CN114002619A - Surface-mounted current sensing device for measuring high-voltage cable grounding current and use method - Google Patents
Surface-mounted current sensing device for measuring high-voltage cable grounding current and use method Download PDFInfo
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- CN114002619A CN114002619A CN202111457687.8A CN202111457687A CN114002619A CN 114002619 A CN114002619 A CN 114002619A CN 202111457687 A CN202111457687 A CN 202111457687A CN 114002619 A CN114002619 A CN 114002619A
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- magnetic field
- copper bar
- linear magnetic
- grounding
- field sensing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
Abstract
The invention relates to a surface-mounted current sensing device for measuring the grounding current of a high-voltage cable and a using method thereof. Compared with the prior art, the invention can obviously enhance the magnetic field signal generated by the current of the grounding copper bar, does not need a high-power-consumption amplifier chip, reduces the overall power consumption and volume of the sensor, and can obviously prolong the service life of the battery.
Description
Technical Field
The invention relates to the technical field of measuring high-voltage cable grounding current, in particular to a surface-mounted current sensing device for measuring the high-voltage cable grounding current and a using method thereof.
Background
The high-voltage cable metal sheath cross-connection grounding system has good power supply reliability, good environmental adaptability and good aesthetic property, and is widely applied to power supply systems. When the high-voltage cable has grounding errors or defects, the current of the grounding copper bars on the grounding box is increased. The cable state can be effectively monitored and evaluated by detecting the current on the grounding copper bar.
At present, the detection of the grounding current of a high-voltage cable is an important means for cable operation and maintenance, mainly manual inspection is taken as a main measure, and the on-line monitoring technology of the grounding current of the cable is gradually popularized in recent years. However, the cable grounding box is generally small in size, no power supply is arranged around the cable grounding box, a large-size battery cannot be placed, the existing sensor needs a magnetic core, the cable grounding box is generally large in size, and the cable grounding box is not beneficial to further reducing the size of the cable grounding box in the future.
Disclosure of Invention
The invention aims to provide a surface-mounted current sensing device for measuring the grounding current of a high-voltage cable and a using method thereof, aiming at overcoming the defect of larger volumes of a battery and a sensor of a monitoring device in the prior art.
The purpose of the invention can be realized by the following technical scheme:
a surface-mounted current sensing device for measuring the grounding current of a high-voltage cable is characterized in that when the device is used, calipers are arranged on a grounding copper bar of the high-voltage cable, the grounding copper bar is connected to a public grounding bar, the surface-mounted current sensing device comprises a circuit substrate, a linear magnetic field sensing chip, a shielding device, a single chip microcomputer, a battery for supplying power to the whole device and a shell for supporting the whole device,
the linear magnetic field sensing chip and the single chip microcomputer are installed on the circuit substrate, the single chip microcomputer is connected with the linear magnetic field sensing chip, the shell is provided with a first slot hole for the ground copper bar to stretch into, when the ground copper bar stretches into the shell, the linear magnetic field sensing chip is located on the side face of the ground copper bar, and the shielding device coats the ground copper bar and the linear magnetic field sensing chip.
Further, the shielding device is of a concave structure and comprises a first side plate, a bottom plate and a second side plate, the first side plate and the second side plate are connected to the two sides of the bottom plate respectively, and the distance between the first side plate and the second side plate of the shielding device is matched with the width of the grounding copper bar.
Furthermore, a second slot combination for the first side plate and the second side plate of the shielding device to pass through is arranged on the circuit substrate, each second slot combination comprises two second slots, the linear magnetic field sensing chip is positioned between the two second slots, and the size and the distance of the two second slots are matched with the size and the distance of the cross section of the first side plate and the second side plate of the shielding device.
Furthermore, the single chip microcomputer is provided with a wireless data transmission module and an analog-to-digital conversion module.
Furthermore, the number of the linear magnetic field sensing chips and the number of the shielding devices are three, the phase-A grounding copper bar, the phase-B grounding copper bar and the phase-C grounding copper bar to be detected respectively correspond to one linear magnetic field sensing chip and one shielding device, and each linear magnetic field sensing chip is connected with the single chip microcomputer.
Further, the A-phase grounding copper bar is connected to the A-phase grounding cable through a fastening bolt, the B-phase grounding copper bar is connected to the B-phase grounding cable through a fastening bolt, and the C-phase grounding copper bar is connected to the C-phase grounding cable through a fastening bolt.
Furthermore, the material of the shielding device is mu metal.
Furthermore, the linear magnetic field sensing chip is a low-power consumption linear magnetic field sensing chip based on a magnetoresistance effect.
