Thermoplastic polyurethanes, TPU), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the base layer 101 is made of polyimide.
Of course, in other embodiments, the number of conductive circuit layers in the flexible circuit board 10 may be changed according to the actual situation.
At least one conductive part 11 is disposed in the flexible circuit board 10. The conductive part 11 is used for electrically connecting the first conductive circuit layer 102 and the second conductive circuit layer 103.
The first protective layer 20 and the second protective layer 21 are formed on the first conductive line layer 102 and the second conductive line layer 103, respectively.
Wherein the first protective layer 20 is adhered to the first conductive circuit layer 102 by a first adhesive layer 22, and the second protective layer 21 is adhered to the second conductive circuit layer 103 by a second adhesive layer 23. The first protection layer 20 is used for protecting the first conductive line layer 102, and the second protection layer 21 is used for protecting the second conductive line layer 103.
A first opening 201 is formed in the first protective layer 20, the first opening 201 penetrates through the first protective layer 20 and the first adhesive layer 22, and a portion of the base layer 101 is exposed to the first opening 201. The second protective layer 21 is provided with a second opening 211, the second opening 211 penetrates through the second protective layer 21 and the second adhesive layer 23, and a part of the base layer 101 is exposed to the second opening 211.
The first protection layer 20 is further provided with a first slot 202, the first slot 202 penetrates through the first protection layer 20 and the first adhesive layer 22, and a part of the first conductive circuit layer 102 is exposed to the first slot 202 to form a first connection pad 1021. The second protection layer 21 is further provided with a second slot 212, the second slot 212 penetrates through the second protection layer 21 and the second adhesive layer 23, and a portion of the second conductive circuit layer 103 is exposed to the second slot 212 to form a second connection pad 1031.
The first reinforcing sheet 30 and the second reinforcing sheet 31 are respectively located at two sides of the flexible circuit substrate 10, the first reinforcing sheet 30 is located in the first opening 201, and the second reinforcing sheet 31 is located in the second opening 211.
The first reinforcing sheet 30 and the second reinforcing sheet 31 serve to reinforce the mechanical strength of the flexible wiring board 10. The material of the first reinforcing sheet 30 and the second reinforcing sheet 31 may be metallic iron or the like.
The haptic feedback unit 40 and the solar energy conversion unit 41 are respectively mounted on the first connection pad 1021 and the second connection pad 1031.
The haptic feedback unit 40 is electrically connected to the first connection pad 1021 of the first conductive trace layer 102 through a first connection element 42, the first connection element 42 is located in the first slot 202, and the haptic feedback unit 40 is located outside the first slot 202. The solar energy conversion unit 41 is electrically connected to the second connection pad 1031 of the second conductive circuit layer 103 through a second connection element 43, the second connection element 43 is located in the second slot 212, and the solar energy conversion unit 41 is located outside the second slot 212.
The haptic feedback unit 40 is electrically connected to the first conductive circuit layer 102 through the first connection pad 1021, and the solar energy conversion unit 41 is electrically connected to the second conductive circuit layer 103 through the second connection pad 1031, so that the haptic feedback unit 40 is electrically connected to the solar energy conversion unit 41 through the conductive portion 11. In this embodiment, the haptic feedback unit 40 may be a haptic sensor. The haptic feedback unit 40 is used to sense a haptic sensation. In this embodiment, the solar energy conversion unit 41 may be a solar cell, and the solar energy conversion unit 41 serves as a main power source to supply power to the haptic feedback unit 40. In another embodiment, the virtual reality glove 100 further includes an external power source (not shown), and the solar energy conversion unit 41 is used as a standby power source to supply power to the haptic feedback unit 40.
The materials of the first connection element 42 and the second connection element 43 may be solder, conductive paste, or the like.
