CN114043634B - Wafer cutting clamping equipment - Google Patents
Wafer cutting clamping equipment Download PDFInfo
- Publication number
- CN114043634B CN114043634B CN202111340146.7A CN202111340146A CN114043634B CN 114043634 B CN114043634 B CN 114043634B CN 202111340146 A CN202111340146 A CN 202111340146A CN 114043634 B CN114043634 B CN 114043634B
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- rod
- sliding
- bevel gear
- shell
- module
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- 238000005520 cutting process Methods 0.000 title claims abstract description 9
- 238000001179 sorption measurement Methods 0.000 claims abstract description 44
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention belongs to the field of wafer processing, and particularly relates to wafer cutting clamping equipment which comprises a chassis, wherein an annular groove is fixedly arranged on the chassis, a first telescopic sleeve is fixedly arranged in the center of the upper surface of the chassis, a sliding rod is arranged in the annular groove in a sliding mode, an adsorption module is arranged at the upper end of the sliding rod, a first telescopic rod is arranged in the first telescopic sleeve in a sliding mode, a rotating ball is fixedly connected to the upper end of the first telescopic rod, a second telescopic sleeve is fixedly connected to the rotating ball, a second telescopic rod is arranged in the second telescopic sleeve in a sliding mode, a motor is fixedly arranged at one end, far away from the rotating ball, of the second telescopic rod, a fixed ring is fixedly arranged on a cylindrical surface of the motor, a sliding shell is rotatably arranged on one side, far away from the second telescopic rod, a clamping rod is arranged in the sliding shell in a sliding mode, a wafer is clamped between the clamping rods, a power module is arranged in the fixed ring, a chamfer driving module is arranged in the sliding shell, a chamfer angle is arranged in the clamping rod, a power conversion module is arranged between the annular groove and the sliding rod, and the adsorption module is arranged in the adsorption module. The wafer can be clamped by chamfering.
Description
Technical Field
The invention belongs to the field of wafer processing, and particularly relates to wafer cutting clamping equipment.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. Domestic wafer lines are mainly 8 inches and 12 inches.
Wafer production includes two major steps of ingot manufacturing and wafer manufacturing, which can be subdivided into the following main processes (wherein ingot manufacturing includes only the following first process, and the rest of wafers are all wafer manufacturing, so they are sometimes collectively referred to as post wafer column slicing processing processes), and the wafer production process flow includes: crystal bar growth, crystal bar cutting and detection, outer diameter grinding, slicing, round edge, surface grinding, etching, defect removal, polishing, cleaning, inspection and packaging, and in the wafer production process, the following problems exist:
(1) the equipment used in the steps of preliminary surface grinding of the round edge of the slice is still traditional industrial processing equipment, and the wafer has no effective prevention against the characteristics of high brittleness, easy cracking and the like
(2) The production steps of the wafer are complicated, and places capable of simplifying and optimizing exist
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides wafer cutting clamping equipment capable of positioning, chamfering, fixing and adsorbing a wafer.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a wafer cutting clamping equipment, includes the chassis, the ring channel has been set firmly on the chassis, chassis upper surface center department has set firmly first flexible cover, the slip has set firmly the solid fixed ring in the ring channel, gu the fixed ring is kept away from second telescopic link one side and has been rotated and have been equipped with the slip casing, it has been stamped the absorption module apron to adsorb module casing top, it has the absorption hole to open on the absorption module apron, it has set firmly first telescopic link to slide in the first flexible cover, first telescopic link upper end has set firmly the spin ball, fixedly connected with second telescopic link on the spin ball, it has set firmly the second telescopic link to slide in the second telescopic link, second telescopic link is kept away from spin ball one end and has been set firmly the motor, the solid fixed ring has been set firmly the slip casing in the motor cylinder face, it has the grip lever to slide one side to have set firmly the power module to press from each other between the grip lever, be equipped with the chamfer drive module in the slip casing, be equipped with the chamfer drive module in the grip lever, be equipped with the fillet module between first telescopic link, be equipped with the power conversion module between ring channel and the slip lever, the slip casing has been equipped with the absorption module.