The invention also provides a current measuring method of the surface-mounted current sensing device for measuring the grounding current of the high-voltage cable, which comprises the following steps:
the grounding copper bar penetrates through the first slotted hole on the shell for assembly, and the circuit substrate is contacted with the grounding copper bar at the moment;
then, the shielding device penetrates through the second slotted hole to be assembled on the circuit substrate, so that the shielding device covers the grounding copper bar and the linear magnetic field sensing chip;
after the linear magnetic field sensing chip senses a magnetic field generated by current on the grounding copper bar, a signal port of the linear magnetic field sensing chip outputs voltage, and data are collected and transmitted in real time through the single chip microcomputer.
Compared with the prior art, the invention has the following advantages:
according to the invention, the surface-mounted current sensing device can be integrally fixed on the grounding copper bar through the first slot hole arranged on the shell; after the grounding copper bar is installed, the side surface of the grounding copper bar is provided with a linear magnetic field sensing chip which can detect a magnetic field signal generated by current on the grounding copper bar; the shielding device coats the grounding copper bar and the linear magnetic field sensing chip simultaneously, and can obviously enhance the magnetic field signal generated by the current on the grounding copper bar, so that the device can use the linear magnetic field sensing chip without a high-power-consumption amplifier chip, the whole power consumption and the volume of the sensor are reduced, and the service life of the battery can be obviously prolonged.
Drawings
Fig. 1 is a schematic diagram illustrating a usage status of a surface-mounted current sensing device for measuring a ground current of a high-voltage cable according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a surface-mount current sensing device for measuring a ground current of a high-voltage cable according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an electrical connection relationship among the linear magnetic field sensing chip, the single chip and the battery provided in the embodiment of the present invention;
FIG. 4 is a diagram illustrating simulation results of advantages of using a mask provided in an embodiment of the present invention;
in the figure, 101, a phase grounding cable, 102, B phase grounding cable, 103, C phase grounding cable, 201, a phase grounding copper bar, 202, B phase grounding copper bar, 203, C phase grounding copper bar, 20101, a first fastening bolt, 20201, a second fastening bolt, 20301, a third fastening bolt, 301, a first linear magnetic field sensing chip, 302, a second linear magnetic field sensing chip, 303, a third linear magnetic field sensing chip, 304, a single chip microcomputer, 305, a first shield, 306, a second shield, 307, a third shield, 308, a battery, 309, a circuit substrate, 30901, a second slot, 310, a housing, 31001, a phase first slot, 31002, a B phase first slot, 31003, a C phase first slot.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
Example 1
The embodiment provides a surface-mounted current sensing device for measuring the grounding current of a high-voltage cable, wherein a caliper is arranged on a grounding copper bar of the high-voltage cable when the surface-mounted current sensing device is used, the grounding copper bar is connected to a public grounding bar, and the surface-mounted current sensing device comprises a circuit substrate, a linear magnetic field sensing chip, a shield, a single chip microcomputer, a battery for supplying power to the whole device and a shell for supporting the whole device;
the linear magnetic field sensing chip and the single chip microcomputer are both mounted on the circuit substrate, the single chip microcomputer is connected with the linear magnetic field sensing chip, the shell is provided with a first slot hole for the grounding copper bar to extend into, the circuit substrate is provided with a second slot hole for the shielding device to pass through, after the grounding copper bar extends into the shell, the linear magnetic field sensing chip is located on the side face of the grounding copper bar, and the shielding device covers the grounding copper bar and the linear magnetic field sensing chip.
The singlechip is provided with a wireless data transmission module and an analog-to-digital conversion module.
The working principle is as follows: according to the invention, the surface-mounted current sensing device can be integrally fixed on the grounding copper bar through the first slot hole arranged on the shell; after the grounding copper bar is installed, the side surface of the grounding copper bar is provided with a linear magnetic field sensing chip which can detect a magnetic field signal generated by current on the grounding copper bar; the shielding device coats the grounding copper bar and the linear magnetic field sensing chip simultaneously, and can obviously enhance the magnetic field signal generated by the current on the grounding copper bar, so that the device can use the linear magnetic field sensing chip without a high-power-consumption amplifier chip, and the whole power consumption and the volume of the sensor are reduced.
As a preferred embodiment, the shielding device is of a concave structure and comprises a first side plate, a bottom plate and a second side plate, the first side plate and the second side plate are respectively connected to two sides of the bottom plate, and the distance between the first side plate and the second side plate of the shielding device is matched with the width of the grounding copper bar.
In this embodiment, the circuit substrate is provided with second slot hole combinations for the first side plate and the second side plate of the shielding device to pass through, each second slot hole combination comprises two second slot holes, the linear magnetic field sensing chip is located between the two second slot holes, and the size and the distance of the two second slot holes are matched with the size and the distance of the cross sections of the first side plate and the second side plate of the shielding device.