The first waterproof layer 50 is positioned on the top and side surfaces of the haptic feedback unit 40, and the second waterproof layer 51 is positioned on the top and side surfaces of the solar energy conversion unit 41. The first waterproof layer 50 and the second waterproof layer 51 may be waterproof glue. The first waterproof layer 50 is used to improve the waterproof performance of the haptic feedback unit 40, and the second waterproof layer 51 is used to improve the waterproof performance of the solar energy conversion unit 41.
The third adhesive layer 60 and the fourth adhesive layer 61 are respectively disposed on the first protective layer 20 and the second protective layer 21. Wherein the third adhesive layer 60 is further filled in the first opening 201 and covers the first reinforcing sheet 30, and the fourth adhesive layer 61 is further filled in the second opening 211 and covers the second reinforcing sheet 31. In the present embodiment, the haptic feedback unit 40 protrudes from the third adhesive layer 60, and the solar conversion unit 41 protrudes from the fourth adhesive layer 61.
At least one ventilation hole 70 is formed in the virtual reality glove 100. The ventilation holes 70 sequentially penetrate the third adhesive layer 60, the first protective layer 20, the first adhesive layer 22, the flexible circuit board 10, the second adhesive layer 23, the second protective layer 21, and the fourth adhesive layer 61. The ventilation holes 70 are provided at a distance from the haptic feedback unit 40 and the solar energy conversion unit 41.
The first textile fabric layer 80 and the second textile fabric layer 81 are respectively located on the third adhesive layer 60 and the fourth adhesive layer 61.
Wherein, the position of the first textile layer 80 corresponding to the haptic feedback unit 40 includes a first window 801, and the haptic feedback unit 40 is located in the first window 801 and is exposed to the first window 801. The second textile layer 81 includes a second window 811 at a position corresponding to the solar energy conversion unit 41, and the solar energy conversion unit 41 is located in the second window 811 and exposed to the second window 811.
In this embodiment, the first textile layer 80 is substantially flush with the first waterproof layer 50, and the second textile layer 81 is substantially flush with the second waterproof layer 51. It will be appreciated that the first textile layer 80 does not cover the first waterproof layer 50, and the second textile layer 81 does not cover the second waterproof layer 51.
According to the invention, the flexible circuit substrate 10 is used as the body of the virtual reality glove 100, so that no additional cable is required to be added, the volume and the weight of the virtual reality glove 100 are reduced, and the thinning of the virtual reality glove 100 is realized. Meanwhile, the base layer 101 is made of a flexible material, so that the virtual reality glove 100 can be stretched, thereby increasing comfort for a user during use. The present invention further provides the ventilation holes 70 in the virtual reality glove 100, further increasing the comfort of the user during use. The present invention further combines the flexible circuit board 10 with the first textile fabric layer 80 and the second textile fabric layer 81, which can facilitate the cleaning of the virtual reality glove 100. The present invention further provides the solar energy conversion unit 41, which prolongs the service time of the virtual reality glove 100, and the first and second windows 801 and 811 are respectively formed on the first and second textile fabric layers 80 and 81, so as to reduce the thickness of the virtual reality glove 100.
The above description is only one preferred embodiment of the present invention, but is not limited to this embodiment during actual application. Other modifications and variations to the present invention will be apparent to those of ordinary skill in the art in light of the present teachings.
Claims (9)
1. The manufacturing method of the virtual reality glove is characterized by comprising the following steps of:
providing a flexible circuit substrate, wherein the flexible circuit substrate comprises a base layer, a first conductive circuit layer formed on one surface of the base layer and a second conductive circuit layer formed on the other surface of the base layer;
forming a first protective layer on the first conductive line layer, wherein part of the first conductive line layer is exposed to the first protective layer to form a first connection pad;
forming a second protection layer on the second conductive circuit layer, wherein part of the second conductive circuit layer is exposed to the second protection layer to form a second connection pad;
a touch feedback unit is arranged on the first connecting pad and is electrically connected with the first conductive circuit layer through the first connecting pad;
a solar energy conversion unit is arranged on the second connecting pad and is electrically connected with the second conductive circuit layer through the second connecting pad;
forming a first textile fabric layer on the first protective layer and a second textile fabric layer on the second protective layer to obtain an intermediate, wherein the tactile feedback unit is exposed to the first textile fabric layer, and the solar energy conversion unit is exposed to the second textile fabric layer; and
and manufacturing the virtual reality glove according to at least one intermediate.