Preferably, the power module comprises a motor rotating shaft extending from the motor, a first bevel gear is fixedly arranged on a cylindrical surface of one side, close to the motor, of the motor rotating shaft, a rotating sleeve is sleeved outside the cylindrical surface of one side, far away from the first bevel gear, of the motor rotating shaft, a third bevel gear is fixedly arranged on the rotating sleeve, a fixing rod fixedly connected to a fixing ring is arranged between the first bevel gear and the third bevel gear, a second bevel gear is rotatably arranged at the other end of the fixing rod, the second bevel gear is in meshed transmission with the first bevel gear and the third bevel gear, a fixing connecting rod is fixedly arranged on one side, far away from the first bevel gear, of the rotating sleeve, the other end of the fixing connecting rod is fixedly connected to a sliding shell, a fixing plate is fixedly arranged on the sliding shell, and a second spring and an electromagnetic sliding block are arranged between the clamping rod and the fixing plate.
Preferably, the chamfering module comprises a connecting plate fixedly connected to the motor rotating shaft, connecting pipes are fixedly connected to the two ends of the connecting plate, the other ends of the connecting pipes are connected into a piston cylinder, the piston cylinder is arranged in a sliding mode in the piston cylinder, a piston rod extending out of the piston cylinder is fixedly arranged on the piston cylinder, and a chamfering cutter is fixedly connected to the other end of the piston rod.
Preferably, the chamfer driving module comprises a chamfer driving shell fixedly connected to the connecting plate, one end, far away from the motor rotation shaft, of the chamfer driving shell is led into the connecting pipe, a sliding plate is arranged in the chamfer driving shell in a sliding mode, a first spring is arranged between the sliding plate and the chamfer driving shell, the chamfer driving shell is close to one side of the motor rotation shaft and is rotationally provided with a first turbofan, one end, close to the motor rotation shaft, of the first turbofan is fixedly connected with a first turbofan rotation shaft, the other end, close to the motor rotation shaft, of the first turbofan rotation shaft is fixedly connected with a fifth bevel gear, one end, far away from the first bevel gear, of the rotating sleeve is fixedly provided with a fourth bevel gear, and the fourth bevel gear is in meshed transmission with the fifth bevel gear.
Preferably, the power conversion module comprises a groove formed in the annular groove, an annular gear is fixedly arranged in the groove, a first gear is rotatably arranged at the bottom of the sliding rod and is meshed with the annular gear, a second turbofan rotating shaft is rotatably arranged in the middle of the sliding rod, the upper end of the second turbofan rotating shaft is rotatably extended into the adsorption module shell, an outer gear ring is fixedly arranged at the lower end of the second turbofan rotating shaft, and the outer gear ring is meshed with the first gear.
Preferably, the adsorption module comprises a second turbofan fixedly connected to the upper end of a rotating shaft of the second turbofan, a sliding block is arranged in the adsorption hole in a sliding manner, a sucker is arranged in the adsorption hole above the sliding block in a sliding manner, a spring table is fixedly arranged on the lower surface of an adsorption module cover plate at the lower side of the sliding block, a fourth spring is arranged between the spring table and the sliding block, a deflector rod is fixedly arranged at the upper end of the sliding block, a fixed table is fixedly arranged on an adsorption module cover plate at one side of the deflector rod, an inclined sliding block is arranged on the fixed table in a sliding manner, a third spring is arranged between the inclined sliding block and the adsorption module cover plate, and a push rod fixedly connected to the sucker is arranged at the upper side of the inclined sliding block.
The beneficial effects are that:
1. the wafer chamfering device can position a wafer and chamfer in advance by using the clamping rod chamfering module and the chamfering driving module.
2. The wafer can be further stably fixed on the clamping equipment by utilizing the adsorption module, and fragments of the wafer are adsorbed when the wafer is cracked, so that the wafer is convenient to clean.