The surface-mount current sensing device in this embodiment is applied to a three-phase grounding copper bar in a cable grounding box, and as shown in fig. 1, the application scenario includes an a-phase grounding cable 101 with a connection terminal, a B-phase grounding cable 102 with a connection terminal, a C-phase grounding cable 103 with a connection terminal, an a-phase grounding copper bar 201, a B-phase grounding copper bar 202, and a C-phase grounding copper bar 203. Wherein 20101 is a first fastening bolt for fixing the A-phase grounding cable 101 and the A-phase grounding copper bar 201. Wherein 20201 is a second fastening bolt, which fixes the B-phase grounding cable 102 and the B-phase grounding copper bar 202. Wherein 20301 is a third fastening bolt for fixing the C-phase grounding cable 103 and the C-phase grounding copper bar 203.
Wherein 4 is a common grounding bar, and the A-phase grounding copper bar 201, the B-phase grounding copper bar 202 and the C-phase grounding copper bar 203 are connected with the ground.
The structure of the surface-mounted current sensing device for measuring the grounding current of the high-voltage cable comprises a first linear magnetic field sensing chip 301, a second linear magnetic field sensing chip 302, a third linear magnetic field sensing chip 303, a single chip microcomputer 304, a first shielding device 305, a second shielding device 306, a third shielding device 307, a battery 308, a circuit substrate 309 and a shell 310, wherein the shell is formed by splicing an upper part and a lower part and is provided with a square first slot hole which comprises a first slot hole 31001 of an A phase, a first slot hole 31002 of a B phase and a first slot hole 31003 of a C phase, and a grounding copper bar can pass through the square first slot hole 31001 of the B phase; the single chip microcomputer 304 is provided with a wireless data transmission module and an analog-to-digital conversion module, and data acquisition, analog-to-digital conversion and remote transmission functions are realized.
The first linear magnetic field sensing chip 301, the second linear magnetic field sensing chip 302 and the third linear magnetic field sensing chip 303 are all low-power consumption linear magnetic field sensing chips based on a magnetoresistive effect, and the first linear magnetic field sensing chip 301, the second linear magnetic field sensing chip 302, the third linear magnetic field sensing chip 303, the single chip microcomputer 304 and the battery 308 are all mounted on the circuit substrate 309.
The circuit board 309 has 3 sets of second slots 30901 for passing the shielding device.
As shown in fig. 3, signal ports of the first linear magnetic field sensing chip 301, the second linear magnetic field sensing chip 302, and the third linear magnetic field sensing chip 303 are respectively connected to three analog-to-digital conversion modules of the single chip microcomputer 304. The positive pole and the negative pole of the battery 308 are connected with the positive pole and the negative pole of the power supply ports of the first linear magnetic field sensing chip 301, the second linear magnetic field sensing chip 302, the third linear magnetic field sensing chip 303 and the single chip microcomputer 304.
The embodiment also provides a measurement method of the surface-mounted current sensing device for measuring the grounding current of the high-voltage cable, which comprises the following steps:
the grounding copper bar penetrates through the first slotted hole on the shell for assembly, and the circuit substrate is contacted with the grounding copper bar at the moment;
then, the shielding device penetrates through the second slotted hole to be assembled on the circuit substrate, so that the shielding device covers the grounding copper bar and the linear magnetic field sensing chip;
after the linear magnetic field sensing chip senses a magnetic field generated by current on the grounding copper bar, a signal port of the linear magnetic field sensing chip outputs voltage, and data are collected and transmitted in real time through the single chip microcomputer.
The detailed procedure used is described below:
when the circuit board is used, after the circuit board 309 is tightly attached to the ground copper bar, the first shield 305, the second shield 306 and the third shield 307 pass through the second slot, and the first linear magnetic field sensing chip 301, the second linear magnetic field sensing chip 302 and the third linear magnetic field sensing chip 303 are located at the center of the coverage area of the shields. When current flows on the grounding copper bar, a magnetic field is generated at the position of the magnetic field sensing chip, the signal port outputs voltage after the magnetic field is sensed by the magnetic resistance effect-based low-power-consumption linear magnetic field sensing chip, and the voltage signal is sent to the low-power-consumption single chip microcomputer with the functions of multi-channel analog-to-digital conversion and remote transmission. The single chip computer processes the signal and sends the signal to the wireless network through the remote transmission channel.
Then, a second slot hole is formed in the circuit substrate, after the circuit substrate is tightly attached to the grounding copper bar, the shielding device penetrates through the second slot hole, and the magnetic field generated by the current of the copper bar can be obviously enhanced. Comparison of the effect of installing and not installing the shield as shown in FIG. 4, the 1A current generated 0.4Oe (10) at the position of the sensing chip when the shield was not installed-4T), 1A current can generate a magnetic field of 1Oe at the sensor chip location after installation of the shield.