2. The method for manufacturing the virtual reality glove according to claim 1, wherein a conductive portion is further provided in the flexible circuit substrate to electrically connect the first conductive circuit layer and the second conductive circuit layer, and the solar energy conversion unit is electrically connected with the haptic feedback unit through the conductive portion.
3. The method of making a virtual reality glove of claim 1, further comprising:
forming a first waterproof layer on the haptic feedback unit; and
forming a second waterproof layer on the solar energy conversion unit;
the first waterproof layer covers the top surface and the side surface of the tactile feedback unit, and the second waterproof layer covers the top surface and the side surface of the solar energy conversion unit.
4. The method for manufacturing the virtual reality glove according to claim 1, wherein at least one ventilation hole is formed in the virtual reality glove, the ventilation hole penetrates through the first protection layer, the flexible circuit substrate and the second protection layer, and the ventilation hole is arranged at a distance from the haptic feedback unit and the solar energy conversion unit.
5. A virtual reality glove, comprising:
the flexible circuit substrate comprises a base layer and a first conductive circuit layer formed on one surface of the base layer;
a first protection layer formed on the first conductive line layer, a portion of the first conductive line layer being exposed to the first protection layer to form a first connection pad;
the touch feedback unit is mounted on the first connecting pad and is electrically connected with the first conductive circuit layer through the first connecting pad; and
a first textile layer formed on the first protective layer, wherein the haptic feedback unit is exposed to the first textile layer.
6. The virtual reality glove of claim 5, wherein the flexible circuit substrate further comprises a second conductive circuit layer formed on the other surface of the base layer, the virtual reality glove further comprising:
a second protection layer formed on the second conductive line layer, a portion of the second conductive line layer being exposed to the second protection layer to form a second connection pad;
the solar energy conversion unit is arranged on the second connecting pad and is electrically connected with the second conductive circuit layer through the second connecting pad; and
and a second textile fabric layer formed on the second protective layer, wherein the solar energy conversion unit is exposed to the second textile fabric layer.
7. The pair of virtual reality gloves according to claim 6, wherein a conductive portion is further provided in the flexible circuit substrate to electrically connect the first conductive circuit layer and the second conductive circuit layer, and the solar energy conversion unit is electrically connected to the haptic feedback unit through the conductive portion.
8. The virtual reality glove of claim 6, further comprising:
the first waterproof layer is positioned on the top surface and the side surface of the tactile feedback unit; and
and the second waterproof layer is positioned on the top surface and the side surface of the solar energy conversion unit.
9. The pair of virtual reality gloves according to claim 6, wherein at least one ventilation hole is formed in the pair of virtual reality gloves, the ventilation hole penetrates through the first protective layer, the flexible circuit substrate and the second protective layer, and the ventilation hole is located at a distance from the haptic feedback unit and the solar energy conversion unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010844705.7A CN114077301B (en) | 2020-08-20 | 2020-08-20 | Virtual reality glove and manufacturing method thereof |
| TW109128835A TWI771741B (en) | 2020-08-20 | 2020-08-24 | Virtual reality gloves and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010844705.7A CN114077301B (en) | 2020-08-20 | 2020-08-20 | Virtual reality glove and manufacturing method thereof |
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| CN114077301A CN114077301A (en) | 2022-02-22 |
| CN114077301B true CN114077301B (en) | 2023-10-10 |
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Also Published As
| Publication number | Publication date |
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| CN114077301A (en) | 2022-02-22 |
| TW202209051A (en) | 2022-03-01 |
| TWI771741B (en) | 2022-07-21 |
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