Drawings
FIG. 1 is a perspective view of the present invention
FIG. 2 is a top view of the present invention
FIG. 3 is a cross-sectional view taken at A-A of FIG. 2
FIG. 4 is a cross-sectional view taken at B-B in FIG. 2
FIG. 5 is an enlarged view of a portion of FIG. 3 at C
FIG. 6 is a partial enlarged view of the portion D in FIG. 3
FIG. 7 is an enlarged view of a portion of FIG. 4 at E
FIG. 8 is an enlarged view of a portion of FIG. 4 at F
In the figure: 11. a chassis; 12. an annular groove; 13. a first telescoping sleeve; 14. a slide bar; 15. an adsorption module housing; 16. a first telescopic rod; 17. a rotating ball; 18. the second telescopic sleeve; 19. a second telescopic rod; 20. a fixing ring; 21. a sliding housing; 22. a clamping rod; 23. a wafer; 24. adsorption holes; 25. an adsorption module cover plate; 26. a rounding module; 27. a power module; 28. a chamfer driving module; 29. a power conversion module; 30. an adsorption module; 31. a motor; 32. a motor rotating shaft; 33. a first bevel gear; 34. a fixed rod; 35. a second bevel gear; 36. a rotating sleeve; 37. a third bevel gear; 38. fixing the connecting rod; 39. a fourth bevel gear; 40. a fifth bevel gear; 41. chamfering drive housing; 42. a first turbofan rotating shaft; 43. a first turbofan; 44. a sliding plate; 45. a first spring; 46. a connecting pipe; 47. a fixing plate; 48. a second spring; 49. an electromagnetic slide block; 50. a piston cylinder; 51. a piston cylinder; 52. a piston rod; 53. chamfering tool; 54. a second turbofan rotating shaft; 55. an inner gear ring; 56. a first gear; 57. an outer ring gear; 58. a second turbofan; 59. a sliding block; 60. a suction cup; 61. a deflector rod; 62. a fixed table; 63. an inclined slide block; 64. a third spring; 65. a spring table; 66. a fourth spring; 67. a connecting plate; 68. a push rod;
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
In the description of the present invention, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that the inventive product is conventionally put in use, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Referring to fig. 1-8, a wafer cutting and clamping device comprises a chassis 11, an annular groove 12 is fixedly arranged on the chassis 11, a first telescopic sleeve 13 is fixedly arranged at the center of the upper surface of the chassis 11, a fixed ring 20 is fixedly arranged on the cylindrical surface of the motor 31, an adsorption module shell 15 is fixedly arranged at the upper end of the fixed ring 14, an adsorption module cover plate 25 is covered above the adsorption module shell 15, an adsorption hole 24 is formed in the adsorption module cover plate 25, a first telescopic rod 16 is slidably arranged in the first telescopic sleeve 13, a rotating ball 17 is fixedly arranged at the upper end of the first telescopic rod 16, a second telescopic sleeve 18 is fixedly connected on the rotating ball 17, a second telescopic rod 19 is slidably arranged in the second telescopic sleeve 18, a motor 31 is fixedly arranged at one end of the second telescopic rod 19 far away from the rotating ball 17, a fixed ring 20 is fixedly arranged on the cylindrical surface of the motor 31, a sliding shell 21 is rotatably arranged on one side of the fixed ring 20 far away from the second telescopic rod 19, a clamping rod 22 is slidably arranged on the sliding shell 21, a wafer 23 is clamped between the clamping rods 22, a power module 27 is arranged in the fixed ring 20, a chamfer driving module 28 is arranged in the sliding shell 21, a chamfer driving module 26 is fixedly arranged in the clamping rod 22, a chamfer driving module 26 is arranged between the clamping rod 12 and the sliding shell 14, a power module 29 is arranged in the power module 29, and is a chamfer module is arranged in the power module 29.