The linear magnetic field sensing chip adopts a low-power-consumption linear magnetic field sensing chip based on a magnetic resistance effect, and the low-power-consumption linear magnetic field sensing chip based on the magnetic resistance effect has high sensitivity and can generate signals with large enough amplitude, so that the signals can be acquired by an analog-to-digital conversion channel of a low-power-consumption single chip microcomputer, a high-power-consumption amplifier chip is not needed, and the overall power consumption and the volume of the sensor are obviously reduced.
When in use, the sensing device can be installed on the copper bar surface sticker without disconnecting the ground.
In this embodiment, based on magnetic resistance effect low-power consumption linear magnetic field sensing chip is TMR2104, and the singlechip is STM32WLE5C8, and the shielding ware material is the magnetic-permeability alloy of ferronickel height.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.
Claims (8)
1. A surface-mounted current sensing device for measuring the grounding current of a high-voltage cable, wherein calipers are arranged on a grounding copper bar of the high-voltage cable when in use, is characterized in that the surface-mounted current sensing device comprises a circuit substrate, a linear magnetic field sensing chip, a shielding device, a singlechip, a battery for supplying power to the whole device and a shell for supporting the whole device,
the linear magnetic field sensing chip and the single chip microcomputer are installed on the circuit substrate, the single chip microcomputer is connected with the linear magnetic field sensing chip, the shell is provided with a first slot hole for the ground copper bar to stretch into, when the ground copper bar stretches into the shell, the linear magnetic field sensing chip is located on the side face of the ground copper bar, and the shielding device coats the ground copper bar and the linear magnetic field sensing chip.
2. The surface-mounted current sensing device for measuring the grounding current of the high-voltage cable according to claim 1, wherein the shield has a concave structure and comprises a first side plate, a bottom plate and a second side plate, the first side plate and the second side plate are respectively connected to two sides of the bottom plate, and the distance between the first side plate and the second side plate of the shield is matched with the width of the grounding copper bar.
3. The surface-mounted current sensing device for measuring the grounding current of the high-voltage cable according to claim 1, wherein the circuit substrate is provided with second slot combinations for the first side plate and the second side plate of the shielding device to pass through, each second slot combination comprises two second slots, the linear magnetic field sensing chip is located between the two second slots, and the size and the distance between the two second slots are matched with the size and the distance between the cross sections of the first side plate and the second side plate of the shielding device.
4. The surface-mounted current sensing device for measuring the grounding current of the high-voltage cable according to claim 1, wherein the single chip microcomputer is provided with a wireless data transmission module and an analog-to-digital conversion module.
5. The surface-mounted current sensing device for measuring the grounding current of the high-voltage cable according to claim 1, wherein the number of the linear magnetic field sensing chips and the number of the shielding devices are three, the three-phase grounding copper bar to be measured corresponds to one linear magnetic field sensing chip and one shielding device respectively, and each linear magnetic field sensing chip is connected with the single chip microcomputer.
6. The surface-mount current sensor according to claim 1, wherein the shield is made of mu metal.
7. The surface-mounted current sensing device for measuring the grounding current of the high-voltage cable according to claim 1, wherein the linear magnetic field sensing chip is a low-power consumption linear magnetic field sensing chip based on a magneto-resistive effect.
8. A measuring method using a surface-mounted current sensing device for measuring a ground current of a high voltage cable according to any one of claims 1 to 7, comprising the steps of:
the grounding copper bar penetrates through the first slotted hole on the shell for assembly, and the circuit substrate is contacted with the grounding copper bar at the moment;
then, the shielding device penetrates through the second slotted hole to be assembled on the circuit substrate, so that the shielding device covers the grounding copper bar and the linear magnetic field sensing chip;
after the linear magnetic field sensing chip senses a magnetic field generated by current on the grounding copper bar, a signal port of the linear magnetic field sensing chip outputs voltage, and data are collected and transmitted in real time through the single chip microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111457687.8A CN114002619A (en) | 2021-12-02 | 2021-12-02 | Surface-mounted current sensing device for measuring high-voltage cable grounding current and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111457687.8A CN114002619A (en) | 2021-12-02 | 2021-12-02 | Surface-mounted current sensing device for measuring high-voltage cable grounding current and use method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114002619A true CN114002619A (en) | 2022-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111457687.8A Pending CN114002619A (en) | 2021-12-02 | 2021-12-02 | Surface-mounted current sensing device for measuring high-voltage cable grounding current and use method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114002619A (en) |
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2021
- 2021-12-02 CN CN202111457687.8A patent/CN114002619A/en active Pending
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