Further, the power module 27 includes a motor rotating shaft 32 extending from the motor 31, a first bevel gear 33 is fixedly arranged on a cylindrical surface of one side of the motor rotating shaft 32, which is close to the motor 31, a rotating sleeve 36 is sleeved outside a cylindrical surface of one side, which is far away from the first bevel gear 33, of the motor rotating shaft 32, a third bevel gear 37 is fixedly arranged on the rotating sleeve 36, a fixed rod 34 fixedly connected to the fixed ring 20 is arranged between the first bevel gear 33 and the third bevel gear 37, a second bevel gear 35 is rotatably arranged at the other end of the fixed rod 34, the second bevel gear 35 is in meshed transmission with the first bevel gear 33 and the third bevel gear 37, a fixed connecting rod 38 is fixedly arranged on one side, which is far away from the first bevel gear 33, of the rotating sleeve 36, the other end of the fixed connecting rod 38 is fixedly connected to the sliding shell 21, a fixed plate 47 is fixedly arranged on the sliding shell 21, and a second spring 48 and an electromagnetic slide 49 are arranged between the clamping rod 22 and the fixed plate 47.
Further, the chamfering module 26 comprises a connecting plate 67 fixedly connected to the motor rotating shaft 32, connecting pipes 46 are fixedly connected to two ends of the connecting plate 67, the other ends of the connecting pipes 46 are connected into the piston cylinder 50, a piston cylinder 51 is arranged in the piston cylinder 50 in a sliding mode, a piston rod 52 extending out of the piston cylinder 50 is fixedly arranged on the piston cylinder 51, and a chamfering tool 53 is fixedly connected to the other end of the piston rod 52.
Further, the chamfer driving module 28 comprises a chamfer driving shell 41 fixedly connected to the connecting plate 67, one end, far away from the motor rotating shaft 32, of the chamfer driving shell 41 is led into the connecting pipe 46, a sliding plate 44 is arranged in the chamfer driving shell 41 in a sliding mode, a first spring 45 is arranged between the sliding plate 44 and the chamfer driving shell 41, one side, close to the motor rotating shaft 32, of the chamfer driving shell 41 is rotatably provided with a first turbofan 43, one end, close to the motor rotating shaft 32, of the first turbofan 43 is fixedly connected with a first turbofan rotating shaft 42, the other end, close to the motor rotating shaft 32, of the first turbofan rotating shaft 42 is fixedly connected with a fifth bevel gear 40, one end, far away from the first bevel gear 33, of the rotating sleeve 36 is fixedly provided with a fourth bevel gear 39, and the fourth bevel gear 39 is meshed with the fifth bevel gear 40.
Further, the power conversion module 29 includes a groove formed in the annular groove 12, an annular gear 55 is fixedly arranged in the groove, a first gear 56 is rotatably arranged at the bottom of the sliding rod 14, the first gear 56 is meshed with the annular gear 55, a second turbofan rotating shaft 54 is rotatably arranged in the middle of the sliding rod 14, the upper end of the second turbofan rotating shaft 54 is rotatably extended into the adsorption module housing 15, an outer gear ring 57 is fixedly arranged at the lower end of the second turbofan rotating shaft 54, and the outer gear ring 57 is meshed with the first gear 56.
Further, the adsorption module 30 includes a second turbofan 58 fixedly connected to the upper end of the second turbofan rotating shaft 54, a sliding block 59 is slidably arranged in the adsorption hole 24, a suction cup 60 is slidably arranged in the adsorption hole 24 above the sliding block 59, a spring table 65 is fixedly arranged on the lower surface of the adsorption module cover plate 25 below the sliding block 59, a fourth spring 66 is arranged between the spring table 65 and the sliding block 59, a deflector rod 61 is fixedly arranged on the upper end of the sliding block 59, a fixed table 62 is fixedly arranged on the adsorption module cover plate 25 on one side of the deflector rod 61, an inclined sliding block 63 is slidably arranged on the fixed table 62, a third spring 64 is arranged between the inclined sliding block 63 and the adsorption module cover plate 25 to be connected, and a push rod 68 fixedly connected to the suction cup 60 is arranged on the upper side of the inclined sliding block 63.
Principle of operation
The first telescopic sleeve 13 is started to push out the first telescopic rod 16, the rotating ball 17 aligns the clamping rod 22 with the wafer 23, the second telescopic sleeve 18 is started to extend out of the second telescopic rod 19, the clamping rod 22 is pushed onto the wafer 23, the electromagnetic sliding block 49 is started, the clamping rod 22 is driven to slide into the sliding shell 21 to compress the second spring 48, the wafer 23 is clamped, when the wafer 23 needs to be loosened, the electromagnetic sliding block 49 is closed, the second spring 48 is pushed out of the clamping rod 22 outwards, the wafer 23 can be loosened, after the wafer 23 is clamped, the second telescopic sleeve 18 is retracted into the second telescopic rod 19, the rotating ball 17 rotates to drive the second telescopic sleeve 18 to be vertical, the first telescopic sleeve 13 is retracted to enable the whole height of the first telescopic rod 16 to be reduced, the motor 31 is started after the stability is increased, the motor 31 drives the motor rotating shaft 32 to rotate, the motor rotating shaft 32 drives the first bevel gear 33 to rotate, the first bevel gear 33 drives the second bevel gear 35 to rotate, the second bevel gear 35 drives the third bevel gear 37 to rotate, the third bevel gear 37 drives the rotating sleeve 36 to rotate around the motor rotating shaft 32, the rotating sleeve 36 drives the fixed connecting rod 38 to rotate, the fixed connecting rod 38 drives the sliding shell 21 rotates the sliding shell 21 to rotate the sliding shell 22, the piston 67 rotates the piston shaft 67 and the connecting rod 50 to rotate the connecting rod 50, and the connecting rod 50 rotates the connecting rod 67 simultaneously. The piston rod 52 drives the chamfering blade 53 to rotate to start chamfering, the chipping caused by stress concentration in subsequent processing is avoided in advance, the fourth bevel gear 39 on the rotating sleeve 36 drives the fifth bevel gear 40 to rotate while the motor rotating shaft 32 rotates, the fifth bevel gear 40 drives the first turbofan rotating shaft 42 to rotate, the first turbofan rotating shaft 42 drives the first turbofan 43 to rotate, the first turbofan 43 drives the sliding plate 44 to move towards the motor rotating shaft 32, the sliding plate 44 moves to drive the piston cylinder 51 to move, the piston cylinder 51 drives the piston rod 52 to move, the piston rod 52 drives the chamfering blade 53 to cut a wafer to chamfer, chamfering is completed when the piston cylinder 51 moves to the end of the piston cylinder 50, at the moment, the chamfering blade 53 stops in the sliding shell 21, the motor 31 is closed, the first telescopic sleeve 13 continues to retract the first telescopic rod 16, the fixed ring 20 and the sliding shell 21 are clamped in the space between the adsorption module shells 15, the motor 31 is started, the sliding shell 21 drives the adsorption module shells 15 to rotate, the adsorption module shells 15 drive the sliding rod 14 to rotate in the annular groove 12, the movement of the sliding rod 14 drives the first gear 56 to rotate relative to the annular gear 55, the first gear 56 drives the outer gear ring 57 to rotate, the outer gear ring 57 drives the second turbofan rotating shaft 54 to rotate, the second turbofan rotating shaft 54 drives the second turbofan 58 to rotate, the second turbofan 58 rotates to suck the sliding block 59 downwards, the sliding block 59 drives the deflector rod 61 to press downwards, the deflector rod 61 pushes the inclined sliding block 63, the inclined sliding block 63 pushes the ejector rod 68 to compress the third spring 64, the ejector rod 68 pushes the sucker 60 to move upwards, the fourth spring 66 resets the sliding block 59 when the machine stops, the third spring 64 resets the inclined sliding block 63 drives the sucker 60 to reset, the second turbofan 58 rotates to generate downward sucked air flow in the sucker 60, therefore, the silicon wafer is adsorbed, the situation that the silicon wafer is broken and difficult to clean is avoided, and the rotating silicon wafer can be subjected to the next grinding processing.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.
Claims (1)
1. The wafer cutting clamping equipment comprises a chassis (11), and is characterized in that an annular groove (12) is fixedly formed in the chassis (11), a first telescopic sleeve (13) is fixedly arranged in the center of the upper surface of the chassis (11), a sliding rod (14) is arranged in the inner sliding mode of the annular groove (12), an adsorption module shell (15) is fixedly arranged at the upper end of the sliding rod (14), an adsorption module cover plate (25) is covered above the adsorption module shell (15), an adsorption hole (24) is formed in the adsorption module cover plate (25), a first telescopic rod (16) is arranged in the inner sliding mode of the first telescopic sleeve (13), a rotating ball (17) is fixedly connected to the upper end of the first telescopic rod (16), a second telescopic sleeve (18) is arranged in the inner sliding mode of the second telescopic sleeve (18), a motor (31) is fixedly arranged at one end of the second telescopic rod (19) far away from the rotating ball (17), a fixing ring (20) is fixedly arranged on a cylindrical surface of the motor (31), a first telescopic rod (16) is arranged in the sliding mode, a clamping shell (22) is arranged between the sliding rods (21) and the clamping shell (22), a power module (27) is arranged in the fixed ring (20), a chamfer driving module (28) is arranged in the sliding shell (21), a chamfer module (26) is arranged in the clamping rod (22), a power conversion module (29) is arranged between the annular groove (12) and the sliding rod (14), and an adsorption module (30) is arranged in the adsorption module shell (15);
the power module (27) comprises a motor rotating shaft (32) extending from a motor (31), a first bevel gear (33) is fixedly arranged on a cylindrical surface of one side, close to the motor (31), of the motor rotating shaft (32), a rotating sleeve (36) is sleeved outside the cylindrical surface of one side, far away from the first bevel gear (33), of the motor rotating shaft (32), a third bevel gear (37) is fixedly arranged on the rotating sleeve (36), a fixed rod (34) fixedly connected to a fixed ring (20) is arranged between the first bevel gear (33) and the third bevel gear (37), a second bevel gear (35) is rotatably arranged at the other end of the fixed rod (34), the second bevel gear (35) is in meshed transmission with the first bevel gear (33) and the third bevel gear (37), a fixed connecting rod (38) is fixedly arranged on one side, far away from the first bevel gear (33), the other side of the fixed connecting rod (38) is fixedly connected to a sliding shell (21), a fixed plate (47) is fixedly arranged on the sliding shell (21), and a second electromagnetic spring (49) and a second slider (48) are arranged between the clamping rod (22) and the fixed plate (47);
the chamfering module (26) comprises a connecting plate (67) fixedly connected to the motor rotating shaft (32), connecting pipes (46) are fixedly connected to two ends of the connecting plate (67), the other ends of the connecting pipes (46) are connected into a piston cylinder (50), a piston cylinder (51) is arranged in the piston cylinder (50) in a sliding mode, a piston rod (52) extending out of the piston cylinder (50) is fixedly arranged on the piston cylinder (51), and a chamfering cutter (53) is fixedly connected to the other end of the piston rod (52);
the chamfering drive module (28) comprises a chamfering drive shell (41) fixedly connected to a connecting plate (67), one end, far away from the motor rotation shaft (32), of the chamfering drive shell (41) is connected with a connecting pipe (46) in an opening mode, a sliding plate (44) is arranged in the chamfering drive shell (41) in a sliding mode, a first spring (45) is arranged between the sliding plate (44) and the chamfering drive shell (41), a first turbofan (43) is arranged on one side, close to the motor rotation shaft (32), of the chamfering drive shell (41), a first turbofan rotation shaft (42) is fixedly connected to one end, close to the motor rotation shaft (32), of the first turbofan rotation shaft (42), a fifth bevel gear (40) is fixedly connected to the other end, far away from the first bevel gear (33), of the rotating sleeve (36), a fourth bevel gear (39) is fixedly arranged, and the fourth bevel gear (39) is in meshed transmission with the fifth bevel gear (40);
the power conversion module (29) comprises a groove which is formed in the annular groove (12), an annular gear (55) is fixedly arranged in the groove, a first gear (56) is rotatably arranged at the bottom of the sliding rod (14), the first gear (56) is meshed with the annular gear (55), a second turbofan rotating shaft (54) is rotatably arranged in the middle of the sliding rod (14), the upper end of the second turbofan rotating shaft (54) rotatably extends into the adsorption module shell (15), an outer gear ring (57) is fixedly arranged at the lower end of the second turbofan rotating shaft (54), and the outer gear ring (57) is meshed with the first gear (56);
the adsorption module (30) comprises a second turbofan (58) fixedly connected to the upper end of a second turbofan rotating shaft (54), a sliding block (59) is arranged in the adsorption hole (24) in a sliding mode, a sucker (60) is arranged in the adsorption hole (24) above the sliding block (59) in a sliding mode, a spring table (65) is fixedly arranged on the lower surface of an adsorption module cover plate (25) on the lower side of the sliding block (59), a fourth spring (66) is arranged between the spring table (65) and the sliding block (59), a deflector rod (61) is fixedly arranged at the upper end of the sliding block (59), a fixed table (62) is fixedly arranged on the adsorption module cover plate (25) on one side of the deflector rod (61), an inclined sliding block (63) is arranged on the fixed table (62), a third spring (64) is arranged between the inclined sliding block (63) and the adsorption module cover plate (25), and a push rod (68) fixedly connected to the sucker (60) is arranged on the upper side of the inclined sliding block (63).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340146.7A CN114043634B (en) | 2021-11-12 | 2021-11-12 | Wafer cutting clamping equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| KR940018901A (en) * | 1993-01-11 | 1994-08-19 | 오쯔보 히데오 | Method for manufacturing a semiconductor wafer and its system |
| KR20050005893A (en) * | 2003-07-07 | 2005-01-15 | 삼성전자주식회사 | Apparatus for Washing Wafer |
| JP5016122B1 (en) * | 2011-03-07 | 2012-09-05 | コマツＮｔｃ株式会社 | Measuring jig, wire saw, and workpiece mounting method |
| CN103302753A (en) * | 2012-03-06 | 2013-09-18 | 深圳赛意法微电子有限公司 | Cutting method for chip scale package glass |
| CN205630235U (en) * | 2016-02-02 | 2016-10-12 | 上海日进机床有限公司 | Multistation combination formula crystal bar processing equipment |
| CN213917466U (en) * | 2020-12-02 | 2021-08-10 | 杭州格勒玛数控机床制造有限公司 | Chamfering machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130119106A1 (en) * | 2011-11-10 | 2013-05-16 | LatticeGear, LLC | Device and Method for Cleaving. |
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|---|---|---|---|---|
| KR940018901A (en) * | 1993-01-11 | 1994-08-19 | 오쯔보 히데오 | Method for manufacturing a semiconductor wafer and its system |
| KR20050005893A (en) * | 2003-07-07 | 2005-01-15 | 삼성전자주식회사 | Apparatus for Washing Wafer |
| JP5016122B1 (en) * | 2011-03-07 | 2012-09-05 | コマツＮｔｃ株式会社 | Measuring jig, wire saw, and workpiece mounting method |
| CN103302753A (en) * | 2012-03-06 | 2013-09-18 | 深圳赛意法微电子有限公司 | Cutting method for chip scale package glass |
| CN205630235U (en) * | 2016-02-02 | 2016-10-12 | 上海日进机床有限公司 | Multistation combination formula crystal bar processing equipment |
| CN213917466U (en) * | 2020-12-02 | 2021-08-10 | 杭州格勒玛数控机床制造有限公司 | Chamfering machine |
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